JP4007587B2 - Holding plate mold used for external electrode coating of electronic parts - Google Patents
Holding plate mold used for external electrode coating of electronic parts Download PDFInfo
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- JP4007587B2 JP4007587B2 JP2002284429A JP2002284429A JP4007587B2 JP 4007587 B2 JP4007587 B2 JP 4007587B2 JP 2002284429 A JP2002284429 A JP 2002284429A JP 2002284429 A JP2002284429 A JP 2002284429A JP 4007587 B2 JP4007587 B2 JP 4007587B2
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- mold
- holding plate
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- movable
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- 238000000576 coating method Methods 0.000 title claims description 16
- 239000011248 coating agent Substances 0.000 title claims description 14
- 238000000465 moulding Methods 0.000 claims description 17
- 229920002379 silicone rubber Polymers 0.000 claims description 17
- 239000004945 silicone rubber Substances 0.000 claims description 15
- 239000011162 core material Substances 0.000 claims description 14
- 229910052731 fluorine Inorganic materials 0.000 claims description 7
- 239000011737 fluorine Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 150000002221 fluorine Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
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- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、チップコンデンサ等小型電子部品の外部電極塗布に用いる保持プレート成形金型に関するものである。
【０００２】
【従来の技術】
チップコンデンサ等小型電子部品に外部電極を塗布する方法のひとつに金属等の剛性を有し、チップ部品を弾性的に保持可能な穴径よりもやや大きな穴を予め設けた芯材プレートをインサートし、電子部品を弾性的に保持可能な多数の穴形状を有するようにシリコーンゴムを成形加工したプレートを用いることは周知である。芯材プレートをインサートし、シリコーンゴムを成形加工して弾性的な穴を設けるには、所望の金型に多数のピン、実質的には500本乃至12,000本のピンを可動型あるいは固定型どちらか一方の型に埋設固定し、該ピンと芯材プレートに予め設けた穴の隙間にシリコーンゴムを充填し、加熱硬化させた後、エジェクトピンあるいはエジェクト板等で前記芯材の外周部分を突き出して脱型する方法が一般的である。
【０００３】
【発明が解決しようとする課題】
前記した金型を用いて保持プレート成形すると、成形完了して金型を開いた際、多数のピンが埋設された方の型に強固に密着した状態となる。これは各ピンの周囲に充填されたシリコーンゴムが強力な粘着性を有することによる。この後、保持プレートが密着した金型から取り外す際には強大なピン引き抜き力が必要となる為、ピン数に比例して成形装置が大型化するばかりでなく芯材を湾曲させてしまうという問題を有していた。保持プレートの湾曲は小型電子部品の挿入性や抜去性が悪くなるばかりでなく、コーティング厚みにバラツキを与え、実使用に耐えないものとなる。
本発明は上記問題に鑑みなされたもので、脱型時のピン引き抜き抵抗を低減させ、極めて省力で脱型することができ、湾曲や反りのない保持プレートを得ることが可能な成形金型を提供するものである。
【０００４】
【課題を解決するための手段】
保持プレートの穴形成の為に金型に設けられるピンを固定側金型と可動側金型に分けて埋設することで前記課題を達成し得ることを見いだしてこの発明に至った。
すなわち前記課題を達成するためのこの発明の要旨は、芯材として金属等の剛性を有し、予め厚み方向にチップ部品を弾性的に保持可能な穴径よりもやや大きな穴を設けたプレートをインサートし、厚み方向に電子部品を弾性的に保持可能な多数の穴形状を有するようにシリコーンゴムを成形加工してなる外部電極塗布用電子部品保持プレートの金型構造において穴形成の為に金型に設けられる多数のピンを固定側金型と可動側金型に分けて埋設することを特徴とする電子部品の外部電極塗布に用いる保持プレート成形金型である。
【０００５】
本発明の保持プレートを用いる電子部品の外部電極塗布方法は既に（電気用小型パーツ端部のコーティング方法とその装置：特公昭62-20685）で知られている。金属等の剛性を有する芯材プレートの材質としては以下に限定されるものではないが炭素鋼、アルミニウム合金、マグネシウム合金、ニッケル合金等があげられ、特には加工性、操作性の面からからアルミニウム合金が好適とされる。
【０００６】
一方弾性体としてのシリコーンゴムはミラブル型シリコーンゴム、付加型液状シリコーンゴム等一般的に使用されている材料である。また厚み方向に多数の穴を有するプレートを得るための成形方法としてはコンプレッション成形、トランスファー成形、インジェクション成形方法を用いることができる。また前記芯材プレートとシリコーンゴムの接着性を高めるために芯材プレートに予めプライマー処理を施すこともできる。またいずれの成形方法を採用する場合も各々適した金型を用いれば良い。この金型に埋設するピンは所望する保持プレートの穴形状に合わせた形状であれば良く、特に制約はない。
【０００７】
このとき固定側、あるいは可動側に全てのピンを埋設した場合、上記した課題のように充填したシリコーンゴムが多数のピンに強固に密着することにより、これを脱型するために強大な引き抜き力が必要となるため、特に5トンを超えるような脱型装置を有する成形機は極めて大型になるという不利が生じるばかりでなく、芯材プレートに大きな負荷がかかるために湾曲、反り、捻じれ等の不具合が発生するのであるが、ピンを分割して配置埋設した場合には成形完了後、金型を開く際に各型方向に引き抜き合う力が発生し、ピンに対する密着力が極めて弱くなるため、その後の保持プレートの脱型が極めて容易に行えるようになる。
【０００８】
上記理由から脱型を省力的に行うためには固定側、可動側に分割埋設する本数比率はなるべく同数に近く、さらに配列パターンは面に対して均一に引き抜き力が発生するようにピンを各型交互に埋設するか、ブロック毎に交互に埋設することが望ましいが、故意に型開時に保持プレートを残したい側の型にピンをより多く埋設して調節することもできる。
【０００９】
また種々検討を重ねた結果、固定側、稼動側への分割本数比率は1:9〜9:1の範囲で最も効果が大きくなることが判明した。
さらに少しでもピンに対する密着力を低減する為、金型に界面活性剤等の離型剤を噴霧したりシリコーンゴムに内部添加される離型剤等を配合することも何ら問題ないが、さらにピン自体の滑り性を向上させるために併用してフッ素含有コーティングを施した場合に最も効果が発現することを見出した。
【００１０】
フッ素含有コーティングは従来より公知のコーティング材を用いることができる。例としてポリテトラフルオロエチレン、テトラフルオロエチレン−フルオロアルキルビニルエーテル共重合体、テトラフルオロエチレン−エチレン共重合体を焼付け処理する方法。無電解ニッケルメッキ液中に粒径0.1〜5μmのフッ素粒子を3〜30%均一に配合し、これを金型にコーティング処理する方法。あるいはハードクロムメッキ上および微細クラック部に0.1〜5μmのフッ素粒子を圧入含浸することにより表面処理を行う方法等が用いられる。いずれも金型表面に析出したフッ素樹脂の持つスベリ性を利用してシリコーンゴムの離型性を高める効果を発揮するものである。またコーティング厚みは特に制限しないが、1μｍから50μｍの範囲が望ましい。1μｍ以下では離型効果が発現しにくく、かつ繰り返し成形に対する耐久性が著しく悪化する。50μｍ以上では厚み精度にバラツキが生じる問題が発生したり、コスト高になるなど有利ではない。
【００１１】
このフッ素含有コーティングは金型のピンだけでも離型効果はある程度発現するが、ピンを埋設する面となるプレートの上面（固定型面）と下面（可動型面）の密着力を低減させるため、ピンと同時にピン埋設面にもフッ素樹脂含有コーティングを施すことが望ましい。
【００１２】
【実施例】
（実施例１）
１） 芯材プレートとしてアルミニウム合金を縦180mm、横270mm、厚み10mmに切り出し、外周10mmを残して厚み方向に両面から2mmずつ切削し、切削した部位にφ2mmの貫通穴を縦方向に30列、横方向に50列の計1500ヶ設けたプレートを製作した。
２） 次いで前記芯材プレートの穴位置と同位置になるようにφ1mmのピンを固定側に700本、可動側に800本を略々交互に位置するように埋設した金型に前記芯材プレートをインサートし、液状シリコーンゴムKE-1950-60A/B(信越化学工業（株）製)をインジェクション成形機にて注入し、120℃、10分かけて前記シリコーンゴムを効果させた。
３） 次いで型開後、可動型に残った保持プレートの外周部を油圧シリンダの力で持ち上げピンを引き抜いて脱型作業を終え、保持プレートを得た。
このとき油圧シリンダにかかる力を測定した結果と脱型後の保持プレートの反り具合を測定した結果を表１に示した。
【００１３】
（実施例２）
実施例１で用いた金型にフッ素含有コーティングを施した以外は全く同じ方法で保持プレートを得た。
（比較例１）
実施例１で用いた金型で固定型に埋設したピンを全て(1500本)可動側に埋設した以外は全く同じ方法で保持プレートを得た。
（比較例２）
比較例１で用いた金型の固定側のピンを全て取り除き、可動側のみ800本のピンを埋設した以外は全く同じ方法で保持プレートを得た。
【００１４】
【表１】
【発明の効果】
本発明による保持プレートの金型構造を用いることにより保持プレート脱型時の負荷を著しく軽減でき、保持プレートの反り、捻じれを防止すことができる。よってこの発明により、従来保持プレートの成形金型が有していた問題点を解消した成形金型を提供できる。
【００１６】
【図面の簡単な説明】
【図１】電子部品の外部電極塗布に用いる保持プレートの外観図である。
【図２】本発明による金型構造を示した図である。
【図３】比較例(1)の金型構造を示した図である。
【図の主要な部分を表す符号の説明】
１．電子部品保持プレート
２．金属プレート
３．シリコーンゴム
４．チップ保持穴
５．シリコーンゴム注入ゲート
６．固定型
７．可動型
８．固定型固定ピン
９．可動型固定ピン[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a holding plate molding die used for coating external electrodes of small electronic components such as chip capacitors.
[0002]
[Prior art]
One of the methods for applying external electrodes to small electronic components such as chip capacitors is to insert a core plate that has a rigidity such as metal and has holes that are slightly larger than the hole diameter that can elastically hold the chip components. It is well known to use a plate in which silicone rubber is molded so as to have a large number of hole shapes capable of elastically holding electronic components. To insert the core plate and mold the silicone rubber to provide elastic holes, the desired mold can have many pins, essentially 500 to 12,000 pins, either movable or fixed After embedding and fixing in one of the molds, filling the gap between the pin and the core plate in advance with silicone rubber, heat curing, and then ejecting the outer periphery of the core with an eject pin or eject plate A method of demolding is common.
[0003]
[Problems to be solved by the invention]
When the holding plate is molded using the above-described mold, when the molding is completed and the mold is opened, the holding plate is firmly adhered to the mold in which a large number of pins are embedded. This is because the silicone rubber filled around each pin has strong adhesiveness. After that, when removing from the mold with which the holding plate is in close contact, a strong pin pulling force is required, so that the molding apparatus not only increases in size in proportion to the number of pins but also causes the core material to bend. Had. The curvature of the holding plate not only deteriorates the insertion and removal properties of the small electronic components, but also causes variations in the coating thickness, making it unusable for actual use.
The present invention has been made in view of the above problems, and a molding die that can reduce a pin pull-out resistance at the time of demolding, can be demolded with extremely labor savings, and can obtain a holding plate without bending or warping. It is to provide.
[0004]
[Means for Solving the Problems]
The present inventors have found that the above-mentioned problem can be achieved by embedding the pins provided in the mold for forming the holes in the holding plate separately for the fixed mold and the movable mold.
That is, the gist of the present invention for achieving the above-described object is to provide a plate having a rigidity such as a metal as a core material and having a hole slightly larger than a hole diameter capable of elastically holding a chip component in the thickness direction in advance. Insert a metal mold for hole formation in the mold structure of the external electrode coating electronic component holding plate formed by molding silicone rubber so that it has a number of hole shapes that can elastically hold the electronic component in the thickness direction. A holding plate molding die used for coating external electrodes of electronic components, wherein a large number of pins provided in the die are embedded separately in a stationary die and a movable die.
[0005]
An external electrode coating method for electronic parts using the holding plate of the present invention is already known (Coating method and apparatus for the end of small electrical parts: Japanese Patent Publication No. 62-20685). The material of the core plate having rigidity, such as metal, is not limited to the following, but includes carbon steel, aluminum alloy, magnesium alloy, nickel alloy, etc., especially aluminum from the viewpoint of workability and operability. Alloys are preferred.
[0006]
On the other hand, silicone rubber as an elastic body is a commonly used material such as millable type silicone rubber and addition type liquid silicone rubber. As a molding method for obtaining a plate having a large number of holes in the thickness direction, compression molding, transfer molding, or injection molding can be used. In addition, in order to enhance the adhesion between the core material plate and the silicone rubber, the core material plate can be preliminarily treated. Moreover, what is necessary is just to use the metal mold | die suitable for each, when employ | adopting any shaping | molding method. The pin embedded in the mold is not particularly limited as long as it has a shape that matches the hole shape of the desired holding plate.
[0007]
At this time, when all the pins are embedded on the fixed side or the movable side, the silicone rubber filled as described above has a strong pulling force in order to demold it by firmly adhering to many pins. In particular, a molding machine having a demolding device exceeding 5 tons is not only disadvantageous in that it becomes very large, but also a large load is applied to the core plate, which causes bending, warping, twisting, etc. However, when the pins are divided and embedded, the force to pull out in each mold direction is generated when the mold is opened after the molding is completed, and the adhesion to the pins becomes extremely weak. Thereafter, the holding plate can be easily removed from the mold.
[0008]
For the reasons described above, in order to save mold removal, the ratio of the number of parts embedded separately on the fixed side and the movable side is as close as possible, and the arrangement pattern is arranged so that the pulling force is uniformly generated on the surface. It is desirable to embed alternately in the mold or alternately in each block, but it is also possible to adjust by embedding more pins in the mold on the side where the holding plate is intentionally left when the mold is opened.
[0009]
As a result of various studies, it has been found that the effect is greatest when the ratio of the number of divisions between the fixed side and the operating side is in the range of 1: 9 to 9: 1.
In order to further reduce the adhesion to the pin, there is no problem in spraying a mold release agent such as a surfactant into the mold or adding a mold release agent added internally to the silicone rubber. It has been found that the effect is most manifested when a fluorine-containing coating is applied in combination to improve the slipperiness of itself.
[0010]
Conventionally known coating materials can be used for the fluorine-containing coating. As an example, a method of baking polytetrafluoroethylene, a tetrafluoroethylene-fluoroalkyl vinyl ether copolymer or a tetrafluoroethylene-ethylene copolymer. A method in which 3 to 30% of fluorine particles having a particle size of 0.1 to 5 μm are uniformly mixed in an electroless nickel plating solution, and this is coated on a mold. Or the method etc. which surface-treat by impregnating and impregnating 0.1-5 micrometers fluorine particle on a hard chromium plating and a fine crack part are used. In any case, the effect of improving the release property of the silicone rubber is exhibited by utilizing the smoothness of the fluororesin deposited on the mold surface. The coating thickness is not particularly limited, but is preferably in the range of 1 μm to 50 μm. If it is 1 μm or less, the mold release effect is hardly exhibited, and the durability against repeated molding is remarkably deteriorated. If it is 50 μm or more, there is a problem that the thickness accuracy varies, and the cost is not advantageous.
[0011]
This fluorine-containing coating exhibits a mold release effect to some extent even with only the mold pin, but in order to reduce the adhesion between the upper surface (fixed mold surface) and the lower surface (movable mold surface) of the plate, which is the surface in which the pin is embedded, It is desirable to apply a fluororesin-containing coating on the pin burying surface simultaneously with the pin.
[0012]
【Example】
Example 1
1) Aluminum alloy is cut into 180mm length, 270mm width and 10mm thickness as the core plate, and cut 2mm from both sides in the thickness direction, leaving the outer periphery 10mm, and 30 rows of φ2mm through holes in the cut direction. A total of 1500 plates with 50 rows in the horizontal direction were manufactured.
2) Next, the core plate is embedded in a mold embedded with 700 φ1 mm pins on the fixed side and 800 pins on the movable side so as to be in the same positions as the holes of the core plate. The liquid silicone rubber KE-1950-60A / B (manufactured by Shin-Etsu Chemical Co., Ltd.) was injected with an injection molding machine, and the silicone rubber was made effective over 120 minutes at 120 ° C.
3) Next, after the mold was opened, the outer peripheral portion of the holding plate remaining in the movable mold was lifted by the force of the hydraulic cylinder, the pin was pulled out, and the demolding operation was completed to obtain a holding plate.
Table 1 shows the results of measuring the force applied to the hydraulic cylinder at this time and the results of measuring the warpage of the holding plate after demolding.
[0013]
(Example 2)
A holding plate was obtained in exactly the same manner except that the mold used in Example 1 was coated with fluorine.
(Comparative Example 1)
A holding plate was obtained in exactly the same manner except that all the pins (1500) embedded in the fixed mold with the mold used in Example 1 were embedded on the movable side.
(Comparative Example 2)
A holding plate was obtained in exactly the same manner except that all the pins on the fixed side of the mold used in Comparative Example 1 were removed and 800 pins were embedded only on the movable side.
[0014]
[Table 1]
【The invention's effect】
By using the mold structure of the holding plate according to the present invention, the load when the holding plate is removed can be remarkably reduced, and the warping and twisting of the holding plate can be prevented. Therefore, according to the present invention, it is possible to provide a molding die that has solved the problems of the conventional holding plate molding die.
[0016]
[Brief description of the drawings]
FIG. 1 is an external view of a holding plate used for applying an external electrode of an electronic component.
FIG. 2 is a view showing a mold structure according to the present invention.
FIG. 3 is a view showing a mold structure of a comparative example (1).
[Explanation of symbols representing main parts of the figure]
1. 1. Electronic component holding plate 2.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002284429A JP4007587B2 (en) | 2002-09-27 | 2002-09-27 | Holding plate mold used for external electrode coating of electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002284429A JP4007587B2 (en) | 2002-09-27 | 2002-09-27 | Holding plate mold used for external electrode coating of electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004114624A JP2004114624A (en) | 2004-04-15 |
| JP4007587B2 true JP4007587B2 (en) | 2007-11-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002284429A Expired - Fee Related JP4007587B2 (en) | 2002-09-27 | 2002-09-27 | Holding plate mold used for external electrode coating of electronic parts |
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| JP (1) | JP4007587B2 (en) |
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| Publication number | Publication date |
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| JP2004114624A (en) | 2004-04-15 |
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