JP4066532B2 - Etching part manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention comprises a partition for blocking the surrounding atmosphere, a means for supplying clean air into the partition so as to be higher than the atmospheric pressure of the surrounding atmosphere, and an opening for loading and unloading articles provided in the partition. at least a method of manufacturing an etching component using the clean room with.
[0002]
[Prior art]
Electronic parts such as shadow masks used in color picture tubes or lead frames used in semiconductor integrated circuit devices are made of a thin metal plate made of iron, iron alloy, copper, or the like, and manufactured by a well-known photo-etching method. It has become mainstream.
[0003]
It can be said that the etched part manufactured using the photoetching method is manufactured at least by the following manufacturing process.
That is, first, the metal thin plate is cleaned and leveled in a leveling process of cleaning the surface of the metal thin plate and leveling the surface of the metal thin plate. Next, in the step of forming a photoresist film (hereinafter simply referred to as a resist film) in which a photosensitive resin (resist solution) is applied, dried, or the like by a roll coater method or a dipping method using a coating roll, at least one of the metal thin plates A resist film is formed on the surface.
Next, pattern exposure is performed on the resist film on the metal thin plate in a pattern exposure process in which pattern exposure is performed through an exposure pattern mask having a predetermined light-shielding pattern. Next, in the development process of developing, hardening, etc. on the resist film after pattern exposure, unexposed and uncured resist film portions are dissolved and removed during pattern exposure, and a metal thin plate is formed according to a predetermined pattern. An exposed resist film is obtained.
[0004]
Next, using a ferric chloride solution or the like as an etchant, the metal thin plate portion exposed from the resist film is selectively etched in an etching process in which the etchant is brought into contact with the metal thin plate, and a predetermined etching pattern is formed on the metal thin plate. Form.
[0005]
Next, after the metal thin plate after etching is brought into contact with a stripping solution such as an alkali solution, the resist film formed on the metal thin plate is stripped in a stripping step of washing with water and washing.
[0006]
Thereafter, a cutting process such as cutting of a thin metal plate using a mold or the like and removal of unnecessary portions is performed to obtain an etched part (part manufactured by a photoetching method).
In manufacturing an etched part using a photo-etching method, at least the above-described steps are included. If the etched part is a shadow mask, the etching process is divided into two stages, and after the first stage etching, an anti-etching varnish is applied to one surface of the metal sheet, and then the second stage. In some cases, the film-peeling step is performed after the eye is etched from the other surface.
[0007]
In the production of etching parts, as shown in FIG. 3, a long strip-shaped thin metal plate 1 supplied from a winding roll 2 is used as a material, and is transported in a substantially horizontal direction on a transport means such as a transport roller 10. It has become mainstream to perform each manufacturing process described in the example mentioned above on the long strip-shaped metal thin plate 1 continuously in a flow manner.
[0008]
Heretofore, in the manufacture of etched parts, there has been a problem that foreign matter floating in the ambient atmosphere of the manufacturing process adheres to the metal thin plate 1 or the like and causes defects.
For example, in the resist film forming step 4 in which a resist film is applied and formed on the metal thin plate 1, foreign substances that float in the atmosphere of the resist film forming step or an adjacent manufacturing process adhere to the raw dry resist film immediately after being applied. It can be said that it is easy. When foreign matter adheres to the resist film, the foreign matter becomes a shadow by pattern exposure in a later process, and an unnecessary resist pattern is formed, resulting in defective etched parts.
In addition, the exposure pattern mask used in the pattern exposure process has adhered to the foreign matter floating in the ambient atmosphere of the pattern exposure process or the adjacent manufacturing process, or the foreign substance once attached to the metal thin plate 1 is the exposure pattern mask. When it adheres again, an unnecessary pattern is formed on the exposure pattern mask, and many etching parts having a common defect are manufactured.
[0009]
For this reason, in the manufacture of etched parts, it is common to install a predetermined manufacturing process in a clean room.
[0010]
That is, a predetermined manufacturing process (for example, a resist film forming process 4, a pattern exposure process 5 and the like) is installed in the clean room 21 as shown in FIG. In the example of FIG. 2, a partition wall 22 that reaches from the ceiling of the building where the manufacturing process is placed to the floor surface is provided, and the ceiling, floor surface, wall surface, and partition wall 22 of the building constitute a clean room 21. The atmosphere with the adjacent manufacturing process is blocked by the partition wall 22. In the clean room 21, clean air 23 from which foreign matter has been removed by a foreign matter removing filter or the like is supplied from the air supply means 26, and the air pressure in the clean room 21 is separated from the air pressure in the adjacent chamber 30 separated by the partition wall 22. Generally, it is set to be higher. In the example of FIG. 2, an example in which the resist film forming process 4 (that is, various devices used for forming the resist film) is provided in the clean room 21 is schematically shown. In the example of FIG. 2, the air intake is outside the building, but air may be taken in from the space of the adjacent manufacturing process. Filling the clean room 21 with clean air 23 so that the air pressure in the clean room 21 is higher than the air pressure in the adjacent room 30, preventing foreign matter floating in the adjacent room 30 from entering the clean room 21, and the thin metal plate 1 It is intended to prevent foreign matter from adhering to the surface.
[0011]
However, in the clean room 21 used for manufacturing the etched part, as shown in the example of FIG. 2, the metal thin plate 1 that is a material of the etched part and is continuously conveyed in a strip shape is carried into and out of the clean room 21. It is necessary to provide an opening 24 in the partition wall 22.
[0012]
For this reason, in the conventional clean room 21, the high-pressure air in the clean room 21 has always flowed out from the opening 24 into the adjacent room 30 that is at a low pressure. The atmosphere in the clean room 21 needs to be maintained at a predetermined temperature and humidity as well as simply clean. For example, in the case where the resist film forming step 4 is provided in the clean room 21, the room temperature and humidity in the clean room 21 are determined in order to apply the resist solution to the metal thin plate 1 with a desired film thickness while maintaining the predetermined conditions. It is necessary to keep in the condition of.
Therefore, the air 23 is supplied from the air supply means 26 into the clean room 21 (for example, in the resist film forming step 4), with clean air having a predetermined temperature and humidity passed through a foreign matter removal filter. However, if the air in the clean room 21 always flows out from the opening 24 to the adjacent room 30, the predetermined condition (in order to supplement the outflow) is to maintain the atmosphere in the clean room at the predetermined conditions (predetermined temperature and humidity). Therefore, it can be said that the adjusted air is constantly supplied, and for that purpose, the cost of operating and maintaining the air supply means 26 and the like becomes enormous, which in turn increases the manufacturing cost of the etched parts.
[0013]
Furthermore, since the outflow of air from the opening 24 provided in the partition wall 22 constituting the clean room 21 to the adjacent chamber 30 occurs, there is a problem that foreign matter adheres to the metal thin plate 1. This point will be described below by taking the resist film forming step 4 as an example.
[0014]
As shown in the example of FIG. 2, when the resist film forming step 4 is provided in the clean room 21, the air in the clean room 21 is installed in the adjacent chamber 30 from the opening 24 provided in the partition wall 22. Will be ejected. Although it is cleaner than the leveling step 3, in the atmosphere of the resist film forming step 4, a resist solution is applied to the metal thin plate 1 in addition to foreign matters such as dust generated by the operator and metal powder from the mechanical device. The fine foreign matter 25 made of a resist film piece or the like that is scattered when it is applied or peeled off from the metal thin plate 1 during drying is floating. For this reason, when the air in the clean room 21 flows out from the opening 24a to the leveling process 3 side, the foreign matter 25 in the clean room (inside the resist film forming process 4) is also ejected to the leveling process 3 side at a high speed. . That is, in the vicinity of the opening 24a provided in the partition wall 22, the air containing the foreign matter 25 in the resist film forming step 4 is brought into contact with the surface of the metal thin plate 1 cleaned in the leveling step 3, and before the resist coating to be cleaned is performed. The foreign material 25 adheres to the surface of the thin metal plate 1 and is contaminated.
[0015]
[Problems to be solved by the invention]
The present invention has been made in view of the above-described problems. That is, the present invention provides a partition for shutting off the atmosphere with the adjacent chamber, means for supplying clean air into the partition so as to be higher than the pressure in the adjacent chamber, and an opening for loading and unloading articles provided in the partition. and at least a clean room to prevent the air in the clean room flows out to the adjacent chamber from the opening, in the manufacture of etched parts had use a clean room atmosphere conditions in the clean room can manage easily, provided in the partition wall An object of the present invention is to provide a manufacturing method capable of preventing contamination of a thin metal plate caused by the outflow of foreign matter from an opening, and obtaining a good etched part free from defects.
[0016]
[Means for Solving the Problems]
The present invention has been made on the basis of the above-mentioned problems. In claim 1, the step of adjusting the surface of the thin metal plate using a long strip-shaped thin metal plate, and the step of forming a resist film on the thin metal plate And a step of exposing the resist film to a pattern, a step of developing and hardening the thin metal plate to form a resist film having an opening that exposes the thin metal plate according to a predetermined pattern, and etching the thin metal plate. In a manufacturing method of an etched part having at least a step of performing and a step of stripping a resist film, a partition wall for blocking an atmosphere from the adjacent chamber, and a partition wall for loading and unloading articles to and from the adjacent chamber separated by the partition wall and provided openings, comprising at least a clean room and means for supplying air to the temperature and humidity of the clean or one where the constant to be higher than the pressure in the next room in the space surrounded by the partition Provided in conjunction with the partition wall in the opening so as to surround the circumference of the article in the loading and unloading, hollow cylindrical small thin metal plate that is loading and unloading from the opening in the belt surrounds the periphery of the sheet metal so as not to contact A room and air supply means provided separately from the air supply means for supplying clean air taken from outside the clean room into the small room, and the air in the small room is air from inside the partition wall. Etching parts manufacturing method characterized by installing a resist film forming process in a clean room where the air pressure in the small room and the air pressure in the space enclosed by the partition walls are set to be the same so as to prevent the outflow It is.
[0017]
In the second aspect, clean room is, the differential pressure between the enclosed space and the small room in a septum wall or, means for detecting the differential pressure between the adjacent room and small room in, or the partition wall Means for detecting the wind direction at the boundary with the small room or the boundary between the adjacent room and the small room, and means for controlling the amount of clean air supplied into the small room based on the detection result obtained from the detection means The method of manufacturing an etched part according to claim 1, wherein:
[0019]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described below with reference to the drawings schematically showing examples of embodiments of the present invention.
[0020]
<Example>
A thin metal plate 1 in FIG. 1 is a long strip-shaped material (plate thickness of 0.12 mm) made of an iron alloy (for example, 42% nickel, iron-nickel alloy made of iron, etc.) supplied from a winding roll 2. . The strip-shaped metal thin plate 1 is conveyed on the conveying means such as the conveying roller 10 in a substantially horizontal direction from right to left in the figure. The metal thin plate 1 in FIG. 1 has been transported from a leveling step 3 (not shown), and the surface is cleaned and leveled in the leveling step 3.
[0021]
The thin metal plate 1 that has been subjected to surface cleaning and leveling in the leveling step 3 is carried into a resist film forming step 4.
In the resist film forming step 4, at least one of the metal thin plates 1 is dried by applying a photosensitive resin (resist solution) to the metal thin plate 1 by a roll coater method or a dipping method using a coating roll as usual. A resist film is formed on the surface.
Next, the metal thin plate 1 on which the resist film is formed is unloaded from the resist film forming step 4 and is transferred to a pattern exposure step 5 (not shown).
Here, in this embodiment, as shown in FIG. 1, the resist film forming step 4 is installed in the clean room 11 according to the present invention. Before and after the resist film forming step 4, a partition wall 12 that reaches from the ceiling of the building where the manufacturing process is placed to the floor surface is provided, and the space that becomes the clean room 11 on the ceiling, floor surface, wall surface, and partition wall 12 of the building Is configured. The clean room 11 also has means (first air supply means 16) for supplying clean air into the clean room 11. In the following description, the inside of the partition wall 12 indicates the ceiling, floor surface, wall surface, and space area surrounded by the partition wall 12.
[0022]
The partition wall 12 is provided with an opening 14 for carrying the thin metal plate 1 into the clean room 11 from the adjacent room 30a separated by the partition wall 12, and for discharging the thin metal sheet 1 from the clean room 11 to the adjacent room 30b. . The first air supply means 16 is composed of a foreign matter removal filter, a blower pump, a device for heating and cooling air, a device for humidifying and dehumidifying air, and the like, similar to those provided in a conventional clean room. Yes. The first air supply means 16 takes in clean air 13 that has been taken in from the ambient atmosphere outside the clean room and removed foreign matter with a foreign matter removal filter, and is heated to a predetermined temperature and humidity with a heating / cooling device and humidifying / dehumidifying device as necessary. Thus, the pressure is supplied so that the pressure in the partition wall 12 becomes higher than the pressure in the adjacent chamber 30. Incidentally, in the present embodiment, the pressure in the partition wall 12 was set higher by 0.5 mm / H ₂ O than the pressure in the adjacent chamber 30.
Although the first air supply means 16 of the present embodiment takes in air from outside the building, it may take air from the space of the adjacent room 30 adjacent to the clean room 11.
[0023]
One feature of the clean room according to the present invention, as shown in FIG. 1, the opening 14 of the partition wall 12 separating the clean room 11 and adjacent chamber 30 (14a and 14b), small room 18 (18a linked to the partition wall 12 And 18b). The small chamber 18 has a hollow cylindrical shape surrounding the thin metal plate 1 so that the thin metal plate 1 carried in and out of the opening 14 does not come into contact with the belt. In this embodiment, the sectional shape of the small chamber 18 is The shape was substantially the same as the shape of the opening 14. Further, it is desirable that the opening 19 of the small room 18 into which the thin metal plate 1 is carried in / out is made small so that the thin metal plate 1 being conveyed does not come into contact with the opening 19 in order to reduce the outflow of air from the small room 18. Furthermore, it is desirable that the length of the small chamber 18 in the conveying direction of the thin metal plate 1 is also shortened within a range in which the outflow of air in the partition wall 12 described later can be prevented.
[0024]
The small chamber 18 is supplied with clean air 33 from second air supply means 17 provided separately from the first air supply means 16. In the present embodiment, the second air supply means 17 is provided for each small room 18, but the second air supply means 17 may also be used to distribute air to each small room 18. .
The second air supply means 17 is composed of a foreign matter removal filter, a blower pump, and the like. The second air supply means 17 takes in the air 33 that is taken in from the adjacent chamber 30 where the metal thin plate 1 is carried in and out, removed foreign matter by the foreign matter removal filter, Supplying into the small room 18 without making any adjustments. That is, as will be described later, the air in the small chamber 18 only serves to hinder the outflow of air from the opening 14, and the temperature and humidity desired for manufacturing the etched part like the air in the partition wall 12. There is no need to adjust. However, if there is a foreign object in the air in the small room 18, when the air in the small room 18 enters the partition wall 12 and the adjacent room, the inside of the partition wall 12 and the adjacent room are contaminated with the foreign object. For this reason, it is sufficient for the second air supply means 17 to supply clean air that has not been adjusted in temperature and humidity into the small room 18.
[0025]
Here, the air pressure in the small chamber 18 is set to be substantially the same as the air pressure in the partition wall 12, or is set higher than the air pressure in the adjacent chamber 30 and slightly lower than in the partition wall 12. That is, if the air pressure in the small room 18 is set higher than the pressure in the partition wall 12, the air in the small room 18 that has not been adjusted in temperature and humidity flows into the partition wall 12, and the temperature and humidity in the partition wall 12 This is because the conditions fluctuate.
[0026]
By setting it as the clean room of this structure, it becomes possible to reduce significantly the quantity of the air in the partition 12 which flows out into the adjacent manufacturing process side (a surface adjustment process 3 side and the pattern exposure process 5 side in a present Example). It will be.
[0027]
That is, when the air pressure in the small chamber 18 is substantially the same as the air pressure in the partition wall 12, the air in the partition wall 12 and the air in the small chamber 18 are kept in balance, so the outflow from the opening 14 is reduced. Further, when the air pressure in the small chamber 18 is made slightly lower than that in the partition wall 12, the air in the partition wall 12 flows into the small chamber 18, but the inflow amount is small because the pressure difference is small. That is, in the conventional clean room, the air in the partition wall 12 has flowed out from the opening 14 into the adjacent chamber 30 having a low pressure, but in the clean room of the present invention, the small room 18 set higher than the pressure in the adjacent chamber 30 By providing, the inside of the small chamber 18 becomes a buffer, so that the outflow of air in the partition wall 12 can be reduced.
[0028]
The space in which the predetermined manufacturing process (in this embodiment, the resist film forming process 4) is covered with the partition wall 12 has to increase the internal volume, and the equipment of the air supply means 16 becomes large.
For this reason, as described in the above section (Conventional Technology), in a conventional clean room where air always flows directly out of the partition wall from the opening 14, a large facility is always in operation and the interior of a large clean room is required. Enormous maintenance costs have been incurred to maintain the predetermined temperature and humidity conditions. However, in the clean room of the present invention, the above-described small room 18 is provided to prevent the outflow of air in the partition wall 12, and the clean room (in the partition wall 12) where the manufacturing process is placed is maintained at a predetermined temperature and humidity condition. The cost for maintaining the temperature and humidity conditions in the clean room (in the bulkhead 12) can be reduced. Here, it can be said that the air in the small room 18 continues to flow out from the opening 19 of the small room 18, and the expense of continuing to supply clean air 33 into the small room 18 is newly generated. However, the small chamber 18 is only provided in the opening 14 of the partition wall 12 and has a small internal volume, and the second air supply means 17 may be small. Further, since the second air supply means 17 merely cleans the air and does not adjust the temperature and humidity, a simple structure is sufficient. Therefore, it can be said that the maintenance cost for the operation of the second air supply means 17 is far less expensive than the conventional maintenance of a clean room having a large internal volume at a predetermined temperature and humidity condition.
[0029]
In addition, air in the small chamber 18 flows out from the opening 19 of the small chamber 18 into the adjacent chamber 30, but the amount of foreign matter that flows out of the opening 19 together with the air and contacts the metal sheet 1 to be conveyed is as follows. , Less than before. That is, as described above, the air in the partition wall 12 containing foreign matter is hindered by the clean air in the small room 18, and the outflow toward the opening 19 is reduced.
For this reason, even if the air which flowed out from the opening part 19 of the small room 18 contacts the metal thin plate 1, adhesion of the foreign material to the metal thin plate 1 reduces.
[0030]
Further, the air in the small chamber 18 only prevents the outflow of air from the partition wall 12, and does not prevent the conveyance of the thin metal plate 1 passing through the small chamber 18. That is, in the present invention, the metal thin plate 1 conveyed in the small chamber 18 contacts only the air in the small chamber 18, and scratches and adhesion of foreign substances occur on the metal thin plate 1 being conveyed in the small chamber 18. Absent.
[0031]
As described above, in the present invention, the air pressure in the small chamber 18 is set to be substantially the same as or slightly lower than the air pressure in the partition wall 12. For this reason, in the present embodiment, the detection means 20 for detecting the wind direction wind force is provided in the opening 14 of the partition wall 12.
[0032]
The detection means 20 detects the wind direction and wind force at the opening 14. That is, in the present invention, the air pressure in the small room 18 is set to be substantially the same as or slightly lower than the air pressure in the partition wall 12. For this reason, the flow of air generated in the opening 14 does not generate a flow, or goes from the opening 14 to the small room 18. This is because the air flow generated in the opening 14 is detected from the small room 18 to the opening 14 because the air pressure in the small room 18 is higher than that in the partition wall 12, and in that case, a separately provided control means ( The amount of clean air 33 supplied from the second air supply means 17 is reduced by not shown). However, if the amount of air 33 supplied from the second air supply means 17 is reduced too much, the amount of air 13 in the partition wall 12 flowing out from the opening 14 will increase. Therefore, the wind power generated when the desired atmospheric pressure difference between the small chamber 18 and the partition wall 12 is set in advance, and the control means (see FIG. If the amount of air supplied from the second air supply means 17 is adjusted with the second air supply means 17, the amount of air in the partition wall 12 flowing out from the opening 14 to the small room 18 side can be reduced. The amount of operation can be reduced.
[0033]
Further, when the detection means 20 detects a differential pressure between the partition wall 12 and the small room 18, the differential pressure between the partition wall 12 and the small room 18 detected by the detection means 20 is The amount of air supplied from the second air supply means 17 is appropriately adjusted by a control means (not shown) so as to obtain a predetermined differential pressure.
[0034]
In this embodiment, conventional manufacturing such as a pattern exposure process 5, an etching process 6, and a film removal process 7 is performed on the metal thin plate 1 carried out from the clean room 11 (resist film forming process 4) having the small chamber 18 described above. Etching parts were obtained by performing the process.
[0035]
Although the embodiments of the present invention have been described above, the embodiments of the present invention are not limited to the above description and drawings, and various modifications may be made based on the spirit of the present invention. Needless to say.
[0036]
For example, in the above embodiment, a part of the partition wall constituting the clean room is also used as a part of the building where the manufacturing process is installed (for example, ceiling, floor, wall surface). However, the manufacturing process is performed using the partition wall independent of the building. And forming a space that is cut off from adjacent manufacturing steps.
[0037]
In the above description, the small chambers 18 are provided in the openings 14 on both sides of the loading / unloading, but depending on the atmospheric pressure set in the adjacent manufacturing process, it is provided in either one of the openings 14. It doesn't matter. Furthermore, the cross-sectional shape of the small chamber 18 and the length of the small chamber 18 in the conveying direction of the thin metal plate 1 may be appropriately selected.
Furthermore, when manufacturing the etched parts, not only the resist film forming process 4 but also other manufacturing processes such as the pattern exposure process 5 and the etching process 6 may be provided in the clean room having the above-described configuration as appropriate.
[0038]
【The invention's effect】
As described above, in the clean room according to the present invention , a small room is provided in the opening for carrying in / out the article, where air has been continuously flowing out, and it prevents the outflow of air in the clean room to a predetermined atmosphere. ing. For this reason, the air in the clean room containing the foreign matter is less likely to come into contact with the article being carried in and out, the foreign matter adheres to the article surface and is contaminated, and the foreign substance in the air ejected at high speed comes into contact with the article surface. Scratches can be prevented from occurring. Moreover, since there is no outflow of air from the clean room with a large volume, the cost of maintaining the atmosphere in the clean room in a predetermined atmosphere can be reduced, and the atmosphere in the clean room can be easily managed in the predetermined atmosphere. . Furthermore, if the clean room according to the present invention is used for the manufacture of etching parts, the outflow of foreign matter in the clean room from the opening provided in the partition wall can be reduced. Defects in etched parts caused by adhesion of foreign matter that has flowed out to the outside manufacturing process are eliminated. That is, according to the etching component manufacturing method of the present invention, it is possible to obtain a high-quality etching component at a low cost.
[0039]
[Brief description of the drawings]
FIG. 1 is an explanatory view schematically showing a main part of an embodiment of a clean room according to the present invention.
FIG. 2 is an explanatory diagram showing a main part of an example of a conventional clean room.
FIG. 3 is an explanatory view showing an example of a manufacturing process of an etched part.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Metal thin plate 2 Winding roll 3 Leveling process 4 Resist film formation process 5 Pattern exposure process 6 Development process 7 Etching process 8 Stripping process 9 Cutting process
10 Transport roller
11, 21 Clean room
12, 22 Bulkhead
13, 23, 33 Air
14, 24 opening
25 Foreign matter
16, 26 Air supply means
17 Air supply means
18 small room
19 opening
20 Detection means
30 Adjacent room

Claims (2)

Using a long strip of thin metal plate as a raw material, the step of leveling the thin metal plate, the step of forming a resist film on the thin metal plate, the step of performing pattern exposure on the resist film, the development and hardening processing on the thin metal plate And producing a resist film having a hole having an opening that exposes the metal thin plate according to a predetermined pattern, a step of etching the metal thin plate, and a step of stripping the resist film In
The partition wall for blocking the atmosphere of the next room, and the opening provided in the partition wall in an article unloading needful to adjacent chamber separated by the partition wall, and the temperature and humidity of the clean or One where the constant to be higher than the pressure of the adjacent room A clean room having at least means for supplying air into the space surrounded by the partition wall, the opening portion being connected to the partition wall so as to surround the periphery of the article being carried in and out, and provided in a band shape Separately from the hollow cylindrical small room surrounding the metal thin plate so that the metal thin plate to be carried in and out does not contact, and the air supply means for supplying clean air taken from outside the clean room into the small room The air pressure in the small room and the air pressure in the space surrounded by the partition are set to be the same so that the air in the small room prevents the air from flowing out of the partition . resist in a clean room Makugata Manufacturing method of etching component, characterized in that they have installed process. The clean room detects the pressure difference between the space enclosed by the bulkhead and the small room, or the pressure difference between the adjacent room and the small room, or the boundary between the bulkhead and the small room, or the adjacent room and the small room. A means for detecting a wind direction at a boundary with the room and a means for controlling the amount of clean air supplied into the small room based on a detection result obtained from the detection means. The manufacturing method of the etching components of 1 .

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