JP4049504B2 - Heat treatment device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a heat treatment apparatus used for heat treatment of, for example, a liquid crystal display (LCD) substrate having a resist film formed thereon or a semiconductor substrate.In placeRelated.
[0002]
In the manufacture of liquid crystal displays (LCDs), for example, in the process of forming electrode patterns, etc., a photoresist film is applied to a glass LCD substrate to form a resist film. A predetermined pattern is formed by a so-called photolithographic technique in which the film is exposed and developed.
[0003]
In these series of processing steps using photolithography technology, heat treatment (pre-bake) for improving the adhesion between the resist film and the substrate after resist application, heat treatment after development (post-bake), etc. Has been done. As a device for performing such heat treatment, a hot plate unit including a heating plate (hot plate) heated by a heater is usually used.
[0004]
In the heat treatment of a substrate or the like using a hot plate unit, generally, as shown in FIG. Placed. Next, the lift pins 63 are lowered so that the substrate 61 is supported on the proximity pins 64 provided on the mounting surface of the heating plate 62. The substrate 61 is subjected to a heat treatment at a predetermined temperature for a predetermined time while being placed on the heating plate 62 in this manner. After completion, the substrate 61 is lifted by raising the elevating pins 63 again and transported to the next process.
[0005]
[Problems to be solved by the invention]
Here, one major reason for disposing the substrate on the proximity pin is when the substrate is placed so as to be in direct contact with the placement surface of the heating plate (hereinafter referred to as “direct placement”). Is to prevent the substrate from being damaged by static electricity generated between the substrate and the heating plate when the substrate is lifted after the heat treatment is completed.
[0006]
However, when a substrate is placed on three proximity pins that are usually provided so as to define a plane, there is a problem that the substrate warps due to its own weight. It becomes prominent as it becomes more prominent, resulting in a very large problem such as a decrease in yield.
[0007]
In addition, the temperature uniformity of the substrate when the substrate is placed on the proximity pin is inferior to that when the substrate is directly placed on the heating plate. When densification progresses, it is considered necessary to realize a uniform temperature distribution on the substrate.
[0008]
The present invention has been made in view of the above-described problems of the prior art, and its purpose is not only to deal with the current situation but also to the future increase in the size of the substrate and the finer pattern to be formed on the substrate. Another object of the present invention is to realize the direct placement of the substrate on the heating plate without reducing the production yield by avoiding damage to the substrate due to static electricity.
[0009]
[Means for Solving the Problems]
  In order to solve the above-described problems, according to the present invention, a heating plate for placing a substrate on a placement surface and heat-treating the substrate, and a vapor having a property of removing static electricity, the substrate and the heating plate A mechanism for supplying between the contact surfaces ofThe heating plate is composed of a lower part in which a heater is embedded, a middle part in which a flow path for supplying the vapor or the solvent for generating the vapor is formed, and an upper part in direct contact with the substrate. The steam is discharged from the outflow hole formed in communication with the flow path, through the discharge hole formed in communication with the outflow hole in the upper stage part, and the middle stage part is formed of a water retaining body, The vapor is discharged from the upper stage by infiltrating the water retaining body with the solvent that generates the vapor and evaporating it.The heat processing apparatus characterized by this is provided.
  With the above configuration, when the substrate placed directly on the heating plate is lifted, the discharged steam removes static electricity between the substrate and the heating plate, thereby preventing the substrate from being damaged and Since the substrate is placed directly on the heating plate and subjected to heat treatment, generation of warpage due to its own weight is prevented, and processing with higher uniformity of the substrate temperature becomes possible.
  Furthermore, in the above heat treatment apparatus, the heating plate includes a lower stage portion in which the heater is embedded, and a middle stage portion in which a flow path for supplying vapor or a solvent that generates vapor (hereinafter referred to as “solvent”) is formed. The upper stage portion that is in direct contact with the substrate, and the discharge hole formed in communication with the flow path from the outflow hole formed in the upper stage portion to the outflow hole (formed in the middle stage portion). And a structure for discharging steam. In addition, the lower stage part, the middle stage part, and the upper stage part show the requirements on the structure, and do not necessarily need to be clearly distinguished in the substance. That is, each part may be formed integrally.
  Furthermore, it is also possible to discharge steam from the upper stage part by forming the middle stage part from the water holding body, infiltrating the solvent into the water holding body, and evaporating the solvent by the heat supplied from the lower stage part. In the case where the middle stage portion is formed from a water retaining body, it is possible to use a method of permeating and supplying the solvent to the water retaining body by capillary action using pores of the water retaining body. In this case, the formation of the flow path is not necessary, which is advantageous in manufacturing the member, and it is possible to uniformly supply the solvent or vapor from the middle stage to the upper stage. As the water retaining body, porous ceramics or porous metals are preferably used.
[0011]
In such a heat treatment apparatus, it is also preferable to provide a valve mechanism that opens and closes the discharge hole formed in the upper stage and / or the outflow hole formed to communicate with the flow path at a predetermined timing. That is, it is also preferable to configure so that vapor can be discharged only when it is necessary to remove static electricity, that is, when the substrate is separated from the heating plate. Thus, the heat treatment atmosphere is not unnecessarily humid, and the amount of steam or solvent used can be reduced, which contributes to reducing the power consumption of the heater.
[0012]
In addition, when the upper portion is composed of porous metal or porous ceramic, the pores of the porous metal or porous ceramic also serve as discharge holes, so that more uniform vapor discharge from the surface than when the discharge holes are provided. Further, since it is not necessary to provide a separate discharge hole, the processing cost can be reduced.
[0015]
Examples of the steam having a function of removing static electricity include steam or a mixed steam of ethanol and water. In addition, it is preferable to use a solvent that has electrical conductivity and a low boiling point as the vapor source, since it is possible to suppress energy required for generating the vapor.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a plan view showing a resist coating / development processing system (hereinafter referred to as “processing system”) of an LCD substrate (hereinafter referred to as “substrate”) to which the heat treatment apparatus of the present invention is suitably applied. First, this processing system will be outlined.
[0018]
This processing system includes a cassette station 1 on which a cassette C that accommodates a plurality of substrates G is placed, and a processing section 2 that includes a plurality of processing units for performing a series of processes including resist coating and development on the substrates G, The interface unit 3 for transferring the substrate G to and from an exposure apparatus (not shown) is provided, and the cassette station 1 and the interface unit 3 are disposed at both ends of the processing unit 2, respectively.
[0019]
The cassette station 1 includes a transport mechanism 10 for transporting the substrate G between the cassette C and the processing unit 2. Then, the cassette C is loaded and unloaded at the cassette station 1. Further, the transport mechanism 10 includes a transport arm 11 that can move on a transport path 10 a provided along the cassette arrangement direction, and the transport arm 11 can transport the substrate G between the cassette C and the processing unit 2. Done.
[0020]
The processing section 2 is divided into a front stage section 2a, a middle stage section 2b, and a rear stage section 2c. Each of the processing sections 2 has a transport path 12, 13, and 14 at the center, and each processing unit is disposed on both sides of the transport path. Yes. In addition, relay sections 15 and 16 are provided between them.
[0021]
The front stage portion 2a includes a main transport device 17 that can move along the transport path 12, and two cleaning units (SCRs) 21a and 21b are arranged on one side of the transport path 12, and the transport path 12, the processing block 25 in which the ultraviolet irradiation unit (UV) and the cooling unit (COL) are stacked in two stages, the processing block 26 in which the heating processing unit (HP) is stacked in two stages, and the cooling unit. A processing block 27 in which (COL) is stacked in two stages is arranged.
[0022]
The middle stage 2 b includes a main transfer device 18 that can move along the transfer path 13. On one side of the transfer path 13, a resist coating processing unit (CT) 22 and a resist on the peripheral edge of the substrate G are provided. A peripheral resist removal unit (ER) 23 for removing the substrate is integrally provided. On the other side of the conveyance path 13, a heat treatment unit (HP) is stacked in two stages, a heat treatment unit 28, and a heat treatment unit. A processing block 29 in which (HP) and a cooling processing unit (COL) are vertically stacked and a processing block 30 in which an adhesion processing unit (AD) and a cooling unit (COL) are vertically stacked are arranged. .
[0023]
Further, the rear stage portion 2 c includes a main transport device 19 that can move along the transport path 14, and three development processing units (DEV) 24 a, 24 b, and 24 c are disposed on one side of the transport path 14. On the other side of the conveyance path 14, a heat treatment unit (HP) is stacked in two stages, and a heat treatment unit (HP) and a cooling processing unit (COL) are stacked vertically. Processing blocks 32 and 33 are arranged.
[0024]
In the processing unit 2, only a spinner system unit such as the cleaning processing unit 21a, the resist processing unit 22, and the development processing unit 24a is disposed on one side of the conveyance path, and the heating processing unit is disposed on the other side. Only a thermal processing unit such as a cooling processing unit is arranged.
[0025]
Further, a chemical liquid supply unit 34 is disposed at a portion of the relay units 15 and 16 on the spinner system unit arrangement side, and a space 35 for performing maintenance of the main transfer device is further provided.
[0026]
Each of the main transport devices 17, 18, and 19 includes a two-direction X-axis drive mechanism, a Y-axis drive mechanism, and a vertical Z-axis drive mechanism in a horizontal plane, and further, a rotational drive that rotates about the Z-axis. It has a mechanism, and each has an arm (not shown) for supporting the substrate G.
[0027]
The main transfer device 17 transfers the substrate G to / from the arm 11 of the transfer mechanism 10, loads / unloads the substrate G to / from each processing unit of the front-stage unit 2 a, and further transfers the substrate G to / from the relay unit 15. It has a function to deliver. The main transfer device 18 transfers the substrate G to and from the relay unit 15, and loads and unloads the substrate G to / from each processing unit of the middle stage 2 b, and further transfers the substrate G to and from the relay unit 16. It has a function to perform. Further, the main transfer device 19 transfers the substrate G to and from the relay unit 16, loads and unloads the substrate G to / from each processing unit of the rear-stage unit 2 c, and transfers the substrate G to and from the interface unit 3. It has a function to perform. The relay parts 15 and 16 also function as cooling plates.
[0028]
The interface unit 3 includes an extension 36 that temporarily holds a substrate when the substrate is transferred to and from the processing unit 2, two buffer stages 37 that are provided on both sides of the substrate and that are provided with buffer cassettes, and these And a transfer mechanism 38 for carrying in and out the substrate G between the exposure apparatus (not shown). The transport mechanism 38 includes a transport arm 39 that can move on a transport path 38 a provided along the arrangement direction of the extension 36 and the buffer stage 37. The transport arm 39 allows the substrate G to be transferred between the processing unit 2 and the exposure apparatus. Is carried.
[0029]
By consolidating and integrating the processing units in this way, it is possible to save space and improve processing efficiency.
[0030]
In the processing system configured as described above, the substrate G in the cassette C is transferred to the processing unit 2, and the processing unit 2 first modifies the surface by the ultraviolet irradiation unit (UV) of the processing block 25 of the front stage unit 2 a. After the quality / cleaning process is performed and cooled by the cooling processing unit (COL), scrubber cleaning is performed by the cleaning units (SCR) 21a and 21b and heated by any one of the heat processing units (HP) in the processing block 26. After being dried, it is cooled by one of the cooling units (COL) in the processing block 27.
[0031]
Thereafter, the substrate G is transported to the middle stage 2b and subjected to a hydrophobic treatment (HMDS process) in the upper adhesion processing unit (AD) of the processing block 30 in order to improve the fixing property of the resist, and the lower cooling processing unit ( After cooling by COL), a resist is applied by a resist application processing unit (CT) 22, and excess resist on the periphery of the substrate G is removed by a peripheral resist removal unit (ER) 23. Thereafter, the substrate G is pre-baked by one of the heat treatment units (HP) in the middle stage 2b and cooled by the lower cooling unit (COL) of the processing block 29 or 30.
[0032]
Thereafter, the substrate G is transported from the relay section 16 to the exposure apparatus via the interface section 3 by the main transport apparatus 19, where a predetermined pattern is exposed. And the board | substrate G is again carried in via the interface part 3, and after performing a post-exposure baking process in the heat processing unit (HP) of the process blocks 31, 32, and 33 of the back | latter stage part 2c as needed, Development processing is performed in one of the development processing units (DEV) 24a, 24b, and 24c, and a predetermined circuit pattern is formed. The developed substrate G is subjected to a post-baking process in any one of the heat treatment units (HP) in the rear stage 2c, and is then cooled in any cooling unit (COL). 18 and 17 and the transport mechanism 10 are accommodated in a predetermined cassette on the cassette station 1.
[0033]
Next, referring to the drawings, an embodiment of the heat treatment apparatus of the present invention (synonymous with the above-described heat treatment unit (HP) and hereinafter referred to as “HP unit”) applied to the above-described treatment system is referred to. Details will be described. FIG. 2 is a cross-sectional view showing an embodiment of the HP unit according to the present invention. Here, FIG. 2 shows a schematic configuration of the HP unit, and various members constituting the HP unit are appropriately selected. Needless to say, the configuration and shape can be changed.
[0034]
The HP unit 52 is formed with a processing chamber 40 that heats the substrate G carried by the transfer arms of the main transfer apparatuses 17, 18, and 19. In the processing chamber 40, a heating element that heats the substrate G ( (Not shown) is provided. A shutter 43 surrounding the periphery of the heating plate 42 is provided on the outer peripheral side of the heating plate 42.
[0035]
The shutter 43 can be moved up and down by the operation of the elevating cylinder 44. When the shutter 43 is lifted, the shutter 43 and a stopper 47 suspended from a cover 46 having an exhaust port 45 at the upper center come into contact with each other. The interior of the chamber 40 is configured to be kept airtight. Further, the stopper 47 is provided with an air supply port, and the air flowing into the processing chamber 40 from the air supply port is exhausted from the exhaust port 45. In addition, since the air which flowed in from this air supply port does not touch the board | substrate G in the process chamber 40 directly, it is comprised so that the board | substrate G can be heat-processed with predetermined | prescribed process temperature.
[0036]
In the processing chamber 40, lift pins 48 that can support the substrate G are provided. The lift pins 48 are generally provided in about three so that the substrate G can be moved up and down while being held on a stable plane. The lift pins 48 are formed to be movable up and down by driving a motor 49 or the like. It has a structure that can be supported at a position indicated by a chain line.
[0037]
When the lifting pins 48 indicated by the two-dot chain line are lowered from the raised state, the substrate G is directly placed on the heating plate 42 at the position indicated by the solid line. This is different from the case of being placed on a proximity pin as shown in FIG.
[0038]
In the present invention, even when the substrate G is directly placed on the heating plate 42, a mechanism for supplying steam having a property of removing static electricity between the placement surface of the substrate G and the heating plate 42, that is, between the contact surfaces. Is provided. As a result, the substrate can be directly placed on the heating plate and moved up and down without causing damage to the substrate due to static electricity. Such a steam supply mechanism is preferably arranged on the heating plate. Hereinafter, this specific form will be described.
[0039]
FIG. 3 is a cross-sectional view showing an embodiment of a heating plate 70 having a steam supply mechanism. Here, FIG. 3B is a cross-sectional view taken along the line AA in FIG. 3A and perpendicular to the paper surface, and conversely, the surface passing through the line BB in FIG. 3B and perpendicular to the paper surface. FIG. 3A is a sectional view showing The heating plate 70 includes a lower step portion 71 in which a heater 74 is embedded, a middle step portion 72 in which a flow path 75 to which a solvent is supplied is formed, and an upper step portion 73 in direct contact with the substrate G. In addition, in each figure of FIG. 3, the through-hole formed in a heating plate for arrangement | positioning of a raising / lowering pin and a raising / lowering pin is abbreviate | omitted, However, A raising / lowering pin is arrange | positioned in the position which does not penetrate a middle stage flow path. can do.
[0040]
The lower stage 71 can be configured similarly to a conventionally used heating plate, and can be configured by burying a heater 74 in a material having excellent thermal conductivity such as aluminum or aluminum nitride. Moreover, it is preferable to form the middle stage part 72 and the upper stage part 73 using the material excellent in heat conductivity, ie, the material which is easy to ensure temperature uniformity. Therefore, the same material as that of the lower step portion 71 is preferably used. That is, the lower stage 71, the middle stage 72, and the upper stage 73 are concepts that are distinguished by their configurations and structures, and the boundaries of the heating plate 70 are not necessarily clear.
[0041]
For example, when the middle stage 72 is made of aluminum, the flow path 75 formed in the middle stage 72 is provided with a metal pipe having a melting point higher than that of aluminum in the mold, and the molten aluminum is poured into the mold. It can be formed by using a method of solidifying with a method. Further, regardless of other materials, the groove itself can be used as a flow path by a method of attaching a grooved material to the surface of a plate-like body or the like. Further, the material may be bonded in such a manner that a pipe having a groove shape is embedded in the groove.
[0042]
The middle stage 72 has an outflow hole 76 that communicates with the flow path 75, and the outflow hole 76 communicates with a discharge hole 77 formed in the upper stage 73. Therefore, the solvent (hereinafter referred to as “solvent”) that generates the vapor supplied to the flow path 75 is heated at least by the middle stage portion 72, and at least a part of the vapor is converted to the vapor and passes through the outflow hole 76 to the discharge hole 77. It is discharged from. Here, using a pressure when the solvent flows through the flow path 75, a predetermined amount may flow out from the outflow hole 76 in a liquid state, and steam may be generated by the heat of the middle stage portion 72 and the upper stage portion 73. .
[0043]
In addition, it is preferable that the solvent is heated to a predetermined temperature before the entrance to the middle stage 72 so that the supplied solvent does not lower the temperature on the entrance side of the flow path 75 in the middle stage 72. . The solvent discharged from the flow path 75 can be used for resupply.
[0044]
It is preferable to use a solvent having a boiling point lower than the temperature of the middle stage 72, that is, the temperature of the heating plate 70, because vapor is generated by natural evaporation. Conversely, when a solvent having a boiling point higher than the temperature of the heating plate 70 is used, a separate heater is provided so that steam is generated, and a heat insulating material is disposed at an appropriate place so that the temperature of the entire heating plate 70 does not rise. In addition, it is necessary to have a structure in which steam is discharged from the discharge hole 77 without condensation.
[0045]
The vapor must also have the property of removing static electricity. Therefore, in the present invention, water is preferably used as the solvent, that is, water vapor is used as the vapor, but a mixed solvent obtained by mixing water with ethanol can also be used.
[0046]
In the heating plate 70 shown in FIG. 3, a plurality of outflow holes 76 and discharge holes 77 are formed. The amount of steam discharged from each discharge hole 77 is as long as the temperature uniformity of the substrate G is ensured. However, it is not always necessary to be the same. On the other hand, by making the diameters of the outflow hole 76 and the discharge hole 77 different in consideration of the pressure loss of the flow path 75, it is possible to ensure substantially the same discharge amount. Further, the number of outflow holes 76 and discharge holes 77 may be one each. Further, as shown in FIG. 3, in the heating plate 70, only one flow path is formed in the middle stage portion 72, but is shown in the sectional view of FIG. 4 (similar to FIG. 3B). As described above, a plurality of flow paths 75 may be used.
[0047]
In the heating plate 70 described above, steam is always generated due to its structure. However, a valve mechanism that opens and closes the discharge hole 77 formed in the upper stage portion 73 at a predetermined timing is provided, and the steam discharge amount is reduced. It is preferable to control. For example, like the heating plate 80 shown in the cross-sectional view of FIG. 5, the upper stage 73 is provided with a slide mechanism 78 so that the discharge hole 77 is closed in a normal state, and the discharge hole 77 is removed when the substrate G is removed. It is also preferable to cause the vapor to be discharged onto the contact surface between the substrate G and the upper stage portion 73. In this case, the heat treatment atmosphere is not unnecessarily humid, the amount of solvent to be used can be reduced, and the power consumption of the heater can be reduced.
[0048]
Next, FIG. 6 is a cross-sectional view showing another embodiment of a heating plate 81 having a steam supply mechanism. The configuration of the lower step portion 71 and the middle step portion 72 of the heating plate 81 is the same as that of the heating plate 70 shown in FIG. 3 described above, but in the heating plate 81, the upper step portion 79 is made of porous metal or porous ceramics. It is configured.
[0049]
In this way, when the upper stage portion 79 is made of a porous body, the pores of the porous body also serve as the discharge holes, so that more uniform vapor can be discharged from the surface than when the discharge holes are provided in the dense body. Become. Moreover, since it is not necessary to provide the discharge hole separately, the processing cost can be reduced. Even if such a porous body is used, since the pore diameter is not large, the temperature uniformity of the substrate G is not adversely affected. As the porous metal, porous aluminum or the like is preferably used, and as the porous ceramic, porous aluminum nitride or the like is preferably used.
[0050]
The cross-sectional view of FIG. 7 is a cross-sectional view showing a heating plate 82 which is still another embodiment of the present invention. The lower step portion 71 of the heating plate 82 is the same as the heating plate 70, 80, 81 described above, and any form of the upper step portions 73, 79 of the heating plate 70, 80, 81 described above is used as the upper step portion. Can do. In FIG. 7, an upper step 79 made of a porous material is described as the upper step.
[0051]
The middle stage portion 83 of the heating plate 82 is formed of a water retaining body. By allowing the solvent to permeate into the water retaining body and evaporating the permeated solvent by the heat supplied from the lower stage portion 71, the upper stage portion 79 generates steam. Can be discharged. Solvent is supplied to the water retaining body by embedding a pipe with holes formed at appropriate locations in the water retaining body and allowing it to flow out of the holes, or by using pores of the water retaining body to penetrate the solvent by capillary action. Can be used.
[0052]
Of these solvent supply methods, the latter method is particularly advantageous in manufacturing the member in that it does not require the formation of a flow path such as embedding of piping. It is also easy to provide a plurality of solvent supply points to the water holding body. Further, when the upper stage portion 79 is made of a porous material, the solvent or vapor can be supplied uniformly from the middle stage portion 83 to the upper stage portion 79. As the water holding body, porous ceramics such as porous aluminum nitride and porous metals such as porous aluminum are preferably used.
[0053]
Now, the sectional view of FIG. 8 is a sectional view showing a heating plate 84 which is still another embodiment of the present invention. For example, a dense body such as aluminum or aluminum nitride is used for the heating plate 84, and a heater 85 is embedded therein. A hole 86 is formed through the upper and lower surfaces of the heating plate 84 so that the heater 85 is not exposed. A supply pipe 87 is disposed below the hole 86.
[0054]
In such a configuration, when a predetermined amount of solvent is fed into the hole 86 from the supply pipe 87, the solvent evaporates due to the heat of the heating plate 84 itself based on the operation of the heater 85, and the vapor is at the upper end of the hole 86 ( The liquid is discharged from an opening formed on the substrate mounting surface. Alternatively, the steam may be discharged from the upper end of the hole 86 by holding the supply pipe 87 at a predetermined temperature and supplying the steam into the hole 86 at a predetermined pressure. Furthermore, it is also preferable to provide a valve mechanism in the hole 86 or the supply pipe 87 so that steam is discharged from the upper end of the hole 86 at a predetermined timing.
[0055]
The shape of the hole is not limited to a shape that penetrates the heating plate 84 as shown in FIG. For example, like the heating plate 89 shown in the cross-sectional view of FIG. 9, an L-shaped hole 88 may be formed above the portion where the heater 74 is embedded. If the hole has such a shape, it can be easily formed on an existing heating plate using a drill or the like.
[0056]
As mentioned above, although embodiment of this invention has been described, this invention is not limited to the said embodiment. For example, in the above embodiment, the case where the heat treatment apparatus of the present invention is applied to the resist coating / development processing system has been described. However, the present invention is not limited to this. Further, although the LCD substrate has been described as the substrate to be processed, other substrates such as a semiconductor wafer and a CD substrate can also be used.
[0057]
【The invention's effect】
As described above, according to the present invention, even when the substrate is directly placed on the heating plate and subjected to heat treatment, the static electricity between the substrate and the heating plate is generated by the discharged steam when the substrate is lifted. Since it is removed, the substrate is not damaged as in the case of using a heating plate having no conventional vapor supply mechanism. Thereby, the production yield is maintained. Also, by placing the substrate directly on the heating plate and performing heat treatment, it is possible to prevent warping due to the weight of the substrate and provide a higher quality product, and at the same time, easily deal with the increase in size of the substrate. It becomes possible to do. Furthermore, since the uniformity of the temperature distribution of the substrate is improved, it is possible to produce an excellent effect that a finer pattern or the like can be formed.
[Brief description of the drawings]
FIG. 1 is a plan view showing a resist coating / developing system to which a heat treatment apparatus as an object of the present invention is applied.
FIG. 2 is a cross-sectional view showing an embodiment of a heat treatment apparatus of the present invention.
FIG. 3 is a cross-sectional view showing an embodiment of a heating plate used in the heat treatment apparatus of the present invention.
FIG. 4 is a cross-sectional view showing another embodiment of a heating plate used in the heat treatment apparatus of the present invention.
FIG. 5 is a cross-sectional view showing still another embodiment of a heating plate used in the heat treatment apparatus of the present invention.
FIG. 6 is a cross-sectional view showing still another form of a heating plate used in the heat treatment apparatus of the present invention.
FIG. 7 is a sectional view showing still another embodiment of a heating plate used in the heat treatment apparatus of the present invention.
FIG. 8 is a cross-sectional view showing still another embodiment of a heating plate used in the heat treatment apparatus of the present invention.
FIG. 9 is a cross-sectional view showing still another form of a heating plate used in the heat treatment apparatus of the present invention.
FIG. 10 is an explanatory diagram showing a movement path of a substrate or the like in the heat treatment apparatus.
[Explanation of symbols]
40; processing chamber
42; heating plate
43; Shutter
44; lifting cylinder
45; exhaust port
46; Cover
47; Stopper
48; Lift pin
52; HP unit
70, 80, 81, 82, 84, 89; heating plate
71; lower part
72: Middle section
73; Upper part
75; flow path
76; Outflow hole
77; Discharge port
86; hole
87; supply pipe

Claims (6)

A heating plate for placing the substrate on a placement surface and heat-treating the substrate;
A mechanism for supplying a vapor having a property of removing static electricity between contact surfaces of the substrate and the heating plate ;
The heating plate is composed of a lower step portion in which a heater is embedded, a middle step portion in which a flow path for supplying the vapor or the solvent that generates the vapor is formed, and an upper step portion in direct contact with the substrate,
The steam is discharged from the outflow hole formed in communication with the flow path, through the discharge hole formed in communication with the outflow hole in the upper stage portion,
The heat treatment apparatus according to claim 1, wherein the middle stage portion is formed of a water retaining body, and the steam is discharged from the upper stage portion by causing the water retaining body to permeate and evaporate a solvent that generates the steam . The heat treatment apparatus according to claim 1 , further comprising a valve mechanism that opens and closes the discharge hole and / or the outflow hole at a predetermined timing. The heat treatment apparatus according to claim 1 , wherein the upper stage portion is made of a porous metal or a porous ceramic, and pores of the porous metal or the porous ceramic also serve as the discharge holes. Without forming the flow path to the water holding member by capillary action according to one wherein any one of claims 1 to claim 3, characterized in that the solvent to generate the vapor is permeated supplied to the water retainer Heat treatment device. The heat treatment apparatus according to any one of claims 1 to 4 , wherein the water retaining body is a porous ceramic or a porous metal. The heat treatment apparatus according to any one of claims 1 to 5 , wherein the steam is steam or a mixed steam of ethanol and water.

Images