JP4069097B2 - Electronic component for embedded board, electronic component-embedded substrate, and method of manufacturing electronic component-embedded substrate - Google Patents

Description

The present invention relates to an electronic component with a built-in board, an electronic component-embedded substrate, and a method of manufacturing an electronic component-embedded substrate, and more particularly, an electronic component with a built-in substrate mounted in an insulating layer of a double-sided printed wiring board or a multilayer printed wiring board. is an electronic component-embedded board with a built-in substrate internal electronic components of this, and a method of manufacturing the electronic component-embedded substrate things.

    In the electronic component built-in substrate, a passive electronic component such as a resistor or a capacitor is formed on an inner layer substrate by a printing technique and the passive electronic component is embedded (for example, Non-Patent Document 1), other than the passive electronic component In some cases, an active electronic component such as an IC chip is embedded and connected to a substrate (for example, Patent Document 1).

    In conventional electronic component built-in substrates, including those in which electronic components are three-dimensionally mounted through an insulating layer of a multilayer printed wiring board, electronic components for built-in substrates use the electrodes of the electronic components themselves as conductors of the substrate. It is just a conductive connection.

    For this reason, in double-sided printed wiring boards and multilayer printed wiring boards, via holes are made in the insulating layer for conduction between conductors on both sides and between conductors in each layer, and interlayer conduction parts are formed by plating, conductive paste, etc. There is a need to.

This not only increases the number of manufacturing steps, but also hinders high-density mounting of electronic components by installing interlayer conductive portions. In addition to the filled hole structure, it is impossible to mount an electronic component on the interlayer conductive portion.
JP 2000-306072 A Printed Circuit Technical Terminology Editorial Board "Printed Circuit Technical Terminology Second Edition" published by Nikkan Kogyo Shimbun, November 15, 2002, 2nd edition, 2nd edition, 288 pages

    The problem to be solved by the present invention is to reduce the number of via holes only for interlayer conduction or to reduce the number of manufacturing steps of a substrate with built-in electronic components, and to achieve high-density mounting of electronic components.

An electronic component with a built-in board according to the present invention is an electronic component with a built-in substrate that is covered with a package body made of an insulating resin and has a cylindrical package shape having end face portions at both ends, and the end face portion of the package body. An electrode conductor portion for circuit connection including the electrode surface exposed on the surface of the package, a peripheral surface portion extending the entire outer peripheral surface of the package body in the axial direction, and one end surface of the package body continuous with one end of the peripheral surface portion An arc-shaped first end surface portion located on the outer peripheral side of the portion, and an arc-shaped second end surface portion located on the outer peripheral side of the other end surface portion of the package body, which is continuous with the other end of the peripheral surface portion And a conductive portion for conduction.

    In the electronic component with a built-in board according to the present invention, preferably, the interlayer conductive portion is constituted by a conductor layer formed on the outer surface of the package body.

    In the board built-in electronic component according to the present invention, it is preferable that the interlayer conductive portion is non-conductive with the electrode conductor portion and is electrically independent from the electrode conductor portion.

    Further, the electronic component with a built-in board according to the present invention has at least two of the electrode conductor portions, and the electrode surface of at least one of the electrode conductor portions is one of both ends of the package body. The electrode surfaces of the remaining electrode conductor portions are exposed on the surface of the other end surface portion of the package body, or all electrode surfaces of these electrode conductor portions are exposed. Is exposed on the surface of one end face of both ends of the package body.

    In the electronic component built-in substrate according to the present invention, the substrate-embedded electronic component according to the above-described invention is built in the insulating layer, and the conductors existing on both surfaces of the insulating layer are mutually connected by the inter-layer conduction conductor portion of the substrate built-in electronic component. Conductive connection is established.

In the method of manufacturing an electronic component built-in substrate according to the present invention, the substrate built-in electronic component according to the above-described invention is built in the insulating layer, and the insulating layer is present on both surfaces of the insulating layer by the interlayer conductive conductors. A method of manufacturing a substrate with built-in electronic components in which conductors are conductively connected to each other, wherein the first conductor layer is provided on one surface of the insulating layer having a layer thickness substantially equal to the axial length of the electronic component with a built-in substrate. Forming a bottomed hole in the insulating layer of the plate having an inner diameter larger than the outer diameter of the electronic component for incorporating a substrate and having a bottom surface provided by the first conductor layer; and the substrate in the bottomed hole Inserting a built-in electronic component and bringing one end face of the substrate built-in electronic component into contact with the first conductor layer; and forming a second conductor layer on the entire other surface of the insulating layer. , The other end surface portion of the electronic component for built-in board is A step of bonding the second conductor layer, by etching the first conductive layer and the second conductive layer and forming a predetermined conductor pattern.

Also, in the method of manufacturing an electronic component built-in substrate according to the present invention, the substrate built-in electronic component according to the above-described invention is built in the insulating layer, and the interlayer conductive conductor portion of the substrate built-in electronic component is provided on both surfaces of the insulating layer. A method of manufacturing an electronic component built-in substrate in which existing conductors are conductively connected to each other, wherein the first conductor layer is formed on one surface of the insulating layer having a layer thickness substantially equal to the axial length of the electronic component for board built-in. Forming a bottomed hole in the insulating layer of the laminate having an inner diameter larger than the outer diameter of the board built-in electronic component and having a bottom surface provided by the first conductor layer; and An anisotropic conductive film is placed on the bottom surface, the board built-in electronic component is inserted into the bottomed hole, and one end surface portion of the board built-in electronic component is inserted through the anisotropic conductive film. A step of facing the first conductor layer; Forming a second conductor layer on the entire other surface of the layer, and joining the other end surface portion of the electronic component for substrate incorporation to the second conductor layer; the first conductor layer and the second conductor layer; Forming a predetermined conductor pattern on the conductor layer by etching.

Also, in the method of manufacturing an electronic component built-in substrate according to the present invention, the substrate built-in electronic component according to the above-described invention is built in the insulating layer, and the interlayer conductive conductor portion of the substrate built-in electronic component is provided on both surfaces of the insulating layer. A method of manufacturing an electronic component built-in substrate in which existing conductors are conductively connected to each other, wherein the first conductor layer is formed on one surface of the insulating layer having a layer thickness substantially equal to the axial length of the electronic component for board built-in. Forming a bottomed hole in the insulating layer of the laminate having an inner diameter larger than the outer diameter of the board built-in electronic component and having a bottom surface provided by the first conductor layer; and Applying an anisotropic conductive paste on the bottom surface, inserting the board built-in electronic component into the bottomed hole, and connecting one end surface portion of the board built-in electronic component to the bottom via the anisotropic conductive paste A step of facing the first conductor layer; Forming a second conductor layer on the entire other surface of the layer, and joining the other end surface portion of the electronic component for substrate incorporation to the second conductor layer; the first conductor layer and the second conductor layer; Forming a predetermined conductor pattern on the conductor layer by etching.

  According to the present invention, in a double-sided printed wiring board or a multilayer printed wiring board, conduction between conductors on both sides and conduction between conductors on each layer can be achieved by an interlayer conduction conductor formed in the electronic component for built-in board. As a result, the number of via holes only for inter-layer conduction can be reduced, or the number of manufacturing steps of the electronic component built-in substrate can be reduced, and further electronic components can be mounted at higher density.

  One embodiment of an electronic component with a built-in board according to the present invention will be described with reference to FIG.

  The board built-in electronic component 10 of this embodiment is a board built-in type capacitor. The electronic component 10 with a built-in board has a cylindrical package shape in which the outside of the capacitor structure portion 21 (not shown in FIG. 2) is covered with a package body 11 made of an insulating resin and has end surface portions 12 and 13 at both ends. Yes.

  The electrode conductor portions 14 and 15 for circuit connection are formed on the end surface portions 12 and 13 of the package body 11, respectively. The electrode surface 14A of one electrode conductor portion 14 is exposed to the surface 12A of one end surface portion 12 of the package body 11, and the electrode surface 15A of the other electrode conductor portion 15 is exposed to the other end surface portion 13 of the package body 11. It is exposed on the surface 13A.

    Interlayer conduction conductor portions 16 and 17 extending between the end surface portions 12 and 13 are formed in the package body 11. Interlayer conduction conductors 16 and 17 are individually provided at two locations in the circumferential direction of the package body 11, and each of the circumferential surface portions 16 </ b> A and 17 </ b> A extends the entire outer circumferential surface of the package body 11 in the axial direction (bus line direction). The arc-shaped end surface portions 16B and 17B, which are continuous to one end of the peripheral surface portions 16A, 17A and located on the outer peripheral side of the end surface portion 12, and the other end of the peripheral surface portions 16A, 17A are positioned on the outer peripheral side of the end surface portion 13. The end faces 16C and 17C have a circular arc shape, and are formed by sputtering, plating, application of a conductor material, or the like to form a conductor layer having a required thickness.

    An example of an internal structure example of the electronic component 10 with a built-in substrate and a manufacturing method thereof will be described with reference to FIGS.

    As shown in FIG. 2 (a), a cylindrical capacitor structure 21 composed of a dielectric 22, a plurality of counter internal electrode plates 23, and two common end face electrodes 24 and 25. 2 is prepared, and as shown in FIG. 2B, the entire outer surface thereof is uniformly covered with an insulating resin, and a package body 11 is provided. The package body 11 has a cylindrical shape having end faces 12 and 13 at both ends.

    Next, as shown in FIG. 2C, electrode openings 26 and 27 are formed in the center of each of the end surface portions 12 and 13 of the package body 11 by laser processing or the like, and electrode openings are formed by plating or the like. 26 and 27 are filled with electrode conductor portions 14 and 15 for circuit connection. The electrode conductor portions 14 and 15 are electrically connected to the common end surface electrodes 24 and 25, respectively. The electrode surfaces 14 A and 15 A of the electrode conductor portions 14 and 15 are the surfaces of the end surface portions 12 and 13 of the package body 11. Exposed to 12A and 13A substantially flush.

    Next, as shown in FIG. 2D, interlayer conductive portions 16 and 17 are formed on the outer surface of the package body 11 by sputtering, plating, or applying a conductive material.

    Interlayer conduction conductor portions 16 and 17 are individually provided at two locations in the circumferential direction of the package body 11, and each of the circumferential surface portions 16 </ b> A and 17 </ b> A extends the entire outer circumferential surface of the package body 11 in the axial direction (bus line direction). And arc-shaped end surface portions 16B and 17B located on the outer peripheral side of the end surface portion 12 and continuing to one end of the peripheral surface portions 16A and 17A, and on the outer peripheral side of the end surface portion 13 continuing to the other end of the peripheral surface portions 16A and 17A. It has end faces 16C and 17C in the shape of arcuate strips, and forms a conductor layer with a required thickness.

    Interlayer conduction conductors 16 and 17 are non-conducting with electrode conductors 14 and 15, respectively, and are electrically independent of electrode conductors 14 and 15.

    Next, an embodiment of an electronic component built-in substrate according to the present invention and an example of a manufacturing method thereof will be described with reference to FIGS.

    First, as shown in FIG. 3A, the insulating layer 31 of a single-sided copper-clad laminate (CCL) 30 having a copper foil (conductor layer) 32 on one side of a resin-made insulating layer 31 is subjected to laser processing or A round hole 33 is formed by etching or the like. The round hole 33 has an inner diameter substantially equal to the outer diameter of the electronic component 10 with a built-in board, and forms a bottomed hole provided with a copper foil 32 on the bottom surface.

    The board built-in electronic component 10 is inserted into the round hole 33. Since the electronic component 10 with a built-in board has a cylindrical shape having an axial length substantially equal to the layer thickness of the insulating layer 31, as shown in FIG. The lower end surface portion 13 of the electronic component 10 is in contact with the copper foil 32 on the bottom surface of the round hole 33, and the upper end surface portion 12 is substantially flush with the upper surface 31 A of the insulating layer 31.

    Next, as shown in FIG. 3C, a copper foil (conductor layer) 34 is formed on the entire upper surface 31A of the insulating layer 31 by plating or the like. Thereby, the upper end surface portion 12 of the electronic component 10 with a built-in board is bonded to the copper foil 34 that forms the ceiling portion of the round hole 33.

    Next, as shown in FIG. 3D, the copper foils 32 and 34 are etched to form conductor patterns 35 and 36.

    In this embodiment, the electrode conductor portion 15 of the electronic component 10 for incorporating a substrate, the end surface portion 16C of the conductor portion 16 for interlayer conduction, and the end surface portion 17C of the conductor portion 17 for interlayer conduction are electrically connected to the conductor 35a. The electrode conductor portion 14 of the electronic component 10 is conductively connected to the conductor 36a, the end surface portion 16B of the interlayer conductive portion 16 is connected to the conductor 36b, and the end surface portion 17B of the interlayer conductive portion 17 is connected to the conductor 36c (FIG. 1). FIG. 2 (d)). When this connection portion is viewed from above, it is as shown in FIG.

    As a result, the interlayer conductive portion 16 forms an interlayer conductive portion for conductively connecting the conductors 35a and 36b, and the interlayer conductive conductor portion 17 forms an interlayer conductive portion for conductively connecting the conductors 35a and 36c.

    This reduces the number of via holes just for interlayer conduction in double-sided printed wiring boards with built-in electronic components and multilayer printed wiring boards, reduces the number of board manufacturing steps, and also achieves high-density mounting of electronic components. Is possible.

    Further, since the inter-layer conducting conductors 16 and 17 are non-conducting with the electrode conductors 14 and 15, respectively, and are electrically independent from the electrode conductors 14 and 15, double-sided printed wiring boards and multilayers are provided. Arrangement of interlayer conductive portions in the printed wiring board and the degree of freedom in circuit design are increased, and further electronic components can be mounted at higher density.

    In the electronic component built-in substrate, the conduction between the electrode conductor portion 14 and the inter-layer conduction conductor portions 16 and 17 and the conductors 36a, 36b, and 36c of the electronic component 10 for incorporating the substrate is performed by the conductor layer 34 plated on the insulating layer 31. As a result, the connection resistance is small, and it is stable.

    On the other hand, the conduction between the electrode conductor portion 15 and the inter-layer conduction conductor portions 16 and 17 of the electronic component 10 with a built-in board and the conductor 35a is merely a facing contact, so that the connection resistance is large and may become unstable. There is sex.

    In such a case, as shown in FIG. 5, the anisotropic conductive film (ACF) 41 is made up of the end face portion 13 of the electronic component 10 with a built-in board and the copper foil 32 forming the bottom of the round hole 33. An anisotropic conductive paste (ACP) is formed on the copper foil 32 forming the bottom of the round hole 33 as shown in FIG. ) 42 may be applied so as to conduct through the anisotropic conductive paste 42.

    Note that the number of inter-layer conduction conductors provided in the board-embedded electronic component 10 is not limited to two, and may be one or two or more according to the number of necessary interlayer conduction parts. There may be a plurality.

    Next, another embodiment of the electronic component with a built-in board according to the present invention will be described with reference to FIG. 7, parts corresponding to those in FIG. 1 are denoted by the same reference numerals as those in FIG. 1, and description thereof is omitted.

    In the substrate built-in electronic component 100 of this embodiment, all the electrode conductor portions 14 and 15 are provided on one end surface portion 12 of the package body 11. The electrode surfaces 14 </ b> A and 15 </ b> A of the electrode conductor portions 14 and 15 are exposed on the surface 12 </ b> A of one end surface portion 12 of the package body 11.

    A conductor layer 18 is formed on the other end surface portion 13 of the electronic component 100 with a built-in substrate, and the interlayer conduction conductor portions 16 and 17 are conductively connected by the conductor layer 18 on the end surface portion 13 side.

    When the board built-in electronic component 100 is mounted on a board equivalent to the board with built-in electronic component shown in FIG. 3D, the mounting portion of the board built-in electronic component 100 is shown in FIG. Be like that. In this case, the electrode conductor portions 14 and 15 are electrically connected to conductors 36d and 36e provided from the conductor layer 34 formed by plating, respectively.

    The board built-in electronic component according to the present invention is not limited to a capacitor, and may be another passive electronic component such as a resistor, or may be an active electronic component such as a diode, a transistor, or an IC chip, and the number of electrode conductor portions. However, the number is not limited to two, and may be two or more.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing one embodiment of an electronic component with a built-in board according to the present invention. (A)-(d) is an expanded sectional view which shows an example in the example of an internal structure of the electronic component for board | substrate incorporation by this invention, and its manufacturing method. (A)-(d) is an expanded sectional view which shows one example of one Embodiment of the electronic component built-in board by this invention, and its manufacturing method. It is a top view of the electronic component mounting part for board | substrate incorporation of the electronic component built-in board | substrate of one Embodiment. It is an expanded sectional view which shows other embodiment of the electronic component built-in substrate by this invention. It is an expanded sectional view which shows other embodiment of the electronic component built-in substrate by this invention. It is a perspective view which shows other embodiment of the electronic component for board | substrates by this invention. It is a top view of the electronic component mounting part for board | substrate incorporation of the electronic component built-in board | substrate of other embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,100 Board built-in electronic component 11 Package body 12, 13 End surface part 14, 15 Electrode conductor part 16, 17 Interlayer conduction conductor part 18 Conductor layer 21 Capacitor structure part 22 Dielectric 23 Opposite internal electrode plate 24, 25 Common end face Partial electrode 26, 27 Electrode opening 30 Single-sided copper-clad laminate 31 Insulating layer 32 Copper foil 33 Round hole 34 Copper foil 35, 36 Conductor pattern 41 Anisotropic conductive film 42 Anisotropic conductive paste

Claims (9)

A board-embedded electronic component having a cylindrical package shape that is covered with a package body made of an insulating resin and has end face portions at both ends,
An electrode conductor portion for circuit connection including an electrode surface exposed on the surface of the end face portion of the package body;
A peripheral surface portion extending the entire outer peripheral surface of the package body in the axial direction, a first end surface portion in the shape of an arc belt continuous with one end of the peripheral surface portion and positioned on the outer peripheral side of one end surface portion of the package body, An inter-layer conduction conductor portion having a second end surface portion in the shape of a circular arc band that is continuous with the other end of the surface portion and is located on the outer peripheral side of the other end surface portion of the package body;
An electronic component with a built-in board.   The board built-in electronic component according to claim 1, wherein the interlayer conductive part is formed of a conductor layer formed on an outer surface of the package body.   The board built-in electronic component according to claim 1, wherein the inter-layer conduction conductor is non-conducting with the electrode conductor and is electrically independent of the electrode conductor.     There are at least two electrode conductor portions, and the electrode surface of at least one of the electrode conductor portions is exposed on the surface of one end surface portion of the both ends of the package body, and the remaining electrodes The electronic part for board | substrate incorporation in any one of Claims 1-3 which the electrode surface of the conductor part is exposed to the surface of the other end surface part among the both ends of the said package body.   4. The device according to claim 1, wherein at least two electrode conductor portions are provided, and all electrode surfaces of these electrode conductor portions are exposed on the surface of one end surface portion of both ends of the package body. An electronic component for mounting on a board as described in the item.   The board-embedded electronic component according to any one of claims 1 to 5 is built in the insulating layer, and conductors existing on both surfaces of the insulating layer are mutually connected by the inter-layer conduction conductor portion of the board-embedded electronic component. A board with built-in electronic components that is connected in a conductive manner. The board-embedded electronic component according to any one of claims 1 to 5 is built in the insulating layer, and conductors existing on both surfaces of the insulating layer are mutually connected by the inter-layer conduction conductor portion of the board-embedded electronic component. A method of manufacturing an electronic component built-in substrate that is conductively connected,
The insulating layer of the laminate having a first conductor layer on one surface of the insulating layer having a layer thickness substantially equal to the axial length of the electronic component for built-in substrate has an inner diameter larger than the outer diameter of the electronic component for embedded substrate. Forming a bottomed hole provided with a bottom surface provided by the first conductor layer;
Inserting the substrate built-in electronic component into the bottomed hole, and bringing one end face of the substrate built-in electronic component into contact with the first conductor layer; and
Forming a second conductor layer on the entire other surface of the insulating layer, and bonding the other end surface portion of the electronic component for built-in board to the second conductor layer;
  Forming a predetermined conductor pattern by etching on the first conductor layer and the second conductor layer;
  A method for manufacturing a substrate with built-in electronic components including: The board-embedded electronic component according to any one of claims 1 to 5 is built in the insulating layer, and conductors existing on both surfaces of the insulating layer are mutually connected by the inter-layer conduction conductor portion of the board-embedded electronic component. A method of manufacturing an electronic component built-in substrate that is conductively connected,
The insulating layer of the laminate having a first conductor layer on one surface of the insulating layer having a layer thickness substantially equal to the axial length of the electronic component for built-in substrate has an inner diameter larger than the outer diameter of the electronic component for embedded substrate. Forming a bottomed hole provided with a bottom surface provided by the first conductor layer;
An anisotropic conductive film is placed on the bottom surface of the bottomed hole, the board built-in electronic component is inserted into the bottomed hole, and one end surface portion of the board built-in electronic component is placed on the anisotropic surface. Facing the first conductor layer through a conductive film;
Forming a second conductor layer on the entire other surface of the insulating layer, and bonding the other end surface portion of the electronic component for built-in board to the second conductor layer;
  Forming a predetermined conductor pattern by etching on the first conductor layer and the second conductor layer;
  A method for manufacturing a substrate with built-in electronic components including: The board-embedded electronic component according to any one of claims 1 to 5 is built in the insulating layer, and conductors existing on both surfaces of the insulating layer are mutually connected by the inter-layer conduction conductor portion of the board-embedded electronic component. A method of manufacturing an electronic component built-in substrate that is conductively connected,
The insulating layer of the laminate having a first conductor layer on one surface of the insulating layer having a layer thickness substantially equal to the axial length of the electronic component for built-in substrate has an inner diameter larger than the outer diameter of the electronic component for embedded substrate. Forming a bottomed hole provided with a bottom surface provided by the first conductor layer;
An anisotropic conductive paste is applied to the bottom surface of the bottomed hole, the board built-in electronic component is inserted into the bottomed hole, and one end surface portion of the board built-in electronic component is connected to the anisotropic conductive material. Facing the first conductor layer via a paste;
Forming a second conductor layer on the entire other surface of the insulating layer, and bonding the other end surface portion of the electronic component for built-in board to the second conductor layer;
  Forming a predetermined conductor pattern by etching on the first conductor layer and the second conductor layer;
  A method for manufacturing a substrate with built-in electronic components including:

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