JP4001671B2 - Tape peeling method, tape peeling mechanism and tape peeling device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a tape peeling technique used in a manufacturing process of a semiconductor device.
[0002]
[Prior art]
In general, an assembly process among semiconductor device manufacturing processes includes processes such as wafer mounting, dicing, UV (ultraviolet) irradiation, die bonding, tape peeling, paste baking, and wire bonding.
[0003]
In the wafer mounting process, a semiconductor wafer is bonded to a tape (a UV tape, a film, a sheet, and the like are generically referred to below ) attached to a ring frame called a scribe ring or the like.
[0004]
In the die bonding step, as shown in FIG. 7, a defective semiconductor chip after bonding a good semiconductor chip, that is, a defective chip 3 is bonded to the tape 2 attached to the ring frame 1.
[0005]
FIG. 8 is a view showing a conventional tape peeling method, and shows a state in which the defective chip 3 is bonded to the tape 2 in cross section.
[0006]
After one or more ring frames are taken out from a ring magazine (not shown) for storing the ring frame 1, the inside of the ring frame 1 is pushed out in the peeling direction indicated by the arrow by a human hand, and the ring frame The adhesive part of 1 and the tape 2 is peeled off from one side.
[0007]
Recently, an automated apparatus has also been proposed in which the end of the tape is pushed out with a peeling body instead of a human hand, and the peeled end is clamped and peeled off.
[0008]
[Problems to be solved by the invention]
However, the method of peeling the tape by a human hand requires a lot of man-hours and has a problem in terms of safety, and the mechanism of the conventional automated apparatus is complicated.
[0009]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the present invention firstly has a contact portion sized to cover the main part of the tape, and the pusher that is inclined so that the contact portion contacts the tape at an angle is lowered. The tape is peeled off from the ring frame.
[0010]
Secondly, a peeling hole is provided in the top plate of the ring magazine that houses the ring frame, and the pusher is lowered through the hole to peel the tape from the ring frame.
[0011]
Thirdly, the tape is adhered to a winding tape having a sticky surface and wound with a roller.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a diagram showing a first embodiment of the present invention. A ring frame 1, a tape 2, and a defective chip 3 are the same as those in the prior art.
[0013]
The ring frame 1 to which the tape 2 to which the defective chip 3 is bonded is affixed on the peeling table 4.
[0014]
The table 4 is provided with holes so that the tape 2 is peeled off and falls downward.
[0015]
A pusher 5 for peeling the tape 2 is provided above the tape 2, and the pusher 5 is operated in the vertical direction by a driving device 6 such as an air cylinder or a motor.
[0016]
The pusher 5 has a contact portion 51 having a size that covers a main portion that is the most part of the tape 2 excluding a portion where the tape 2 is bonded to the ring frame 1.
[0017]
When the pusher 5 descends and comes into contact with the tape 2, the contact portion 51 is inclined so as to come into contact with the tape 2 at an angle. By comprising in this way, the tape 2 can be gradually peeled off from an edge part.
[0018]
The overall shape of the pusher 5 may be a columnar or prismatic one whose end is cut obliquely, a hollow one inside thereof, or a tube having an appropriate thickness.
[0019]
Next, a tape peeling method will be described. After a good semiconductor chip is die-bonded, the ring frame 1 taken out from the ring magazine is set on the table 4 by a transport arm or the like.
[0020]
The driving device 6 operates to lower the pusher 5 in the peeling direction A. Since the contact portion 51 of the pusher 5 is inclined with respect to the tape 2, in FIG. 1, the contact is made from the right end of the tape 2, and the portion bonded to the ring frame 1 is gradually peeled off. The tape 2 is peeled from the ring frame 1 with the entire contact portion 51.
[0021]
Since the tape 2 falls downward from the hole of the table 4 with the defective chip 3 adhered, a tray or the like is prepared on the lower side of the table 4, stocked there, and discarded at an appropriate time. .
[0022]
As described above, according to the first embodiment, the tape 2 can be automatically peeled off by a simple mechanism.
[0023]
More specifically, it is very practical because it can reduce the man-hours for peeling, injuries due to broken pieces of the defective chip 3, and the apparatus configuration is simple compared with peeling by human hands.
[0024]
Further, since the tape 2 is gradually peeled off from the end portion of the tape 2, the load is small, and there is also an effect that the adhesive which is the adhesive of the tape 2 does not remain on the ring frame 1.
[0025]
FIG. 2 is a view showing another example of the pusher, which is shown in cross section.
[0026]
An adsorbing part / blow part 72 is provided in the contact part 71 of the pusher 7, and these are connected to the adsorbing / blowing device 8 through a groove 73. The pusher 7 is moved up and down by the driving device 6 as in FIG.
[0027]
After the pusher 7 is lowered and the tape is peeled off, the peeled tape can be sucked by the suction / blow unit 72 and conveyed to the disposal unit, and then blown to be discarded while preventing the tape from clinging.
[0028]
FIG. 3 is a diagram showing a second embodiment of the present invention, and the pusher 5 and the driving device 6 are the same as those in the first embodiment.
[0029]
A peeling hole 92 is provided in the top plate 91 of the ring magazine 9 which is a storage container of the ring frame 1. Further, the bottom plate 93 may be provided with a tape discharge hole 94 as required.
[0030]
The ring magazine 9 is provided with a plurality of storage grooves 96 on the side plate 95 so that a plurality of ring frames 1 can be stored in the vertical direction.
[0031]
The tape peeling method will be described. After the die bonding, the ring frame 1 to which the tape 2 from which the defective chip is omitted is affixed is stored in the ring magazine 9 as a plurality or a single number.
[0032]
Ring Magazine 9 is placed on the unit with a peeling mechanism, as in the first embodiment of the pusher 5 is lowered through the stripping hole 92 in the peeling direction A, peeling the tape 2 from the ring frame 1 in the ring magazine 9 To do.
[0033]
Thereafter, the tape 2 peeled from the discharge hole 94 of the bottom plate 93 is pushed down the ring magazine 9 and stocked in a receiving tray or the like for disposal.
[0034]
Note that when the discharge hole 94 is not formed in the bottom plate 93, the tape 2 is stocked on the bottom plate 93.
[0035]
As described above, according to the second embodiment, in addition to the effects of the first embodiment, it is possible to collectively peeling a plurality of tape automatically, there is an effect of the time reduction.
[0036]
Further, since the tape 2 is peeled in the ring magazine 9, it is not necessary to take out and store the ring frame 1, and the number of man-hours can be reduced.
[0037]
FIG. 4 is a view showing a third embodiment of the present invention, in which a pusher and a driving device are omitted.
[0038]
In this embodiment, the waste tape tray 10 is provided in the second embodiment. The top plate 91 of the ring magazine 9 is provided with a peeling hole 92 and the tray 10 is provided on the bottom plate 93. .
[0039]
The peeled tape 2 is stocked in the tray 10 of the bottom plate portion, and after the peeling process is completed, the tray 10 is pulled out, and the waste tape is taken out and discarded.
[0040]
As described above, according to the third embodiment, in addition to the effects of the second embodiment, the waste tape can be easily taken out by pulling out the tray 10 from the ring magazine 9, and space saving can be achieved. There is an effect.
[0041]
FIG. 5 is a diagram showing a fourth embodiment of the present invention, in which a pusher 11 having a plurality of peeling holes 92 and a plurality of pusher bars 111 is provided.
[0042]
The top plate 91 of the ring magazine 9 is provided with a plurality of peeling holes 92 so as to draw a circumference as a whole.
[0043]
The pusher 11 that is moved up and down by the driving device 6 has a plurality of pusher bars 111 corresponding to the plurality of peeling holes 92 so as to press down the main part of the tape.
[0044]
Multiple pusher bar 111 at the tip is spherical, the length in contact at an angle is formed differently with respect to the tape as a whole.
[0045]
A tray 10 is provided on the bottom plate 93 as necessary.
[0046]
Next, a method for peeling the tape will be described. The pusher 11 descends from above the ring magazine 9 in which one or more ring frames to which the tape is attached are stored, and the plurality of pusher bars 111 pass through the corresponding peeling holes 92. Touch the tape.
[0047]
At this time, the plurality of pushers over bar 111 because the tip portion is inclined as a whole in the figure contacts the tape from the right side of the pusher bar 111, gradually peeled from the end portion of the tape adhered to a ring frame.
[0048]
Then, the tape can be peeled from the ring frame in the ring magazine 9 by the entire pusher bar 111 including the left end pusher bar 111.
[0049]
The peeled tape is stocked on the tray 10. On the bottom plate 93 when not provided pan 10, also when provided with a hole for exit exhaust in the bottom plate 93 will be issued discharged outside of the ring magazine 9.
[0050]
As described above, according to the fourth embodiment, in addition to the effects of the second or third embodiment, the peeling holes 92 provided in the top plate 91 are a plurality of small holes. As compared with the provision of the, the strength of the top plate 91 is increased.
[0051]
FIG. 6 is a diagram showing a reference form. This reference form is different from the above-described embodiment in that the tape 2 is bonded to a take-up tape 21 having a sticky surface and wound with a roller.
[0052]
Is tape 2 adhered defective chip 3 is adhered ring frame 1 is set in the table 4.
[0053]
Peeling roller unit on the lower side of the table 4, i.e., the surface of the tape 21 the winding tacky, the joining roller 22 which is suspended a take-up tape 21, the drive side for driving the winding tape 21 A roller 23 and a driven roller 24 are provided. The driving roller 23 is driven by a motor (not shown).
[0054]
A piercing roller 25 that moves up and down by a driving device (not shown) is provided above the table 4.
[0055]
The chip waste plate 26 is for separating the defective chip 3 from the tape 2.
[0056]
Next, the tape peeling method will be described. The ring frame 1 to which the tape 2 is attached is taken out from the ring magazine one by one, conveyed, and set on the table 4.
[0057]
The piercing roller 25 descends from the upper side of the table 4 to the end of the tape 2 and peels the end of the table 2 from the ring frame 1.
[0058]
The peeled end of the tape 2 contacts and adheres to the winding tape 21. When the end of the tape 2 is bonded to the winding tape 21, the driving side roller 23 rotates, so that the tape 2 is wound on the winding tape 21 while being peeled off from the ring frame 1.
[0059]
At the same time, the ring frame 1 slides to the right as shown in the peeling direction B on the table 4 due to the peeled stress, and after the tape 2 is completely peeled from the ring frame 1, it is transported to the storage unit side.
[0060]
Further, when the tape 2 is peeled off by the winding tape 21 on the sticking roller 22, the chip disposal plate 26 enters between the defective chip 3 and the tape 2, and the defective chip 3 can be separated from the tape 2.
[0061]
Although the above description is an example in which the piercing roller 25 descends, the pasting roller 22 may be configured to move up and down by means not shown.
[0062]
In this case, the sticking roller 22 rises, and the winding tape 21 comes into contact with and adheres to the end of the tape 2. After that, the tape 2 is peeled off from the ring frame 1 by the driving side roller 23 and is wound on the winding tape 21 as described above.
[0063]
However, since the tape 2 is peeled off only by adhesion of the winding tape 21, the adhesive force of the winding tape 21 needs to be stronger than the adhesive force of the tape 2. In this way, the piercing roller 25 can be made unnecessary.
[0064]
The tape 2 adhered and wound on the winding tape 21 is sequentially wound on the driving roller 23 and can be discarded together with the winding tape 21.
[0065]
As described above, according to the reference embodiment, in addition to the effects of the first embodiment, the tape 2 is peeled off from the ring frame 1 and bonded to the winding tape 21 to be wound up. It is possible to reduce the waste space without providing a tray.
[0066]
Further, if the chip discard plate 26 is provided, the tape 2 and the defective chip 3 can be separated, and sorting and disposal can be performed.
[0067]
【The invention's effect】
As described above, the present invention can automatically peel off the tape with a simple mechanism.
[Brief description of the drawings]
FIG. 1 is a diagram showing a first embodiment of the present invention. FIG. 2 is a diagram showing another example of a pusher. FIG. 3 is a diagram showing a second embodiment of the present invention. FIG. 5 is a diagram showing a fourth embodiment of the present invention. FIG. 6 is a diagram showing a reference embodiment. FIG. 7 is a diagram showing a tape and a ring frame to which a defective chip is bonded. ] Diagram showing conventional tape peeling method

Claims (10)

Set the ring frame with the tape to which the semiconductor chip is adhered on the table,
Having a contact portion sized to cover the main portion of the tape, and lowering the inclined pusher so that the contact portion contacts the tape at an angle;
A tape peeling method comprising peeling the tape from the ring frame. Provide a suction part and blow part in the contact part of the pusher,
2. The tape peeling method according to claim 1, wherein the peeled tape is sucked and conveyed, blown and discarded. A table for setting a ring frame to which a tape to which a semiconductor chip is bonded is attached;
A pusher having a contact portion sized to cover a main portion of the tape, and an inclined pusher so that the contact portion contacts the tape at an angle;
A driving device for moving the pusher up and down;
A tape peeling device comprising: Provide a suction part and blow part in the contact part of the pusher,
4. The tape peeling apparatus according to claim 3, wherein the peeled tape is sucked and conveyed, and blown and discarded. A hole for peeling is provided on the top plate of the ring magazine that houses the ring frame to which the tape to which the semiconductor chip is bonded is attached.
A contact portion sized to cover the main portion of the tape, and a pusher inclined so that the contact portion comes into contact with the tape at an angle is lowered through the peeling hole;
A tape peeling method comprising peeling the tape from the ring frame. A ring magazine provided with a peeling hole in the top plate that houses the ring frame to which the tape to which the semiconductor chip is bonded is attached;
A pusher having a contact portion sized to cover a main portion of the tape, and an inclined pusher so that the contact portion contacts the tape at an angle;
A drive device for moving the pusher up and down;
A tape peeling mechanism, wherein the pusher is lowered through the peeling hole to peel the tape from the ring frame.   The tape peeling mechanism according to claim 6, wherein a tape discharge hole is provided in a bottom plate of the ring magazine. A plurality of peeling holes are provided in the top plate of the ring magazine for storing the ring frame to which the tape to which the semiconductor chip is bonded is attached
A plurality of pusher bars having a spherical tip end corresponding to the plurality of peeling holes and having different lengths so as to come into contact with the tape at an angle so as to press down the main part of the tape Lowering the busher with
A tape peeling method, wherein the pusher bar peels the tape from the ring frame through the plurality of peeling holes. A ring magazine provided with a plurality of peeling holes on the top plate that houses a ring frame to which a tape to which a semiconductor chip is bonded is attached;
A plurality of pusher bars having a spherical tip end corresponding to the plurality of peeling holes and having different lengths so as to come into contact with the tape at an angle so as to press down the main part of the tape A pusher having
A drive device for moving the pusher up and down;
A tape peeling mechanism, wherein the pusher is lowered, and the pusher bar peels the tape from the ring frame through the plurality of peeling holes. A saucer is provided on the bottom plate of the ring magazine,
The tape peeling mechanism according to claim 6 or 9, wherein the peeled tape is accommodated in the tray.

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