JP4070987B2 - Processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a processing apparatus for transferring a processing object such as a semiconductor wafer (hereinafter referred to as “wafer”) or an LCD substrate from a cassette station to a process station.
[0002]
[Prior art]
In the semiconductor device manufacturing process, single-wafer processing is progressing with the recent increase in the diameter of semiconductor wafers. For example, in a combined processing system that performs resist coating processing and phenomenon processing in one system, wafers are taken out from the cassette one by one, processed in the processing unit one by one, and processed wafers one by one in the cassette. It has been done to return.
[0003]
FIG. 37 is a diagram showing a schematic configuration of a conventional coating phenomenon processing system.
As shown in FIG. 37, a plurality of cassettes CR are placed on the cassette station 102 of the conventional coating phenomenon processing system, and wafers W are taken out one by one from the cassette CR by the wafer transfer mechanism 105, and the process station 101. The resist is applied and developed.
[0004]
The wafer transfer mechanism 105 includes a drive unit 103 and an arm 104. The arm 104 is movable in the X-axis, Y-axis, and Z-axis directions by the drive unit 103 and is rotatable around the Z-axis. The processed wafer W is returned to the cassette CR of the cassette station 102 by the wafer transfer mechanism 105.
[0005]
In order to prevent particles from adhering to the wafer W, the coating phenomenon processing system is installed in a clean room, and a clean air downflow is formed inside the processing system.
[0006]
By the way, a detachable lid is attached to the opening of the cassette CR so that particles do not enter the cassette CR during the conveyance of the cassette CR.
[0007]
[Problems to be solved by the invention]
However, if the lid is removed from the cassette CR set in the cassette station 102 and the lid is inadvertently held in the cassette station 102, the lid itself removed from the cassette CR itself hinders the downflow of cleaning air in the processing system. Therefore, there is a problem that the process station 101 has an adverse effect such as the formation of an air flow in which particles are likely to enter.
[0008]
Further, in the conventional apparatus, when the wafer W protrudes from the wafer cassette CR, the wafer W protruding from the wafer cassette CR interferes with the mapping sensor 21b as shown in FIG. is there.
[0009]
The present invention has been made to solve such a problem, and the object to be processed can be taken in and out of the cassette having the lid without disturbing the downflow of the cleaning air in the cassette station. It is an object of the present invention to provide a processing apparatus capable of effectively preventing adhesion of particles and preventing particles from flowing into the process station from the cassette station side.
[0010]
[Means for Solving the Problems]
  According to the first aspect of the present invention, an opening for taking in and out a plurality of objects to be processed is formed, and the opening is detachably attached to the opening.Lid with multiple keyholesA cassette mounting table on which a cassette having a cassette is placed, a transfer chamber having a first transfer window for transferring an object to be processed from the cassette, and a transfer chamber provided in the transfer chamber via the first transfer window Conveying means for taking in and out the object to be processed from the cassette, and holding the lid via the first delivery window, and horizontally moving the held lid toward the conveying means side. After being removed from the cassette, it is transferred downward, and thereafter, the lid is moved horizontally to the cassette side and stored in a storage portion, and is disposed adjacent to the transfer chamber, And a processing chamber for processing the object to be processed carried in via the second delivery window.When the lid transfer mechanism is inserted into the keyhole and rotated, the lid is released from the cassette and the lid is fixed to the lid transfer mechanism, and the plurality of keys rotate about the axis θ. Has a rotation mechanismIt is characterized by that.
[0011]
  The invention according to claim 2The processing apparatus according to claim 1, wherein the storage portion is provided below the first delivery window.
[0016]
According to the processing apparatus of the present invention, the downflow of the cleaning air is not disturbed in the cassette station, and particles do not adhere to the object to be processed or particles do not flow into the process station from the cassette station side.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, details of embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a plan view showing a schematic configuration of a coating phenomenon treatment system according to an embodiment of the present invention.
[0018]
As shown in FIG. 1, the coating and developing treatment system 1 includes a cassette station 10, a process station 11, an interface unit 12, two sub arm mechanisms 21 and 24, and a main arm mechanism 22, and is provided in a clean room.
[0019]
A fan filter unit (FFU) for air conditioning is provided on the upper part of each part 10, 11, and 12, and clean air is blown out downward to form a downflow of clean air.
[0020]
The cassette station 10 includes a cassette mounting table 20, and a plurality of cassettes CR are mounted on the cassette mounting table 20. One lot of wafers W is stored in the cassette CR. One lot is 25 sheets or 13 sheets. The wafer W is taken out from the cassette CR by the sub arm mechanism 21 and loaded into the process station 11.
[0021]
FIG. 2 is a front view of the coating and developing treatment system according to the present embodiment, and FIG. 3 is a rear view of the coating and developing treatment system according to the present embodiment.
[0022]
As shown in FIGS. 2 and 3, the process station 11 includes five processing unit groups G1 to G5. The processing units of each group G1 to G5 are arranged in multiple upper and lower stages, and wafers W are loaded and unloaded one by one by the main arm mechanism 22. The interface unit 12 is provided between the process station 11 and an exposure apparatus (not shown). The wafer W is carried into and out of the exposure apparatus by the sub arm mechanism 24.
[0023]
Four protrusions 20 a are provided on the cassette mounting table 20, and the cassette CR is positioned on the mounting table 20 by the protrusions 20 a. A lid 44 is attached to the cassette CR carried into the cassette station 10. The cassette CR is placed on the mounting table 20 with the lid 44 facing the process station 11.
[0024]
The process station 11 is provided with five processing unit groups G1, G2, G3, G4, and G5. The first and second processing unit groups G1 and G2 are arranged on the front side of the system, the third processing unit group G3 is arranged adjacent to the cassette station 10, and the fourth processing unit group G4 is the interface unit 12. The fifth processing unit group G5 is arranged on the back side.
[0025]
The main arm mechanism 22 includes drive mechanisms for X axis, Z axis, and θ rotation. When the main arm mechanism 22 delivers the wafer W from the first sub-arm mechanism 21, the wafer W is transferred to the alignment unit (ALIM) and the extension unit (EXT) belonging to the third processing unit group G3 in the process station 11. It is supposed to be.
[0026]
As shown in FIG. 2, in the first processing unit group G1, in the cup CP, two spinner type processing units, for example, a resist coating unit (COT) and a developing unit that perform predetermined processing by placing a wafer W on a spin chuck in a cup CP. Units (DEV) are stacked in two stages from the bottom. Also in the second processing unit group G2, two spinner processing units, for example, a resist coating unit (COT) and a developing unit (DEV) are stacked in two stages in order from the bottom. These resist coating units (COT) are preferably arranged in the lower stage so that the waste liquid can be easily discharged.
[0027]
As shown in FIG. 3, the third processing unit group G3 includes, for example, a cooling unit (COL), an adhesion unit (AD), an alignment unit (ALIM), an extension unit (EXT), and a pre-baking unit (PREBAKE). ) And post-baking units (POBAKE) are stacked in eight stages from the bottom. The fourth processing unit group G4 also includes, for example, a cooling unit (COL), an extension / cooling unit (EXTCOL), an extension unit (EXT), a cooling unit (COL), a pre-baking unit (PREBAKE), and a post-baking unit ( POBAKE) are stacked in 8 steps from the bottom.
[0028]
In this way, the cooling unit (COL) and the extension cooling unit (EXTCOL) having a low processing temperature are arranged in the lower stage, and the baking unit (PREBAKE), the post-baking unit (POBAKE) and the adhesion unit (AD) having a high processing temperature. By arranging in the upper stage, it is possible to reduce the thermal mutual interference between the units.
[0029]
The interface unit 12 has substantially the same size in the X-axis direction as that of the process station 11, but the size in the Y-axis direction is smaller than that of the process station 11.
[0030]
A stationary buffer cassette BR is disposed on the front surface of the interface section 12, a peripheral exposure device 23 is disposed on the other back surface, and a second sub-arm mechanism 24 is disposed on the center. The second sub-arm mechanism 24 includes the same X-axis, Y-axis, Z-axis, and θ-rotation drive mechanisms as the first sub-arm mechanism 21, and an extension unit belonging to the fourth processing unit group G4. (EXT) and also a wafer transfer table (not shown) on the adjacent exposure apparatus side can be accessed.
[0031]
Further, in the coating and developing treatment system 1, the fifth processing unit group G <b> 5 can be disposed on the back side of the main wafer transfer mechanism 22. The fifth processing unit group G5 can move along the guide rail 25 in the Y-axis direction. By moving the fifth processing unit group G5, a space for maintenance and inspection work from behind is secured for the main arm mechanism 22.
[0032]
FIG. 4 is a partially transparent sectional view showing the cassette lid removing mechanism according to the present embodiment. As shown in FIG. 4, the transfer chamber 31 of the cassette station 10 is partitioned from the clean room atmosphere by a first vertical partition plate 32. A gate block 60 is attached to the lower part of the first vertical partition plate 32. An opening (passage) 33a and a lower opening (storage chamber) 33b are formed in the gate block 60, and a lid removing mechanism 47 is provided in the upper and lower openings 33a and 33b). The lid removing mechanism 47 removes the lid 44 from the cassette CR in the passage 33a and temporarily stores the lid 44 in the storage chamber 33b.
[0033]
The cassette station 10 and the process station 11 are partitioned by a second vertical partition plate 35. An opening / closing shutter 37 is attached to the passage 36 of the second vertical partition plate 35.
[0034]
A first sub arm mechanism 21 is provided in the space between the first and second partition plates 32 and 35. The first sub-arm mechanism 21 includes an X-axis drive mechanism 42 that moves the arm 21a in the X-axis direction, a Y-axis drive mechanism 39 that moves the arm 21a in the Y-axis direction, and a Z that moves the arm 21a in the Z-axis direction. The shaft drive mechanism 40 and the θ rotation drive mechanism 40 that rotates the arm 21a around the Z axis are provided. The first sub arm mechanism 21 takes out the wafer W from the cassette CR through the passage 33a of the gate block 60, and further carries the wafer W into the process station 11 through the passage 36 of the second partition plate 35. .
[0035]
Next, the cassette mounting table 20 and the lid removing mechanism 47 will be described with reference to FIGS. 5, 6, 7 to 19, 22, and 26.
[0036]
FIG. 6 is an enlarged vertical sectional view of the periphery of the mounting table 20 on which the cassette CR is set.
[0037]
The cassette mounting table 20 is provided with a movable base 80 connected to the rod 82 a of the Y-axis cylinder 82. A protrusion 20 a is attached to the center of the upper surface of the movable base 80. When the cassette CR is placed on the mounting table 20, the projection 20a is fitted into a bottom recess (not shown) of the cassette CR so that the cassette CR is positioned. The protrusion 20 a has a touch sensor function. When the cassette CR is placed on the mounting table 20, it detects the cassette CR and sends a detection signal to the controller 59.
[0038]
FIG. 5 is a perspective view showing the cassette lid removing mechanism according to the present embodiment.
As shown in FIG. 5, the lid removal mechanism 47 includes a shutter plate 49 and an elevating mechanism 52. The elevating mechanism 52 includes a pair of linear guides 48, a ball screw 53, and a motor 55. In addition, the raising / lowering mechanism 52 may be comprised with the air cylinder. Each linear guide 48 is provided vertically on both sides of the upper and lower openings 33a and 33b. Nuts 49 a are attached to the left and right ends of the shutter plate 49, and each nut 49 a is connected to each of the linear guides 48.
[0039]
The nut 49 a is screwed into the ball screw 53 of the elevating mechanism 52, and the gear 54 of the screw 53 is engaged with the drive gear 56 of the motor 55. By such an elevating mechanism 52, the shutter plate 49 is moved in the Z-axis direction in the space from the passage 33a to the storage chamber 33b.
[0040]
The shutter plate 49 has a pair of keys 50, and each of the keys 50 is supported by a θ ′ rotation drive mechanism (not shown).
[0041]
FIG. 22 is an exploded perspective view showing the cassette CR and the lid 44 according to the present embodiment. Each key 50 is attached to the shutter plate 49 so as to correspond to each keyhole 45 of the cassette lid 44 shown in FIG.
[0042]
FIG. 26 is a cross-sectional view showing the lock key of the cassette lid removing mechanism according to this embodiment.
[0043]
As shown in FIG. 26, when the key 50 is inserted into the key hole 45 and the key 50 is rotated by θ ′, the lock piece 250 falls into the key groove of the key hole 45, and the cassette cover 44 is locked to the shutter plate 49. Yes.
[0044]
As shown in FIG. 6, the first optical sensors 57a and 57b are respectively provided above and below the gate block 60 so that the optical axis crosses the front surface of the cassette CR at the third position. The second optical sensors 58a and 58b are respectively provided above and below the gate block 60 so that the optical axis crosses the front surface of the cassette CR at the second position.
[0045]
The controller 59 controls the operations of the Y-axis cylinder 82 and the lid removing mechanism 47 of the mounting table 20 based on the detection information sent from the touch sensor 20a and the first and second optical sensors 57a, 57b, 58a, 58b, respectively. It comes to control.
[0046]
7 to 19 are diagrams showing a series of operations of the cassette lid removing mechanism according to the present embodiment.
[0047]
As shown in FIG. 8, the position of the first cassette CR when the cassette CR is positioned on the mounting table 20 is referred to as a “first position”. Further, as shown in FIGS. 13 to 15, the position of the cassette CR when the wafer W is taken out from the cassette CR with the lid 44 removed is referred to as a “second position”. Further, as shown in FIGS. 12 and 16, the position of the cassette CR at the cassette retracted position when the cover 44 is removed from the cassette CR or fitted is referred to as a “third position”.
[0048]
The lid 44 of the cassette CR in the first position is located at the entrance (front end) of the passage 33a. The controller 59 determines whether or not the cassette CR is in the first position based on the detection information of the touch sensor 20a and the cylinder sensor of the cylinder 82.
[0049]
The first optical sensors 57a and 57b are used to monitor whether or not the wafer W has jumped out of the cassette CR when the lid 44 is removed. The second optical sensors 58a and 58b are provided by the arm 21a. This is to prevent the arm 21a and the wafer W in the cassette CR from interfering when accessing the cassette CR.
[0050]
Next, the operation of the lid removal mechanism 47 will be described with reference to FIGS. 7 to 19, 20, 22, and 26.
[0051]
Before the cassette CR is placed on the mounting table 20, as shown in FIG. 7, the shutter plate 49 of the lid removing mechanism 47 is located in the passage (tunnel structure) 33 a, and the atmosphere in the transfer chamber 31 is caused by the shutter plate 49. It is cut off from the clean room atmosphere.
[0052]
As shown in FIG. 8, when the cassette CR is placed on the mounting table 20, the protrusion 20a is fitted into a bottom recess (not shown) of the cassette CR, and the cassette CR is positioned at the first position.
[0053]
As shown in FIG. 9, the cassette CR is advanced from the first position to the second position, and the cassette lid 44 is pressed against the shutter plate 49.
[0054]
Next, as shown in FIGS. 10, 22, and 26, the key 50 is inserted into the keyhole 45, and the shutter plate 49 is locked to the lid 44 by turning the key 50. As a result, the cassette lid 44 is integrated with the shutter plate 49.
[0055]
As shown in FIG. 11, the cassette CR is retracted from the second position to the third position, and the lid 44 is pulled away from the cassette CR.
[0056]
Next, as shown in FIG. 12, the lid 44 is lowered together with the shutter plate 49, and the lid 44 is accommodated in the accommodation chamber (lower opening) 33b. The third position is in the passage (tunnel), and the inside of the cassette CR is in the apparatus atmosphere. Moreover, since the inside of the tunnel, the cassette CR does not come off, and safety is considered in the locked state.
[0057]
As shown in FIG. 13, the cassette CR is advanced from the third position to the second position, and the front end of the cassette CR is moved to the cassette arm access position. This cassette CR blocks the atmosphere in the transfer chamber 31 from the clean room atmosphere and prevents particles from entering the processing system 1 via the passage 33a.
[0058]
As shown in FIGS. 14 and 15, the arm 21a of the first sub arm mechanism 21 is inserted into the cassette CR, and the wafer W is taken out from the cassette CR.
[0059]
FIG. 20 is a plan view showing a state in which the wafer protruding from the cassette and the sub-arm mapping sensor interfere with each other.
[0060]
As shown in FIG. 20, a pair of mapping sensors 21b are movably attached to the arm 21a of the first sub-arm mechanism 21. These sensors 21b advance to the tip of the arm 21a during the mapping operation. For this reason, if there is a wafer W protruding from the cassette CR, the sensor 21b collides with the protruding wafer W to cause a mapping malfunction, and the wafer W is damaged. In order to avoid such mutual interference between the protruding wafer W and the sensor 21b, when the first sensors 57a and 57b detect the wafer W protruding from the cassette CR, the controller 59 that receives the detection signal issues an alarm. Stop the mapping operation.
[0061]
The operator checks the wafer W in the cassette CR and corrects the wafer W to the correct position in the cassette CR. Then, the reset button is pressed to resume the processing work. Note that the protruding wafer W may be pushed into the cassette CR using an electrically driven wafer pushing mechanism (not shown) instead of manual work by the operator.
[0062]
The wafer W is transferred from the cassette station 10 to the process station 11, processed in each unit of the process station 11, further subjected to exposure processing by the exposure apparatus, and returned to the cassette CR of the cassette station 10 after the processing is completed.
[0063]
When the processing of all the wafers W in the cassette CR is completed in this way, the cassette CR is moved backward from the second position to the third position as shown in FIG. By positioning the cassette CR at the third position, the lid 44 and the cassette CR do not interfere with each other when the lid 44 is lifted from the storage chamber 33b.
[0064]
As shown in FIG. 17, the lid 44 is raised together with the shutter plate 49, and the lid 44 is positioned in the passage 33a.
[0065]
Next, as shown in FIG. 18, the cassette CR is advanced from the third position to the second position, and the opening of the cassette CR is pressed against the lid 44. As a result, the lid 44 is fitted into the opening of the cassette CR.
[0066]
Further, as shown in FIGS. 22 and 26, the key 50 is turned to release the lock between the shutter plate 49 and the lid 44. As shown in FIG. 19, the cassette CR is retracted from the second position to the first position, and the lid 44 is pulled away from the shutter plate 49. Then, the cassette CR is carried out from the cassette station 10.
[0067]
According to the above apparatus, the shutter plate 49 blocks the passage 33a during non-processing, and the cassette CR blocks the passage 33a during processing, so that particles are less likely to enter the system from the clean room.
[0068]
Further, since the cassette CR is moved forward or backward toward the passage 33a by the Y-axis cylinder 82, the lid removing mechanism 47 does not require a Y-axis drive mechanism. For this reason, the structure of the lid removing mechanism 47 is simplified, and the generation amount of particles is reduced.
[0069]
Further, since the wafer W is taken in and out of the cassette CR with the front end portion of the cassette CR inserted into the passage 33a, it is possible to completely prevent the operator from inadvertently lifting the cassette CR being processed from the mounting table 20. Can do.
[0070]
Next, an apparatus according to a second embodiment of the present invention will be described with reference to FIGS. Note that a description of portions of the second embodiment that are common to the first embodiment will be omitted.
[0071]
FIG. 21 is a partially transparent sectional view showing a cassette lid removing mechanism according to the second embodiment of the present invention.
[0072]
As shown in FIG. 21, the transfer chamber 31 of the cassette station 10 is partitioned from the clean room atmosphere by a partition plate 32. The partition plate 32 is made of, for example, an acrylic plate or a stainless steel plate. Four passages 33 are formed in the partition plate 32. A sub arm mechanism 21 is provided in the transfer chamber 31. The sub arm mechanism 21 takes in and out the wafer W from the cassette CR through the passage 33.
[0073]
The size of the passage 33 is slightly larger than the opening 43 of the cassette CR. An opening / closing shutter 34 is provided above the passage 33. The shutter 34 is opened when the cassette CR is on the mounting table 20, and is closed when the cassette CR is not on the mounting table 20.
[0074]
As shown in FIG. 22, an opening 43 is formed in the front surface of the cassette CR, and the wafer W is taken in and out of the cassette CR through the opening 43. The opening 43 is covered with a lid 44, and the cassette CR is hermetically sealed. The inside of the cassette CR is filled with a non-oxidizing gas such as N 2 gas. Note that the mounting table 20 may be provided with N2 gas filling means so that the cassette CR from which the wafer W is to be taken out is filled and replenished with N2 gas or the like. Note that a lock mechanism (not shown) for fixing the lid 44 to the cassette CR is provided inside the lid 44. Further, two key holes 45 are formed on the surface side of the lid 44. The distance between the two key holes 45 is preferably at least half of the long side size of the lid 44.
[0075]
As shown in FIG. 21, four lid storage portions 246 are provided along the X-axis direction on the side surface of the cassette mounting table 20 on the transfer chamber 31 side. The lid storage portion 246 is for storing the lid 44 removed from the cassette CR.
[0076]
On the other hand, the transport chamber 31 is provided with four lid removal mechanisms 247. The lid removing mechanism 247 is provided corresponding to the lid storage portion 246, and is configured to remove the lid 44 from the cassette CR and store it in the lower lid storage portion 246.
[0077]
FIG. 23 is a perspective view showing the cassette lid removing mechanism and the cassette lid according to the second embodiment of the present invention, and FIG. 24 is a plan view showing the cassette lid removing mechanism according to the second embodiment of the present invention. FIG. 25 is an exploded perspective view showing a cassette lid removing mechanism according to the second embodiment of the present invention.
[0078]
As shown in FIGS. 23 to 25, the lid removal mechanism 247 includes a Z-axis direction drive mechanism 251 and a Y-axis direction drive mechanism 252. The Z-axis direction drive mechanism 251 includes two Z-axis cylinders 254 configured to move up and down in synchronization, and the lid transfer member 248 is supported by these Z-axis cylinders 254. Each Z-axis cylinder 254 is supported at both ends of one support member 255. Further, the support member 255 is connected to two Y-axis cylinders 256. These Y-axis cylinders 256 are attached to the cassette mounting table 20, and move the lid transfer member 248 in the Y-axis direction.
[0079]
By the way, the coating and developing treatment system 1 is installed in a clean room in which a clean air downflow is formed.
[0080]
27 is an internal perspective view showing the flow of clean air in the substrate processing apparatus according to the embodiment of the present invention. FIG. 28 is an internal perspective view showing the flow of clean air in the substrate processing apparatus according to the embodiment of the present invention. FIG.
[0081]
As shown in FIGS. 27 and 28, a clean air downflow is also formed inside the system 1, thereby increasing the cleaning degree of each part of the processing system 1. In the system 1, air supply chambers 61, 62, and 63 are provided above the cassette station 10, the processing station 11, and the interface unit 12. ULPA filters 64, 65, and 66 having a dustproof function are attached to the lower surfaces of the air supply chambers 61, 62, and 63, respectively.
[0082]
As shown in FIG. 28, an air conditioner 67 is installed outside or behind the processing system 1, and air is introduced from the air conditioner 67 through the pipe 68 into the air supply chambers 61, 62, 63. Air that is cleaner than the ULPA filters 64, 65, and 66 in the air supply chamber is supplied to each of the units 10, 11, and 12 by downflow. The downflow air is collected at the bottom exhaust port 70 through a plurality of ventilation holes 69 provided at appropriate locations below the system, and is collected from the exhaust port 70 through the pipe 71 to the air conditioner 67. It has become so.
[0083]
In the processing station 11, the first and second sets G1. A ULPA filter 72 is provided on the ceiling surface of the resist coating units (COT) and (COT) arranged in the lower stage of the G2 multi-stage unit, and the air from the air conditioner 67 is branched from the pipe 68. It is sent to the ULPA filter 72 through 73. A temperature / humidity adjuster (not shown) is provided in the middle of the pipe 73 so that clean air having a predetermined temperature and humidity suitable for the resist coating process is supplied to the resist coating units (COT) and (COT). It has become. A temperature / humidity sensor 74 is provided in the vicinity of the blow-out side of the ULPA filter 72, and the sensor output is given to the controller of the temperature / humidity adjuster so that the temperature and humidity of the clean air can be accurately measured by a feedback system To be controlled.
[0084]
In FIG. 27, an opening DR through which a wafer W and a transfer arm enter and exit is provided on a side wall facing the main wafer transfer mechanism 22 of each spinner type processing unit (COT), (DEV). A shutter (not shown) is attached to each opening DR in order to prevent particles and the like from each unit from entering the main arm mechanism 22 side.
[0085]
The air supply amount and the exhaust amount to the transfer chamber 31 are controlled by the air conditioner 67, and the internal pressure of the transfer chamber 31 is set higher than the internal pressure of the clean room and higher than the internal pressure of the cassette CR. As a result, an air flow from the clean room or cassette CR to the transfer chamber 31 is not formed, and as a result, particles do not enter the transfer chamber 31. Further, the internal pressure of the process station 11 is set higher than the internal pressure of the transfer chamber 31. As a result, an air flow from the transfer chamber 31 toward the process station 11 is not formed, and as a result, particles do not enter the process station 11.
[0086]
Next, the operation of the lid removing mechanism 247 will be described with reference to FIGS. The lid removing mechanism 247 is controlled in operation by a controller 59 as shown in FIG.
[0087]
29 to 33 are views showing a series of operations of the cassette lid removing mechanism according to the second embodiment of the present invention.
[0088]
As shown in FIG. 29, when the shutter 34 is opened and the cassette CR is placed on the cassette placement table 20, the lid transfer member 248 is advanced toward the passage 33 by the Y-axis direction drive mechanism 256. As shown in FIG. 30, the key 249 of the lid transfer member 248 is inserted into the key hole 45 of the lid 44, and is locked with the internal locking mechanism. Then, the key 249 is rotated by θ ′, and the lock between the lid 44 and the cassette CR is released. Accordingly, the lid 44 can be detached from the cassette CR.
[0089]
Next, as shown in FIG. 31, the lid transfer member 248 is moved backward in the Y-axis direction together with the lid 44, and the lid 44 is carried into the transfer chamber 31 through the passage 33. Further, as shown in FIG. 32, the lid transfer member 248 is lowered together with the lid 44 to the front of the storage portion 246 by the Z-axis direction drive mechanism 251. Next, as shown in FIG. 33, the lid transfer member 248 is advanced in the Y-axis direction, and the lid 44 is accommodated in the accommodating portion 246.
[0090]
Thereafter, the wafer W is taken out from the cassette CR by the sub arm mechanism 21 and further transferred to the process station 11. Then, after processing the wafer W in each processing unit, the wafer W is returned to the cassette CR again. When the processing of all the wafers W in the cassette CR is completed, the lid 44 is transferred from the storage unit 246 to the passage 33, and this is put on the opening of the cassette CR, and the lid 44 is locked to the cassette CR. Unload outside.
[0091]
In the processing system 1 described above, the flow of the downflow cleaning air is not disturbed in the transfer chamber 31 by the opening / closing transfer operation of removing the lid 44 from the cassette CR.
[0092]
Further, since the lid 44 is accommodated in the accommodating portion 246, the lid 44 itself does not disturb the downflow of the clean air in the transfer chamber 31, and manufacturing defects caused by particles can be suppressed as much as possible.
[0093]
Next, a third embodiment of the present invention will be described with reference to FIGS.
[0094]
FIG. 34 is a partially transparent sectional view showing a cassette lid removing mechanism by cutting out a part of the cassette station according to the present embodiment.
FIG. 35 is a perspective view showing a cassette lid removing mechanism according to this embodiment.
As shown in FIGS. 34 and 35, in the apparatus according to the third embodiment, when the lid 44 is removed from the cassette CR, the lid 44 is reversed around the horizontal support shaft 384 by the rotation mechanism 382 to be stored in the storage portion 346. The lid 44 is accommodated. The rotation mechanism 382 includes a U-shaped arm member 381, a key 349, a horizontal support shaft 384, a θ ′ rotation motor (not shown), and a θ ″ rotation motor (not shown). The key 349 is attached to one end of the U arm member 381. The θ ′ rotation motor is for rotating the key 349 by θ ′. This is for rotating the character arm member 381 by θ ″.
[0095]
FIG. 36 is a cross-sectional view showing the lock key of the cassette lid removing mechanism according to this embodiment.
[0096]
As shown in FIG. 36, the key 349 is rotatably provided in the hollow arm member 381. When the key 349 is inserted into the keyhole 45, the lock piece 3
As shown in FIG. 36, the key 349 is rotatably provided in the hollow arm member 381. When the key 349 is inserted into the key hole 45, the lock piece 350 is fitted into the key groove. When the key 349 is rotated by θ ′, the lock between the lid 44 and the cassette CR is released, and the lid 44 can be detached from the cassette CR. Next, when the horizontal support shaft 384 is rotated by θ ″, the lid 44 is inverted and accommodated in the accommodating portion 346. Thus, in the apparatus of the third embodiment, the lid 44 is accommodated by a simpler mechanism. It becomes possible to do.
[0097]
Moreover, although the above-described embodiment relates to a resist coating and developing processing system used in a photolithography process for manufacturing a semiconductor device, the present invention can also be applied to other processing systems, and a substrate to be processed is also a semiconductor. The substrate is not limited to a wafer, and may be an LCD substrate, a glass substrate, a CD substrate, a photomask, a printed substrate, a ceramic substrate, or the like.
[0098]
According to the present invention, the flow of the cleaning air in the down mouth is not disturbed by opening and closing the lid at the opening of the cassette, and manufacturing defects caused by particles can be suppressed as much as possible.
[0099]
Further, according to the present invention, the flow of the down-flow cleaning air in the transfer chamber is not disturbed by opening and closing the lid at the opening of the cassette, and particles on the transfer chamber and the substrate in the processing chamber are not disturbed. Adhesion can be prevented and manufacturing defects caused by particles can be suppressed as much as possible.
[0100]
Furthermore, according to the present invention, particles do not flow out from the inside of the cassette to the apparatus side.
[0101]
Further, according to the present invention, particles do not flow out from the clean room or inside the cassette to the apparatus side.
[0102]
Further, according to the present invention, particles do not flow out from the transfer chamber to the processing chamber.
[0103]
【The invention's effect】
As described above in detail, according to the present invention, the downflow of the cleaning air is not disturbed in the cassette station, and particles do not adhere to the substrate, or particles do not flow into the process station measurement from the cassette station side. .
[Brief description of the drawings]
FIG. 1 is an overall plan view showing a coating and developing treatment system according to an embodiment of the present invention.
FIG. 2 is a front view of a coating and developing treatment system according to an embodiment of the present invention.
FIG. 3 is a rear view of the coating and developing treatment system according to the embodiment of the present invention.
FIG. 4 is a partial perspective sectional view showing a cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 5 is a perspective view showing the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 6 is an enlarged vertical sectional view of the periphery of the mounting table 20 on which a cassette is set.
FIG. 7 is a view showing the operation of the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 8 is a view showing the operation of the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 9 is a view showing the operation of the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 10 is a diagram showing an operation of the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 11 is a diagram showing an operation of the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 12 is a view showing the operation of the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 13 is a view showing the operation of the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 14 is a view showing the operation of the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 15 is a view showing the operation of the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 16 is a view showing the operation of the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 17 is a view showing the operation of the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 18 is a view showing the operation of the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 19 is a view showing the operation of the cassette lid removing mechanism according to the first embodiment of the present invention.
FIG. 20 is a plan view showing a state in which the wafer protruding from the cassette and the sub-arm mapping sensor interfere with each other.
FIG. 21 is a partial perspective sectional view showing a cassette lid removing mechanism according to a second embodiment of the present invention.
FIG. 22 is an exploded perspective view showing a cassette and a lid according to a second embodiment of the present invention.
FIG. 23 is a perspective view showing a cassette lid removing mechanism and a cassette lid according to the second embodiment of the present invention.
FIG. 24 is a plan view showing a cassette lid removing mechanism according to a second embodiment of the present invention.
FIG. 25 is an exploded perspective view showing a cassette lid removing mechanism according to a second embodiment of the present invention.
FIG. 26 is a cross-sectional view showing a lock key of the cassette lid removal mechanism according to the first and second embodiments of the present invention.
FIG. 27 is an internal perspective view showing the flow of clean air in the substrate processing apparatus according to the embodiment of the present invention.
FIG. 28 is an internal perspective view showing a flow of clean air in the substrate processing apparatus according to the embodiment of the present invention.
FIG. 29 is a diagram showing an operation of a cassette lid removing mechanism according to a second embodiment of the present invention.
FIG. 30 is a view showing the operation of the cassette lid removing mechanism according to the second embodiment of the present invention.
FIG. 31 is a view showing an operation of a cassette lid removing mechanism according to a second embodiment of the present invention.
FIG. 32 is a view showing the operation of the cassette lid removing mechanism according to the second embodiment of the present invention.
FIG. 33 is a view showing the operation of the cassette lid removing mechanism according to the second embodiment of the present invention.
FIG. 34 is a partially transparent sectional view showing a cassette lid removing mechanism of a third embodiment by cutting out a part of the cassette station according to the embodiment of the present invention.
FIG. 35 is a perspective view showing a cassette lid removing mechanism according to a third embodiment of the present invention.
FIG. 36 is a cross-sectional view showing a lock key of a cassette lid removing mechanism according to a third embodiment of the present invention.
FIG. 37 is an internal perspective view schematically showing a cassette station of a conventional apparatus.
[Explanation of symbols]
W ... wafer, 43 ... opening, 44 ... cassette lid, CR ... cassette, 20 ... cassette mounting table, 11 ... processing station, 21 ... sub-arm mechanism, 32, 35 ... partition plate, 33a …… Passage, 82 …… Cassette moving mechanism, 82a …… Y axis cylinder, 47 …… Cover removal mechanism, 57,58 …… Optical sensor, 59 …… Controller, 50 …… Key, 49 …… Shutter plate, 45... Keyhole, 40... Θ rotation drive mechanism, 33 b and 246... Lid storage section, 33 and 36.

Claims (2)

An opening for inserting and removing a plurality of objects to be processed is formed, and a cassette mounting table on which a cassette having a lid provided with a plurality of keyholes is detachably attached to the opening.
A transfer chamber having a first delivery window for delivering an object to be processed from the cassette;
A conveying means provided in the conveying chamber, for taking in and out the object to be processed from the cassette through the first delivery window;
It is provided in the transfer chamber, holds the lid through the first delivery window, horizontally moves the held lid to the transfer means side, removes it from the cassette, and then transfers it downward. A lid transfer mechanism that horizontally moves the lid toward the cassette and stores the lid in a storage unit;
Arranged adjacent to the transfer chamber, and having a second transfer window for transferring the object to be processed by the transfer means to and from the transfer chamber, the transfer chamber was transferred through the second transfer window. A processing chamber for processing an object to be processed;
Equipped with,
When the lid transfer mechanism is inserted into the keyhole and rotated, the lid is released from the cassette and the lid is fixed to the lid transfer mechanism, and a θ rotation mechanism that rotates the plurality of keys around an axis. processing apparatus characterized by having a. The processing apparatus according to claim 1,
The processing apparatus , wherein the storage portion is provided below the first delivery window .

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