JP4002189B2 - Substrate transfer device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate carrier 3 which can support a substrate W without bending the substrate largely even in the case of a large and thin substrate W. <P>SOLUTION: The hand mechanism 40 of the substrate carrier 3 is provided with first to third arm mechanisms 50X1, 50X2, and 50X3. The first to third arm mechanisms 50X1, 50X2, and 50X3 are provided with pins P1a to P3b for supporting the undersurface of the substrate W. The pins P1a to P3b shift in an x-y direction by the drive of motors MX1, MX2, and MX3 and motors My1a and My1b so as to support the undersurface of a section with no pattern on the substrate W. <P>COPYRIGHT: (C)2003,JPO

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate transport apparatus that supports and transports a substrate such as a glass square substrate for liquid crystal, a substrate for a color filter, and a substrate for a photomask.
[0002]
[Prior art]
Conventionally, substrates taken one by one from a cassette containing a large number of substrates are sequentially transported to various processing units such as a cleaning unit, a heating unit, a cooling unit, a resist coating unit, an exposure unit, and a development unit by a transport robot. Various substrate transfer apparatuses for doing this are known.
[0003]
In such a substrate transfer apparatus, since various processes are mainly performed on the front surface side of the substrate, the substrate transfer hand of the transfer robot is prevented from contacting and supporting the surface of the substrate, and from the back side of the substrate. Supporting and transporting. That is, FIG. 16 is a plan view showing a state where the substrate is being conveyed, and FIG. 17 is a cross-sectional view taken along the line aa. Three support pins 203 are implanted on the substrate transfer hand 200 of the transfer robot, and the back surface of the substrate W is supported by the support pins 203. Even if the supporting pins 203 are in contact with the back surface of the substrate W, they may also affect the front surface side, so that the back surface near the peripheral edge where the pattern Wp is not formed on the surface of the substrate W is supported. Are arranged as follows.
[0004]
[Problems to be solved by the invention]
However, in the configuration in which the substrate W is supported by the support pins 203 in this way, the deflection increases as the substrate size increases as the substrate W indicated by the solid line in FIG. In particular, in recent years, the substrate W tends to be thin for weight reduction, and is more easily bent. Therefore, it is conceivable that the substrate W that is greatly bent comes into contact with the frame of the apparatus during transportation or impairs the reliability of the delivery process with the processing unit.
[0005]
SUMMARY OF THE INVENTION The present invention solves the above-described problems of the prior art, and an object of the present invention is to provide a substrate transport apparatus that can transport a substrate with a small deflection when transporting even a thin substrate that is large and easily bent. .
[0006]
[Means for Solving the Problems]
The present invention made to solve the above problems
In a substrate transport apparatus equipped with a hand mechanism that supports and transports a substrate from its lower surface side,
The hand mechanism includes first to third arm mechanisms arranged in parallel to each other, and the second arm mechanism is arranged between the first arm mechanism and the third arm mechanism,
Each of the arm mechanisms includes a substrate support member that is provided at a plurality of locations along the longitudinal direction of the arm mechanism and protrudes upward to support the lower surface of the substrate.
The plurality of substrate support members are configured to be capable of changing the position for supporting the substrate in the longitudinal direction on each of the arm mechanisms ,
It is characterized by.
[0007]
According to another aspect of the present invention, the substrate support member is configured such that a position for supporting the substrate can be changed in the longitudinal direction by moving along the longitudinal direction of the arm mechanism.
[0008]
Furthermore, the substrate support member according to another aspect of the invention is characterized in that it is selectively arranged at a desired position of the arm mechanism so that a position for supporting the substrate can be changed in the longitudinal direction.
[0009]
The plurality of substrate support members according to another invention are characterized by comprising switching means for switching between a support position that supports the lower surface of the substrate and a non-support position that does not support the lower surface of the substrate.
[0010]
As a preferred aspect of the present invention, the switching means has a mechanism for projecting the upper end of the substrate support member to the support position above the non-support position.
[0011]
Further, the substrate support member can be configured to suck and hold the substrate by suction and pressure reduction, and configured to selectively perform suction and holding of the substrate. You can also.
[0012]
Furthermore, a preferable aspect of the plurality of arm mechanisms may be configured to include first to third arms parallel to each other. It said plurality of arm mechanism can be movable in the first to perpendicular directions to the longitudinal direction of the third arm.
[0013]
[Action]
In the substrate transfer apparatus of the present invention, the substrate is transferred by supporting the lower surface of the substrate by the plurality of substrate support members provided in the plurality of arm mechanisms. Each substrate support member can change the position which supports a board | substrate to a longitudinal direction.
[0014]
【Example】
In order to further clarify the configuration and operation of the present invention described above, preferred embodiments of the present invention will be described below.
[0015]
FIG. 1 is a view showing a substrate cleaning apparatus to which a substrate transfer apparatus according to the present invention can be applied. Hereinafter, after briefly explaining the schematic configuration and operation of the substrate cleaning apparatus, the configuration of the substrate transfer apparatus according to the present invention will be described in detail.
[0016]
The substrate cleaning apparatus includes an indexer unit 1, a cleaning processing unit 2, and a substrate transfer device 3. The indexer section 1 is provided with three cassette mounting sections 11 along the direction A for mounting a cassette 4 capable of storing a plurality of substrates, for example, 25 sheets. For this reason, when the cassette 4 that has been transported to the apparatus by an AGV (automated guided vehicle) (not shown) is placed on each cassette placement unit 11, the three cassettes 4 are moved in the direction A in the indexer unit 1. Thus, the substrate can be taken out from the cassette 4 and stored in the cassette 4 by the substrate transfer device 3 described later. In FIG. 1, the cassette placement unit 11 is provided with a recess 12 for delivering the cassette 4 to and from the automatic transfer robot.
[0017]
The cleaning processing unit 2 is provided with a brush module 21 that cleans both surfaces (or only the back surface) of the substrate and a spin unit 22 that cleans the surface of the substrate while rotating the substrate. 22 is arranged opposite to and substantially parallel to the direction A of the arrangement of the cassettes 4 while being spaced apart from the indexer unit 1 in the direction B by a predetermined interval. Above the brush module 21, there is disposed a UV lamp house 23 for irradiating ultraviolet rays onto the surface of the substrate to burn and ash the organic matter on the surface of the substrate, that is, dry cleaning. As described above, the cleaning processing unit 2 is provided with a plurality of cleaning processing units (hereinafter, the terminology is used when the brush module 21, the spin unit 22, and the UV lamp house 23 are generically referred to), and the substrate is appropriately disposed. The substrate is cleaned in each cleaning unit while being conveyed in order. In this embodiment, as shown in FIG. 1, a transport hand 5 for transporting a substrate from the brush module 21 to the spin unit 22 is provided on the back side of the cleaning unit 2 with respect to the indexer unit 1. .
[0018]
In this way, the substrate cleaning apparatus performs a cleaning process on a single substrate in a predetermined procedure.
[0019]
FIG. 2 is a perspective view showing the substrate transfer device 3. The substrate transfer device 3 is disposed in a transfer path 6 (FIG. 1) sandwiched between the indexer unit 1 and the cleaning processing unit 2. In the transport path 6, a guide rail 31 extending in the direction A is fixed to the bottom of the substrate cleaning apparatus main body, and a base 32 can reciprocate along the guide rail 31. In addition, an A drive mechanism (not shown) is connected to the base 32, and the A drive mechanism operates in response to a command from a control unit (not shown) that controls the entire substrate cleaning apparatus. 32 is moved in direction A.
[0020]
A triaxial transfer robot 33 is fixed to the base 32, and the transfer robot 33 is reciprocated along the arrangement of the cassettes 4 and the arrangement of the cleaning processing units in the cleaning processing unit 2 by the A driving mechanism. It can be positioned in front of an arbitrary cassette 4 or cleaning processing section.
[0021]
The transfer robot 33 has a column 35 that expands and contracts in the vertical direction C from the robot body 34, and a C drive mechanism (not shown) connected to the column 35 receives a command from the control unit, Extend and contract in direction C. One end of a first arm 36 extending in the horizontal direction is attached to the tip of the column 35 so as to be rotatable about the rotation axis A1. The other end of the first arm 36 has one end of the second arm 37, and the other end of the second arm 37 has one end of the hand mechanism 40 (conveying hand body) centered on the rotation axes A2 and A3, respectively. It is free to rotate. Although not shown, the transport robot 33 incorporates a motor as a power source for rotating each part around the rotation axes A1, A2, and A3. For this reason, the transfer robot 33 can move the hand mechanism 40 three-dimensionally in accordance with a command from the control unit while holding the substrate by the hand mechanism 40, as will be described later. Substrate loading and unloading can be performed between the cassette 4 corresponding to the stop position and the cleaning processing unit.
[0022]
FIG. 3 is an enlarged plan view of the upper portion of the hand mechanism 40. FIG. 4 is a side view of the hand mechanism 40. The hand mechanism 40 includes a support plate 41, and side plates 42 </ b> R and 42 </ b> L that are fixed at a predetermined interval are provided upright at both ends of the support plate 41. Between the side plates 42R and 42L, guide members 43 parallel to each other are installed.
[0023]
Ball screws BNx1, BNx2, and BNx3 are installed in parallel between the side plates 42R and 42L. The ball screws BNx1, BNx2, and BNx3 pass through a screw through hole 42La formed in the side plate 42L at one end and are rotatably supported by the side plate 42R at the other end.
[0024]
Motors Mx1, Mx2, and Mx3 are mounted and fixed on one end of the support plate 41. The motors Mx1, Mx2, and Mx3 are connected to end portions of the ball screws BNx1, BNx2, and BNx3, respectively, and rotate them.
[0025]
The first to third arm mechanisms 50x1, 50x2, and 50x3 are coupled to the ball screws BNx1, BNx2, and BNx3, respectively. The first to third arm mechanisms 50x1, 50x2, 50x3 are guided in the direction X by the guide members 43 on both sides and are moved in the direction X by driving the motors Mx1, Mx2, Mx3.
[0026]
Since the first to third arm mechanisms 50x1, 50x2, and 50x3 have substantially the same configuration, the first arm mechanism 50x1 will be described as a representative.
[0027]
The first arm mechanism 50 x 1 includes a support plate 51 x 1 disposed in the direction Y with respect to the guide member 43. The support plate 51x1 includes a guide hole 52, and the guide member 43 is inserted into the guide hole 52, and is supported in a horizontal state. The support plate 51x1 is screwed with the ball screw BNx1. Accordingly, when the ball screw BNx1 rotates by driving the motor Mx1, the support plate 51x1 moves in the direction X.
[0028]
A pin moving mechanism 60x1 is fixed on the support plate 51x1. 5 to 7 show the pin moving mechanism 60x1, FIG. 5 is a perspective view, FIG. 6 is a plan view, and FIG. 7 is a sectional view taken along line bb of FIG. Note that the pin moving mechanism 60x1 is shown in a reduced scale with respect to the direction Y. As shown in these drawings, the pin moving mechanism 60x1 includes a frame body 61, and a pin moving section 62a and a pin moving section 62b are formed on the frame body 61.
[0029]
The pin moving part 62a includes a guide groove 63a, a ball screw BNy1a installed in the guide groove 63a, a motor My1a fixed to one end of the ball screw BNy1a, and a pin moving body 66a screwed to the ball screw BNy1a. I have. The pin moving body 66a includes a fitting portion 67a that is slidably fitted in the guide groove 63a, an upper guide portion 68a that protrudes in the horizontal direction from the upper portion of the fitting portion 67a, and a protrusion on the upper guide portion 68a. And a pin P1a (substrate support member) that supports the lower surface of the substrate W.
[0030]
Also, the pin moving part 62b has substantially the same configuration as the pin moving part 62a, and includes a guide groove 63b, a ball screw BNy1b, a motor My1b, and a pin moving body 66b. The pin moving body 66b includes a fitting portion 67b, an upper guide portion 68b, and a pin P1b. Note that the length of the guide groove 63b and the ball screw BNy1b is about half of the length of the guide groove 63a and the ball screw BNy1a in the direction Y.
[0031]
With the configuration of the pin moving mechanism 60x1, when the motor My1a of the pin moving portion 62a is driven forward or reversely, the ball screw BNy1a rotates, and the pin moving body 66a restrained by the guide groove 63a by this rotation moves in the direction Y. Moving. Therefore, the pin P1a on the pin moving body 66a also moves together. In the pin moving part 62b, the ball screw BNy1b is rotated by driving the motor My1b, and the pin P1b is also moved through the pin moving body 66b. At this time, the pin P1b has a movement distance that is half that of the pin P1a in the direction Y.
[0032]
The hand mechanism 40 is controlled by an electronic control unit 70 shown in the block diagram of FIG. The electronic control device 70 includes a substrate size setting unit 71, a pattern arrangement setting unit 72, a substrate support pin position setting unit 73, and a substrate support pin position control unit 74.
[0033]
The substrate size setting unit 71 sets the size of the substrate W as the coordinates of each corner. For example, the substrate size setting unit 71 receives data from manual input means such as a numeric keypad or the preceding device and outputs it as coordinate data.
[0034]
FIG. 9 shows the coordinates set for the substrate W. The substrate size setting unit 71 determines the center of the substrate W as the origin (0, 0) as the coordinates of the substrate W, and sets (xs, ys), (xs, −ys), (− xs, ys) and (-xs, -ys) are output.
[0035]
The pattern arrangement setting unit 72 does not form the number of patterns Wp1 and Wp2 (indicated by a one-dot chain line in FIG. 9) formed on the substrate W, the coordinates of each corner of the patterns Wp1 and Wp2, and the patterns Wp1 and Wp2. When data such as the width of the portion is input, the positions of the effective areas of the patterns Wp1 and Wp on the surface of the substrate W are output as coordinates. The pattern arrangement setting unit 72 can also be configured to receive data from an input unit using a numeric keypad or a preceding device.
[0036]
For example, the pattern arrangement setting unit 72 includes coordinates of each corner of the upper pattern Wp1 such as (xa, ya), (xa, yb), (−xa, yb), (−xa, yb), and (xa, − The coordinates of each corner of the lower pattern Wp2 such as yb), (xa, -ya), (-xa, yb), (-xa, -ya) are output.
[0037]
Data output from the substrate size setting unit 71 and the pattern arrangement setting unit 72 are input to the substrate support pin position setting unit 73, respectively. The board support pin position setting unit 73 performs a calculation based on the input data, and obtains positions where the total of six pins P1a to P3b move. The data output from the substrate support pin position setting unit 73 is input to the substrate support pin position control unit 74, from which the motors Mx1 to Mx3 and the motors My1a and My1b are driven to move the pins P1a to P3b. To do.
[0038]
That is, the pin P1a is driven by the motor Mx1 and the motor My1a, the pin P1b is driven by the motor Mx1 and the motor My1b, the pin P2a is driven by the motor Mx2 and the motor My2a, and the pin P2b is driven by the motor Mx2 and the motor My2b. The pin P3a can be moved to a desired position by driving the motor Mx3 and the motor My3a, and the pin P3b can be moved by driving the motor Mx3 and the motor My3b.
[0039]
Therefore, in the hand mechanism 40, the pins P1a to P3b can be moved to desired positions, that is, the pins P1a to P3b are placed at positions where the patterns Wp1 and Wp2 of the substrate W are not present and the substrate W is difficult to bend. Can be moved. Therefore, even if the substrate W is large and thin, the substrate W can be supported by the pins P1a to P3b in a state of small deflection, and does not come into contact with the frame or the like of the apparatus. The delivery work with the part can be performed reliably.
[0040]
10 and 11 are examples in which the pins P1a to P3b are moved to the optimum positions in accordance with the pattern Wp of the substrate W. FIG. In FIG. 10A, pins P1a to P3b are arranged on the outer peripheral edge portion of one pattern Wp, and in FIG. 10B, the patterns Wp1 and Wp2 divided in the vertical direction are provided. P2a and P2b are arranged between the patterns Wp1 and Wp2 and at intermediate coordinate positions. Also, the pins P1a to P3b can be appropriately arranged for the three-divided patterns Wp1 to Wp3 in FIG. 11A and the multi-divided patterns in FIG. 11B and FIG.
[0041]
12 and 13 show another embodiment. In this embodiment, a pad is used as a substrate support member instead of a configuration for moving a pin, and this pad is selectively placed at a desired position by advancing and retracting in the vertical direction by air pressure. In these drawings, the hand support 40B is provided with a substrate support member Pt that can be moved back and forth in the vertical direction. In this substrate support member Pt, substrate support members Pt1a and Pt1b are arranged in the first row, substrate support members Pt2a to Pt2e are arranged in the second row, and substrate support members Pt3a and Pt3b are arranged in the third row. . Each substrate support member Pt has the same configuration, which is shown in cross section in FIG.
[0042]
As shown in FIG. 13, the substrate support member Pt1a is formed in a recess 102 that opens toward the upper surface, and is a flexible disk-shaped member 104 formed of two layers of circular diaphragms 104A and 104B. And a ring-shaped pad 106 made of a fluoride resin, which is formed on the disk-shaped member 104 and directly supports the substrate W.
[0043]
Each of the diaphragms 104A and 104B is formed from an elastic body such as silicon rubber, for example. The outer periphery is fixed to the side wall of the recess 102, and both are recessed upward when no external pressure is applied ( FIG. 13 (A)). A suction port 108 is formed at the center of the upper diaphragm 104A. Therefore, by sucking and reducing the space between the upper and lower diaphragms 104A and 104B, the substrate W placed on the pad 106 can be sucked and securely held. A closed space 110 is formed below the lower diaphragm 104 </ b> B between the bottom surface of the recess 102. By supplying pressurized air to the closed space 110, the upper and lower diaphragms 104A and 104B are projected upward, and the upper end of the pad 106 protrudes from the upper surface of the hand mechanism 40B (FIG. 13B). Since the distance between the upper and lower diaphragms 104A and 104B is kept constant by an appropriate structure, the upper diaphragm 104A rises as the lower diaphragm 104B rises, and the upper end of the pad 106 also moves to the hand mechanism. It protrudes from the upper surface of 40B. At this time, even if the space between the upper and lower diaphragms 104A and 104B is reduced, the upper diaphragm 104A also maintains an upwardly convex state by the structure that keeps the distance between the upper and lower diaphragms 104A and 104B constant. The upper end of the pad 106 protrudes from the upper surface of the substrate, and supports the substrate W (FIG. 13C).
[0044]
Each substrate support member Pt can move each pad 106 up and down by independently pressurizing or depressurizing by opening / closing control of an electromagnetic valve (not shown), and supports or supports the lower surface of the substrate W accordingly. I do not. 14A to 14C and FIGS. 15A to 15C show various examples in which the substrate W is selectively supported by each substrate support member Pt, and the black circles support the substrate W. The substrate support member Pt is a substrate support member Pt whose white circle does not support the substrate W. In this embodiment, among the substrate support members Pt, by changing the support state of the second row of substrate support members Pt2a to Pt2d according to the substrate pattern Wp, the substrate W is not greatly bent, The part which is not present can be supported from the lower surface.
[0045]
The present invention is not limited to the above-described embodiments, and can be implemented in various modes without departing from the scope of the invention.
[0046]
【The invention's effect】
As described above , according to the substrate transport apparatus according to the present invention, a plurality of substrate support members that support the lower surface of the substrate are provided, and each substrate support member supports the substrate at an optimal position, for example. Even a large substrate can be transported with reduced deflection.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view showing a substrate cleaning apparatus to which a substrate transfer apparatus according to the present invention is applied.
FIG. 2 is a perspective view showing a substrate transfer device.
FIG. 3 is a plan view showing a hand mechanism of the substrate transfer apparatus.
FIG. 4 is a side view showing a hand mechanism.
FIG. 5 is a perspective view showing a pin moving mechanism 60x1.
FIG. 6 is a plan view showing a pin moving mechanism 60x1.
7 is a cross-sectional view taken along the line bb in FIG. 6;
FIG. 8 is a block diagram showing an electronic control unit 70 that controls the pin moving mechanism 60x1.
FIG. 9 is an explanatory diagram illustrating a state in which a substrate is supported by pins.
FIG. 10 is an explanatory diagram illustrating a state in which another substrate is supported by pins.
FIG. 11 is an explanatory diagram for explaining a state in which another substrate is supported by pins.
FIG. 12 is an explanatory view showing a hand mechanism including a substrate support member according to another embodiment.
FIG. 13 is an explanatory diagram illustrating a substrate support member.
FIG. 14 is an explanatory diagram illustrating a state in which a substrate is supported by a substrate support member.
FIG. 15 is an explanatory diagram illustrating a state in which another substrate is supported by the substrate support member.
FIG. 16 is an explanatory diagram illustrating a state in which a substrate is supported by a conventional hand mechanism.
17 is a cross-sectional view taken along the line aa in FIG.
[Explanation of symbols]
3 ... substrate transfer device 5 ... transfer hand 33 ... transfer robot 34 ... robot body 40 ... hand mechanism 40B ... hand mechanism 60x1 ... pin moving mechanism 62a ... pin moving Unit 62b ... Pin moving unit 70 ... Electronic controller 71 ... Substrate size setting unit 72 ... Pattern arrangement setting unit 73 ... Substrate support pin position setting unit 74 ... Substrate support pin position control Part 106 ... Pad Pt ... Substrate support members Pt1a, Pt1b ... Substrate support members Pt2a to Pt2e ... Substrate support members Pt3a, Pt3b ... Substrate support members P1a, P1b, P2a, P2b, P3a, P3b ... Pin W ... Substrate Wp1-Wp3 ... Pattern

Claims (2)

In a substrate transport apparatus equipped with a hand mechanism that supports and transports a substrate from its lower surface side,
The hand mechanism includes first to third arm mechanisms arranged in parallel to each other, and the second arm mechanism is arranged between the first arm mechanism and the third arm mechanism,
Each of the arm mechanisms includes a substrate support member that is provided at a plurality of locations along the longitudinal direction of the arm mechanism and protrudes upward to support the lower surface of the substrate.
The plurality of substrate support members are configured to be capable of changing the position for supporting the substrate in the longitudinal direction by moving along the longitudinal direction of the arm mechanism,
A substrate transfer device. The substrate transfer apparatus according to claim 1 , wherein
The substrate transport apparatus, wherein each of the first to third arm mechanisms is configured to be movable in a direction perpendicular to the longitudinal direction.

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