JP4043601B2 - Non-contact type IC card and manufacturing method thereof, non-contact type IC card substrate - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact method IC card manufacturing how that data can be transmitted and received in the external device and the non-contact method. In particular containment antenna inside the IC card, the plastic IC card designed for mounting IC module from the outside of the card, a method for manufacturing such a non-contact type IC cards which can be reliably joined to the antenna terminal and the module contacts .
[0002]
[Prior art]
In recent years, IC cards mounted with an IC circuit using a semiconductor element have become widespread from the viewpoint of improving data processing efficiency and security. Such IC cards are classified into a contact method in which an external terminal is connected to a terminal of an external device to transmit and receive data, and a non-contact method in which an antenna is provided and data is transmitted to and received from an external device by electromagnetic waves. Recently, the driving power of the IC circuit is supplied by electromagnetic induction, and the demand for a non-contact type IC card that does not incorporate a battery is increasing.
Furthermore, in the era of possessing a large number of cards, it has been required that a contact-type terminal board be provided on a non-contact type IC card so that both functions can be used. In addition, an IC chip that functions as a non-contact type IC card is also provided.
[0003]
The IC module has a structure in which an IC chip having a microprocessor or memory function is mounted on a printed circuit board, and these IC chips are covered with an epoxy resin or the like. The IC chip is thinly formed for incorporation in a card, and the thickness thereof is about 150 to 300 μm. Since it is thin like this, it tends to be damaged by external stress. On the other hand, the non-contact IC card has ISO 10536 standard, and the card thickness is defined as 0.76 mm (± 10% is allowed). Therefore, there is a manufacturing problem that a fragile IC module is reliably loaded in such a thin card substrate layer to ensure high reliability.
[0004]
A conventional non-contact type IC card has, for example, a configuration in which an IC module including an IC chip and an antenna is incorporated between a front resin sheet and a back resin sheet. In the non-contact type IC card, in the manufacturing process, for example, the front and back resin sheets are integrated with a transparent oversheet and a pre-printed milky white intermediate sheet by heat-pressing with a hot press, and then the antenna, The concave resin shape of the contact-type IC module, coil, capacitor, battery, and other parts is cut to produce a front resin sheet and a back resin sheet. Next, for example, after a thermosetting adhesive is applied to the back resin sheet, components such as an IC chip and an antenna are mounted according to the positions of the recesses until the adhesive is cured on the front resin sheet. It is pressed and pasted with a press.
[0005]
However, the above-described method for manufacturing a non-contact type IC card (thermal lamination method) has a problem that printing applied to the front resin sheet and the back resin sheet may be defective. This is because, when components such as an IC chip are mounted, irregularities corresponding to these components are generated on the surface of the front resin sheet and the back resin sheet, and distortion is caused by the irregularities, resulting in a decrease in printing quality. Because.
In addition, since the IC chip and the coil or antenna are connected in advance and then embedded in the card base for lamination, there is a problem that the electrical connection is broken in the hot-pressing process and cannot be repaired.
[0006]
Therefore, a method has been adopted in which a card base in which only an antenna is embedded is formed in advance, and a concave portion for fitting the IC module is formed in the card base and the IC module is mounted.
FIG. 10 is a diagram showing a conventional manufacturing method of a non-contact type IC card.
First, as shown in FIG. 10A, the antenna 24 and the antenna connection terminal 25 are formed on the core sheet by screen printing or the like, and the upper and lower oversheets are laminated on the core sheet by heat bonding or the like to form a card base. . Thereafter, as shown in FIG. 10 (B), a recess 22 is formed in the base by a counter-sink process so that only the antenna connection terminal 25 is exposed to the outside. This is a method for forming an IC card by mounting a required IC chip and fittingly mounting an IC module 10 having a connection terminal 26 with an antenna terminal using an adhesive, and connecting the IC module and the antenna terminal. (JP-A-9-123654, JP-A-9-286187, etc.).
[Problems to be solved by the invention]
[0007]
However, in the manufacturing method in which the IC module is fitted in the recess, the antenna connection terminal and the module terminal are joined using a conductive adhesive or the like. There was a lacking aspect. The present invention seeks to provide a manufacturing how a non-contact type IC cards that reliable bonding is made also in the joint in such a production method. There are various types of antennas for capturing signals from non-contact type IC cards. However, when using the same type of antenna, the card base is pre-manufactured because it is a common specification for each card. There is a demand from the manufacturer to keep it. The present invention can meet such a demand.
[0009 ]
[Means for Solving the Problems]
Summary of the non-contact type IC card manufacturing method of the present invention to solve the above SL problem, has an antenna embedded in the card substrate, a connection terminal of the antenna, in a recess formed in the card base In a method of manufacturing a non-contact type IC card in which an IC module terminal fitted and mounted from the outside of the base is electrically connected by a conductive material, the surface of the core sheet constituting the central layer of the card base and the IC A step of forming a connection terminal for connecting the antenna to a portion where the module is mounted; a step of connecting an antenna provided on the core sheet or between the core sheet and the intermediate sheet and the antenna connection terminal; and the antenna and the connection terminal. And laminating the core sheet, the intermediate sheet and, if necessary, an oversheet, and heating and pressing them together to form a card base, The card substrate is countersunk to a depth that allows the IC module substrate to be embedded in the portion of the card substrate where the IC module substrate is to be embedded, and the intermediate sheet layer remains partially. The step of forming, and only the central portion of the concave portion is countersunk deeply to a depth that allows the IC chip sealing resin portion of the IC module to be embedded to form the lower step portion of the concave portion, and at the same time, the antenna connection terminal A step of cutting the central portion so as not to cause a short circuit, a step of filling a conductive material by forming small holes at two portions where the card base side terminal of the IC module is joined to the antenna connection terminal, A step of loading an IC module into the recess formed by repetitive formation and heating and pressurizing and fixing the IC module terminal and the antenna connection terminal at the same time. Non-contact type IC card manufacturing method of that, in. Since it is a manufacturing method of such a non-contact type IC card, it is possible to easily manufacture an IC card with no surface failure and good surface accuracy.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of a contactless IC card. 1A is a plan view of the non-contact type IC card 20, and FIG. 1B is a cross-sectional view taken along the line AA in FIG. 1A. As shown in FIG. 1, a coil 24 is formed in the IC card base 21 and is connected to the IC module 10 via the antenna connection terminal 25 via the conducting portion 5p. The conductive portion 5p is performed using a conductive material or the like as will be described in detail later. The antenna is provided as a winding coil in which a conductive wire is wound in a coil shape, or a spiral pattern is formed on a printed circuit board as a core sheet by a method such as photoetching, or by silk screen printing using a conductive ink. Can be formed. In general, the antenna 24 is often formed on the surface of the core sheet 213 as shown in FIG.
[0013]
At both ends of the antenna 24, the connection terminals 25 for ensuring the bonding are formed by metal pieces at the portions to be bonded to the IC module, or conductive ink is printed by silk screen printing or the like. In the case of conductive ink, the connection terminal 25 can be formed integrally with the antenna portion by screen printing or the like. However, when the antenna and the connection terminal are made of different materials, it is necessary to connect them with a conductive adhesive or the like. is there.
[0014]
As shown in FIG. 1B, the card base is often composed of a core sheet 213, upper and lower milky white sheets (intermediate sheets) 212 and 214 covering the core sheet, and transparent oversheets 211 and 215. Of course, the card base is not limited to the illustrated configuration, and may be one that does not use the oversheets 211 and 215 or that does not use the lower sheets 214 and 215.
[0015]
The first feature of the non- contact type IC card used in the method of manufacturing the non-contact type IC card of the present invention is that the intermediate sheet 212 is thinly layered at a portion where the wiring pattern layer of the IC module 10 is connected to the connection terminal of the antenna. That is, the portion 212t is left and interposed. Even if there is some variation in the thickness of the intermediate sheet 211 and the oversheet 212 due to the presence of such a thin layer portion, it is possible to absorb processing errors such as the thickness of the sheet, and the surface of the IC module and the card substrate. It has a remarkable effect that the surface can always be the same surface. Moreover, there is also an effect of enhancing the durability of the cutting blade because the cutting blade for counterboring does not grind the connection terminal . The non-contact type IC cards is that form a conductive portion 5p terminal and the antenna connection terminal 25 of the IC module 10 is joined with a conductive material through an antenna connection terminal. With such a structure, there is a remarkable effect that the continuity between the IC module terminal and the antenna connection terminal is not cut even by some bending stress.
[0016]
Next, the manufacturing method of the non-contact type IC card of the present invention will be described with reference to FIGS.
FIG. 2 is a diagram illustrating a process of forming the antenna and the connection terminal on the core sheet. First, the antenna 24 is formed by various means on one of the plastic sheets constituting the card base, usually the surface of the core sheet 213. This can be formed by a method of printing conductive ink by a screen printing method, a method of forming by a photo-etching process in the same manner as a printed wiring board, a method of embedding a winding in a sheet, or the like. FIG. 2A shows a state in which the antenna 24 is provided on the core sheet 213 in such a manner so as to be multifaceted. The antenna connection terminal 25 is formed of a thin metal piece or the like as described above, or is formed by a silk screen printing method. In the case of a metal piece, a metal such as lead, copper, or aluminum can be used by punching out a central portion that is easy to cut by a countersink as shown in the figure with a narrow width.
In this case, with the metal piece stuck to the release paper with a double-sided adhesive, the mold is removed, and the die-cut metal piece is peeled from the release paper together with the double-sided adhesive, and the core sheet IC module is mounted. It can be easily formed by sticking to the part to be done.
[0017]
FIG. 2B is an enlarged view of the connection terminal 25, and FIG. 2C shows a cross section taken along the line BB. As shown in the figure, the connection terminal 25 is attached to the core sheet 213 with a double-sided adhesive 28, and the antenna 24 and the connection terminal 25 are connected to each other at the bonding portion 27 with solder or a conductive adhesive.
Next, the core sheet 213, the intermediate sheets 212 and 214, and the oversheets 211 and 215 are integrated with each other by hot pressing or lamination. Appropriate printing can be performed in advance on the front surface side of the intermediate sheets 211 and 214 or the back surface (inner surface side) of the oversheets 211 and 215.
After hot pressing, the card substrate is punched into individual cards. A mark 29 in FIG. 2A is a register mark for such punching.
[0018]
FIG. 3 is a diagram showing a step of countersinking the card base. A plan view and a cross-sectional view of each process are shown. In the state before the countersink processing in FIG. 3A, the surface of the card base 21 is smooth, and the antenna 24 and the connection terminal 25 are normally not seen through. Next, only the upper portion 22u of the recess 22 is ground to a depth corresponding to the thickness of the module substrate of the IC module (FIG. 3B). Countersinking is performed by cutting with an end mill, drill, engraving machine, or the like.
The manufacturing method of the present invention is characterized in that a part of the intermediate sheet 212 is left as a thin part 212t on the connection terminal 25 during the grinding. By doing this, even if there is some variation in the thickness of the oversheet 211 and the intermediate sheet 212, the card surface and the IC module surface can be accurately ground from the card surface to a depth corresponding to the thickness of the module substrate. There is an advantage that can be made flat with high accuracy and an advantage that wear of the drill blade due to grinding of the metal surface of the connection terminal 25 by the drill can be reduced.
[0019]
Finally, grinding is performed to the depth of the lower step portion 22d of the countersink recess 22 by a depth that allows the IC chip sealing resin portion of the IC module 10 to be embedded (FIG. 3C). At the time of this grinding, since the narrowed portion of the connection terminal 25 is cut, the connection terminal is divided into left and right. Further, in order to establish electrical connection between the IC module and the connection terminal, two small holes 17 are provided under the connection terminal of the IC module, and the conductive material is sufficiently filled so as to rise in the small hole.
[0020]
FIG. 4 is an enlarged cross-sectional view showing a process of mounting the IC module, and FIG. 5 is an enlarged cross-sectional view showing a state where the IC module is mounted. An adhesive is applied to a portion of the IC module 10 that is in contact with the thin portion 212t of the intermediate sheet (except for a portion where the wiring pattern layer 14 is in contact with the conductive material in the small hole 17). The IC module can be mounted and the IC module terminal and the antenna connection terminal can be joined by being fitted inside and applying heat pressure.
In FIG. 5, the wiring pattern layer 14 of the IC module 10 is connected to the antenna 24 through the conductive material in the small hole 17 and the connection terminal 25.
[0021]
FIG. 6 is a diagram illustrating another process of mounting the IC module. In the case of FIG. 6, the joining means 15 having a shape protruding sharply is provided on the wiring pattern layer of the IC module 10, and the IC module is fixed by fitting the IC module into the recess 22 cut to a predetermined depth. At this time, the joining means 15 of the IC module is pierced into the conductive material in the small hole 17.
FIG. 7 is a diagram illustrating another state in which the IC module is mounted. In the figure, the wiring pattern layer 14 of the IC module 10 is securely connected to the antenna 24 through the bonding means 15, the conductive material in the small hole 17, and the connection terminal 25.
[0022]
8 and 9 are diagrams showing an IC module used for a non- contact type IC card. In the case of FIG. 8, an IC module terminal for both a contact type and a non-contact type is shown, FIG. 8A is a contact terminal side surface view, FIG. 8B is an IC chip side back view, FIG. (C) has shown the cross section along the bonding wire connected to the newly provided C9, C10 terminal. The IC module 10 includes a printed circuit board 11 and an IC chip 12 mounted on the printed circuit board 11 as shown in FIG. An external contact terminal portion 13 is provided on one surface of the printed circuit board 11, and a wiring pattern layer 14 is provided on the other surface of the printed circuit board 11. The external contact terminal portion 13 and the wiring pattern layer 14 are electrically connected through a through hole 19. An IC chip 12 is mounted on the wiring pattern layer side of the printed circuit board 11, and the die pad of the IC chip and the wiring pattern layer 14 are electrically connected by a bonding wire 18 (FIG. 8B). The IC chip 12 is covered with the mold resin 16 including the bonding wires 18.
[0023]
As shown in FIG. 8A, eight terminals C1 to C8 are formed on the contact terminal side surface based on the ISO standard. Of these, the terminals C4 and C8 are for future use and are not currently used. Each terminal is separated by a separation groove 13g. Module side terminals connected to the antenna are normally formed at terminals C9 and C10 provided separately from C1 to C8.
[0024]
In the case of FIG. 9, a non-contact type IC module is shown, FIG. 9A is a front view of the module, FIG. 9B is a rear view of the IC chip side, and FIG. 9C is connected to an antenna terminal. A cross section along the bonding wire is shown.
In the case of FIG. 9, since it is a non-contact type IC module, there is no external contact terminal portion as shown in FIG. 1C, and only two wiring pattern layers 14 connected to the antenna terminal are provided on the back side. Is provided.
In the case of the IC module shown in FIGS. 8 and 9, both are shown as having the joining means 15 having a shape protruding sharply on the wiring pattern layer 14, but the joining means is not provided as described above. You can also Further, when the joining means is provided, the connection terminal can be pierced, so that the small hole 17 can be omitted.
[0025]
Next , the non- contact type IC card substrate will be described. The IC card substrate should be called an intermediate medium at the intermediate stage from the card substrate on which the antenna and the connection terminals are formed to the completed card, and is in the state of FIG. 3 (A), (B) or (C). Shows things. However, it does not have to be punched into individual cards . Contactless IC card based body has has FIG 3 means a state of (A), the antenna 24 and the connection terminal 25 for connecting both terminals of an antenna embedded in the card base. In this IC card base, since the antenna connection terminal 25 is formed on the intermediate sheet so as to connect the two antenna terminals with a conductive metal piece or conductive ink, the distance between the two terminals of the antenna is kept constant. And irregularities on the card surface can be reduced . Contactless IC card based body has a FIG 3 (B) or refers to a state of (C), the antenna 24 and the connection terminal 25 to be connected to both terminals of the antenna being embedded in the card base, A portion 212t formed by thinning the intermediate sheet remains on the connection terminal. This IC card substrate can absorb an error in the thickness of the intermediate sheet or oversheet as described above.
[0026]
<Examples regarding materials>
{Circle around (1)} The card substrate 21 may be a known material conventionally used as an IC card substrate, such as a vinyl chloride resin, an ABS resin, a polyethylene terephthalate resin, or a polycarbonate resin.
(2) The material used for the joining means 15 is preferably a conductive material having a certain degree of hardness, such as a metal such as copper, aluminum, gold, silver, chromium, nickel, an alloy thereof, or copper, gold, silver. In addition, a resin material or the like in which metal powder such as aluminum is dispersed to be conductive can be used.
(3) As the conductive adhesive, it is possible to use a thermosetting resin material that is made conductive by dispersing metal powders such as copper, gold, silver, and aluminum. Is an adhesive in which the above metal powder is dispersed in a thermoplastic resin, and it does not soften under normal IC card use conditions, but softens under heating conditions when IC modules are installed can do.
[0027]
【Example】
Example 1
<Preparation of IC module>
Metal copper is cut into both connection terminal portions on the back surface of an IC module for non-contact type IC card ("SLE-44R2S" manufactured by Siemens Co., Ltd .; thickness of the substrate 0.2 mm) to obtain a height of 0.3 mm (bottom side) The bonding means 15 formed to have a conical shape with a diameter of 0.2 mm) was fixed on the wiring pattern layer of the IC module using a conductive adhesive (“Ablebond 8350T” manufactured by Able Stick).
[0028]
<Preparation of IC card base>
As the transparent oversheet 211 (FIG. 5), a 0.05 mm thick resin sheet (polyvinyl chloride and vinyl acetate copolymer) is used, and as the milky white sheet (polyvinyl chloride) 212, a 0.28 mm thick sheet is used. I used something. A white concealing layer was provided on the surface of the milky white sheet 212, and then a pattern by offset printing was provided.
On the other hand, a milk white polyvinyl chloride sheet having a thickness of 0.15 mm is used for the core sheet 213, and the antenna sheet is made of a conductive ink made of aluminum paste on the surface of the core sheet 213 to be fused with the milk white polyvinyl chloride sheet 212. A pattern (line width 0.05 mm) was provided by silk screen printing.
[0029]
Connection terminals made of lead foil having a thickness of 0.05 mm were provided at both ends of the antenna pattern and the portions to be joined to the joining means of the IC module. In the state where the lead foil is adhered to the release paper with a double-sided adhesive, the lead foil is removed (one of the approximately H-shaped shape in FIG. 2 (B)), and the die-cut lead foil piece is attached to the double-sided adhesive. At the same time, it is peeled off from the release paper and is attached to the position corresponding to the IC module terminal at the portion of the core sheet where the IC module is mounted, and is joined to the antenna 24 with a conductive adhesive (“Able Bond 8350T” manufactured by Able Stick). )) And connected as in the adhesive portion 27 of FIG.
[0030]
The transparent oversheet 215 was of the same quality and thickness as the oversheet 211, and the milky white polyvinyl chloride sheet 214 was of the same quality and thickness as the sheet 212. Centering on the core sheet 213 on which the antenna 24 and the connection terminal 25 are formed, the two sheets 212 and 211 are overlapped on the antenna surface side, and the two sheets 214 and 215 are overlapped on the back side and heat-pressed to be integrated into a card base. Formed. Thereafter, punching was performed for each card size. The total thickness of the card base after hot pressing was 0.81 mm.
[0031]
A portion of the card base where the IC module 10 is mounted was first countersunk to a depth of 0.20 mm by a countersink. At this depth, the total thickness of the 0.05 mm thick oversheet and the 0.28 mm thick intermediate sheet is not reached. Therefore, the 0.13 mm thick intermediate sheet is a thin layer on the antenna connection terminal. 212t remained. Next, the central portion into which the module enters was further countersunk to a depth of 0.25 mm (total of 0.45 mm from the surface of the card base) to form a recess 22. Further, a small hole having a diameter of 0.8 mm and a depth of 0.4 mm was provided in a portion where the joining means 15 of the IC module was inserted, and a heat-reactive conductive adhesive (“AbleBond 8350T” manufactured by Ablestick) was filled.
[0032]
After applying a heat-reactive adhesive (“Afan UH-203” manufactured by Nihon Matai Co., Ltd.) to parts other than the connection terminals, the IC module is fitted into the recess 22 and heated under pressure (temperature 100 to 170 ° C., 5 ˜15 kg / cm ² , 5 seconds) and fixed in the recess. At that time, the joining means 15 was inserted into the conductive adhesive in the small hole 17, and the conduction between the IC module 10 and the antenna 24 was completely achieved.
[0033]
(Example 2)
<Preparation of IC module>
The same non-contact type IC card IC module ("SLE-44R2S" manufactured by Siemens Co., Ltd .; substrate thickness: 0.2 mm) as in Example 1 was prepared, but the bonding means 15 was provided in the wiring pattern layer portion. No flat ones were used.
[0034]
<Preparation of IC card base>
An IC card substrate having the same conditions as in Example 1 was prepared, and the same heat-reactive conductive adhesive as in Example 1 was similarly filled in the small holes so as to rise from the small holes and solidified. After an adhesive (“Afan UH-203” manufactured by Nippon Matai Co., Ltd.) is applied to the IC module, it is inserted into the recess 22 and heated under pressure (temperature 100 to 170 ° C., 5 to 15 kg / cm ² , 5 seconds). ) And fixed in the recess. Also in this case, the IC module 10 and the antenna 24 are completely connected.
[0035]
The completed non-contact type IC card showed good operation in both of Example 1 and Example 2, and no malfunction occurred even when repeated bending tests were performed.
Moreover, since all the card | curd surfaces were formed smoothly, the pattern provided on the oversheet layer did not distort.
[0036]
【The invention's effect】
IC card made by a non-contact type IC card manufacturing method of the present invention, since the IC module terminal and the antenna connection terminal is joined by the conductive material via the resin layer of the thin layer, sheet thickness The processing error can be absorbed to smooth the card surface, and the IC module terminal and the antenna connection terminal can be reliably joined. In the non-contact type IC card manufacturing method of the present invention, it is possible to easily and accurately manufacture a plastic IC card designed to enclose an antenna inside a card and mount a module from the surface of the card .
[Brief description of the drawings]
1 shows an embodiment of the I C card.
FIG. 2 is a diagram illustrating a process of forming an antenna and connection terminals on a core sheet.
FIG. 3 is a diagram showing a step of countersinking a card base.
FIG. 4 is an enlarged cross-sectional view showing a process of mounting an IC module.
FIG. 5 is an enlarged sectional view showing a state where an IC module is mounted.
FIG. 6 is a diagram showing another process of mounting an IC module.
FIG. 7 is a diagram showing another state in which an IC module is mounted.
FIG. 8 is a diagram showing an IC module used for a non- contact type IC card.
FIG. 9 is a diagram showing an IC module used for a non- contact type IC card.
FIG. 10 is a diagram showing a conventional manufacturing method of a non-contact type IC card.

Claims (4)

An antenna embedded in the card base, and the connection terminal of the antenna and the IC module terminal fitted and attached to the recess formed in the card base from the outside of the base are electrically connected by a conductive material. Forming a connection terminal for connecting an antenna to the surface of the core sheet constituting the central layer of the card substrate and to which the IC module is mounted; and on the core sheet or The step of connecting the antenna provided between the core sheet and the intermediate sheet and the antenna connection terminal, the core sheet having the antenna and the connection terminal, the intermediate sheet, and, if necessary, the oversheet are laminated and heated and pressed to be integrated. The IC module substrate is embedded in the step of forming the card base and the part of the card base where the IC module is mounted. A step of forming the upper step portion of the recess by countersinking the card base to a depth with a part of the intermediate sheet layer and a central portion of the recess, A step of deeply countersinking to a depth that allows the chip sealing resin portion to be embedded to form the lower step portion of the recess, and simultaneously cutting the central portion of the antenna connection terminal to prevent a short circuit; and IC A step of forming a small hole at two locations where the card base side terminal of the module is joined to the antenna connection terminal and filling the conductive material, and an IC module is loaded into the concave portion formed by countersink, and heated. And a step of joining the IC module terminal and the antenna connection terminal at the same time as being pressed and fixed. The contact portion electrically connected to the antenna connection terminal of the IC module, sharply protruding joining means is provided, when the joining means of the IC module mounted non according to claim 1, characterized in that inserted into the conductive material A method for manufacturing a contact IC card. Non-contact type IC card manufacturing method of claim 1, wherein the antenna connection terminals made of a conductive metal piece. Non-contact type IC card manufacturing method of claim 1, wherein the conductive material is characterized in that it is a heat-reactivated adhesive.

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