JP4043382B2

JP4043382B2 - Coating film removing method and apparatus

Info

Publication number: JP4043382B2
Application number: JP2003054060A
Authority: JP
Inventors: 法久古閑; 泰夫森; 優人野村; 真二小林
Original assignee: Tokyo Electron Ltd
Current assignee: Tokyo Electron Ltd
Priority date: 2003-02-28
Filing date: 2003-02-28
Publication date: 2008-02-06
Anticipated expiration: 2023-02-28
Also published as: JP2004261705A

Description

【０００１】
【発明の属する技術分野】
本発明は、表面に塗布膜が形成された角型の基板に対して、基板の縁部の不要な塗布膜を除去する方法及びその装置に関する。
【０００２】
【従来の技術】
半導体デバイスの製造プロセスにおいて、半導体マスクを形成する場合、角型のマスク基板にレジスト液を塗布し、フォトマスクを用いてそのレジスト膜を露光し、更に現像することによって所望のレジストパタ−ンを作製することが行われている。上記のような処理を行う場合、例えば、レジスト膜の形成方法として、角形のマスク基板（以下に「基板」という）を、例えばスピンチャック上に載置固定した状態で、スピンチャックを回転させ、例えばこの基板上面の中心部にレジスト液を滴下し、そのレジスト液を基板の回転力と遠心力とにより基板中心部から周縁部に向けて放射状に拡散させて塗布することが行われている。
【０００３】
この塗布処理の際、塗布直後における膜厚は均一であっても、回転が停止して遠心力が働かなくなった後や時間が経つに従い、表面張力の影響で基板周縁部でレジスト液が盛り上がるように厚くなる。またレジスト液が基板の下面周縁部にまで回り込んで不要な膜が形成される現象が発生する。このように基板の周縁部に不均一な厚い膜が形成されていると、集積回路パターン等の現像時に周縁部のレジスト膜が完全には除去されずに残存することになり、その後の基板の搬送工程中にその残存したレジストが剥がれ、パーティクル発生の原因となる。
【０００４】
そこで従来では、基板表面にレジスト液等を塗布した後、基板のパターン形成領域の外側の縁部の不要な塗布膜を除去する処理が行われている。このような手法としては、角型基板１をチャック２により保持すると共に、基板端縁洗浄ブロック１０ａ〜１０ｄから基板端縁に向けてレジスト液の溶剤を吐出しながら、前記洗浄ブロック１０ａ〜１０ｄを基板端縁に沿って移動させることにより、基板端縁の不要なレジスト膜を溶解して剥離させ、除去する構成（例えば、特許文献１参照）が提案されている。前記洗浄ブロック１０ａ〜１０ｄは、横から見た断面形状がコ字型に形成され、この中に基板の縁部が入り込み、吸気溝５８より溶解物が吸引される構造になっている。
【０００５】
【特許文献１】
特開平７−２６３３９４号公報（図１参照）
【０００６】
【発明が解決しようとする課題】
ところで上述の手法により、例えば基板の端縁から幅１ｍｍの縁部のレジスト膜を除去しようとすると、基板の端縁から１ｍｍ内側の箇所に洗浄ブロック１０ａ〜１０ｄからレジスト液の溶剤を供給しながら、洗浄ブロック１０ａ〜１０ｄを基板端縁に沿ってスキャンさせることが行われる。これにより溶剤が供給された部位はレジスト膜が溶解し、溶解物は前記吸気溝５８に吸引されるが、前記溶剤が基板の縁部よりも内側のレジスト膜の内部に浸透し、そこからレジスト膜が溶け出し、溶け出したレジストが線状に基板表面に沿って流出してしまうという現象が発生する。つまり厚みは小さいものの、基板表面にはレジスト膜が線状に残存することになる。
【０００７】
この現象は、洗浄ブロック１０ａ〜１０ｄを基板端縁に沿ってスキャンさせる毎に発生し、やがて１０回程度スキャンさせると線状のレジスト膜が認められなくなることから、従来では洗浄ブロック１０ａ〜１０ｄを１０回以上スキャンさせて、基板の縁部のレジスト膜を除去していた。しかしながらこのように洗浄ブロック１０ａ〜１０ｄを１０回以上もスキャンさせるのでは、処理に時間がかかり過ぎ、また溶剤の使用量も多くなってしまうという問題がある。
【０００８】
またマスク基板１は角部が平面的に見て半径２ｍｍの円の一部をなす円弧状にカットされており、基板の端縁から１ｍｍの幅で縁部の不要な塗布膜を除去しようとすると、図１８に示すように基板角部の縁部では斜線領域１１のレジスト膜は除去できるものの、領域１２のレジスト膜は除去しにくく、洗浄ブロック１０ａ〜１０ｄを１０回以上スキャンさせても、この領域のレジスト膜は除去できずに残る傾向があり、問題となっている。
【０００９】
本発明はこのような事情の下になされたものであり、その目的は、基板端縁の不要な塗布膜を効率よく除去する技術を提供することにある。
【００１０】
【課題を解決するための手段】
本発明の塗布膜除去方法は、塗布膜の溶剤を吐出する溶剤吐出部と、溶剤吐出部から吐出した溶剤及び塗布膜の溶解物を排出するための排出路と、この排出路に接続された吸引手段と、を備えた塗布膜除去部により、角型の基板表面に形成された塗布膜の縁部に前記溶剤を吐出しながら、この塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側まで移動させることにより、前記基板表面の縁部の不要な塗布膜を除去する塗布膜除去方法において、
前記溶剤吐出部により、前記基板の端縁から第１の距離分内側に前記溶剤を吐出しながら、前記塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側まで第１の回数移動させる工程と、
次いで前記溶剤吐出部により、前記基板の端縁から第１の距離よりも短い第２の距離分内側に前記溶剤を吐出しながら、前記塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側まで、第１の回数と同じか少ない第２の回数移動させる工程と、を含み、基板の角部近傍領域の塗布膜を除去するときの塗布膜除去部の移動速度を、基板の辺の中央近傍領域の塗布膜を除去するときの塗布膜除去部の移動速度よりも遅くすることを特徴とする。前記第２の距離は、第１の距離よりも０．２ｍｍ〜０．４ｍｍ短い距離であることが好ましい。
【００１１】
このような方法は、塗布膜の溶剤を吐出する溶剤吐出部と、溶剤吐出部から吐出した溶剤及び塗布膜の溶解物を排出するための排出路と、この排出路に接続された吸引手段と、を備えた塗布膜除去部と、
この塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側まで移動させる移動機構と、
前記基板の端縁から第１の距離分内側に前記溶剤を吐出しながら、前記塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側まで第１の回数移動させ、次いで前記基板の端縁から第１の距離よりも短い第２の距離分内側に前記溶剤を吐出しながら、前記塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側まで、第１の回数と同じか少ない第２の回数移動させるように前記移動機構を制御する制御部と、を備えることを特徴とする塗布膜除去装置や、前記基板の端縁から第１の距離分内側に塗布膜の溶剤を吐出する第１の溶剤吐出部と、前記基板の端縁から第１の距離よりも短い第２の距離分内側に塗布膜の溶剤を吐出する第２の溶剤吐出部と、前記第１の溶剤吐出部及び第２の溶剤吐出部から吐出した溶剤及び塗布膜の溶解物を排出するための排出路と、この排出路に接続された吸引手段と、を備えた塗布膜除去部と、
この塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側まで移動させる移動機構と、
前記第１の溶剤吐出部から基板表面の塗布膜に対して前記溶剤を吐出しながら、前記塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側まで第１の回数移動させ、次いで前記第２の溶剤吐出部から基板表面の塗布膜に対して前記溶剤を吐出しながら、前記塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側まで、第１の回数と同じか少ない第２の回数移動させるように前記移動機構を制御し、また基板の角部近傍領域の塗布膜を除去するときの塗布膜除去部の移動速度を、基板の辺の中央近傍領域の塗布膜を除去するときの塗布膜除去部の移動速度よりも遅くするように前記移動機構を制御する制御部と、を備えることを特徴とする塗布膜除去装置にて実施される。
【００１２】
このような手法では、塗布膜除去部のスキャン回数が少なくても基板の縁部の不要な塗布膜を効率よく除去することができ、このため処理時間の短縮や塗布膜の溶剤の省量化を図ることができる。
【００１４】
ここで本発明では、前記塗布膜除去部は、基板の端縁の位置を検出する位置検出部を備え、前記塗布膜除去部から基板の縁部に溶剤を吐出する前に、前記塗布膜除去部により前記基板の端縁の２箇所の位置を検出し、この検出値に基づいて前記塗布膜除去部の移動路を補正する工程を含むようにしてもよい。
【００１５】
さらに基板の角部近傍領域の塗布膜の縁部に溶剤を吐出し、基板の辺の中央近傍領域の塗布膜の縁部には溶剤を吐出しないで、前記塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側へ所定回数移動させる工程と、基板の塗布膜の縁部に溶剤を吐出しながら、前記塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側へ所定回数移動させる工程と、を備えるようにしてもよい。さらにまた基板の塗布膜の縁部に溶剤を吐出しながら、前記塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側へ所定回数移動させる工程と、続いて基板の塗布膜の縁部に不活性ガスを供給しながら、前記塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側へ所定回数移動させる工程と、続いて基板の塗布膜の縁部に溶剤を吐出しながら、前記塗布膜除去部を前記基板の端縁に沿って基板の一端側から他端側へ所定回数移動させる工程と、を備えるようにしてもよい。さらに前記塗布膜除去部により、基板の互いに対向する一対の辺に沿った縁部の不要な塗布膜を除去した後、基板の向きを変え、この基板における前記一対の辺とは異なる他の一対の辺に沿った縁部の不要な塗布膜を除去するようにしてもよい。
【００１６】
【発明の実施の形態】
以下に本発明の塗布膜除去方法が実施される塗布膜除去装置が組み込まれた塗布膜形成装置の一実施の形態について説明する。ここで、図１は塗布膜形成装置の一実施の形態に係る全体構成を示す平面図であって、図２はその概略斜視図である。図中Ｂ１は例えば５枚の基板例えばマスク基板Ｇが収納されたキャリアＣを搬入出するためのキャリアブロックであり、このキャリアブロックＢ１は、前記キャリアＣを載置するキャリア載置部２０と受け渡し手段２１とを備えている。
【００１７】
前記マスク基板Ｇは、例えば半導体マスクを形成するためのガラス基板であり、例えば一辺の長さが１５２±０.５ｍｍの正方形であって、厚さが６．３５ｍｍの、一辺の長さが６インチサイズの角型のガラス基板が用いられる。前記受け渡し手段２１はキャリアＣから基板Ｇを取り出し、取り出した基板ＧをキャリアブロックＢ１の奥側に設けられている処理部Ｂ２へと受け渡すように、左右、前後に移動自在、昇降自在、鉛直軸回りに回転自在に構成されている。
【００１８】
処理部Ｂ２の中央には主搬送手段２２が設けられており、これを取り囲むように例えばキャリアブロックＢ１から奥を見て例えば右側には塗布ユニット２３及び現像ユニット２４、左側には洗浄ユニット２５、手前側、奥側には加熱・冷却系のユニット等を多段に積み重ねた棚ユニットＵ１，Ｕ２が夫々配置されている。塗布ユニット２３は、基板にレジスト液を塗布する処理を行うユニット、現像ユニット２４は、露光後の基板に現像液を液盛りして所定時間そのままの状態にして現像処理を行うユニット、洗浄ユニット２５はレジスト液を塗布する前に基板を洗浄するためのユニットである。
【００１９】
前記棚ユニットＵ１，Ｕ２は複数のユニットが積み上げられて構成され、例えば図２に示すように、塗布膜除去ユニット３や加熱ユニット２６、冷却ユニット２７のほか、基板Ｇの受け渡しユニット２８等が上下に割り当てられている。前記主搬送手段２２は、昇降自在、進退自在及び鉛直軸まわりに回転自在に構成され、棚ユニットＵ１，Ｕ２及び塗布ユニット２３、現像ユニット２４並びに洗浄ユニット２５の間で基板Ｇを搬送する役割を持っている。但し図２では便宜上受け渡し手段２１及び主搬送手段２２は描いていない。
【００２０】
前記処理部Ｂ２はインタ−フェイス部Ｂ３を介して露光装置Ｂ４と接続されている。インタ−フェイス部Ｂ３は受け渡し手段２９を備えており、この受け渡し手段２９は、例えば昇降自在、左右、前後に移動自在かつ鉛直軸まわりに回転自在に構成され、前記処理ブロックＢ２と露光装置Ｂ４との間で基板Ｇの受け渡しを行うようになっている。
【００２１】
このような塗布膜形成装置における基板Ｇの流れについて述べておくと、先ず外部からキャリアＣがキャリア載置部２０に搬入され、受け渡し手段２１によりこのキャリアＣ内から基板Ｇが取り出される。基板Ｇは、受け渡し手段２１から棚ユニットＵ１の受け渡しユニット２８を介して主搬送手段２２に受け渡され、所定のユニットに順次搬送される。例えば洗浄ユニット２５にて所定の洗浄処理が行われ、熱処理ユニットの一つにて加熱乾燥が行われた後、冷却ユニット２７にて所定の温度に調整され、塗布ユニット２３にて塗布膜の成分が溶剤に溶解された塗布液例えばレジスト液の塗布処理が行われる。
【００２２】
続いて基板Ｇは塗布膜除去ユニット３にて、基板Ｇの縁部に付着している不要なレジスト膜（塗布膜）が除去される。ここで基板Ｇの縁部とは、基板のパターン形成領域の外側の周縁領域及び基板端面をいう。この後、基板Ｇは加熱ユニット２６の一つにて、所定温度に加熱されてプリベーク処理が行われた後、冷却ユニット２７の一つにて所定の温度に調整され、次いで主搬送手段２２により棚ユニットＵ２の受け渡しユニット２８を介してインターフェイス部Ｂ３の受け渡し手段２９に受け渡され、この受け渡し手段２９により露光装置Ｂ４に搬送されて、所定の露光処理が行われる。この後基板Ｇは、インターフェイス部Ｂ３を介して処理部Ｂ２に搬送され、加熱ユニット２６の一つにて所定の温度に加熱されて、ポストエクスポージャーベーク処理が行われる。次いで冷却ユニット２７にて所定の温度まで冷却されて温度調整された後、現像ユニット２４にて現像液が液盛りされ、所定の現像処理が行われる。こうして所定の回路パターンが形成された基板Ｇは主搬送手段２２、キャリアブロックＢ１の受け渡し手段２１を介して、例えば元のキャリアＣ内に戻される。
【００２３】
続いて本発明の塗布膜除去装置をなす塗布膜除去ユニット３について図３〜図５を参照して説明する。図中３０は処理容器であり、その側面には例えばシャッタ３１ａにより開閉自在に構成された基板Ｇの搬出入口３１が形成され、この搬出入口３１を介して処理容器３０の内部に主搬送手段２２がアクセスできるように構成されている。
【００２４】
このような処理容器３０の内部には、主搬送手段２２との間で基板Ｇの受け渡しを行うための基板チャック３２が、搬出入口３１を介して主搬送手段２２との間で基板Ｇの受け渡しを行うことができる位置に設けられている。前記基板チャック３２は、例えば基板Ｇの４つの角部を保持するための４個の保持部３３を備えており、これら保持部３３は保持アーム３３ａを介して昇降機構３４及び回転機構３５により、昇降自在、略鉛直軸まわりに回転自在に構成されている。
【００２５】
また処理容器３０の内部には、基板を保持するための４本の支持ピン３６が、前記基板チャック３２と干渉しない位置に設けられている。これら支持ピン３６は塗布膜の除去処理時に基板Ｇを保持するためのものであり、基板チャック３２が支持ピン３６に対して昇降することにより、基板チャック３２との間で基板Ｇの受け渡しが行われるようになっている。これら支持ピン３６は、基板Ｇを安定に支持し、かつ後述する塗布膜除去部と干渉しない状態で基板Ｇを保持するようになっている。
【００２６】
さらに処理容器３０の内部には、支持ピン３６により支持された基板ＧのＹ方向の両側に、この基板ＧのＹ方向に伸びる互いに対向する一対の辺の端縁に沿って移動して、当該辺の縁部の不要な塗布膜であるレジスト膜を除去するための塗布膜除去部４Ａ，４Ｂが設けられている。この例では、塗布膜除去部４（４Ａ，４Ｂ）は、図５に示すように、断面形状が略コ字型の基体４１を備えており、この基体４１は基板Ｇの縁部を間隔を介して挟み込むように設けられている。
【００２７】
基体４１の上面部分には、基板表面の端縁の縁部に沿って多数の溶剤吐出孔４２ａが配列された溶剤吐出部４２が設けられると共に、基板表面の前記溶剤吐出部４２からの溶剤の供給領域よりも端縁から見て内側の領域に不活性ガス例えば窒素（Ｎ2）ガスを供給するためのガス吐出部４３が設けられている。また基体４１の背面部分には、溶剤と、不活性ガスと、溶剤による塗布膜の溶解物とを吸引排出するための排出路である吸引排出路４４が形成されており、この吸引排出路４４には吸引手段である例えば吸引ポンプが接続されている。
【００２８】
またこの例では、基体４１の下面部分にも、基板裏面の端縁の周縁領域に沿って多数の溶剤吐出孔４５ａが配列された溶剤吐出部４５が設けられると共に、基板裏面の前記溶剤吐出部４５からの溶剤の供給領域よりも端縁から見て内側の領域に不活性ガス例えば窒素（Ｎ2）ガスを供給するためのガス吐出部４６が設けられている。前記溶剤吐出部４２，４５には図示しない溶剤供給路を介して溶剤を貯留するための溶剤タンク（図示せず）が、前記ガス吐出部４３，４６には図示しないガス供給路を介して不活性ガスを貯留するためのガスタンク（図示せず）が夫々接続されている。また溶剤ノズル４２，４５の先端は、夫々吸引排出路４４に向けて傾斜するように形成されている。
【００２９】
また基体４１の上面部分における、溶剤吐出部４２，４５やガス吐出部４３，４６が設けられている領域よりも前面部分には、コ字の開口部を広げるような段部４１ａが形成されており、この段部４１ａには、基板表面に対向するように第１の位置センサ４７が設けられ、基体４１の下面部分における、前記第１の位置センサ４７と対向する位置には第２の位置センサ４８が設けられている。これら第１及び第２の位置センサ４７，４８は夫々ファイバセンサよりなり、一方側が発光素子、他方側が受光素子として構成されて、基板Ｇの端縁上のある位置を検出するようになっている。この例では第１及び第２の位置センサ４７，４８が位置検出部に相当する。
【００３０】
これら塗布膜除去部４は、例えば幅Ｘが３ｍｍ〜３０ｍｍ、間隔Ｙが６ｍｍ〜８ｍｍに設定され、例えば厚さが５ｍｍ〜７ｍｍの基板Ｇに対して例えば幅１ｍｍ〜５ｍｍ程度の縁部の不要な塗布膜を除去することができる形状に形成されている。なお溶剤吐出孔４２ａの形状としては図５のような複数孔であってもよいし、単一孔であってもスリット状のものであってもよい。
【００３１】
前記塗布膜除去ユニット３は、支持ピン３６に保持された基板Ｇの両外側に、基板ＧのＹ方向の互いに対向する一対の辺と略平行に設けられたＹ方向に互いに対向して伸びる２本のＹ方向ガイドレール５１，５２を備えており、前記塗布膜除去部４Ａ，４Ｂは、夫々Ｙ方向移動機構５３，５４により、前記Ｙ方向ガイドレール５１，５２に沿ってＹ方向に移動自在に構成されている。またこのＹ方向ガイドレール５１，５２はＸ方向移動機構５５，５６により、Ｘ方向に伸びるＸ方向ガイドレール５７，５８に沿ってＸ方向に移動自在に構成されており、これにより塗布膜除去部４Ａ，４ＢはＸ軸，Ｙ軸に沿って、Ｘ軸とＹ軸とを同期させた状態で移動自在に構成されることとなる。ここでＹ方向移動機構５３，５４は例えばベルト駆動機構により構成され、Ｘ方向移動機構５５，５６は例えばボールネジ機構により構成される。図３中Ｍ１，Ｍ２は夫々Ｙ方向移動機構５３，５４のモータ、Ｍ３，Ｍ４は夫々Ｘ方向移動機構５５，５６のボールネジを回転させるモータである。
【００３２】
前記シャッタ３１ａ、基板チャック３２の昇降機構３４や回転機構３５、Ｙ方向駆動機構５３，５４の各モータＭ１，Ｍ２、Ｘ方向駆動機構５５，５６の各モータＭ３，Ｍ４の駆動動作は制御部６により制御される。この制御部６はＣＰＵ（中央処理ユニット）、プログラム及びメモリ等により構成されるが、ここでは各機能をブロック化し構成要素として図６に基づいて説明するものとする。制御部６は各処理ユニットのレシピの作成や管理を行うと共に、レシピに応じて各処理ユニットの制御を行うものであるが、この実施の形態の形態における、その働きの要点は塗布膜除去部４Ａ，４Ｂの移動制御にあるので、この点に重点をおいて説明する。
【００３３】
図６中６１はレシピ作成部、６２はレシピ格納部、６３はレシピ選択部であり、レシピ作成部６１は、塗布膜の溶剤の種類、塗布膜の除去幅（除去しようとする塗布膜の基板端縁からの距離）、塗布膜除去部４Ａ，４Ｂのスキャン速度やスキャン回数等といった、塗布膜除去処理に必要な処理条件を組み合わせたレシピの入力を行うことができるようになっていて、ここで作成された各レシピはレシピ格納部６２に格納される。レシピは目的とする塗布膜に応じて複数用意され、オペレータはレシピ選択部６３によりレシピ格納部６２に格納されている複数のレシピから目的のレシピを選択することとなる。なおＢ１はバスである。
【００３４】
また制御部６は吐出位置補正部６４を備えている。この吐出位置補正部６４は、塗布膜除去部４Ａ，４Ｂにより夫々対応する基板端縁の２箇所の位置を検出し、その検出値に基づいて基板の端縁の位置を求め、この位置に応じて塗布膜除去部４Ａ，４Ｂの塗布膜除去処理時の移動路を補正する機能を備えている。
【００３５】
具体的にこの機能について説明すると、例えば図７に実線で示すように、基板の互いに対向する一対の辺Ｇ１，Ｇ３の端縁が、夫々塗布膜除去部４Ａ，４Ｂに設けられた上下２個の位置センサ４７，４８を結ぶ線上近傍に位置するように、先ず除去ユニット４Ａ，４ＢをＹ方向移動機構５３，５４によりＹ軸方向に移動させた後（図７（ａ）参照）、次いでＸ方向移動機構５５，５６によりＸ軸方向に移動させ（図７（ｂ）参照）、これにより基板の辺Ｇ１，Ｇ３の夫々の端縁の第１のポイントＰ１Ａ，Ｐ１Ｂの位置を把握する。次いで図７（ｃ），（ｄ）に示すように、第１のポイントＰ１（Ｐ１Ａ，Ｐ１Ｂ）と同様に、この基板の辺Ｇ１，Ｇ３の端縁の第２のポイントＰ２（Ｐ２Ａ，Ｐ２Ｂ）の位置を把握する。ここで制御部６ではＹ方向移動機構５３，５４のモータＭ１，Ｍ２及びＸ方向移動機構５５，５６のモータＭ３，Ｍ４からの情報により塗布膜除去部４Ａ，４Ｂの位置を認識するようになっており、これにより夫々の辺Ｇ１，Ｇ３の第１及び第２のポイントＰ１，Ｐ２の位置座標が把握されるようになっている。
【００３６】
次いでこれら基板端縁の第１のポイントＰ１と第２のポイントＰ２との２箇所の位置情報、例えば座標ポイントの数値差に基づいて、直線の式により基板の辺Ｇ１，Ｇ３の端縁の位置を算出する。具体的に図８に基づいて説明すると、先ず塗布膜除去部４Ａ（４Ｂ）のホーム位置の位置座標を座標（０，０）とし、塗布膜除去部４Ａ（４Ｂ）をＹ軸（Ｙ方向ガイドレール５１（５２））に沿って第１のポイントＰ１に対応する位置まで移動させ、続いて塗布膜除去部４Ａ（４Ｂ）をＸ軸（Ｘ方向ガイドレール５７（５８））に沿って第１のポイントＰ１の位置まで移動させて、当該ポイントＰ１の座標データ例えば第１の座標（５，８）を取得する。ここで前記ホーム位置とは、例えば基板の端縁の一端側の塗布膜除去部４Ａ（４Ｂ）が待機する位置である。
【００３７】
続いて塗布膜除去部４Ａ（４Ｂ）をホーム位置まで戻した後、塗布膜除去部４Ａ（４Ｂ）をＹ軸（Ｙ方向ガイドレール５１（５２））に沿って第２のポイントＰ２に対応する位置まで移動させ、続いて塗布膜除去部４Ａ（４Ｂ）をＸ軸（Ｘ方向ガイドレール５７（５８））に沿って第２のポイントＰ２の位置まで移動させて、当該ポイントＰ２の座標データ例えば第２の座標（２５，１５）を取得する。
【００３８】
この後塗布膜除去部４Ａ（４Ｂ）をホーム位置まで戻し、第１の座標（５，８）と第２の座標（２５，１５）とにより、第１及び第２のポイントＰ１，Ｐ２の間の傾き角度θ（図８（ｂ）参照）を算出し、このデータが補正値出力部６５によりＹ方向駆動機構５３，５４、Ｘ方向駆動機構５５，５６の各モータＭ１〜モータＭ４に夫々出力される。そして実際の塗布膜の除去処理の際には、基板端縁から所定距離分内側の位置に塗布膜除去部４Ａ，４Ｂから塗布膜の溶剤を供給するように、前記傾き角度θ分、塗布膜除去部４Ａ（４Ｂ）のＸ軸方向の動きが制御された状態で、塗布膜除去部４Ａ（４Ｂ）を前記基板端縁に沿って基板Ｇの一端側から他端側へ移動させる。つまり塗布膜除去部４Ａ（４Ｂ）の移動路がＹ軸（Ｙ方向ガイドレール５１（５２））から角度θ傾くように、塗布膜除去部４Ａ（４Ｂ）をＸ軸方向に移動させながら前記基板端縁に沿ってＹ軸方向に移動させる。
【００３９】
この例では前記傾き角度θを求めることにより、基板端縁のＹ軸（Ｙ方向ガイドレール５１（５２））からの傾きが算出されて基板端縁の位置が求められ、また塗布膜除去部４Ａ（４Ｂ）の移動路がＹ軸から角度θ傾くように、塗布膜除去部４Ａ（４Ｂ）の移動が制御されるので、塗布膜除去部４Ａ（４Ｂ）の移動路の補正が行われることになる。
【００４０】
また前記傾き角度θを算出して、予め基板端縁のＹ軸からの傾きテーブルを作成し、これに沿って塗布膜除去部４Ａ（４Ｂ）を移動させるように、塗布膜除去部４Ａ，４Ｂの移動路を補正し、このようにして補正された移動路の情報を、補正値出力部６５によりＹ方向駆動機構５３，５４、Ｘ方向駆動機構５５，５６の各モータＭ１〜モータＭ４に夫々出力しておき、実際の処理では、塗布膜除去部４Ａ，４Ｂを補正後の移動路に沿って移動させて塗布膜の除去処理を行うようにしてもよい。
【００４１】
次いで上述の塗布膜除去ユニット３にて行われる本発明の塗布膜除去方法の第１の実施の形態について図９〜図１１に基づいて説明する。先ず処理容器３０のシャッタ３１ａを開き、搬出入口３１を介して主搬送手段２２により基板Ｇを処理容器３０内に搬入して基板チャック３２に受け渡し、シャッタ３１ｂにより搬出入口３１を閉じる（図９（ａ），ステップＳ１）。続いて基板チャック３２を下降させて支持ピン３６に基板Ｇを受け渡す（図９（ｂ），ステップＳ２）。
【００４２】
この後、既述のように塗布膜除去部４Ａ，４Ｂを移動させて、基板Ｇの互いに対向する一対の辺Ｇ１，Ｇ３の端縁の２箇所のポイントＰ１，Ｐ２の位置を検出し、塗布膜除去部４Ａ，４Ｂの除去処理時の移動路を補正する（図９（ｃ），ステップＳ３）。しかる後、塗布膜除去部４Ａ，４Ｂを補正された移動路の一端側まで移動させ、次いで基板Ｇの表面側と裏面側の夫々の所定位置に塗布膜の溶剤を供給しながら、前記移動路に沿って基板の辺Ｇ１，Ｇ３の一端側から他端側までの間を所定回数スキャンして、所定の塗布膜の除去を行う（図９（ｄ），図１１（ａ））。
【００４３】
ここでスキャン開始位置は、図１２（ａ）に示すように、基板の辺Ｇ１，Ｇ３の一端側であって例えば基板表面の端縁から第１の距離Ａ１例えば１ｍｍ内側に溶剤を供給する位置であって、前記スキャン終了位置は、基板の辺Ｇ１，Ｇ３の他端側であって例えば基板表面の端縁から第１の距離Ａ１例えば１ｍｍ内側に溶剤を供給する位置である。この際基板の端縁から第１の距離Ａ１とは、基板の縁部の塗布膜の除去幅がＡ１ということである。
【００４４】
こうして夫々基板表面の辺Ｇ１，Ｇ３の端縁から１ｍｍ内側の位置に溶剤例えばシンナー液を供給すると共に、溶剤の供給領域よりも内側に窒素ガスを供給する一方、基板Ｇの裏面側にも基板端縁から例えば５ｍｍ程度内側に溶剤を供給すると共に、溶剤の供給領域よりも内側に窒素ガスを供給しながら、塗布膜除去部４Ａ，４Ｂを基板Ｇの端縁に沿って往復させ、基板Ｇの一端側から他端側まで第１の回数例えば５回スキャンさせる（第１の除去工程（ステップＳ４）、図１１（ａ））。ここで塗布膜除去部４を基板の一端側から他端側まで移動させたときに、スキャン回数を１とする。
【００４５】
これにより基板の表面側と裏面側の縁部に付着している不要なレジスト膜が溶解され、溶剤及び溶解物は、窒素ガスによって基板Ｇの外方側へ吹き飛ばされると共に、吸引手段により吸引されて吸引排出路４４から吸引排出される。
【００４６】
この後、図１２（ｂ）に示すように塗布膜除去部４Ａ，４Ｂを基板表面の端縁から第１の距離Ａ１よりも短い第２の距離Ａ２内側に溶剤を供給する位置に僅かに移動させる。前記第２の距離Ａ２とは第１の距離Ａ１よりも例えば０．２〜０．４ｍｍ程度短い距離をいい、第１の距離Ａ１と第２の距離Ａ２の差は、溶剤が除去領域よりも内側の塗布膜に染み込む距離に相当する。
【００４７】
こうして例えば基板表面の辺Ｇ１，Ｇ３の端縁から例えば０．８ｍｍ内側の位置に溶剤を供給すると共に、この溶剤の供給位置よりも内側に窒素ガスを供給する一方、基板裏面の辺Ｇ１，Ｇ３の端縁から４．８ｍｍ内側の位置に溶剤を供給すると共に、この溶剤の供給位置よりも内側に窒素ガスを供給しながら、塗布膜除去部４Ａ，４Ｂを基板Ｇに沿って往復させて、基板Ｇの辺Ｇ１，Ｇ３の端から端まで第１の除去工程と同じ回数か第１の除去工程よりも少ない回数例えば３回スキャンさせる（第２の除去工程（ステップＳ５，図１１（ｂ）））。
【００４８】
こうして基板Ｇの縁部の塗布膜の除去を行った後、基板チャック３２を上昇させて支持ピン３６から基板チャック３２に基板Ｇを受け渡し、この後基板チャック３２を９０度回転させた後下降させて、支持ピン３６に基板Ｇを受け渡す（ステップＳ６）。これにより基板Ｇの互いに対向する一対の辺Ｇ２，Ｇ４が塗布膜除去部４Ａ，４Ｂに対応し、塗布膜の除去が行われる基板Ｇの端縁が変えられる（図１１（ｃ））。
【００４９】
次いで塗布膜除去部４Ａ，４Ｂにより辺Ｇ１，Ｇ３の塗布膜除去時と同様に、先ず基板Ｇの辺Ｇ２，Ｇ４の端縁の夫々２箇所を測定して、塗布膜除去部４Ａ，４Ｂの移動路の補正を行った後（ステップＳ７）、基板表面Ｇの辺Ｇ２，Ｇ４に対して辺Ｇ１，Ｇ３と同様に第１の除去工程を行い（ステップＳ８）、次いで第２の除去工程（ステップＳ９）を行う。
【００５０】
こうして全ての辺に対して縁部の不要な塗布膜が除去された基板Ｇは基板チャック３２に受け渡されて主搬送手段２２との間で受け渡しを行う位置にて待機し、そしてシャッタ３１ａを開き、搬出入口３１を介して主搬送手段２２に受け渡されて処理容器３０から搬出され、次いでシャッタ３１ａにより搬出入口３１が閉じられる（ステップＳ１０）。以上において、塗布膜除去部４Ａ，４Ｂの移動動作は制御部６によりＹ方向移動機構５３，５４、Ｘ方向移動機構５５，５６を介して制御される。
【００５１】
このような方法では、基板Ｇの縁部の塗布膜を除去するにあたり、処理の途中において、基板Ｇの縁部の除去幅（基板の端縁からの距離）を変化させているので、塗布膜除去部４Ａ，４Ｂのスキャン回数を低減させても、良好な除去性能を確保することができ、これにより処理時間の短縮や、溶剤の省量化を図ることができる。
【００５２】
具体的に説明すると、従来の技術の欄にも記載したように、塗布膜除去部４から塗布膜Ｒの縁部に溶剤を供給すると、この溶剤が供給位置よりも上流側の塗布膜Ｒの内側に染み込み、吸引手段により吸引されるときに、当該塗布膜Ｒを溶解しながら流れるために、図１３に示すように、溶け出した塗布膜が線状に基板表面に沿って流出してしまう。この現象は塗布膜除去部４を基板端縁に沿ってスキャンさせる毎に発生するので、従来のように基板Ｇの周縁領域の除去幅を変化させない場合には、線状の塗布膜を除去するために、塗布膜除去部４を１０回程度スキャンさせる必要がある。
【００５３】
これに対して本発明では、前記溶剤が塗布膜Ｒに染み込む距離は０．２ｍｍ〜０．４ｍｍ程度であるので、第１の除去工程では除去幅に相当する距離Ａ１分端縁から内側の位置に溶剤を供給して例えば５回スキャンを行ない、次いで第２の除去工程では溶剤の供給位置を前記溶剤が塗布膜Ｒに染み込む距離に相当する分、端縁に近い位置に変化させる。このようにすると、第２の除去工程においても溶剤の供給位置よりも上流側の塗布膜Ｒに溶剤が染み込む現象が発生するが、塗布膜Ｒの除去領域よりも内側の領域には溶剤が染み込んで行かないので、新たな塗布膜Ｒの溶解が抑えられる。
【００５４】
また第１の除去工程で流出した線状の塗布膜の溶剤の供給位置よりも下流側の部分は、前記溶剤の供給により除去される。さらに線状の塗布膜の溶剤の供給位置よりも上流側の部分については塗布膜の流出により発生した薄い塗布膜であるので、前記第２の除去工程にて供給される溶剤が上流側への塗布膜Ｒに染み込むことにより、当該領域の塗布膜は塗布膜除去部４を２，３回程度のスキャンさせれば除去することができる。これにより塗布膜の除去幅を変えない場合よりもトータルのスキャン回数を低減させることができ、処理時間の短縮化や溶剤の省量化を図ることができる。
【００５５】
ここで第１の除去工程や第２の除去工程の塗布膜除去部４のスキャン回数や、第２の工程での溶剤の供給位置については、例えば塗布膜除去部４のスキャン速度や溶剤の供給量によっても異なるが、本発明者らの実験により、例えば１辺の長さが６インチサイズの基板Ｇであり、レジスト膜（塗布膜）の厚さが０．５μｍ〜１μｍ、基板Ｇ端縁からの除去幅が１ｍｍの場合、第１の工程のスキャン回数は２〜５回、前記距離Ａ１と距離Ａ２の差は０．２ｍｍ〜０．４ｍｍ、第２の除去工程のスキャン回数は１〜３回が好ましいことが認められている。
【００５６】
またこの実施の形態では、基板Ｇを支持ピン３６にて保持する際に、機械的に基板Ｇの端縁を押圧して基板自体の位置合わせを行うのでなく、塗布膜除去部４Ａ，４Ｂにより基板Ｇの端縁の２箇所の位置を検出し、この検出値に基づいて前記基板端縁の位置を直線の式により算出して、こうして求められた位置に基づいて塗布膜除去部４Ａ，４Ｂの移動路を補正するようにしている。このため機械的な位置合わせでは、押圧部材が塗布膜が付着している基板の端面と接触するので、押圧部材に塗布膜が付着し、パーティクル発生の原因となるが、本実施の形態の手法では、基板端面と接触する工程がないので、パーティクルの発生が抑えられる。
【００５７】
さらに制御部６では、基板Ｇの端縁の２箇所の位置に基づく計算により基板端縁の位置を精度良く算出できるので、これにより塗布膜除去部４Ａ，４Ｂの移動路の補正も正確に行なうことができるので、１ｍｍという僅かな幅の縁部の不要な塗布膜を精度良く除去することができ、有効である。
【００５８】
さらにまたこの例では、塗布膜除去部４Ａ，４Ｂに、基板Ｇの裏面側に塗布膜の溶剤を供給する溶剤吐出部４５が設けられているので、基板裏面の縁部に付着した不要な塗布膜を除去することができる。また塗布膜除去部４Ａ，４Ｂには、基板Ｇの表面側及び裏面側に、溶剤の供給領域よりも内側に窒素ガスを供給するガス吐出部４３，４６が設けられており、この窒素ガスは吸引排出路４４により吸引排気されるので、溶剤や塗布膜の溶解物が吸引排出路４４に排出される際、これらを吸引排出路４４に向けて押し出すように働き、これにより溶剤等が効率良く吸引排出路に排出される。
【００５９】
続いて本発明の第２の実施の形態について説明するが、この例は、例えば図１４に示すように、平面的に見て円弧状にカットされたマスク基板Ｇの角部の端縁に付着した塗布膜を有効に除去するための手法である。
【００６０】
この例においても、処理容器３０内に基板Ｇを搬入して基板チャック３２を介して支持ピン３６に基板Ｇを受け渡した後、塗布膜除去部４Ａ，４Ｂにより基板Ｇの互いに対向する一対の辺Ｇ１，Ｇ３の端縁の２箇所のポイントＰ１，Ｐ２の位置を検出して、制御部６にて塗布膜除去部４Ａ，４Ｂの除去処理時の移動路を補正する工程までは上述の実施の形態と同様である。
【００６１】
そして塗布膜除去部４Ａ，４Ｂを補正された移動路の吐出開始位置まで移動させる。この例では、塗布膜除去部４Ａ，４Ｂの吐出開始位置は図１４（ａ）に示すように、基板Ｇの対角線状に対向する位置になっている。次いで前記移動路に沿って基板表面の辺Ｇ１，辺Ｇ３の所定幅Ａ１の縁部の内縁の位置例えば辺Ｇ１，Ｇ３の端縁から距離Ａ１例えば１ｍｍ内側の位置に前記溶剤を供給すると共に、溶剤の供給位置よりも内側に窒素ガスを供給する一方、基板裏面の辺Ｇ１，辺Ｇ３の所定位置例えば端縁から５ｍｍ内側の位置に前記溶剤を供給すると共に、溶剤の供給位置よりも内側に窒素ガスを供給しながら、基板の一端側から他端側までスキャンさせて、基板Ｇの第１の辺Ｇ１，Ｇ３の中央近傍領域の縁部の塗布膜を除去する。
【００６２】
続いて塗布膜除去部４Ａ，４Ｂが基板の辺Ｇ１，Ｇ３の他端側の位置、つまり基板Ｇの角部Ｃ１，Ｃ３の端縁から所定幅Ａ１の縁部を除去する位置まで移動したときに、塗布膜除去部４Ａ，４Ｂの姿勢を維持した状態で、前記角部の縁部を除去する位置に溶剤を供給するように、塗布膜除去部４Ａ，４ＢをＸ軸移動機構５５，５６により第２の辺つまり基板Ｇの辺Ｇ２，Ｇ４に沿って移動させて、この領域の塗布膜の除去を行う（図１４（ａ）参照）。
【００６３】
こうして基板Ｇの第１の辺Ｇ１，Ｇ３の縁部の塗布膜の除去を行った後、基板Ｇを基板チャック３２により９０度回転させ（図１４（ｂ）参照）、次いで同様に基板Ｇの第２の辺Ｇ２，Ｇ４に対して所定幅Ａ１の縁部の塗布膜の除去を行ない（図１４（ｃ）参照）、続いて基板Ｇを主搬送手段２２に受け渡して塗布膜除去ユニット３から搬出する。以上において、塗布膜除去部４Ａ，４Ｂの移動動作は制御部６によりＹ方向移動機構５３，５４、Ｘ方向移動機構５５，５６を介して制御される。
【００６４】
このような方法では、マスク基板Ｇの角部の縁部の塗布膜を効率よく除去することができる。つまりマスク基板Ｇは既述のように基板Ｇの角部が半径２ｍｍの円の一部をなす円弧状にカットされている上、基板Ｇの端縁から１ｍｍという僅かな幅で縁部の塗布膜を除去するので、塗布膜除去部４Ａ，４Ｂを基板Ｇの辺の端縁に沿って移動させて溶剤を供給して塗布膜除去処理を行うと、従来の技術の欄に記載したように、前記角部の縁部については除去しきれない塗布膜が存在する。
【００６５】
これに対して本実施の形態では、図１５（ａ）に示すように、塗布膜除去部４Ａ，４Ｂが、基板Ｇの角部の端縁から所定幅Ａ１の縁部まで移動したときに、Ｘ方向に第２の辺Ｇ２，Ｇ４に沿って移動させて、前記角部の縁部の塗布膜を除去する位置に溶剤を供給しているので、図１５（ｂ）に斜線で示す領域の塗布膜を除去することができ、前記角部の縁部の塗布膜についても効率よく除去することができる。ここで基板の角部では所定幅Ａ１の縁部よりも内側の領域まで塗布膜が除去されてしまうが、この領域についてはパターン形成領域の外側であり、問題がない範囲である。
【００６６】
またこの実施の形態では、基板Ｇの角部の縁部の塗布膜を除去するにあたり、塗布膜除去部４Ａ，４Ｂから前記角部の所定幅Ａ１の縁部の内縁近傍位置に溶剤を供給するように、塗布膜除去部４Ａ，４ＢをＸ方向駆動機構５５，５６及びＹ方向駆動機構５３，５４により段階的に移動させ、これにより前記角部の縁部の塗布膜を除去するようにしてもよい。この場合にはより確実に前記角部の所定幅Ａ１の縁部の塗布膜を除去することができる。
【００６７】
続いて本発明の第３の実施の形態について説明する。この例は、基板Ｇの辺に対して塗布膜除去部４Ａ，４Ｂを所定回数スキャンさせて基板縁部の不要な塗布膜を除去するにあたり、最後の複数回のスキャンのときにスキャン速度を遅くすることにより、トータルの処理時間を短縮するものである。
【００６８】
この例においても、処理容器３０に基板Ｇを搬入して、塗布膜除去部４Ａ，４Ｂの除去処理時の移動路を補正する工程までは上述の実施の形態と同様である。続いて塗布膜除去部４Ａ，４Ｂを補正された移動路の吐出開始位置まで移動させ、次いで前記移動路に沿って基板の互いに対向する一対の辺Ｇ１，辺Ｇ３の所定位置例えば端縁から１ｍｍ内側の位置に前記溶剤を供給しながら、基板の辺Ｇ１，Ｇ３の一端側から他端側までＸ１回例えば８回、速度Ｖ１例えば１００ｍｍ／ｓｅｃ程度の速度でスキャンする。
【００６９】
次いで塗布膜除去部４Ａ，４Ｂのスキャン速度を速度Ｖ１よりも遅い速度である速度Ｖ２例えば５０ｍｍ／ｓｅｃ程度の速度に変え、Ｘ１回よりも少ないＸ２回例えば２回スキャンして、所定の塗布膜の除去を行う。
【００７０】
こうして基板Ｇの辺Ｇ１，Ｇ３の塗布膜の除去を行った後、基板Ｇを基板チャック３２により９０度回転させて、基板Ｇの互いに対向する一対の辺Ｇ２，Ｇ４に対して同様に塗布膜の除去を行ない、続いて基板Ｇを主搬送手段２２に受け渡す。以上において、塗布膜除去部４Ａ，４Ｂの移動動作は制御部６によりＹ方向移動機構５３，５４、Ｘ方向移動機構５５，５６を介して制御される。
【００７１】
このような方法では、処理時間を短縮しながら、効率よく縁部の塗布膜を除去することができる。つまり本実施の形態は、本発明者らが、基板Ｇの１辺の塗布膜の除去を行う場合、塗布膜除去部４のトータルのスキャン回数を例えば１０回とした場合、所定のスキャン回数例えば８回までは速度Ｖ１程度のスキャン速度で処理を行い、次いで最後の例えば２回は、速度Ｖ１よりも遅い速度Ｖ２程度のスキャン速度で処理を行うと、例えば速度Ｖ２程度のゆっくりしたスキャン速度で１０回スキャンして処理を行った場合とほぼ同等程度の塗布膜の剥離状態を確保できることを見出した結果なされたものであり、これにより上述の方法では、塗布膜除去部４を所定回数スキャンさせて処理を行う場合に、ゆっくりした速度で全ての回数スキャンを行う場合に比べて、処理時間を短縮しながら、効率よく縁部の塗布膜を除去することができる。
【００７２】
またこの実施の形態は上述の第１の実施の形態又は第２の実施の形態に組み合わせて、各実施の形態において所定回のスキャン回数の内、速度Ｖ１でＸ１回スキャンし、次いで速度Ｖ１よりも遅い速度Ｖ２でＸ２回スキャンを行うようにして、トータルの処理時間を短縮するようにしてもよい。
【００７３】
続いて本発明の第４の実施の形態について説明する。この実施の形態は、塗布膜除去部４のスキャン速度を、基板Ｇの辺の中央近傍領域と角部近傍領域との間で変化させることにより、基板角部の縁部の塗布膜を確実に除去する手法である。
【００７４】
この例においても、処理容器３０に基板Ｇを搬入して塗布膜除去部４Ａ，４Ｂの除去処理時の移動路を補正する工程までは上述の実施の形態と同様である。続いて塗布膜除去部４Ａ，４Ｂを、補正された移動路の吐出開始位置まで移動させ、次いで前記移動路に沿って基板の互いに対向する一対の辺Ｇ１、辺Ｇ３の所定位置例えば端縁から１ｍｍ内側の位置に前記溶剤を供給しながら、基板の辺Ｇ１，Ｇ３の一端側から他端側まで所定の回数スキャンして所定の塗布膜の除去を行うが、この際図１６（ａ）に示すように、基板の角部近傍領域例えば基板の一端側のＬ０位置（スキャン開始側）〜Ｌ１位置までの例えばＬ０から３０ｍｍ程度の領域は速度Ｖ３例えば４０ｍｍ／ｓｅｃにて移動させ、次いで基板Ｇ中央近傍領域に相当する基板のＬ１位置からＬ２位置までの領域（基板の一端側Ｌ０から３０ｍｍ〜９０ｍｍ程度の領域）は速度Ｖ３よりも早い速度Ｖ４例えば１００ｍｍ／ｓｅｃにて移動させ、続いて基板のＬ２位置からＬ３位置までの他端側の角部近傍領域、例えば基板の他端（スキャン終了側）から３０ｍｍの間は速度Ｖ４よりも遅い速度Ｖ５例えば４０ｍｍ／ｓｅｃにて移動するように、制御部６によりスキャン速度を制御する。
【００７５】
こうして基板Ｇの辺Ｇ１，Ｇ３の塗布膜の除去を行った後、基板Ｇを基板チャック３２により９０度回転させて、同様に基板Ｇの互いに対向する一対の辺Ｇ２，Ｇ４の塗布膜の除去を行ない、続いて基板Ｇを主搬送手段２２に受け渡して、塗布膜除去ユニット３から搬出する。以上において、塗布膜除去部４Ａ，４Ｂの移動動作は制御部６によりＹ方向移動機構５３，５４、Ｘ方向移動機構５５，５６を介して制御される。
【００７６】
このような手法では、図１６（ｂ）に示すように基板Ｇの辺の角部近傍領域では中央領域よりも膜厚が厚くなる傾向があるが、角部近傍領域では塗布膜除去部のスキャン速度を遅くしているので、溶剤による塗布膜の剥離時間を長くすることができ、前記角部近傍領域の塗布膜も確実に除去することができる。なおスキャン速度が一定である場合には、角部近傍領域の塗布膜を除去するために、スキャン回数を増やす必要があり、トータルの処理時間が長くなってしまうおそれがある。
【００７７】
またこの実施の形態を上述の第１〜第３の実施の形態に組み合わせ、各実施の形態において、基板Ｇの辺の中央領域よりも角部近傍領域におけるスキャン速度を遅くして、角部近傍領域の塗布膜を確実に除去するようにしてもよい。
【００７８】
さらに他の例（第５の実施の形態）として、図１６（ａ）の、基板のＬ０位置（一端側）〜Ｌ１位置まで（例えば一端側から３０ｍｍ程度）の領域と、基板のＬ２位置〜Ｌ３位置までの領域（例えば基板の他端側（スキャン終了側）から３０ｍｍ程度）の領域については、塗布膜除去部４Ａ，４Ｂから基板Ｇの端縁の所定位置に溶剤を供給し、基板Ｇの中央近傍領域例えば基板ＧのＬ１位置〜Ｌ２位置までの領域については溶剤の供給を停止した状態で、基板Ｇの一端側から他端側に所定回数例えば２回所定のスキャンを行い、続いて基板Ｇの辺の全ての領域に端縁の所定位置に溶剤を供給しながら、基板の一端側から他端側へ塗布膜除去部４Ａ，４Ｂを等速でスキャンさせて、塗布膜の除去処理を行うようにしてもよい。この例においても前記角部近傍領域の塗布膜が確実に除去することができる。またこの実施の形態を上述の第１〜第４の実施の形態に組み合わせてもよい。
【００７９】
続いて本発明の第６の実施の形態について説明する。この例においても、処理容器３０に基板Ｇを搬入して塗布膜除去部４Ａ，４Ｂの除去処理時の移動路を補正する工程までは上述の実施の形態と同様である。そして塗布膜除去部４Ａ，４Ｂを、補正された移動路の吐出開始位置まで移動させ、次いで基板両面の互いに対向する一対の辺Ｇ１、辺Ｇ３の所定位置に、溶剤と不活性ガス例えば窒素ガスとを夫々供給しながら、基板の辺Ｇ１，Ｇ３の一端側から他端側まで第１の回数スキャンして所定の塗布膜の除去を行う。
【００８０】
続いて溶剤吐出部４２，４５からの溶剤の吐出を停止し、基板両面の所定位置、例えば基板Ｇの縁部の除去領域よりも上流側の塗布膜の端面近傍に窒素ガスを供給した状態で、基板の辺Ｇ１，Ｇ３の一端側から他端側まで複数回スキャンを行う。次いで溶剤吐出部４２，４５からの溶剤の吐出を開始し、基板両面の所定位置に溶剤と窒素ガスとを夫々供給しながら、基板の辺Ｇ１，Ｇ３の一端側から他端側まで第２の回数スキャンを行って所定の塗布膜の除去を行う。こうして基板Ｇの辺Ｇ１，Ｇ３の塗布膜の除去を行った後、基板Ｇを基板チャック３２により９０度回転させて、同様に基板Ｇの互いに対向する一対の辺Ｇ２，Ｇ４の塗布膜の除去を行ない、続いて基板Ｇを主搬送手段２２に受け渡して、塗布膜除去ユニット３から搬出する。以上において、塗布膜除去部４Ａ，４Ｂの移動動作や、溶剤吐出部４２，４５からの溶剤の供給開始や停止の動作は、制御部６により制御される。
【００８１】
このような手法では、基板Ｇの縁部の除去領域よりも内側の塗布膜の端面に窒素ガスのみを供給しながら、所定回数塗布膜除去部４Ａ，４Ｂを基板の辺に沿ってスキャンさせる工程を設けているので、前記除去領域よりも上流側の塗布膜の端面が窒素ガスの供給により乾燥し、ここからのさらなる塗布膜の溶解の発生や、塗布膜の溶解部分の広がりを抑えることができ、より効率良く基板Ｇの縁部の不要な塗布膜を除去することができる。ここで窒素ガスは乾燥に適した温度に温度調整したものを供給するようにしてもよい。
【００８２】
またこの実施の形態を上述の第１〜第５の実施の形態に組み合わせ、各実施の形態において、基板Ｇの縁部に窒素ガスのみを供給してスキャンを行う工程を設け、塗布膜をより効率良く除去するようにしてもよい。
以上において塗布膜除去部は、基板の縁部の所定位置に塗布膜の溶剤を供給しながら、基板の端縁に沿って移動する構成であれば上述の例に限らず、ガス吐出部や基板の裏面側に溶剤を供給する溶剤吐出部を設けない構成としてもよい。また上述の第１実施の形態においては、図１７に示す構成の塗布膜除去部７を用いて不要な縁部の塗布膜の除去を行うようにしてもよい。
【００８３】
この塗布膜除去部７は、基板の辺の端縁から第１の距離分内側に、塗布膜の溶剤を吐出する第１の溶剤吐出部７１と、前記辺の端縁から第１の距離よりも短い第２の距離分内側に、塗布膜の溶剤を吐出する第２の溶剤吐出部７２と、前記第１の溶剤吐出部７１及び第２の溶剤吐出部７２から吐出した溶剤及び塗布膜の溶解物を排出するための排出路７３と、この排出路に接続された図示しない吸引手段と、を備えている。
【００８４】
このように構成された塗布膜除去部７の第１の溶剤吐出部７１から溶剤を吐出しながら、前記塗布膜除去部７を基板の辺の端縁に沿って基板の一端側から他端側まで第１の回数移動させ、次いで第１の溶剤吐出部７１からの溶剤の吐出を停止して、前記第２の溶剤吐出部７２から溶剤を吐出しながら、前記塗布膜除去部７を前記基板の辺の端縁に沿って基板の一端側から他端側まで、第１の回数と同じか少ない第２の回数移動させて、基板Ｇの辺の縁部の不要な塗布膜を除去するようにしてもよい。このような塗布膜除去部７を用いた場合でも、上述の第１の実施の形態と同様の効果を得ることができる。
【００８５】
また上述の実施の形態では、基板Ｇの辺の端縁の位置を算出して、塗布膜除去部の移動路を補正するようにしたが、本発明では基板Ｇを支持ピン３６に載置する際に、例えば基板Ｇを機械的に押圧してアライメントを行うようにしてもよい。さらに位置検出部として例えばＣＣＤカメラを用い、このＣＣＤカメラの画像により基板Ｇの辺の端縁の位置を確認し、この位置に基づいて塗布膜除去部の移動路を補正するようにしてもよい。
【００８６】
さらに上述の実施の形態では、塗布膜除去部は基板の互いに対向する一対の辺に対して同時に処理するように構成されているが、基板の辺を１辺ずつ処理するように１個の塗布膜除去部を用いて処理を行うようにしてもよいし、基板の４辺を同時に処理するように４個の塗布膜除去部を備える構成としてもよい。
【００８７】
本発明はレジスト膜以外に保護膜等の塗布膜の除去にも適用可能である。さらに上述の実施の形態では半導体マスク用の角型基板を処理する装置について説明したが、ＦＰＤ（フラットパネルディスプレイ）用の角型基板等を処理する装置についても本発明は適用可能である。また角型基板としては、角部が平面的に見て直線状にカットされたタイプのものについても本発明は適用可能である。
【００８８】
【発明の効果】
本発明によれば、塗布膜が形成された角型基板に対して基板の縁部の不要な塗布膜を効率よく除去することができる。
【図面の簡単な説明】
【図１】本発明にかかる塗布膜形成装置の一実施の形態の全体構成を示す平面図である。
【図２】前記塗布膜形成装置の全体構成を示す概略斜視図である。
【図３】前記塗布膜形成装置に設けられる塗布膜除去ユニットの一例を示す断面図である。
【図４】前記塗布膜除去ユニットの平面図である。
【図５】前記塗布膜除去ユニットに設けられる塗布膜除去部の一例を示す断面図と平面図である。
【図６】前記塗布膜除去部の移動を制御する制御部の一例を示す構成図である。
【図７】前記塗布膜除去ユニットの作用を説明するための工程図である。
【図８】前記塗布膜除去ユニットの作用を説明するための工程図である。
【図９】前記塗布膜除去ユニットの作用を説明するための工程図である。
【図１０】前記塗布膜除去ユニットの作用を説明するための工程図である。
【図１１】前記塗布膜除去ユニットの作用を説明するための工程図である。
【図１２】前記塗布膜除去部の作用を説明するための断面図である。
【図１３】前記塗布膜除去ユニットの作用を説明するための平面図と側面図である。
【図１４】前記塗布膜除去ユニットの他の実施の形態の作用を説明するための工程図である。
【図１５】前記他の実施の形態の作用を説明するための平面図である。
【図１６】前記塗布膜除去ユニットのさらに他の実施の形態の作用を説明するための特性図である。
【図１７】前記塗布膜除去部の他の実施の形態の一例を示す断面図である。
【図１８】従来の基板の縁部の塗布膜を除去する様子を示す平面図である。
【符号の説明】
Ｇマスク基板
Ｂ１キャリアブロック
Ｂ２処理ブロック
２２主搬送手段
２３塗布ユニット
３塗布膜除去ユニット
３２基板チャック
３６支持ピン
４塗布膜除去部
４１基体
４２，４５溶剤吐出部
４３，４６ガス吐出部
４４吸引排気路
４７第１の位置センサ
４８第２の位置センサ
５３，５４Ｙ方向移動機構
５５，５６Ｘ方向移動機構
６制御部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method and an apparatus for removing an unnecessary coating film at the edge of a substrate from a rectangular substrate having a coating film formed on the surface thereof.
[0002]
[Prior art]
In the semiconductor device manufacturing process, when forming a semiconductor mask, a resist solution is applied to a square mask substrate, the resist film is exposed using a photomask, and further developed to produce a desired resist pattern. To be done. When performing the above processing, for example, as a method for forming a resist film, a spin mask is rotated in a state where a square mask substrate (hereinafter referred to as “substrate”) is placed and fixed on a spin chuck, for example. For example, a resist solution is dropped onto the central portion of the upper surface of the substrate, and the resist solution is applied by diffusing radially from the central portion of the substrate toward the peripheral portion by the rotational force and centrifugal force of the substrate.
[0003]
During this coating process, even if the film thickness is uniform immediately after coating, the resist solution swells at the periphery of the substrate due to the influence of surface tension as the rotation stops and the centrifugal force stops working and as time passes. It becomes thicker. In addition, a phenomenon occurs in which an unnecessary film is formed due to the resist solution wrapping around the peripheral portion of the lower surface of the substrate. When a non-uniform thick film is formed on the peripheral edge of the substrate in this way, the resist film on the peripheral edge remains without being completely removed during the development of the integrated circuit pattern or the like. The remaining resist is peeled off during the transfer process, which causes generation of particles.
[0004]
Therefore, conventionally, after a resist solution or the like is applied to the surface of the substrate, an unnecessary coating film on the outer edge of the pattern formation region of the substrate is removed. As such a method, while holding the square substrate 1 by the chuck 2 and discharging the resist solution solvent from the substrate edge cleaning blocks 10a to 10d toward the substrate edge, the cleaning blocks 10a to 10d are moved. There has been proposed a configuration (see, for example, Patent Document 1) in which an unnecessary resist film on a substrate edge is dissolved, peeled, and removed by moving along the substrate edge. The cleaning blocks 10a to 10d are formed in a U-shaped cross section when viewed from the side, and the edge of the substrate enters into the cleaning blocks 10a to 10d, and the melt is sucked from the intake groove 58.
[0005]
[Patent Document 1]
JP-A-7-263394 (see FIG. 1)
[0006]
[Problems to be solved by the invention]
By the way, for example, when an attempt is made to remove the 1 mm wide resist film from the edge of the substrate, the resist solution solvent is supplied from the cleaning blocks 10a to 10d to a location 1 mm inside from the edge of the substrate. The cleaning blocks 10a to 10d are scanned along the edge of the substrate. As a result, the resist film dissolves in the portion to which the solvent is supplied, and the dissolved material is sucked into the intake groove 58, but the solvent penetrates into the resist film inside the edge of the substrate and from there the resist film A phenomenon occurs in which the film melts and the melted resist flows out along the substrate surface in a linear shape. That is, although the thickness is small, the resist film remains linearly on the substrate surface.
[0007]
This phenomenon occurs every time the cleaning blocks 10a to 10d are scanned along the edge of the substrate, and when the scanning is performed about 10 times, a linear resist film is not recognized. The resist film on the edge of the substrate was removed by scanning 10 times or more. However, if the cleaning blocks 10a to 10d are scanned 10 times or more in this way, there are problems that the processing takes too much time and the amount of solvent used increases.
[0008]
Further, the mask substrate 1 is cut into an arc shape that forms a part of a circle having a radius of 2 mm when the corner portion is viewed in plan, and an unnecessary coating film on the edge portion is removed with a width of 1 mm from the edge of the substrate. Then, as shown in FIG. 18, although the resist film in the hatched region 11 can be removed at the edge of the substrate corner, the resist film in the region 12 is difficult to remove, and even if the cleaning blocks 10a to 10d are scanned 10 times or more, The resist film in this region tends to remain without being removed, which is a problem.
[0009]
The present invention has been made under such circumstances, and an object of the present invention is to provide a technique for efficiently removing an unnecessary coating film on a substrate edge.
[0010]
[Means for Solving the Problems]
  The coating film removing method of the present invention is connected to a solvent discharge section for discharging the solvent of the coating film, a discharge path for discharging the solvent discharged from the solvent discharge section and the dissolved solution of the coating film, and the discharge path. A coating film removing section provided with suction means, while discharging the solvent to the edge of the coating film formed on the surface of the square substrate, the coating film removing section is moved along the edge of the substrate. In the coating film removal method of removing an unnecessary coating film on the edge of the substrate surface by moving from one end side to the other end side of the substrate,
  While the solvent discharge unit discharges the solvent inward from the edge of the substrate by a first distance, the coating film removal unit is moved from one end side of the substrate to the other end side along the edge of the substrate. Moving the number of times 1;
  Next, the coating film removal unit is moved along the edge of the substrate along the edge of the substrate while the solvent is ejected by the solvent ejection unit to the inner side by a second distance shorter than the first distance from the edge of the substrate. Moving from the one end side to the other end side a second number of times equal to or less than the first number of times.Therefore, the moving speed of the coating film removing unit when removing the coating film in the region near the corner of the substrate is slower than the moving speed of the coating film removing unit when removing the coating film in the region near the center of the side of the substrate. DoIt is characterized by that. The second distance is preferably a distance shorter by 0.2 mm to 0.4 mm than the first distance.
[0011]
  Such a method includes a solvent discharge section that discharges the solvent of the coating film, a discharge path for discharging the solvent discharged from the solvent discharge section and the dissolved substance of the coating film, and suction means connected to the discharge path. , A coating film removing unit comprising:
  A moving mechanism for moving the coating film removing portion along the edge of the substrate from one end side to the other end side of the substrate;
  While discharging the solvent inward for a first distance from the edge of the substrate, the coating film removal unit is moved along the edge of the substrate from one end side to the other end side of the substrate a first number of times, Next, while discharging the solvent inwardly by a second distance shorter than the first distance from the edge of the substrate, the coating film removing unit is moved from one end side to the other end side of the substrate along the edge of the substrate. And a controller that controls the moving mechanism to move the second number of times equal to or less than the first number of times, and a coating film removing apparatus characterized by comprising: A first solvent discharge portion for discharging the solvent of the coating film to the inner side by a distance; and a second solvent for discharging the solvent of the coating film to the inner side by a second distance shorter than the first distance from the edge of the substrate. Discharge unit, solvent and coating film discharged from first solvent discharge unit and second solvent discharge unit A discharge passage for discharging the melt, and the coating film removing section and a suction means connected to the discharge channel,
  A moving mechanism for moving the coating film removing portion along the edge of the substrate from one end side to the other end side of the substrate;
  While discharging the solvent from the first solvent discharge unit to the coating film on the surface of the substrate, the coating film removal unit is moved along the edge of the substrate from the one end side to the other end side of the substrate a first number of times. The coating film removing unit is moved from one end side to the other end side of the substrate along the edge of the substrate while the solvent is discharged from the second solvent discharging unit to the coating film on the substrate surface. , Controlling the moving mechanism to move the second number of times equal to or less than the first number of timesIn addition, the moving speed of the coating film removing unit when removing the coating film in the region near the corner of the substrate is higher than the moving speed of the coating film removing unit when removing the coating film in the region near the center of the side of the substrate. Control the moving mechanism to slow downAnd a controller for performing the coating film removal.
[0012]
In such a method, even if the number of scans of the coating film removal unit is small, an unnecessary coating film on the edge of the substrate can be efficiently removed, thereby shortening the processing time and saving the solvent of the coating film. Can be planned.
[0014]
  Here, in the present invention, the coating film removal unit includes a position detection unit that detects the position of the edge of the substrate, and the coating film removal is performed before the solvent is discharged from the coating film removal unit to the edge of the substrate. The two positions of the edge of the substrate are detected by the unit, and this detected valueOn the basis of theThe method may include a step of correcting the moving path of the coating film removing unit.Good.
[0015]
Further, the solvent is discharged to the edge of the coating film in the region near the corner of the substrate, and the solvent is not discharged to the edge of the coating film in the region near the center of the side of the substrate. Moving the coating film from one end side to the other end side of the substrate a predetermined number of times along the edge, and discharging the coating film removal portion along the edge of the substrate while discharging the solvent to the edge portion of the coating film on the substrate And a step of moving a predetermined number of times from one end side to the other end side. Furthermore, the step of moving the coating film removing portion a predetermined number of times from one end side of the substrate to the other end side along the edge of the substrate while discharging the solvent to the edge portion of the coating film of the substrate, A step of moving the coating film removing portion a predetermined number of times from one end side to the other end side of the substrate along the edge of the substrate while supplying an inert gas to the edge portion of the coating film; A step of moving the coating film removing unit a predetermined number of times from one end side to the other end side of the substrate along the edge of the substrate while discharging the solvent to the edge of the substrate. Further, after the unnecessary coating film at the edge portions along the pair of opposite sides of the substrate is removed by the coating film removing unit, the orientation of the substrate is changed, and another pair different from the pair of sides in the substrate. You may make it remove the unnecessary coating film of the edge part along the edge | side.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a coating film forming apparatus incorporating a coating film removing apparatus in which the coating film removing method of the present invention is implemented will be described. Here, FIG. 1 is a plan view showing an overall configuration according to an embodiment of a coating film forming apparatus, and FIG. 2 is a schematic perspective view thereof. In the figure, B1 is a carrier block for carrying in / out a carrier C in which, for example, five substrates, for example, a mask substrate G are accommodated, and this carrier block B1 is transferred to and from the carrier placing portion 20 on which the carrier C is placed. Means 21.
[0017]
The mask substrate G is, for example, a glass substrate for forming a semiconductor mask. For example, the mask substrate G is a square having a side length of 152 ± 0.5 mm, a thickness of 6.35 mm, and a side length of 6 mm. An inch-size square glass substrate is used. The delivery means 21 takes out the substrate G from the carrier C, and can move left and right, back and forth, move up and down, vertically so as to deliver the removed substrate G to the processing unit B2 provided on the back side of the carrier block B1. It is configured to be rotatable around its axis.
[0018]
A main conveying means 22 is provided at the center of the processing section B2, and for example, when viewed from the carrier block B1, the coating unit 23 and the developing unit 24 are on the right side, and the cleaning unit 25 is on the left side. Shelf units U1 and U2 in which heating / cooling units and the like are stacked in multiple stages are arranged on the front side and the back side, respectively. The coating unit 23 is a unit that performs a process of coating a resist solution on a substrate, and the developing unit 24 is a unit that deposits a developer on an exposed substrate and performs the developing process for a predetermined time, and a cleaning unit 25. Is a unit for cleaning the substrate before applying the resist solution.
[0019]
The shelf units U1 and U2 are configured by stacking a plurality of units. For example, as shown in FIG. 2, in addition to the coating film removing unit 3, the heating unit 26, and the cooling unit 27, the substrate G delivery unit 28 and the like are arranged vertically. Assigned to. The main transport means 22 is configured to be movable up and down, reciprocated and rotatable about a vertical axis, and serves to transport the substrate G between the shelf units U1 and U2, the coating unit 23, the developing unit 24, and the cleaning unit 25. have. However, in FIG. 2, the delivery means 21 and the main transport means 22 are not drawn for convenience.
[0020]
The processing unit B2 is connected to an exposure apparatus B4 through an interface unit B3. The interface part B3 is provided with a delivery means 29. The delivery means 29 is, for example, configured to be movable up and down, movable left and right, back and forth, and rotatable about a vertical axis, and the processing block B2 and the exposure apparatus B4. The board | substrate G is delivered between.
[0021]
The flow of the substrate G in such a coating film forming apparatus will be described. First, the carrier C is first carried into the carrier mounting unit 20 from the outside, and the substrate G is taken out from the carrier C by the transfer means 21. The substrate G is transferred from the transfer means 21 to the main transfer means 22 via the transfer unit 28 of the shelf unit U1, and is sequentially transferred to a predetermined unit. For example, a predetermined cleaning process is performed in the cleaning unit 25, heat drying is performed in one of the heat treatment units, the temperature is adjusted to a predetermined temperature in the cooling unit 27, and the components of the coating film are adjusted in the coating unit 23. A coating solution in which is dissolved in a solvent, for example, a resist solution is applied.
[0022]
Subsequently, the unnecessary resist film (coating film) attached to the edge of the substrate G is removed from the substrate G by the coating film removing unit 3. Here, the edge portion of the substrate G means a peripheral region outside the pattern formation region of the substrate and a substrate end surface. Thereafter, the substrate G is heated to a predetermined temperature by one of the heating units 26 and prebaked, and then adjusted to a predetermined temperature by one of the cooling units 27. The paper is transferred to the transfer means 29 of the interface unit B3 via the transfer unit 28 of the shelf unit U2, and is transferred to the exposure apparatus B4 by the transfer means 29 to perform a predetermined exposure process. Thereafter, the substrate G is transported to the processing unit B2 via the interface unit B3, heated to a predetermined temperature by one of the heating units 26, and subjected to a post-exposure baking process. Next, after cooling to a predetermined temperature by the cooling unit 27 and adjusting the temperature, the developer is accumulated in the developing unit 24 and a predetermined development process is performed. The substrate G on which the predetermined circuit pattern is thus formed is returned to, for example, the original carrier C through the main transport unit 22 and the transfer unit 21 of the carrier block B1.
[0023]
Next, the coating film removing unit 3 constituting the coating film removing apparatus of the present invention will be described with reference to FIGS. In the drawing, reference numeral 30 denotes a processing container, and a substrate G loading / unloading port 31 configured to be opened and closed by, for example, a shutter 31a is formed on a side surface of the processing container 30 via the loading / unloading port 31. Is configured to be accessible.
[0024]
In such a processing container 30, a substrate chuck 32 for transferring the substrate G to and from the main transfer means 22 is transferred to and from the main transfer means 22 via the carry-in / out port 31. It is provided at a position where it can be performed. The substrate chuck 32 includes, for example, four holding portions 33 for holding four corners of the substrate G, and these holding portions 33 are moved by a lifting mechanism 34 and a rotating mechanism 35 via a holding arm 33a. It is configured to be movable up and down and rotatable about a substantially vertical axis.
[0025]
Further, four support pins 36 for holding the substrate are provided in the processing container 30 at positions where they do not interfere with the substrate chuck 32. These support pins 36 are for holding the substrate G during the removal process of the coating film, and the substrate chuck 32 moves up and down with respect to the support pins 36 so that the substrate G is transferred to and from the substrate chuck 32. It has come to be. These support pins 36 stably support the substrate G, and hold the substrate G in a state where it does not interfere with a coating film removing section described later.
[0026]
Further, inside the processing container 30, the substrate G is moved on both sides in the Y direction of the substrate G supported by the support pins 36 along the edges of a pair of opposite sides extending in the Y direction of the substrate G, Coating film removal portions 4A and 4B are provided for removing a resist film, which is an unnecessary coating film at the edge of the side. In this example, the coating film removing unit 4 (4A, 4B) includes a base 41 having a substantially U-shaped cross section, as shown in FIG. It is provided so that it may pinch.
[0027]
The upper surface portion of the base body 41 is provided with a solvent discharge portion 42 in which a large number of solvent discharge holes 42 a are arranged along the edge of the edge of the substrate surface, and the solvent discharge portion 42 from the solvent discharge portion 42 on the substrate surface is provided. A gas discharge portion 43 for supplying an inert gas, for example, nitrogen (N2) gas, is provided in an inner region as viewed from the edge of the supply region. In addition, a suction discharge path 44 that is a discharge path for sucking and discharging the solvent, the inert gas, and the dissolved material of the coating film by the solvent is formed on the back surface portion of the base body 41. For example, a suction pump, which is a suction means, is connected.
[0028]
In this example, the lower surface portion of the base body 41 is also provided with a solvent discharge portion 45 in which a large number of solvent discharge holes 45a are arranged along the peripheral region of the edge of the back surface of the substrate, and the solvent discharge portion on the back surface of the substrate. A gas discharge portion 46 for supplying an inert gas, for example, nitrogen (N2) gas, is provided in an inner region as viewed from the edge of the solvent supply region 45. A solvent tank (not shown) for storing a solvent through a solvent supply path (not shown) is not provided in the solvent discharge sections 42 and 45, and a gas supply path (not shown) is not provided in the gas discharge sections 43 and 46. Gas tanks (not shown) for storing active gas are connected to each other. Further, the tips of the solvent nozzles 42 and 45 are formed so as to incline toward the suction / discharge path 44, respectively.
[0029]
Further, a step portion 41a is formed in the front surface portion of the upper surface portion of the base body 41 so as to widen the U-shaped opening portion than the region where the solvent discharge portions 42 and 45 and the gas discharge portions 43 and 46 are provided. The step portion 41 a is provided with a first position sensor 47 so as to face the substrate surface, and a second position is provided at a position facing the first position sensor 47 in the lower surface portion of the base body 41. A sensor 48 is provided. Each of the first and second position sensors 47 and 48 is a fiber sensor, and one side is configured as a light emitting element and the other side is configured as a light receiving element, and detects a certain position on the edge of the substrate G. . In this example, the first and second position sensors 47 and 48 correspond to a position detection unit.
[0030]
For example, the coating film removing unit 4 has a width X of 3 mm to 30 mm and an interval Y of 6 mm to 8 mm. For example, an edge portion having a width of about 1 mm to 5 mm is not required for a substrate G having a thickness of 5 mm to 7 mm. It is formed in a shape that can remove a coating film. The solvent discharge hole 42a may have a plurality of holes as shown in FIG. 5, or may be a single hole or a slit.
[0031]
The coating film removal unit 3 extends opposite to each other in the Y direction provided substantially parallel to a pair of opposite sides in the Y direction of the substrate G on both outer sides of the substrate G held by the support pins 36. The Y-direction guide rails 51 and 52 are provided, and the coating film removing portions 4A and 4B are movable in the Y direction along the Y-direction guide rails 51 and 52 by Y-direction moving mechanisms 53 and 54, respectively. It is configured. The Y-direction guide rails 51 and 52 are configured to be movable in the X direction along the X-direction guide rails 57 and 58 extending in the X direction by the X-direction moving mechanisms 55 and 56, thereby the coating film removing unit. 4A and 4B are configured to be movable along the X and Y axes in a state where the X and Y axes are synchronized. Here, the Y-direction moving mechanisms 53 and 54 are configured by, for example, a belt drive mechanism, and the X-direction moving mechanisms 55 and 56 are configured by, for example, a ball screw mechanism. In FIG. 3, M1 and M2 are motors for the Y-direction moving mechanisms 53 and 54, respectively, and M3 and M4 are motors for rotating the ball screws of the X-direction moving mechanisms 55 and 56, respectively.
[0032]
The driving operation of the shutter 31a, the lifting mechanism 34 of the substrate chuck 32, the rotating mechanism 35, the motors M1 and M2 of the Y-direction driving mechanisms 53 and 54, and the motors M3 and M4 of the X-direction driving mechanisms 55 and 56 are controlled by the control unit 6. Controlled by The control unit 6 includes a CPU (central processing unit), a program, a memory, and the like. Here, each function is blocked and described as a component based on FIG. The control unit 6 creates and manages recipes for each processing unit and controls each processing unit according to the recipe. The main point of the operation in this embodiment is the coating film removing unit. Since this is in the movement control of 4A and 4B, this point will be described with emphasis.
[0033]
In FIG. 6, 61 is a recipe creation unit, 62 is a recipe storage unit, and 63 is a recipe selection unit. The recipe creation unit 61 includes the type of solvent of the coating film, the removal width of the coating film (the substrate of the coating film to be removed) The distance from the edge), the scanning speed of the coating film removal units 4A and 4B, the number of scans, and the like can be input, and a recipe that combines processing conditions necessary for the coating film removal processing can be input here. Each recipe created in the above is stored in the recipe storage unit 62. A plurality of recipes are prepared according to the target coating film, and the operator selects a target recipe from a plurality of recipes stored in the recipe storage unit 62 by the recipe selection unit 63. B1 is a bus.
[0034]
The control unit 6 includes a discharge position correction unit 64. The discharge position correction unit 64 detects the positions of the corresponding substrate edge by the coating film removal units 4A and 4B, obtains the position of the substrate edge based on the detected value, and according to the position. The coating film removal units 4A and 4B have a function of correcting the movement path during the coating film removal process.
[0035]
Specifically, this function will be described. For example, as shown by a solid line in FIG. 7, two upper and lower edges of the pair of opposite sides G1 and G3 of the substrate provided in the coating film removing portions 4A and 4B, respectively. First, the removal units 4A and 4B are moved in the Y-axis direction by the Y-direction moving mechanisms 53 and 54 so as to be positioned in the vicinity of the line connecting the position sensors 47 and 48 (see FIG. 7A), and then X It is moved in the X-axis direction by the direction moving mechanisms 55 and 56 (see FIG. 7B), thereby grasping the positions of the first points P1A and P1B at the respective edges of the sides G1 and G3 of the substrate. Next, as shown in FIGS. 7C and 7D, similarly to the first point P1 (P1A, P1B), the second point P2 (P2A, P2B) at the edge of the side G1, G3 of the substrate is used. Know the position of the. Here, the control unit 6 recognizes the positions of the coating film removing units 4A and 4B based on information from the motors M1 and M2 of the Y-direction moving mechanisms 53 and 54 and the motors M3 and M4 of the X-direction moving mechanisms 55 and 56. Thus, the position coordinates of the first and second points P1, P2 of the respective sides G1, G3 are grasped.
[0036]
Next, based on the positional information of the first point P1 and the second point P2 of the substrate edge, for example, the numerical difference of the coordinate points, the position of the edge of the sides G1 and G3 of the substrate by a linear equation Is calculated. Specifically, referring to FIG. 8, first, the position coordinates of the home position of the coating film removing unit 4A (4B) are set to coordinates (0, 0), and the coating film removing unit 4A (4B) is set to the Y axis (Y direction guide The coating film removal unit 4A (4B) is moved along the X axis (X direction guide rail 57 (58)) to the position corresponding to the first point P1 along the rail 51 (52). Is moved to the position of the point P1 to obtain the coordinate data of the point P1, for example, the first coordinates (5, 8). Here, the home position is a position where the coating film removal unit 4A (4B) on one end side of the edge of the substrate stands by, for example.
[0037]
Subsequently, after the coating film removal unit 4A (4B) is returned to the home position, the coating film removal unit 4A (4B) corresponds to the second point P2 along the Y axis (Y-direction guide rail 51 (52)). Next, the coating film removing unit 4A (4B) is moved to the position of the second point P2 along the X axis (X direction guide rail 57 (58)), and the coordinate data of the point P2, for example, The second coordinate (25, 15) is acquired.
[0038]
Thereafter, the coating film removing unit 4A (4B) is returned to the home position, and the first and second points P1, P2 are determined by the first coordinates (5, 8) and the second coordinates (25, 15). Is calculated, and this data is output by the correction value output unit 65 to the motors M1 to M4 of the Y-direction drive mechanisms 53 and 54 and the X-direction drive mechanisms 55 and 56, respectively. Is done. In the actual removal process of the coating film, the coating film is removed by the inclination angle θ so that the solvent of the coating film is supplied from the coating film removing units 4A and 4B to a position a predetermined distance from the edge of the substrate. With the movement of the removal unit 4A (4B) in the X-axis direction controlled, the coating film removal unit 4A (4B) is moved from one end side to the other end side of the substrate G along the substrate edge. That is, while moving the coating film removing unit 4A (4B) in the X-axis direction so that the moving path of the coating film removing unit 4A (4B) is inclined at an angle θ from the Y-axis (Y-direction guide rail 51 (52)), the substrate Move in the Y-axis direction along the edge.
[0039]
In this example, by obtaining the inclination angle θ, the inclination of the substrate edge from the Y-axis (Y-direction guide rail 51 (52)) is calculated to obtain the position of the substrate edge, and the coating film removing unit 4A Since the movement of the coating film removal unit 4A (4B) is controlled so that the movement path of (4B) is inclined at an angle θ from the Y axis, the movement path of the coating film removal unit 4A (4B) is corrected. Become.
[0040]
Further, the tilt angle θ is calculated, a tilt table from the Y-axis of the substrate edge is created in advance, and the coating film removing units 4A and 4B are moved so as to move the coating film removing unit 4A (4B) along this table. And the information of the travel path corrected in this way is supplied to the motors M1 to M4 of the Y-direction drive mechanisms 53 and 54 and the X-direction drive mechanisms 55 and 56 by the correction value output unit 65, respectively. In the actual processing, the coating film removal units 4A and 4B may be moved along the corrected movement path to perform the coating film removal processing.
[0041]
Next, a first embodiment of the coating film removal method of the present invention performed in the coating film removal unit 3 will be described with reference to FIGS. First, the shutter 31a of the processing container 30 is opened, the substrate G is transferred into the processing container 30 by the main transfer means 22 through the loading / unloading port 31 and transferred to the substrate chuck 32, and the loading / unloading port 31 is closed by the shutter 31b (FIG. 9 ( a), Step S1). Subsequently, the substrate chuck 32 is lowered to deliver the substrate G to the support pins 36 (FIG. 9B, step S2).
[0042]
Thereafter, the coating film removal units 4A and 4B are moved as described above to detect the positions of the two points P1 and P2 at the edges of the pair of sides G1 and G3 facing each other on the substrate G, and coating is performed. The movement path during the removal process of the film removing units 4A and 4B is corrected (FIG. 9C, step S3). Thereafter, the coating film removal units 4A and 4B are moved to one end side of the corrected movement path, and then the movement path is supplied while supplying the solvent of the coating film to the respective predetermined positions on the front surface side and the back surface side of the substrate G. A predetermined number of times are scanned from one end side to the other end side of the sides G1 and G3 of the substrate along the substrate to remove a predetermined coating film (FIGS. 9D and 11A).
[0043]
Here, as shown in FIG. 12A, the scan start position is one end side of the sides G1 and G3 of the substrate, for example, a position where the solvent is supplied to the inner side of the first distance A1, for example, 1 mm from the edge of the substrate surface. The scanning end position is a position where the solvent is supplied to the other end side of the sides G1 and G3 of the substrate, for example, at a first distance A1, for example, 1 mm inside from the edge of the substrate surface. At this time, the first distance A1 from the edge of the substrate means that the removal width of the coating film at the edge of the substrate is A1.
[0044]
In this way, a solvent, for example, a thinner solution is supplied to a position 1 mm inside from the edges of the sides G1 and G3 of the substrate surface, and nitrogen gas is supplied to the inside of the solvent supply region, while the substrate G is also provided on the back side of the substrate G. For example, while supplying the solvent to the inside by about 5 mm from the edge and supplying the nitrogen gas to the inside of the solvent supply region, the coating film removing units 4A and 4B are reciprocated along the edge of the substrate G to obtain the substrate G For example, five scans from one end side to the other end side (first removal step (step S4), FIG. 11A). Here, when the coating film removing unit 4 is moved from one end side to the other end side of the substrate, the number of scans is set to 1.
[0045]
As a result, unnecessary resist films adhering to the edge portions on the front and back sides of the substrate are dissolved, and the solvent and dissolved matter are blown off to the outer side of the substrate G by nitrogen gas and sucked by the suction means. As a result, it is sucked and discharged from the suction / discharge path 44.
[0046]
Thereafter, as shown in FIG. 12B, the coating film removing portions 4A and 4B are slightly moved from the edge of the substrate surface to the position where the solvent is supplied to the inside of the second distance A2 which is shorter than the first distance A1. Let The second distance A2 is a distance shorter than the first distance A1 by, for example, about 0.2 to 0.4 mm, and the difference between the first distance A1 and the second distance A2 is that the solvent is removed from the removal region. This corresponds to the distance soaking into the inner coating film.
[0047]
Thus, for example, the solvent is supplied to a position, for example, 0.8 mm inside from the edges of the sides G1 and G3 on the substrate surface, and the nitrogen gas is supplied to the inside of the solvent supply position, while the sides G1 and G3 on the back surface of the substrate are supplied. While supplying the solvent to a position 4.8 mm inside from the edge of the film, and reciprocating the coating film removing portions 4A and 4B along the substrate G while supplying nitrogen gas to the inside of the supply position of the solvent, Scan from side to end of the sides G1 and G3 of the substrate G for the same number of times as the first removal process or a smaller number of times than the first removal process, for example three times (second removal process (step S5, FIG. 11B) )).
[0048]
After removing the coating film on the edge of the substrate G in this way, the substrate chuck 32 is raised to transfer the substrate G from the support pins 36 to the substrate chuck 32, and then the substrate chuck 32 is rotated 90 degrees and then lowered. Then, the substrate G is delivered to the support pins 36 (step S6). As a result, a pair of opposite sides G2 and G4 of the substrate G correspond to the coating film removing portions 4A and 4B, and the edge of the substrate G on which the coating film is removed is changed (FIG. 11C).
[0049]
Next, in the same manner as when the coating films on the sides G1 and G3 are removed by the coating film removing units 4A and 4B, first, two locations on the edges of the sides G2 and G4 of the substrate G are measured, and the coating film removing units 4A and 4B After correcting the movement path (step S7), the first removal step is performed on the sides G2 and G4 of the substrate surface G in the same manner as the sides G1 and G3 (step S8), and then the second removal step ( Step S9) is performed.
[0050]
Thus, the substrate G from which the unnecessary coating film at the edge has been removed with respect to all sides is transferred to the substrate chuck 32 and waits at a position where it is transferred to and from the main transfer means 22, and the shutter 31a is moved. It is opened, transferred to the main transfer means 22 via the carry-in / out port 31 and carried out from the processing container 30, and then the carry-in / out port 31 is closed by the shutter 31a (step S10). In the above, the movement operation of the coating film removing units 4A and 4B is controlled by the control unit 6 via the Y direction moving mechanisms 53 and 54 and the X direction moving mechanisms 55 and 56.
[0051]
In such a method, when removing the coating film on the edge of the substrate G, the removal width (distance from the edge of the substrate) of the edge of the substrate G is changed during the process. Even if the number of scans of the removal units 4A and 4B is reduced, good removal performance can be ensured, thereby shortening the processing time and saving the amount of solvent.
[0052]
More specifically, as described in the prior art section, when a solvent is supplied from the coating film removing unit 4 to the edge of the coating film R, the solvent is applied to the coating film R upstream of the supply position. When it soaks into the inside and is sucked by the suction means, it flows while dissolving the coating film R, so that the melted coating film flows out linearly along the substrate surface as shown in FIG. . Since this phenomenon occurs every time the coating film removal unit 4 is scanned along the edge of the substrate, the linear coating film is removed when the removal width of the peripheral region of the substrate G is not changed as in the prior art. Therefore, it is necessary to scan the coating film removing unit 4 about 10 times.
[0053]
On the other hand, in the present invention, the distance that the solvent soaks into the coating film R is about 0.2 mm to 0.4 mm. Therefore, in the first removal step, the distance A1 corresponding to the removal width is located on the inner side from the edge. For example, in the second removal step, the supply position of the solvent is changed to a position closer to the edge corresponding to the distance that the solvent penetrates into the coating film R. In this case, a phenomenon occurs in which the solvent soaks into the coating film R upstream of the solvent supply position even in the second removal step, but the solvent soaks into a region inside the removal region of the coating film R. Therefore, dissolution of a new coating film R can be suppressed.
[0054]
Further, the portion of the linear coating film that has flowed out in the first removal step is removed by supplying the solvent from the downstream side of the solvent supply position. Further, the portion of the linear coating film upstream from the solvent supply position is a thin coating film generated by the outflow of the coating film, so that the solvent supplied in the second removal step is upstream. By soaking into the coating film R, the coating film in the region can be removed if the coating film removing unit 4 is scanned about a few times. As a result, the total number of scans can be reduced as compared with the case where the removal width of the coating film is not changed, and the processing time can be shortened and the solvent can be saved.
[0055]
Here, for the number of scans of the coating film removal unit 4 in the first removal process and the second removal process and the supply position of the solvent in the second process, for example, the scanning speed of the coating film removal unit 4 and the supply of the solvent Although depending on the amount, according to the experiments of the present inventors, for example, the length of one side is a substrate G of 6 inches, the thickness of the resist film (coating film) is 0.5 μm to 1 μm, and the edge of the substrate G When the removal width from 1 mm is 1 mm, the number of scans in the first process is 2 to 5 times, the difference between the distance A1 and the distance A2 is 0.2 mm to 0.4 mm, and the number of scans in the second removal process is 1 to 1. Three times have been found to be preferred.
[0056]
Further, in this embodiment, when the substrate G is held by the support pins 36, the edge of the substrate G is not mechanically pressed to align the substrate itself, but by the coating film removing units 4A and 4B. Two positions of the edge of the substrate G are detected, the position of the substrate edge is calculated by a linear equation based on the detected value, and the coating film removing units 4A and 4B are calculated based on the position thus obtained. The travel path is corrected. For this reason, in the mechanical alignment, the pressing member comes into contact with the end face of the substrate on which the coating film is attached, so that the coating film adheres to the pressing member and causes particle generation. Then, since there is no step in contact with the end face of the substrate, generation of particles can be suppressed.
[0057]
Further, since the control unit 6 can accurately calculate the position of the substrate edge by calculation based on the positions of the two edges of the substrate G, the movement path of the coating film removal units 4A and 4B is also corrected accurately. Therefore, it is possible to remove an unnecessary coating film at an edge having a width as small as 1 mm with high accuracy, which is effective.
[0058]
Furthermore, in this example, the coating film removal units 4A and 4B are provided with a solvent discharge unit 45 for supplying the solvent for the coating film on the back side of the substrate G, so that unnecessary coating adhered to the edge on the back side of the substrate. The film can be removed. Further, the coating film removing units 4A and 4B are provided with gas discharge units 43 and 46 for supplying nitrogen gas inside the solvent supply region on the front surface side and back surface side of the substrate G. Since it is sucked and exhausted by the suction / discharge path 44, when the solvent or the dissolved substance of the coating film is discharged to the suction / discharge path 44, it works to push them out toward the suction / discharge path 44. It is discharged to the suction discharge path.
[0059]
Next, a second embodiment of the present invention will be described. In this example, as shown in FIG. 14, for example, the mask substrate G is attached to the edge of the corner portion of the mask substrate G cut in an arc shape when seen in a plan view. This is a method for effectively removing the applied film.
[0060]
Also in this example, after carrying the substrate G into the processing container 30 and delivering the substrate G to the support pins 36 via the substrate chuck 32, a pair of sides of the substrate G facing each other by the coating film removing units 4A and 4B. Until the step of detecting the positions of the two points P1 and P2 at the edges of G1 and G3 and correcting the moving path during the removal processing of the coating film removing units 4A and 4B by the control unit 6, the above-described implementation is performed. It is the same as the form.
[0061]
Then, the coating film removing units 4A and 4B are moved to the discharge start position on the corrected moving path. In this example, the discharge start positions of the coating film removing units 4A and 4B are positions facing the diagonal line of the substrate G as shown in FIG. Next, along the moving path, the solvent is supplied to the position of the inner edge of the edge of the predetermined width A1 of the side G1, G3 of the substrate surface, for example, the position inside the distance A1, for example, 1 mm from the edge of the sides G1, G3, While supplying nitrogen gas to the inner side of the solvent supply position, the solvent is supplied to a predetermined position of the side G1 and the side G3 on the back surface of the substrate, for example, a position 5 mm inside from the edge, and to the inner side of the solvent supply position. While supplying nitrogen gas, scanning is performed from one end side to the other end side of the substrate, and the coating film at the edge in the vicinity of the center of the first sides G1 and G3 of the substrate G is removed.
[0062]
Subsequently, when the coating film removing portions 4A and 4B are moved to the position on the other end side of the sides G1 and G3 of the substrate, that is, from the edge of the corners C1 and C3 of the substrate G to the position for removing the edge of the predetermined width A1. In addition, the coating film removing units 4A and 4B are moved to the X-axis moving mechanisms 55 and 56 so that the solvent is supplied to the position where the edge of the corner is removed while maintaining the posture of the coating film removing units 4A and 4B. By moving along the second side, that is, the sides G2 and G4 of the substrate G, the coating film in this region is removed (see FIG. 14A).
[0063]
After removing the coating film at the edges of the first sides G1 and G3 of the substrate G in this way, the substrate G is rotated by 90 degrees by the substrate chuck 32 (see FIG. 14B), and then the substrate G is similarly formed. The coating film at the edge of the predetermined width A1 is removed from the second sides G2 and G4 (see FIG. 14C), and then the substrate G is transferred to the main transport means 22 from the coating film removal unit 3. Take it out. In the above, the movement operation of the coating film removing units 4A and 4B is controlled by the control unit 6 via the Y direction moving mechanisms 53 and 54 and the X direction moving mechanisms 55 and 56.
[0064]
In such a method, the coating film at the edge of the corner of the mask substrate G can be efficiently removed. That is, the mask substrate G is cut into an arc shape in which the corner portion of the substrate G forms a part of a circle having a radius of 2 mm as described above, and the edge portion is coated with a slight width of 1 mm from the edge of the substrate G. Since the film is removed, when the coating film removing unit 4A, 4B is moved along the edge of the side of the substrate G and the solvent is supplied to perform the coating film removing process, as described in the column of the prior art, There is a coating film that cannot be completely removed from the edge of the corner.
[0065]
On the other hand, in this embodiment, as shown in FIG. 15A, when the coating film removing portions 4A and 4B move from the edge of the corner of the substrate G to the edge of the predetermined width A1, Since the solvent is supplied to the position where the coating film at the edge of the corner is removed by moving along the second sides G2 and G4 in the X direction, the region indicated by the oblique lines in FIG. The coating film can be removed, and the coating film at the edge of the corner can also be efficiently removed. Here, the coating film is removed up to a region inside the edge portion of the predetermined width A1 at the corner portion of the substrate, but this region is outside the pattern formation region and has no problem.
[0066]
In this embodiment, when removing the coating film at the edge of the corner portion of the substrate G, the solvent is supplied from the coating film removing portions 4A and 4B to the position near the inner edge of the edge portion having the predetermined width A1 of the corner portion. As described above, the coating film removing units 4A and 4B are moved stepwise by the X direction driving mechanisms 55 and 56 and the Y direction driving mechanisms 53 and 54, thereby removing the coating film at the edge of the corner. Also good. In this case, the coating film at the edge of the corner having the predetermined width A1 can be more reliably removed.
[0067]
Next, a third embodiment of the present invention will be described. In this example, when the coating film removal units 4A and 4B are scanned a predetermined number of times with respect to the side of the substrate G to remove unnecessary coating films on the edge of the substrate, the scanning speed is slowed at the last multiple scans. By doing so, the total processing time is shortened.
[0068]
Also in this example, the process up to the step of carrying the substrate G into the processing container 30 and correcting the movement path during the removal process of the coating film removing units 4A and 4B is the same as that of the above-described embodiment. Subsequently, the coating film removing units 4A and 4B are moved to the corrected ejection start position of the moving path, and then along the moving path, a predetermined position of the pair of sides G1 and G3 facing each other on the substrate, for example, 1 mm from the edge. While supplying the solvent to the inner position, scanning is performed from one end side to the other end side of the sides G1 and G3 of the substrate X1 times, for example, 8 times, at a speed V1, for example, about 100 mm / sec.
[0069]
Next, the scanning speed of the coating film removing units 4A and 4B is changed to a speed V2 that is slower than the speed V1, for example, a speed of about 50 mm / sec. Remove.
[0070]
After removing the coating film on the sides G1 and G3 of the substrate G in this way, the substrate G is rotated 90 degrees by the substrate chuck 32, and the coating film is similarly applied to the pair of sides G2 and G4 facing each other on the substrate G. Next, the substrate G is transferred to the main transfer means 22. In the above, the movement operation of the coating film removing units 4A and 4B is controlled by the control unit 6 via the Y direction moving mechanisms 53 and 54 and the X direction moving mechanisms 55 and 56.
[0071]
In such a method, the coating film at the edge can be efficiently removed while shortening the processing time. That is, in the present embodiment, when the inventors remove the coating film on one side of the substrate G, when the total number of scans of the coating film removal unit 4 is, for example, 10, the predetermined number of scans, for example, The process is performed at a scan speed of about V1 up to 8 times, and then the process is performed at a scan speed of about V2 that is slower than the speed V1 for the last two times, for example, at a slow scan speed of about V2 for example. As a result of finding that a coating film peeling state of about the same level as when processing was performed 10 times can be secured, the above-described method allows the coating film removal unit 4 to scan a predetermined number of times. When the processing is performed, it is possible to efficiently remove the coating film on the edge portion while shortening the processing time as compared with the case where scanning is performed all times at a slower speed.
[0072]
In addition, this embodiment is combined with the first embodiment or the second embodiment described above, and in each embodiment, scanning is performed X1 times at a speed V1 out of a predetermined number of scans, and then from the speed V1. Alternatively, the total processing time may be shortened by scanning X2 times at a slower speed V2.
[0073]
Next, a fourth embodiment of the present invention will be described. In this embodiment, by changing the scanning speed of the coating film removing unit 4 between the region near the center of the side of the substrate G and the region near the corner, the coating film at the edge of the substrate corner can be reliably secured. It is a technique to remove.
[0074]
Also in this example, the process up to the step of carrying the substrate G into the processing container 30 and correcting the movement path during the removal process of the coating film removing units 4A and 4B is the same as that of the above-described embodiment. Subsequently, the coating film removing units 4A and 4B are moved to the discharge start position of the corrected moving path, and then along a predetermined position of the pair of sides G1 and G3 facing each other along the moving path, for example, from an edge. A predetermined coating film is removed by scanning a predetermined number of times from one end side to the other end side of the sides G1 and G3 of the substrate while supplying the solvent to a position 1 mm inside, as shown in FIG. As shown, a region in the vicinity of the corner of the substrate, for example, a region from L0 position (scan start side) to L1 position on one end side of the substrate, for example, about L0 to 30 mm is moved at a speed V3, for example, 40 mm / sec. The region from the L1 position to the L2 position of the substrate corresponding to the region near the center (region of about 30 mm to 90 mm from one end side L0 of the substrate) moves at a speed V4 faster than the speed V3, for example, 100 mm / sec. Subsequently, a region near the corner on the other end side from the L2 position to the L3 position of the substrate, for example, 30 mm from the other end (scan end side) of the substrate at a speed V5 that is slower than the speed V4, for example, 40 mm / sec. The scanning speed is controlled by the control unit 6 so as to move.
[0075]
After removing the coating film on the sides G1 and G3 of the substrate G in this manner, the substrate G is rotated 90 degrees by the substrate chuck 32, and similarly, the coating film on the pair of sides G2 and G4 facing each other on the substrate G is removed. Then, the substrate G is transferred to the main transfer means 22 and is unloaded from the coating film removing unit 3. In the above, the movement operation of the coating film removing units 4A and 4B is controlled by the control unit 6 via the Y direction moving mechanisms 53 and 54 and the X direction moving mechanisms 55 and 56.
[0076]
In such a method, as shown in FIG. 16B, the film thickness tends to be thicker in the region near the corner of the side of the substrate G than in the central region, but in the region near the corner, the coating film removal portion is scanned. Since the speed is reduced, the peeling time of the coating film by the solvent can be lengthened, and the coating film in the vicinity of the corner portion can also be reliably removed. When the scanning speed is constant, it is necessary to increase the number of scans in order to remove the coating film in the corner vicinity region, which may increase the total processing time.
[0077]
In addition, this embodiment is combined with the first to third embodiments described above, and in each embodiment, the scan speed in the corner vicinity region is slower than the central region of the side of the substrate G, and the vicinity of the corner portion You may make it remove the coating film of an area | region reliably.
[0078]
As yet another example (fifth embodiment), the region from the L0 position (one end side) to the L1 position (for example, about 30 mm from one end side) of the substrate and the L2 position of the substrate in FIG. For the region up to the L3 position (for example, about 30 mm from the other end side (scan end side) of the substrate), the solvent is supplied from the coating film removing units 4A and 4B to a predetermined position on the edge of the substrate G, and the substrate G In the vicinity of the center of the substrate G, for example, the region from the L1 position to the L2 position of the substrate G, a predetermined scan is performed a predetermined number of times, for example, twice from one end side to the other end side of the substrate G in a state where the supply of the solvent is stopped. The coating film removal unit 4A, 4B is scanned at a constant speed from one end side of the substrate to the other end side while supplying the solvent to a predetermined position of the edge in all regions on the side of the substrate G, thereby removing the coating film. May be performed. Also in this example, the coating film in the corner vicinity region can be surely removed. Further, this embodiment may be combined with the first to fourth embodiments described above.
[0079]
Next, a sixth embodiment of the present invention will be described. Also in this example, the process up to the step of carrying the substrate G into the processing container 30 and correcting the movement path during the removal process of the coating film removing units 4A and 4B is the same as that of the above-described embodiment. Then, the coating film removing units 4A and 4B are moved to the discharge start position of the corrected moving path, and then a solvent and an inert gas, for example, nitrogen gas, are placed at predetermined positions on the opposite sides G1 and G3 on both surfaces of the substrate. Are respectively scanned from the one end side to the other end side of the sides G1 and G3 of the substrate to remove a predetermined coating film.
[0080]
Subsequently, the discharge of the solvent from the solvent discharge portions 42 and 45 is stopped, and nitrogen gas is supplied to a predetermined position on both surfaces of the substrate, for example, in the vicinity of the end surface of the coating film on the upstream side of the removal region at the edge of the substrate G. The scan is performed a plurality of times from one end side to the other end side of the sides G1 and G3 of the substrate. Next, the discharge of the solvent from the solvent discharge portions 42 and 45 is started, and while supplying the solvent and nitrogen gas to predetermined positions on both sides of the substrate, the second side from the one end side to the other end side of the sides G1 and G3 of the substrate is supplied. A predetermined number of scans are performed to remove a predetermined coating film. After removing the coating film on the sides G1 and G3 of the substrate G in this manner, the substrate G is rotated 90 degrees by the substrate chuck 32, and similarly, the coating film on the pair of sides G2 and G4 facing each other on the substrate G is removed. Then, the substrate G is transferred to the main transfer means 22 and is unloaded from the coating film removing unit 3. In the above, the movement operation of the coating film removing units 4A and 4B and the operation of starting and stopping the supply of the solvent from the solvent discharge units 42 and 45 are controlled by the control unit 6.
[0081]
In such a method, the coating film removing portions 4A and 4B are scanned along the side of the substrate a predetermined number of times while supplying only nitrogen gas to the end surface of the coating film inside the removal region at the edge of the substrate G. Therefore, the end face of the coating film upstream of the removal region is dried by supplying nitrogen gas, and it is possible to suppress further dissolution of the coating film and spread of the dissolved portion of the coating film from here. In addition, an unnecessary coating film on the edge of the substrate G can be removed more efficiently. Here, the nitrogen gas may be supplied with its temperature adjusted to a temperature suitable for drying.
[0082]
In addition, this embodiment is combined with the first to fifth embodiments described above, and in each of the embodiments, a step of performing scanning by supplying only nitrogen gas to the edge of the substrate G is provided, and the coating film is more You may make it remove efficiently.
In the above, the coating film removing unit is not limited to the above example as long as it is configured to move along the edge of the substrate while supplying the solvent of the coating film to a predetermined position on the edge of the substrate. It is good also as a structure which does not provide the solvent discharge part which supplies a solvent to the back side. In the first embodiment described above, the coating film at the unnecessary edge may be removed using the coating film removing unit 7 having the configuration shown in FIG.
[0083]
The coating film removing unit 7 includes a first solvent discharge unit 71 that discharges the solvent of the coating film inwardly by a first distance from the edge of the side of the substrate, and a first distance from the edge of the side. A second solvent discharge portion 72 that discharges the solvent of the coating film, and the solvent and coating film discharged from the first solvent discharge portion 71 and the second solvent discharge portion 72 within a short second distance. A discharge path 73 for discharging the melt and a suction means (not shown) connected to the discharge path are provided.
[0084]
While discharging the solvent from the first solvent discharge portion 71 of the coating film removing portion 7 configured as described above, the coating film removing portion 7 is moved from one end side to the other end side of the substrate along the edge of the side of the substrate. The coating film removing unit 7 is moved to the substrate while discharging the solvent from the first solvent discharge unit 71 and discharging the solvent from the second solvent discharge unit 72. The unnecessary coating film on the edge of the side of the substrate G is removed by moving the substrate G from the one end side of the substrate to the other end side by a second number of times equal to or less than the first number of times. It may be. Even when such a coating film removing unit 7 is used, the same effects as those of the first embodiment described above can be obtained.
[0085]
In the above-described embodiment, the position of the edge of the side of the substrate G is calculated to correct the movement path of the coating film removing unit. However, in the present invention, the substrate G is placed on the support pins 36. At this time, for example, the substrate G may be mechanically pressed to perform alignment. Further, for example, a CCD camera may be used as the position detecting unit, and the position of the edge of the side of the substrate G may be confirmed from the image of the CCD camera, and the moving path of the coating film removing unit may be corrected based on this position. .
[0086]
Further, in the above-described embodiment, the coating film removing unit is configured to perform processing on a pair of opposite sides of the substrate at the same time. However, one coating is performed so that the sides of the substrate are processed one by one. Processing may be performed using the film removing unit, or four coating film removing units may be provided so as to simultaneously process four sides of the substrate.
[0087]
The present invention can be applied to the removal of a coating film such as a protective film in addition to the resist film. Furthermore, in the above-described embodiment, an apparatus for processing a square substrate for a semiconductor mask has been described. However, the present invention can also be applied to an apparatus for processing a square substrate for an FPD (flat panel display). The present invention can also be applied to a rectangular substrate in which a corner portion is cut in a straight line when seen in a plan view.
[0088]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the unnecessary coating film of the edge part of a board | substrate can be efficiently removed with respect to the square board | substrate with which the coating film was formed.
[Brief description of the drawings]
FIG. 1 is a plan view showing the overall configuration of an embodiment of a coating film forming apparatus according to the present invention.
FIG. 2 is a schematic perspective view showing an overall configuration of the coating film forming apparatus.
FIG. 3 is a cross-sectional view showing an example of a coating film removing unit provided in the coating film forming apparatus.
FIG. 4 is a plan view of the coating film removing unit.
FIGS. 5A and 5B are a cross-sectional view and a plan view showing an example of a coating film removing unit provided in the coating film removing unit. FIGS.
FIG. 6 is a configuration diagram illustrating an example of a control unit that controls movement of the coating film removing unit.
FIG. 7 is a process diagram for explaining the operation of the coating film removing unit.
FIG. 8 is a process diagram for explaining the operation of the coating film removing unit.
FIG. 9 is a process diagram for explaining the operation of the coating film removing unit.
FIG. 10 is a process diagram for explaining the operation of the coating film removing unit.
FIG. 11 is a process diagram for explaining the operation of the coating film removing unit.
FIG. 12 is a cross-sectional view for explaining the operation of the coating film removing unit.
FIGS. 13A and 13B are a plan view and a side view for explaining the operation of the coating film removing unit. FIGS.
FIG. 14 is a process diagram for explaining the operation of another embodiment of the coating film removing unit.
FIG. 15 is a plan view for explaining the operation of the other embodiment.
FIG. 16 is a characteristic diagram for explaining the operation of still another embodiment of the coating film removing unit.
FIG. 17 is a cross-sectional view showing an example of another embodiment of the coating film removing unit.
FIG. 18 is a plan view showing a state in which a coating film at the edge of a conventional substrate is removed.
[Explanation of symbols]
G mask substrate
B1 carrier block
B2 processing block
22 Main transport means
23 Application unit
3 Coating film removal unit
32 Substrate chuck
36 Support Pin
4 Coating film removal section
41 Base
42,45 Solvent discharge part
43,46 Gas discharge part
44 Suction exhaust passage
47 First position sensor
48 Second position sensor
53, 54 Y-direction moving mechanism
55, 56 X direction moving mechanism
6 Control unit

Claims

Coating film comprising: a solvent discharge section for discharging the solvent of the coating film; a discharge path for discharging the solvent discharged from the solvent discharge section and the dissolved substance of the coating film; and a suction means connected to the discharge path While removing the solvent to the edge of the coating film formed on the surface of the square substrate by the removing unit, the coating film removing unit is moved from one end side of the substrate to the other end side along the edge of the substrate. In the coating film removing method for removing an unnecessary coating film on the edge of the substrate surface,
While the solvent is discharged from the edge of the substrate surface to the inside by a first distance by the solvent discharge portion, the coating film removal portion is moved from one end side of the substrate to the other end side along the edge of the substrate. Moving the number of times 1;
Next, while the solvent is ejected inward by a second distance shorter than the first distance from the edge of the substrate surface by the solvent ejection unit, the coating film removal unit is moved along the edge of the substrate along the edge of the substrate. Moving from the one end side to the other end side a second number of times equal to or less than the first number of times,
The moving speed of the coating film removing unit when removing the coating film in the region near the corner of the substrate is slower than the moving speed of the coating film removing unit when removing the coating film in the region near the center of the side of the substrate. A method for removing a coating film, comprising:

2. The method of removing a coating film according to claim 1, wherein the second distance is a distance shorter by 0.2 mm to 0.4 mm than the first distance.

The coating film removal unit includes a position detection unit that detects the position of the edge of the substrate, and before the solvent is discharged from the coating film removal unit to the substrate, the coating film removal unit performs two positions on the edge of the substrate. 3. The method of removing a coating film according to claim 1, further comprising: a step of detecting the position of the coating film and correcting a moving path of the coating film removing unit based on the detected value.

The solvent is discharged to the edge of the coating film in the region near the corner of the substrate, and the solvent is not discharged to the edge of the coating film in the region near the center of the substrate side. A step of moving the substrate from one end side to the other end side a predetermined number of times along
A step of moving the coating film removing portion a predetermined number of times from one end side to the other end side of the substrate along the edge of the substrate while discharging a solvent to the edge of the coating film of the substrate. The coating film removing method according to any one of claims 1 to 3 .

While discharging the solvent to the edge of the coating film on the substrate, moving the coating film removing portion a predetermined number of times from one end side to the other end side of the substrate along the edge of the substrate;
Subsequently, while supplying an inert gas to the edge of the coating film of the substrate, moving the coating film removing portion a predetermined number of times from one end side of the substrate to the other end side along the edge of the substrate;
And then moving the coating film removing portion a predetermined number of times from one end side of the substrate to the other end side along the edge of the substrate while discharging a solvent to the edge of the coating film of the substrate. coating film removing method according to any one of claims 1 to 4, wherein.

After removing the unnecessary coating film at the edges along the pair of opposite sides of the substrate by the coating film removing unit, the direction of the substrate is changed to another pair of sides different from the pair of sides on the substrate. coating film removing method according to any one of claims 1 to 5, characterized in that the removal of unnecessary coating film along the edges.

Coating film comprising: a solvent discharge section for discharging the solvent of the coating film; a discharge path for discharging the solvent discharged from the solvent discharge section and the dissolved substance of the coating film; and a suction means connected to the discharge path A removal section;
A moving mechanism for moving the coating film removing portion from one end side of the substrate to the other end side along the edge of the rectangular substrate having the coating film formed on the surface;
While discharging the solvent inwardly from the edge of the substrate surface by a first distance, the coating film removing portion is moved along the edge of the substrate from one end side to the other end side of the substrate a first number of times. Then, while discharging the solvent inwardly by a second distance shorter than the first distance from the edge of the substrate surface, the coating film removing portion is moved from one end side of the substrate along the edge of the substrate. The moving mechanism is controlled to move to the end side a second number of times that is the same as or less than the first number of times, and the moving speed of the coating film removing unit when removing the coating film in the region near the corner of the substrate is adjusted. And a control unit that controls the moving mechanism so as to be slower than the moving speed of the coating film removing unit when the coating film in the vicinity of the center of the side of the substrate is removed. .

The coating film removal unit includes a position detection unit that detects the position of the edge of the substrate,
The controller corrects the solvent discharge position by correcting the movement path of the coating film removing unit via the moving mechanism based on the positions of the two edges of the substrate detected by the position detecting unit. 8. The coating film removing apparatus according to claim 7, further comprising a discharge position correcting unit that corrects the discharge position.