Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JP4027564B2 - Vacuum exhaust system - Google Patents
[go: Go Back, main page]

JP4027564B2 - Vacuum exhaust system - Google Patents

Vacuum exhaust system Download PDF

Info

Publication number
JP4027564B2
JP4027564B2 JP2000109453A JP2000109453A JP4027564B2 JP 4027564 B2 JP4027564 B2 JP 4027564B2 JP 2000109453 A JP2000109453 A JP 2000109453A JP 2000109453 A JP2000109453 A JP 2000109453A JP 4027564 B2 JP4027564 B2 JP 4027564B2
Authority
JP
Japan
Prior art keywords
main
vacuum pump
vacuum chamber
pressure
exhaust line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000109453A
Other languages
Japanese (ja)
Other versions
JP2001295761A (en
JP2001295761A5 (en
Inventor
裕之 川崎
博 服部
敏治 中澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2000109453A priority Critical patent/JP4027564B2/en
Publication of JP2001295761A publication Critical patent/JP2001295761A/en
Publication of JP2001295761A5 publication Critical patent/JP2001295761A5/ja
Application granted granted Critical
Publication of JP4027564B2 publication Critical patent/JP4027564B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Control Of Positive-Displacement Pumps (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、半導体製造プロセス等で使用するプロセスガスを導入する真空チャンバーの真空排気システムのように、比較的大流量のガスを排気する用途に適する真空排気システムに関するものである。
【0002】
【従来の技術】
図1は従来のこの種の真空排気システムの構成を示す図である。排気ラインとしては、通常のプロセス時に真空チャンバー1内のガスを排気する主排気ラインL1と、真空チャンバー1の粗引き時や真空チャンバー1のドライクリーニング実施時に用いられる粗引きラインL2を有している。
【0003】
主排気ラインL1にはアダプティブプレッシャーコントロールバルブ(以下、「APCバルブ」と記す)2、ゲートバルブ3、主真空ポンプ4としてのターボ分子ポンプ、ゲートバルブ5が挿入接続、粗引きラインL2にはAPCバルブ6、ゲートバルブ7が挿入接続されている。また、主排気ラインL1と粗引きラインL2の合流点10より後流側に補助ポンプとしてドライ真空ポンプ8が接続されている。また、9は主真空ポンプ4のコントローラ、11は真空チャンバー内の圧力を測定する真空計である。そして主真空ポンプ4の後流側は、特に調圧をする必要がなく、APCバルブは配置されていない。
【0004】
上記構成の真空排気システムにおいて、真空チャンバー1内に付着した生成物を除去するために行われる例えば、NF3ガスを用いるドライクリーニングを実施するときは、主真空ポンプ4が接続されている主排気ラインL1は閉止させて、粗引きラインL2を使用する。また、最近、主排気ラインL1の主真空ポンプ4の吸気側に配置されたAPCバルブ2、ゲートバルブ3及び主真空ポンプ4のドライクリーニングも実施している。これは主真空ポンプ4を停止させ、APCバルブ2及びゲートバルブ3を全開にして実施する方法である。
【0005】
上記主真空ポンプ4を停止させ、APCバルブ2及びゲートバルブ3を全開にしてAPCバルブ2、ゲートバルブ3及び主真空ポンプ4をドライクリーニングする方法は、主真空ポンプ4を停止し、再起動させるのに時間がかかり、頻繁に実施することができないという問題があった。また、頻繁に実施したとしたら、本来のプロセスを実施する時間が低下し、その結果、スループットが低下するという問題もあった。
【0006】
また、主真空ポンプ4は回転させたままで、真空チャンバー1内のクリーニングと主真空ポンプ4の吸気側のAPCバルブ2、ゲートバルブ3及び主真空ポンプ4のドライクリーニングを同時に実施する方法として、主真空ポンプ4の吸気側のAPCバルブ2で真空チャンバー1内の圧力を調整して、主真空ポンプ4で排気する方法もある。しかしながら、この方法は、APCバルブ2の上流側はその圧力は高く、十分なクリーニング効果が得られるが、該APCバルブ2の後流側はその圧力は低く、十分なクリーニング効果が得られないという問題がある。
【0007】
【発明が解決しようとする課題】
本発明は上述の点に鑑みてなされたもので、真空チャンバー、主真空ポンプ、主真空ポンプの吸気側のAPCバルブ及びゲートバルブのドライクリーニングを同時に実施し、十分なクリーニング効果を発揮できる真空排気システムを提供することを目的とする。
【0008】
【課題を解決するための手段】
上記課題を解決するため請求項1に記載の発明は、ガスを導入する真空チャンバーと、該真空チャンバー内に導入したガスを排気する排気システムであって、真空チャンバー内に導入したガスを排気する主排気ラインを設け、主排気ライン真空チャンバー内に導入したガスを排気し且つ所望の圧力に減圧する主真空ポンプを挿入接続すると共に、主排気ラインの主真空ポンプの吸気側にゲートバルブと第1のアダプティブプレッシャーコントロールバルブを、主真空ポンプの排気側に第2のアダプティブプレッシャーコントロールバルブを順次挿入接続して設け、主真空ポンプを任意の回転数で回転させたまま、第2のアダプティブプレッシャーコントロールバルブで真空チャンバー内圧を所望の圧力に調圧することを特徴とする。
【0010】
また、請求項2に記載の発明は、ガスを導入する真空チャンバーと、該真空チャンバー内に導入したガスを排気する排気システムであって、真空チャンバー内に導入したガスを排気する主排気ラインを設け、主排気ライン真空チャンバー内に導入したガスを排気し且つ所望の圧力に減圧する主真空ポンプを挿入接続すると共に、主排気ラインの主真空ポンプの吸気側にゲートバルブと第1のアダプティブプレッシャーコントロールバルブを、主真空ポンプの排気側に第2のアダプティブプレッシャーコントロールバルブを順次挿入接続して設け、主真空ポンプの回転数を制御する回転数制御手段を設け、第2のアダプティブプレッシャーコントロールバルブの動作と回転数制御手段による主真空ポンプの回転数制御により真空チャンバー内圧を所望の圧力に調圧することを特徴とする。
【0011】
また、請求項3に記載の発明は、請求項1又は2に記載の真空排気システムにおいて、主排気ラインの第2のアダプティブプレッシャーコントロールバルブの後流側に補助ポンプを設けたことを特徴とする。
【0013】
上記のように主真空ポンプを任意の回転数で回転させたまま、主排気ラインの主真空ポンプの後流側に設けたAPCバルブの動作で真空チャンバー内圧を所望の圧力に調整するか、又は該APCバルブの動作と主真空ポンプの回転数制御により真空チャンバー内圧を所望の圧力に調圧するので、例えば真空チャンバーのドライクリーニングの場合では、真空ポンプを任意の回転数で回転させたまま、真空チャンバー、真空ポンプの圧力を高く保ち、十分なクリーニング効果を有するドライクリーニングを実施できる。
【0014】
【発明の実施の形態】
以下、本発明の実施の形態例を図面に基づいて説明する。図2は本発明に係る真空排気システムの構成を示す図である。図2において、図1と同一符号を付した部分は同一又は相当部分を示す。排気ラインとしては、通常のプロセス時に真空チャンバー1内のガスを排気する主排気ラインL1と、真空チャンバー1の粗引き時や真空チャンバー1のドライクリーニング実施時に用いられる粗引きラインL2を有している点は図1の真空排気システムと同じである。
【0015】
主排気ラインL1にはAPCバルブ2、ゲートバルブ3、主真空ポンプ4としてのターボ分子ポンプが挿入接続され、更に主真空ポンプ4の後流側にAPCバルブ12、ゲートバルブ5が挿入接続されている。また、粗引きラインL2にはゲートバルブ7のみが挿入接続されている。主排気ラインL1と粗引きラインL2の合流点10より後流側に補助ポンプとしてドライ真空ポンプ8が接続されている。
【0016】
また、主真空ポンプ4内の圧力は真空計11で測定され、主排気ラインL1内の圧力は真空計13で測定され、主真空ポンプ4吸気側のAPCバルブ2及び主真空ポンプ後流側のAPCバルブ12のコントロールに供される。また、主真空ポンプ4の回転数はコントローラ9により制御されるようになっている。
【0017】
上記構成の真空排気システムにおいて、真空チャンバー1内を粗引きするときは、主排気ラインL1のゲートバルブ3及び5を閉じ、粗引きラインL2のゲートバルブ7を開いて、ドライ真空ポンプ8により、真空チャンバー1内を粗引きする(この時、主真空ポンプ4であるターボ分子ポンプは運転状態又は停止状態にある)。真空チャンバー1内が減圧され、所定の圧力に減圧されたら、ゲートバルブ7を閉じ、ゲートバルブ3及び5を開いて通常のプロセス運転に移る(この時、主真空ポンプ4であるターボ分子ポンプが停止状態である場合はターボ分子ポンプを運転する)。
【0018】
主真空ポンプ4の後流側のAPCバルブ12により、その上流側の圧力を高めた場合、主真空ポンプ4は過負荷状態となり、条件によっては、主真空ポンプ4の稼動範囲を超えてしまうかもしれない。このとき主真空ポンプ4の回転数をコントローラ9により低下させれば、過負荷運転時の主真空ポンプ4のロータ温度やモータ温度の上昇を抑えることができる。
【0019】
また、過負荷運転時の回転数変化(回転数低下)は、無負荷運転時の変化時間に比べ、大幅に短く、短時間で回転数の回転数変化(回転数低下)を得ることができる。また、主真空ポンプ4の後流側のAPCバルブ12だけの真空チャンバー1の調圧に比べ、主真空ポンプ4の回転数を変化させて低下させておけば、更に高い圧力の調圧も可能であり、上記した主真空ポンプ4吸気側のAPCバルブ2の上流側圧力は高く、十分なクリーニング効果が得られるが、該APCバルブ2の後流側の圧力は低く、十分なクリーニング効果が得られないという問題を解決できる。
【0020】
主真空ポンプ4後流側のAPCバルブ12は、真空チャンバー1の圧力を直接調圧しても構わないし、主真空ポンプ4の回転数に対する真空チャンバー1内圧力と背圧の関係を予め求めておけば、主真空ポンプ4の背圧を調整することにより、真空チャンバー1内の圧力も調整することができる。
【0021】
なお、上記例では主真空ポンプ4にターボ分子ポンプを用いる例を示したが、主真空ポンプ4はターボ分子ポンプに限定されるものではない。
【0022】
また、本発明の主眼点は主真空ポンプ4の回転数と、該主真空ポンプ4の後流側に設けたAPCバルブ12による真空チャンバー1の圧力制御にある。よって、粗引きラインL2の有無や、粗引きラインL2が有る場合、粗引きラインL2に設置されるAPCバルブ6の有無はどちらでも構わない。また、排気系の構成上、主真空ポンプ4吸気側のAPCバルブ2とゲートバルブ3の位置は図2とは逆に配置してもよい。また、主真空ポンプ4後流側のAPCバルブ12とゲートバルブ5の位置も図2とは逆に配置してもよい。
【0023】
【発明の効果】
以上説明したように、各請求項に記載の発明によれば下記のような優れた効果が期待できる。
【0024】
主真空ポンプを任意の回転数で回転させたまま、主排気ラインの主真空ポンプの後流側に設けたAPCバルブの動作で真空チャンバー内圧を所望の圧力に調整するか、又は該APCバルブの動作と主真空ポンプの回転数制御により真空チャンバー内圧を所望の圧力に調圧するので、例えば真空チャンバーのドライクリーニングの場合では、真空ポンプを任意の回転数で回転させたまま、真空チャンバー、真空ポンプの圧力を高く保ち、十分なクリーニング効果を有するドライクリーニングを実施できる。
【0025】
請求項に記載の発明によれば、更に、主真空ポンプ、主真空ポンプの吸気側のAPCバルブ、ゲートバルブのドライクリーニングも同時に実施できる。
【図面の簡単な説明】
【図1】 従来の真空排気システムの構成を示す図である。
【図2】 本発明に係る真空排気システムの構成を示す図である。
【符号の説明】
1 真空チャンバー
2 APCバルブ
3 ゲートバルブ
4 主真空ポンプ
5 ゲートバルブ
6 APCバルブ
7 ゲートバルブ
8 ドライ真空ポンプ
9 コントローラ
10 合流点
11 真空計
12 APCバルブ
13 真空計
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an evacuation system suitable for an application of evacuating a gas having a relatively large flow rate, such as an evacuation system of a vacuum chamber for introducing a process gas used in a semiconductor manufacturing process or the like.
[0002]
[Prior art]
FIG. 1 is a diagram showing the configuration of a conventional evacuation system of this type. The exhaust line includes a main exhaust line L1 that exhausts gas in the vacuum chamber 1 during a normal process, and a roughing line L2 that is used when the vacuum chamber 1 is roughed or when the vacuum chamber 1 is dry cleaned. Yes.
[0003]
An adaptive pressure control valve (hereinafter referred to as “APC valve”) 2, a gate valve 3, a turbo molecular pump as a main vacuum pump 4, and a gate valve 5 are inserted and connected to the main exhaust line L 1, and an APC is connected to the roughing line L 2. A valve 6 and a gate valve 7 are inserted and connected. Further, a dry vacuum pump 8 is connected as an auxiliary pump on the downstream side from the junction 10 of the main exhaust line L1 and the roughing line L2. Further, 9 is a controller of the main vacuum pump 4 and 11 is a vacuum gauge for measuring the pressure in the vacuum chamber. The downstream side of the main vacuum pump 4 does not need to be regulated in particular, and no APC valve is arranged.
[0004]
In the vacuum evacuation system having the above-described configuration, for example, when dry cleaning using NF 3 gas is performed in order to remove a product adhered in the vacuum chamber 1, the main evacuation to which the main vacuum pump 4 is connected is performed. The line L1 is closed and the roughing line L2 is used. Recently, dry cleaning of the APC valve 2, the gate valve 3, and the main vacuum pump 4 disposed on the intake side of the main vacuum pump 4 in the main exhaust line L <b> 1 has also been performed. In this method, the main vacuum pump 4 is stopped and the APC valve 2 and the gate valve 3 are fully opened.
[0005]
The main vacuum pump 4 is stopped, the APC valve 2 and the gate valve 3 are fully opened, and the APC valve 2, the gate valve 3 and the main vacuum pump 4 are dry-cleaned. The main vacuum pump 4 is stopped and restarted. There was a problem that it took time and could not be carried out frequently. Further, if it is frequently performed, there is a problem that the time for performing the original process is reduced, and as a result, the throughput is reduced.
[0006]
Further, as a method of simultaneously performing the cleaning in the vacuum chamber 1 and the dry cleaning of the APC valve 2, the gate valve 3 and the main vacuum pump 4 on the intake side of the main vacuum pump 4 while the main vacuum pump 4 is kept rotating. There is also a method of adjusting the pressure in the vacuum chamber 1 with the APC valve 2 on the intake side of the vacuum pump 4 and exhausting with the main vacuum pump 4. However, in this method, the upstream side of the APC valve 2 has a high pressure and a sufficient cleaning effect can be obtained, but the downstream side of the APC valve 2 has a low pressure and a sufficient cleaning effect cannot be obtained. There's a problem.
[0007]
[Problems to be solved by the invention]
The present invention has been made in view of the above points, and is a vacuum exhaust capable of exhibiting a sufficient cleaning effect by simultaneously performing dry cleaning of the vacuum chamber, the main vacuum pump, the APC valve on the intake side of the main vacuum pump, and the gate valve. The purpose is to provide a system.
[0008]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the invention described in claim 1 is a vacuum chamber for introducing a gas and an exhaust system for exhausting the gas introduced into the vacuum chamber, wherein the gas introduced into the vacuum chamber is exhausted. A main exhaust line is provided, a main vacuum pump for exhausting the gas introduced into the vacuum chamber to the main exhaust line and reducing the pressure to a desired pressure is inserted and connected, and a gate valve is provided on the intake side of the main vacuum pump of the main exhaust line. a first adaptive pressure control valve, while the main exhaust side of the vacuum pump a second adaptive pressure control valves are sequentially inserted and connected is provided to rotate the main vacuum pump in any rotation speed, the second adaptive The pressure in the vacuum chamber is adjusted to a desired pressure with a pressure control valve.
[0010]
The invention described in claim 2 is a vacuum chamber for introducing a gas and an exhaust system for exhausting the gas introduced into the vacuum chamber, wherein a main exhaust line for exhausting the gas introduced into the vacuum chamber is provided. A main vacuum pump for exhausting the gas introduced into the vacuum chamber to the main exhaust line and reducing the pressure to a desired pressure is inserted and connected, and a gate valve and a first adaptive on the intake side of the main vacuum pump of the main exhaust line the pressure control valve is provided with a second adaptive pressure control valves are sequentially inserted into and connected to an exhaust side of the main vacuum pump, provided the rotational speed control means for controlling the rotational speed of the main vacuum pump, the second adaptive pressure control Inside the vacuum chamber by controlling the number of rotations of the main vacuum pump by means of valve operation and number of rotations control means The wherein the pressure regulated to a desired pressure.
[0011]
The invention described in claim 3 is characterized in that, in the vacuum exhaust system according to claim 1 or 2, an auxiliary pump is provided on the downstream side of the second adaptive pressure control valve of the main exhaust line . .
[0013]
While the main vacuum pump is rotated at an arbitrary rotation number as described above, the internal pressure of the vacuum chamber is adjusted to a desired pressure by the operation of the APC valve provided on the downstream side of the main vacuum pump in the main exhaust line , or while since pressure regulating the vacuum pressure in the chamber to a desired pressure by the rotation speed control of the operation and the main vacuum pump of the APC valve, for example in the case of the vacuum chamber dry cleaning rotates the main vacuum pump in any rotation speed Further, it is possible to carry out dry cleaning having a sufficient cleaning effect by keeping the pressure of the vacuum chamber and the main vacuum pump high.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is a diagram showing the configuration of the vacuum exhaust system according to the present invention. 2, the same reference numerals as those in FIG. 1 denote the same or corresponding parts. The exhaust line includes a main exhaust line L1 that exhausts gas in the vacuum chamber 1 during a normal process, and a roughing line L2 that is used when the vacuum chamber 1 is roughed or when the vacuum chamber 1 is dry cleaned. This is the same as the vacuum exhaust system in FIG.
[0015]
A turbo molecular pump as an APC valve 2, a gate valve 3, and a main vacuum pump 4 is inserted and connected to the main exhaust line L1, and an APC valve 12 and a gate valve 5 are inserted and connected to the downstream side of the main vacuum pump 4. Yes. Further, only the gate valve 7 is inserted and connected to the roughing line L2. A dry vacuum pump 8 is connected as an auxiliary pump downstream from the junction 10 of the main exhaust line L1 and the roughing line L2.
[0016]
The pressure in the main vacuum pump 4 is measured by the vacuum gauge 11, the pressure in the main exhaust line L1 is measured by the vacuum gauge 13, and the APC valve 2 on the intake side of the main vacuum pump 4 and the downstream side of the main vacuum pump are measured. This is used to control the APC valve 12. The rotation speed of the main vacuum pump 4 is controlled by the controller 9.
[0017]
In the vacuum exhaust system having the above configuration, when the vacuum chamber 1 is roughed, the gate valves 3 and 5 of the main exhaust line L1 are closed, the gate valve 7 of the roughing line L2 is opened, and the dry vacuum pump 8 is used. The inside of the vacuum chamber 1 is roughed (at this time, the turbo molecular pump as the main vacuum pump 4 is in an operating state or a stopped state). When the inside of the vacuum chamber 1 is depressurized and depressurized to a predetermined pressure, the gate valve 7 is closed, the gate valves 3 and 5 are opened, and a normal process operation is started (at this time, the turbo molecular pump as the main vacuum pump 4 is If it is stopped, operate the turbo molecular pump).
[0018]
When the pressure on the upstream side is increased by the APC valve 12 on the downstream side of the main vacuum pump 4, the main vacuum pump 4 is overloaded, and depending on the conditions, the operating range of the main vacuum pump 4 may be exceeded. unknown. At this time, if the rotation speed of the main vacuum pump 4 is decreased by the controller 9, an increase in the rotor temperature or motor temperature of the main vacuum pump 4 during overload operation can be suppressed.
[0019]
Further, the rotational speed change (reduction in rotational speed) during overload operation is significantly shorter than the change time during no-load operation, and the rotational speed change (reduction in rotational speed) can be obtained in a short time. . Further, if the rotation speed of the main vacuum pump 4 is decreased by changing the rotation speed of the vacuum chamber 1 with only the APC valve 12 on the downstream side of the main vacuum pump 4, even higher pressure can be regulated. The upstream pressure of the APC valve 2 on the intake side of the main vacuum pump 4 is high and a sufficient cleaning effect can be obtained, but the pressure on the downstream side of the APC valve 2 is low and a sufficient cleaning effect is obtained. Can solve the problem of not being able to.
[0020]
The APC valve 12 on the downstream side of the main vacuum pump 4 may directly adjust the pressure in the vacuum chamber 1, and the relationship between the pressure in the vacuum chamber 1 and the back pressure with respect to the rotation speed of the main vacuum pump 4 can be obtained in advance. For example, the pressure in the vacuum chamber 1 can be adjusted by adjusting the back pressure of the main vacuum pump 4.
[0021]
In addition, although the example which uses a turbo-molecular pump for the main vacuum pump 4 was shown in the said example, the main vacuum pump 4 is not limited to a turbo-molecular pump.
[0022]
The main points of the present invention are the number of rotations of the main vacuum pump 4 and the pressure control of the vacuum chamber 1 by the APC valve 12 provided on the downstream side of the main vacuum pump 4. Therefore, the presence / absence of the roughing line L2 or the presence / absence of the APC valve 6 installed in the roughing line L2 does not matter. Further, the positions of the APC valve 2 and the gate valve 3 on the intake side of the main vacuum pump 4 may be arranged opposite to those in FIG. Also, the positions of the APC valve 12 and the gate valve 5 on the downstream side of the main vacuum pump 4 may be arranged opposite to those in FIG.
[0023]
【The invention's effect】
As described above, according to the invention described in each claim, the following excellent effects can be expected.
[0024]
While the main vacuum pump is rotated at an arbitrary rotational speed, or adjusting the vacuum pressure in the chamber to a desired pressure by the operation of the APC valve provided on the downstream side of the main vacuum pump in the main exhaust line, or the A PC valve since pressure operation and adjusting the vacuum pressure in the chamber to a desired pressure by the rotation speed control of the main vacuum pump, for example, while in the case of the vacuum chamber dry cleaning has a main vacuum pump is rotated at an arbitrary rotational speed, a vacuum chamber, Dry cleaning having a sufficient cleaning effect can be carried out while keeping the pressure of the main vacuum pump high.
[0025]
According to the third aspect of the present invention, dry cleaning of the main vacuum pump, the APC valve on the intake side of the main vacuum pump, and the gate valve can be simultaneously performed.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a conventional vacuum exhaust system.
FIG. 2 is a diagram showing a configuration of an evacuation system according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Vacuum chamber 2 APC valve 3 Gate valve 4 Main vacuum pump 5 Gate valve 6 APC valve 7 Gate valve 8 Dry vacuum pump 9 Controller 10 Junction point 11 Vacuum gauge 12 APC valve 13 Vacuum gauge

Claims (3)

ガスを導入する真空チャンバーと、該真空チャンバー内に導入したガスを排気する排気システムであって、
前記真空チャンバー内に導入したガスを排気する主排気ラインを設け、
前記主排気ライン前記真空チャンバー内に導入したガスを排気し且つ所望の圧力に減圧する主真空ポンプを挿入接続すると共に、前記主排気ラインの前記主真空ポンプの吸気側にゲートバルブと第1のアダプティブプレッシャーコントロールバルブを、前記主真空ポンプの排気側に第2のアダプティブプレッシャーコントロールバルブを順次挿入接続して設け、
前記主真空ポンプを任意の回転数で回転させたまま、前記第2のアダプティブプレッシャーコントロールバルブで前記真空チャンバー内圧を所望の圧力に調圧することを特徴とする真空排気システム。
A vacuum chamber for introducing gas, and an exhaust system for exhausting the gas introduced into the vacuum chamber,
A main exhaust line for exhausting the gas introduced into the vacuum chamber is provided,
Is inserted the main vacuum pump for depressurizing connected to the evacuated and desired pressure gas introduced into the vacuum chamber to the main exhaust line, a gate valve and the first to the intake side of the main vacuum pump of the main exhaust line adaptive a pressure control valve, provided the second adaptive pressure control valves are sequentially inserted into and connected to an exhaust side of the main vacuum pump,
An evacuation system characterized in that the internal pressure of the vacuum chamber is adjusted to a desired pressure by the second adaptive pressure control valve while the main vacuum pump is rotated at an arbitrary rotational speed.
ガスを導入する真空チャンバーと、該真空チャンバー内に導入したガスを排気する排気システムであって、
前記真空チャンバー内に導入したガスを排気する主排気ラインを設け、
前記主排気ライン前記真空チャンバー内に導入したガスを排気し且つ所望の圧力に減圧する主真空ポンプを挿入接続すると共に、前記主排気ラインの前記主真空ポンプの吸気側にゲートバルブと第1のアダプティブプレッシャーコントロールバルブを、前記主真空ポンプの排気側に第2のアダプティブプレッシャーコントロールバルブを順次挿入接続して設け、
前記主真空ポンプの回転数を制御する回転数制御手段を設け、
前記第2のアダプティブプレッシャーコントロールバルブの動作と前記回転数制御手段による主真空ポンプの回転数制御により前記真空チャンバー内圧を所望の圧力に調圧することを特徴とする真空排気システム。
A vacuum chamber for introducing gas, and an exhaust system for exhausting the gas introduced into the vacuum chamber,
A main exhaust line for exhausting the gas introduced into the vacuum chamber is provided,
Is inserted the main vacuum pump for depressurizing connected to the evacuated and desired pressure gas introduced into the vacuum chamber to the main exhaust line, a gate valve and the first to the intake side of the main vacuum pump of the main exhaust line adaptive a pressure control valve, provided the second adaptive pressure control valves are sequentially inserted into and connected to an exhaust side of the main vacuum pump,
A rotation speed control means for controlling the rotation speed of the main vacuum pump is provided;
An evacuation system characterized in that the internal pressure of the vacuum chamber is regulated to a desired pressure by the operation of the second adaptive pressure control valve and the rotational speed control of the main vacuum pump by the rotational speed control means.
請求項1又は2に記載の真空排気システムにおいて、
前記主排気ラインの前記第2のアダプティブプレッシャーコントロールバルブの後流側に補助ポンプを設けたことを特徴とする真空排気システム。
The evacuation system according to claim 1 or 2,
An evacuation system according to claim 1 , wherein an auxiliary pump is provided on the downstream side of the second adaptive pressure control valve in the main exhaust line.
JP2000109453A 2000-04-11 2000-04-11 Vacuum exhaust system Expired - Lifetime JP4027564B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000109453A JP4027564B2 (en) 2000-04-11 2000-04-11 Vacuum exhaust system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000109453A JP4027564B2 (en) 2000-04-11 2000-04-11 Vacuum exhaust system

Publications (3)

Publication Number Publication Date
JP2001295761A JP2001295761A (en) 2001-10-26
JP2001295761A5 JP2001295761A5 (en) 2005-01-06
JP4027564B2 true JP4027564B2 (en) 2007-12-26

Family

ID=18622144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000109453A Expired - Lifetime JP4027564B2 (en) 2000-04-11 2000-04-11 Vacuum exhaust system

Country Status (1)

Country Link
JP (1) JP4027564B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100458629C (en) * 2002-11-08 2009-02-04 东京毅力科创株式会社 Fluid treatment device and fluid treatment method
JP2007242521A (en) * 2006-03-10 2007-09-20 Mitsui Eng & Shipbuild Co Ltd How to replace the ion source
CN103426789A (en) * 2012-05-24 2013-12-04 上海宏力半导体制造有限公司 Device capable of detecting leakage state of adaptive pressure controller
CN111322226A (en) * 2018-12-14 2020-06-23 夏泰鑫半导体(青岛)有限公司 Vacuum system and semiconductor processing equipment
CN112530777B (en) * 2019-09-18 2024-09-10 夏泰鑫半导体(青岛)有限公司 Air extraction device and air extraction method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2663549B2 (en) * 1988-09-02 1997-10-15 株式会社日本自動車部品総合研究所 Pressure control method for vacuum equipment
JPH0378982U (en) * 1989-11-30 1991-08-12
JPH0457681U (en) * 1990-09-25 1992-05-18
JPH04326943A (en) * 1991-04-25 1992-11-16 Hitachi Ltd Vacuum exhaust system and exhaust method
JPH0758032A (en) * 1993-08-09 1995-03-03 Hitachi Electron Eng Co Ltd Pressure control device and pressure control method
JP3277209B2 (en) * 1994-06-08 2002-04-22 日本電信電話株式会社 Dry cleaning method for dry etching equipment
JP3247270B2 (en) * 1994-08-25 2002-01-15 東京エレクトロン株式会社 Processing apparatus and dry cleaning method
JPH0969515A (en) * 1995-06-20 1997-03-11 Sony Corp Vacuum processing equipment for semiconductor manufacturing equipment

Also Published As

Publication number Publication date
JP2001295761A (en) 2001-10-26

Similar Documents

Publication Publication Date Title
JP4335469B2 (en) Method and apparatus for adjusting gas circulation rate of vacuum exhaust device
JP3929185B2 (en) Vacuum exhaust apparatus and method
JPH0864578A (en) Semiconductor manufacturing apparatus and method for cleaning semiconductor manufacturing apparatus
JP3501524B2 (en) Vacuum exhaust system for processing equipment
US4835114A (en) Method for LPCVD of semiconductors using oil free vacuum pumps
KR100384907B1 (en) Vacuum device
US6251192B1 (en) Vacuum exhaust system
CN100520503C (en) Vacuum pumping system, driving method thereof, apparatus having the same, and method of transferring substrate by using the system
JP4027564B2 (en) Vacuum exhaust system
JPH07321047A (en) Vacuum processing device
JP4244674B2 (en) Processing apparatus and processing method
JP2001295761A5 (en)
JP4521889B2 (en) Substrate processing equipment
JP3079367B2 (en) Turbo molecular pump
JP3941147B2 (en) Vacuum exhaust apparatus and maintenance method thereof
JPH07145872A (en) Evacuating valve
JP2019081944A (en) Control method of vacuum valve
JP6725389B2 (en) Semiconductor manufacturing equipment
JPH10132141A (en) Conductance adjusting valve and semiconductor manufacturing device
JP2004270653A (en) Vacuum exhaust device
JP3595508B2 (en) Semiconductor manufacturing equipment
WO2005078281A1 (en) Vacuum device
JP2003083248A (en) Evacuation system
JP3558557B2 (en) Vacuum pump and driving method thereof
JP2000243705A (en) Vapor growth method

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20060512

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070306

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070313

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070507

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20070507

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20070529

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20070626

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070626

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20070801

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070911

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070919

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20070919

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20071009

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20071010

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101019

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4027564

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111019

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121019

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131019

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term