JP4039866B2 - Component recognition processing method for electronic component mounting apparatus and component recognition processing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component recognition processing method of an electronic component mounting apparatus and a component recognition processing apparatus for imaging an electronic component sucked and held by a suction nozzle with a recognition camera and recognizing the position of the electronic component.
[0002]
[Prior art]
In the conventional component recognition processing method of this type, the size of the electronic component is checked based on whether or not the size of the recognized electronic component is within the allowable range based on the size learning value.
[0003]
[Problems to be solved by the invention]
However, if the part dimensions change suddenly, such as when there is a lot change of electronic parts, for example, even if the part library data is correct, it may be out of the allowable value range, resulting in a recognition error. In some cases, recognition processing is performed as (part size defect).
[0004]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to perform recognition processing without causing a recognition abnormality even when the component dimensions change suddenly.
[0005]
[Means for Solving the Problems]
Therefore, according to a first aspect of the present invention, there is provided a component recognition processing method for an electronic component mounting apparatus, in which an electronic component sucked and held by a suction nozzle is imaged by a recognition camera, and the position of the electronic component is recognized and processed. The image is processed to calculate the size of the electronic component, whether the calculated size of the electronic component is within an allowable value range based on the size learning value, and based on the learning value If it is outside the tolerance range, it is determined whether it is within the tolerance range based on the parts library, and if it is within the tolerance range based on the parts library, it is determined whether it is immediately after the occurrence of a component shortage. In the case where it is determined that the part has just expired, the learning value is cleared and it is determined that the recognition is normal .
[0006]
According to a second aspect of the present invention, in the component recognition processing method for an electronic component mounting apparatus, the electronic component picked up and held by the suction nozzle is picked up by the recognition camera, and the position of the electronic component is recognized and processed. processing the image to calculate the size of the electronic component, the size of the calculated the electronic component is determined whether the allowable value range based on the learning value for the size, relative to the said learning value allowable If the value is within the value range, the learning value is calculated and the recognition is determined to be normal. If the value is outside the allowable value range based on the learning value, it is determined whether the value is within the allowable value range based on the component library. If it is within the allowable value range based on the parts library, it is determined whether or not the part has run out. If it is determined that the part has run out , the learning value is cleared and recognized. Is considered normal And, when the component shortage is determined not just been generated, and judging the recognition is normal to calculate the learned value.
[0007]
According to a third aspect of the present invention, there is provided a component recognition processing device of an electronic component mounting apparatus that captures an electronic component sucked and held by the suction nozzle with a recognition camera and recognizes a position of the electronic component, and an image captured by the recognition camera. And calculating a size of the electronic component by processing and a first determination unit that determines whether the size of the electronic component calculated by the calculation unit is within an allowable value range based on a learning value of the size And a second determination that determines whether or not the component is within an allowable value range based on the component library when the first determination unit determines that the value is outside the allowable value range based on the learning value. And a third determination unit that determines whether or not a component shortage has occurred immediately after the second determination unit determines that the component is within an allowable value range based on the component library . According to 3 judgment means If the component shortage is determined to be immediately after the occurrence is characterized by comprising a fourth determination means determines that normal recognition clears the learned value.
[0008]
According to a fourth aspect of the present invention, there is provided a component recognition processing device of an electronic component mounting device that captures an electronic component sucked and held by the suction nozzle with a recognition camera and recognizes the position of the electronic component, and the image captured by the recognition camera. And calculating a size of the electronic component by processing and a first determination unit that determines whether the size of the electronic component calculated by the calculation unit is within an allowable value range based on a learning value of the size When the determination means and the first determination means determine that the value is within the allowable value range based on the learning value, the learning value is calculated and the recognition is determined to be normal. and the second judging means for judging whether or not within the tolerance range relative to the allowable value range and long if the component library, the tolerance range with respect to the parts library by said second judging means determine to be the Third determining means for determining whether or not it is immediately after the component depletion has occurred when it is, clears the learned value if the component shortage is determined to be immediately generated by said third determination means And a fourth determination unit that calculates a learning value and determines that the recognition is normal when it is determined that the recognition is normal and that it is not immediately after the occurrence of a component shortage. .
[0009]
According to a fifth aspect of the present invention, in the first to fourth aspects, an allowable value range based on the part library is manually set .
[0010]
According to a sixth aspect of the present invention, in the first to fourth aspects, an allowable value range based on the part library is automatically set according to a part shape or a part dimension .
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of an electronic component mounting apparatus according to the present invention will be described with reference to the accompanying drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1. A plurality of component supply units 3 for supplying various electronic components one by one to a component take-out portion (component adsorption position) are provided on a base 2 of the apparatus 1. It is installed side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the groups of opposing units 3. The supply conveyor 4 conveys the printed circuit board P received from the upstream to the positioning unit 5, and after the electronic components are mounted on the substrate P positioned by a positioning mechanism (not shown) by the positioning unit 5, the conveyance is conveyed to the discharge conveyor 6. Is done.
[0015]
Reference numeral 8 denotes a beam that is long in the X direction. Each screw shaft 10 is rotated by driving each Y-axis motor 9, and a component take-out portion (component suction position) of the printed circuit board P or the component supply unit 3 is moved along a pair of left and right guides 11. ) Move upward in the Y direction individually.
[0016]
The beam 8 is provided with a mounting head 7 that moves along a guide (not shown) by an X-axis motor 12 in the longitudinal direction, that is, in the X direction. The mounting head 7 is equipped with four vertical axis motors 14 for moving the four suction nozzles 13 up and down, and four θ-axis motors 15 for rotating around the vertical axis. Therefore, the suction nozzles 13 of the four mounting heads 7 can move in the X direction and the Y direction, can rotate around a vertical line, and can move up and down. It should be noted that by providing one θ-axis motor that allows the mounting head to rotate about the vertical line and by providing one vertical motor for moving the mounting head up and down, only the selected suction nozzle is moved up and down as a result. It is also possible.
[0017]
Reference numeral 16 is a recognition camera for recognizing the position of the component, and two electronic cameras are provided. The electronic component is used for recognizing the position of the electronic component with respect to the suction nozzle 13 with respect to the XY direction and the rotation angle. However, it is possible to image two electronic components at the same time. Reference numeral 17 denotes a nozzle stocker for storing nozzles and the like, and a maximum of 10 can be stored, but 8 are stored. The suction nozzle 13 housed in the nozzle stocker 17 and the suction nozzle 13 mounted on the mounting head 7 can be replaced by a replacement device (not shown).
[0018]
FIG. 2 is a control block diagram of the electronic component mounting apparatus 1. For convenience, only one X-axis motor 12, Y-axis motor 9, θ-axis motor 15, and vertical axis motor 14 are illustrated and described below.
[0019]
Reference numeral 20 denotes a control unit that performs overall control of the mounting device 1 and a CPU (mounting control unit) as a determination unit. The CPU 20 is connected to a RAM (Random Access Memory) 22 and a ROM (Read) via a bus line. (Only memory) 23 is connected. The CPU 20 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 23 based on the data stored in the RAM 22.
[0020]
That is, the CPU 20 drives the X-axis motor 12 via the interface 24 and the drive circuit 25, drives the Y-axis motor 9 via the interface 24 and the drive circuit 28, and passes the interface 24 and the drive circuit 32. The drive of the θ-axis motor 15 is further controlled via the interface 24 and the drive circuit 30.
[0021]
The RAM 22 stores mounting data relating to component mounting as shown in FIG. 3, and for each mounting order (step number), the X direction (indicated by X) and the Y direction (indicated by X) in the printed circuit board. Y) and angle (indicated by Z) information, Fdr No. The arrangement number of each component supply unit 3 and electronic component type information, etc. are stored. That is, for example, the arrangement number 101 is the type in which the electronic component is P1. Further, as shown in the component library data of FIG. 4, the RAM 22 stores the component dimensions in the X direction and the Y direction and the allowable values for each component type of each electronic component.
[0022]
A recognition processing unit 33 is connected to the CPU 20 via the interface 24. The recognition processing unit 33 performs recognition processing of an image captured by the recognition camera 16, and the processing result is transmitted to the CPU 20. Sent out. That is, the CPU 20 outputs an instruction to the recognition processing unit 33 so as to perform recognition processing (calculation of misalignment amount, etc.) on an image captured by the recognition camera 16 and receives a recognition processing result from the recognition processing unit 33. is there.
[0023]
Reference numeral 34 denotes a keyboard as data registration means connected to the CPU 20 via the keyboard driver 35 and the interface 24. Reference numeral 36 denotes a monitor for displaying component images and the like. Further, means such as a touch panel may be used instead of the keyboard 34 as the data registration means.
[0024]
FIG. 5 and FIG. 6 show setting screens on the part dimension data tolerance monitor 36 of the part library data, which are set for each type of electronic part, and are displayed as “automatic” or “manual” in FIG. 5 and FIG. If you click the part, it will be changed to either "Automatic" or "Manual", and if it is set to "Automatic", the "Part dimension tolerance X" and "Part dimension tolerance Y" will be shaded The operator cannot set the allowable value, but is automatically set based on a predetermined standard. When the “manual” is set, the operator sets the “part dimension allowable value X” and the “part dimension allowable value Y”. Can be set. This allowable value is stored in the RAM 22 as component library data as shown in FIG.
[0025]
As described above, when “automatic” is set, the allowable value is automatically set based on a predetermined standard. However, it depends on “part shape” such as square and IC, and “part dimension”. It is obtained by the CPU 20 by a predetermined calculation formula. That is, an electronic component having a certain shape is, for example, 60% of the component size. In addition, when “manual” is set, it is used when inheriting data of another electronic component mounting apparatus as it is, or when determining the size of a component or making it more complicated.
[0026]
With the above configuration, the operation will be described with reference to FIGS. First, the printed circuit board P is conveyed from the upstream device to the positioning unit 5 via the supply conveyor 4 by a conveyor (not shown), and is positioned and fixed by the positioning mechanism.
[0027]
Next, the CPU 20 follows the mounting data shown in FIG. 3 stored in the RAM 22, that is, the XY coordinate position to be mounted on the printed circuit board P stored in the RAM 22 for each step number, the rotational angle position and arrangement around the vertical axis. The electronic component to be mounted by the suction nozzle 13 is picked up and taken out from the predetermined component supply unit 3 according to the mounting data in which the number or the like is designated. That is, each mounting head 7 moves so as to be positioned above each component supply unit 3 that stores an electronic component to be mounted. However, in the Y direction, the Y-axis motor 9 is driven by the drive circuit 28 along the pair of guides 11. Then, the beam 8 moves, and in the X direction, the X-axis motor 12 is driven by the drive circuit 25 and the mounting head 7 moves. Since each of the predetermined supply units 3 has already been driven and components can be taken out at the component suction position, the vertical axis motor 14 is driven by the drive circuit 30 and the suction nozzles 13 are lowered and sucked. Take out.
[0028]
Next, each vertical axis motor 14 is driven to raise the nozzle, the beam 8 is moved along the pair of guides 11 in the Y direction, and the mounting head is driven along the guide 11 by driving the X axis motor 12 in the X direction. By moving 7, the mounting head 7 moves to a position above the printed circuit board P. In the middle of this movement, it stops at a position above the recognition camera 16, the recognition camera 16 images the electronic component, and how much the electronic component is attracted and held with respect to the nozzle by the XY direction and the rotation angle. The recognition processing unit 33 processes the image and recognizes the position.
[0029]
At this time, as shown in FIG. 7, each time the electronic component is picked up from each component supply unit 3 and picked up by the recognition camera 16 and image-processed by the recognition processing unit 33, the CPU 20 performs X of the electronic component. The size in the direction and the Y direction is calculated, and the size check starts. This check is performed on the basis of a learning value to be described later. However, until an arbitrary number of samples (for example, set to “5”) is reached, the CPU 20 determines “invalid” and performs on the basis of the component library data.
[0030]
When the arbitrary number of samples (for example, set to “5”) is reached, a component size check is performed based on the learning value, and whether or not the calculated size is within an allowable value range based on the learning value is determined. Is determined by the CPU 20.
[0031]
If the calculated size is within the allowable value range, the process proceeds to the flowchart for calculating the learning value shown in FIG. The method for obtaining the learning value is a method for obtaining the average value from the number of samples of the recent measurement size without considering the maximum value and the minimum value, which will be described in detail below. At that time, first, an area for storing a part size of an arbitrary number of samples (for example, set to “5”) is secured, recognition processing is executed, and if the area is not full, the measured part size is set. If the area is not full at this time, it is normal and the process ends.
[0032]
As described above, the processing is sequentially performed until the area is full. When the area is full, the CPU 20 calculates the total value of the stored component sizes, and further subtracts the maximum value and the minimum value from the total value to calculate the average value. (With the number of samples of “3”) is obtained, and this average value is stored in the RAM 22 as a learning value. From the next time, since the area is full, the oldest data is deleted, the measured component size is substituted into the area, the CPU 20 calculates the total value of the stored component sizes, and further calculates the maximum value from the total value. Then, an average value (with the number of samples of “3”) is obtained by subtracting the minimum value, and this average value is stored in the RAM 22 as a learning value.
[0033]
Therefore, when checking the component size, the size check is performed based on the learning value stored in the RAM 22 and continuously updated, and if the calculated size is within the allowable value range based on the learning value, It moves to the flowchart which calculates a learning value, and it is determined that recognition is normal.
[0034]
If the value is outside the allowable value range based on the learning value, the size is checked based on the part library data. As described above, when it is determined that the value is outside the allowable range based on the learning value, there may be a case where there is a lot change of the electronic parts and the part dimensions change suddenly. If it is OK within the component dimension allowable value range based on the component library data, the learning value is cleared (data for the number of samples “5” is secured again from the next time), and the recognition is determined to be normal. If it is NG outside the part dimension allowable value range based on the part library data, it is determined that the recognition is abnormal and the process ends.
[0035]
If the recognition is normal, each suction nozzle 13 is based on the recognition result from the recognition processing unit 33 by the amount of displacement of each electronic component, and the CPU 20 causes the mounting head to move the beam 8 in the Y direction by driving the Y-axis motor 9. 7 is moved in the X direction by driving the X-axis motor 12, and is rotated by θ by the θ-axis motor 15, so that the rotational angular position about the X, Y direction and the vertical axis is corrected. After this correction, the vertical axis motor 14 is driven, the suction nozzles are lowered, and electronic components are mounted at predetermined positions on the printed circuit board P, and then sequentially mounted in the same manner.
[0036]
Further, if the recognition is abnormal, it is discarded without being mounted on a collection device provided at a predetermined position, and sometimes corrected and used for recycling.
[0037]
Next, the flowchart shown in FIG. 9 will be described for an embodiment in which the learning value is cleared only when the electronic component is out. As described above, the size is checked based on the part library data, and if the size is OK, it is determined whether or not the part outage abnormality has occurred, and if it has occurred, the learning value is cleared and the recognition is normal. It is determined that it is and ends. If it is not immediately after generation, a learning value is calculated, it is determined that recognition is normal, it is determined that recognition is normal, and the process ends. That is, it is possible to reliably determine the recognition abnormality regardless of the occurrence of the component outage abnormality and continue the operation.
[0038]
In order to determine that the electronic component is out, the end detection of the carrier tape containing the electronic component is continuously detected, for example, three times, and the absence of the component is detected by the component absence sensor. That is, the carrier tape is transported by the electronic component supply unit, but it is determined that the tape end has been detected when the detection sensor detects the absence of the carrier tape via the reflector provided on the passage through which the carrier tape passes. However, if this is detected three times in succession, and the component-free sensor detects that no electronic component is sucked and held by the suction nozzle 13, the CPU 20 determines that the electronic component has run out.
[0039]
Although the embodiments of the present invention have been described above, various alternatives, modifications, or variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes examples, modifications or variations.
[0040]
【The invention's effect】
As described above, according to the present invention, the image captured by the recognition camera is processed to calculate the size of the electronic component, and the calculated size of the electronic component is an allowable value range based on the learning value of the size. If it is outside the tolerance range based on the learning value, it is judged whether it is within the tolerance range based on the parts library, and within the tolerance range based on the parts library. If it is, it is determined whether or not it is immediately after the occurrence of a component shortage, and if it is determined that it is immediately after the occurrence of a component failure, the learning value is cleared and it is determined that the recognition is normal. Even when the size of the electronic component is outside the allowable range based on the learning value , the recognition process can be performed without causing a recognition error, and thus, even in the case where a recognition error has been determined so far. It is not recognized as a recognition error. Sometimes will be processed, it is possible to improve the recognition execution accuracy, and reliably determine the recognition error or without occurrence of the component shortage abnormality, it is possible to continue the operation.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus.
FIG. 2 is a control block diagram of the electronic component mounting apparatus.
FIG. 3 is a diagram showing mounting data.
FIG. 4 is a diagram showing component library data.
FIG. 5 is a diagram showing a setting screen for a part dimension allowable value of part library data.
FIG. 6 is a diagram showing a setting screen of a part dimension allowable value of part library data.
FIG. 7 is a flowchart illustrating a component size check.
FIG. 8 is a diagram illustrating a flowchart for calculating a learning value.
FIG. 9 is a diagram illustrating a flowchart of a component size check according to another embodiment.
[Explanation of symbols]
13 Suction nozzle 16 Recognition camera 20 CPU
22 RAM
33 Recognition processing section

Claims (6)

In the component recognition processing method of the electronic component mounting apparatus for imaging the electronic component sucked and held by the suction nozzle with a recognition camera and recognizing the position of the electronic component,
Processing the image captured by the recognition camera to calculate the size of the electronic component,
Determine whether the calculated size of the electronic component is within the allowable range based on the learning value of the size,
If it is outside the allowable value range based on the learning value, it is determined whether it is within the allowable value range based on the parts library ,
If it is within the allowable value range based on the parts library, it is determined whether or not a part shortage has occurred,
If it is determined that the part has just run out, the learning value is cleared and the recognition is determined to be normal.
A component recognition processing method for an electronic component mounting apparatus. In the component recognition processing method of the electronic component mounting apparatus for imaging the electronic component sucked and held by the suction nozzle with a recognition camera and recognizing the position of the electronic component,
Processing the image captured by the recognition camera to calculate the size of the electronic component,
Determine whether the calculated size of the electronic component is within the allowable range based on the learning value of the size,
If the learning value is within the allowable value range based on the learning value, the learning value is calculated and the recognition is determined to be normal. If it is outside the allowable value range based on the learning value, the allowable value is based on the component library. Determine whether it is within the value range,
If it is within the allowable value range based on the parts library, it is determined whether or not a part shortage has occurred,
When it is determined that the part has just run out, the learning value is cleared and the recognition is determined to be normal. When it is determined that the part has not run out immediately, the learning value is calculated and recognized. To determine that it is normal,
A component recognition processing method for an electronic component mounting apparatus. In a component recognition processing device of an electronic component mounting device that captures an electronic component sucked and held by the suction nozzle with a recognition camera and recognizes the position of the electronic component, the image captured by the recognition camera is processed and the electronic Calculating means for calculating the size of the component ; first determining means for determining whether or not the size of the electronic component calculated by the calculating means is within an allowable value range based on a learning value of the size; and Second determination means for determining whether or not it is within an allowable value range based on the component library when it is determined by one determination means to be outside the allowable value range based on the learning value; A third determination unit that determines whether or not a component shortage has occurred immediately after being determined by the determination unit to be within an allowable value range based on the component library; Out of stock Component recognition processing device of the electronic component mounting apparatus characterized by comprising a fourth determination means determines that normal recognition clears the learned value when the the was determined to be just. In a component recognition processing device of an electronic component mounting device that captures an electronic component sucked and held by the suction nozzle with a recognition camera and recognizes the position of the electronic component, the image captured by the recognition camera is processed and the electronic Calculating means for calculating the size of the component; first determining means for determining whether or not the size of the electronic component calculated by the calculating means is within an allowable value range based on a learning value of the size; and When the determination unit 1 determines that the value is within the allowable value range based on the learning value, the learning value is calculated and the recognition is determined to be normal, and the value is outside the allowable value range based on the learning value. If so, a second determination unit that determines whether the component library is within a tolerance range, and the second determination unit determines that the component library is within a tolerance range that is based on the component library. in the case Third determination means for determining whether or not the product is out of stock, and when the third determination means determines that the product has been out of stock, the learning value is cleared and the recognition is normal. An electronic component mounting apparatus comprising: a fourth determination unit that determines that there is a component and determines that it is not immediately after the occurrence of component failure, and calculates a learning value to determine that the recognition is normal Component recognition processing device. 5. The component recognition processing method for an electronic component mounting apparatus or the component recognition processing apparatus for an electronic component mounting apparatus according to claim 1, wherein an allowable value range based on the component library is manually set . 5. The component recognition processing method for electronic component mounting apparatus or electronic component mounting according to claim 1, wherein an allowable range based on the component library is automatically set according to the shape of the component or the size of the component. Device part recognition processing device.

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