JP4021788B2 - Solid-state imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a solid-state imaging device, and more particularly to a solid-state imaging device incorporating a wireless tag.
[0002]
[Prior art]
In general, image sensors such as CCD (Charge Coupled Device) sensors and CMOS (Complementary Metal Oxide Semiconductor) sensors often contain defective pixels, so image sensor manufacturers check their own defective pixels. The defective pixel information such as the number and address of defective pixels is provided to the device manufacturer of the image sensor supply destination. In addition to the defective pixel pixel information, adjustment values unique to the imaging element such as an overflow drain voltage, a reset voltage, and a light receiving element sensitivity may be provided.
[0003]
In addition, a serial number is attached to the image sensor, information corresponding to each serial number and defective pixel pixel information is stored in a recording medium such as a floppy disk (registered trademark), and the recording medium is attached to the image sensor. The method of shipping is also implemented.
[0004]
In addition, although not necessarily for the image sensor, a wireless tag storing information related to the stored component is attached to the component transport case that stores the component so that the information related to the component can be read in a non-contact manner in the device manufacturing process. Technology is also known. (See Patent Document 1)
[0005]
[Patent Document 1]
Japanese Patent Laid-Open No. 2000-271820
[Problems to be solved by the invention]
However, in the conventional technique, after the imaging device is mounted on a device such as a camera or a mobile phone, the serial number attached to the imaging device cannot be visually observed. Since the serial number is engraved on the back surface of the image sensor, the serial number is hidden by the mounting board and other components when mounted on a device. For this reason, after the image sensor is mounted, the defective pixel information of the image sensor cannot be known unless the device is disassembled and the serial number is confirmed.
[0007]
The present invention was devised in view of such problems of the prior art, and an object of the present invention is to provide a solid-state imaging device capable of acquiring information relating to an imaging element even after being mounted on a device. is there.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a solid-state imaging device of the present invention is a solid-state imaging device in which an imaging element is accommodated in a package, and includes a wireless tag that stores information related to the imaging element in an internal memory. .
[0009]
According to this configuration, since information related to the image sensor stored in the internal memory of the wireless tag can be acquired by wireless communication with the wireless tag, information regarding the image sensor can be obtained even after the solid-state imaging device is mounted on the device. Can be acquired.
[0010]
In the solid-state imaging device of the present invention, the wireless tag includes an IC chip unit having the internal memory, and an antenna unit for wirelessly transmitting information stored in the internal memory to an external device. The part and the antenna part are preferably arranged separately from each other.
[0011]
According to this configuration, the antenna unit can be arranged at a position suitable for wireless communication with an external device without being restricted by the installation position of the imaging element, the IC chip unit, and the like.
[0012]
The information preferably includes any one of an identification number, a manufacturing number, an overflow drain voltage, a reset voltage, a light receiving element sensitivity, the number of defective pixels, and a defective pixel address.
[0013]
According to this configuration, even after the solid-state imaging device is mounted on the device, any one of the identification number of the imaging element, the serial number, the overflow drain voltage, the reset voltage, the sensitivity of the light receiving element, the number of defective pixels, and the defective pixel address Can be obtained.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0015]
FIG. 1 is a cross-sectional view showing a configuration example of a solid-state imaging device according to the present invention.
The solid-state imaging device 10 includes a CCD chip 12 and a wireless tag 13 housed in a synthetic resin package (housing) 11. The opening 11a of the package 11 is closed with a cover glass 14 that transmits light well. The CCD chip 12 is fixed to the inner bottom part (mount part) 11b of the package 11 with its light receiving part facing the cover glass 14. A plurality of connection terminals 15 connected to the control terminals of the CCD chip 12 are arranged on the outer periphery of the package 11. The connection terminal 15 is connected to a CCD drive circuit of a device on which the solid-state imaging device 10 is mounted.
[0016]
The wireless tag 13 is fixed to the inner bottom surface 11 b of the package 11 together with the CCD chip 12. The wireless tag 13 includes a memory 13a that stores information about the CCD chip 12 and an antenna 13b that wirelessly transmits the information stored in the memory 13a to a tag reader (external device) (not shown) in one IC chip. Built-in.
[0017]
In the memory 13a of the wireless tag 13, as shown in FIG. 2, the identification number (ID number) of the CCD chip 12, the manufacturing number (CCD Lot number), the overflow drain voltage, the reset voltage, the light receiving element sensitivity (CCD sensitivity), the defect The number of pixels (number of scratches) and defective pixel addresses (scratch addresses 1, 2, 3,...) Are stored.
[0018]
According to the solid-state imaging device 10 configured as described above, information on the CCD chip 12 stored in the memory 13a of the wireless tag 13 can be acquired by wireless communication by using a tag reader or the like. Accordingly, information about the CCD chip 12 can be acquired even after the solid-state imaging device 10 is mounted on a device such as a camera or a mobile phone.
[0019]
FIG. 3 is a cross-sectional view showing another configuration example of the solid-state imaging device according to the present invention. In the solid-state imaging device 20 in FIG. 3, the wireless tag 13 having the same configuration as that in FIG. 1 is provided embedded in the back surface (lower surface) portion of the package 11. Thus, the same effect as in the case of FIG. 1 can also be obtained by the configuration in which the wireless tag 13 is embedded in the package 11.
[0020]
4 to 9 are cross-sectional views showing still another configuration example of the solid-state imaging device according to the present invention. In the configuration examples of FIGS. 4 to 9, the wireless tag 13 includes an IC chip unit 13A having a memory 13a and The antenna unit 13B has an antenna 13b for wirelessly transmitting information stored in the memory 13a to an external device. In any configuration example, the IC chip portion 13A is fixed to the inner bottom surface 11b of the package 11 together with the CCD chip 12, but the installation form of the antenna portion 13B is different.
[0021]
In the solid-state imaging device 30 of FIG. 4, the antenna unit 13 </ b> B is installed on the inner surface of the cover glass 14. Since the cover glass 14 has a larger area than the light receiving surface of the CCD chip 12 in order to increase the light receiving angle or to secure a space for wire bonding of the CCD chip 12, the CCD is used. In consideration of the light incident angle on the chip 12, the antenna part 13 </ b> B can be arranged in the peripheral part of the cover glass 14. However, in this case, it is desirable to apply an antireflection treatment to the upper surface (interface with the cover glass 14) and the lower surface (surface on the CCD chip 12 side) of the antenna portion 13B. If reflection occurs at the interface with the cover glass 14, lens flare or ghost is caused. Even if reflection occurs on the surface of the CCD chip 12, flare or ghost may occur.
The
[0022]
In the solid-state imaging device 40 of FIG. 5, the antenna unit 13 </ b> B is provided by being embedded in the front surface (upper surface) portion of the package 11. The antenna unit 13B is covered with a cover glass 14 bonded to the package 11. This configuration is effective when the adhesion surface between the package 11 and the cover glass 14 can be made large. However, also in this case, it is desirable to apply an antireflection treatment to the upper surface of the antenna portion 13B (interface with the cover glass 14).
[0023]
In the solid-state imaging device 50 of FIG. 6, the antenna unit 13 </ b> B is embedded in the front surface (upper surface) portion of the package 11. In this case, since the antenna portion 13B is not covered with the cover glass 14, it is desirable to provide a protective layer for preventing damage on the outside of the antenna portion 13B.
[0024]
In the solid-state imaging device 60 of FIG. 7, the antenna unit 13 </ b> B is provided on the internal wall surface 11 c of the package 11. In the solid-state imaging device 70 of FIG. 8, the antenna unit 13B is provided on the inner bottom surface 11b of the package 11 together with the IC chip unit 13A. Also in these cases, it is desirable to apply an antireflection treatment to the antenna portion 13B.
[0025]
In the solid-state imaging device 70 of FIG. 8, the antenna unit 13 </ b> B is embedded in the back surface (lower surface) portion of the package 11. In this case, it is desirable to provide a protective layer on the outside of the antenna portion 13B as necessary.
[0026]
As described above, by separating the wireless tag 13 into the IC chip portion 13A and the antenna portion 13B, the antenna portion 13B can be connected to an external device without being restricted by the installation position of the CCD chip 12 or the IC chip portion 13A. Can be placed at a position suitable for wireless communication.
[0027]
In the above embodiment, the example in which the IC chip portion 13A of the wireless tag 13 is provided on the inner bottom surface 11b of the package 11 together with the CCD chip 12 has been described, but the installation position of the IC chip portion 13A of the wireless tag 13 is also It can be appropriately changed according to the positional relationship with other components.
[0028]
Further, in the above example, the detailed component information regarding the CCD chip 12 as shown in FIG. 2 is stored in the memory 13a of the wireless tag 13, but the memory 13a of the wireless tag 13 stores the CCD information. Only information necessary for specifying the chip 12, that is, an identification number may be stored. In this case, by constructing a database that stores detailed component information, the overflow drain voltage, reset voltage, light receiving element sensitivity, number of defective pixels of the CCD chip 12 using the identification number read from the wireless tag 13 as a key. A defective pixel address can be acquired.
[0029]
【The invention's effect】
As described above, according to the solid-state imaging device of the present invention, information related to the imaging element stored in the internal memory of the wireless tag can be acquired by wireless communication with the wireless tag. Even after mounting, information on the image sensor can be acquired.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating a configuration example of a solid-state imaging device according to the present invention.
FIG. 2 is a diagram illustrating contents of information stored in an internal memory of a wireless tag.
FIG. 3 is a cross-sectional view showing another configuration example of the solid-state imaging device according to the present invention.
FIG. 4 is a cross-sectional view showing still another configuration example of the solid-state imaging device according to the present invention.
FIG. 5 is a cross-sectional view showing still another configuration example of the solid-state imaging device according to the present invention.
FIG. 6 is a cross-sectional view showing still another configuration example of the solid-state imaging device according to the present invention.
FIG. 7 is a cross-sectional view showing still another configuration example of the solid-state imaging device according to the present invention.
FIG. 8 is a cross-sectional view showing still another configuration example of the solid-state imaging device according to the present invention.
FIG. 9 is a cross-sectional view showing still another configuration example of the solid-state imaging device according to the present invention.
[Explanation of symbols]
10: Solid-state imaging device 11: Package 12: CCD chip (imaging device)
13: Wireless tag 13A: IC chip unit 13a: Memory 13B: Antenna unit 13b: Antenna 14: Cover glass 20: Solid-state imaging device 30: Solid-state imaging device 40: Solid-state imaging device 50: Solid-state imaging device 60: Solid-state imaging device 70: Solid-state imaging device

Claims (3)

In a solid-state imaging device in which an imaging element is accommodated in a package,
A solid-state imaging device comprising a wireless tag storing information about the imaging element in an internal memory. The wireless tag is
An IC chip portion having the internal memory;
An antenna unit for wirelessly transmitting information stored in the internal memory to an external device;
The solid-state imaging device according to claim 1, wherein the IC chip part and the antenna part are arranged separately from each other. The information includes
3. The solid-state imaging device according to claim 1, wherein any one of an identification number, a manufacturing number, an overflow drain voltage, a reset voltage, a light receiving element sensitivity, the number of defective pixels, and a defective pixel address is included.

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