JP4014918B2 - Vacuum deposition system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a vacuum film forming apparatus.
[0002]
[Prior art]
In a general vacuum film forming apparatus, a substrate supported by a substrate holder, an evaporation source for evaporating a film material to be formed, and the like are provided at predetermined positions inside a vacuum chamber. And the space in a vacuum chamber is made into the vacuum atmosphere which has a predetermined pressure by exhaust means, such as a vacuum pump. In the vacuum chamber in a vacuum atmosphere, the material of the film placed in the evaporation source is evaporated using an electron gun or the like, so that the scattered material is deposited on the substrate to form a film.
[0003]
One parameter that affects the properties of the deposited film is the temperature of the substrate. Therefore, a heater heating part (heater) is provided in the vicinity of the substrate, and when film formation is performed, power is supplied from the outside of the vacuum chamber to the heating wire via the power supply cable, so that the substrate or the periphery of the substrate is disposed. May be heated.
[0004]
The desired film thickness of the film formed on the substrate varies depending on the application. Therefore, it is necessary to measure the film thickness of the film formed on the substrate during the film formation. In recent years, an optical monitor (film thickness sensor) is being used for measuring the film thickness because of its high measurement accuracy.
[0005]
The optical monitor includes an optical monitor light projecting unit and an optical monitor light receiving unit. The light monitor light projecting unit irradiates light to a portion where a film material on the substrate is deposited. The irradiated light passes through or is reflected by the substrate, and the light monitor light receiving unit detects the passed light or reflected light. Thus, the film thickness of the film formed on the substrate can be measured based on the phase difference between the light emitted from the light monitor light projecting unit and the light detected by the light monitor light receiving unit. it can.
[0006]
[Problems to be solved by the invention]
By the way, in recent years, an optical monitor used as a film thickness sensor does not convert an optical signal into an electric signal by an optical monitor light receiving unit, and transmits the received light as it is to the outside. In this case, an optical fiber (signal transmission cable) is used as a cable for transmitting light from the optical monitor to the outside of the vacuum chamber.
[0007]
However, the heat resistance of the optical fiber is relatively poor, and there is a possibility that the optical fiber is deteriorated by the heat radiated from the heater heat generating portion. The optical fiber and the power supply cable are both provided in the vacuum chamber through an opening called a port provided in the vacuum chamber. Therefore, the optical fiber and the power supply cable are arranged close to each other. The power supply cable is covered with a sheath which is a non-heat generating body covered with a protective cover made of a metal material, and the tip thereof is connected to the heater heat generating part via a connecting member. However, since the heat released from the heater heating part is transferred to the metallic cover that covers the power supply cable, heat is also released from the protective cover in addition to the heat directly released from the heater heating part. As a result, the optical fiber is exposed to relatively high heat.
[0008]
Therefore, the present invention provides a vacuum film forming apparatus having a structure capable of protecting an optical fiber connected to an optical monitor from heat emitted from a heater and heat transferred to a metallic material protective cover. The purpose is to provide.
[0009]
[Means for Solving the Problems]
The present invention has been made in view of the above circumstances, and contains a film thickness sensor for detecting the film thickness of a film formed on a substrate and a heater for heating the substrate, A film-forming vacuum chamber for maintaining a vacuum atmosphere in an internal space is provided, and one end of the film-thickness sensor is used to transmit a signal indicating the film thickness detected by the film-thickness sensor to the outside of the vacuum chamber. A signal transmission cable connected to the heater, and a power supply cable having one end connected to the heater to supply power to the heater from outside the vacuum chamber, through the opening provided in the vacuum chamber, the vacuum chamber In the vacuum film forming apparatus provided inside and outside, a cooling pipe for circulating a cooling medium therein, and a cooling member provided in a substantially tubular shape so that the cooling pipe can be inserted through the inside, the electric power Serving Cable is arranged as it is inserted into the inside of the cooling member, the signal transmission cable is disposed outside the cooling member.
[0010]
By adopting such a configuration, the power supply cable is cooled by cooling water or the like flowing through the inside of the cooling pipe, and has a substantially tubular shape so that the power supply cable is inserted through the inside and the cooling water or the like. Since it is also cooled by the cooling member to be cooled, the heat leaked to the outside of the cooling member out of the heat transferred to the metallic protective cover covering the power supply cable is greatly suppressed. Can do. Since the signal transmission cable (optical fiber) is disposed outside the cooling member, the signal transmission cable can be prevented from being deteriorated by heat.
[0011]
In the present invention, a heat shield member is interposed between the cooling member and the signal transmission cable.
[0012]
By adopting such a configuration, even if heat released from the protective cover covering the power supply cable is leaked to the outside of the cooling member, it is blocked by the heat shield member and the signal transmission cable is heated. It will not be done.
[0013]
In the present invention, the heat shield member is a plate-like member made of a metal material, and the surface is mirror-finished.
[0014]
By setting it as such a structure, the heat-shielding property of a heat-shielding member can be improved more, and the heat released to a signal transmission cable can be shielded more effectively.
[0015]
In addition, a vacuum film forming apparatus according to the present invention accommodates a film thickness sensor for detecting the film thickness of a film formed on a substrate and a heater for heating the substrate, and vacuums the internal space. A signal having a film-forming vacuum chamber for maintaining an atmosphere and having one end connected to the film thickness sensor to transmit a signal indicating the film thickness detected by the film thickness sensor to the outside of the vacuum chamber A transmission cable and a power supply cable having one end connected to the heater to supply power to the heater from the outside of the vacuum chamber extend inside and outside the vacuum chamber through an opening provided in the vacuum chamber. In the vacuum film forming apparatus provided, the film thickness sensor is provided in advance so as to be positioned within a predetermined positioning range in the vicinity of the heater, and the heater and the signal transmission cable A first shielding member that surrounds the positioning range and a second shielding member that closes a gap between the first shielding member and the film thickness sensor, and transmits the signal from the heater. It is designed to shield the heat dissipation to the cable.
[0016]
By setting it as such a structure, it can prevent that a signal transmission cable is heated by the heat directly emitted from a heater. Further, the gap formed between the film thickness sensor and the first shielding member is closed by the second shielding member in accordance with the position where the film thickness sensor is installed within a predetermined positioning range, and thus released from the heater. The signal transmission cable can be more effectively protected from heat.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a partial sectional front view showing a configuration of a vacuum film forming apparatus 100 according to an embodiment of the present invention. A vacuum film forming apparatus 100 shown in FIG. 1 is configured to be able to form a film on a substrate 4 arranged in a vacuum chamber 1 by so-called vacuum deposition as a film forming method.
[0018]
The vacuum film forming apparatus 100 includes a vacuum chamber 1 having a space that can be hermetically sealed, and a source material of a film to be formed is evaporated in the space in the vacuum chamber 1 at the inner bottom of the vacuum chamber 1. Two evaporation sources 14 and 14 are provided. Further, an opening P ₂ called a port through which the inside of the vacuum chamber 1 can be viewed is provided at the inner bottom of the vacuum chamber 1, and a film thickness monitor for measuring the film thickness of the formed film is provided. The light monitor light projecting unit 12 constituting a part is provided in a state where the light projecting head 12a faces the inside of the vacuum chamber 1 (upward in FIG. 1). Further, an electron gun (not shown) for heating and evaporating the film material placed on the crucible of the evaporation source 14 is provided at the inner bottom of the vacuum chamber 1.
[0019]
Further, the ceiling portion of the vacuum chamber 1 is provided with a substrate rotating device 3 for holding the optical monitor light receiving unit 11 and the substrate 4 constituting the other part of the film thickness monitor at the lower end thereof. The light receiving head 11a of the light monitor light receiving section 11 is directed to the inside of the vacuum chamber 1 (downward in FIG. 1), and the light projecting head 12a and the light receiving head 11a face each other with their optical axes aligned. It has a configuration. Further, since the substrate rotation device 3 is provided over the inside and outside of the vacuum chamber 1 through the opening P ₁ provided in the ceiling portion of the vacuum chamber 1, the substrate rotation device 3 is held at the lower end of the substrate rotation device 3. The substrate 4 is located inside the vacuum chamber 1.
[0020]
When a film is formed on the substrate 4 using such a vacuum chamber 1, the internal space is exhausted by a vacuum pump (not shown) to obtain a required vacuum atmosphere. Then, a film source placed on the crucible of the evaporation source 14 is irradiated with electrons by an electron gun, and the evaporated source material is deposited on the surface of the substrate 4 (lower surface in FIG. 1) to form a film. The light emitted from the light monitor light projecting unit 12 passes through the substrate 4 and is detected by the light monitor light receiving unit 11, and the optical signal detected by the light monitor light receiving unit 11 is transmitted to the outside. The film thickness of the film deposited on the surface of the substrate 4 can be calculated based on the change in the phase of the transmitted optical signal.
[0021]
Moreover, the vacuum chamber 1 is installed on the installation stand 20, and is placed on a firm floor such as a laboratory. The installation stand 20 includes a stand 23 that forms an upper plate on which the vacuum chamber 1 is placed, and an optical monitor that forms a lower plate for installing the light monitor projector 12 below the mount 23. A gantry 24 is provided.
[0022]
Next, components that characterize the vacuum film forming apparatus 1 according to the present embodiment will be described. 2 and FIG. 3 are drawings for explaining constituent parts characterizing the vacuum film forming apparatus 100. FIG. 2 is an enlarged partial view showing the upper front surface of the vacuum film forming apparatus 100 shown in FIG. FIG. 3 is a partially enlarged side view showing an enlarged upper side surface of the vacuum film forming apparatus 100 shown in FIG.
[0023]
As shown in FIGS. 2 and 3, the substrate rotation device 3 mainly includes a substrate support 30, a sensor support 40 provided inside the substrate support 30, and the substrate support 30 and sensor support. The casing 50 surrounds the body 40.
[0024]
Of these, the substrate support 30 has a rotationally symmetric shape around a virtual axis C passing through the center of the opening P ₁ of the vacuum chamber 1, and has a stepped cylindrical shape having a lower diameter larger than the upper portion. Yes. The lower part of the substrate support 30 has a substrate attachment part 31 at the lower part having a large diameter, and has a claw-like shape protruding inward at the lower end of the substrate attachment part 31 (that is, the lower end of the substrate support 30). The substrate 4 is held by the substrate holder 32.
[0025]
Further, in a peripheral edge portion of the opening portion P _1, a first casing 51 having a substantially cylindrical shape forms part of the casing 50, it is erected by matching the central axis to the imaginary axis C. The substrate support 30 is provided through the inside of the first casing 51, and the substrate support 30 is supported by the first casing 51 with a plurality of magnetic seals 54 and 55 interposed therebetween. Yes. Since the magnetic seals 54 and 55 seal between the substrate support 30 and the first casing 51, the atmospheric pressure inside the vacuum chamber 1 can be maintained.
[0026]
Further, the first casing 51 has a direct drive motor 53 inside, and the drive portion of the direct drive motor 53 should be in sliding contact with the outer surface of the substrate support 30. Therefore, by driving the direct drive motor 53, the substrate support 30 can be driven to rotate about the virtual axis C.
[0027]
Inside the substrate support 30, as in the case of the substrate support 30, the sensor having a stepped cylindrical shape that is rotationally symmetric around the virtual axis C and has a lower diameter larger than the upper portion. A support 40 is provided. The upper end portion of the support body 40 such as a sensor extends outward in the radial direction and has a disk shape having an opening at the center with the imaginary axis C as the center. It is joined to the upper end surface. Moreover, the bottomed cylindrical 2nd casing 52 is covered on the upper end part of the support bodies 40, such as a sensor, with the opening end facing down.
[0028]
On the other hand, in the lower opening of the sensor support 40 (that is, the lower opening of the sensor mounting portion 41), a first copper cooling member (first shield) having a disk shape with a notch in part. Member) 42 is provided so as to close the lower opening. 4 is a view taken in the direction of arrows IV-IV when the vicinity of the lower opening is viewed from above in FIG. 2 in order to show the configuration in the vicinity of the lower opening of the support body 40 such as the sensor, and FIG. It is a VV arrow line view at the time of seeing the said opening part vicinity. As shown in FIGS. 4 and 5, the first cooling member 42 has a substantially disk shape, and has a cutout portion 44 cut out from a part of the circumference to a center part thereof. Further, as will be described later, the first cooling member 42 has a space for circulating cooling water therein, and a cooling water pipe is attached to connect the cooling water pipe so that the cooling water enters and exits the space. Holes 42a and 42b are provided.
[0029]
The light monitor light receiving portion 11 is attached to the cutout portion 44 so that the light receiving head 11a desires the central portion of the vacuum chamber 1 (downward in FIGS. 2 and 3). Therefore, the light monitor light receiving unit 11 faces the light monitor light projecting unit 12 provided at the inner bottom of the vacuum chamber 1. The optical monitor light receiving unit 11 can be arbitrarily positioned and attached in advance within the range formed as the notch 44.
[0030]
In addition, after the optical monitor light receiving unit 11 is positioned, a copper first shielding plate (first plate) having a rectangular plate shape is formed in a gap formed between the first cooling member 42 and the optical monitor light receiving unit 11. 2 shielding member) 43 is attached. Thus, by providing the first cooling member 42 and the first shielding plate 43, the lower end portion of the sensor mounting portion 41 is divided into an upper side and a lower side.
[0031]
A heater wire H for heating the substrate 4 is disposed below the first shielding plate 43. The heater wire H can heat the ambient temperature of the substrate 4 to several hundred degrees (for example, 700 degrees) when electric power is supplied from the outside of the vacuum film forming apparatus 1.
[0032]
By the way, as shown in FIG.2 and FIG.3, inside the support body 40, such as a sensor above the said 1st cooling member 42, the 2nd copper cooling member 61 which makes a long bowl shape, a long plate shape A third cooling member 62 made of copper and a second shielding plate 63 made of stainless steel (suspension) having a long plate shape like the third cooling member 62 are erected.
[0033]
FIG. 6 is a VI-VI arrow view when the lower side is viewed from the upper end side of the sensor support 40 in FIG. 2 in order to show the internal configuration of the sensor support 40. As shown in FIG. 6, the second cooling member 61 has a channel shape in a cross section that intersects the longitudinal direction thereof, and the third cooling member 62 is provided so as to close an opening in the cross section. The second shielding plate 63 is provided in parallel with the third cooling member 62 on the opposite side of the third cooling member 62 from the second cooling member 61. Therefore, the inside of the support body 40 such as the sensor is in relation to the space S ₁ formed therein by the second cooling member 61 and the third cooling member 62 (hereinafter referred to as the first space) and the second shielding plate 63. And a space (hereinafter referred to as a second space) S ₂ formed on the opposite side of the third cooling member 62. The second shielding plate 63 is mirror-finished at least on the surface with respect to the third cooling member 62.
[0034]
In addition, a cooling water pipe is disposed inside the support body 40 such as a sensor in order to suppress an increase in the temperature around the sensor. Next, the piping form of the cooling water pipe disposed inside the substrate rotating device 3 will be described with reference to FIG. The first cooling water pipe L ₁ provided through the second casing 52 from the outside of the substrate rotating device 3 extends downward inside the support body 40 such as the sensor through the second space S ₂ , and the first cooling member. 42 is connected to a cooling water pipe mounting hole 42a that communicates with the space inside.
[0035]
The cooling water pipe mounting hole 42a in the separate cooling water pipe mounting hole 42b is connected to the second cooling water pipe L ₂ is the second cooling water pipe L ₂ is the first cooling member 42 has, extending to the vicinity of the imaginary axis C It is installed. Further, the third cooling water pipe L ₃ continuing from the second cooling water pipe L ₂ extends upward inside the support body 40 such as a sensor through the first space S ₁ . The third cooling water pipe L ₃ reaching the upper end of the sensor support 40 is folded back at the upper end and continues to the fourth cooling water pipe L ₄ . The fourth cooling water pipe L ₄ extends downward from the upper end of the sensor support 40 through the first space S ₁ , reaches the vicinity of the lower end of the sensor support 40, and continues to the fifth cooling water pipe L ₅ .
[0036]
The fifth cooling water pipe L ₅ extends to the optical monitor light receiving unit 11 at the lower end of the sensor support 40 and continues to the sixth cooling water pipe L ₆ piped inside the optical monitor light receiving unit 11. The sixth cooling water pipe L ₆ is disposed so as to surround the periphery of the light receiving head 11 a and further continues to the seventh cooling water pipe L ₇ . It said 7 coolant pipe L ₇ Through the second space S ₂ of the internal sensor such support 40, which extends upwardly of the sensor such support 40 extends through the second casing 52 to the outside.
[0037]
Incidentally, one end of an optical fiber L _S is connected to the optical monitor light receiving unit 11 in order to transmit the optical signal detected by the optical monitor light receiving unit 11 to the outside of the vacuum film forming apparatus 100. The optical fiber L _S is disposed along the first cooling water pipe L ₁ and the seventh cooling water pipe L ₇ in the second space S ₂ and penetrates the second casing 52 to the outside.
[0038]
Further, in order to supply power to the heater wire H, the transmission cable L _P1 having one end connected to the heater wire H is connected to the third cooling water pipe L ₃ and the fourth cooling water pipe L ₄ in the first space S ₁ . It is arrange | positioned along and has penetrated the 2nd casing 52 to the exterior. Further, a thermocouple L _D for measuring the ambient temperature of the substrate 4 is disposed through the first space S ₁ , and a hot junction is provided in the vicinity of the substrate 4. The transmission cable L _P1 is connected to the second casing 52 by a connecting member L _P2 that is attached through the second casing 52. The one end side of the connection member L _P2 in the transmission cable L _P1 is covered with a sheath L _P3 covered with a protective cover made of a metal material. The power transmission cable L _P1 and the heater wire H are connected via a heater wire connecting member L _P4 .
[0039]
In the case of the vacuum film forming apparatus 100 configured as described above, the first cooling member 42 and the first shielding plate 43 are provided between the heater wire H and the optical fiber L _S. Therefore, even when the periphery of the substrate 4 is heated to several hundred degrees by the heater wire H, the heat transmitted to the optical fiber L _S can be reduced.
[0040]
Further, by attaching the first shielding plate 43 according to the position of the light monitor light receiving unit 11 determined within the range formed by the notch 44, regardless of the set position of the light monitor light receiving unit 11. The same effects as described above can be obtained.
[0041]
Further, by circulating the cooling water in the internal space of the first cooling member 42, the above-described effects can be made even more effective.
[0042]
In the case of the vacuum film forming apparatus 100 described above, the transmission cable L _P1 is connected to the third cooling water pipe L ₃ and the third cooling water pipe L ₃ in the first space S ₁ formed by the second cooling member 61 and the third cooling member 62. 4 The cooling water pipe L _{4 is} disposed together with the optical cable L _S in the second space S ₂ sandwiching the third cooling member 62 and the second shielding plate 63 between the transmission cable L _P1 and the first cooling water pipe L. _{The first} and seventh cooling water pipes L ₇ are disposed.
[0043]
Therefore, as the temperature of the heater wire H rises, even if the heat around the heater wire H is transmitted to the protective cover made of metal material on the surface of the sheath L _P3 covering the transmission cable L _P1 , the optical cable L _S Is hardly heated, and deterioration of the optical cable L _S due to temperature rise can be prevented.
[0044]
Moreover, since there is at least a third surface of the cooling member 62 side in the second shielding plate 63 as a mirror finish, even when the heat leaks from the first space S _1, it is possible to effectively reflecting the heat The optical fiber L _S can be prevented from being heated by the leaked heat.
[0045]
In the above description, an apparatus for forming a film by vacuum deposition is described as an example of the vacuum film forming apparatus 100, but a vacuum film forming apparatus in which another method such as ion plating is adopted as a film forming method. However, the same effect can be obtained by carrying out the present invention.
[0046]
Moreover, although the thing made from copper is demonstrated as the 1st cooling member 42, the 1st shielding board 43, the 2nd cooling member 61, and the 3rd cooling member 62, it is not restricted to this, Other heat conductivity is comparatively high. You may comprise these using materials. The second shielding plate 63 is made of stainless steel, but is not limited to this. The second shielding plate 63 is made of another material having a relatively low thermal conductivity and suitable for shielding heat. May be.
[0047]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the vacuum film-forming apparatus which has a structure which can protect the optical fiber connected to an optical monitor from the heat which a heater and an electric power supply cable emit can be provided.
[Brief description of the drawings]
FIG. 1 is a partial sectional front view showing a configuration of a vacuum film forming apparatus according to an embodiment of the present invention.
FIG. 2 is a partially enlarged front view showing the upper front of the vacuum film forming apparatus shown in FIG. 1 in an enlarged manner.
FIG. 3 is a partially enlarged side view showing an enlarged upper side surface of the vacuum film forming apparatus shown in FIG. 1;
4 is a view taken in the direction of arrows IV-IV when the vicinity of the lower opening is viewed from above in FIG. 2 in order to show the configuration in the vicinity of the lower opening of the support body such as a sensor.
FIG. 5 is a VV arrow view when the vicinity of the opening is viewed from below in FIG. 2 in order to show the configuration near the lower opening of the support body such as a sensor.
6 is a VI-VI arrow view when the lower side is viewed from the upper end side of the sensor support in FIG. 2 in order to show the internal configuration of the sensor support.
FIG. 7 is a schematic explanatory diagram for explaining a piping configuration of a cooling water pipe disposed inside the substrate rotating device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Vacuum chamber 3 Substrate rotation apparatus 4 Substrate 11 Optical monitor light-receiving part 11a Light-receiving head 12 Optical monitor light-projecting part 12a Light-projecting head 14 Evaporation source 20 Installation base 23 Base 24 Optical monitor base 30 Substrate support 31 Substrate attachment part 32 Substrate holder 40 Sensor support body 41 Sensor mounting section 42 First cooling member (first shielding member)
42a, 42b Cooling water pipe mounting hole 43 First shielding plate (second shielding member)
44 Notch 50 Casing 51 First casing 52 Second casing 53 Direct drive motors 54, 55 Magnetic seal 61 Second cooling member 62 Third cooling member 63 Second shielding plate 100 Vacuum film-forming apparatus H Heater wire L ₁ 1st Cooling water pipe L ₂ 2nd cooling water pipe L ₃ 3rd cooling water pipe L ₄ 4th cooling water pipe L ₅ 5th cooling water pipe L ₆ 6th cooling water pipe L ₇ 7th cooling water pipe L _D thermocouple L _P1 transmission cable L _P2 connecting member L _P3 sheath L _P4 heater wire connecting member L _S optical fibers P ₁ , P 2 opening S ₁ first space S ₂ second space

Claims (4)

A film forming vacuum chamber for storing a film thickness sensor for detecting the film thickness of a film formed on the substrate and a heater for heating the substrate, and maintaining a vacuum atmosphere in the internal space A signal transmission cable having one end connected to the film thickness sensor to transmit a signal indicating the film thickness detected by the film thickness sensor to the outside of the vacuum chamber, and the heater from the outside of the vacuum chamber In a vacuum film forming apparatus, a power supply cable having one end connected to the heater to supply power to the inside and outside of the vacuum chamber through an opening provided in the vacuum chamber,
A cooling pipe for circulating a cooling medium therein; and a cooling member provided in a substantially tubular shape so that the cooling pipe can be inserted through the inside thereof, and the power supply cable is arranged through the inside of the cooling member. The vacuum film forming apparatus is characterized in that the signal transmission cable is disposed outside the cooling member.   The vacuum film-forming apparatus according to claim 1, wherein a heat shield member is interposed between the cooling member and the signal transmission cable.   The vacuum film forming apparatus according to claim 2, wherein the heat shielding member is a plate-like member made of a metal material, and the surface is mirror-finished. A film forming vacuum chamber for storing a film thickness sensor for detecting the film thickness of a film formed on the substrate and a heater for heating the substrate, and maintaining a vacuum atmosphere in the internal space A signal transmission cable having one end connected to the film thickness sensor to transmit a signal indicating the film thickness detected by the film thickness sensor to the outside of the vacuum chamber, and the heater from the outside of the vacuum chamber In a vacuum film forming apparatus, a power supply cable having one end connected to the heater to supply power to the inside and outside of the vacuum chamber through an opening provided in the vacuum chamber,
A first shielding member having a notch part is provided to shield between the heater and the signal transmission cable, and the attachment position of the notch part can be changed in the notch part. A vacuum film forming apparatus, wherein the film thickness sensor is attached, and a second shielding member is provided in a gap portion that is not blocked by the film thickness sensor in the cutout portion .

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