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JP4026044B2 - Board connection member - Google Patents
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JP4026044B2 - Board connection member - Google Patents

Board connection member Download PDF

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Publication number
JP4026044B2
JP4026044B2 JP2000136233A JP2000136233A JP4026044B2 JP 4026044 B2 JP4026044 B2 JP 4026044B2 JP 2000136233 A JP2000136233 A JP 2000136233A JP 2000136233 A JP2000136233 A JP 2000136233A JP 4026044 B2 JP4026044 B2 JP 4026044B2
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JP
Japan
Prior art keywords
substrate
terminal
fastening
board
connecting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000136233A
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Japanese (ja)
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JP2001319701A (en
Inventor
達哉 町
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
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Denso Corp
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Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2000136233A priority Critical patent/JP4026044B2/en
Publication of JP2001319701A publication Critical patent/JP2001319701A/en
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  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、基端部が基板に固定され、先端部が回路部品に設けられた締結ターミナルに締結される基板半田固定型の基板接続部材に関する。
【0002】
【従来の技術】
樹脂封止半導体モジュールなど、やや大型の回路部品は、その頂面に締結ターミナルを有し、この締結ターミナルを基板のプリント配線層に接続するために、基端部が基板にはんだ付けされた基板接続部材の先端部をこの締結ターミナルに締結ねじで締結する端子板重ね式締結方式が一般に採用されている。
【0003】
【発明が解決しようとする課題】
しかしながら、上記した従来の端子板重ね式締結方式では、回路部品と基板との間の基板の厚さ方向や基板の面方向への相対位置ずれ、回路部品などの製造誤差による形状ばらつき、締結時の基板接続部材の姿勢変動、温度変化による熱ストレスの繰り返しなどにより、基板の締結ターミナルと基板接続部材の先端締結部の各締結孔の位置が基板の面方向又は厚さ方向でずれ、その結果、これら両者を強引にねじで締結すると基板接続部材に応力が生じ、この応力が基板接続部材を基板に固定する半田に作用して、この半田の接合部分が疲労し、半田にクラックや割れや半田の剥がれなどが生じる可能性が生じるため、回路部品の位置決めや締結作業に注意が必要であった。
【0004】
本発明は上記問題点に鑑みなされたものであり、作業の複雑、高精度化を回避しつつ、基板接続部材を固定する半田付け部の信頼性を向上可能な基板接続部材を提供することをその目的としている。
【0005】
【課題を解決するための手段】
請求項1記載の基板接続部材は、 基板(4)にはんだ付けされたはんだ固定基端部(11)と、前記基板(4)から所定距離離れて前記基板(4)と略平行に延設されて回路部品(3)の締結ターミナル(7)が締結される端子締結先端部(13)と、金属板により前記はんだ固定基端部(11)及び端子締結先端部(13)と一体に形成されて前記はんだ固定基端部(11)及び端子締結先端部(13)を連結する連結中央部(12)とを有する L 字板状の基板接続部材(1)において、前記連結中央部(12)は、弾性変形あるいは塑性変形容易な特性をもち前記基板(4)の厚さ方向及び前記基板(4)の面方向への前記端子締結先端部(13)の変位をそれぞれ容易化する易変形部を有し、前記易変形部は、前記端子締結先端部(13)から前記基板(4)と略平行に延設される平板部(121)に狭幅に形成された第1のネック部(128)と、前記はんだ固定基端部(11)から前記基板(4)と略直角に立設される平板部(120)に狭幅に形成された第2のネック部(129)とを有し、前記2つの平板部(121、122)を連結する屈曲部(122)は幅広に形成されていることをその特徴としている。
【0006】
発明において、基板接続部材が基板の厚さ方向に容易に変形する易変形部をもつ場合、たとえば回路部品の締結ターミナルと、それにねじにより締結されるべき基板接続部材の先端締結部(端子締結先端部)とが基板厚さ方向にずれていたとしても、この易変形部が基板と直角な面内における回動方向に弾性変形あるいは塑性変形して先端締結部(端子締結先端部)を基板の厚さ方向に変位させるので、基板接続部材のはんだ固定基端部を基板に固定するはんだ(半田)にかかる応力を、実質的な工程、コストの増加なしに低減することができ、この応力によるはんだ接合部分の信頼性低下を抑止することができる。
【0007】
なお、この応力は、締結時の回路部品の締結ターミナルとこの基板接続部材との相対位置ずれや、締結終期における摩擦力による基板接続部材にかかる基板の面方向における回動捻り力や、温度変動の繰り返しによる基板接続部材にかかる周期的熱応力などにより発生する。
【0008】
そのうえ更に、発明において、基板接続部材が基板の面方向(基板厚さ方向と直角の方向)に容易に変形する易変形部をもつ場合、たとえば回路部品の締結ターミナルと、それにねじにより締結されるべき基板接続部材の先端締結部(端子締結先端部)とが基板の面方向にずれていたとしても、この易変形部が基板と平行な面内における回動方向に変形して先端締結部(端子締結先端部)を基板厚さ方向に変位させるので、基板接続部材のはんだ固定基端部を基板に固定するはんだ(半田)にかかる応力を、実質的な工程、コストの増加なしに低減することができ、この応力によるはんだ接合部分の信頼性低下を抑止することができる。
【0009】
本構成において、基板接続部材が基板の厚さ方向及び面方向(基板厚さ方向と直角の方向)に容易に変形する易変形部をもつ場合、上記した両方の効果を同時に奏することができる。
【0010】
すなわち、本構成によれば、回路部品の頂面又は回路部品から基板表面より所定距離隔てて基板と略平行に延設される回路部品の締結ターミナルを、基板の配線に、基板接続部材を通じて小電気抵抗率と短い配線距離で接続することができ、回路部品の締結ターミナルと基板との間の配線の電気抵抗及び配線インピーダンスを低減できるとともに、基板接続部材の信頼性を確保することができるものである。
【0011】
更に、本発明は、端子締結先端部から基板と略平行に延設される平板部に狭幅に形成された第1のネック部を有している。
【0012】
本構成によれば、金属板(通常銅板)からの基板接続部材の打ち抜き成形時に同時に易変形部を形成することができ、製造工程の増加を抑止することができる。なお、易変形部は板状部材である基板接続部材の一部を薄肉化しても弾性変形しやすくすることができる。しかし、このような幅を狭化することなくただ薄肉化するだけでは、基板接続部材の厚さ方向への弾性変形は容易となるが、それと直角方向(捻り方向)への弾性変形容易性を得ることが容易でなく、かつ、製造において金属板の単なる打ち抜き加工では作製できず、プレス加工を必要とするという不具合がある。なお、ここでいう略平行とは+/−10度以下の製造公差を許容するものとする。すなわち、本構成によれば、製造工程の追加なしに基板面方向及び基板厚さ方向への弾性変形性を改善することができる。
【0013】
更に、本発明は、はんだ固定基端部から基板と略直角に立設される平板部に狭幅に形成された第2のネック部(129)を有している。
【0014】
本構成によれば、このネック部が、容易に基板の面方向への弾性回動変形又は基板の厚さ方向への回動変形を行うことができるため、基板接続部材の先端締結部はこのネック部を回動中心として、基板の面方向又は厚さ方向に変位することができる。本構成によれば特に、請求項2記載のネック部に比較して、このネック部と先端締結部との間に距離を稼ぐことができるので、このネック部のわずかな捻じり方向(基板面方向)又は曲げ方向(基板厚さ方向)の弾性変形量を、先端締結部で比例拡大することができ、打ち抜き加工のみで実現することができコスト増大を防止しつつ、請求項1記載の効果を一層増大することができる。なお、ここでいう略直角とは+/−10度以下の製造公差を許容するものとする。
【0016】
【発明を実施するための態様】
本発明の基板接続部材の好適な態様を以下の実施例を参照して説明する。
【0017】
【実施例1】
本発明の基板接続部材の一例を図1〜図4を参照して説明する。
【0018】
1は本発明で言う基板接続部材をなすL字ターミナル、2はアルミベース、3は回路部品モジュール、4はプリント基板、5はねじ、6はプリント基板実装回路部品、7は回路部品モジュール3の締結ターミナル、8はワッシャである。
【0019】
回路部品モジュール3は、この実施例では半導体チップが樹脂封止された角型樹脂モジュールであって、ヒートシンクマス及び放熱を行うとともに密閉ケースの底板をなすアルミベース2上に載置、固定されている。
【0020】
アルミベース2上には、捩子孔付きの支持面(図示せず)が形成されており、プリント基板4は、この螺子孔付きの支持面に締結、固定されている。プリント基板4上にはプリント基板実装回路部品6が実装されている。回路部品モジュール3は、プリント基板4に形成された開口を貫通してプリント基板4の反アアルミベース側へ突出している。
【0021】
回路部品モジュール3の頂面には一対の締結ターミナル7が突出しており、螺子孔を有する締結ターミナル7の先端部はプリント基板(基板)4の面方向に延設されている。
【0022】
L字ターミナル1について図2〜図4を参照して更に詳しく説明する。
【0023】
L字ターミナル1は、銅板を所定形状に打ち抜き、屈曲加工して形成されており、はんだ固定基端部11、連結中央部12、先端締結部13をもつ。はんだ固定基端部11は、プリント基板4の図示しない貫通孔に挿入されてプリント基板4の裏面で噴流半田方式などによりプリント基板4にはんだ付けされている。先端締結部13は、締結用の孔14を有し、この孔14を貫通して締結ターミナル7の螺子孔に螺入された螺子5により、締結ターミナル7に締結されている。
【0024】
L字ターミナル1の連結中央部12は、はんだ固定基端部11と端子締結先端部13とを連結する部分であって、互いに直角な一対の平板部120、121と、L字状に屈曲されてこれら平板部120、121を連結する屈曲部122を有している。連結中央部12は更に、平板部12に設けられた溝部123、124と、平板部12に設けられた溝部125、126と、溝部123、124で狭幅化された平板部12の部分であるネック部128と、溝部125、126で狭幅された平板部12の部分であるネック部129とを有している。
【0025】
ネック部128、129は溝部123〜126により狭幅化されているので、一定の外力に対してプリント基板4の面方向又は厚さ方向に弾性変形又は塑性変形しやすくなっている。
【0026】
したがって、この基板接続部材であるL字ターミナル1の両端間、すなわち、はんだ固定基端部11と先端締結部13との間に、たとえば既述したようななんらかの原因により応力が生じても、この応力によりネック部128、129が応力印加方向に容易に変形されるため、応力が解消又は軽減される。したがって、はんだ固定基端部11にかかるストレスが緩和され、はんだ接合の信頼性を確保することができる。
【0027】
(変形態様)
上記実施例では、ネック部128、129を設けたがどちらか一方でもよく、更に多数設けてもよい。
【図面の簡単な説明】
【図1】 本発明の一実施例のL字ターミナル(基板接続部材)を用いた電子回路装置の部分側面図である。
【図2】 図1に示すL字ターミナルの拡大平面図である。
【図3】 図1に示すL字ターミナルの拡大側面図である。
【図4】 図1に示すL字ターミナルの拡大正面図である

【符号の説明】
1:L字ターミナル(基板接続部材)
3:回路部品モジュール(回路部品)
4:プリント基板(基板)
7:締結ターミナル
11:はんだ固定基端部
12:連結中央部
13:先端締結部
128、129:ネック部(易変形部)
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a board connecting member of a board solder fixing type in which a base end is fixed to a board and a tip is fastened to a fastening terminal provided on a circuit component.
[0002]
[Prior art]
Slightly large circuit components such as resin-encapsulated semiconductor modules have a fastening terminal on the top surface, and the base end is soldered to the board to connect this fastening terminal to the printed wiring layer of the board In general, a terminal plate overlap type fastening method in which the distal end portion of the connecting member is fastened to the fastening terminal with a fastening screw is employed.
[0003]
[Problems to be solved by the invention]
However, in the conventional terminal board overlapping type fastening method described above, relative positional deviation in the thickness direction of the board between the circuit component and the board and the surface direction of the board, shape variation due to manufacturing errors of the circuit parts, etc. The position of each fastening hole in the fastening terminal of the board and the front fastening portion of the board connecting member is shifted in the surface direction or the thickness direction of the board due to the variation of the posture of the board connecting member, repeated thermal stress due to temperature change, etc. When these two are forcibly fastened with screws, a stress is generated in the board connecting member, and this stress acts on the solder for fixing the board connecting member to the board, and the solder joints are fatigued, and the solder is cracked or cracked. Since there is a possibility that the solder will peel off, attention must be paid to the positioning and fastening work of the circuit components.
[0004]
The present invention has been made in view of the above problems, and provides a board connecting member that can improve the reliability of a soldering portion that fixes the board connecting member while avoiding complicated work and high accuracy. That is the purpose.
[0005]
[Means for Solving the Problems]
The board connecting member according to claim 1 , A solder fixing base end portion (11) soldered to the substrate (4), and a fastening terminal for the circuit component (3) extending from the substrate (4) at a predetermined distance and substantially parallel to the substrate (4) The terminal fastening distal end portion (13) to which (7) is fastened, and the solder fastening proximal end portion (11) and the terminal fastening distal end portion (13) are integrally formed by a metal plate to form the solder fastening proximal end portion (11). ) and connecting the central part connecting the terminal connection tip (13) (12) and the L-shaped board connecting member (1) having the connection middle portion (12) is easy elastic deformation or plastic deformation Having an easily deformable portion having characteristics and facilitating displacement of the terminal fastening tip (13) in the thickness direction of the substrate (4) and the surface direction of the substrate (4), The terminal fastening tip (13) is substantially parallel to the substrate (4). A first neck portion (128) narrowly formed on the extending flat plate portion (121), and a flat plate erected substantially perpendicularly to the substrate (4) from the solder fixing base end portion (11) The portion (120) has a second neck portion (129) formed narrowly, and the bent portion (122) connecting the two flat plate portions (121, 122) is formed wide. Is the feature.
[0006]
In the present invention , when the board connecting member has an easily deformable part that easily deforms in the thickness direction of the board, for example, a fastening terminal of a circuit component and a tip fastening part (terminal fastening) of the board connecting member to be fastened by a screw thereto Even if the tip portion is displaced in the substrate thickness direction, the easily deformable portion is elastically deformed or plastically deformed in the rotation direction in a plane perpendicular to the substrate, and the tip fastening portion (terminal fastening tip portion) is changed to the substrate. The stress applied to the solder (solder) that fixes the solder fixing base end of the board connecting member to the board can be reduced without substantial steps and cost increase. Therefore, it is possible to suppress a decrease in the reliability of the solder joint portion.
[0007]
This stress is caused by the relative displacement between the fastening terminal of the circuit component and the board connecting member at the time of fastening, the rotational twisting force in the surface direction of the board on the board connecting member due to the frictional force at the end of fastening, and the temperature fluctuation. It is generated by periodic thermal stress applied to the board connecting member due to repetition of the above.
[0008]
Furthermore, in the present invention , when the board connecting member has an easily deformable portion that easily deforms in the surface direction of the board (direction perpendicular to the board thickness direction), for example, it is fastened by a fastening terminal of a circuit component and a screw. Even if the front end fastening portion (terminal fastening front end portion) of the substrate connecting member to be shifted is displaced in the surface direction of the substrate, the easily deformable portion is deformed in the rotation direction in a plane parallel to the substrate, and the front end fastening portion Since the (terminal fastening tip) is displaced in the board thickness direction, the stress applied to the solder (solder) that fixes the solder fixing base end of the board connecting member to the board is reduced without substantial increase in process and cost. It is possible to suppress a decrease in reliability of the solder joint portion due to this stress.
[0009]
In this configuration, when the substrate connecting member has an easily deformable portion that easily deforms in the thickness direction and the surface direction (direction perpendicular to the substrate thickness direction) of the substrate, both of the effects described above can be achieved simultaneously.
[0010]
That is, according to this configuration, the fastening terminal of the circuit component, which is extended from the top surface of the circuit component or the circuit component at a predetermined distance from the substrate surface and substantially parallel to the substrate, is connected to the wiring of the substrate through the substrate connecting member. Can be connected with electrical resistivity and short wiring distance, can reduce the electrical resistance and wiring impedance of the wiring between the circuit component fastening terminal and the board, and can ensure the reliability of the board connecting member It is.
[0011]
Furthermore, the present invention has a first neck portion that is narrowly formed on a flat plate portion that extends substantially parallel to the substrate from the terminal fastening tip portion.
[0012]
According to this structure, an easily deformable part can be formed simultaneously at the time of stamping the board | substrate connection member from a metal plate (usually copper plate), and the increase in a manufacturing process can be suppressed. The easily deformable portion can be easily elastically deformed even if a part of the board connecting member which is a plate-like member is thinned. However, it is easy to elastically deform the board connecting member in the thickness direction by simply reducing the thickness without reducing the width, but it is easy to elastically deform in the direction perpendicular to it (twist direction). There is a problem that it is not easy to obtain, and cannot be produced by simple punching of a metal plate in production, and requires press working. Note that the term “substantially parallel” as used herein allows manufacturing tolerances of +/− 10 degrees or less. That is, according to this configuration, it is possible to improve the elastic deformability in the substrate surface direction and the substrate thickness direction without adding a manufacturing process.
[0013]
Furthermore, the present invention has a second neck portion (129) formed narrowly on a flat plate portion erected substantially perpendicular to the substrate from the solder fixing base end portion.
[0014]
According to this configuration, the neck portion can easily perform elastic rotational deformation in the surface direction of the substrate or rotational deformation in the thickness direction of the substrate. It can be displaced in the surface direction or the thickness direction of the substrate with the neck portion as the rotation center. According to this configuration, in particular, since a distance can be obtained between the neck portion and the tip fastening portion as compared with the neck portion according to claim 2, a slight twisting direction of the neck portion (substrate surface) Direction) or bending direction (substrate thickness direction), the amount of elastic deformation can be proportionally increased at the front end fastening portion, can be realized only by punching, and the effect of claim 1 is prevented while preventing an increase in cost. Can be further increased. Note that the term “substantially right angle” as used herein allows manufacturing tolerances of +/− 10 degrees or less.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
The suitable aspect of the board | substrate connection member of this invention is demonstrated with reference to a following example.
[0017]
[Example 1]
An example of the board connecting member of the present invention will be described with reference to FIGS.
[0018]
DESCRIPTION OF SYMBOLS 1 is the L-shaped terminal which makes the board connection member said by this invention, 2 is an aluminum base, 3 is a circuit component module, 4 is a printed circuit board, 5 is a screw, 6 is a printed circuit board mounting circuit component, 7 is the circuit component module 3 A fastening terminal, 8 is a washer.
[0019]
In this embodiment, the circuit component module 3 is a square resin module in which a semiconductor chip is sealed with a resin. The circuit component module 3 is mounted and fixed on an aluminum base 2 that performs heat sink mass and heat dissipation and forms a bottom plate of a sealed case. Yes.
[0020]
A support surface (not shown) with screw holes is formed on the aluminum base 2, and the printed circuit board 4 is fastened and fixed to the support surface with screw holes. A printed circuit board mounting circuit component 6 is mounted on the printed circuit board 4. The circuit component module 3 projects through the opening formed in the printed circuit board 4 to the side opposite to the aluminum base of the printed circuit board 4.
[0021]
A pair of fastening terminals 7 protrude from the top surface of the circuit component module 3, and the leading end of the fastening terminal 7 having screw holes extends in the surface direction of the printed circuit board (substrate) 4.
[0022]
The L-shaped terminal 1 will be described in more detail with reference to FIGS.
[0023]
The L-shaped terminal 1 is formed by punching a copper plate into a predetermined shape and bending it, and has a solder fixing base end portion 11, a connection center portion 12, and a tip fastening portion 13. The solder fixing base end portion 11 is inserted into a through hole (not shown) of the printed circuit board 4 and soldered to the printed circuit board 4 on the back surface of the printed circuit board 4 by a jet solder method or the like. The distal end fastening portion 13 has a fastening hole 14, and is fastened to the fastening terminal 7 by a screw 5 that passes through the hole 14 and is screwed into a screw hole of the fastening terminal 7.
[0024]
The connection center portion 12 of the L-shaped terminal 1 is a portion that connects the solder fixing base end portion 11 and the terminal fastening distal end portion 13, and is bent into a pair of flat plate portions 120 and 121 that are perpendicular to each other, and an L-shaped plate shape. And has a bent portion 122 connecting the flat plate portions 120 and 121. Connecting the central portion 12 further includes a groove portion 123, 124 provided in the flat plate portion 12 1, a groove portion 125, 126 provided in the flat plate portion 12 0, is narrowed by the grooves 123 and 124 a of the flat plate portion 12 1 a neck portion 128 is a portion, and a neck portion 129 is a narrow portion of the flat plate portion 12 0 in the groove 125.
[0025]
Since the neck portions 128 and 129 are narrowed by the groove portions 123 to 126, the neck portions 128 and 129 are easily elastically or plastically deformed in the surface direction or the thickness direction of the printed circuit board 4 with respect to a certain external force.
[0026]
Therefore, even if stress is generated between the both ends of the L-shaped terminal 1 which is the board connecting member, that is, between the solder fixing base end portion 11 and the front end fastening portion 13, for example, for some reason as described above, Since the neck portions 128 and 129 are easily deformed in the stress application direction by the stress, the stress is eliminated or reduced. Therefore, the stress applied to the solder fixing base end portion 11 is relieved, and the reliability of solder joint can be ensured.
[0027]
(Modification)
In the above embodiment, the neck portions 128 and 129 are provided, but either one may be provided, or a larger number may be provided.
[Brief description of the drawings]
FIG. 1 is a partial side view of an electronic circuit device using an L-shaped terminal (substrate connecting member) according to an embodiment of the present invention.
FIG. 2 is an enlarged plan view of the L-shaped terminal shown in FIG.
FIG. 3 is an enlarged side view of the L-shaped terminal shown in FIG.
4 is an enlarged front view of the L-shaped terminal shown in FIG .

[Explanation of symbols]
1: L-shaped terminal (board connection member)
3: Circuit component module (circuit component)
4: Printed circuit board (board)
7: Fastening terminal 11: Solder fixing base end portion 12: Connection center portion 13: Tip fastening portion 128, 129: Neck portion (easy deformation portion)

Claims (1)

基板(4)にはんだ付けされたはんだ固定基端部(11)と、
前記基板(4)から所定距離離れて前記基板(4)と略平行に延設されて回路部品(3)の締結ターミナル(7)が締結される端子締結先端部(13)と、
金属板により前記はんだ固定基端部(11)及び端子締結先端部(13)と一体に形成されて前記はんだ固定基端部(11)及び端子締結先端部(13)を連結する連結中央部(12)と、
を有するL 字板状の基板接続部材(1)において、
前記連結中央部(12)は、弾性変形あるいは塑性変形容易な特性をもち前記基板(4)の厚さ方向及び前記基板(4)の面方向への前記端子締結先端部(13)の変位をそれぞれ容易化する易変形部を有し、
前記易変形部は、
前記端子締結先端部(13)から前記基板(4)と略平行に延設される平板部(121)に狭幅に形成された第1のネック部(128)と、前記はんだ固定基端部(11)から前記基板(4)と略直角に立設される平板部(120)に狭幅に形成された第2のネック部(129)とを有し、
前記2つの平板部(121、122)を連結する屈曲部(122)は幅広に形成されていることを特徴とする基板接続部材。
A solder fixing base end (11) soldered to the substrate (4) ;
A terminal fastening tip (13) extending from the substrate (4) at a predetermined distance and extending substantially parallel to the substrate (4) to which the fastening terminal (7) of the circuit component (3) is fastened;
A connecting central portion ( 11) formed integrally with the solder fixing base end portion (11) and the terminal fastening tip end portion ( 13) by a metal plate and connecting the solder fixing base end portion (11) and the terminal fastening tip end portion (13). 12)
In the L -shaped board connecting member (1) having
The connecting central portion (12), said terminal connection tip of the surface direction of the thickness direction and the substrate has the substrate easy characteristic elastic deformation or plastic deformation (4) (4) a displacement (13) have a deformable portion to facilitate respectively,
The easily deformable portion is
A first neck portion (128) formed narrowly on a flat plate portion (121) extending substantially parallel to the substrate (4) from the terminal fastening tip portion (13), and the solder fixing base end portion (11) to the substrate (4) and a second neck portion (129) narrowly formed on the flat plate portion (120) erected substantially at right angles,
The board connecting member, wherein the bent portion (122) connecting the two flat plate portions (121, 122) is formed wide .
JP2000136233A 2000-05-09 2000-05-09 Board connection member Expired - Fee Related JP4026044B2 (en)

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JP5848890B2 (en) * 2010-06-03 2016-01-27 矢崎総業株式会社 Multilayer wiring board and manufacturing method thereof
JP2011258340A (en) * 2010-06-07 2011-12-22 Alps Electric Co Ltd Connection apparatus and connection method
JP5449237B2 (en) * 2011-03-09 2014-03-19 古河電気工業株式会社 Substrate and substrate manufacturing method
US9306381B2 (en) * 2013-11-15 2016-04-05 Yazaki North America, Inc. Electrical device having busbar with flexible weld crimp
US9444183B2 (en) 2014-02-10 2016-09-13 Yazaki North America, Inc. Bused electrical center for electric or hybrid electric vehicle
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