JP4016982B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method in which an electronic component cut out from a wafer and attached to an adhesive sheet is taken out and mounted on a substrate.

  In the manufacturing process of a semiconductor device, a semiconductor chip is cut out from a wafer composed of a large number of chips. The chip is cut out with the wafer attached to the adhesive sheet, and the cut out individual chips are peeled off from the adhesive sheet and picked up. In a state where these chips are adhered to the adhesive sheet, the chips are in a face-up state with the active surface facing upward.

  By the way, semiconductor chip mounting forms include flip chip bonding forms that are mounted on a substrate in a face-down state with the active surface facing down, such as flip chips with bumps formed on the active surface, and lead frames and the like. There is a die bonding configuration in which a semiconductor chip is mounted face-up on a substrate.

  However, in the conventional electronic component mounting apparatus, as described above, it is not possible to directly take out and mount a semiconductor chip of a type with different front and back directions from the wafer by the same apparatus, and die bonding and flip chip bonding. Each implementation required a separate dedicated device.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that can cope with two mounting forms of die bonding and flip chip bonding with the same apparatus.

  The electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus that takes out an electronic component supplied in a face-up state and mounts the electronic component on a mounting target part, and mounts the taken-out electronic component in a face-up state. An up-mounting function, and a face-down mounting function for mounting the electronic component in a face-down state in which the electronic component is reversed, and a pick-up head that picks up the electronic component supplied in the face-up state and reverses the front and back; In the case of mounting by the face-up mounting function, the electronic component supplied in the face-up state is picked up and the electronic component is mounted on the mounting target part, and in the case of mounting by the face-down mounting function, the pickup head is turned upside down. A mounting head for picking up the mounted electronic component and mounting it on the mounting target site, Serial mounting head has a first nozzle for holding an electronic component in the case of implementation by the face-up mounting feature and a second nozzle for holding an electronic component in the case of implementation by the face-down mounting feature.

  The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1, further comprising a component supply unit that supplies the electronic component in a state where the electronic component is positioned at a pickup position in a face-up state, The mounting head picks up the electronic component positioned at this pickup position.

The electronic component mounting apparatus according to claim 3 is the electronic component mounting apparatus according to claim 2, wherein the first camera that acquires an image of the electronic component on the component supply unit and the first camera capture the image. A first recognizing unit for recognizing the position of the electronic component of the component supplying unit based on the obtained image, a second camera for imaging the electronic component that is reversed and held on the mounting head, and the second camera A second recognition unit for recognizing the position of the electronic component held by the mounting head based on the image captured in step (b), and the component supply unit based on the recognition result of the first recognition unit to control the second And a control unit that corrects the amount of movement of the mounting head based on the recognition result of the recognition unit.

  The electronic component mounting apparatus according to claim 4 is an electronic component mounting apparatus that takes out an electronic component supplied in a face-up state and mounts the electronic component on a mounting target part, and mounts the taken-out electronic component in a face-up state. An up-mounting function, and a face-down mounting function for mounting the electronic component in a face-down state in which the electronic component is reversed, and a pick-up head that picks up the electronic component supplied in the face-up state and reverses the front and back; In the case of mounting by the face-up mounting function, the electronic component supplied in the face-up state is picked up and the electronic component is mounted on the mounting target part, and in the case of mounting by the face-down mounting function, the pickup head is turned upside down. A mounting head for picking up the mounted electronic component and mounting it on the mounting target site, The mounting head includes a nozzle replacement mechanism that can attach and detach a plurality of types of replacement nozzles, and in the case of mounting by the face-up mounting function, the first replacement nozzle that holds an electronic component is mounted and mounting by the face-down mounting function In this case, the second replacement nozzle for holding the electronic component is mounted.

  6. The electronic component mounting method according to claim 5, wherein the electronic component mounted in a face-up state is mounted in a face-up state or a face-down state in which the electronic component is turned upside down. When mounting in a state, an electronic component supplied in a face-up state using the first nozzle of the plurality of nozzles provided in the mounting head is picked up by the mounting head and mounted on the mounting target site. When mounting in the face-down state, the electronic component picked up by the take-out head and turned upside down is mounted on the mounting target site using the second nozzle among the plurality of nozzles provided in the mounting head.

  7. The electronic component mounting method according to claim 6, wherein the electronic component mounted in a face-up state is mounted in a face-up state or a face-down state in which the electronic component is turned upside down. When mounting in the state, the electronic components supplied in the face-up state are picked up by the mounting head and mounted on the mounting target part. In the case of mounting in the face-down state, the pick-up head picks up and the front and back are reversed. The electronic component is picked up by a mounting head and mounted on a mounting target part. The mounting head includes a nozzle replacement mechanism that can attach and detach a plurality of types of replacement nozzles, and holds the electronic component in the case of face-up mounting. A second replacement that holds the electronic components when the nozzle is mounted and face-down mounting Mounting the nozzle.

  According to the present invention, the pick-up head that picks up the electronic component supplied in the face-up state and reverses the front and back, and in the case of face-up mounting, picks up the electronic component supplied in the face-up state and places it on the mounting target site. In the case of face-down mounting, an electronic component is mounted and a mounting head that picks up the electronic component that has been turned upside down by the take-out head and mounts it on the mounting target portion, thereby providing a face-up mounting function and a face in the same device. A down-mounting function can also be provided, and two mounting forms of die bonding and flip chip bonding can be handled.

(Embodiment 1)
FIG. 1 is a perspective view of an electronic component mounting apparatus according to Embodiment 1 of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus according to Embodiment 1 of the present invention, and FIGS. 3, 4, 5, and 6 are It is process explanatory drawing of the electronic component mounting method in Embodiment 1 of this invention. The first embodiment is a reference embodiment for explaining a second embodiment and a third embodiment which will be described later.

  First, an electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, an electronic component mounting apparatus 1 includes a board transfer mechanism 2 disposed in the X direction. The substrate transport mechanism 2 transports the substrate 3 and positions the substrate 3 at a predetermined mounting position. A mounting head 4 having a mounting nozzle 4 a is movably disposed above the substrate transport mechanism 2 by a head moving mechanism 22.

  The mounting head 4 holds an electronic component supplied by a component supply unit 10 to be described later, that is, a flip chip 13 or a die 14 having a bump formed on an active surface, by a mounting nozzle 4a and mounted on a component mounting portion on the substrate 3. To do. Here, in the mounting of the electronic component by the mounting head 4, there are a form in which the electronic component is picked up directly from the component supply unit 10 and a form in which the electronic component delivered via the take-out head 9 described below is mounted. It is selected according to the type of electronic component.

  A movable block 6 (movable member) is disposed on the side of the substrate transport mechanism 2 by a cylinder 7 so as to advance and retract in the direction of arrow a. On the side surface of the movable block 6, a takeout head 9 having a takeout nozzle 9a is provided. The take-out head 9 picks up and takes out the flip chip 13 from the component supply unit 10. The take-out head 9 is rotatable about a horizontal axis (Y-axis direction), and when the take-out head 9 rotates 180 degrees, the flip chip 13 held by the take-out nozzle 9a moves up and down around the horizontal axis. Move around. As a result, the flip chip 13 is turned upside down and moved to the delivery position to the mounting head 4.

  Next, the configuration of the component supply unit 10 will be described. The component supply unit 10 includes two component holding tables, a first holding table 11A and a second holding table 11B. Both the first holding table 11A and the second holding table 11B are axes of a θ table 15. It is coupled to the portion 15a. The θ table 15 is mounted on the XY table 16, and when the XY table 16 and the θ table 15 are driven by the component supply mechanism driving unit 25, the first holding table 11A and the second holding table 11B are shaft portions. While turning around 15a, it moves horizontally in the XY directions. The component supply mechanism drive unit 25 is controlled by the control unit 23.

  A first camera 5 is disposed above the pickup position by the take-out head 9 and the mounting head 4. The first camera 5 images the flip chip 13 and the die 14 that are supplied to the take-out head 9 and the mounting head 4 by the component supply unit 10. The captured image is subjected to recognition processing by the first recognition unit 21, whereby the positions of the flip chip 13 and the die 14 in the component supply unit 10 are recognized.

  The movable block 6 incorporates a second camera 8, and the second camera 8 images the flip chip 13 held by the mounting head 4 from below. The image captured by the second camera 8 is subjected to recognition processing by the second recognition unit 24, whereby the position of the flip chip 13 in the state held by the mounting head 4 is recognized.

The recognition results by the first recognition unit 21 and the second recognition unit 24 are sent to the control unit 23. Based on the recognition result by the first recognition unit 21, the control unit 23 controls the component supply mechanism drive unit 25, so that the mounting head 4 picks up the die 14 and the pick-up head 9 picks up the flip chip 13. The die 14 and the flip chip 13 are correctly aligned with the pickup positions by the mounting nozzle 4a and the take-out nozzle 9a, respectively. Further, the control unit 23 controls the head moving mechanism 22 based on the recognition result by the second recognition unit 24 to correct the movement amount of the mounting head 4, so that the mounting head 4 mounts the flip chip 13 on the substrate 3 correctly. Mount on the target part.

  On the first holding table 11A, the flip chip 13 in which bumps are formed on the active surface (circuit forming surface) is held in a state of being attached to the adhesive sheet 12 (see FIG. 3) with the active surface facing upward. ing. The first holding table 11A takes out the flip chip 13 in a face-up state and supplies it to the head 9. Further, the second holding table 11B holds the die 14 in a state where the die 14 is attached to the adhesive sheet 12 (see FIG. 5) with the active surface facing upward. The second holding table 11B supplies the die 14 to the mounting head 4 in a face-up state.

  When the flip chip 13 is mounted on the substrate 3, as shown in FIG. 2A, the shaft portion 15 a of the θ table 15 is rotated in the component supply unit 10, and the first holding table 11 A is taken out. To the pickup position A. Then, the first holding table 11A is moved in the XY direction by the XY table 16, and the flip chip 13 to be mounted among the many flip chips 13 held is aligned with the pickup position A. Thereafter, the flip chip 13 is taken out by the take-out nozzle 9 a of the take-out head 9 and turned upside down, and then the flip chip in a face-down state is delivered to the mount head 4.

  On the other hand, when the die 14 is mounted on the substrate 3, as shown in FIG. 2B, the second holding table 11B is similarly turned and moved to the pickup position A by the mounting head 4. Similarly, among the many dies 14 held on the second holding table 11B, the die 14 to be mounted is aligned with the pickup position A. Thereafter, the die 14 is directly picked up by the mounting nozzle 4a of the mounting head 4 and mounted on the substrate 3 in a face-up state.

  That is, the electronic component mounting apparatus 1 has a face-up mounting function for mounting the taken-out electronic component in a face-up state and a face-down mounting function for mounting the electronic component in a face-down state in which the electronic component is turned upside down. ing. In either case of mounting by the face-up mounting function or mounting by the face-down mounting function, the flip chip 13 and the die 14 positioned at the common pickup position A of the take-out head 9, the mounting head 4, and the component supply unit 10 are used. Pick up each.

  In the case of mounting by the face-up mounting function shown in FIG. 2B, the cylinder 7 is driven to retract the single movable block 6 integrally provided with the second camera in the direction of the arrow, The pickup head 9 is retracted to a position where the mounting head 4 does not hinder the operation of picking up the die 14 positioned at the pickup position A. The cylinder 7 is a retraction mechanism that retreats the movable block 6.

  This electronic component mounting apparatus is configured as described above. Hereinafter, an electronic component mounting method will be described with reference to FIGS. First, in FIG. 3A, the substrate 3 is positioned on the substrate transport mechanism 2, and the mounting head 4 including the mounting nozzle 4 a is positioned above the substrate transport mechanism 2. The first holding table 11A is positioned at the pickup position A of the component supply unit 10, and the flip chip 13 attached to the adhesive sheet 12 is held in a face-up state with the bump forming surface facing upward. . Of these flip chips 13, the flip chip 13 to be taken out in this pickup operation is aligned with the pickup position A.

When the take-out nozzle 9a of the take-out head 9 above the flip chip 13 moves up and down, the flip chip 13 is peeled off from the adhesive sheet 12 by the take-out nozzle 9a and picked up. At this time, the sheet peeling mechanism 17 is in contact with the lower surface of the adhesive sheet 12 to adsorb the adhesive sheet 12.

  Thereafter, as shown in FIG. 3B, when the take-out head 9 rotates up and down by 180 degrees and the take-out nozzle 9a faces upward, the flip chip 13 held by the take-out nozzle 9a is turned upside down, and the active surface is changed. Face down with face down. Then, the flip chip 13 is transferred to the mounting nozzle 4a of the mounting head 4 in a face-down state.

  Next, as shown in FIG. 4A, the mounting head 4 holding the flip chip 13 moves onto the second camera 8 of the movable block 6, where the flip chip 13 is moved from below by the second camera 8. Imaged. As a result, the active surface of the flip chip 13 is imaged, and this image is subjected to recognition processing by the second recognition unit 24 (FIG. 1), whereby the position of the flip chip 13 is recognized.

  Thereafter, as shown in FIG. 4B, the mounting head 4 moves onto the substrate 3, and the flip chip 13 held by the mounting nozzle 4a is mounted on the mounting target portion of the substrate 3 in a face-down state. At this time, the movement amount of the mounting head 4 is corrected by controlling the head moving mechanism 22 by the control unit 23 based on the position recognition result of the flip chip 13 recognized by the second recognition unit 24 in FIG. Is done. In parallel with this operation, the take-out head 9 performs an operation of taking out a new flip chip 13 from the first holding table 11A.

  Subsequent to the mounting of the flip chip 13, stack die mounting is performed in which the die 14 is mounted on the flip chip 13 in an overlapping manner. As shown in FIG. 5A, the flip chip 13 is already mounted on the substrate 3 on the substrate transport mechanism 2 in a face-down state with the active surface facing downward in the previous process. Prior to the removal of the die 14 from the second holding table 11B, the movable block 6 is moved backward by the cylinder 7 so that the mounting head 4 does not hinder the operation of picking up the die 14 positioned at the pickup position. The take-out head 9 is retracted.

  At the pickup position A, the die 14 attached to the adhesive sheet 12 of the second holding table 11B is located, and the die 14 is imaged by the upper first camera 5. The position of the die 14 is recognized by the first recognition unit 21 based on this image, and the die 14 is moved to the pickup position A by controlling the component supply mechanism driving unit 25 by the control unit 23 based on the recognition result. Correct alignment.

  Next, the mounting head 4 moves to the component supply unit 10, and the mounting head 4 moves up and down as shown in FIG. 5B, whereby the die 14 is peeled off from the adhesive sheet 12 by the mounting nozzle 4 a and picked up. At this time, the sheet peeling mechanism 17 is in contact with the lower surface of the adhesive sheet 12 to adsorb the adhesive sheet 12.

  Thereafter, as shown in FIG. 6, the mounting head 4 holding the die 14 moves onto the substrate 3 of the substrate transport mechanism 2. Then, the die 14 is mounted in a face-up state, overlaid on the flip chip 13 already mounted in the face-down state. As a result, stack die mounting is performed in which the die 14 with the active surface facing upward is mounted on the upper surface of the flip chip 13 mounted on the substrate 3 via the bumps formed on the active surface. After this mounting process, the die 14 is connected to the substrate 3 by wire bonding.

(Embodiment 2)
FIG. 7 is a partial sectional view of the electronic component mounting apparatus according to the second embodiment of the present invention, and FIG. 8 is a process explanatory diagram of the electronic component mounting method according to the second embodiment of the present invention. The second embodiment corresponds to claims 1, 2, 3 and 5 of the present application. In the second embodiment, as shown in FIG. 7, in the case of mounting by the face-up mounting function, the first mounting head 4B to which the first nozzle 4b holding the die 14 is mounted and the face-down mounting function In the case of mounting by the electronic component mounting apparatus, an electronic component mounting apparatus including a multiple head 18 that holds together the second mounting head 4A to which the second nozzle 4a that holds the flip chip 13 is mounted is used. Also in this case, when the flip chip 13 and the die 14 are picked up from the component supply unit 10, the position is recognized by the first camera 5 disposed above.

  Next, an electronic component mounting method will be described. When the flip chip 13 is mounted on the substrate 3 in a face-down state, as shown in FIG. 8A, the flip chip 13 is face-up from the first holding table 11A by the take-out nozzle 9a of the take-out head 9. Take out. Then, the flip chip 13 which is taken out and turned upside down is mounted on the mounting target portion of the substrate 3 positioned on the substrate transport mechanism 2 by using the second mounting head 4A on which the second nozzle 4a is mounted.

  Further, when the die 14 is mounted on the flip chip 13 already mounted on the substrate 3 in a face-up state, the component supply unit is used by using the first mounting head 4B to which the first nozzle 4b is mounted. The die 14 is picked up from the ten second holding tables 11B and mounted on the flip chip 13 in the same manner as in the first embodiment.

(Embodiment 3)
9 and 10 are process explanatory diagrams of the electronic component mounting method according to Embodiment 3 of the present invention. The third embodiment corresponds to claims 4 and 6 of the present application. In the third embodiment, a mounting head 4 having a nozzle replacement mechanism that can attach and detach a plurality of types of replacement nozzles is used. In other words, interchangeable nozzles that are compatible with the mounting of the lower end portion of the mounting head 4 to the nozzle mounting portion and that are manufactured in a shape and size according to the type of the target electronic component are used.

  As shown in FIG. 9A, a nozzle holding unit 19 is provided on the side surface of the substrate transport mechanism 2, and the nozzle holding unit 19 has two types of second exchanges corresponding to the flip chip 13 and the die 14. The nozzle 20B and the first replacement nozzle 20A are held. When the mounting head 4 accesses the nozzle holding unit 19 to perform the nozzle replacement operation, either the second replacement nozzle 20B or the first replacement nozzle 20A is replaced with the nozzle mounting portion at the lower end of the mounting head 4. Can be installed.

  When the flip chip 13 is mounted in a face-down state, as shown in FIG. 9A, the flip chip 13 is taken out from the first holding table 11A by the take-out head 9, and as shown in FIG. 9B. The flip chip 13 is turned upside down and the mounting head 4 is moved to the nozzle holding portion 19 to mount the second replacement nozzle 20B on the lower end portion.

  Then, the flip chip 13 held face-up on the take-out head 9 is sucked and held by the second replacement nozzle 20B of the mounting head 4, and the second chip is moved on the movable block 6 as shown in FIG. After the flip chip 13 is imaged and recognized by the camera 8, the mounting head 4 is moved onto the substrate 3 of the substrate transport mechanism 2 and mounted on the mounting target site.

  Thereafter, as shown in FIG. 10B, the second replacement nozzle 20B of the mounting head 4 is replaced with the first replacement nozzle 20A, and the die 14 is moved from the second holding table 11B to the first replacement nozzle 20A. Hold by adsorption. Then, the mounting head 4 is moved onto the substrate 3, and the die 14 is mounted on the flip chip 13 that has already been mounted.

  According to the present invention, the pick-up head that picks up the electronic component supplied in the face-up state and reverses the front and back, and in the case of face-up mounting, picks up the electronic component supplied in the face-up state and places it on the mounting target site. In the case of face-down mounting, an electronic component is mounted, and a mounting head that picks up the electronic component that has been turned upside down by the take-out head and mounts it on the mounting target part. A down-mounting function can also be provided, and two mounting forms of die bonding and flip chip bonding can be handled.

The perspective view of the electronic component mounting apparatus in Embodiment 1 of this invention 1 is a plan view of an electronic component mounting apparatus according to Embodiment 1 of the present invention. Process explanatory drawing of the electronic component mounting method in Embodiment 1 of this invention Process explanatory drawing of the electronic component mounting method in Embodiment 1 of this invention Process explanatory drawing of the electronic component mounting method in Embodiment 1 of this invention Process explanatory drawing of the electronic component mounting method in Embodiment 1 of this invention Sectional drawing of the electronic component mounting apparatus in Embodiment 2 of this invention Process explanatory drawing of the electronic component mounting method in Embodiment 2 of this invention Process explanatory drawing of the electronic component mounting method in Embodiment 3 of this invention Process explanatory drawing of the electronic component mounting method in Embodiment 3 of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Board | substrate 4 Mounting head 4A 1st mounting head 4B 2nd mounting head 5 1st camera 6 Movable block 7 Cylinder 8 2nd camera 9 Takeout head 9a Takeout nozzle 10 Component supply part 11A 1st holding table 11B 1st 2 holding table 13 flip chip 14 die 19 nozzle replacement unit 20A first replacement nozzle 20B second replacement nozzle 21 first recognition unit 23 control unit 24 second recognition unit

Claims (6)

  An electronic component mounting apparatus that takes out an electronic component supplied in a face-up state and mounts the electronic component on a mounting target part, and mounts the taken-out electronic component in a face-up state, and the electronic component is turned upside down. In the case of mounting by the face-up mounting function for picking up the electronic parts supplied in the face-up state and picking up the electronic parts supplied in the face-up state and reversing the front and back, Pick up the electronic parts supplied in face-up state and mount the electronic parts on the mounting target part, and in case of mounting by the face-down mounting function, pick up the electronic parts reversed by the take-out head and mount the target part And the mounting head is mounted on the face up. A first nozzle which holds the electronic components in the case of mounting by mounting function, the electronic component mounting apparatus characterized by a second nozzle for holding an electronic component in the case of implementation by the face-down mounting feature.   2. The electronic apparatus according to claim 1, further comprising: a component supply unit configured to supply the electronic component in a state where the electronic component is positioned in a face-up state, wherein the pick-up head and the mounting head pick up the electronic component positioned in the pickup position. Electronic component mounting equipment.   A first camera that acquires an image of an electronic component on the component supply unit; a first recognition unit that recognizes a position of the electronic component of the component supply unit based on an image captured by the first camera; A second camera that captures an image of an electronic component that is reversed and held by the mounting head, and a second recognition that recognizes the position of the electronic component held by the mounting head based on an image captured by the second camera And a control unit that controls the component supply unit based on the recognition result of the first recognition unit and corrects the movement amount of the mounting head based on the recognition result of the second recognition unit. The electronic component mounting apparatus according to claim 2.   An electronic component mounting apparatus that takes out an electronic component supplied in a face-up state and mounts the electronic component on a mounting target part, and mounts the taken-out electronic component in a face-up state, and the electronic component is turned upside down. In the case of mounting by the face-up mounting function for picking up the electronic parts supplied in the face-up state and picking up the electronic parts supplied in the face-up state and reversing the front and back, Pick up the electronic parts supplied in face-up state and mount the electronic parts on the mounting target part, and in case of mounting by the face-down mounting function, pick up the electronic parts reversed by the take-out head and mount the target part A mounting head mounted on the mounting head, the mounting head having a plurality of types of replacement nozzles. A nozzle replacement mechanism that can be attached and detached is mounted, a first replacement nozzle that holds an electronic component is mounted in the case of mounting by the face-up mounting function, and an electronic component is held in the case of mounting by the face-down mounting function An electronic component mounting apparatus comprising a second replacement nozzle.   An electronic component mounting method for mounting an electronic component supplied in a face-up state in a face-up state or a face-down state in which the electronic component is reversed, and when mounting in the face-up state, the mounting head In the case where the electronic component supplied in the face-up state is picked up by the mounting head using the first nozzle of the plurality of nozzles provided in and mounted on the mounting target part, and mounted in the face-down state, An electronic component mounting method comprising mounting an electronic component picked up by a pick-up head and turned upside down on a mounting target site using a second nozzle among a plurality of nozzles provided in the mounting head. An electronic component mounting method for mounting an electronic component supplied in a face-up state in a face-up state or a face-down state in which the electronic component is turned upside down. When picking up the electronic components supplied by the mounting head and mounting them on the mounting target site, and mounting them face down, the electronic components picked up by the picking head and turned upside down are picked up by the mounting head and mounted. In the case of face-down mounting, the mounting head is equipped with a nozzle replacement mechanism in which a plurality of types of replacement nozzles can be attached and detached, and the first replacement nozzle that holds the electronic component is mounted in the case of face-up mounting. A second replacement nozzle for holding an electronic component is mounted. Component mounting method.

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