JP4050841B2 - Wet etching processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wet etching processing apparatus, and more particularly to an apparatus for performing etching processing on various substrates in a manufacturing process of a liquid crystal substrate, a semiconductor wafer substrate, an electronic circuit substrate, or the like.
[0002]
[Prior art]
FIG. 1 shows a typical example of a conventional wet etching processing apparatus. An etching solution supply nozzle 2 is attached to the bottom of a processing tank 1 having a bottomed box shape with an open top, An overflow rod 3 is provided around the upper edge, and the processing object 4 is immersed in the processing tank 1 filled with the etching solution 6 while being placed on the processing object installation mechanism 5. It is supposed to be done. The overflow 3 is connected to the etching solution supply nozzle 2 via a circulation pump 7 and a filter 8, and the etching solution 6 overflowing from the processing tank 1 is overflowed. After being collected by the trough 3, it is discharged again from the etching solution supply nozzle 2 into the processing tank 1 and recirculated.
[0003]
Reference numeral 9 denotes an up-and-down swing device provided outside the tank. A processing object installation mechanism 5 in the processing tank 1 is connected to the up-and-down swing mechanism 9 by a hanger 10 and is moved up and down in the processing tank 1. Doing dynamic exercise. Further, a heater 28 was attached to the bottom surface of the processing tank 1.
[0004]
[Problems to be solved by the invention]
In this conventional wet etching processing apparatus, the etching tank 6 is filled with the etching liquid 6, the etching liquid 6 is discharged from the etching liquid supply nozzle 2 at the bottom, and the etching liquid 6 overflowing from the processing tank 1 is turned on. Etching is performed by immersing the processing object 4 in the processing tank 1 so as to be collected and recirculated by the barbed bowl 3.
[0005]
That is, the etching solution 6 flows from the bottom to the top of the processing tank 1, but the etching solution 6 cannot be uniformly flowed. That is, the flow of the etching solution 6 tends to stay in the central portion of the liquid surface away from the tank wall, and the etching solution 6 is not sufficiently replaced. In such a state, the etching uniformity cannot be obtained.
[0006]
For this reason, the processing object 4 is swung up and down in the etching solution 6 using the up-and-down rocking mechanism 9 to improve uniformity and promote etching. However, since the up-and-down swing mechanism 5 operates above the processing object 4 during the processing operation, dust generation from this portion is inevitable, and the etching solution 6 is deteriorated by being mixed into the etching solution. It was also the cause. Further, the vertical swing mechanism 9 has many movable parts, the structure is complicated, the device tends to be large, and there are many movable parts, so that the failure is likely to occur.
[0007]
On the other hand, the size of various substrates to be etched tends to increase as the performance of electronic equipment increases, and as a result, there is a demand for larger etching tanks. Along with this, it is inevitable that the region where the etching solution is stagnated in the bath is unavoidable, and the nonuniformity of the etching process becomes more and more remarkable.
[0008]
Also, the vertical swing mechanism 9 naturally has to be increased with the increase in the size of the substrate, and accordingly the weight has increased and the power consumption for driving it has also increased. Further, since the vertical swing mechanism 9 itself is located above the processing tank 1 and cannot be provided in the processing tank 1, the upper surface of the processing tank 1 needs to be opened. When the heater 6 is heated by the heater 28 and used, the vapor of the etching solution 6 diffuses from the open portion to the periphery of the treatment tank 1 and may adversely affect the environment and workers. there were.
[0009]
An object of the present invention is to solve the above-mentioned problems related to the wet etching processing apparatus, to make the flow of the etching solution uniform in the processing tank, to eliminate the stagnation part, and to perform a uniform etching process, and also to the environment. The present invention intends to provide a wet etching processing apparatus that can cope with a substrate that tends to become larger and more compact while making the entire apparatus compact.
[0010]
[Means for Solving the Problems]
The present invention relates to a wet etching processing apparatus in which a plate-like processing object 4 is immersed in a processing tank 11 filled with an etching solution 6 and the etching solution 6 flows in a horizontal direction to perform an etching process. Of the pair of opposing side walls 13, 14, a number of etching solution discharge holes 15 are provided on one side wall 13, and a number of etching solution discharge holes 20 are provided on the other side wall 14, respectively. Each of the holes 20 is connected to a piping system 32 that forcibly circulates the etching solution 6, and has the same vertical and horizontal dimensions as the side wall 13, and has a punching board shape in which a large number of rectifying holes 25 are opened at equal intervals. A plurality of lattice plates 27 are vertically arranged in parallel with the sides of the frame body 26 in the inner space of the frame body 26 in which rectangular thin plates are combined in a cross beam shape on the front and back of the rectifying plate 24. The louver 23 crossed in the shape of a Yoroi door is overlapped in a sandwich shape to form a rectifying means 30, the rectifying means 30 is fixed to the side wall 13, and a pair of rectifying plates 24 are sandwiched on the front and back of the louver 23. The rectifying means 31 is superposed on the side wall 14 and is fixed in the processing tank 11 in parallel with the side wall 14 with a predetermined gap G2 from the side wall 14, and the rectifying means 30 is allowed to pass therethrough to discharge the etching solution. The etching solution 6 discharged from the holes 15 is uniformly diffused into the processing tank 11 and the rectifying means 31 is allowed to pass so that the etching liquid discharge holes 20 uniformly suck the etching solution 6 in the processing tank 11. The above problems were solved.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
2 is a longitudinal sectional view of an embodiment of a wet etching apparatus according to the present invention, FIG. 3 is a perspective view thereof, and FIG. 4 is a perspective view seen from the opposite direction to FIG.
[0012]
In the figure, reference numeral 11 denotes an etching treatment tank having a bottomed box shape, in which an etching solution 6 is filled. A processing object installation mechanism 12 is provided on the bottom surface of the etching processing tank 11, and a plurality of processing objects 4 are placed in the vertical direction on the processing object installation mechanism 12. Yes. The processing object 4 is various substrates to be etched and has a plate shape.
[0013]
Further, among the pair of opposing side walls 13 and 14 on the left and right end face sides of the processing object 4 to be placed in the processing tank 11, a plurality of etching solution discharge holes 15 are opened on the wall surface of one side wall 13. The end of the etchant injection pipe 16 is connected to the etchant discharge hole 15. The etchant injection pipe 16 branches off from a single trunk pipe 17, and a filter 18 and a circulation pump 19 are connected to the trunk pipe 17. In addition, a plurality of etching solution discharge holes 20 are formed in the other side wall 14, and an end of an etching solution discharge pipe 21 is connected to the etching solution discharge hole 20. The main pipe 22 is connected to the inlet side of the circulation pump 19. A piping system 32 is constituted by the etching solution injection pipe 16, the trunk pipe 17, the trunk pipe 22, and the etching liquid discharge pipe 21.
[0014]
Further, a rectifying means 30 is fixed to the side wall 13 on the side to which the etching solution injection pipe 16 is connected. The rectifying means 30 is formed by sandwiching the front and back of the rectifying plate 24 with a rubber 23. FIG. 7 is a perspective view of the rectifying means 30. As shown in FIG. 5, the rectifying plate 24 is a punching board-like plate body in which a large number of rectifying holes 25 are opened, and the diameter and opening ratio of the rectifying holes 25 are the size of the processing tank 11 and etching. It is determined appropriately according to the flow rate and properties of the liquid 6. Further, as shown in FIG. 6, the louver 23 has a plurality of lattice plates 27 in an inner space of a rectangular frame 26 in which rectangular thin plates are combined in a cross-beam shape and in parallel with the side of the frame 26. Are attached in the shape of a Yoroi door by crossing them vertically and horizontally, and is constituted by a thin plate having a strength capable of resisting the fluid pressure of the etching solution 6. The rectifying plate 24 is installed on the side wall 13 side through the louver 23, and a constant gap G <b> 1 is provided between the rectifying plate 24 and the side wall 13.
[0015]
On the other hand, the side wall 14 side of the etching liquid discharge pipe 21 is connected, Le - rectifying means 31 formed by interposing a sandwich by the rectifier plate 24 the front and back of the bus -23, opened from the side wall 14 fixed interval G2 The side wall 14 is fixed in parallel . FIG. 8 is a perspective view of the rectifying means. The rectifying plate 24 and the louver 23 itself on the side wall 14 side have the same structure as the rectifying plate 24 and the louver 23 on the side wall 13 side. Further, a heater 28 is attached to the outside of the bottom surface of the processing tank 11, and a lid 29 is provided at the upper opening. 3 and 4, reference numeral 30 denotes an overflow tank for collecting excess etching solution 6. Although FIG. 3 and FIG. 4 are drawn with the processing object 4 omitted, the processing object 4 has a direction perpendicular to the side walls 13, 14, that is, a direction parallel to the flow A of the etching solution 6. Placed facing.
[0016]
The rectifying means 30 and 31 are a combination of the rectifying plate 24 and the louver 23 , but the size of the processing tank 11, the amount and properties of the etching solution 6, and the number and shape of the processing object 4. Of course, the diameter and opening ratio of the rectifying hole 25 of the rectifying plate 24, the size of the lattice plate 27 of the louver 23, the mounting angle, and the like may be adjusted as appropriate. 2, 3, and 4, reference numeral 33 denotes a fixing frame for fixing the rectifying means 30 and 31.
[0017]
This etching processing apparatus has the configuration as described above, and the processing object 4 transported by transporting means such as a transporting robot is put into the processing tank 11 from above and is placed on the processing object installation mechanism 12. The lid 29 of the processing tank 11 is closed as soon as it is placed. The etching solution 6 in the processing tank 11 is sent from the etching solution discharge hole 20 in the side wall 14 to the trunk pipe 17 through the circulation pump and the filter 8, passes through the etching solution injection pipe 16, and is processed again from the etching solution discharge hole 15. The recirculation movement causes the etching solution to flow continuously in the horizontal direction from the side wall 13 side to the side wall 14 side. At this time, since the rectifying means 30 in which the louver 23 and the rectifying plate 24 are combined is attached to the etching solution discharge hole 15, the etching solution 6 discharged from the etching solution discharge hole 15 is louvered on the side wall 13 side. After the flow is restricted in the horizontal direction by the grid plate 27 of 23, it collides with the rectifying plate 24 to become a turbulent state, is agitated and homogenized, and is again rectified in the horizontal direction by the opposite louver 23. To the processing tank 11. On the other hand, since the rectifying means 31 sandwiching the louver 23 with the rectifying plate 24 is positioned on the side wall 14 side, the etching solution 6 flowing in the direction of the side wall 14 collides with the rectifying plate 24. Then, after turbulent flow, stirring and homogenizing, the air flows into the louver 23 from the rectifying hole 25 of the rectifying plate 24, thereby restricting the flow in the horizontal direction, and then collides with the rectifying plate 24 on the opposite side again. Then, a turbulent state is obtained, and the mixture is agitated and homogenized, and then sent out from the etching solution discharge hole 20 to the piping system 32. In this way, when the etching solution 6 is sent to the processing tank 11 and discharged, the rectification and stirring are repeated by the louver 23 and the rectifying plate 24. Extremely uniform flow is achieved. In particular, when the processing tank 11 has a large volume or when the processing tank 11 is relatively small compared to the volume of the processing object 4, the rectifying means 30 and 31 act effectively.
[ 0018 ]
On the other hand, depending on the treatment process, the heater 28 may be energized to heat the etching solution 6, but the upper opening of the treatment tank 11 is opened only when the treatment object 4 is carried in and out, and otherwise. Since it is always closed by the lid 29, the vapor of the etching solution 6 does not diffuse around the apparatus, and it is possible to prevent adverse health effects on workers and the surroundings. Furthermore, since the processing tank 11 is always closed by the lid 29, dust from the outside does not enter and the etching solution 6 can be prevented from deteriorating.
[ 0019 ]
【The invention's effect】
As described above, the etching apparatus according to the present invention is not only capable of performing a uniform etching process, but also prevents adverse health effects on the surroundings, and can process a large object to be processed with a compact apparatus. It has an excellent effect and is extremely excellent in practical use.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a typical example of a conventional wet etching apparatus.
FIG. 2 is a longitudinal sectional view of an embodiment of a wet etching processing apparatus according to the present invention.
FIG. 3 is a perspective view thereof.
4 is a perspective view seen from the opposite direction to FIG. 3. FIG.
FIG. 5 is a perspective view of an example of a rectifying plate 24 that is a component of the wet etching apparatus according to the present invention.
FIG. 6 is a perspective view of an example of a louver 23, which is also a constituent part.
FIG. 7 is a perspective view of an example of rectifying means used in the present invention.
FIG. 8 is a perspective view of an example of the rectifying means.
[Explanation of symbols]
1 treatment tank
2 Etching solution supply nozzle
3 Overflow 樋
4 processing object
5 Processing object installation mechanism
6 Etching solution
7 Circulation pump
8 Filter
9 Vertical swing mechanism 10 Hanger
DESCRIPTION OF SYMBOLS 11 Processing tank 12 Processing object installation mechanism 13 Side wall 14 Side wall 15 Etching liquid discharge hole 16 Etching liquid injection pipe 17 Trunk pipe 18 Filter
19 Circulation pump 20 Etch solution discharge hole 21 Etch solution discharge tube 22 Trunk tube 23 Louver
24 rectifying plate 25 rectifying hole 26 frame 27 lattice plate 28 heater
29 Lid 30 Rectifying means 31 Rectifying means 32 Piping system 33 Fixed frame

Claims (4)

In a wet etching processing apparatus that immerses a plate-like processing object 4 in a processing tank 11 filled with an etching solution 6 and causes the etching solution 6 to flow in the horizontal direction to perform the etching process, a pair of processing tanks 11 facing each other. Among the side walls 13, 14, a large number of etching liquid discharge holes 15 are provided on one side wall 13, and a large number of etching liquid discharge holes 20 are provided on the other side wall 14. The punching board-like rectifying plate 24 is connected to piping systems 32 for forcibly circulating the etching solution 6 and has substantially the same vertical and horizontal dimensions as the side wall 13 and a large number of rectifying holes 25 are formed at equal intervals. A plurality of lattice plates 27 are vertically and horizontally arranged in the inner space of a frame body 26 in which rectangular thin plates are combined in a cross-beam shape on the front and back sides of the frame body 26 in parallel with the side edges of the frame body 26. The louver 23 crossed and attached in the shape of a door is overlapped in a sandwich shape to form a rectifying means 30, and the rectifying means 30 is fixed to the side wall 13. By superposing the rectifying means 31, the rectifying means 31 is fixed in the processing tank 11 in parallel to the side wall 14 with a certain distance G 2 from the side wall 14, and the etching solution 6 is passed through the rectifying means 30. The etching liquid 6 discharged from the etching liquid discharge hole 15 is uniformly diffused into the processing tank 11 and the etching liquid discharge hole 20 uniformly sucks the etching liquid 6 in the processing tank 11 by passing the rectifying means 31. A wet etching processing apparatus characterized in that the above is performed.   The wet etching processing apparatus according to claim 1, wherein a processing object installation mechanism is provided in the processing tank.   The wet etching apparatus according to claim 1, wherein a lid 29 is provided at an upper opening of the processing tank 11.   The wet etching processing apparatus according to claim 1, wherein a heater (28) for heating the etching solution is provided in the processing tank (11).

Images