JP4041609B2 - Electronic component testing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component testing apparatus for testing various electronic components (hereinafter, referred to as ICs) such as semiconductor integrated circuit elements, and more particularly to suppressing the self-heating of electronic components during testing. The present invention relates to an electronic component testing apparatus capable of preventing damages and performing a test at an accurate temperature.
[0002]
[Prior art]
In the manufacturing process of a semiconductor device or the like, a test apparatus for testing an electronic component such as an IC chip finally manufactured is required. As one type of such a test apparatus, an apparatus for testing an IC chip under normal temperature, a temperature condition higher or lower than normal temperature is known. This is because, as a characteristic of the IC chip, it is necessary to ensure that it operates well even at room temperature, high temperature or low temperature.
[0003]
In this type of electronic component testing apparatus, the upper part of the test head is covered with a chamber to form a sealed space, the interior of the chamber is kept at a constant temperature environment such as normal temperature, high temperature or low temperature, and the IC chip is mounted on the test head. Then, the IC chip is pressed against the test head and electrically connected thereto to perform the test. By such a test, the IC chip is well tested and classified into at least a good product and a defective product.
[0004]
[Problems to be solved by the invention]
However, with the recent increase in the speed and integration of IC chips, the amount of self-heating during operation tends to increase, and this amount of self-heating tends to increase even during testing. For example, some types of IC chips generate self-heating of 30 watts.
[0005]
For this reason, for example, when a high temperature test of about 125 ° C. is performed, the amount of heat due to self-heating is applied to the IC chip in addition to this amount of heat, which may cause the temperature of the IC chip to exceed its allowable limit. Further, even in the normal temperature test and the low temperature test, even if the inside of the chamber is maintained at a constant temperature, the self-heating amount of the IC chip is generated, so that it becomes difficult to perform the test at the target test temperature.
[0006]
The present invention has been made in view of such problems of the prior art, and it is possible to prevent the electronic components from being damaged by suppressing the self-heating of the electronic components during the test and to perform the test at an accurate temperature. An object of the present invention is to provide an electronic component testing apparatus that can be used.
[0007]
[Means for Solving the Problems]
(1) In order to achieve the above object, an electronic component testing apparatus according to the present invention performs testing by pressing terminals of a plurality of electronic components to be tested against a contact portion of a test head while being mounted on a tray. In the above, the contact portion is provided so as to be movable toward and away from the contact portion.Lead pusher base andA pusher base, and a pusher block that is provided integrally with or separately from the pusher base and that contacts and presses the electronic device under test from the opposite surface of the contact portion;An elastic body for applying an elastic force to the pusher block in the pressing direction of the electronic device under test;A heat absorbing / dissipating body provided on the pusher block.The elastic body and the heat absorbing / dissipating body are arranged between the lead pusher base and the pusher base so as not to overlap when viewed from the pressing direction of the pusher block.It is characterized by that.
[0008]
In the electronic device test apparatus of the present invention, the pusher block that contacts the electronic device under test is provided with a heat absorbing / dissipating body, so that the self-heating of the electronic device under test is absorbed by the heat absorbing / dissipating material and the surrounding environment from here Will run away. As a result, it is possible to prevent destruction or damage of electronic components due to overheating, which is a problem particularly in high-temperature tests.
[0009]
In addition to the high temperature test, the temperature rise due to self-heating is suppressed by the heat absorbing / dissipating effect of the heat absorbing / dissipating body, so that the test can be performed at the target accurate temperature, and the reliability of the test result is improved.
[0010]
Although it does not specifically limit as a heat absorption / radiation body which concerns on this invention, It is preferable to use the heat sink comprised from the metal etc. which were excellent in thermal conductivity, and in which the radiation fin etc. were formed.
[0011]
(2) In the electronic component testing apparatus of the present invention, the form in which the electronic device under test is transported to the contact portion is a type in which the electronic device under test is pressed against the contact portion while being mounted on the tray. In order to simultaneously measure the electronic devices under test, a large number of electronic devices under test are pressed at the same time, so that the periphery of the electronic devices under test becomes overcrowded and heat tends to be trapped. Therefore, it is more preferable that the present invention is applied to an electronic component testing apparatus of a type in which the electronic device under test is pressed against the contact portion while being mounted on the tray.
[0012]
(3) In the above invention, the pusher block may be configured integrally with the pusher base or may be configured separately. However, in the electronic component testing apparatus according to claim 2, the pusher block is connected to the pusher base. Is composed of a separate body.
[0013]
In the electronic component testing apparatus of the present invention, when the terminal of the electronic device under test is pressed against the contact portion of the test head, the pusher base is brought close to the contact portion, and the electronic device under test is pressed toward the contact portion by the pusher block.
[0014]
At this time, the positional relationship between the pusher base and the contact portion is regulated to a reference dimension by a mechanical mechanism such as a stopper or an electric mechanism such as an electric motor, but there is an error in the positional relationship between the pusher base and the contact portion. If it occurs, the pusher block absorbs the error while applying an elastic force to the electronic device under test by the elastic body. Therefore, it is possible to prevent an excessive pressing force from acting on the electronic device under test or, conversely, insufficient pressing force. In other words, in the electronic component testing apparatus of the present invention, the pressure applied to the electronic device under test is made uniform by managing the load by the pusher block rather than managing the stroke of the pusher.
[0015]
The elastic body according to the present invention is not particularly limited, and various elastic bodies such as coil springs and actuators can be used. Moreover, the said elastic body can be provided also in another site | part other than providing in a pusher base.
[0016]
The main errors that occur in the positional relationship between the pusher base and the contact portion are the thickness ΔX of the electronic device under test itself, the manufacturing dimension ΔY between the pusher-side stopper and the pusher surface, and the contact-side stopper and contact pin tip As described, the integrated amount of ΔX to ΔZ usually rises to about ± 0.1 to ± 0.2 mm. However, for example, when a coil spring is used as an elastic body, even if an error of ± 2 mm occurs, the error of the pressing force acting on the electronic device under test is, for example, ± 3 gf / 1ball with respect to a reference load of 25 gf / 1ball. There is no problem of overload or underload.
[0017]
(3) The elastic body according to the present invention is not particularly limited, but it is more preferable that the elastic force is variable.
The variable elastic force means that the elastic force in the pressing direction of the part under test applied to the pusher block can be changed, and the specific means is not particularly limited.
[0018]
For example, changing the elastic force by exchanging multiple types of elastic bodies having different elastic coefficients, or changing the basic length of the elastic body using the same elastic body, etc. Is mentioned.
[0019]
By making the elastic force of the elastic body variable, even if the reference load (pressing force) fluctuates according to the test conditions of the electronic device under test, it can respond flexibly to this, and the versatility of the electronic component test equipment Becomes higher.
[0020]
(4) The heat absorbing / dissipating body according to the present invention is not particularly limited,Seen from the pressing direction by the pusher block,It can be provided between the elastic bodies or on both sides of the elastic bodies.Lead pusher baseWhenPusher baseBy efficiently disposing the elastic body and the heat absorbing / dissipating body between the two, the apparatus can be reduced in size.
[0021]
(5) The electronic device under test applied in the present invention is not particularly limited and includes all types of electronic components. However, when applied to an IC or the like that has a very large amount of self-heating during operation, the effect is particularly remarkable. .
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing an embodiment of an electronic component testing apparatus of the present invention, FIG. 2 is a flowchart of a tray showing a method of routing an IC under test, and FIG. 3 is a part showing a test tray used in the electronic component testing apparatus. FIG.
[0023]
Note that FIG. 2 is a diagram for understanding the method of routing the IC under test in the electronic component testing apparatus of this embodiment, and actually shows the members arranged side by side in the vertical direction in plan view. There is also a part. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.
[0024]
The electronic component test apparatus 1 according to the present embodiment tests (inspects) whether or not the IC properly operates in a state where high or low temperature stress is applied to the IC under test, and classifies the IC according to the test result. The operation test in a state in which such temperature stress is applied is performed from a tray (hereinafter also referred to as a customer tray KST, not shown) on which a large number of ICs to be tested are mounted. The test is performed by replacing the IC under test on the test tray TST (see FIG. 3) conveyed in the component testing apparatus 1.
[0025]
For this reason, as shown in FIGS. 1 and 2, the electronic component testing apparatus 1 of the present embodiment stores ICs to be tested to be tested from now on, and also classifies and stores tested ICs. Then, the loader unit 300 for sending the IC under test sent from the IC storage unit 200 to the chamber unit 100, the chamber unit 100 including the test head, and the ICs that have been tested in the chamber unit 100 are classified and taken out. The unloader part 400 is comprised.
[0026]
IC storage unit 200
The IC storage unit 200 is provided with a pre-test IC stocker 201 that stores ICs to be tested before testing, and a tested IC stocker 202 that stores ICs to be tested classified according to the test results.
[0027]
Each of the pre-test IC stocker 201 and the tested IC stocker 202 includes a frame-like tray support frame 203 and an elevator 204 that enters from the lower part of the tray support frame 203 and can move up and down. It is configured. A plurality of customer trays KST are stacked and supported on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204.
[0028]
The pre-test IC stocker 201 holds and holds the customer trays KST storing the ICs to be tested, and the tested IC stocker 202 holds the ICs to be tested. Are stacked and held in a customer tray KST appropriately classified.
[0029]
Since the pre-test IC stocker 201 and the tested IC stocker 202 have the same structure, the numbers of the pre-test IC stocker 201 and the tested IC stocker 202 are appropriately set as necessary. be able to.
[0030]
In the example shown in FIG. 1 and FIG. 2, two stockers STK-B are provided in the pre-test stocker 201, and two empty stockers STK-E to be sent to the unloader unit 400 are provided next to the stocker STK-B. Eight stockers STK-1, STK-2,..., STK-8 are provided in 202, and are configured to be classified into a maximum of eight categories according to the test results and stored. That is, in addition to good products and defective products, the non-defective products are classified into high-speed, medium-speed, low-speed, or defective products that require retesting.
[0031]
Loader unit 300
The above-described customer tray KST is carried from the lower side of the device substrate 105 to the window portion 306 of the loader unit 300 by the tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105. In the loader unit 300, the ICs to be tested loaded on the customer tray KST are once transferred to a precursor 305 by the XY transport device 304, where the mutual positions of the ICs to be tested are corrected. Further, the IC under test transferred to the precursor 305 is transferred again to the test tray TST stopped at the loader unit 300 by using the XY transport device 304 again.
[0032]
As shown in FIG. 1, an IC transfer device 304 that reloads ICs to be tested from the customer tray KST to the test tray TST includes two rails 301 installed on the upper part of the device substrate 105, and the two rails 301. , The movable arm 302 that can reciprocate between the test tray TST and the customer tray KST (this direction is the Y direction), and is supported by the movable arm 302 and can move in the X direction along the movable arm 302. And a movable head 303.
[0033]
A suction head is mounted on the movable head 303 of the XY transport device 304 so that the IC under test is sucked from the customer tray KST by moving the suction head while sucking air. The IC under test is transferred to the test tray TST. For example, about eight such suction heads are attached to the movable head 303, and eight ICs to be tested can be transferred to the test tray TST at a time.
[0034]
Chamber portion 100
The test tray TST described above is loaded into the chamber portion 100 after the ICs to be tested are loaded by the loader unit 300, and each IC under test is tested in a state of being mounted on the test tray TST.
[0035]
The chamber section 100 includes a constant temperature bath 101 that applies a target high or low temperature thermal stress to the IC under test loaded on the test tray TST, and the IC under test that has been subjected to the thermal stress in the constant temperature bath 101. The test chamber 102 is brought into contact with the test head, and a heat removal tank 103 for removing a given thermal stress from the IC under test tested in the test chamber 102.
[0036]
In the heat removal tank 103, when a high temperature is applied in the thermostatic chamber 101, the IC under test is cooled by blowing to return to room temperature, and when a low temperature of, for example, about −30 ° C. is applied in the thermostatic chamber 101, The IC is heated with warm air or a heater to return it to a temperature at which no condensation occurs. Then, the IC under test with the heat removed is carried out to the unloader unit 400.
[0037]
As conceptually shown in FIG. 2, the constant temperature bath 101 is provided with a vertical transfer device, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 102 is empty. To do. Mainly during this standby, high or low temperature thermal stress is applied to the IC under test.
[0038]
A test head 104 is arranged at the center of the test chamber 102, and a test tray TST is carried on the test head 104, so that the input / output terminal HB of the IC under test is electrically connected to the contact pin 51 of the test head 104. The test is performed by contacting. On the other hand, the test tray TST for which the test has been completed is removed by the heat removal tank 103, and after the temperature of the IC is returned to room temperature, it is discharged to the unloader section 400.
[0039]
Further, a test tray transfer device 108 is provided on the apparatus substrate 105, and the test tray TST discharged from the heat removal tank 103 by the test tray transfer device 108 is transferred to the thermostatic chamber 101 via the unloader unit 400 and the loader unit 300. Will be returned.
[0040]
FIG. 3 is an exploded perspective view showing the structure of the test tray TST used in the present embodiment. In this test tray TST, a plurality of crosspieces 13 are provided on the rectangular frame 12 in parallel and at equal intervals, and a plurality of mounting pieces 14 are provided on both sides of the crosspiece 13 and on the side 12a of the frame 12 facing the crosspiece 13 respectively. Are projected at equal intervals. An insert storage portion 15 is configured by the space between these bars 13, between the bars 13 and the side 12 a, and the two attachment pieces 14.
[0041]
Each insert storage portion 15 stores one insert 16, and this insert 16 is attached to two attachment pieces 14 in a floating state using fasteners 17. For this purpose, attachment holes 21 for attachment pieces 14 are formed at both ends of the insert 16. For example, about 16 × 4 inserts 16 are attached to one test tray TST.
[0042]
Each insert 16 has the same shape and the same dimensions, and the IC under test is accommodated in each insert 16. The IC accommodating portion 19 of the insert 16 is determined according to the shape of the IC under test to be accommodated, and is a rectangular recess in the example shown in FIG.
[0043]
Here, if the IC under test connected to the test head 104 at one time is an IC under test arranged in 4 rows × 16 columns as shown in FIG. Test ICs are tested simultaneously. That is, in the first test, 16 ICs to be tested arranged every fourth row from the first row are connected to the contact pins 51 of the test head 104, and in the second test, the test tray TST is set. The ICs to be tested are moved in the same row and arranged every fourth row from the second row in the same manner, and this is repeated four times to test all the ICs to be tested. However, the present invention is not limited to this, and it is not necessary to mount the inserts 16 in all columns and rows, and the mounting positions of the inserts 16 can be selected according to test specifications. The result of this test is stored in an address determined by, for example, the identification number assigned to the test tray TST and the number of the IC under test assigned inside the test tray TST.
[0044]
4 is an exploded perspective view showing the structure of the socket 50 having the pusher 30, the insert 16 (test tray TST side), the socket guide 40 and the contact pin 51 in the test head 104 of the electronic component testing apparatus 1. FIG. 6 is a cross-sectional view taken along line VV in FIG. 6. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 4 (both FIGS. 5 and 6 show the state where the pusher 30 is lowered in the test head 104). FIG. 8 is a perspective view showing an example of the plate 61, and FIG.
[0045]
As shown in FIG. 8, a Z-axis drive device 60 is provided on the upper side of the test head 104, and moves up and down in the Z-axis direction by, for example, a fluid pressure cylinder. A match plate 61 shown in FIG. 7 is attached to the lower side of the Z-axis drive device 60. The match plate 61 is supported by the Z-axis drive device 60 so as to move up and down together with the Z-axis drive device 60. Yes.
[0046]
The match plate 61 is provided with pushers 30 shaped according to the specifications of the IC under test according to the interval of the IC under test to be tested at one time as shown in FIG.
[0047]
4 and 5 show one pusher 30. The pusher 30 is attached to the above-described match plate 16 and moves up and down in the Z-axis direction together with the Z-axis drive device 60. The pusher base 34 has pusher blocks 31 attached to the pusher base 34 via two springs 36 (corresponding to the elastic body of the present invention).
[0048]
As shown in FIG. 5, the lead pusher base 35 and the pusher base 34 are fixed by bolts. On both sides of the pusher base 34, there are guide holes 20 of the insert 16 and guide bushes 41 of the socket guide 40, which will be described later. A guide pin 32 to be inserted is provided. The pusher base 34 is provided with a stopper guide 33 for restricting the lower limit when the pusher base 34 is lowered together with the Z-axis drive device 60. The stopper guide 33 is a stopper of the socket guide 40. By contacting the surface 42, the reference dimension of the lower limit position of the pusher that is pressed with an appropriate pressure that does not destroy the IC under test is determined.
[0049]
As shown in FIGS. 5 and 6, the pusher block 31 is made of, for example, aluminum or copper, and is inserted into a through hole formed in the center of the pusher base 34. 36 and shims (not shown) are interposed as required. The springs 36 and 36 are compression springs (elastic bodies) that urge the pusher block 31 downward (in the direction toward the IC under test) in the drawing, and have an elastic coefficient corresponding to the reference load applied to the IC under test. .
[0050]
In addition, the shim attached as necessary together with the spring 36 adjusts the reference length in the attached state of the spring 36 and adjusts the initial load acting on the pusher block 31. That is, even when the spring 36 having the same elastic coefficient is used, the initial load acting on the pusher block 31 is increased by interposing the shim. Since it is sufficient that the reference length of the spring 36 can be adjusted, the shim is interposed between the spring 36 and the pusher block 31 or between the lead pusher base 35 and the spring 36.
[0051]
On the upper surface of the pusher block 31 between the two springs 36, 36, for example, an aluminum heat sink 38 (corresponding to the heat absorbing / dissipating body of the present invention) excellent in thermal conductivity is fixed. The heat sink 38 is in contact with the upper surface of the pusher block 31 on a flat surface, and a heat radiating fin having a large surface area is formed on the opposite surface. The pusher block 31 is made of aluminum or copper having excellent thermal conductivity and directly contacts the IC under test. Therefore, the pusher block 31 absorbs the self-heating of the IC generated during the test as it is, but the heat transmitted to the pusher block 31 is absorbed. By absorbing heat with the heat sink 38 and dissipating heat from the radiation fins to the surroundings, destruction or damage due to self-heating of the IC or fluctuations in temperature conditions can be prevented.
[0052]
As described with reference to FIG. 3, the insert 16 is attached to the test tray TST using the fastener 17, and the guide pin 32 of the pusher 30 and the guide bush 41 of the socket guide 40 described above are provided on both sides thereof. A guide hole 20 is formed to be inserted from above and below. Although detailed illustration is omitted, for example, the left half of the guide hole 20 is a small diameter hole in which the upper half is inserted into the guide pin 32 of the pusher base 34 and the lower half is the guide bush 41 of the socket guide 40. It is a large-diameter hole that is inserted and positioned. Incidentally, in FIG. 5, the right guide hole 20, the guide pin 32 of the pusher base 34, and the guide bush 41 of the socket guide 40 are loosely fitted.
[0053]
As shown in FIGS. 4 and 5, an IC accommodating portion 19 is formed at the center of the insert 16, and the IC under test is loaded on the test tray TST by dropping the IC under test here. Become.
[0054]
On the other hand, two guide pins 32 of the pusher base 34 are inserted on both sides of the socket guide 40 fixed to the test head 104, and guide bushes 41 for positioning between the two guide pins 32 are provided. The left side of the guide bush 41 is also positioned with respect to the insert 16.
[0055]
A socket 50 having a plurality of contact pins 51 is fixed to the lower side of the socket guide 40, and the contact pins 51 are urged upward by a spring (not shown). Therefore, even if the IC under test is pressed, the contact pins 51 are retracted to the upper surface of the socket 50, while the IC pins 51 can be contacted with all IC terminals even when the IC under test is pressed with a slight inclination. It has become.
[0056]
Unloader unit 400
The unloader unit 400 is also provided with XY transport devices 404 and 404 having the same structure as the XY transport device 304 provided in the loader unit 300. The XY transport devices 404 and 404 allow the unloader unit 400 to Tested ICs are transferred from the test tray TST carried out to the customer tray KST.
[0057]
As shown in FIG. 1, the device substrate 105 of the unloader unit 400 has a pair of windows 406 and 406 arranged so that the customer tray KST carried to the unloader unit 400 faces the upper surface of the device substrate 105. Two pairs have been established.
[0058]
Although not shown, an elevating table for elevating and lowering the customer tray KST is provided below each window 406. Here, the tested ICs to be tested are reloaded and become full. The customer tray KST is loaded and lowered, and the full tray is transferred to the tray transfer arm 205.
[0059]
Incidentally, in the electronic component test apparatus 1 of the present embodiment, although the maximum number of categories that can be sorted is eight, only a maximum of four customer trays KST can be arranged in the window 406 of the unloader unit 400. In order to compensate for this, a buffer unit 405 is provided between the test tray TST of the unloader unit 400 and the window unit 406, and the IC under test in a category that rarely occurs is temporarily stored in the buffer unit 405. Yes.
[0060]
Next, the operation will be described.
In the test process in the chamber portion 100, the IC under test is mounted on the test tray TST shown in FIG. 3, more specifically, each IC under test is dropped into the IC accommodating portion 19 of the insert 16 shown in FIG. It is conveyed to the upper part of the test head 104 in the state of being inserted.
[0061]
When the test tray TST stops at the test head 104, the Z-axis drive device 60 starts to descend, and one pusher 30 descends relative to one insert 16. At this time, in the example shown in FIG. 8, one pusher 30 is pressed by two pressing portions 62. The two guide pins 32, 32 formed on the lower surface of the pusher base 34 penetrate the guide holes 20, 20 of the insert 16, respectively, and are fitted into the guide bushes 41, 41 of the socket guide 40.
[0062]
This state is shown in FIGS. 5 and 6, and the insert 16 and the pusher 30 have a certain positional error with respect to the socket 50 and the socket guide 40 fixed to the test head 104 (that is, the electronic component test apparatus 1 side). However, when the guide pin 32 on the left side of the pusher base 34 is fitted into the small diameter hole of the guide hole 20 of the insert 16, the pusher 30 and the insert 16 are aligned with each other. The pusher block 31 attached to the can push the IC under test at an appropriate position in the XY direction.
[0063]
In addition, the large diameter hole of the left guide hole 20 of the insert 16 is fitted into the left guide bush 41 of the socket guide 40, whereby the insert 16 and the socket guide 40 are aligned, whereby the device under test is tested. The positional accuracy of the IC and the contact pin 51 in the XY direction is increased.
[0064]
Further, when the IC under test held in the IC accommodating portion 19 of the insert 16 is pressed by the pusher 30, it is called and positioned (posture correction) by the device guide 52 provided in the socket 50 or the socket guide 40. Therefore, the alignment of the input / output terminals and the contact pins 51 in the XY direction can be realized with high accuracy.
[0065]
On the other hand, in the Z-axis direction, the load acting on the IC under test when the stopper guide 33 of the pusher base 34 and the stopper surface 42 of the socket guide 40 come into contact becomes a problem. If it is too small, it becomes impossible to test. Therefore, it is necessary to accurately create the distance Y in the Z-axis direction between the stopper guide 33 of the pusher base 34 and the pusher block 31 and the distance Z in the Z-axis direction between the contact pin 51 and the stopper surface 42 of the socket guide 40. However, there is a limit to this, and the thickness X of the IC under test itself has a great influence.
[0066]
However, the electronic component testing apparatus 1 of the present embodiment equalizes the pressing force on the IC under test by managing the load applied by the pusher block 31 rather than managing the stroke of the pusher. Even when errors ΔX, ΔY, ΔZ occur in X, Y, Z, the pusher block 31 absorbs these errors while applying an elastic force to the IC under test by the action of the springs 36, 36. Therefore, it is possible to prevent an excessive pressing force from acting on the IC under test, or conversely, insufficient pressing force.
[0067]
In addition to such load management, since the heat sink 38 is provided in the pusher base 31 in this embodiment, even if the IC self-heats during the test, it is absorbed by the heat sink 38 and from here to the surrounding environment. Since it escapes, it is possible to prevent destruction or damage of the IC due to overheating, which is a problem particularly in high temperature tests. Further, not only the high temperature test but also the temperature rise due to self-heating is suppressed by the heat absorbing and radiating effect of the heat sink 38, so that the test can be performed at the target accurate temperature and the reliability of the test result is improved.
[0068]
Moreover, as shown in FIGS. 4, 5, and 8, in the test chamber 102 of this example, the wind direction works well with respect to the heat sink 38, so that the heat dissipation is further improved.
[0069]
Other embodiments
The present invention is not limited to the above-described embodiments, and can be variously modified. 9 is an exploded perspective view (corresponding to FIG. 4) showing another embodiment of the present invention, FIG. 10 is a perspective view showing an example of the match plate 61 of the embodiment, and FIG. 11 is inside the test chamber 102 of the embodiment. It is sectional drawing which shows this structure.
[0070]
In this example, the number of ICs measured in the test head is different, and accordingly, the shapes of the match plate 61 and the pusher 30 are different. Further, the shape of the heat sink 38 provided on the pusher base 31 is different.
[0071]
That is, the match plate 61 of the above-described embodiment has 2 rows × 8 columns, whereas in this example, the match plate 61 has 4 rows × 8 columns as shown in FIGS. 10 and 11. For this reason, since one pusher 30 shown in FIG. 9 needs to be about half the size shown in FIG. 4, heat sinks 38 are provided on both sides of one spring 36.
[0072]
Also in this embodiment, the pusher block 31 is made of aluminum or copper having excellent thermal conductivity, and directly contacts the IC under test. Therefore, the pusher block 31 directly absorbs the self-heating of the IC generated during the test, The transmitted heat is absorbed by the heat sink 38 and is dissipated from the radiation fins to the surroundings, so that destruction or damage due to self-heating of the IC or fluctuations in temperature conditions can be prevented.
[0073]
FIG. 12 is an exploded perspective view (corresponding to FIG. 4) showing still another embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG.
[0074]
In this example, the position of the pusher block 31 is fixed with respect to the pusher base 34, and springs 36 and 36 are interposed between the pressing portion 35 a of the lead pusher base 35 and the pusher base 34 instead. That is, the pressing portion 35 a is movable in the Z-axis direction with respect to the lead pusher base 35. At the bottom dead center of the Z-axis drive device 60, the stopper guide 33 of the pusher base 34 and the stopper surface 42 of the socket guide 40 are not in contact with each other. Positioning is performed by contacting the frame of the shaft driving device 60 with the stopper post 104a of the test head.
[0075]
Therefore, when the Z-axis driving device 60 is lowered and the pressing portion 62 of the lead pusher base 35 is pressed by the pressing portion 62, the IC receives an upward force from the contact pin 51 and a downward force by the spring 36. In other words, by adjusting the balance between the two, the load acting on the IC can be adjusted to an appropriate value.
[0076]
In such an embodiment, since the pusher block 31 can be formed integrally with the pusher base 34, it is preferable to mount the heat sink 38 on the top surface of the pusher base 34. As a result, the IC self-heating generated during the test is transmitted to the heat sink 38 via the pusher block 31 and the pusher base 34, and is radiated from there to the surroundings. Variations can be prevented.
[0077]
In particular, in the present embodiment, since the members having a large heat capacity such as the pusher block 31 and the pusher base 34 are in contact with the IC, even an IC having a remarkably large self-heat generation amount can sufficiently dissipate heat.
[0078]
The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.
[0079]
For example, an appropriate temperature management can be realized by interposing a Peltier element between the pusher block 31 and the heat sink 38 and causing a current in a predetermined direction to flow through the Peltier element in accordance with the IC temperature.
[0080]
【The invention's effect】
As described above, according to the present invention, the self-heating of the electronic device under test is absorbed by the heat sink and escapes to the surrounding environment. Breakage or damage can be prevented.
[0081]
In addition to the high temperature test, the temperature rise due to self-heating is suppressed by the heat absorbing / dissipating effect of the heat absorbing / dissipating body, so that the test can be performed at the target accurate temperature, and the reliability of the test result is improved.
[0082]
In addition, according to the invention of claim 2, since the stroke of the pusher is not managed, but the load by the pusher is managed, the pressing force on the electronic device under test is made uniform, and the electronic device under test is It is possible to prevent an excessive pressing force from acting or a pressing force from becoming insufficient.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of an electronic device test apparatus according to the present invention.
2 is a flow chart of a tray showing a method of routing an IC under test in the electronic component testing apparatus of FIG. 1. FIG.
3 is a partially exploded perspective view showing a test tray used in the electronic component testing apparatus of FIG. 1; FIG.
4 is an exploded perspective view showing structures of a pusher, an insert (test tray), a socket guide, and a contact pin (contact part) in the test head of FIG. 1. FIG.
5 is a cross-sectional view taken along line VV in FIG.
6 is a cross-sectional view taken along line VI-VI in FIG.
FIG. 7 is a perspective view showing an example of a match plate.
FIG. 8 is a cross-sectional view showing the structure inside the test chamber.
FIG. 9 is an exploded perspective view (corresponding to FIG. 4) showing another embodiment of the present invention.
10 is a perspective view showing an example of the match plate of the embodiment shown in FIG. 9. FIG.
11 is a cross-sectional view showing a structure inside the test chamber of the embodiment shown in FIG. 9;
FIG. 12 is an exploded perspective view (corresponding to FIG. 4) showing still another embodiment of the present invention.
13 is a cross-sectional view taken along line XIII-XIII in the test head portion of the embodiment shown in FIG.
[Explanation of symbols]
IC: Electronic device under test
1 ... Electronic component testing equipment
100 ... Chamber part
101 ... constant temperature bath
102 ... Test chamber
103 ... Heat removal tank
104 ... Test head
30 ... Pusher
31 ... Pusher block
32 ... Guide pins
33 ... Stopper guide
34 ... Pusher base
35 ... Lead pusher base
36 ... Spring (elastic body)
38 ... heat sink
40 ... Socket guide (contact part)
41 ... Guide bush
42 ... Stopper surface
50 ... Socket (contact part)
51 ... Contact pin
105 ... Device substrate
108 ... Test tray transfer device
TST ... Test tray
16 ... Insert

Claims (4)

In an electronic component testing apparatus that performs testing by pressing the terminals of a plurality of electronic components to be tested against the contact portion of the test head while mounted on a tray,
A lead pusher base and a pusher base which are provided so as to be movable toward and away from the contact part, and are provided integrally with or separately from the pusher base and contact the electronic device under test from the opposite surface of the contact part. A pusher block that presses, an elastic body that imparts an elastic force to the pusher block in the pressing direction of the electronic device under test , and a heat absorbing and dissipating body provided on the pusher block ,
The electronic component testing apparatus according to claim 1, wherein the elastic body and the heat absorbing / dissipating body are arranged between the lead pusher base and the pusher base so as not to overlap each other when viewed from the pressing direction of the pusher block . 2. The electronic component testing apparatus according to claim 1, wherein the pusher block is configured separately from the pusher base. The electronic component testing apparatus according to claim 2, wherein the heat-absorbing and heat-dissipating body is provided between the pair of elastic bodies as viewed from the pressing direction by the pusher block . The electronic component testing apparatus according to claim 2, wherein the heat absorbing / dissipating body is provided on both sides of the elastic body as viewed from the pressing direction of the pusher block .

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