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JP4011866B2 - Electronic component separation / conveyance apparatus and separation / conveyance method - Google Patents
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JP4011866B2 - Electronic component separation / conveyance apparatus and separation / conveyance method - Google Patents

Electronic component separation / conveyance apparatus and separation / conveyance method Download PDF

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JP4011866B2
JP4011866B2 JP2001204874A JP2001204874A JP4011866B2 JP 4011866 B2 JP4011866 B2 JP 4011866B2 JP 2001204874 A JP2001204874 A JP 2001204874A JP 2001204874 A JP2001204874 A JP 2001204874A JP 4011866 B2 JP4011866 B2 JP 4011866B2
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electronic component
separation
conveyance
conveying
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JP2003023019A (en
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文廣 平川
省悟 服部
宏二 平位
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株式会社 東京ウエルズ
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

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Description

【0001】
【発明の属する技術分野】
この発明は、リードフレームの幅方向及び長手方向に配列された複数個の電子部品をリードフレームから打抜いて分離し、分離した電子部品を搬送する電子部品の分離・搬送装置及び分離・搬送方法に関する。
【0002】
【従来の技術】
リードフレームに多数の電子部品を整列状態に連接し、このリードフレームから電子部品を打抜いて分離し、電子部品を実装工程等に搬送する分離・搬送装置が知られている。
【0003】
図4はリードフレーム1に縦1列に電子部品2を連接したものであり、図5は効率化のためにリードフレーム1に縦3列に電子部品2を連接したものである。
【0004】
ところで、昨今、電子部品の小型化に伴う集積化で、図6に示すように、リードフレーム1の長手方向及び幅方向とも高密度に電子部品2を配列したものも出現し、これに伴いリードフレーム1から電子部品2を分離し、分離した電子部品2を例えばテーピング装置等の収納部への搬送を高速で処理することが求められている。
【0005】
【発明が解決しようとする課題】
しかしながら、リードフレーム1に対する電子部品2の配列の高密度化に伴ってリードフレーム1から電子部品2を分離するための打抜きには大きな力が必要となる。従って、装置自体に打抜き力に耐え得る剛性が必要であり、装置自体の重量が増し、打抜き工程及び打抜き後の分離部への電子部品2の搬送速度が遅く、分離部からテーピング装置等へ搬送する搬送速度は高速であるため、その速度に対応できないという問題がある。
【0006】
この発明は、前記事情に着目してなされたもので、その目的とするところは、電子部品を高密度に集積したリードフレームから電子部品を打抜いて分離された個々の電子部品を複数個同時に分離・搬送部へ搬送し、分離・搬送部への搬送速度の高速化を図り、効率的に処理することができる電子部品の分離・搬送装置及び分離・搬送方法を提供することにある。
【0007】
【課題を解決するための手段】
この発明は、前記目的を達成するために、請求項1は、リードフレームの幅方向及び長手方向に配列された複数個の電子部品を、前記リードフレームの幅方向の一列ごとに打抜き、一列の電子部品列とする打抜き部と、この打抜き部で打抜かれた前記電子部品列を回転搬送する搬送テーブルと、この搬送テーブルにより搬送された前記電子部品列を個々の電子部品に分離し、次の工程に移送する分離・搬送手段を有する分離・搬送部とからなる分離・搬送装置において、前記搬送テーブルに、前記打抜き部で打抜かれた前記電子部品列を載置する複数の搬送機構を設け、前記搬送テーブルの回転に伴って前記搬送機構に載置された前記電子部品列を前記打抜き部から前記分離・搬送部へ搬送することを特徴とする。
【0008】
請求項2は、請求項1の前記分離・搬送部は、前記搬送機構に載置された前記電子部品列に対向し、個々の電子部品を分離搬送する分離・搬送手段と、前記搬送機構に設けられ、前記電子部品列をその長手方向に移動して個々の電子部品を前記分離・搬送手段に順次位置決め供給する部品移動機構とから構成されていることを特徴とする。
【0009】
請求項3は、請求項2の前記部品移動機構は、前記搬送機構に設けられ前記電子部品列の長手方向に移動する駆動手段を有し、前記搬送機構に載置された電子部品列の個々の電子部品を前記分離・搬送手段に順次位置決めすることを特徴とする。
【0010】
請求項4は、請求項1〜3のいずれかに記載の前記搬送機構は、前記搬送テーブルの接線方向に直線移動するスライド部を有し、このスライド部の直線移動方向に前記電子部品列を載置したことを特徴とする。
【0011】
請求項5は、請求項3または4記載の前記部品移動機構の駆動手段は、カム機構であり、このカム機構の回転により前記スライド部を前記電子部品のピッチで移動させることを特徴とする。
【0012】
請求項6は、請求項4または5記載の前記スライド部は、前記カム機構に向かって弾性部材によって付勢されていることを特徴とする。
【0013】
請求項7は、請求項4〜6のいずれかに記載の前記スライド部は、前記搬送テーブルの停止時に押圧手段によって拘束されることを特徴とする。
【0014】
請求項8は、請求項1または2記載の前記分離・搬送手段は、前記搬送機構に載置した電子部品列上の定位置に一つ以上設けられ、電子部品を搬送可能な移送ヘッドを備えていることを特徴とする。
【0015】
請求項9は、請求項5または6の前記カム機構のカム体には切欠部が設けられていることを特徴とする。
【0016】
請求項10は、リードフレームの幅方向の一列ごとに打抜きされた一列の電子部品列を、搬送テーブルに設けた複数の搬送機構に載置して分離・搬送部へ搬送する第1の工程と、前記分離・搬送部で、部品移動機構により前記電子部品列をその長手方向に移動し、個々の電子部品を前記分離・搬送部に位置決めし、個々の電子部品分離・搬送する第2の工程とからなることを特徴とする電子部品の分離・搬送方法にある。
【0017】
前記構成によれば、リードフレームに高密度に配列された電子部品をリードフレームの幅方向の一列ごとに打抜き、電子部品列として搬送機構によって分離・搬送部へ搬送することにより、電子部品の搬送速度を高速化し、分離・搬送部から次の工程に移送する分離・搬送手段の速度に対応させることができる。
【0018】
また、部品移動機構によって電子部品列の個々の電子部品を分離・搬送手段の定位置に順次位置決め供給することができ、受け渡しの高速化を図ることができる。
【0019】
【発明の実施の形態】
以下、この発明の実施の形態を図面に基づいて説明する。
【0020】
図1〜図3は第1の実施形態を示し、図1は搬送機構を含む部品移動機構の正面図、図2は同じく側面図、図3は分離・搬送装置の平面図である。
【0021】
まず、図3に基づいて分離・搬送装置3の概略的構成を説明する。分離・搬送装置3は円板状の搬送テーブル4を備えており、この搬送テーブル4はモータ等の回転駆動機構5の回転軸6に固定され、水平面内で矢印方向に間欠回転するようになっている。この搬送テーブル4の外周縁部には例えば90°間隔に4台の搬送機構7が設けられ、この搬送テーブルの外周部にはリードフレーム1から打抜いて個々に分離した複数個の電子部品2からなる電子部品列8とする打抜き部9及び分離・搬送部10が設けられている。
【0022】
打抜き部9と分離・搬送部10とは搬送テーブル4の回転中心を挟んで対称的に配置されている。そして、打抜き部9でリードフレーム1から打抜いた電子部品列8を搬送機構7に載置し、搬送テーブル4の回転によって分離・搬送部10に搬送するようになっている。
【0023】
次に、搬送機構7及び分離・搬送部10を図1及び図2に基づいて詳述する。すなわち、搬送テーブル4の外周縁部には基板11が固定されている。この基板11の下面にはスライド手段であるスライド軸受12が設けられ、部品移動機構30を構成している。
【0024】
スライド軸受12は基板11に固定されたスライドベース13と、スライドベース13に対してスライド自在で、搬送テーブル4の回転の接線方向にスライド自在なスライダ14とから構成されている。さらに、基板11の側部で、搬送テーブル4の回転方向側にはスライダ14のスライド方向と直交してブラケット15が固定されている。
【0025】
スライド軸受12のスライダ14にはスライドテーブル16が固定され、スライドテーブル16は基板11に対してスライド自在に設けられ、このスライドテーブル16の上面には受け台支持部17を介して受け台18が設けられている。この受け台18の上部にはスライドテーブル16のスライド方向に沿って長い載置面18aを有しており、リードフレーム1から打抜いて個々に分離した複数個の電子部品2からなる電子部品列8が載置されている。
【0026】
また、スライドテーブル16の下面には下方に突出する2本の連接シャフト19が設けられ、この連結シャフト19の下端部には取付け部材20を介してカムフォロア21が設けられている。
【0027】
また、スライドテーブル16のスライド方向の一端側で、前記搬送テーブル4の反回転方向側にはブラケット15に対向するスライド面板22が固定されている。このスライド面板22の一部には軸孔22aが穿設され、この軸孔22aと対向するブラケット15にはねじ孔23が穿設されている。軸孔22aには先端部にねじ部24aを有し、基端部にストッパ部24bを有するストッパシャフト24がスライド面板22の外側から挿入されている。このストッパシャフト24のねじ部24aはブラケット15のねじ孔23aにねじ込み固定されている。
【0028】
ブラケット15とスライド面板22との間にはストッパシャフト24に嵌合された状態で、コイルスプリングからなる弾性部材25が介在されている。そして、弾性部材25によってブラケット15とスライド面板22との距離を規制するとともに、スライドテーブル16上の受け台18が分離・搬送手段26の移送ヘッド27に対して受け台18に載置した電子部品列8との受け渡しにおける基準位置に戻るように設定されている。
【0029】
また、ブラケット15にはスライド面板22を押圧する押圧手段としてシリンダ28が固定されている。このシリンダ28にはピストン(図示しない)に直結した防振ロッド29が伸縮自在に設けられている。そして、防振ロッド29は伸長時にスライド面板22をストッパシャフト24のストッパ部24bに押圧して搬送テーブル4の回転・停止に伴う部品移動機構30の搬送機構7の振動を防止することができるようになっている。
【0030】
前記搬送テーブル4の下方には搬送テーブル4とは別に部品移動機構30の駆動手段であるカム機構31が設けられている。このカム機構31は複数の搬送機構7に対して1台ずつ対応して設けられている。カム機構31は、間欠回転可能なモータ32の回転軸33に装着されたカム体34を有している。
【0031】
カム体34は、円筒体の一部を切欠した切欠部34aと周方向に漸次高さが増大する転動面34bを有し、転動面34bが前記カムフォロア21と転動するようになっている。カム体34の回転軸33は搬送テーブル4の接線方向、すなわちスライドテーブル16の移動方向と平行に設けられている。
【0032】
次に、前述のように構成された電子部品の分離・搬送装置によって電子部品を分離・搬送する方法について説明する。
【0033】
打抜き部9でリードフレーム1の幅方向の1列の複数個の電子部品2が打抜かれた電子部品列8は搬送機構7の受け台18に載置される。この状態で、搬送テーブル4が矢印方向に90°回転すると、搬送機構7に載置された電子部品列8は分離・搬送部10の基準位置に停止する。
【0034】
搬送機構7が基準位置に停止した後、カム機構31のモータ32が駆動してカム体34が回転すると、カム体34の転動面34bがカムフォロア21に接触して転動する。カム体34の転動面34bの高さが高い部分がカムフォロア21に接すると、カムフォロア21を介して連接シャフト19を押圧する。
【0035】
従って、連接シャフト19を介してスライドテーブル16がスライドし、ストッパシャフト24のストッパ部24bに当接して位置決めされていたスライド面板22が弾性部材25の付勢力に抗してストッパ部24bから離れるとともに、受け台支持部17及び受け台18がスライド移動する。
【0036】
カム機構31のカム体34の外周部は一周を複数等分して各1分割分ずつ間欠的に回転させ、その1分割分で受け台18がスライド移動する量が受け台18に載置された電子部品列8の電子部品2の1個に相当するようになっている。従って、カム体34の間欠回転によってスライドテーブル16が1ピッチずつ移動し、受け台18に載置された電子部品2が分割・搬送手段26の移送ヘッド27の受け渡し位置に位置決めされ、電子部品2は移送ヘッド27によって吸着されて次の工程に搬送される。
【0037】
従って、カム機構31の複数分割した割り出しの分割数は部品の受け渡し回数と同じになっており、受け台18に載置した全ての電子部品2の受け渡しが完了すると、カムフォロア21を押圧していたカム機構31の切欠部34aによりカムフォロア21の押圧を開放し、弾性部材25の付勢力によってスライド面板22がストッパ部24bまで押し戻され、受け台18が最初の電子部品2を受け渡し位置である基準位置に位置決めされる。
【0038】
本実施形態では受け台18に載置した電子部品2は8個からなり、分離・搬送手段26の移送ヘッド27として2本の吸着ノズルを設け、8個の電子部品2を2個ずつ同時に搬送するようにしているため、4回の受け渡しで全ての電子部品2が搬送される。
【0039】
従って、カム機構31のカム体34は4等分に分割され、90°ずつ間欠回転して受け台18がスライド位置決めされる。カム体34に設けた切欠部34aは受け台18の位置決めが終了して基準位置に戻す際に、カム体34からカムフォロア21を開放する役割と搬送テーブル4により搬送機構7が回転搬送される際にカムフォロア21とカム体34が干渉しないようにする役割を併せ持っている。
【0040】
また、搬送テーブル4により搬送機構7が打抜き部9から搬送されて分離・搬送部10に位置決め停止する際、スライド面板22は弾性部材25によりストッパ部24bに付勢されているが、搬送テーブル4の回転力による弾性のための搬送テーブル4の割り出し停止時に弾性部材25の付勢力に抗して部品移動機構30の搬送機構7が振動してしまう。
【0041】
しかし、シリンダ28によって防振ロッド29が突出してスライド面板22を押圧し、スライド面板22をストッパ部24bに押し付けることにより、搬送テーブル4の回転・停止に伴う部品移動機構30の搬送機構7の振動を防止することができる。
【0042】
なお、搬送テーブル4の回転が停止した後は、防振ロッド29のスライド面板22への押付け力が解除された後、カム機構31により部品移動機構が駆動される。
【0043】
なお、前記実施形態においては、リードフレームの幅方向に8個の電子部品を配列した電子部品列について説明したが、一例を示したまでであり、電子部品の個数、形状に限定されるものではない。
【0044】
また、搬送テーブルに設けた搬送機構の個数、分離・搬送手段の移送ヘッドの個数も限定されず、適宜変更可能である。
【0045】
【発明の効果】
以上説明したように、請求項1によれば、リードフレームに高密度に配列された電子部品をリードフレームの幅方向の一列ごとに打抜き、電子部品列として搬送機構によって分離・搬送部へ搬送することにより、電子部品の搬送速度を高速化し、分離・搬送部から次の工程に移送する分離・搬送手段の速度に対応させることができる。
【0046】
請求項2〜4によれば、部品移動機構によって電子部品列の個々の電子部品を分離・搬送手段の定位置に順次位置決め供給することができ、受け渡しの高速化を図ることができる。
【0047】
請求項5,6,9によれば、カム機構の回転により、部品移動機構のスライド部を電子部品のピッチに合わせて正確に移動させることができる。
【0048】
請求項7によれば、スライド部は、搬送テーブルの停止時に押圧手段によって拘束されるため、部品移動機構の搬送機構の振動を防止することができる。
【0049】
請求項8によれば、分離・搬送手段は、搬送機構に載置した電子部品列上の定位置に一つ以上設けられているため、電子部品を移送ヘッドによって次の工程に高速に搬送できる。
【0050】
請求項10によれば、リードフレームに高密度に配列された電子部品をリードフレームの幅方向の一列ごとに打抜き、電子部品列として搬送機構によって分離・搬送部へ搬送することにより、電子部品の搬送速度を高速化し、分離・搬送部から次の工程に移送する分離・搬送手段の速度に対応させることができる。
【図面の簡単な説明】
【図1】この発明の第1の実施形態における、搬送機構を含む部品移動機構の正面図。
【図2】同実施形態の搬送機構を含む部品移動機構の側面図。
【図3】同実施形態の分離・搬送装置の平面図。
【図4】縦1列に電子部品を連接したリードフレームの平面図。
【図5】縦3列に電子部品を連接したリードフレームの平面図。
【図6】長手方向及び幅方向とも高密度に電子部品を配列したリードフレームの平面図。
【符号の説明】
1…リードフレーム
2…電子部品
3…分離・搬送装置
4…搬送テーブル
7…搬送機構
8…電子部品列
9…打抜き部
10…分離・搬送部
26…分離・搬送手段
30…部品移動機構
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component separating / conveying apparatus and separation / conveying method for separating a plurality of electronic components arranged in a width direction and a longitudinal direction of a lead frame by punching and separating the electronic components from the lead frame. About.
[0002]
[Prior art]
2. Description of the Related Art Separation / conveying devices are known in which a large number of electronic components are connected to a lead frame in an aligned state, the electronic components are punched and separated from the lead frame, and the electronic components are conveyed to a mounting process or the like.
[0003]
4 shows the electronic components 2 connected to the lead frame 1 in one vertical row, and FIG. 5 shows the electronic components 2 connected to the lead frame 1 in three vertical rows for efficiency.
[0004]
By the way, with the recent integration due to the downsizing of electronic components, as shown in FIG. 6, there is an appearance in which the electronic components 2 are arranged with high density in the longitudinal direction and the width direction of the lead frame 1. It is required to separate the electronic component 2 from the frame 1 and to process the separated electronic component 2 at a high speed, for example, to a storage unit such as a taping device.
[0005]
[Problems to be solved by the invention]
However, as the arrangement of the electronic components 2 with respect to the lead frame 1 is increased in density, a large force is required for punching for separating the electronic components 2 from the lead frame 1. Accordingly, the apparatus itself needs to have rigidity capable of withstanding the punching force, the weight of the apparatus itself increases, the transport speed of the electronic component 2 to the separation part after the punching process and punching is slow, and the transport from the separation part to the taping device, etc. Since the conveyance speed to perform is high-speed, there exists a problem that it cannot respond to that speed.
[0006]
The present invention has been made paying attention to the above circumstances, and the object of the present invention is to simultaneously manufacture a plurality of individual electronic components separated by punching out electronic components from a lead frame in which electronic components are densely integrated. An object of the present invention is to provide an electronic component separation / conveyance device and a separation / conveyance method that can be efficiently transported by conveying to a separation / conveyance unit, increasing the conveyance speed to the separation / conveyance unit.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, according to a first aspect of the present invention, a plurality of electronic components arranged in a width direction and a longitudinal direction of a lead frame are punched for each row in the width direction of the lead frame . A punching portion to be an electronic component row, a transport table for rotating and transporting the electronic component row punched by the punching portion, and separating the electronic component row transported by the transport table into individual electronic components, In a separation / conveyance device comprising a separation / conveyance unit having separation / conveyance means for transferring to a process, the conveyance table is provided with a plurality of conveyance mechanisms for placing the electronic component rows punched by the punching unit , The electronic component row placed on the transport mechanism is transported from the punching unit to the separation / conveyance unit as the transport table rotates .
[0008]
According to a second aspect of the present invention, the separation / conveyance unit according to the first aspect is separated from the electronic component row placed on the conveyance mechanism and separates and conveys individual electronic components, and the conveyance mechanism includes And a component moving mechanism that moves the electronic component row in the longitudinal direction thereof and sequentially positions and supplies the individual electronic components to the separating / conveying means .
[0009]
According to a third aspect of the present invention, the component moving mechanism according to the second aspect includes a driving unit that is provided in the transport mechanism and moves in a longitudinal direction of the electronic component row, and each of the electronic component rows mounted on the transport mechanism. and sequentially positioning to said Rukoto to the electronic component the separating and conveying means.
[0010]
According to a fourth aspect of the present invention, the conveyance mechanism according to any one of the first to third aspects includes a slide portion that linearly moves in a tangential direction of the conveyance table, and the electronic component row is arranged in the linear movement direction of the slide portion. It is characterized by being placed.
[0011]
According to a fifth aspect of the present invention, the driving means of the component moving mechanism according to the third or fourth aspect is a cam mechanism, and the slide portion is moved at a pitch of the electronic component by the rotation of the cam mechanism.
[0012]
A sixth aspect is characterized in that the slide portion according to the fourth or fifth aspect is urged by an elastic member toward the cam mechanism.
[0013]
A seventh aspect of the present invention is characterized in that the slide portion according to any one of the fourth to sixth aspects is restrained by a pressing unit when the transport table is stopped.
[0014]
According to an eighth aspect of the present invention, the separation / conveying means according to the first or second aspect includes a transfer head provided at one or more fixed positions on the electronic component row mounted on the transport mechanism and capable of transporting the electronic components. It is characterized by.
[0015]
A ninth aspect is characterized in that the cam body of the cam mechanism according to the fifth or sixth aspect is provided with a notch.
[0016]
According to a tenth aspect of the present invention, there is provided a first step of placing a row of electronic components punched for each row in the width direction of the lead frame on a plurality of transport mechanisms provided on the transport table and transporting the separation to the separation unit. The separation / conveyance unit moves the electronic component row in the longitudinal direction by a component movement mechanism, positions the individual electronic components on the separation / conveyance unit, and separates / conveys the individual electronic components. An electronic component separation / conveyance method comprising the steps of:
[0017]
According to the above configuration, the electronic components are densely arranged on the lead frame, punched for each row in the width direction of the lead frame, and transported as electronic component rows to the separation / conveyance unit by the transport mechanism, thereby transporting the electronic components. The speed can be increased to correspond to the speed of the separating / conveying means for transferring from the separating / conveying section to the next process.
[0018]
Further, the individual electronic components in the electronic component row can be sequentially positioned and supplied to the fixed positions of the separating / conveying means by the component moving mechanism, so that the delivery speed can be increased.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0020]
1 to 3 show a first embodiment, FIG. 1 is a front view of a component moving mechanism including a conveying mechanism, FIG. 2 is a side view of the same, and FIG. 3 is a plan view of a separation / conveying device.
[0021]
First, a schematic configuration of the separation / conveyance device 3 will be described with reference to FIG. The separating / conveying device 3 includes a disc-shaped conveying table 4, which is fixed to a rotating shaft 6 of a rotary drive mechanism 5 such as a motor, and intermittently rotates in a direction indicated by an arrow within a horizontal plane. ing. For example, four transport mechanisms 7 are provided on the outer peripheral edge portion of the transport table 4 at intervals of 90 °, and a plurality of electronic components that are punched from the lead frame 1 and separated individually on the outer peripheral portion of the transport table 4. A punching unit 9 and a separation / conveying unit 10 are provided as an electronic component row 8 composed of two.
[0022]
The punching unit 9 and the separation / conveying unit 10 are arranged symmetrically with the rotation center of the conveying table 4 in between. The electronic component row 8 punched from the lead frame 1 by the punching unit 9 is placed on the transport mechanism 7 and transported to the separation / transport unit 10 by the rotation of the transport table 4.
[0023]
Next, the transport mechanism 7 and the separation / transport unit 10 will be described in detail with reference to FIGS. That is, the substrate 11 is fixed to the outer peripheral edge of the transfer table 4. A slide bearing 12 which is a slide means is provided on the lower surface of the substrate 11 and constitutes a component moving mechanism 30.
[0024]
The slide bearing 12 includes a slide base 13 fixed to the substrate 11 and a slider 14 that is slidable with respect to the slide base 13 and slidable in a tangential direction of rotation of the transport table 4. Further, a bracket 15 is fixed to the side of the substrate 11 on the rotation direction side of the transport table 4 so as to be orthogonal to the sliding direction of the slider 14.
[0025]
A slide table 16 is fixed to the slider 14 of the slide bearing 12, and the slide table 16 is provided so as to be slidable with respect to the substrate 11. A cradle 18 is provided on the upper surface of the slide table 16 via a cradle support portion 17. Is provided. An upper part of the cradle 18 has a long mounting surface 18a along the sliding direction of the slide table 16, and is an electronic component row made up of a plurality of electronic components 2 punched from the lead frame 1 and separated individually. 8 is placed.
[0026]
Further, two connecting shafts 19 projecting downward are provided on the lower surface of the slide table 16, and a cam follower 21 is provided on the lower end portion of the connecting shaft 19 via an attachment member 20.
[0027]
Further, a slide face plate 22 facing the bracket 15 is fixed to one end side of the slide table 16 in the sliding direction and on the opposite side of the conveying table 4 in the direction of rotation. A shaft hole 22a is formed in a part of the slide face plate 22, and a screw hole 23 is formed in the bracket 15 opposed to the shaft hole 22a. A stopper shaft 24 having a screw portion 24a at the distal end portion and a stopper portion 24b at the proximal end portion is inserted into the shaft hole 22a from the outside of the slide face plate 22. The screw portion 24 a of the stopper shaft 24 is screwed and fixed to the screw hole 23 a of the bracket 15.
[0028]
An elastic member 25 made of a coil spring is interposed between the bracket 15 and the slide face plate 22 while being fitted to the stopper shaft 24. The distance between the bracket 15 and the slide face plate 22 is regulated by the elastic member 25, and the pedestal 18 on the slide table 16 is mounted on the cradle 18 with respect to the transfer head 27 of the separating / conveying means 26. It is set so as to return to the reference position in the transfer with the column 8.
[0029]
A cylinder 28 is fixed to the bracket 15 as a pressing means for pressing the slide face plate 22. The cylinder 28 is provided with a vibration-isolating rod 29 directly connected to a piston (not shown) so as to be stretchable. The vibration isolating rod 29 can press the slide face plate 22 against the stopper portion 24b of the stopper shaft 24 when extended to prevent vibration of the conveying mechanism 7 of the component moving mechanism 30 accompanying rotation / stop of the conveying table 4. It has become.
[0030]
A cam mechanism 31, which is a driving unit for the component moving mechanism 30, is provided below the transport table 4 separately from the transport table 4. One cam mechanism 31 is provided corresponding to each of the plurality of transport mechanisms 7. The cam mechanism 31 has a cam body 34 mounted on a rotation shaft 33 of a motor 32 that can rotate intermittently.
[0031]
The cam body 34 has a notched portion 34a in which a part of the cylindrical body is cut out and a rolling surface 34b whose height gradually increases in the circumferential direction, and the rolling surface 34b rolls with the cam follower 21. Yes. The rotating shaft 33 of the cam body 34 is provided in parallel to the tangential direction of the transport table 4, that is, the moving direction of the slide table 16.
[0032]
Next, a method for separating and transporting an electronic component by the electronic component separating and transporting apparatus configured as described above will be described.
[0033]
An electronic component row 8 in which a plurality of electronic components 2 in one row in the width direction of the lead frame 1 are punched by the punching portion 9 is placed on a cradle 18 of the transport mechanism 7. In this state, when the transport table 4 rotates 90 ° in the direction of the arrow, the electronic component row 8 placed on the transport mechanism 7 stops at the reference position of the separation / transport unit 10.
[0034]
After the transport mechanism 7 stops at the reference position, when the motor 32 of the cam mechanism 31 is driven and the cam body 34 rotates, the rolling surface 34b of the cam body 34 comes into contact with the cam follower 21 and rolls. When a portion where the rolling surface 34 b of the cam body 34 is high contacts the cam follower 21, the connecting shaft 19 is pressed via the cam follower 21.
[0035]
Therefore, the slide table 16 slides through the connecting shaft 19, and the slide face plate 22 that is positioned in contact with the stopper portion 24 b of the stopper shaft 24 moves away from the stopper portion 24 b against the urging force of the elastic member 25. The cradle support 17 and the cradle 18 slide.
[0036]
The outer peripheral portion of the cam body 34 of the cam mechanism 31 is divided into a plurality of equal parts and rotated intermittently by one division, and the amount by which the cradle 18 slides is placed on the cradle 18. This corresponds to one of the electronic components 2 in the electronic component row 8. Accordingly, the slide table 16 is moved one pitch at a time by the intermittent rotation of the cam body 34, and the electronic component 2 placed on the cradle 18 is positioned at the delivery position of the transfer head 27 of the dividing / conveying means 26. Is adsorbed by the transfer head 27 and conveyed to the next step.
[0037]
Therefore, the divided number of the divided parts of the cam mechanism 31 is the same as the number of parts delivered, and when the delivery of all the electronic parts 2 placed on the cradle 18 is completed, the cam follower 21 is pressed. The notch 34a of the cam mechanism 31 releases the press of the cam follower 21, the sliding face plate 22 is pushed back to the stopper 24b by the urging force of the elastic member 25, and the cradle 18 is the reference position which is the first electronic component 2 delivery position. Is positioned.
[0038]
In this embodiment, the number of electronic components 2 placed on the cradle 18 is eight, and two suction nozzles are provided as the transfer head 27 of the separating / conveying means 26 so that two electronic components 2 are conveyed at a time. Therefore, all the electronic components 2 are conveyed by four times of delivery.
[0039]
Accordingly, the cam body 34 of the cam mechanism 31 is divided into four equal parts, and intermittently rotated by 90 ° to slide and position the cradle 18. The notch 34a provided in the cam body 34 serves to release the cam follower 21 from the cam body 34 and to rotate the transport mechanism 7 by the transport table 4 when the positioning of the cradle 18 is completed and returned to the reference position. In addition, the cam follower 21 and the cam body 34 have a role of preventing interference.
[0040]
In addition, when the transport mechanism 7 is transported from the punching unit 9 by the transport table 4 and stops positioning to the separation / transport unit 10, the slide face plate 22 is urged by the elastic member 25 to the stopper portion 24 b. The conveyance mechanism 7 of the component moving mechanism 30 vibrates against the urging force of the elastic member 25 when the indexing of the conveyance table 4 for elasticity due to the rotational force is stopped.
[0041]
However, the vibration isolating rod 29 is protruded by the cylinder 28 to press the slide face plate 22 and press the slide face plate 22 against the stopper portion 24b, so that the vibration of the transport mechanism 7 of the component moving mechanism 30 accompanying the rotation / stop of the transport table 4 is achieved. Can be prevented.
[0042]
In addition, after the rotation of the conveyance table 4 is stopped, the pressing force of the anti-vibration rod 29 against the slide face plate 22 is released, and then the component moving mechanism is driven by the cam mechanism 31.
[0043]
In the above-described embodiment, the electronic component row in which eight electronic components are arranged in the width direction of the lead frame has been described. However, this is only an example and is not limited to the number and shape of electronic components. Absent.
[0044]
Further, the number of transport mechanisms provided on the transport table and the number of transfer heads of the separation / transport means are not limited and can be appropriately changed.
[0045]
【The invention's effect】
As described above, according to the first aspect, the electronic components arranged in a high density on the lead frame are punched for each row in the width direction of the lead frame, and are conveyed to the separation / conveyance unit by the conveyance mechanism as the electronic component row. Thus, the conveyance speed of the electronic component can be increased, and the speed can be made to correspond to the speed of the separation / conveyance means for transferring from the separation / conveyance section to the next process.
[0046]
According to the second to fourth aspects, the individual electronic components of the electronic component row can be sequentially positioned and supplied to the fixed positions of the separating / conveying means by the component moving mechanism, and the delivery speed can be increased.
[0047]
According to the fifth , sixth , and ninth aspects , the slide portion of the component moving mechanism can be accurately moved according to the pitch of the electronic component by the rotation of the cam mechanism.
[0048]
According to the seventh aspect, since the slide portion is restrained by the pressing means when the conveyance table is stopped, the vibration of the conveyance mechanism of the component moving mechanism can be prevented.
[0049]
According to the eighth aspect, since one or more separation / conveyance means are provided at fixed positions on the electronic component row placed on the conveyance mechanism, the electronic components can be conveyed to the next process at high speed by the transfer head. .
[0050]
According to the tenth aspect of the present invention , the electronic components arranged in a high density on the lead frame are punched for each row in the width direction of the lead frame, and are conveyed to the separation / conveyance unit by the conveyance mechanism as the electronic component row. It is possible to increase the conveyance speed and correspond to the speed of the separation / conveying means for transferring from the separation / conveyance unit to the next process.
[Brief description of the drawings]
FIG. 1 is a front view of a component moving mechanism including a conveying mechanism in a first embodiment of the present invention.
FIG. 2 is a side view of a component moving mechanism including a transport mechanism according to the embodiment.
FIG. 3 is a plan view of the separation / conveyance device of the embodiment.
FIG. 4 is a plan view of a lead frame in which electronic components are connected in a vertical row.
FIG. 5 is a plan view of a lead frame in which electronic components are connected in three vertical rows.
FIG. 6 is a plan view of a lead frame in which electronic components are arranged at high density in both the longitudinal direction and the width direction.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Lead frame 2 ... Electronic component 3 ... Separation / conveyance apparatus 4 ... Conveyance table 7 ... Conveyance mechanism 8 ... Electronic component row | line | column 9 ... Punching part 10 ... Separation / conveyance part 26 ... Separation / conveyance means 30 ... Component movement mechanism

Claims (10)

リードフレームの幅方向及び長手方向に配列された複数個の電子部品を、前記リードフレームの幅方向の一列ごとに打抜き、一列の電子部品列とする打抜き部と、この打抜き部で打抜かれた前記電子部品列を回転搬送する搬送テーブルと、この搬送テーブルにより搬送された前記電子部品列を個々の電子部品に分離し、次の工程に移送する分離・搬送手段を有する分離・搬送部とからなる分離・搬送装置において、
前記搬送テーブルに、前記打抜き部で打抜かれた前記電子部品列を載置する複数の搬送機構を設け、前記搬送テーブルの回転に伴って前記搬送機構に載置された前記電子部品列を前記打抜き部から前記分離・搬送部へ搬送することを特徴とする電子部品の分離・搬送装置。
A plurality of electronic components arranged in the width direction and the longitudinal direction of the lead frame are punched for each row in the width direction of the lead frame , and a punched portion is formed as a row of electronic component rows, and the punched portion is the punched portion. A conveyance table for rotating and conveying an electronic component row, and a separation / conveying unit having separation / conveying means for separating the electronic component row conveyed by the conveyance table into individual electronic components and transferring them to the next process In the separation / conveyance device,
The transport table is provided with a plurality of transport mechanisms for placing the electronic component rows punched by the punching unit, and the electronic component rows placed on the transport mechanism are rotated as the transport table rotates. A separation / conveyance device for electronic parts, wherein the separation / conveyance unit is conveyed to a separation / conveyance unit.
前記分離・搬送部は、前記搬送機構に載置された前記電子部品列に対向し、個々の電子部品を分離搬送する分離・搬送手段と、前記搬送機構に設けられ、前記電子部品列をその長手方向に移動して個々の電子部品を前記分離・搬送手段に順次位置決め供給する部品移動機構とから構成されていることを特徴とする請求項1記載の電子部品の分離・搬送装置。Said separating and conveying portion is opposed to the placed the electronic component column on the transport mechanism, the separation and conveying means for separating and conveying individual electronic components, provided in the transport mechanism, the electronic component sequence 2. The electronic component separating / conveying apparatus according to claim 1, further comprising: a component moving mechanism that moves in the longitudinal direction and sequentially positions and supplies the individual electronic components to the separating / conveying means . 前記部品移動機構は、前記搬送機構に設けられ前記電子部品列の長手方向に移動する駆動手段を有し、前記搬送機構に載置された電子部品列の個々の電子部品を前記分離・搬送手段に順次位置決めすることを特徴とする請求項2記載の電子部品の分離・搬送装置。The component moving mechanism includes a driving unit that is provided in the transport mechanism and moves in the longitudinal direction of the electronic component row, and separates and transports the individual electronic components of the electronic component row placed on the transport mechanism. sequentially positioning be separated and transfer apparatus for an electronic component according to claim 2, wherein Rukoto to. 前記搬送機構は、前記搬送テーブルの接線方向に直線移動するスライド部を有し、このスライド部の直線移動方向に前記電子部品列を載置したことを特徴とする請求項1〜3のいずれかに記載の電子部品の分離・搬送装置。The said conveyance mechanism has a slide part which moves linearly in the tangential direction of the said conveyance table, The said electronic component row | line | column was mounted in the linear movement direction of this slide part, The any one of Claims 1-3 characterized by the above-mentioned. Separation / conveyance device for electronic components as described in 1. 前記部品移動機構の駆動手段は、カム機構であり、このカム機構の回転により前記スライド部を前記電子部品のピッチで移動させることを特徴とする請求項3または4記載の電子部品の分離・搬送装置。5. The electronic component separation / conveyance according to claim 3, wherein the driving means of the component moving mechanism is a cam mechanism, and the slide portion is moved at a pitch of the electronic component by rotation of the cam mechanism. apparatus. 前記スライド部は、前記カム機構に向かって弾性部材によって付勢されていることを特徴とする請求項4または5記載の電子部品の分離・搬送装置。6. The electronic component separating / conveying device according to claim 4, wherein the slide portion is biased by an elastic member toward the cam mechanism. 前記スライド部は、前記搬送テーブルの回転時に押圧手段によって拘束されることを特徴とする請求項4〜6のいずれかに記載の電子部品の分離・搬送装置。The electronic component separating / conveying apparatus according to claim 4, wherein the slide portion is restrained by a pressing unit when the conveying table is rotated. 前記分離・搬送手段は、前記搬送機構に載置した電子部品列上の定位置に一つ以上設けられ、電子部品を搬送可能な移送ヘッドを備えていることを特徴とする請求項1または2記載の電子部品の分離・搬送装置。3. The separation / conveying means is provided with one or more fixed positions on an electronic component row placed on the conveying mechanism, and includes a transfer head capable of conveying the electronic components. The electronic component separation / conveyance device described. 前記カム機構のカム体には切欠部が設けられていることを特徴とする請求項5または6記載の電子部品の分離・搬送装置。7. The electronic component separating / conveying device according to claim 5, wherein the cam body of the cam mechanism is provided with a notch. リードフレームの幅方向の一列ごとに打抜きされた一列の電子部品列を、搬送テーブルに設けた複数の搬送機構に載置して分離・搬送部へ搬送する第1の工程と、
前記分離・搬送部で、部品移動機構により前記電子部品列をその長手方向に移動し、個々の電子部品を前記分離・搬送部に位置決めし、個々の電子部品分離・搬送する第2の工程とからなることを特徴とする電子部品の分離・搬送方法。
A first step of placing a row of electronic components punched for each row in the width direction of the lead frame and placing the rows on a plurality of transport mechanisms provided on a transport table and transporting them to a separation / transport unit;
In the separation / conveyance unit, a second step of moving the electronic component row in the longitudinal direction by a component moving mechanism, positioning the individual electronic components on the separation / conveyance unit, and separating / conveying the individual electronic components A method for separating and transporting electronic components, comprising:
JP2001204874A 2001-07-05 2001-07-05 Electronic component separation / conveyance apparatus and separation / conveyance method Expired - Lifetime JP4011866B2 (en)

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