JP4002913B2 - Convex connection terminal of printed wiring board and method for manufacturing the same - Google Patents
Convex connection terminal of printed wiring board and method for manufacturing the same Download PDFInfo
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- JP4002913B2 JP4002913B2 JP2004205080A JP2004205080A JP4002913B2 JP 4002913 B2 JP4002913 B2 JP 4002913B2 JP 2004205080 A JP2004205080 A JP 2004205080A JP 2004205080 A JP2004205080 A JP 2004205080A JP 4002913 B2 JP4002913 B2 JP 4002913B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000000034 method Methods 0.000 title description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 59
- 229910052802 copper Inorganic materials 0.000 claims description 59
- 239000010949 copper Substances 0.000 claims description 59
- 238000005530 etching Methods 0.000 claims description 46
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 38
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- 239000011888 foil Substances 0.000 claims description 7
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- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000002585 base Substances 0.000 description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- 239000012964 benzotriazole Substances 0.000 description 4
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- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
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- -1 chlorine ions Chemical class 0.000 description 2
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- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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- 229920006231 aramid fiber Polymers 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
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- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
本発明は、プリント配線板とその製造法に関する。 The present invention relates to a printed wiring board and a manufacturing method thereof.
近年、電子部品に対する高機能・高性能、小型軽量化の要求に伴う部品形態の変遷は著しい。例えば、ＬＳＩパッケージに関しては、接続端子（アウターリード）の小型・微細化が進み、またその配列は、スモール・アウトライン・パッケージ（以下、ＳＯＰという。）、クワッド・フラット・パッケージ、（以下、ＱＦＰという。）、リードレス・チップ・キャリア（以下、ＬＣＣという。）などの直線状の配列から、ボールグリッドアレイ（以下、ＢＧＡという。）やピングリッドアレイ（以下、ＰＧＡという。）などの格子状の配列へと、変化している。特に、接続端子をはんだで形成し、パッケージ底面に配列させたＢＧＡは、多端子化と小型軽量化と言う相反する要求を両立させており、実装の容易性と相まって近年注目を集めている。 In recent years, there has been a remarkable change in the form of components in response to demands for high functionality, high performance, small size and light weight for electronic components. For example, with respect to LSI packages, connection terminals (outer leads) are becoming smaller and finer, and their arrangement is small outline package (hereinafter referred to as SOP), quad flat package (hereinafter referred to as QFP). .), From a linear arrangement such as a leadless chip carrier (hereinafter referred to as LCC) to a lattice arrangement such as a ball grid array (hereinafter referred to as BGA) or a pin grid array (hereinafter referred to as PGA). It has changed into an array. In particular, BGAs in which connection terminals are formed of solder and arranged on the bottom surface of the package satisfy the conflicting demands of multiple terminals and reduction in size and weight, and have attracted attention in recent years in combination with ease of mounting.
はんだボール又はソルダーボールと称されている、従来のはんだからなる接続端子の構造は、リフロー加熱による溶融・挫屈で接合を担う部分と、挫屈量を抑制し接続高さの一定化を担う部分とから成っている。ところで、はんだ接続信頼性は、接続端子各部分の形状、寸法に依存するが、従来の構造ではそれらの均一化は容易でなかった。また、その製造工程は複雑で、かつパッケージへの装着工程を新たに追加する必要があり、コスト高の要因となっていた。 The connection terminal structure made of conventional solder, called solder ball or solder ball, is responsible for joining by melting and buckling due to reflow heating, and is responsible for keeping the connection height constant by suppressing the amount of buckling. Consists of parts. By the way, although the solder connection reliability depends on the shape and size of each part of the connection terminal, it is not easy to make them uniform in the conventional structure. In addition, the manufacturing process is complicated, and it is necessary to newly add a mounting process to the package, which causes a high cost.
本発明の目的は、形状、寸法が均一の新規な接続端子を有し、かつ安価なプリント配線板を提供することにある。 An object of the present invention is to provide an inexpensive printed wiring board having a new connection terminal having a uniform shape and size.
本発明のプリント配線板は、絶縁基材と、絶縁性接着層と、前記絶縁性接着層によって前記絶縁基材に固定された回路と、両面の回路を接続するためのスルーホールとを有し、前記回路が、回路部と、凸型接続端子とからなり、凸型接続端子が、絶縁性接着層の表面側から、回路となる銅層／ニッケルあるいはニッケル合金層／キャリアとなる銅層の３層構造となっていることを特徴とする。 The printed wiring board of the present invention has an insulating base, an insulating adhesive layer, a circuit fixed to the insulating base by the insulating adhesive layer, and a through hole for connecting circuits on both sides. The circuit comprises a circuit portion and a convex connection terminal, and the convex connection terminal is formed of a copper layer / nickel or a nickel alloy layer / copper layer serving as a carrier from the surface side of the insulating adhesive layer. It has a three-layer structure.
また、絶縁基材に代えて、内層回路を有する回路板を用い、絶縁性接着層と、前記絶縁性接着層によって前記回路板に固定された外層回路と、少なくとも２層の回路を接続するために内部を金属化した経由孔とを有し、前記外層回路が、回路部と、凸型接続端子とからなり、凸型接続端子が、絶縁性接着層の表面側から、回路となる銅層／ニッケルあるいはニッケル合金層／キャリアとなる銅層の３層構造となっているプリント配線板とすることもできる。 Further, instead of using an insulating base material, a circuit board having an inner layer circuit is used to connect an insulating adhesive layer, an outer layer circuit fixed to the circuit board by the insulating adhesive layer, and at least two circuits. The outer layer circuit is composed of a circuit portion and a convex connection terminal, and the convex connection terminal is a copper layer serving as a circuit from the surface side of the insulating adhesive layer. It can also be a printed wiring board having a three-layer structure of / a nickel or nickel alloy layer / a copper layer serving as a carrier.
前記凸型接続端子には、接続のためのはんだ層が形成されていればより好ましい。 It is more preferable that a solder layer for connection is formed on the convex connection terminal.
このようなプリント配線板は、絶縁基材あるいは内層回路板上に、接着性絶縁材を重ね、その表面に回路となる銅層／ニッケルあるいはニッケル合金層／キャリアとなる銅層の三層からなる金属箔を、回路となる銅層が接着性絶縁材と接触する様に重ね、加熱加圧して積層一体化し、接続の必要な箇所に穴を明け、凸型接続端子となる形状にエッチングレジストを形成して、ニッケルあるいはニッケル合金からなる中間層まで、キャリアとなる銅層を、アルカリエッチング液で選択的にエッチング除去し、エッチングレジストを剥離除去し、露出したニッケルあるいはニッケル合金からなる中間層をエッチング除去した後、無電解めっき及び必要に応じて電解めっきを行い、穴内壁と表面に必要な導体を形成し、回路となる形状にエッチングレジストを形成して、回路となる銅層を選択的にエッチング除去し、エッチングレジストを剥離除去して、必要に応じて所定の位置に、ソルダーレジストの形成、及び、ソルダーペーストをスクリーン印刷し、加熱することによって製造することができる。 Such a printed wiring board is composed of three layers of an insulating base material or an inner layer circuit board with an adhesive insulating material stacked thereon, and a copper layer / nickel or nickel alloy layer / copper layer serving as a carrier on the surface. Stack the metal foil so that the copper layer that will be in contact with the adhesive insulating material, heat and press to stack and integrate, drill holes in the places where connection is required, and apply the etching resist to the shape that will be the convex connection terminal The copper layer as a carrier is selectively etched away with an alkaline etchant until the intermediate layer made of nickel or nickel alloy is formed, the etching resist is peeled off, and the exposed intermediate layer made of nickel or nickel alloy is formed. After removing by etching, electroless plating and electrolytic plating as necessary are performed to form necessary conductors on the inner wall and surface of the hole, and then etched into a circuit shape Form a resist, selectively remove the copper layer that will be the circuit, remove the etching resist, and if necessary, form a solder resist and screen-print the solder paste at a predetermined position. It can be manufactured by heating.
また、絶縁基材あるいは内層回路板上に、接着性絶縁材を重ね、その表面に回路となる銅層／ニッケルあるいはニッケル合金層／キャリアとなる銅層の三層からなる金属箔を、回路となる銅層が接着性絶縁材と接触する様に重ね、加熱加圧して積層一体化し、接続の必要な箇所に穴を明け、凸型接続端子となる形状にエッチングレジストを形成して、ニッケルあるいはニッケル合金からなる中間層まで、キャリアとなる銅層を、アルカリエッチング液で選択的にエッチング除去し、エッチングレジストを剥離除去し、露出したニッケルあるいはニッケル合金からなる中間層をエッチング除去した後、無電解めっきを行って、穴内壁と表面に必要な導体を形成し、回路となる箇所を除いてめっきレジストを形成して、電解めっき及びはんだめっきを行い、めっきレジストを剥離除去した後、回路となる銅層を選択的にエッチング除去し、必要に応じて所定の位置に、ソルダーレジストの形成、及び、ソルダーペーストをスクリーン印刷し、加熱することによっても製造することができる。 Further, an adhesive insulating material is stacked on an insulating base material or an inner layer circuit board, and a metal foil composed of three layers of copper layer / nickel or nickel alloy layer / copper layer serving as a carrier is formed on the surface thereof. Stack the copper layer so that it comes into contact with the adhesive insulating material, heat and press to integrate the layers, drill holes at the places where connection is required, form an etching resist in the shape to form the convex connection terminals, The copper layer as a carrier is selectively removed by etching with an alkaline etchant up to the intermediate layer made of nickel alloy, the etching resist is peeled off, and the exposed intermediate layer made of nickel or nickel alloy is removed by etching. Electrolytic plating is performed to form the necessary conductors on the inner wall and surface of the hole, and a plating resist is formed except for the places where the circuit is to be formed. After removing the plating resist, the copper layer that becomes the circuit is selectively removed by etching, and if necessary, the solder resist is formed and the solder paste is screen printed at a predetermined position and heated. Can also be manufactured.
本発明の凸型接続端子は、はんだ接続の必要な箇所に、回路となる銅層／ニッケルあるいはニッケル合金層／キャリアとなる銅層からなる凸型接続端子を形成し、その凸部で接続対象の接続端子とのはんだ接続を可能とすることができる。 The convex connection terminal of the present invention forms a convex connection terminal made of a copper layer / nickel or a nickel alloy layer / copper layer serving as a carrier at a place where solder connection is necessary, and is connected to the convex portion. Solder connection with the connection terminal can be made possible.
本発明に用いる絶縁基材には、フェノール樹脂、エポキシ樹脂、ポリイミド樹脂、ビスマレイミドトリアジン（ＢＴ）樹脂、ふっ素樹脂、及びこれらの樹脂の変性樹脂、あるいはこれら樹脂を含浸した紙、ガラス繊維布、石英繊維布、アラミド繊維布、あるいはこれら樹脂にガラス繊維、タルク、カオリン、アルミナ粒子、チタン酸カルシウムなど各種の充填剤、添加剤を混合したもの、あるいはこれら樹脂をフィルム状にしたものなどを用いることができる。内層回路板は、通常用いられる配線板を使用することができる。 The insulating base material used in the present invention includes a phenol resin, an epoxy resin, a polyimide resin, a bismaleimide triazine (BT) resin, a fluorine resin, a modified resin of these resins, a paper impregnated with these resins, a glass fiber cloth, Use quartz fiber cloth, aramid fiber cloth, or a mixture of these resins with various fillers and additives such as glass fiber, talc, kaolin, alumina particles, calcium titanate, or a film of these resins. be able to. As the inner layer circuit board, a commonly used wiring board can be used.
回路となる銅層／ニッケルあるいはニッケル合金からなる中間層／キャリアとなる銅層の三層からなる金属箔は、回路となる銅層が、１〜１５μｍの厚さであることが好ましく、１μｍ未満では銅層にピンホール等の欠陥が現れ、また、１５μｍを越えるとエッチングによる回路形成性が劣ってくる。ニッケルあるいはニッケル合金からなる中間層は、０．０４〜１．５μｍの厚さであることが好ましく、０．０４μｍ未満では中間層にピンホール等の欠陥が現れ、また、１．５μｍを越えるとエッチングによる除去に時間がかかり非能率的で、エッチング液の消費量も多くなり不経済的となる。 It is preferable that the copper layer to be a circuit has a thickness of 1 to 15 μm in a metal foil composed of a copper layer to be a circuit / intermediate layer made of nickel or a nickel alloy / a copper layer to be a carrier, preferably less than 1 μm Then, defects such as pinholes appear in the copper layer, and if the thickness exceeds 15 μm, the circuit formability by etching becomes poor. The intermediate layer made of nickel or a nickel alloy preferably has a thickness of 0.04 to 1.5 μm. If the thickness is less than 0.04 μm, defects such as pinholes appear in the intermediate layer. The removal by etching is time consuming and inefficient, and the consumption of the etching solution increases, which is uneconomical.
キャリアとなる銅層は、１０〜１５０μｍであることが好ましく、１０μｍ未満では凸型接続端子としての高さが不十分となり、１５０μｍを越えるとエッチングによる除去に時間がかかり非能率的で、エッチング液の消費量も多くなり不経済的となる。穴明けは、通常のドリルあるいはレーザーあるいは打ち抜きなどで行うことができる。 The copper layer serving as a carrier is preferably 10 to 150 μm, and if it is less than 10 μm, the height as a convex connection terminal is insufficient, and if it exceeds 150 μm, it takes time to remove by etching and is inefficient. The amount of consumption increases and becomes uneconomical. Drilling can be performed with a normal drill, laser, or punching.
キャリアとなる銅層のみを選択的にエッチングする方法としては、塩素イオンと、アンモニウムイオンと、銅イオンとを含む化学液（アルカリエッチング液と言う）に接触することによって行うことができる。ここで言う接触とは、その液中に浸漬することや、その液を噴霧することを指している。 A method of selectively etching only the copper layer serving as a carrier can be performed by contacting with a chemical solution (referred to as an alkali etching solution) containing chlorine ions, ammonium ions, and copper ions. Contact here refers to dipping in the liquid or spraying the liquid.
露出したニッケルあるいはニッケル合金からなる中間層のみをエッチングするためには、硝酸と、過酸化水素とカルボキシル基を含む有機酸と、ベンゾトリアゾールとを含む化学液に接触することによって行うことができる。 Etching only the exposed intermediate layer made of nickel or nickel alloy can be performed by contacting with a chemical solution containing nitric acid, hydrogen peroxide, an organic acid containing a carboxyl group, and benzotriazole.
無電解及び電解めっきはともに通常の方法によって行うことができる。はんだの種類は特に限定するものではなく、接続時の加熱条件やプリント配線板と接続対象との熱膨張係数差などを考慮して、特に融点、機械的特性などに注意して選択することが重要である。 Both electroless and electroplating can be performed by ordinary methods. The type of solder is not particularly limited, and it should be selected with particular attention to the melting point and mechanical characteristics, taking into account the heating conditions during connection and the difference in thermal expansion coefficient between the printed wiring board and the connection target. is important.
本発明では、はんだでプリント配線板上への接続対象の固定を行い、凸型接続端子を構成する銅で接続高さが決まり、この高さは、キャリアとなる銅層の厚さ及びめっき厚により設定できる。また、製造は、通常のプリント配線板の製造工程により製造できるので、従来のはんだからなる接続端子を有したプリント配線板と比較し安価となる。本発明によって、形状、寸法の均一性に優れたはんだ接続用の接続端子を有したプリント配線板並びに、そのプリント板を簡便に効率的に製造する方法を提供することができるものである。 In the present invention, the connection object is fixed on the printed wiring board with solder, and the connection height is determined by the copper constituting the convex connection terminal. This height is the thickness of the copper layer and the plating thickness as a carrier. Can be set. Moreover, since it can manufacture with the manufacturing process of a normal printed wiring board, it becomes cheap compared with the printed wiring board which has the connection terminal which consists of the conventional solder. According to the present invention, it is possible to provide a printed wiring board having a connection terminal for solder connection having excellent uniformity in shape and size, and a method for easily and efficiently manufacturing the printed board.
以下に本発明の実施例について、図２を用いて説明する。 An embodiment of the present invention will be described below with reference to FIG.
実施例１
ガラス布／エポキシ樹脂塗工布ＧＥＡ−６７Ｎ（日立化成工業株式会社製、商品名）と、回路となる銅層（５μｍ）／リンを２％含有するリン−ニッケルからなる中間層（０．１８μｍ）／キャリアとなる銅層（１５μｍ）からなる三層構造の銅箔を、回路となる銅層が前記塗工布に接触する様に重ね、圧力２．９４ＭＰａ（３０ｋｇ／ｃｍ２）、温度１７５℃、６５分の条件で積層一体化し（図２（ａ）に示す。）、所定位置に表裏の各回路層を接続するためのドリル穴明けを行った（図２（ｂ）に示す。）。次に、凸型接続端子となる形状にエッチングレジストＨ−Ｋ４５０（日立化成工業株式会社製、商品名）を形成して、リン−ニッケルからなる中間層まで、アルカリエッチング液であるＡプロセス用エッチング液（ソルテックス社、商品名）で選択的にエッチング除去し、前記のエッチングレジストを剥離除去し（図２（ｃ）に示す。）、露出したリン−ニッケルからなる中間層を、硝酸２００ｇ／ｌ、過酸化水素水１０ｍｌ／ｌ、りんご酸１００ｇ／ｌ、ベンゾトリアゾール５ｇ／ｌを成分とするエッチング液によりエッチング除去し（図２（ｄ）に示す。）た後、無電解銅めっき及び電解銅めっきを３０μｍ行って穴内壁と表面に必要な導体を形成した（図２（ｅ）に示す。）。そして、回路となる形状にエッチングレジストＨ−Ｋ４５０（日立化成工業株式会社、商品名）を形状して、回路となる銅層を選択的にエッチング除去し、前記のエッチングレジストを剥離除去した（図２（ｆ）に示す。）。
Example 1
Glass cloth / epoxy resin coated cloth GEA-67N (manufactured by Hitachi Chemical Co., Ltd., trade name) and copper layer (5 μm) to be a circuit / intermediate layer made of phosphorus-nickel containing 2% phosphorus (0.18 μm) ) / A copper layer having a three-layer structure consisting of a copper layer (15 μm) serving as a carrier is stacked so that the copper layer serving as a circuit comes into contact with the coated cloth, and a pressure of 2.94 MPa (30 kg / cm 2 ) and a temperature of 175 Lamination and integration were performed under the conditions of 65 ° C. for 65 minutes (shown in FIG. 2 (a)), and drill holes for connecting the respective circuit layers on the front and back sides were performed at predetermined positions (shown in FIG. 2 (b)). . Next, an etching resist H-K450 (trade name, manufactured by Hitachi Chemical Co., Ltd.) is formed in a shape to be a convex connection terminal, and etching for A process that is an alkaline etching solution is performed up to an intermediate layer made of phosphorus-nickel. Etching is selectively removed with a solution (Soltex Co., Ltd., trade name), and the etching resist is peeled and removed (shown in FIG. 2 (c)), and the exposed intermediate layer of phosphorus-nickel is mixed with 200 g of nitric acid. l, 10 ml / l of hydrogen peroxide, 100 g / l of malic acid, and 5 g / l of benzotriazole, and then removed by etching (shown in FIG. 2 (d)), followed by electroless copper plating and electrolysis Copper plating was performed to a thickness of 30 μm to form necessary conductors on the inner wall and the surface of the hole (shown in FIG. 2 (e)). Then, an etching resist H-K450 (Hitachi Chemical Industry Co., Ltd., trade name) was formed into a shape to be a circuit, a copper layer to be a circuit was selectively etched and removed, and the etching resist was peeled off (see FIG. 2 (f)).
実施例２
ガラス布／変性エポキシ樹脂塗工布ＧＥＡ−６７９Ｎ（日立化成工業株式会社製、商品名）を重ね、回路となる銅層（５μｍ）／２％のリンを含むリン−ニッケルからなる中間層（０．１８μｍ）／キャリアとなる銅層（６５μｍ）からなる三層構造の銅箔を、回路となる銅層が前記塗工布に接触する様に重ね、圧力２．９ＭＰａ（３０ｋｇ／ｃｍ２）、温度１７５℃、６５分の条件で積層一体化し（図２（ａ）に示す。）、所定位置に表裏の各回路層を接続するためのドリル穴明けを行った（図２（ｂ）に示す。）。次に、凸型接続端子となる形状にエッチングレジストＨ−Ｋ４５０（日立化成工業株式会社製、商品名）を形成して、リン−ニッケルからなる中間層まで、アルカリエッチャントであるＡプロセス用エッチャント（ソルテックス社、商品名）で選択的にエッチング除去し、前記のエッチングレジストを剥離除去し（図２（ｃ）に示す。）、露出したリン−ニッケルからなる中間層を硝酸２００ｇ／ｌ、過酸化水素水１０ｍｌ／ｌ、りんご酸１００ｇ／ｌ、ベンゾトリアゾール５ｇ／ｌを成分とするエッチング液によりエッチング除去し（図２（ｄ）に示す。）た後、無電解銅めっき及び電解銅めっきを３０μｍ行って穴内壁と表面に必要な導体を形成した（図２（ｅ）に示す。）。そして、回路となる形状にエッチングレジストＨ−Ｋ４５０（日立化成工業株式会社、商品名）を形成して、回路となる銅層を選択的にエッチング除去し、前記のエッチングレジストを剥離除去した（図２（ｆ）に示す。）。
Example 2
Glass cloth / modified epoxy resin coated cloth GEA-679N (trade name, manufactured by Hitachi Chemical Co., Ltd.) is stacked, and a copper layer (5 μm) to be a circuit / an intermediate layer made of phosphorus-nickel containing 2% phosphorus (0 .18 μm) / a copper layer having a three-layer structure consisting of a copper layer (65 μm) serving as a carrier is stacked so that the copper layer serving as a circuit comes into contact with the coated cloth, and a pressure of 2.9 MPa (30 kg / cm 2 ), The layers were integrated and integrated at a temperature of 175 ° C. for 65 minutes (shown in FIG. 2A), and drill holes were drilled to connect the front and back circuit layers at predetermined positions (shown in FIG. 2B). .) Next, an etching resist H-K450 (manufactured by Hitachi Chemical Co., Ltd., trade name) is formed in a shape to be a convex connection terminal, and an etchant for A process that is an alkaline etchant (up to an intermediate layer made of phosphorus-nickel) The etching resist is peeled off and removed (shown in FIG. 2 (c)), and the exposed intermediate layer made of phosphorus-nickel is treated with 200 g / l nitric acid. Etching and removal with an etching solution containing 10 ml / l of hydrogen oxide water, 100 g / l of malic acid and 5 g / l of benzotriazole (shown in FIG. 2 (d)), and then electroless copper plating and electrolytic copper plating are performed. The required conductors were formed on the inner wall and surface of the hole by 30 μm (shown in FIG. 2 (e)). Then, an etching resist H-K450 (Hitachi Kasei Kogyo Co., Ltd., trade name) was formed in the shape to be a circuit, the copper layer to be the circuit was selectively etched away, and the etching resist was peeled off (see FIG. 2 (f)).
実施例３
ガラス布／エポキシ樹脂塗工布ＧＥＡ−６７Ｎ（日立化成工業株式会社製、商品名）を重ね、回路となる銅層（５μｍ）／２％のリンを含むリン−ニッケルからなる中間層（０．１８μｍ）／キャリアとなる銅層（１００μｍ）からなる三層構造の銅箔を回路となる銅層が前記塗工布に接触する様に重ね、圧力２．９４ＭＰａ（３０ｋｇ／ｃｍ２）、温度１７５℃、６５分の条件で積層一体化し（図２（ａ）に示す。）、所定位置に表裏の各回路層を接続するためのドリル穴明けを行った（図２（ｂ）に示す。）。次に、凸型接続端子となる形状にエッチングレジストＨ−Ｋ４５０（日立化成工業株式会社製、商品名）を形成して、リン−ニッケルからなる中間層まで、アルカリエッチャントであるＡプロセス用エッチング液（ソルテックス社、商品名）で選択的にエッチング除去し、エッチングレジストを剥離除去し（図２（ｃ）に示す。）、露出したリン−ニッケルからなる中間層を硝酸２００ｇ／ｌ、過酸化水素水１０ｍｌ／ｌ、りんご酸１００ｇ／ｌ、ベンゾトリアゾール５ｇ／ｌを成分とするエッチング液によりエッチング除去し（図２（ｄ）に示す。）た後、無電解銅めっきを１５μｍ行って、回路となる形状にめっきレジストＨ−Ｋ４５０（日立化成工業株式会社、商品名）を形成し、電解銅めっきを３０μｍ、次いではんだめっきを８μｍ行って穴内壁と表面に必要な導体を形成し（図２（ｇ）に示す。）た後、めっきレジストＨ−Ｋ４５０を剥離除去して、アルカリエッチング液であるＡプロセス用エッチング液（ソルテックス社、商品名）で回路となる銅層を選択的にエッチング除去したのち、２１０℃のオイル中に２５秒浸漬してはんだめっきを除去した（図２（ｈ）に示す。）。
Example 3
Glass cloth / epoxy resin coated cloth GEA-67N (trade name, manufactured by Hitachi Chemical Co., Ltd.) is stacked, and a copper layer (5 μm) to be a circuit / an intermediate layer made of phosphorus-nickel containing 2% phosphorus (0. 18 μm) / a copper layer having a three-layer structure composed of a copper layer (100 μm) serving as a carrier is stacked so that the copper layer serving as a circuit comes into contact with the coated cloth, and the pressure is 2.94 MPa (30 kg / cm 2 ) and the temperature is 175. Lamination and integration were performed under the conditions of 65 ° C. for 65 minutes (shown in FIG. 2 (a)), and drill holes for connecting the respective circuit layers on the front and back sides were performed at predetermined positions (shown in FIG. 2 (b)). . Next, an etching resist H-K450 (manufactured by Hitachi Chemical Co., Ltd., trade name) is formed in a shape to be a convex connection terminal, and an etching solution for A process which is an alkali etchant up to an intermediate layer made of phosphorus-nickel. (Soltex Co., Ltd., trade name) is selectively removed by etching, and the etching resist is peeled and removed (shown in FIG. 2 (c)), and the exposed intermediate layer made of phosphorus-nickel is nitric acid 200 g / l, peroxide. Etching and removal with an etching solution containing 10 ml / l of hydrogen water, 100 g / l of malic acid, and 5 g / l of benzotriazole (shown in FIG. 2 (d)), followed by electroless copper plating at 15 μm, A plating resist H-K450 (Hitachi Chemical Industry Co., Ltd., trade name) is formed in a shape to become, electrolytic copper plating is 30 μm, then solder plating is 8 μm After forming necessary conductors on the inner wall and surface of the hole (shown in FIG. 2 (g)), the plating resist H-K450 is peeled and removed, and an etching solution for process A (Solutex) which is an alkaline etching solution. After selectively removing the copper layer to be a circuit by the company, the solder plating was removed by immersion in oil at 210 ° C. for 25 seconds (shown in FIG. 2 (h)).
以上の様にして、新規な工程を追加すること無く製造したプリント配線板は、いずれも凸型接続端子を有していた。また、その凸型接続端子の凸部の高さばらつきは、回路となる銅層／ニッケルあるいはニッケル合金からなる中間層／柱となる銅層の三層からなる金属箔厚及びめっき厚のばらつき量程度であった As described above, any printed wiring board manufactured without adding a new process has a convex connection terminal. Also, the height variation of the convex portion of the convex connection terminal is the variation in the thickness of the metal foil and the plating thickness consisting of three layers of the copper layer serving as a circuit / intermediate layer composed of nickel or nickel alloy / the copper layer serving as a column. Was about
１．プリント配線板
２．凸型接続端子
３．内層回路パターン
４．スルーホール
５．接続対象
６．接続端子
７．三層からなる金属箔
７１．柱となる銅層
７２．ニッケルあるいはニッケル合金からなる中間層
７３．回路となる銅層
８．絶縁性接着層となる接着を担う絶縁材
９．内層回路板
１０．スルーホールとなる穴
１１．無電解めっき
１２．電解めっき
１３．はんだめっき
１４．めっきレジスト
１５．はんだ
1. 1. Printed wiring board 2. convex connection terminal 3. Inner layer circuit pattern Through hole 5. Connection target 6. Connection terminal 7. Metal foil consisting of three layers 71. Copper layer to be a pillar 72. Intermediate layer 73 made of nickel or nickel alloy 73. 7. Copper layer to be a circuit 8. Insulating material responsible for adhesion to become an insulating adhesive layer Inner layer circuit board 10. 10. Hole to be a through hole Electroless plating12. Electroplating13. Solder plating14. Plating resist 15. Solder
Claims (7)
前記キャリアとなる銅層を前記ニッケル又はニッケル合金層が露出するまでエッチング除去する工程、
前記エッチングレジストを除去する工程、及び
露出した前記ニッケル又はニッケル合金層をエッチング除去する工程、
を含むことを特徴とするプリント配線板の凸型接続端子の製造方法。 Copper layer surface serving as a carrier of a metal foil comprising three layers in which a copper layer serving as a circuit / a nickel alloy layer / a copper layer serving as a carrier having a thickness of 10 to 150 μm is laminated in this order on an insulating substrate Forming an etching resist in a shape to be a convex connection terminal;
Etching and removing the copper layer serving as the carrier until the nickel or nickel alloy layer is exposed,
Removing the etching resist; and etching and removing the exposed nickel or nickel alloy layer;
The manufacturing method of the convex connection terminal of the printed wiring board characterized by including this.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004205080A JP4002913B2 (en) | 2004-07-12 | 2004-07-12 | Convex connection terminal of printed wiring board and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004205080A JP4002913B2 (en) | 2004-07-12 | 2004-07-12 | Convex connection terminal of printed wiring board and method for manufacturing the same |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6579694A Division JP3663636B2 (en) | 1994-04-04 | 1994-04-04 | Printed wiring board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004304206A JP2004304206A (en) | 2004-10-28 |
| JP4002913B2 true JP4002913B2 (en) | 2007-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2004205080A Expired - Lifetime JP4002913B2 (en) | 2004-07-12 | 2004-07-12 | Convex connection terminal of printed wiring board and method for manufacturing the same |
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| Country | Link |
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| JP (1) | JP4002913B2 (en) |
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