JP4030294B2 - IC socket - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC socket, and more particularly to an IC socket used for a surface mount type IC in which bumps are arranged in a matrix on the bottom surface of an IC.
[0002]
[Prior art]
A conventional example will be described with reference to FIGS. FIG. 5 is a diagram showing a partial cross section of a conventional example of an IC socket, FIG. 6 is a diagram showing an enlarged main part of FIG. 5, and FIG. 7 is a diagram showing a state where an IC is mounted on the IC socket.
A plurality of contact electrodes 12 are arranged on the surface of the printed wiring board 11, and the arrangement pitch of the contact electrodes 12 is formed corresponding to the arrangement pitch of the bumps 29 of the IC 28 to be mounted. On the back surface of the printed wiring board 11, terminal electrodes 13 correspondingly connected to the contact electrodes 12 are formed. In this conventional example, the pitch between the terminal electrodes 13 is enlarged as compared with the pitch between the contact electrodes 12. A pin terminal 14 is attached and fixed to the terminal electrode 13, and the pin terminal 14 is electromechanically connected to a burn-in board (not shown) by fitting into a through hole formed therein.
[0003]
A guide plate 15 is disposed on the surface of the printed wiring board 11 on which the contact electrode 12 is formed via an anisotropic conductive sheet 16. The anisotropic conductive sheet 16 exhibits a conductive adhesive action by pressure heating, and the guide plate 15 is bonded and fixed to the printed wiring board 11 through this.
A plurality of through holes 17 made of a conductive material are formed in the guide plate 15, and these through holes 17 are arranged on the contact electrodes 12 in an array. Through-hole electrodes 18 and 19 as shown in FIG. 6 are formed at both ends of each through-hole 17, and the electrode 19 is electrically connected to the opposing contact electrode 12 through the anisotropic conductive sheet 16.
[0004]
A coil contact 21 is accommodated in each through hole 17. One end of the coil contact 21 protrudes from the through hole 17, and the other end is positioned on the anisotropic conductive sheet 16 and fixed to the anisotropic conductive sheet 16, and the contact electrode 12 is opposed to the anisotropic conductive sheet 16. Conducted with. In FIG. 6, the arrow 22 indicates the direction of conduction between the coil contact 21 and the electrode 19 and the contact electrode 12.
A frame 23 accommodates the guide plate 15 and is fixedly attached to the surface of the printed wiring board 11. A recess 24 is formed by the opening provided in the frame 23 and the plate surface of the guide plate 15, and the IC 28 is positioned and accommodated therein.
[0005]
Reference numeral 25 denotes a bearing portion provided at an edge of the frame 23, and a cover (not shown) is rotatably attached around the bearing portion 25. Projections formed on the other edge of the frame 23 26 is locked that hooking the cover.
Here, when the IC 28 is mounted in the concave portion 24 of the socket 27, the coil contact 21 is pressed by the bump 29 of the IC 28, whereby the coil contact 21 can be in good electrical contact with the bump 29 by its elastic restoring force. . In this case, the coil contact 21 is curved by pressing and comes into contact with the inner wall of the through hole 17, and the through hole 17 also operates as a connection conductor between the bump 29 and the contact electrode 12. It plays the role of reducing the electrical resistance value between the two.
[0006]
When the IC 28 is mounted in the recess 24 of the socket 27, the bump 29 of the IC 28 and the contact electrode 12 are electrically connected via the coil contact 21, the through hole 17, and the anisotropic conductive sheet 16. The IC 28 is further connected to the burn-in board from the contact electrode 12 via the printed wiring board 11, the terminal electrode 13, and the pin terminal 14, and finally connected to the IC test apparatus.
[0007]
[Problems to be solved by the invention]
The miniaturization of the IC 28 is rapidly progressing, and the interval between the adjacent bumps 29 has reached a fine pitch of up to 0.5 mm. The frequency of electrical signals handled by the IC 28 is increasing to the order of GHz. In this case, the coil contact 21 that exists between the bump 29 of the IC 28 and the contact electrode 12 and constitutes a part of the transmission path of the electric signal between them has an inductance of the transmission path as the electric signal to be handled becomes higher in frequency. Increase side effects. If the coil contact 21 is replaced by a leaf spring, the inductance between the bump 29 of the IC 28 and the contact electrode 12 can be easily reduced. However, as the IC 28 is downsized, the gap between the bump 29 and the contact electrode 12 can be reduced. The distance is becoming increasingly smaller, and a coil contact made up of a coil spring having a small elastic coefficient must be used as an electric signal transmission path during this period. By replacing this with a leaf spring having a large elastic coefficient, manufacturing dimensional errors between the bumps 29 and the contact electrodes 12 of a large number of ICs 28 cannot be sufficiently absorbed. There is a risk of poor contact between the two.
[0008]
By the way, Japanese Patent Application Laid-Open No. 11-26112 discloses a conventional example corresponding to the pin terminal 14 extended in the previous example to the inside of the coil contact 21. Thereby, although the inductance between the both ends of the coil contact 21 can be reduced, this reduction effect is very slight, and the inductance reduction effect in the high-frequency electric signal reaching the order of GHz is not particularly large. . The electrical signal handled by the IC 28 may be a direct current, and in this case, the influence of the pure resistance indicated by the coil contact 21 cannot be ignored.
[0009]
The present invention eliminates the above-described problem of reducing the inductance and pure resistance of a coil contact existing between a bump and contact electrode of an IC over a high-frequency electrical signal ranging from a DC electrical signal to a GHz order. Is to provide.
[0010]
In an IC socket in which bumps arranged in a matrix on the bottom surface of an IC and pin terminals 14 are electromechanically connected via a coil contact 21, the coil contact 21 tapers the tip of the upper half. The tapered small-diameter coil 211 is wound in the shape of a coil, and the lower half is the large-diameter coil 212. The upper half of the entire length of the pin terminal 14 is tapered, and the coil contacts The coil contact 21 is interposed between the bump and the pin terminal 14 in a state where the taper portion 143 is inserted inside the coil contact 21 and the tapered small diameter coil 211 is formed. as the coil to the tapered portion 143 when the displacement of the coil narrowing divide the tip of the tapered portion 143 is stopped is closely wound-up state, the inner shape of the tapered small-diameter coil 211 and the tapered portion 14 An outer shape of the tip portion is constituted of IC socket to form a tapered diameter coil 211 and the tapered portion 143 on the geometry of the substantially similar shape.
[0011]
Then, according to claim 2: IC socket as set forth in claim 1, tapered small-diameter coil 211 and the tapered portion 143, also crowded divide the tip of the tapered portion 143 to the tape over path shaped small-diameter coil 211 of the tapered portion 143 tip An IC socket formed to have a shape and dimension that does not penetrate through is formed.
Further, in the IC socket according to claim 2, the terminal electrode 141 bulged in the middle part is formed , the pin contact part 142 is formed in the lower half part, and the taper part 143 is formed in the upper half part. The pin guide 14 is provided, and the terminal guide 10 in which the pin terminal insertion holes 101 are formed in a matrix form at the same pitch as the arrangement pitch of the bumps 29 of the IC 28 is provided, and in the matrix form at the same pitch as the arrangement pitch of the bumps 29 of the IC 28. A guide plate 15 having a coil contact insertion hole 151 is provided, through holes 201 are formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28, and a spring insertion hole 204 and a float pin connected to the spring insertion hole 204 are fitted. A float 20 in which a hole 43 is formed; a float spring 45 for biasing the float 20; The pin contact part 142 is inserted into the 10 pin terminal insertion hole 101, the taper part 143 of the pin terminal 14 and the large diameter coil 212 of the coil contact 21 are inserted in this order into the coil contact insertion hole 151 of the guide plate 15, An IC socket in which 20 is assembled to the float pin 44 and the coil contact 21 is configured.
[0012]
[4] The IC socket according to [3], wherein a flexible anisotropic conductive adhesive sheet 50 is interposed between the lower end of the coil contact 21 and the upper surface of the terminal electrode 141 where the pin terminal 14 bulges. IC socket was constructed .
[0013]
DETAILED DESCRIPTION OF THE INVENTION
The embodiments of this invention with reference to the embodiment of FIGS. 1 and 2 will be described. FIG. 1A is a diagram showing a steady state where IC is not measured, and FIG. 1B is a diagram showing a measurement state of IC. FIG. 2 is a diagram illustrating the float pin. In the embodiment, the same reference numerals are given to the members common to the conventional example.
Reference numeral 14 denotes a pin terminal. The pin terminal 14 has a terminal electrode 141 bulged at the middle part thereof, a lower half part as a pin contact part 142, and an upper half part as a taper part 143.
[0014]
A terminal guide 10 has pin terminal insertion holes 101 formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28.
Reference numeral 21 denotes a coil contact, which has a tapered small-diameter coil 211 whose tip is wound in a tapered shape and a large-diameter coil 212 in the lower half. Here, the inner shape of the tapered small diameter coil 211 and the outer shape of the distal end portion of the tapered portion 143 are substantially similar, and the taper portion 143 penetrates even when the distal end of the tapered portion 143 is pressed into the tapered small diameter coil 211. It is formed in the shape and dimension without. Then, the upper half constituting a tapered portion 143 of the pin terminal 14 has a total length not shorter compared to the total length of the coil contact 21.
[0015]
Reference numeral 15 denotes a guide plate, in which coil contact insertion holes 151 are formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28. A terminal electrode recess 152 is formed on the lower surface of the guide plate 15 and accommodates the terminal electrode 141.
Reference numeral 20 denotes a float, and through holes 201 are formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28. The float 20 is biased upward by a float spring 45 and is at a level shown in FIG. 1A in a steady state where the IC 28 is not measured. The float spring 45 is float pin insertion indicated by 44, it is thereto by Ri draft within. 4 indicates a base. Reference numeral 41 denotes a pin terminal coil contact accommodating portion formed through the base 4, and a support rod 42 is formed in the lower portion so as to protrude inward. Float pin fitting holes 43 are formed in the base 4 so as to be spaced apart from each other in the vertical direction. A float pin guide hole 205 is formed in the float 20 corresponding to the float pin fitting hole 43. The float pin 44 is fitted and fixed in the float pin fitting hole 43. A spring insertion hole 204 into which the float spring 45 is inserted and positioned is formed in the float 20.
[0016]
The base 4 is provided with a frame (not shown) that is rotationally engaged with the base 4. During measurement, the IC 28 is rotationally positioned with respect to the opening 206 formed in the float 20 while being held by the frame.
Next, the order of assembling the IC socket will be described.
(1) The terminal guide 10 is placed on the support rod 42 of the pin terminal coil contact accommodating portion 41 of the base 4. Here, the float pin 44 is fitted and fixed in advance to the float pin fitting hole 43.
[0017]
(2) The pin contact portion 142 of the pin terminal 14 is inserted into the pin terminal insertion hole 101 of the terminal guide 10 from above.
(3) The tapered portion 143 of the pin terminal 14 and the large-diameter coil 212 of the coil contact 21 are inserted in this order into the coil contact insertion hole 151 of the guide plate 15, and the guide plate 15 and the coil contact 21 are inserted into the pin terminal 14. Assemble.
(4) Insert the float spring 45 into the float pin 44.
(5) The spring insertion holes 204 and the float pin guide holes 205 of the float 20 are made to correspond to the float pins 44, and the through holes 201 formed in a matrix form of the float 20 are tapered to the coil contacts 21. The float 20 is assembled to the float pin 44 and the coil contact 21 in correspondence with the small diameter coil 211.
[0018]
(6) The assembly of the IC socket is completed through the processes up to (5) above.
Here, a method of measuring the IC will be described with reference to FIG.
The IC 28 is rotationally positioned in the state shown in FIG. 1A with respect to the opening 206 formed in the float 20 while being held by a frame (not shown). When the frame is further rotated and the IC 28 is pressed downward, the lower surface of the IC 28 displaces the float 20 downward while compressing the float spring 45, and the bump 29 of the IC 28 is the upper end of the tapered small diameter coil 211 of the coil contact 21. To come into contact. When the frame is further rotated and the IC 28 is pressed downward, the lower surface of the IC 28 displaces the float 20 downward, while the bump 29 compresses and deforms the coil contact 21 downward, and the tapered small-diameter coil 211 is tapered. When the tapered tip of the portion 143 is fitted and strongly engaged, the displacement of the tapered small-diameter coil 211 is stopped. Here, between the bump 29 of the IC 28 and the pin contact portion 142 of the pin terminal 14, the coil contact 21 is interposed between the bump 29 and the terminal electrode 141 and is strongly pressed against both by the elastic restoring force. Good electrical contact is ensured. The bumps 29 of the IC 28 are in close contact with the tapered portion 143 of the pin terminal 14 via the tapered small diameter coil 211 of the coil contact 21, thereby being brought into a tightly wound state and being substantially pinned with the tapered small diameter coil 211 of the cylindrical body. It is electrically connected to the terminal electrode 141 via the taper portion 143 of the terminal 14, and bridges the portion of the large-diameter coil 212 operating as an elastic coil in the coil contact 21. In the end, there is no portion that operates as an electric coil between the bump 29 of the IC 28 and the pin contact portion 142 of the pin terminal 14, so that the effect of reducing the inductance of the IC socket in a high-frequency electric signal is great. The pure resistance value with the part 142 is also reduced.
[0019]
Here, a modification of the first embodiment will be described with reference to FIGS.
In this modified example, a flexible anisotropic conductive adhesive sheet 50 is joined to the entire lower surface of the guide plate 15 as shown in FIG. 2, and the lower end portion of the coil contact 21 and the terminal electrode in which the pin terminal 14 bulges out. It is interposed between the upper surface of 141. FIG. 2 shows a state in which the IC 28 is pressed downward. In the downward pressed state of the IC 28, the flexible anisotropic conductive adhesive sheet 50 is formed between the lower end portion of the coil contact 21 and the terminal electrode 141 of the pin terminal 14. It is compressed and sandwiched between the upper surface and the electrical connection between the two is ensured. That is, due to manufacturing variations of the coil contact 21 and the pin terminal 14, there may be a case where the mechanical contact between the two is insufficient and proper electrical connection is not ensured, but this mechanical contact is insufficient. Absorption is eliminated by interposing a flexible anisotropic conductive adhesive sheet 50 between them.
[0020]
A second embodiment will be described with reference to FIGS. 3A shows a state before contact, and FIG. 3B shows a contact state at the time of measurement. FIG. 4 is a diagram illustrating the float pin. In the second embodiment, the same reference numerals are assigned to the members common to the first embodiment.
The pin terminal has only one pin terminal 14 in the first embodiment, but in the second embodiment, in addition to the pin terminal 14, the movable pin terminal 14 having substantially the same configuration as this. Use two of '. Correspondingly, a movable pin terminal guide 10 ′ for guiding the movable pin terminal 14 ′ is provided. In the movable pin terminal guide 10 ′, movable pin terminal insertion holes 101 ′ are formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28. The pin terminal 14 is formed as a terminal electrode 141 having a bulged middle portion, the lower half portion is formed in the pin contact portion 142, and the upper half portion is formed in the elastic elongated piece 144 that is easily deformed when a force is applied. . The movable pin terminal 14 ′ has substantially the same configuration as that of the inverted pin terminal 14, the intermediate portion is formed on the bulged terminal electrode 141 ′, the upper half portion is formed on the pin contact portion 142 ′, and The lower half is formed into an elastic strip 144 '. In the second embodiment, the pin terminal 14 and the movable pin terminal 14 ′ are configured such that the diameter of the terminal electrode 141 ′ is slightly smaller than the diameter of the terminal electrode 141 of the pin terminal 14. Become. The coil contact 21 of the second embodiment is composed of a simple-shaped cylindrical coil spring that is wound to the same diameter over the entire length. Here, the total length of the coil contact 21 is slightly larger than the sum of the total length of the elastic strip 144 of the pin terminal 14 and the total length of the elastic strip 144 ′ of the movable pin terminal 14 ′. The float pin of FIG. 4 has the same configuration as the float pin of FIG. 2 described above.
[0021]
Next, how to assemble the second embodiment will be described.
(1) The terminal guide 10 is placed on the support rod 42 of the pin terminal coil contact accommodating portion 41 of the base 4. Here, the float pin 44 is fitted and fixed in advance to the float pin fitting hole 43.
(2) The pin contact portion 142 of the pin terminal 14 is inserted into the pin terminal insertion hole 101 of the terminal guide 10 from above.
(3) The elastic strip 144 of each pin terminal 14 is inserted into each coil contact insertion hole 151 of the guide plate 15, and the guide plate 15 is assembled to the pin terminal 14.
[0022]
(4) The coil contact 21 is inserted into the coil contact insertion hole 151 with the elastic strip 144 positioned inside thereof, and the elastic strip 144 ′ of the movable pin terminal 14 ′ is inserted into the coil contact 21.
(5) Insert the float spring 45 into the float pin 44.
(6) The movable pin terminal insertion holes 101 ′ formed in a matrix of the movable pin terminal guides 10 ′ correspond to the pin contact portions 142 ′ of the respective movable pin terminals 14 ′, and the movable pin terminal guides 10 ′ are in pin contact. It is assembled to the part 142 ′.
[0023]
(7) The spring insertion holes 204 and the float pin guide holes 205 of the float 20 are made to correspond to the float pins 44, and the through holes 201 formed in a matrix of the float 20 are connected to the movable pin terminals 14 ′. The float 20 is assembled to the float pin 44 and the pin contact portion 142 ′ in correspondence with the pin contact portion 142 ′.
The assembly of the second embodiment of the IC socket is completed through the steps up to (7) above.
As in the first embodiment, the IC 28 is rotationally positioned in the state shown in FIG. 3A with respect to the opening 206 formed in the float 20 while being held by a frame (not shown). . When the frame is further rotated and the IC 28 is pressed downward, the lower surface of the IC 28 displaces the float 20 downward while compressing the float spring 45, and the bumps 29 of the IC 28 are formed on the pin contact portion 142 ′ of the movable pin terminal 14 ′. It reaches the upper end. When the IC 28 is further pressed downward by rotating the frame, the lower surface of the IC 28 displaces the float 20 downward, while the bump 29 is coiled via the pin contact portion 142 ′ of the movable pin terminal 14 ′ and the terminal electrode 141 ′. The contact 21 is gradually compressed and displaced downward. As this displacement progresses, the elastic elongated piece 144 ′ of the movable pin terminal 14 ′ contacts the elastic elongated piece 144 of the pin terminal 14, and when both are deformed and strongly engaged, the displacement of the coil contact 21 and the elastic elongated piece are increased. The deformation of the piece 144 'and the elastic elongated piece 144 is stopped.
[0024]
In this case, the coil contact 21 is interposed between the movable pin terminal 14 ′ and the pin terminal 14 between the bump 29 of the IC 28 and the pin contact portion 142 of the pin terminal 14, and is strongly pressed against both by the elastic restoring force. As the pin contact portion 142 ′ of the pin terminal 14 ′ is in strong pressure contact with the bump 29, good electrical contact is ensured. Here, the bumps 29 of the IC 28 are formed so that the elastic elongated piece 144 ′ of the movable pin terminal 14 ′ is in contact with, deformed and strongly engaged with the elastic elongated piece 144 of the pin terminal 14, so that the movable pin terminal 14 ′ of the rod-shaped body is engaged. And the pin terminal 14 are directly connected to the pin contact portion 142, and the bump 29 and the pin contact portion 142 are directly electrically connected without the coil contact 21 operating as an elastic coil. Therefore, the effect of reducing the inductance of the IC socket in the high-frequency electric signal is great, and the pure resistance value between the bump 29 and the pin contact portion 142 is also reduced.
[0025]
Further, as described above, the coil contact 21 of the second embodiment is formed of a coil spring having a simple shape wound to the same diameter over the entire length, so that it can be manufactured easily and inexpensively. However, in the embodiment of FIG. 3, two types of pin terminals 14 and a movable pin terminal 14 ′ are apparently required as pin terminals. However, the terminal electrode 141 ′ has a diameter of the terminal electrode 141 ′. The diameter is substantially the same as that of the diameter. The pin terminal 14 and the movable pin terminal 14 ′ can be made common by changing the design of the diameter of the terminal electrode 141 ′ and the diameter of the terminal electrode 141.
[0026]
Incidentally, also in the second embodiment, a flexible anisotropic conductive adhesive sheet 50 is joined to the entire lower surface of the guide plate 15, and between the lower end portion of the coil contact 21 and the upper surface of the terminal electrode 141 of the pin terminal 14. By interposing, the insufficiency of the mechanical contact between them can be eliminated by interposing a flexible anisotropic conductive adhesive sheet 50 between them.
[0027]
【The invention's effect】
As described above, according to the first embodiment of the present invention, the coil contact 21 is interposed between the bump 29 and the terminal electrode 141 between the bump 29 of the IC 28 and the pin contact portion 142 of the pin terminal 14. In this way, a good electrical contact can be ensured by strongly pressing both of them due to their elastic restoring force. Here, the bumps 29 of the IC 28 are formed so that the tapered small-diameter coil 211 obtained by winding the tip end portion of the coil contact 21 in a tapered shape strongly presses against the tapered tip end of the tapered portion 143 of the pin terminal 14. 211 is a substantially cylindrical body compressed in a tightly wound state, and is electrically connected to the terminal electrode 141 via the small-diameter coil 211 of this substantially cylindrical body and the taper portion 143 of the pin terminal 14, and coil contacts The portion of the large-diameter coil 212 operating as the elastic coil 21 is bridged so that no current flows. Eventually, there is no portion that electrically operates as a coil between the bump 29 of the IC 28 and the pin contact portion 142 of the pin terminal 14. Therefore, the effect of reducing the inductance of the IC socket in a high-frequency electric signal is great. The pure resistance value with the pin contact portion 142 is also reduced.
[0028]
According to the second embodiment, between the bump 29 of the IC 28 and the pin contact portion 142 of the pin terminal 14, the coil contact 21 is interposed between the movable pin terminal 14 ′ and the pin terminal 14, and its elastic recovery is performed. A strong electrical contact is ensured by strongly pressing the two together with the force and by the pin contact portion 142 ′ of the movable pin terminal 14 ′ pressing strongly against the bump 29. Here, the bumps 29 of the IC 28 are formed so that the elastic elongated piece 144 ′ of the movable pin terminal 14 ′ is in contact with, deformed and strongly engaged with the elastic elongated piece 144 of the pin terminal 14, so The pin 29 and the pin contact 14 are directly connected to the pin contact portion 142, and the bump 29 and the pin contact portion 142 are electrically connected without the coil contact 21 operating as a coil. The effect of reducing the inductance of the IC socket in a high-frequency electric signal is great, and the pure resistance value between the bump 29 and the pin contact portion 142 is also reduced.
[0029]
Further, since the coil contact 21 of the second embodiment is composed of a coil spring having a simple shape wound to the same diameter over the entire length, it can be manufactured easily and inexpensively. However, two types of pin terminals 14 and a movable pin terminal 14 ′ are apparently required as pin terminals, but these have a slightly smaller diameter of the terminal electrode 141 ′ than the diameter of the terminal electrode 141 of the pin terminal 14. It is almost the same type that is only configured to have a small diameter. The pin terminal 14 and the movable pin terminal 14 ′ can be made common by changing the design of the diameter of the terminal electrode 141 ′ and the diameter of the terminal electrode 141.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining a first embodiment;
FIG. 2 is a diagram illustrating a first embodiment and a float pin.
FIG. 3 is a diagram for explaining a second embodiment.
FIG. 4 is a diagram illustrating a second embodiment and a float pin.
FIG. 5 illustrates a conventional example.
6 is an enlarged view of a part of FIG.
FIG. 7 is a diagram showing a state where an IC is mounted on an IC socket.
[Explanation of symbols]
14 pin terminal 211 tapered small diameter coil 143 tapered portion 212 large diameter coil 21 coil contact 28 IC
29 Bump

Claims (4)

In an IC socket for electromechanically connecting between bumps and pin terminals arranged in a matrix on the bottom surface of the IC via coil contacts,
The coil contact is a tapered small-diameter coil in which the tip of the upper half is wound in a tapered shape, and the lower half is a large-diameter coil.
It is the upper half of the total length of the pin terminal , the tip is formed in a tapered shape, and has a shorter tapered portion than the total length of the coil contact ,
With the taper portion inserted inside the coil contact, the coil contact is interposed between the bump and the pin terminal,
The inner shape of the tapered small-diameter coil and the outer shape of the distal end of the tapered portion are arranged so that the coil is tightly wound around the tapered portion when the tip of the tapered portion is pressed into the tapered small-diameter coil and the displacement of the coil stops. An IC socket characterized in that a tapered small-diameter coil and a tapered portion are formed in a shape that is substantially similar. In the IC socket according to claim 1,
Tapered small diameter coil and the tapered portion, IC socket, characterized in that also crowded divide the tip of the tapered portion to the tape over path shaped small-diameter coil formed in the absence geometry that penetrate the tip of the tapered portion. In the IC socket according to claim 2,
An intermediate portion and bulged terminal electrode, comprising a pin terminal which is formed a tapered portion on the upper half to form a pin contact portion in the lower half,
A terminal guide having pin terminal insertion holes formed in a matrix at the same pitch as the IC bump arrangement pitch,
A guide plate having coil contact insertion holes formed in a matrix at the same pitch as the IC bump arrangement pitch,
It has a float in which through holes are formed in a matrix with the same pitch as the bump pitch of the IC and a spring insertion hole and a float pin fitting hole communicating with this are formed,
A float spring for biasing the float;
Insert the pin contact part into the pin terminal insertion hole of the terminal guide,
Insert the taper part of the pin terminal and the large diameter coil of the coil contact in this order into the coil contact insertion hole of the guide plate,
An IC socket characterized in that a float is assembled to a float pin and a coil contact. In the IC socket according to claim 3,
An IC socket characterized in that a flexible anisotropic conductive adhesive sheet is interposed between a lower end portion of a coil contact and an upper surface of a terminal electrode in which a pin terminal is expanded.

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