JP4013582B2 - Circuit board processing method and substrate processing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a technique for conveying a circuit board.
[0002]
[Prior art]
Conventionally, when mounting electronic components such as fine electronic elements and circuit chips on a plate-like printed wiring board (hereinafter referred to as “substrate”) made of resin, a plurality of apparatuses corresponding to various kinds of processing have been installed. An array system is used.
[0003]
Usually, in a mounting system, a supply device that supplies a substrate that is stored to the conveyance path of the mounting line, a coating device that applies solder paste to the substrate, a mounting device that mounts electronic components on the solder paste, and heating the solder paste A reflow device that melts and cools and solidifies, an inspection device that inspects the mounting state of the electronic component, and a storage device that stores the mounted substrate are sequentially arranged.
[0004]
[Problems to be solved by the invention]
By the way, in recent years, as the life cycle of electrical appliances has been shortened and multifunctionalized, there has been a demand for production of various types and small quantities in mounting systems. As an example of an electronic device incorporating a wide variety of mounting boards, a television is taken as an example. One TV has one main board, two signal boards, two terminal boards, one high-frequency circuit board, and other devices. There may be a total of ten different types of mounting boards of four boards. Furthermore, recently, there are cases where the specifications differ from each other due to market demands, and in order to meet such demands, it is necessary to frequently perform the operation of switching the type of substrate in the mounting system.
[0005]
Examples of the operation for switching the type of substrate include an operation for replacing a storage rack for storing a substrate in a supply device and a storage device, an operation for replacing a metal mask used in a coating device, and a width of a conveyor for transporting a substrate in various devices. There are operations such as changing the handle by turning the handle, and these operations are performed by the operator. The switching work is performed in a state where the worker waits until the mounting substrate does not exist on the mounting line and the mounting system is completely stopped. Therefore, a lot of time is required for the switching work.
[0006]
However, the market demand for high-mix low-volume production tends to increase further, and there is a possibility that the conventional mounting system cannot exhibit sufficient production capacity.
[0007]
The present invention has been made in view of the above-described problems, and an object thereof is to provide a technique suitable for high-mix low-volume production.
[0008]
[Means for Solving the Problems]
  According to the first aspect of the present invention, there is provided a circuit board process for processing a circuit board while conveying a circuit board or an object which is a holding member for holding the circuit board.MethodBecausea) a step in which the first transport unit changes the width of the transport path in accordance with the size of the first object; b) a step in which the first transport unit receives the first object; and c) the first object. A step of performing an operation on the first object on the conveyance unit, d) a step of a second conveyance unit downstream of the first conveyance unit paying out the second object, and e) the second conveyance unit Changing the width of the transfer path in accordance with the size of the first object, and f) transferring the first object from the first transfer unit to the second transfer unit. The steps a) to c) and the steps d) and e) are performed in parallel.
[0009]
  The invention according to claim 2 is the circuit board processing according to claim 1.MethodBecauseBefore the step d), g) further includes a step of working on the second object on the second transport unit, the steps a) to c) and the steps g), d) and e. ) Is performed in parallel with the process.
[0010]
  The invention according to claim 3A substrate processing method for transferring a substrate or an object which is a holding member for holding the substrate and processing the substrate, wherein the width of the transfer path of the first transfer unit is changed in accordance with the size of the first object. In the process of transporting the first object to the first transport unit, performing work on the first object on the first transport unit, and transporting the first object to the second transport unit, Corresponding to the size of the first object, the width of the conveying path of the first conveying unit is changed, the first object is conveyed to the first conveying unit, and the first object on the first conveying unit is Performing at least a part of the operation for performing an operation on one object and changing the width of the conveyance path of the second conveyance unit corresponding to the size of the first object at the same time. .
[0011]
  The invention according to claim 4A substrate processing method for transferring a substrate or an object which is a holding member for holding the substrate and processing the substrate, wherein the width of the transfer path of the first transfer unit is changed in accordance with the size of the first object. The first conveyance corresponding to the size of the first object during the step of conveying the first object to the first conveyance unit and conveying the first object to the second conveyance unit. The width of the conveyance path of the part is changed, and the second conveyance is performed in correspondence with at least a part of the movement of conveying the first object to the first conveyance part and the size of the first object. The operation of changing the width of the conveyance path of the unit is performed simultaneously.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
<1. Configuration of mounting system>
FIG. 1 is a plan view of a mounting system 1 suitable for mounting electronic components on various types of printed circuit boards (hereinafter referred to as “boards”), and FIG. 2 is a front view of the mounting system 1. In the mounting system 1, mounting is generally performed on a plate-like substrate formed of a resin, but mounting may be performed on another type of substrate (for example, a flexible circuit board). Also, the electronic components to be mounted include various components such as microchips such as resistors and capacitors, IC packages, connectors, and variable resistors. In the mounting system 1, mounting is performed using a solder paste, but mounting using another type of bonding material may be performed.
[0018]
In the mounting system 1, from the upstream side, a supply device 11 that takes out the substrate from the storage rack 8 and supplies it to the transport path of the next process, a coating device 12 that applies a solder paste to the substrate, and a mounting device that mounts electronic components on the solder paste 13. Reflow device 14 that heats and melts the solder paste and cools and solidifies, inspection device 15 that inspects the mounting state of the electronic component, and a substrate received from the transport path of the previous process and is stored in the storage rack 8 The storage devices 16 are arranged in order. In the following description, a device group related to mounting from the coating device 12 to the inspection device 15 is referred to as a mounting line.
[0019]
In FIG. 1, the heads of the coating device 12, the mounting device 13, and the inspection device 15 are not shown in order to clearly show the conveyance path.
[0020]
The supply device 11 includes a plurality of storage rack exchanging units 111 that replace the storage rack 8 from which the substrate is taken out with another storage rack 8, and a transfer that receives the substrate from the storage rack 8 and transfers it to the coating device 12. A mounting portion 112 is provided. As shown in FIG. 1, the plurality of storage rack exchanging units 111 are arranged in a direction perpendicular to the substrate transport direction after the next process of the mounting line. Thereby, in the mounting system 1, even if many storage rack exchange parts 111 are arrange | positioned, it is suppressed that the supply apparatus 11 becomes long with respect to a board | substrate conveyance direction.
[0021]
Each storage rack exchanging unit 111 stores a plurality of storage racks 8 that store one type of substrate, and as many storage rack exchanging units 111 as the number of types of substrates mounted in the mounting system 1 are provided. The storage rack 8 arranges a plurality of substrates parallel to each other in the normal direction of the main surface (in the mounting system 1, the normal direction of the main surface is the vertical direction because the substrate is handled in a horizontal posture). This is a so-called magazine rack that is stored in the same manner as that conventionally used.
[0022]
The transfer unit 112 can access any storage rack replacement unit 111 and can hold any of a plurality of types of substrates having different sizes, and transfers the substrate to a mounting line starting from the coating apparatus 12. Included.
[0023]
The coating apparatus 12 includes a transport mechanism 2 including three transport units 21, and a head unit 121 (see FIG. 2) that discharges solder paste from the nozzles is disposed on a transport path by the transport mechanism 2. The head unit 121 is movable in the horizontal direction and the vertical direction, and applies a solder paste in a dot shape to a predetermined location on the substrate being transported.
[0024]
A plurality of mounting devices 13 are provided, and each mounting device 13 includes a transport mechanism 2 including two transport units 21. Two heads 131 (see FIG. 2) are positioned above the two transport units 21, and electronic components are mounted on the solder paste on the substrate held by the transport units 21. The electronic parts are supplied from the cassette unit 132 shown in FIG. 1, and a reel around which a tape on which the electronic parts are arranged is wound is attached to the cassette unit 132.
[0025]
The reflow device 14 holds the substrate with a chuck (not shown) and transfers the substrate from the mounting device 13 to the pallet 7, and takes out the substrate from the pallet 7 with the chuck and transfers it to the inspection device 15. It has the transfer part 142 to send out. Inside the reflow device 14, the substrate is transported while being placed on the pallet 7. A plurality of heating units 143 (see FIG. 2) are provided inside the reflow apparatus 14, and heating (preheating and main heating) of the substrate is performed according to a predetermined temperature control profile while the substrate is transported. The substrate on which the solder paste has been melted by heating is air-cooled by a fan (not shown), and the electronic components are fixed to the substrate by solidifying the solder. The pallet 7 from which the substrate has been taken out by the transfer unit 142 is conveyed to the transfer unit 141 via the lower part of the reflow device 14.
[0026]
The inspection device 15 includes a transport mechanism 2 including three transport units 21, and a head unit 151 (see FIG. 2) having a camera is disposed on a transport path by the transport mechanism 2. The head unit 151 is movable in the horizontal direction, and confirms whether or not the electronic component is properly mounted on the substrate. The inspection result is used for production management.
[0027]
The storage device 16 receives a substrate from the plurality of storage rack exchanging portions 161 for exchanging the storage rack 8 with another storage rack 8 and the inspection device 15 in the same manner as the supply device 11 and transfers the substrate to the storage rack exchanging portion 161. The transfer part 162 to be used is included. As shown in FIG. 1, the plurality of storage rack exchanging parts 161 are arranged in a direction perpendicular to the substrate transport direction before the previous process of the mounting line. Thereby, in the mounting system 1, even if many storage rack exchange parts 161 are arrange | positioned, it is suppressed that the storage apparatus 16 becomes long with respect to a board | substrate conveyance direction.
[0028]
Each storage rack exchanging unit 161 stores a plurality of storage racks 8 that store one type of substrate in the same manner as the storage rack exchanging unit 111 on the supply device 11 side, and as many storage rack exchanging units 161 as the number of types of substrates are provided. . The transfer unit 162 can hold any of a plurality of types of substrates to be transferred, and transfers the substrate received from the inspection apparatus 15 to the storage rack replacement unit 161 corresponding to the type of substrate.
[0029]
As described above, in the mounting system 1, it is possible to supply a plurality of types of substrates from the supply device 11 to the mounting line in an arbitrary order. It is stored in.
[0030]
Further, on the mounting line, it is possible to mount a plurality of types of substrates in an arbitrary order. Although details will be described later, a plurality of types of substrates can be efficiently transferred in an arbitrary order by providing a plurality of transfer units 21 in the coating device 12, the mounting device 13, and the inspection device 15. Also in the reflow apparatus 14, as described above, a plurality of types of substrates can be transported in an arbitrary order by the pallet 7. As a result, the mounting system 1 mounts substrates suitable for high-mix low-volume production.
[0031]
For example, when three different substrates 901 to 903 are used for one electrical appliance 900 as shown in FIG. 3, it is assumed that several hundred to several thousand electrical appliances 900 are conventionally manufactured on the substrate 901. Mounting, mounting on the substrate 902, and mounting on the substrate 903 are continuously performed in units of the number of manufactured units, and switching work and switching time are required unless switching of the system setting due to the change of the type of the substrate is limited to about twice. There has been a problem of pressing production costs and production efficiency.
[0032]
On the other hand, since the mounting system 1 can mount the substrates 901 to 903 in an arbitrary order, it is possible to mount the substrates 901, 902, and 903 one by one in this order. As a result, even when a very small number of electrical appliances 900 are manufactured, mounting can be performed without reducing manufacturing cost and manufacturing efficiency.
[0033]
Even when electronic components are mounted on a board used only for one television exemplified as the problem to be solved by the invention, mounting is performed while continuously conveying 10 types of boards having different sizes. Therefore, the mounting efficiency by the mounting system 2 is drastically improved by eliminating the production stop state for switching the board model. Furthermore, it is possible to reduce the inventory of electronic components and substrates before and after mounting, and it is possible to mount quickly and inexpensively in response to market demands.
[0034]
Hereinafter, some devices in the mounting system 1 will be described in detail.
[0035]
<2. Supply device and storage device>
4 and 5 are a plan view and a front view of the supply device 11. As shown in FIG. 4, the supply device 11 has a plurality of storage rack exchanging units 111 in a direction perpendicular to the substrate transfer direction of the mounting line, and further, between the plurality of storage rack exchanging units 111 and the coating device 12. A transfer unit 112 is included.
[0036]
The storage rack exchanging unit 111 includes a storage unit 31 for storing the storage rack 8 and an elevating unit 32 for exchanging the storage rack 8. As shown in FIG. 5, the storage rack 8 for storing the substrate 9 is placed on the lower portion of the storage unit 31, and the storage rack 8 after the substrate 9 is taken out is placed on the upper portion. Conveyors 311 and 312 for moving the storage rack 8 are provided at the lower and upper stages of the storage unit 31, respectively.
[0037]
The elevating unit 32 has a conveyor 321 on which the storage rack 8 is placed, and the conveyor 321 is moved up and down by a drive unit 322. In principle, in the storage rack exchanging unit 111, the storage rack 8 is transferred from the lower conveyor 311 to the conveyor 321 in a lowered state, and is transferred to the upper conveyor 312 after the elevating unit 32 is moved up.
[0038]
As shown in FIGS. 4 and 5, an extrusion mechanism 313 is provided between the belts of the upper conveyor 312, and the extrusion member 3131 of the extrusion mechanism 313 can be moved by the driving unit 3132. The conveyor 321 of the elevating unit 32 intermittently rises at every storage interval of the substrates 9 in the storage rack 8, and the extrusion mechanism 313 pushes the substrate 9 toward the transfer unit 112 each time the conveyor 321 moves up. Accordingly, the substrates 9 are discharged one by one to the transfer unit 112, and when the lowermost substrate 9 in the storage rack 8 is pushed out, the empty storage rack 8 is transferred to the upper conveyor 312.
[0039]
As shown in FIG. 4, the transfer unit 112 includes a plurality of standby units 33 and transfer units 34 corresponding to the storage rack replacement units 111. Each standby unit 33 has a conveyor 331 corresponding to the size of the substrate 9 in the storage rack 8 of the corresponding storage rack replacement unit 111, and only one substrate 9 pushed out from the storage rack replacement unit 111 is on the conveyor 331. Retained.
[0040]
The transfer unit 34 includes a transfer table 342 provided with a conveyor 341 and a moving mechanism 343 that moves the transfer table 342 in a direction perpendicular to the substrate transfer direction of the mounting line. One belt of the conveyor 341 can be moved by two guide rails, a ball screw mechanism and a motor, and the width in the direction perpendicular to the conveying direction of the conveyor 341 can be changed according to the size of the substrate 9 to be held. It is said.
[0041]
The moving mechanism 343 also moves the transfer table 342 by two guide rails, a ball screw mechanism, and a motor. The transfer unit 34 can receive the substrates 9 of various sizes from an arbitrary standby unit 33 by the moving mechanism 343 and the conveyor 341 capable of changing the width, and the received substrates 9 are transferred to the coating apparatus 12. In addition, since the various board | substrates 9 are waited by the some standby part 33, the transfer stand 342 can receive arbitrary types of board | substrates 9 rapidly.
[0042]
As shown in FIG. 4, a reading sensor 323 that reads a barcode written on the storage rack 8 is provided in the elevating unit 32 of each storage rack exchanging unit 111. As a result, the storage rack 8 placed on the conveyor 321 and from which the substrate 9 is taken out is identified, and it is confirmed in advance whether the size and type of the substrate 9 stored in the storage rack 8 are incorrect. As a result, even if the wrong storage rack 8 is carried into the storage rack exchanging unit 111, the wrong substrate 9 is prevented from being pushed out to the standby unit 33.
[0043]
6 and 7 are a plan view and a front view of the storage device 16. The storage device 16 has substantially the same configuration as the supply device 11, and has a plurality of storage rack exchanging portions 161 in a direction perpendicular to the substrate transport direction of the mounting line, as shown in FIG. A transfer unit 162 is provided between the storage rack exchanging unit 161 and the inspection device 15.
[0044]
The storage rack exchanging unit 161 is the same as the storage rack exchanging unit 111 of the supply apparatus 11 except that the storage rack exchanging unit 161 includes the storage unit 31 and the elevating unit 32 and does not include the extrusion mechanism 313. However, as shown in FIG. 7, in the storage rack exchanging unit 161, the empty storage rack 8 is transferred from the upper conveyor 312 of the storage unit 31 to the lifting unit 32, and the storage rack 8 is lowered while the substrate 9 is stored. The storage rack 8 storing the substrates 9 is transferred from the conveyor 321 to the lower conveyor 311.
[0045]
The transfer unit 162 has substantially the same configuration as the transfer unit 112 of the supply device 11, and includes a plurality of standby units 33 and transfer units 34. However, the standby unit 33 is provided with an extrusion mechanism 332, and the standby unit 33 is longer by that amount.
[0046]
The transfer unit 34 has the same structure as the transfer unit 34 of the supply device 11, and receives and holds substrates 9 of various sizes from the inspection device 15 by a transfer table 342 having a conveyor 341 whose width can be changed and a moving mechanism 343. The received substrate 9 is transferred to a standby unit 33 having a conveyor 331 having a corresponding width.
[0047]
Each standby unit 33 conveys the received substrate 9 to the storage rack exchanging unit 161 side by the conveyor 331, and stores the substrate 9 in the storage rack 8 on the elevating unit 32 by the extrusion mechanism 332. When one substrate 9 is stored, the elevating unit 32 is lowered, and preparation for storing the next substrate 9 of the same size is made. When one storage rack 8 is filled with the substrate 9, the storage rack 8 is transferred to the lower conveyor 311, and the conveyor 321 of the elevating unit 32 rises to receive the empty storage rack 8 from the upper conveyor 312.
[0048]
As shown in FIG. 6, a reading sensor 323 that reads a barcode written on the storage rack 8 is also provided in the elevating unit 32 of each storage rack exchanging unit 161, and the storage rack 8 in which the substrate 9 is stored is the storage rack 8. It is confirmed whether or not it conforms to the size and model. This prevents erroneous storage of the substrate 9.
[0049]
As described above, since the supply device 11 and the storage device 16 are provided with the plurality of storage rack exchanging units 111 and 161, a plurality of types of substrates 9 can be supplied and stored. By replacing the storage rack 8 at 161, a large number of substrates 9 can be supplied and stored.
[0050]
<3. Multi-substrate transfer mechanism>
As shown in FIGS. 1 and 2, in the mounting system 1, a large number of transfer units 21 are provided, and the substrate 9 is transferred. For example, in the coating device 12 and the inspection device 15, three transport units 21 are arranged on the base of the device along the transport direction of the substrate 9 to configure the transport mechanism 2, and in the mounting device 13, the two transport units 21 are configured. A transport mechanism 2 is configured. Each transport unit 21 has the same configuration, and holds only one substrate 9 at a time, and the width of the transport path is individually changed according to the size of the substrate 9 to be held. In addition, the structure of the conveyance part 21 and the structure on the transfer stand 342 in the supply apparatus 11 and the storage apparatus 16 are the same. Hereinafter, after describing the structure of the transport unit 21, the cooperative operation of the plurality of transport units 21 will be described.
[0051]
FIG. 8 is a plan view of the transport unit 21, and FIGS. 9 and 10 are cross-sectional views at the positions of arrows AA and BB in FIG. 8, respectively. In addition, illustration is abbreviate | omitted suitably about the detail.
[0052]
The conveyance part 21 conveys the board | substrate 9 with the conveyor 22, and the conveyor 22 has the two guide parts 221 which comprise the conveyance path by guiding the two opposing sides of the board | substrate 9, as shown in FIG. 8 thru | or FIG. The belt 222 is attached to the plurality of pulleys so as to be covered with the guide portion 221. The belt 222 is driven by a motor 223 shown in FIGS. As shown in FIG. 10, a protrusion that protrudes toward the substrate 9 to be conveyed is provided at the upper end of the guide portion 221, and the substrate placed on the two belts 222 between the protrusion and the belt 222. 9 is conveyed.
[0053]
As shown in FIGS. 8 and 10, a motor 231 and a ball screw 232 are provided on the base (which may be the base of the apparatus) of the transport unit 21, and are further shown in FIGS. 8 and 9. Thus, two guide rails 233 are attached. One of the two guide portions 221 is fixed to the base as shown in FIG. 10, and the other is attached to a nut 234 attached to the ball screw 232. Therefore, when the motor 231 rotates, only one guide portion 221 moves while being guided by the guide rail 233 by the ball screw mechanism. As a result, the distance between the two guide portions 221 (and the two belts 222) is changed, and stable conveyance can be performed while restricting the postures of the substrates 9 of various sizes.
[0054]
As described above, the transfer table 342 of the supply device 11 and the storage device 16 has the same structure, and has a mechanism for changing the interval between the two guide portions. Accordingly, the posture of the substrate 9 is also restrained when the substrate 9 is transferred to the transfer table 342, and the stable transfer of the substrate 9 is performed.
[0055]
FIG. 11 is a diagram illustrating a typical example of the flow of operations of the two transfer units 21 that transfer the substrate 9. FIGS. 12 to 15 are plan views showing the states of the two transport units 21. The second transport unit 21b is located on the downstream side of the first transport unit 21a, and the second transport unit 21a performs the second transport from the first transport unit 21a. The substrate 9 is transported to the part 21b. In the following description, the substrate 9 newly received by the first transport unit 21a is referred to as “first substrate 9a”, and the substrate 9 delivered by the second transport unit 21b is referred to as “second substrate 9b”. Further, the motor 231 and the conveyor 22 of the first transport unit 21a and the second transport unit 21b are connected to the transport control unit 20 as shown in FIG. 12, and the transport control unit 20 performs the cooperative operation shown in FIG.
[0056]
First, as shown in FIG. 12, in a state where the second transport unit 21b holds the second substrate 9b and the first transport unit 21a does not hold the substrate, the first transport unit 21a receives the first substrate 9a. The width of the transport path (that is, the distance between the two guide portions 221) is changed in accordance with the size of the first substrate 9a (step S11). And when the 1st board | substrate 9a is received by the 1st conveyance part 21a, it will be in the state shown in FIG. 13 (step S12).
[0057]
On the other hand, in the second transport unit 21b, after the second substrate 9b is dispensed and the state shown in FIG. 14 is reached (step S13), the distance between the two guide portions 221 of the second transport unit 21b is the first substrate 9a. The width of the conveyance path is changed by changing it according to the size of the sheet (step S14). Thereafter, the first substrate 9a is transported from the first transport unit 21a to the second transport unit 21b, and returns to the state before step S11 (step S15).
[0058]
Here, in the coating apparatus 12 and the inspection apparatus 15 having the three transport units 21 shown in FIG. 2, the most upstream transport unit 21 corresponds to the first transport unit 21a, and the central transport unit 21 is the second transport unit. When it is assumed that the head portion 121b corresponds to 21b, the head portions 121 and 151 of these apparatuses access the substrate 9 held by the second transport portion 21b and work (the processing by the head portion is appropriately referred to as “work”). Therefore, the operation in which the step (step S16) in which the head unit performs work on the first substrate 9a after step S15 is added is executed in these apparatuses. And the 1st conveyance part 21a fulfill | performs the role as a buffer which hold | maintains a standby | waiting board | substrate, and the fall of the conveyance efficiency by the nonuniformity of conveyance operation is suppressed.
[0059]
On the other hand, in the coating device 12 and the inspection device 15, when it is considered that the central transport unit 21 corresponds to the first transport unit 21a and the most downstream transport unit 21 corresponds to the second transport unit 21b, the head unit after step S12. However, the operation in which the step (step S17) of performing the work on the first substrate 9a is added is executed. In this case, the second transport unit 21b serves as a buffer for holding the substrate 9 to be delivered to the next apparatus, and a decrease in transport efficiency due to uneven transport operation is suppressed.
[0060]
When it is assumed that the two transport units 21 of the mounting device 13 correspond to the first transport unit 21a and the second transport unit 21b, the first substrate in which one head unit 131 is held by the first transport unit 21a after step S12. A step (step S17) for accessing 9a and mounting an electronic component is added, and a step for mounting the electronic component by accessing the first substrate 9a held by the second transport unit 21b after step S15 (step S16). Will be added.
[0061]
Furthermore, the two transport units 21 that perform the operation shown in FIG. 11 are the operations of the two transport units 21 that are adjacent to each other between the devices, or the transfer table 342 of the supply device 11 and the storage device 16 and the transport units 21 that are adjacent thereto. It may be regarded as an operation. In the mounting system 1, a plurality of types of substrates 9 can be arbitrarily provided by providing a plurality of transfer units 21 capable of changing the width of the transfer path in one apparatus or by providing a transfer table 342 having the same structure as the transfer unit 21. Smooth conveyance is realized in this order.
[0062]
In mounting electronic components, it is necessary to reliably manage the position of the substrate 9 to be transported and restrain the posture, and the conventional mounting system is designed with a policy of stably transporting the same type of substrate 9 continuously. Has been done. In other words, there is no concept that a single apparatus is provided with a plurality of conveyors and a single conveyor conveys only one substrate 9 at a time. Switching work was assumed. However, in the mounting system 1, a large number of transfer units 21 are provided in one apparatus, and an arbitrary part of the transfer path in the apparatus is set to an arbitrary width by the idea that one conveyor holds only one substrate 9 at a time. As a result, the concept of switching the type of the substrate 9 is eliminated, and the switching work by the operator is unnecessary.
[0063]
Since steps S11, S12, and S17 are independent of steps S13 and S14 and step S16 for the second substrate 9b (that is, step S16 executed before step S13), steps S11 and S12. , S17 and steps S16, S13, S14 are executed in parallel, thereby realizing efficient conveyance. Note that “parallel” refers to a state in which at least a part of one operation and at least a part of the other operation are simultaneously performed (the same applies hereinafter), and a plurality of transfer units 21 deliver two or more substrates 9. By carrying out in parallel, efficient conveyance is realized.
[0064]
<4. Production management>
FIG. 16 is a diagram showing the main functions of the production management unit 5 that performs production management in the mounting system 1. A reading sensor 323 that reads the barcode of the storage rack 8 in the supply device 11 and the storage device 16 is connected to the production management unit 5. Further, as shown in FIGS. 4 and 5, an upstream sensor 41 that reads a barcode written on the substrate 9 on the most upstream side of the conveyance path (that is, the conveyance unit 21 on the most upstream side of the coating apparatus 12), and As shown in FIGS. 6 and 7, the downstream sensor 42 that reads the barcode written on the substrate 9 on the most downstream side of the conveyance path (that is, the conveyance unit 21 on the most downstream side of the inspection apparatus 15) is also the production management unit 5. Connected to.
[0065]
17 and 18 are a plan view and a front view showing a state in which the upstream sensor 41 is attached. The downstream sensor 42 is similarly attached. The upstream sensor 41 is attached to the inside of the two guide portions 221 on the guide portion 221 of the conveying portion 21 via the flange 411, and is a barcode written on the substrate 9 conveyed by the belt 222 along the guide portion 221. Read.
[0066]
The production management unit 5 shown in FIG. 16 is constructed from a computer system, and the storage rack monitoring unit 51 and the difference data generation unit 52 are realized by the CPU performing arithmetic processing according to a program. In the production management unit 5, various data are stored in the fixed disk 53.
[0067]
The output of the reading sensor 323 of the supply device 11 and the storage device 16 is input to the storage rack monitoring unit 51 and collated with the storage rack management data 501 prepared in advance according to the production plan. The storage rack management data 501 includes the type of the substrate 9 (the product number of the substrate, the product number of the manufactured product, the number for specifying the mounting conditions, etc.) to be stored in each storage rack replacement unit 111, 161, the storage rack 8. The information indicating the type (number of stored sheets, storage pitch, etc.) of the storage rack 8 is included, and the barcode information of the storage rack 8 includes the type of the substrate 9 to be stored by the storage rack replacement unit 111, 161 and the type of the storage rack 8. If they are different, the storage rack monitoring unit 51 notifies the worker.
[0068]
The output from the upstream sensor 41 is the identification result of the substrate 9 supplied to the mounting line (that is, the mounting device group from the coating device 12 to the inspection device 15), and is stored as supply substrate data 502 in the fixed disk 53. The The output from the downstream sensor 42 is an identification result of the board 9 paid out from the mounting line, and is stored as the storage board data 503 on the fixed disk 53. Then, the difference data generation unit 52 obtains a difference between the supply board data 502 and the storage board data 503 (a matching result between the input board and the mounted board) and stores the difference data 504 in the fixed disk 53.
[0069]
In the mounting system 1, the substrate 9 may be removed or inserted by an operator for separate inspection. Also, obvious defective substrates are removed as appropriate. For these reasons, the substrate 9 removed or inserted during the transfer is managed as difference data 504.
[0070]
When mounting is performed only on the same type of substrate 9 as in the prior art, it is possible to manage production of the substrate only by managing the number of substrates supplied to the mounting line and the number of substrates dispensed from the mounting line. . However, since a plurality of types of substrates are transported in an arbitrary order in the mounting system 1, production management cannot be performed only with the number of substrates. Therefore, in the mounting system 1, by providing the upstream sensor 41 and the downstream sensor 42, it is possible to appropriately perform production management of a plurality of types of substrates.
[0071]
Further, the output from the downstream sensor 42 is also input to the storage device 16. Accordingly, the storage device 16 grasps the type of the substrate 9 received by the transfer unit 34 illustrated in FIG. 6, and the width of the conveyor 341 of the transfer unit 34 is changed according to the size of the substrate 9. Furthermore, the storage rack 8 corresponding to the type of the substrate 9 is specified, and the transfer table 342 can be moved to the standby unit 33 that communicates with the storage rack exchanging unit 161 having the specified storage rack 8.
[0072]
In the mounting system 1, the downstream sensor 42 is provided on the most downstream side of the transport path. Therefore, even if the substrate 9 is removed from the transport path or inserted in the middle, the respective substrates 9 are finally confirmed after being finally confirmed. Storage in the rack exchanging unit 161 is realized.
[0073]
Note that the types of the substrates 9 supplied from the supply device 11 to the mounting line are sequentially transmitted to the transport unit 21 arranged and arranged on the mounting line, and the width of the transport path of the transport unit 21 is changed. When the removal or insertion of the substrate 9 is performed in the course of conveyance, the signal transmitted between the conveyance units 21 is appropriately corrected. Then, after the final confirmation is performed by the downstream sensor 42, the substrate 9 is stored. Each transport unit 21 may be provided with a sensor for detecting the type of the substrate 9. In this case, removal and insertion of the substrate 9 are automatically recognized.
[0074]
<5. Other transport mechanisms>
FIG. 19 is a plan view showing another form of the mounting apparatus. The mounting device 13a shown in FIG. 19 is different from the mounting device 13 shown in FIG. 1 in that the mounting device 13a includes a transport mechanism 2 including three transport units 21 on a base. In addition, an auxiliary transport unit 210 is disposed on the upstream side of each mounting device 13a. The transport unit 21 and the upstream auxiliary transport unit 210 of each mounting apparatus 13a are controlled by the transport control unit 20a, and communication for synchronizing control is performed between the transport control units 20a.
[0075]
A head for taking out an electronic component from the cassette unit 132 and mounting it on the substrate 9 held by the transport unit 21 above the two transport units 21 on the upstream side and the downstream side of the three transport units 21 of the mounting device 13a. The part 131 is located. The auxiliary transport unit 210 has substantially the same configuration as the transport unit 21, but is separate from the mounting device 13a. In the auxiliary transport unit 210, an operator can take out and insert the substrate 9 between the devices as needed. Unlike the guide unit 221 shown in FIG. The upper part of the part 221 has a shape that does not protrude above the substrate 9.
[0076]
That is, in the mounting device 13a, the auxiliary transport unit 210 serves as a buffer for the upstream head unit 131, and the central transport unit 21 serves as a buffer for the downstream head unit 131. Thereby, even if the mounting time of the electronic component by each head part 131 of the plurality of mounting devices 13a is uneven, the stable transport of the substrate 9 is realized.
[0077]
FIG. 20 is a diagram showing a flow of operations of one mounting device 13a and the auxiliary transport unit 210 on the upstream side, and FIGS. 21 to 24 are diagrams for explaining operating states of the mounting device 13a and the auxiliary transport unit 210. It is. In the following description, the three transport units 21 are referred to as the first transport unit 21a, the second transport unit 21b, and the third transport unit 21c from the upstream side, and the substrate 9 held by the auxiliary transport unit 210 in the state of FIG. The substrate 9 held by the first substrate 9a and the second transfer unit 21b is called the second substrate 9b, and the substrate 9 received after the auxiliary transfer unit 210 pays out the first substrate 9a is called the third substrate 9c. In FIG. 20, the operation of only the auxiliary conveyance unit 210 is indicated by a wavy line block.
[0078]
As shown in FIG. 21, in a state where the auxiliary transport unit 210 holds the first substrate 9a and the second transport unit 21b holds the second substrate 9b, the first transport unit 21a matches the size of the first substrate 9a. The width of the transport path is changed (that is, the interval between the two guide portions 221 shown in FIG. 8 is changed) (step S21), and the third transport section 21c is transported in accordance with the size of the second substrate 9b. Is changed (step S22). Then, the first transport unit 21a receives the first substrate 9a from the auxiliary transport unit 210 (step S23), and the second substrate 9b is transported from the second transport unit 21b to the third transport unit 21c (step S24). As a result, the mounting device 13a is in the state shown in FIG.
[0079]
In the first transport unit 21a, the head unit 131 accesses the first substrate 9a to mount electronic components (step S25), and in the third transport unit 21c, the other head unit 131 accesses the second substrate 9b. Then, electronic parts are mounted (step S26). Further, since the auxiliary transport unit 210 and the second transport unit 21b do not hold the substrate 9, the width of the transport path is changed in accordance with the third substrate 9c newly received by the auxiliary transport unit 210 as shown in FIG. (Step S31), the width of the transport path is changed in accordance with the first substrate 9a that is also expected to receive the second transport unit 21b (Step S27).
[0080]
Thereafter, the auxiliary transport unit 210 receives the third substrate 9c (step S32), the first substrate 9a is transported from the first transport unit 21a to the second transport unit 21b (step S28), and the third transport unit 21c performs the first operation. The two substrates 9b are paid out (step S29).
[0081]
With the above operation, as shown in FIG. 24, the auxiliary transport unit 210 and the second transport unit 21b return to the initial state in which the substrate 9 is held (the state before steps S21 and S22), and then the transport and mounting operations. Is repeated.
[0082]
Here, the operation of transporting the substrate 9 from the auxiliary transport unit 210 to the first transport unit 21a (step S23), and the operation of transporting the substrate 9 from the second transport unit 21b to the third transport unit 21c (step S24). ) Can be performed independently of each other. Therefore, the flow of steps S21, S23, S31 and S25 and the flow of steps S22, S24, S27, S26 and S29 can be executed in parallel with each other. Further, since the operation of mounting the electronic component on the substrate 9 and the operation of the downstream transport unit 21 changing the width of the transport path in accordance with the size of the substrate 9 being mounted are independent of each other, each step S31, S25, S27, and S26 can also be executed in parallel with each other.
[0083]
Similarly, an operation in which the auxiliary transport unit 210 receives the substrate 9 (step S32), an operation in which the substrate 9 is transported from the first transport unit 21a to the second transport unit 21b (step S28), and a third transport unit 21c. Since the operation of dispensing the substrate 9 (step S29) can also be performed independently of each other, the flow of steps S31 and S32, the flow of steps S25, S27, S28, and S21, and the flow of steps S26, S29, and S22. Can be executed in parallel with each other.
[0084]
By performing the operations of the auxiliary transport unit 210 and the mounting device 13 while satisfying the relationship of these operations, the transport and mounting operations can be performed quickly, and a stable operation can be achieved even if some unevenness occurs in the transport operation. Realized.
[0085]
The configuration shown in FIG. 19 can be used for an apparatus that performs processing other than mounting of electronic components, and can also be used for the coating apparatus 12, the reflow apparatus 14, and the inspection apparatus 15.
[0086]
Here, when a plurality of head units are provided in the apparatus, transport that serves as a buffer for holding the substrates 9 in order to suppress the influence of unevenness in the work timing of the head units on the substrates 9 on the operation of each transport unit 21. It is preferable that at least one section 21 (hereinafter referred to as a “buffer transport section”) is provided. That is, it is preferable to provide a larger number of transport units 21 than the number of head units (the number of transport units 21 on which work is performed by the head units (hereinafter referred to as “work transport unit”)).
[0087]
Further, when the buffer auxiliary transport unit 210 is provided on the upstream side of the apparatus, it is preferable that at least one buffer transport unit is disposed between the plurality of work transport units.
[0088]
Furthermore, since a more stable operation is realized by waiting the substrate 9 on the upstream side of each work transport unit, the buffer transport is performed upstream of each work transport unit other than the most upstream work transport unit. It is more preferable that the number of transport sections 21 is (2n-1) with respect to the number n of head sections. That is, it is preferable that the buffer transport unit is disposed between any two work transport units adjacent to each other. Needless to say, the number of buffer conveyance units for one head unit may be two or more, and it can be said that one apparatus is preferably provided with (2n-1) or more conveyance units 21.
[0089]
In FIG. 19, the auxiliary transport unit 210 causes the head 9 on the most upstream side to stand by, but the auxiliary transport unit 210 may be provided integrally with the apparatus. In this case, at least one buffer transport section and work transport section are alternately arranged, and one apparatus is provided with 2n or more transport sections 21 for the number n of heads.
[0090]
In addition, the conveyance part 21 may protrude and be attached from the base of an apparatus, and all the conveyance parts 21 do not need to be arrange | positioned on the base of an apparatus.
[0091]
<6. Other supply device and storage device>
25 is a plan view showing the supply device 11a having only one storage rack exchanging unit 111, and FIG. 26 is a plan view showing the storage device 16a having only one storage rack exchanging unit 161.
[0092]
The supply device 11a includes a storage rack exchanging unit 111 and a transfer unit 112a. The storage rack exchanging unit 111 has the same structure as the storage rack exchanging unit 111 shown in FIGS. 4 and 5, and replaces the storage rack 8 from which the substrate 9 is taken out. The transfer unit 112a is the same as the auxiliary transport unit 210 shown in FIG. In the following description, reference numerals attached to FIG.
[0093]
In the storage rack exchanging unit 111, the storage rack 8 is not only transported from the lower conveyor 311 to the upper conveyor 312 by the lower conveyor 311, the upper conveyor 312 and the elevating unit 32, but also from the upper conveyor 312 to the lower conveyor. It is also possible to transport the storage rack 8 to 311. That is, the storage rack 8 from which the substrate 9 is taken out can be replaced with another arbitrary storage rack 8. Furthermore, the plurality of storage racks 8 that are stored respectively store different types of substrates 9.
[0094]
Therefore, the storage rack exchanging unit 111 confirms the output of the reading sensor 323 and replaces the storage rack 8 placed on the elevating unit 32, and changes the width of the conveyor of the transfer unit 112a, whereby a plurality of types of substrates 9 are obtained. Can be taken out in any order. The extracted substrate 9 is supplied from the transfer unit 112a to the coating apparatus 12.
[0095]
The storage device 16a includes a storage rack exchanging unit 161 and a transfer unit 162a. The storage rack exchanging part 161 has the same structure as the storage rack exchanging part 161 shown in FIGS. 6 and 7, and replaces the storage rack 8 that stores the substrates 9. The transfer unit 162a includes a conveyor 1621 and an extrusion mechanism 1622 whose width can be changed. In the following description, reference numerals attached to FIG.
[0096]
In the storage rack exchanging unit 161, the storage rack 8 is not only transported from the lower conveyor 311 to the upper conveyor 312 by the lower conveyor 311, the upper conveyor 312, and the elevating unit 32, but also from the upper conveyor 312 to the lower conveyor 312. The storage rack 8 can be transported to the conveyor 311. That is, the storage rack 8 in which the substrates 9 are stored can be exchanged with any other storage rack. Furthermore, the plurality of storage racks 8 that are stored respectively store different types of substrates 9.
[0097]
The type of the substrate 9 paid out from the inspection device 15 is identified by the downstream sensor 42, and the width of the conveyor 1621 of the transfer unit 162a is changed according to the identification result. When the transfer unit 162a receives the substrate 9 from the inspection apparatus 15 and transports it to the vicinity of the storage rack exchange unit 161, the storage rack exchange unit 161 checks the output of the reading sensor 323 and is placed on the elevating unit 32. 8 is replaced, and the substrate 9 is stored in an appropriate storage rack 8 by the extrusion mechanism 1622.
[0098]
As described above, each of the supply device 11a and the storage device 16a is provided with only one storage rack replacement unit 111, 161. However, by arbitrarily replacing the storage rack 8, a plurality of types of substrates 9 in an arbitrary order can be obtained. It can be supplied to the mounting line and can accommodate the substrate 9 from the mounting line.
[0099]
Next, still another example of the supply device will be described. In the supply device 11 and the storage device 16 shown in FIGS. 4 to 7, the transfer units 112 and 162 have the standby unit 33 and the transfer unit 34, but the standby rack 33 is omitted and the storage rack replacement units 111 and 161 and the transfer unit are omitted. The substrate 9 may be directly transferred to and from 34.
[0100]
FIG. 27 is a plan view showing the supply device 11b in which the standby unit 33 is omitted, and FIG. 28 is a plan view showing the storage device 16b in which the standby unit 33 is omitted. The supply device 11b has the same structure as the supply device 11 shown in FIG. 4 except that the standby unit 33 is omitted, and the storage device 16b has the standby unit 33 omitted from the storage device 16 shown in FIG. The transfer table 342 is provided with an extrusion mechanism 35 that pushes the substrate 9 to the storage rack exchanging unit 161. That is, in the supply device 11, the transfer unit 34 moves between a plurality of receiving positions where the substrate is received, and in the storage device 16, the transfer unit 34 moves between a plurality of payout positions where the substrate is discharged. Substrate supply and storage are realized.
[0101]
FIG. 29 is a plan view showing the structure of the extrusion mechanism 35. The extruding mechanism 35 includes a driving unit 351 attached to the fixed-side guide unit, a moving member 352 that moves in the conveyance direction of the substrate 9 by the driving unit 351, and a pin 353 that is attached to the moving member 352. The member 352 can be moved up and down together with the pin 353 by a mechanism not shown. When the substrate 9 is held on the conveyor 341 of the transfer table 342, the moving member 352 and the pin 353 are raised and moved toward the storage rack exchanging portion 161, and the tip of the pin 353 comes into contact with the edge of the substrate 9. Is pushed into the storage rack 8. When the substrate 9 is stored, the moving member 352 and the pin 353 are lowered and returned to the inspection apparatus 15 side.
[0102]
Further, in the supply device 11 and the storage device 16 shown in FIGS. 4 to 7, the standby unit 33 is omitted, and a plurality of storage racks 8 are arranged and arranged so as to be movable in a direction perpendicular to the conveyance direction of the substrate 9. May be. 30 and 31 are a plan view and a front view of such a supply device 11c.
[0103]
The supply device 11c includes a storage rack switching unit 36 and an extrusion unit 37. On the storage rack switching unit 36, storage racks 8 for storing different types of substrates 9 are in the horizontal direction and in the substrate transport direction. Three are arranged in the vertical direction. A placement portion 361 on which the storage rack 8 is placed can be moved up and down by an elevating mechanism 362 constituted by a ball screw or a guide rod. Further, the placement portion 361 and the lifting mechanism 362 are disposed on a horizontal movement mechanism 363 configured by a ball screw, a guide rail, and the like, and are movable in the direction in which the storage rack 8 is arranged.
[0104]
When the substrate 9 is taken out from the supply device 11 c, the desired storage rack 8 is moved to a position facing the transport mechanism of the adjacent coating device 12 by the horizontal movement mechanism 363, and the substrate 9 taken out by the elevating mechanism 362 is moved. Move to the delivery position with the transport mechanism. Thereafter, the pushing member 371 of the pushing part 37 pushes the substrate 9 toward the coating device 12 side.
[0105]
32 and 33 are a plan view and a front view showing another supply device 11d. The supply device 11d includes a storage rack switching unit 36a and an extrusion unit 37. The storage rack switching unit 36a has storage racks 8 for storing different types of substrates 9 in the vertical direction and in the transport direction of the substrates 9. Two are arranged in the vertical direction. The placement portion 364 on which the storage rack 8 is placed can be largely moved up and down by an elevating mechanism 365 constituted by a ball screw or a guide rod.
[0106]
When the substrate 9 is taken out from the supply device 11d, the substrate 9 taken out from the desired storage rack 8 is moved to the delivery position with the transport mechanism of the coating device 12 by the lifting mechanism 365. Thereafter, the pushing member 371 of the pushing part 37 pushes the substrate 9 toward the coating device 12 side.
[0107]
The configuration of the supply device 11c and the supply device 11d can also be used as a storage device. For example, by providing an extrusion mechanism 35 illustrated in FIG. 9 can be stored.
[0108]
As described above, the plurality of storage racks 8 are mounted on the mounting portions 361 and 364, and the plurality of storage racks 8 are mounted by the moving mechanisms such as the lifting mechanism 362, the horizontal moving mechanism 363, and the lifting mechanism 365. By moving any of the placement positions to the supply position or the storage position according to the type of the substrate 9, supply or storage of various types of substrates 9 is realized.
[0109]
<7. Mounting multiple types of boards with storage racks>
Although the storage rack 8 in the above description stores only one type of substrate 9, a storage rack 8 that can store a plurality of types of substrates 9 may be used. 34 is a plan view of a storage rack 8a capable of storing a plurality of types of substrates 9, FIG. 35 is a longitudinal sectional view taken along arrow CC in FIG. 34, and FIG. 36 is an arrow in FIG. It is a longitudinal cross-sectional view in DD. In the storage rack 8a, a plurality of types of substrates 9 parallel to each other are stored in the normal direction of the main surface, and the substrate 9 is moved in the vertical direction in FIG. Done.
[0110]
As shown in FIG. 35, a plurality of support bodies 81 extending in the horizontal direction from one side surface 801 (that is, a portion parallel to the arrangement direction of the plurality of substrates 9) are formed inside the storage rack 8a. As shown in FIG. 36, the support body 81 has a plurality of holes 811 formed therein. A support member 82 that supports one side of the substrate 9 is attached to each of the plurality of support bodies 81 as shown in FIGS.
[0111]
FIG. 37 is a front view of the support member 82, and FIG. 38 is a cross-sectional view taken along arrows EE in FIG. The support member 82 is a bar-shaped member having an L-shaped cross section, and a pin 821 inserted into the hole 811 is attached to the lower surface. As shown in FIGS. 34 and 35, a large number of holes 811 are formed, and the support member 82 can be movably attached to a plurality of positions.
[0112]
A plurality of grooves 83 are formed in a side surface 802 (that is, a portion parallel to the arrangement direction of the plurality of substrates 9) facing the side surface 801 shown in FIG. 35. As shown in FIGS. One side is supported by the lower part of the support member 82, and the other opposite side is supported by one groove 83. Therefore, most of the lower surface of the substrate 9 is separated from the support body 81 by a predetermined distance, and even if the substrate 9 is for double-sided mounting, the lower surface of the substrate 9 (or an electronic component already mounted on the lower surface) is damaged. The substrate 9 can be taken in and out without any problems.
[0113]
In the storage rack 8a, as shown in FIGS. 34 and 35, the position of the support member 82 is moved in accordance with the size of the substrate 9 to be stored, so that the space between each of the plurality of support members 82 and the corresponding groove 83 is increased. Can be changed, and a plurality of types of substrates 9 can be accommodated. Further, since the attachment position of the support member 82 can be easily changed, the substrate 9 to be accommodated can be easily changed.
[0114]
When the storage rack 8a is used for the supply device 11 or the storage device 16, a plurality of types of substrates 9 can be supplied to the mounting line by sequentially removing the substrates 9 from the storage rack 8a. Therefore, in the supply device 11 and the storage device 16, there is no need to arrange a plurality of storage rack exchange parts 111 and 161 as shown in FIG. 1, and the storage rack 8a is arranged in one direction in the storage rack exchange parts 111 and 161. It is only necessary to perform the exchange operation in order. Thereby, simplification of a structure and operation | movement of the supply apparatus 11 and the storage apparatus 16 is implement | achieved.
[0115]
Of course, the substrates 9 may be taken out from the storage rack 8a in any order, and in this case, the relationship between the bar code previously stored in the storage rack 8a in the production management unit 5 and the type and order of the substrates 9 to be stored. Is entered.
[0116]
Note that the structure of the storage rack 8a may be changed as appropriate. For example, in FIG. 35, the support body 81 protrudes from only one side surface 801, but the support body 81 protrudes from both side surfaces 801 and 802 (both support bodies 81 may be integrated). May be supported by two support members 82. However, the structure of the storage rack 8a can be simplified by supporting one side of the substrate 9 with the groove 83 as shown in FIG.
[0117]
FIG. 39 is a perspective view showing another support member 82a. The upper portion of the support member 82a is a two-stage pin, and a pin 821 to be inserted into the hole 811 is attached to the lower portion. FIG. 40 is a plan view showing a state in which the support member 82a is attached to the hole 811 of the support body 81 and the substrate 9 is supported by the support member 82a.
[0118]
Further, the support body 81 is not limited to a plate shape, and may be a bar-like portion extending horizontally from the side surface 801.
[0119]
Furthermore, a member in which the support main body 81 and the support member 82 are integrated is prepared according to the type of the substrate 9 and is detachably attached to the side surface 801 according to the type and number of the substrates 9 accommodated by this member. May be.
[0120]
As described above, various structures can be used as the structure of the storage rack 8a for storing a plurality of types of substrates 9.
[0121]
<8. Modification>
Although the embodiment related to the present invention has been described above, various modifications may be made in the above embodiment.
[0122]
In the transport unit 21 and the transfer table 342 in the above embodiment, the substrate 9 is transported by a conveyor having a belt, but the mechanism for holding and transporting the substrate 9 may be another mechanism. For example, the substrate 9 may be transported by being pressed by a predetermined member while being held by the guide portion 221, or may be transported by contacting a rotating roller. Furthermore, instead of the guide portion 221, the substrate 9 may be transported by gripping two sides of the substrate 9 with a gripping mechanism and moving the gripping mechanism. In this case, the interval between the gripping mechanisms facing the two sides of the substrate 9 corresponds to the width of the transport path.
[0123]
Further, the storage rack 8 in which the substrate 9 is taken in and out and the substrate 9 in the mounting line may be identified by a method other than the barcode. For example, numbers and symbols written on the storage rack 8 and the substrate 9 may be recognized by the camera.
[0124]
Although the storage rack 8 is replaced in the supply devices 11 and 11a and the storage devices 16 and 16a in the above-described embodiment, the storage rack replacement units 111 and 161 are omitted, and the storage rack 8 is placed at a predetermined placement position. In addition, the substrate 9 may not be stored in the storage rack 8 in any supply device or storage device. For example, the substrates 9 may be stacked as they are at a predetermined placement position and taken out one by one. That is, in the supply device 11 and the storage device 16, a plurality of types of substrates 9 having different sizes may be arranged in any manner.
[0125]
In the above embodiment, the widths of the conveyance paths of the plurality of conveyance units 21 provided in one apparatus are controlled independently of each other, but it is not always necessary that all the conveyance units 21 are independently controlled. For example, the width of the conveyance path of the two conveyance units 21 among the three conveyance units 21 may be similarly changed. Even with such control, the width of different transport paths can be set simultaneously in one apparatus, and a plurality of types of substrates 9 having different sizes can be transferred smoothly in parallel in one apparatus. It can be performed. That is, the conveyance path width is individually changed for at least two of the plurality of conveyance units 21 in one apparatus, thereby realizing conveyance suitable for mounting a plurality of types of substrates.
[0126]
In other words, a plurality of transfer units 21 that are not independently controlled are regarded as one transfer unit, and a plurality of transfer units that are independently controlled from each other are provided in the apparatus, whereby smooth transfer of a plurality of types of substrates 9 is realized. Further, by providing more independently controlled transport units than the number of head units, it becomes possible to make the substrate 9 stand by in several transport units, and serve as a buffer among the independently controlled transport units. By providing the transfer unit that fulfills between the transfer units on which the head unit operates, the substrate 9 can be put on standby upstream of each head unit other than the most upstream head unit.
[0127]
In addition, when paying attention to one apparatus and wanting to minimize the number of transfer units 21 (when transfer between transfer units 21 can be performed relatively stably), it is necessary to sequentially move the substrates 9 from the downstream side. In consideration of this, it is preferable that one apparatus is provided with a conveyance unit corresponding to each head unit, and only one buffer conveyance unit is provided on the most downstream side. That is, it is preferable that the number of transport units is one more than the number of head units.
[0128]
Moreover, although the board | substrate 9 is directly conveyed in the conveyance mechanism 2 which concerns on the said embodiment, the board | substrate 9 may be conveyed in the state hold | maintained one or more by the pallet which is a member holding the board | substrate 9. FIG. Even in this case, by using the transport mechanism 2, various pallets can be used according to the type and number of substrates 9 placed on the pallet, and efficient transport is realized.
[0129]
In the reflow device 14 in the above embodiment, the substrate 9 is transported by the pallet 7, but the reflow device 14 may be provided with a plurality of transport units that can change the width of the transport path.
[0130]
【The invention's effect】
According to the present invention, objects having different sizes can be efficiently transported in an arbitrary order by the plurality of transport units that can change the width of the transport path. As a result, conveyance suitable for high-mix low-volume production is realized.
[Brief description of the drawings]
FIG. 1 is a plan view of a mounting system.
FIG. 2 is a front view of the mounting system.
FIG. 3 is a diagram illustrating a substrate used for an electric appliance
FIG. 4 is a plan view of a supply device
FIG. 5 is a front view of the supply device.
FIG. 6 is a plan view of the storage device.
FIG. 7 is a front view of the storage device.
FIG. 8 is a plan view of a transport unit
FIG. 9 is a cross-sectional view of a conveyance unit
FIG. 10 is a cross-sectional view of a conveyance unit
FIG. 11 is a diagram illustrating a flow of operations of two transport units.
FIG. 12 is a plan view showing a state of two transport units
FIG. 13 is a plan view showing a state of two conveying units.
FIG. 14 is a plan view showing a state of two transport units
FIG. 15 is a plan view showing a state of two conveying units.
FIG. 16 is a diagram showing the main functions of the production management department
FIG. 17 is a plan view showing a state in which an upstream sensor is attached.
FIG. 18 is a front view showing a state in which an upstream sensor is attached.
FIG. 19 is a plan view showing another form of the mounting device.
FIG. 20 is a diagram showing a flow of operations of the mounting device and the upstream auxiliary conveyance unit;
FIG. 21 is a diagram for explaining the operation of the mounting device and the auxiliary transport unit;
FIG. 22 is a diagram for explaining the operation of the mounting device and the auxiliary transport unit;
FIG. 23 is a diagram for explaining the operation of the mounting device and the auxiliary transport unit;
FIG. 24 is a diagram for explaining the operation of the mounting device and the auxiliary transport unit;
FIG. 25 is a plan view showing another supply device.
FIG. 26 is a plan view showing another storage device.
FIG. 27 is a plan view showing another supply device.
FIG. 28 is a plan view showing another storage device.
29 is a plan view showing the transfer table in FIG. 28. FIG.
FIG. 30 is a plan view showing another supply device.
FIG. 31 is a front view showing another supply device.
FIG. 32 is a plan view showing another supply device.
FIG. 33 is a front view showing another supply device.
FIG. 34 is a plan view of a storage rack capable of storing a plurality of types of substrates.
FIG. 35 is a sectional view of a storage rack.
FIG. 36 is a sectional view of a storage rack.
FIG. 37 is a front view of the support member.
FIG. 38 is a cross-sectional view of a support member
FIG. 39 is a perspective view of another supporting member.
FIG. 40 is a diagram showing how the substrate is supported by another supporting member.
[Explanation of symbols]
2 Transport mechanism
9 Board
9a First substrate
9b Second substrate
12 Application equipment
13 Mounting device
15 Inspection equipment
20, 20a Transport control unit
21 Transport section
21a First transport unit
21b Second transport unit
21c 3rd conveyance part
121, 131, 151 Head
221 Guide part
231 motor
232 Ball screw
Steps S11 to S16, S21 to S29

Claims (4)

A circuit board processing method for processing a circuit board while conveying an object that is a circuit board or a holding member that holds the circuit board,
a) a step in which the first transport unit changes the width of the transport path according to the size of the first object;
b) the first transport unit receiving the first object;
c) performing a work on the first object on the first transport unit;
d) a step in which the second transport unit downstream of the first transport unit pays out the second object;
e) the second transport unit changing the width of the transport path according to the size of the first object;
f) a step of transporting the first object from the first transport unit to the second transport unit;
Have
A circuit board processing method, wherein the steps a) to c) and the steps d) and e) are performed in parallel. It is a circuit board processing method of Claim 1, Comprising: Before the process of said d),
g) a step of working on the second object on the second transport unit;
Further comprising
A circuit board processing method, wherein the steps a) to c) and the steps g), d) and e) are performed in parallel. A substrate processing method for transporting a substrate or an object that is a holding member that holds the substrate and processing the substrate,
Corresponding to the size of the first object, the width of the conveyance path of the first conveyance unit is changed, the first object is conveyed to the first conveyance unit, and the first object on the first conveyance unit The work is performed on the object, and the width of the conveyance path of the first conveyance unit is changed corresponding to the size of the first object during the process of conveying the first object to the second conveyance unit, At least a part of the operation of transporting the first object to the first transport unit and performing work on the first object on the first transport unit;
To change the width of the conveying path of the second transport section in accordance with the size of the first object, and operating,
The substrate processing method characterized by performing simultaneously. A substrate processing method for transporting a substrate or an object that is a holding member that holds the substrate and processing the substrate,
Corresponding to the size of the first object, the width of the transport path of the first transport unit is changed, the first object is transported to the first transport unit, and the first object is transported to the second transport unit. The width of the conveyance path of the first conveyance unit is changed corresponding to the size of the first object during the process of conveying to the first object, and the first object is conveyed to the first conveyance unit. At least some actions,
To change the width of the conveying path of the second transport section in accordance with the size of the first object, and operating,
The substrate processing method characterized by performing simultaneously.

Images