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JP4058130B2 - Chemical switch valve and wafer cleaning device - Google Patents
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JP4058130B2 - Chemical switch valve and wafer cleaning device - Google Patents

Chemical switch valve and wafer cleaning device Download PDF

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Publication number
JP4058130B2
JP4058130B2 JP08858597A JP8858597A JP4058130B2 JP 4058130 B2 JP4058130 B2 JP 4058130B2 JP 08858597 A JP08858597 A JP 08858597A JP 8858597 A JP8858597 A JP 8858597A JP 4058130 B2 JP4058130 B2 JP 4058130B2
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Japan
Prior art keywords
chemical
introduction path
chemical solution
switching valve
wafer cleaning
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JP08858597A
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JPH10281313A (en
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卓夫 松田
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Oki Electric Industry Co Ltd
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Oki Electric Industry Co Ltd
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  • Cleaning Or Drying Semiconductors (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、薬液切り替え装置及びウエハ洗浄装置に関し、特には半導体装置の製造工程でウエハを洗浄する際に用いられるウエハ洗浄装置とこれに備えられた薬液切り替え弁に関する。
【0002】
【従来の技術】
半導体装置の製造工程で用いられるウエハ洗浄装置の中には、薬液切り替え弁を介して複数の薬液供給手段を洗浄処理室に接続させたものがある。このようなウエハ洗浄処理装置によれば、洗浄処理室内において複数種類の異なる薬液を用いた各洗浄を行うことができる。
【0003】
図4(1)は、上記ウエハ洗浄装置に設けられた薬液切り替え弁の一例を示す側断面図であり、図4(2)にはこの薬液切り替え弁の平断面図(すなわち図4(1)におけるA−A’断面)である。
これらの図に示すように、薬液切り替え弁4は、薬液導入路41と、この薬液導入路41の側壁に接続された複数の開閉弁42a,42b…と、各開閉弁42a,42b…を介して薬液導入路41に接続された薬液供給管43a,43b…とを備えたものである。
【0004】
上記薬液導入路41は、上記各開閉弁42a,42b…が接続される供給部411と、各供給部411間を接続する接続管412とで構成されている。この薬液導入路41の一方の端部は閉じられており、もう一方の端部は上記洗浄処理室(図示省略)に接続されている。そして、開閉弁42a,42b…は、例えばエアシリンダーからなるものである。これらの開閉弁42a,42b…は、エアの導入によって押し下げられたシリンダー421によって薬液供給管43a,43b…と薬液導入路41との連通状態が遮断され、エアの導入を停止して押し戻されたシリンダー421によって薬液導入路41と薬液供給管43a,43b…とが連通するように構成されている。
【0005】
上記構成の薬液切り替え弁4では、所望の薬液を供給する薬液供給管(例えば薬液供給管43a)が接続された開閉弁(例えば開閉弁42a)を開くことによって、薬液導入路41に上記所望の薬液が供給される。そして、この薬液はウエハ洗浄装置の洗浄処理室に導入される。
【0006】
しかし、上記構成の薬液切り替え弁4では、薬液導入路41を構成する供給部411と接続管412との開口形状が必ずしも同一ではないことから、薬液導入路41内に死水領域が形成される。
【0007】
そこで、薬液導入路を均一な開口径を有する一本の管体で構成し、この薬液導入路の側壁に薬液供給管が接続された開閉弁を設けた構成の薬液切り替え弁が考えられた。この薬液切り替え弁では、開閉弁を閉じた状態においては、シリンダーの底面と薬液供給管の側壁とが同一高さに配置されるようになっている。このような構成の薬液切り替え弁では、薬液導入路内に死水領域が形成されることはない。
【0008】
【発明が解決しようとする課題】
しかし、上記構成の切り替え弁は、1本の薬液導入路を複数の薬液供給管で共有した構成になっている。このため、この切り替え弁を備えたウエハ洗浄装置を用いたウエハの洗浄処理において、混ぜ合わせることができない第1の薬液と第2の薬液とを用いた洗浄工程を連続して行う場合には、先の洗浄工程で用いた第1の薬液を無害な第3の薬液に置換する置換工程を行った後に第2の薬液を用いた洗浄工程を行う必要がある。この置換工程は、ウエハの洗浄処理全体のスループットを低下させる要因になる。
【0009】
【課題を解決するための手段】
上記課題を解決するための本発明の薬液切り替え弁は、直管形状の薬液導入路と、この薬液導入路に接続された開閉弁と、開閉弁を介して薬液導入路に接続された薬液供給管とを備えた薬液切り替え弁であり、上記薬液導入路が薬液の流通方向下流に向かって開口径が狭く形成されていることを特徴としている。
また、本発明のウエハ洗浄装置は、上記構成の薬液切り替え弁を介して洗浄処理室に薬液供給手段を接続してなるウエハ洗浄装置である。
【0010】
上記薬液切り替え弁は、直管形状の薬液導入路の下流程開口径が狭くなっていることから、当該薬液導入路から排出される薬液の流速が速くなりしかも薬液導入路内に死水領域が形成されることもない。このため、薬液導入路内において薬液の置換が効率良く行われ、置換速度が速くなる。
【0011】
したがって、上記ウエハ洗浄装置によるウエハの洗浄処理において、ウエハ洗浄を行う場合に薬液導入路内における薬液の置換工程が短縮される。
【0012】
【発明の実施の形態】
以下、本発明を適用した薬液切り替え弁とウエハ洗浄装置の実施の形態を図面に基づいて説明する。以下の実施形態においては、上記従来の技術と同様の構成部分に同一の符号を付し、重複する説明は省略する。
【0013】
(第1実施形態)
図1(1)は、第1実施形態の薬液切り替え弁の側断面図であり、図1(2)はこの薬液切り替え弁の平断面図(すなわち図1(1)におけるA−A’断面)である。
【0014】
これらの図に示す薬液切り替え弁1は、薬液導入路11の形状に特徴を有する。すなわち薬液導入路11は、薬液の流通方向下流に向かってその開口径が狭くなるように形成されている。この薬液導入路11は、開口径の異なる配管11a,11b…を開口径の大きさ順に接続した直管形状に形成されている。そして、最も大きい開口径を有する管体11fは、隣接する管体11eとの接続端と反対側の端部が塞がれている。
【0015】
また、各配管11a,11bには、開閉弁42a,42b…を介して薬液供給管43a,43b…が接続されている。そして、上記薬液導入路11の開口径は、この薬液供給管43a,43b…の径に対して薬液導入路11からの薬液の排出が妨げられない程度の大きさであることとする。上記開閉弁42a,42b…は、例えばエアシリンダーからなるものである。
【0016】
次に、上記薬液切り替え弁1の動作手順は、上記従来の技術で示した薬液切り替え弁と同様である。すなわち、所望の薬液を供給する薬液供給管(例えば薬液供給管43a)に接続された開閉弁(例えば開閉弁42a)を開き、その他の開閉弁42b,42c…を閉じることによって薬液導入路11に上記所望の薬液のみが供給される。
【0017】
上記構成の薬液切り替え弁1は、直管形状の薬液導入路11の下流程開口径が狭くなっていることから、薬液導入路11から排出される薬液の流速が速くなり、しかも薬液導入路11内に死水領域が形成されることもない。また、この切り替え弁1では、各薬液供給管43a,43b…から供給された薬液が薬液導入路11の上流側にも供給され易くなる。このため、薬液供給管43a,43b…の開閉状態を切り換えることによって薬液導入路11内に異なる薬液を供給した場合に、薬液導入路11内における薬液の置換が効率良く行われ、置換速度を速めることができる。供給された薬液が供給部分よりも上流側で循環し易くなる。
【0018】
図2には、この薬液切り替え弁を用いたウエハ洗浄装置の構成図を示す。このウエハ洗浄装置は、半導体基板や液晶ガラス基板等の薄板状のウエハの表面を洗浄するための装置である。以下に、図2と上記図1とを用いてウエハ洗浄装置の構成を説明する。このウエハ洗浄装置2は、上記構成の薬液切り替え弁1を介して、洗浄処理室22に複数の薬液供給手段21a,21b…やN2 供給手段21fを接続させてなるものである。
【0019】
薬液供給手段21a,21b…のうち、薬液供給手段21aは薬液Aを供給するものであり、薬液供給手段21bは薬液Bを、薬液供給手段21cは薬液Cを、薬液供給手段21dは薬液Dを、さらに薬液供給手段21eは純水を供給するためのものである。そして、薬液供給手段21a,21b…は、薬液タンク211a,211b…とこれらに接続された供給ポンプ212及び各供給ポンプ212の下流側に配置されたフィルタ213で構成されている。そして、薬液切り替え弁1の各薬液供給管(43a,43b…)には、その上流側から順にN2 供給手段21f,純水を供給する薬液供給手段21d,薬液Dを供給する薬液供給手段21c,薬液Cを供給する薬液供給手段21c…が接続されている。
【0020】
また、薬液切り替え弁1の薬液導入路11は、洗浄処理室22の薬液吐出ブロック221に接続されている。
【0021】
上記構成のウエハ洗浄装置2を用いたウエハの洗浄の動作手順の一例を説明する。
先ず、開閉弁42aのシリンダー421を上昇させて薬液供給管43aと薬液導入路11を連通させる。この際、その他の開閉弁42b,42c…のシリンダー421を下降させ、各薬液供給管43b,43c…を閉じた状態にしておく。そして、薬液供給管43aから薬液導入路11内に薬液Aを導入する。これによって、洗浄処理室22内に薬液Aを供給し、薬液Aによるウエハ洗浄を行う。ウエハ洗浄が終了した後、薬液供給管43aからの薬液の供給を停止し、開閉弁42aのシリンダー421を降下させて薬液供給管43aを閉じる。
【0022】
次に、純水によるウエハ洗浄工程(すなわちリンス工程)を行う。ここで、上記薬液Aは、純水と混ぜ合わされることによって強アルカリになりウエハへ悪影響を及ぼすものであることとする。そこで、上記リンス工程を行う前に、薬液導入路11内の薬液Aを薬液Aや純水と混ぜ合わせても無害な薬液Bに置換する置換工程を行う。
【0023】
この際、先ず、開閉弁42bのシリンダー421を上昇させて薬液供給管43bと薬液導入路11を連通させる。そして、薬液供給管43bから薬液導入路11内に薬液Bを導入する。これによって、薬液導入路11内、洗浄処理室22内及びこれらを接続する配管の内部の薬液Aを薬液Bに置換する。
【0024】
上記置換工程が終了した後、薬液供給間43bからの薬液Bの供給を停止し、開閉弁42bのシリンダー421を降下させて薬液供給管43bを閉じる。次いで、開閉弁42fのシリンダー421を上昇させて薬液供給管43fと薬液導入路11を連通させる。そして、薬液供給管43fから薬液導入路11内にN2 を導入する。これによって、薬液導入路11内の薬液Bを除去する。
【0025】
しかる後、薬液供給管43fからのN2 の供給を停止し、開閉弁42fのシリンダー421を降下させて薬液供給管43fを閉じる。次いで、開閉弁42eのシリンダー421を上昇させて薬液供給管43eと薬液導入路11を連通させる。そして、薬液供給管43eから薬液導入路11内に純水を導入する。そして、洗浄処理室22内に純水を供給し、ウエハのリンス工程を行う。
【0026】
上記ウエハ洗浄装置2では、上記構成の薬液切り替え弁1を備えたことによって薬液導入路11内における薬液の置換効速度を速くすることができるため、薬液Aを用いたウエハの洗浄工程と純水を用いたウエハのリンス工程との間に行われる薬液Bによる薬液Aの置換工程が短縮される。したがって、複数の薬液を用いた洗浄工程を連続して行うウエハの洗浄処理において、そのスループットを向上させることが可能になる。
【0027】
(第2実施形態)
図3(1)は、第2実施形態の薬液切り替え弁の側断面図であり、図3(2)はこの薬液切り替え弁の平断面図(すなわち図3(1)におけるA−A’断面)である。
【0028】
これらの図に示す薬液切り替え弁1と上記第1実施形態で説明した薬液切り替え弁(1)との異なるところは、薬液の流通方向下流に向かって開口径が狭く形成されている薬液導入路31の内壁がテーパー状になっているところにあり、その他の部分は上記薬液切り替え弁(1)同様である。
そして、この薬液切り替え弁3の動作手順も、上記薬液切り替え弁(1)と同様である。
【0029】
上記構成の薬液切り替え弁3であっても、上記薬液切り替え弁(1)と同様の効果が得られる。この薬液切り替え弁3では、薬液導入路31の内周壁がテーパー状であるため、上記第1実施形態の薬液切り替え弁(1)よりもさらに薬液の置換が効率良く行われる。そして、上記薬液切り替え弁3を用いたウエハ洗浄装置の構成は、図2の構成図に示したウエハ洗浄装置と同様である。この薬液切り替え弁1を用いたウエハ洗浄装置2’であっても、ウエハ洗浄装置(2)と同様の効果が得られる。
【0030】
尚、上記各実施形態で説明した上記各薬液切り替え弁は、開閉弁を介して配管に薬液供給管を接続させてなるユニットを繋ぎあわせて構成したものでも良い。また、各開閉弁は、エアシリンダーからなるものに限定されるものではなく、電磁弁のようなその他の開閉弁でも良い。
【0031】
【発明の効果】
以上説明したように、本発明の薬液切り替え弁によれば、開閉弁を介して薬液供給管が接続された直管形状の薬液導入路の開口径を下流程狭くすることで、薬液導入路内における薬液の置換効率を向上させ、薬液切り替えに伴う置換工程を短縮することができる。
そして、本発明のウエハ洗浄装置によれば、上記薬液切り替え弁を設けたことで、異なる薬液を用いた洗浄を連続して行う場合に薬液の置換工程を短縮し、ウエハの洗浄処理におけるスループットを向上させることが可能になる。
【図面の簡単な説明】
【図1】本発明を適用した第1実施形態の薬液切り替え弁の構成図である。
【図2】本発明のウエハ洗浄装置の構成図である。
【図3】本発明を適用した第2実施形態の薬液切り替え弁の構成図である。
【図4】従来の薬液切り替え弁の構成図である。
【符号の説明】
1,3 薬液切り替え弁
2 ウエハ洗浄装置
11,31 薬液導入管
21a,21b… 薬液供給手段
22 洗浄処理室
42a,42b… 開閉弁
43a,43b… 薬液供給管
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chemical liquid switching device and a wafer cleaning device, and more particularly to a wafer cleaning device used when cleaning a wafer in a manufacturing process of a semiconductor device and a chemical liquid switching valve provided therein.
[0002]
[Prior art]
Some wafer cleaning apparatuses used in the manufacturing process of a semiconductor device have a plurality of chemical liquid supply means connected to a cleaning processing chamber via a chemical liquid switching valve. According to such a wafer cleaning processing apparatus, each cleaning using a plurality of different chemical solutions can be performed in the cleaning processing chamber.
[0003]
FIG. 4 (1) is a side sectional view showing an example of the chemical switching valve provided in the wafer cleaning apparatus. FIG. 4 (2) is a plan sectional view of this chemical switching valve (ie, FIG. 4 (1)). AA ′ cross section in FIG.
As shown in these drawings, the chemical switching valve 4 is connected via a chemical solution introduction path 41, a plurality of on-off valves 42a, 42b ... connected to the side walls of the chemical solution introduction path 41, and the on-off valves 42a, 42b ... Are provided with chemical solution supply pipes 43a, 43b... Connected to the chemical solution introduction path 41.
[0004]
The said chemical | medical solution introduction path 41 is comprised by the supply part 411 to which each said on-off valve 42a, 42b ... is connected, and the connecting pipe 412 which connects between each supply part 411. As shown in FIG. One end of the chemical solution introduction path 41 is closed, and the other end is connected to the cleaning treatment chamber (not shown). The on-off valves 42a, 42b,... Are made of, for example, air cylinders. These on-off valves 42a, 42b, ... are disconnected from the chemical solution supply pipes 43a, 43b, ... and the chemical solution introduction passage 41 by the cylinder 421 that is pushed down by the introduction of air, and the introduction of air is stopped and pushed back. The chemical solution introduction path 41 and the chemical solution supply pipes 43a, 43b,...
[0005]
In the chemical liquid switching valve 4 having the above-described configuration, the desired liquid is supplied to the chemical liquid introduction path 41 by opening an on-off valve (for example, the on-off valve 42a) connected to a chemical liquid supply pipe (for example, the chemical liquid supply pipe 43a) that supplies a desired chemical liquid. Chemical solution is supplied. And this chemical | medical solution is introduce | transduced into the cleaning process chamber of a wafer cleaning apparatus.
[0006]
However, in the chemical liquid switching valve 4 having the above-described configuration, since the opening shapes of the supply section 411 and the connection pipe 412 that constitute the chemical liquid introduction path 41 are not necessarily the same, a dead water region is formed in the chemical liquid introduction path 41.
[0007]
Therefore, a chemical liquid switching valve having a configuration in which the chemical liquid introduction path is configured by a single pipe body having a uniform opening diameter and an open / close valve having a chemical liquid supply pipe connected to the side wall of the chemical liquid introduction path has been considered. In this chemical solution switching valve, the bottom surface of the cylinder and the side wall of the chemical solution supply pipe are arranged at the same height when the on-off valve is closed. In the chemical liquid switching valve having such a configuration, a dead water region is not formed in the chemical liquid introduction path.
[0008]
[Problems to be solved by the invention]
However, the switching valve configured as described above has a configuration in which one chemical solution introduction path is shared by a plurality of chemical solution supply pipes. For this reason, in the case of continuously performing the cleaning process using the first chemical solution and the second chemical solution that cannot be mixed in the wafer cleaning process using the wafer cleaning apparatus including the switching valve, It is necessary to perform the cleaning process using the second chemical solution after performing the replacement step of replacing the first chemical solution used in the previous cleaning step with the harmless third chemical solution. This replacement process becomes a factor of reducing the throughput of the entire wafer cleaning process.
[0009]
[Means for Solving the Problems]
The chemical switch valve of the present invention for solving the above-described problems is a straight pipe-shaped chemical solution introduction path, an on-off valve connected to the chemical solution introduction path, and a chemical solution supply connected to the chemical solution introduction path via the on-off valve. A chemical liquid switching valve including a pipe, wherein the chemical liquid introduction path is formed with a narrow opening diameter toward the downstream in the chemical liquid flow direction.
The wafer cleaning apparatus of the present invention is a wafer cleaning apparatus in which a chemical solution supply means is connected to the cleaning processing chamber via the chemical solution switching valve having the above-described configuration.
[0010]
The above-mentioned chemical switching valve has a narrower opening diameter toward the downstream side of the straight-pipe-shaped chemical solution introduction path, so that the flow rate of the chemical solution discharged from the chemical solution introduction path is increased and a dead water region is formed in the chemical solution introduction path. It is never done. For this reason, the chemical solution is efficiently replaced in the chemical solution introduction path, and the replacement speed is increased.
[0011]
Accordingly, in the wafer cleaning process by the wafer cleaning apparatus, the chemical solution replacement process in the chemical solution introduction path is shortened when performing wafer cleaning.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a chemical switching valve and a wafer cleaning apparatus to which the present invention is applied will be described below with reference to the drawings. In the following embodiments, the same reference numerals are given to the same components as those in the conventional technique described above, and a duplicate description will be omitted.
[0013]
(First embodiment)
FIG. 1 (1) is a side sectional view of the chemical switching valve of the first embodiment, and FIG. 1 (2) is a plan sectional view of this chemical switching valve (that is, AA ′ cross section in FIG. 1 (1)). It is.
[0014]
The chemical liquid switching valve 1 shown in these drawings is characterized by the shape of the chemical liquid introduction path 11. That is, the chemical solution introduction path 11 is formed so that the opening diameter thereof becomes narrower toward the downstream in the distribution direction of the chemical solution. This chemical | medical solution introduction path 11 is formed in the straight pipe | tube shape which connected piping 11a, 11b ... from which an opening diameter differs in order of the magnitude | size of an opening diameter. The tube 11f having the largest opening diameter is closed at the end opposite to the connection end with the adjacent tube 11e.
[0015]
Further, chemical supply pipes 43a, 43b,... Are connected to the pipes 11a, 11b via on-off valves 42a, 42b,. And the opening diameter of the said chemical | medical solution introduction path 11 shall be a magnitude | size which is the extent which does not prevent discharge | emission of the chemical | medical solution from the chemical | medical solution introduction path 11 with respect to the diameter of this chemical | medical solution supply pipe 43a, 43b. The on-off valves 42a, 42b... Are made of, for example, an air cylinder.
[0016]
Next, the operation procedure of the chemical liquid switching valve 1 is the same as that of the chemical liquid switching valve shown in the prior art. That is, by opening an on-off valve (for example, the on-off valve 42a) connected to a chemical liquid supply pipe (for example, the chemical liquid supply pipe 43a) for supplying a desired chemical liquid, the other on-off valves 42b, 42c,. Only the desired chemical solution is supplied.
[0017]
Since the opening diameter of the chemical liquid switching valve 1 having the above configuration is narrower toward the downstream of the straight chemical liquid introduction path 11, the flow rate of the chemical liquid discharged from the chemical liquid introduction path 11 is increased, and the chemical liquid introduction path 11 is further increased. A dead water area is not formed inside. In the switching valve 1, the chemical liquid supplied from the chemical liquid supply pipes 43 a, 43 b... Is easily supplied to the upstream side of the chemical liquid introduction path 11. Therefore, when different chemical liquids are supplied into the chemical liquid introduction path 11 by switching the open / close state of the chemical liquid supply pipes 43a, 43b, ..., the chemical liquid is efficiently replaced in the chemical liquid introduction path 11 and the replacement speed is increased. be able to. The supplied chemical solution is easily circulated on the upstream side of the supply portion.
[0018]
FIG. 2 shows a configuration diagram of a wafer cleaning apparatus using this chemical solution switching valve. This wafer cleaning apparatus is an apparatus for cleaning the surface of a thin wafer such as a semiconductor substrate or a liquid crystal glass substrate. Hereinafter, the configuration of the wafer cleaning apparatus will be described with reference to FIG. 2 and FIG. The wafer cleaning apparatus 2 is formed by connecting a plurality of chemical solution supply means 21a, 21b,... And N 2 supply means 21f to the cleaning processing chamber 22 via the chemical solution switching valve 1 having the above configuration.
[0019]
Of the chemical liquid supply means 21a, 21b, ..., the chemical liquid supply means 21a supplies the chemical liquid A, the chemical liquid supply means 21b supplies the chemical liquid B, the chemical liquid supply means 21c supplies the chemical liquid C, and the chemical liquid supply means 21d supplies the chemical liquid D. Further, the chemical solution supply means 21e is for supplying pure water. The chemical liquid supply means 21a, 21b,... Are configured by chemical liquid tanks 211a, 211b, a supply pump 212 connected thereto, and a filter 213 arranged on the downstream side of each supply pump 212. The chemical solution supply pipes (43a, 43b,...) Of the chemical solution switching valve 1 are sequentially supplied from the upstream side with an N 2 supply unit 21f, a chemical solution supply unit 21d for supplying pure water, and a chemical solution supply unit 21c for supplying the chemical solution D. , Chemical solution supply means 21c for supplying the chemical solution C are connected.
[0020]
The chemical solution introduction path 11 of the chemical solution switching valve 1 is connected to the chemical solution discharge block 221 of the cleaning processing chamber 22.
[0021]
An example of an operation procedure for cleaning a wafer using the wafer cleaning apparatus 2 having the above configuration will be described.
First, the cylinder 421 of the on-off valve 42a is raised to make the chemical solution supply pipe 43a and the chemical solution introduction path 11 communicate with each other. At this time, the cylinders 421 of the other on-off valves 42b, 42c,... Are lowered, and the chemical solution supply pipes 43b, 43c,. Then, the chemical solution A is introduced into the chemical solution introduction path 11 from the chemical solution supply pipe 43a. Thus, the chemical solution A is supplied into the cleaning processing chamber 22 and the wafer cleaning with the chemical solution A is performed. After the wafer cleaning is completed, the supply of the chemical solution from the chemical solution supply pipe 43a is stopped, and the cylinder 421 of the on-off valve 42a is lowered to close the chemical solution supply pipe 43a.
[0022]
Next, a wafer cleaning process with pure water (that is, a rinsing process) is performed. Here, it is assumed that the chemical solution A becomes a strong alkali when mixed with pure water and has a negative effect on the wafer. Therefore, before performing the rinsing step, a replacement step is performed in which the chemical solution A in the chemical solution introduction path 11 is replaced with a chemical solution B that is harmless even if mixed with the chemical solution A or pure water.
[0023]
At this time, first, the cylinder 421 of the on-off valve 42b is raised to cause the chemical solution supply pipe 43b and the chemical solution introduction path 11 to communicate with each other. Then, the chemical solution B is introduced into the chemical solution introduction path 11 from the chemical solution supply pipe 43b. As a result, the chemical solution A is replaced with the chemical solution B in the chemical solution introduction path 11, the cleaning treatment chamber 22, and the pipes connecting these.
[0024]
After the replacement step is completed, the supply of the chemical solution B from the chemical solution supply interval 43b is stopped, the cylinder 421 of the on-off valve 42b is lowered, and the chemical solution supply pipe 43b is closed. Next, the cylinder 421 of the on-off valve 42f is raised to connect the chemical solution supply pipe 43f and the chemical solution introduction path 11. Then, N 2 is introduced into the chemical solution introduction path 11 from the chemical solution supply pipe 43f. Thereby, the chemical solution B in the chemical solution introduction path 11 is removed.
[0025]
Thereafter, the supply of N 2 from the chemical liquid supply pipe 43f is stopped, the cylinder 421 of the on-off valve 42f is lowered, and the chemical liquid supply pipe 43f is closed. Next, the cylinder 421 of the on-off valve 42e is raised to connect the chemical solution supply pipe 43e and the chemical solution introduction path 11. Then, pure water is introduced into the chemical solution introduction path 11 from the chemical solution supply pipe 43e. Then, pure water is supplied into the cleaning processing chamber 22 to perform a wafer rinsing step.
[0026]
In the wafer cleaning apparatus 2, since the chemical solution switching valve 1 having the above-described configuration is provided, the chemical solution replacement speed in the chemical solution introduction path 11 can be increased. Therefore, the wafer cleaning process using the chemical solution A and pure water are performed. The process of replacing the chemical solution A with the chemical solution B performed during the wafer rinsing process using the process is shortened. Therefore, in the wafer cleaning process in which the cleaning process using a plurality of chemical solutions is continuously performed, the throughput can be improved.
[0027]
(Second Embodiment)
FIG. 3 (1) is a side sectional view of the chemical liquid switching valve of the second embodiment, and FIG. 3 (2) is a plan sectional view of this chemical liquid switching valve (that is, an AA ′ cross section in FIG. 3 (1)). It is.
[0028]
The difference between the chemical switching valve 1 shown in these drawings and the chemical switching valve (1) described in the first embodiment is that the chemical introduction path 31 is formed with a narrower opening diameter toward the downstream in the chemical flow direction. The other wall is in a tapered shape, and the other parts are the same as the above-described chemical liquid switching valve (1).
And the operation | movement procedure of this chemical | medical solution switching valve 3 is the same as that of the said chemical | medical solution switching valve (1).
[0029]
Even with the chemical liquid switching valve 3 configured as described above, the same effect as the chemical liquid switching valve (1) can be obtained. In the chemical liquid switching valve 3, since the inner peripheral wall of the chemical liquid introduction path 31 is tapered, the chemical liquid replacement is performed more efficiently than the chemical liquid switching valve (1) of the first embodiment. And the structure of the wafer cleaning apparatus using the said chemical | medical solution switching valve 3 is the same as that of the wafer cleaning apparatus shown in the block diagram of FIG. Even with the wafer cleaning apparatus 2 ′ using the chemical switching valve 1, the same effect as the wafer cleaning apparatus (2) can be obtained.
[0030]
In addition, each said chemical | medical solution switching valve demonstrated by said each embodiment may be comprised by connecting the unit which connects a chemical | medical solution supply pipe to piping via an on-off valve. Each on-off valve is not limited to an air cylinder, and may be another on-off valve such as an electromagnetic valve.
[0031]
【The invention's effect】
As described above, according to the chemical switching valve of the present invention, the diameter of the straight-pipe-shaped chemical liquid introduction path connected to the chemical liquid supply pipe via the on-off valve is narrowed toward the downstream, thereby reducing the chemical liquid introduction path. It is possible to improve the replacement efficiency of the chemical solution in and to shorten the replacement step accompanying the switching of the chemical solution.
According to the wafer cleaning apparatus of the present invention, by providing the chemical switching valve, the chemical replacement process is shortened when cleaning with different chemicals is continuously performed, and the throughput of the wafer cleaning process is increased. It becomes possible to improve.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a chemical switching valve according to a first embodiment to which the present invention is applied.
FIG. 2 is a configuration diagram of a wafer cleaning apparatus of the present invention.
FIG. 3 is a configuration diagram of a chemical liquid switching valve according to a second embodiment to which the present invention is applied.
FIG. 4 is a configuration diagram of a conventional chemical switching valve.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1,3 Chemical solution switching valve 2 Wafer cleaning apparatus 11,31 Chemical solution introduction pipe | tube 21a, 21b ... Chemical solution supply means 22 Cleaning process chamber 42a, 42b ... On-off valve 43a, 43b ... Chemical solution supply pipe

Claims (6)

一端部が開口し他端部が塞がれた管状の薬液導入路と当該薬液導入路に沿って配置されると共に当該薬液導入路の側壁に接続された複数の開閉弁と、当該各開閉弁を介して当該薬液導入路に接続された薬液供給管とを備えた薬液切り替え弁において、
前記薬液導入路は、前記塞がれた端部側から開口された端部側に向かって内径が狭く形成されている
ことを特徴とする薬液切り替え弁。
A tubular chemical solution introduction path having one end opened and the other end closed, a plurality of on- off valves arranged along the chemical solution introduction path and connected to a side wall of the chemical solution introduction path , In the chemical liquid switching valve provided with a chemical liquid supply pipe connected to the chemical liquid introduction path through the valve,
The drug solution switching valve is characterized in that an inner diameter of the drug solution introduction path is narrowed from the closed end side toward the end side opened .
請求項1記載の薬液切り替え弁において、The chemical switch valve according to claim 1,
前記薬液導入路は、開口径の異なる管体を開口径の大きさ順に接続してなり、最も大きい開口径を有する管体における隣接する管体との接続端と反対側の端部が塞がれている  The chemical solution introduction path is formed by connecting tubes having different opening diameters in the order of the opening diameter, and the end of the tube having the largest opening diameter on the side opposite to the connection end with the adjacent tube is blocked. Is
ことを特徴とする薬液切り替え弁。  This is a chemical switching valve.
請求項1記載の薬液切り替え弁において、
前記薬液導入路の内壁は、内径が狭く形成される方向に向かってテーパ状に構成されている
ことを特徴とする薬液切り替え弁。
The chemical switch valve according to claim 1,
An inner wall of the chemical solution introduction path is formed in a taper shape in a direction in which an inner diameter is narrowly formed .
薬液切り替え弁を介して洗浄処理室に薬液供給手段を接続してなるウエハ洗浄装置において、
前記薬液切り替え弁は、一端部が開口し他端部が塞がれた管状の薬液導入路と当該薬液導入路に沿って配置されると共に当該薬液導入路の側壁に接続された複数の開閉弁と、当該各開閉弁を介して当該薬液導入路に接続された薬液供給管とを備え、
前記薬液導入路は、前記塞がれた端部側から開口された端部側に向かって内径が狭く形成されている
ことを特徴とするウエハ洗浄装置。
In a wafer cleaning apparatus in which a chemical solution supply means is connected to a cleaning processing chamber via a chemical solution switching valve,
The medicinal solution switching valve has a tubular medicinal solution introduction path that is open at one end and closed at the other end, and a plurality of open / close ports that are arranged along the medicinal solution introduction path and connected to a side wall of the medicinal solution introduction path A chemical solution supply pipe connected to the chemical solution introduction path through the valve and each on-off valve,
The wafer cleaning apparatus, wherein the chemical solution introduction path has a narrow inner diameter from the closed end side toward the open end side .
請求項4記載のウエハ洗浄装置において、The wafer cleaning apparatus according to claim 4, wherein
前記薬液導入路は、開口径の異なる管体を開口径の大きさ順に接続してなり、最も大きい開口径を有する管体における隣接する管体との接続端と反対側の端部が塞がれている  The chemical solution introduction path is formed by connecting tubes having different opening diameters in the order of the opening diameter, and the end of the tube having the largest opening diameter on the side opposite to the connection end with the adjacent tube is blocked. Is
ことを特徴とするウエハ洗浄装置。  A wafer cleaning apparatus.
請求項4記載のウエハ洗浄装置において、
前記薬液導入路の内壁は、内径が狭く形成される方向に向かってテーパー状に構成されている
ことを特徴とするウエハ洗浄装置。
The wafer cleaning apparatus according to claim 4, wherein
The wafer cleaning apparatus, wherein an inner wall of the chemical solution introduction path is tapered in a direction in which an inner diameter is narrowly formed .
JP08858597A 1997-04-08 1997-04-08 Chemical switch valve and wafer cleaning device Expired - Fee Related JP4058130B2 (en)

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JP4058130B2 true JP4058130B2 (en) 2008-03-05

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JP4668635B2 (en) * 2005-02-02 2011-04-13 積水化学工業株式会社 Microvalve flow rate adjustment method
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