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JP4075136B2 - Single crystal growth equipment - Google Patents
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JP4075136B2 - Single crystal growth equipment - Google Patents

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Publication number
JP4075136B2
JP4075136B2 JP15165998A JP15165998A JP4075136B2 JP 4075136 B2 JP4075136 B2 JP 4075136B2 JP 15165998 A JP15165998 A JP 15165998A JP 15165998 A JP15165998 A JP 15165998A JP 4075136 B2 JP4075136 B2 JP 4075136B2
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Japan
Prior art keywords
crucible
single crystal
shielding member
heat shielding
raw material
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JP15165998A
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JPH11343196A (en
Inventor
建 濱田
靖則 前田
房雄 田端
博之 田辺
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Sumco Corp
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Sumco Corp
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Description

【0001】
【発明の属する技術分野】
本発明は、半導体デバイスに使用されるシリコンウエーハ等の製造に用いられる単結晶育成装置に関し、更に詳しくは、CZ法を用いた結晶引き上げによる単結晶育成装置に関する。
【0002】
【従来の技術】
CZ法によるシリコン単結晶の育成では、図4に示すように、チャンバー11内の中心部に坩堝12を配置し、坩堝12内に装填された塊状の多結晶シリコンを、坩堝12の周囲に配置されたヒータ14により減圧下で溶解することにより、坩堝12内に原料融液40を形成する。そして、引き上げ軸の下端に取り付けた種結晶を原料融液40に漬け、これを回転させながら引き上げることにより、種結晶の下に単結晶を育成する。
【0003】
このようなCZ法によるシリコン単結晶の育成では、単結晶の引き上げ速度を上げるために、コーンと呼ばれる逆錐筒状の熱遮蔽部材20を坩堝12の上方に配設するのが最近の傾向である。この熱遮蔽部材20は、坩堝12内の原料融液40から引き上げられる単結晶を包囲し、原料融液40からの輻射熱とヒータ14からの輻射熱を遮蔽して単結晶の冷却を促進することにより、単結晶の引き上げ速度を増大させることが可能である。
【0004】
シリコン単結晶の育成では又、単結晶の比抵抗を調整するために、各種のドープ剤(ドーパント)が使用される。代表的なドープ剤はリン、ボロン、アンチモンなどである。これらのドープ剤のうちリン、ボロンは、坩堝内に原料融液を形成する前、即ちヒータによる原料溶解の前に、塊状の多結晶シリコンと共に坩堝内に投入され、ヒータによる加熱で多結晶シリコンと共に溶解される。これにより、所定量のドープ剤を含んだ原料融液が坩堝内に形成される。
【0005】
これに対し、アンチモンはリン、ボロンと比べると融点が低く、減圧下では蒸発速度が非常に速くなるため、リン、ボロンと同様に多結晶シリコンとの同時溶解を行うと多量に蒸発する。このため、坩堝内で多結晶シリコンを溶解した後、その融液にドープ剤を添加するという手順が踏まれる。そして、熱遮蔽部材20を備えた単結晶育成装置では、このアンチモンは、熱遮蔽部材20の外側に設けられたドープ供給管30により、熱遮蔽部材20の外側を通って坩堝12内の原料融液40に投入されることが、例えば特開平4−21585号公報に記載されている。
【0006】
【発明が解決しようとする課題】
しかしながら、熱遮蔽部材20の外側を通って坩堝12内の原料融液40にアンチモンを添加する場合には、坩堝12内に予め原料融液40が形成されているとは言え、ヒータ14からの輻射熱、更には坩堝12内に形成されたシリコンの原料融液40からの輻射熱により、アンチモンが投入中に高温に加熱され、原料融液40に到達する以前に多くが蒸発するという問題がある。この問題のため、投入量に比して融液中のアンチモン濃度が低くなり、所定濃度を確保しようとすると、多量のアンチモンを余分に投入することが必要となる。
【0007】
そこで本発明者らは、図5に示すように、熱遮蔽部材20の内側を通って坩堝12内の原料融液40にアンチモンを添加する実験を行った。その結果、投入中のアンチモンが熱遮蔽部材20によって周囲の輻射熱から効果的に遮蔽され、その蒸発が抑制されることが判明したが、その一方ではアンチモンを添加した後の、原料融液40からの単結晶引き上げでは、その単結晶に有転位化が多発することが明らかとなった。
【0008】
熱遮蔽部材20の内側を通ってアンチモンを投入した場合に有転位化が多発する理由は、後で詳しく述べるが、その投入に伴う原料融液40のハネが熱遮蔽部材20の内面に粒状に付着し、これが後で原料融液40に落下して単結晶に取り込まれることにある。
【0009】
本発明の目的は、アンチモンのような蒸発が顕著なドープ剤を原料融液に添加する場合に、そのドープ剤の蒸発を効果的に抑え、合わせてドープ剤の添加に起因する有転位化を防ぐことができる単結晶育成装置を提供することにある。
【0010】
【課題を解決するための手段】
上記目的を達成するために、本発明者らは、熱遮蔽部材を備えた単結晶育成装置で、その部材内側を通って坩堝内の原料融液にアンチモンを添加する場合の功罪について、詳細な調査を行った。その結果、以下のことが判明し、また確認された。
【0011】
アンチモンのような蒸発が顕著なドープ剤を坩堝内の原料融液に添加する場合、熱遮蔽部材の外側を通すと、その蒸発が顕著となる。この蒸発を抑制するためには、熱遮蔽部材の内側を通すことが有効であり、不可欠である。しかし、熱遮蔽部材の内側を通すと、有転位化が多発する。その原因は、図5に示すように、ドープ剤を投入することによる原料融液40のハネ41が熱遮蔽部材20の内面に付着して粒状のまま凝固し、この粒がその後の単結晶育成中に原料融液の液面に落下して単結晶中に取り込まれることにある。
【0012】
このハネは、熱遮蔽部材の外側を通ってドープ剤を投入する場合にも当然生じる。しかし、この場合は、ハネが熱遮蔽部材の外面に付着する。外面側の雰囲気温度は内面側より高温のため、外面に付着したハネは、その外面で薄く広がり、ベットリと付着した状態で凝固する。このような状態で凝固したハネは外面から剥離し難い。このため、その後の単結晶育成中も落下を生じず、仮に落下しても液状のため有転位化の原因にはならない。
【0013】
これに対し、熱遮蔽部材の内面に付着したハネは、内面側の雰囲気温度が低いために、付着後、粒状のまま凝固する。このため、熱遮蔽部材の内面から剥離しやすくなり、剥離して原料融液の液面に落下したものは固体のまま単結晶中に取り込まれて有転位化の原因となる。これが、熱遮蔽部材の内側を通してドープ剤を添加した場合に有転位化が多発する原因である。実際、ハネに起因する有転位化は、ドープ剤の添加から間のない引き上げ初期に多発する傾向がある。
【0014】
これらの検討結果を踏まえて、本発明者らは、熱遮蔽部材の内側を通って途中までドープ剤を投下し、そのドープ剤を途中から熱遮蔽部材の外側へ導出して原料融液に投入することを試みた。その結果、アンチモンと言えども蒸発が効果的に抑制され、しかも、ハネによる有転位化が防止されることが判明した。
【0015】
本発明の単結晶育成装置は、かかる知見に基づいて開発されたものであり、坩堝の外側に配置されたヒータによって坩堝内に原料融液を形成し、その原料融液からCZ法によって単結晶を引き上げる育成装置本体と、ヒータ及び原料融液からの輻射熱を遮蔽するために坩堝の上方に単結晶を包囲するように配設された筒状の熱遮蔽部材と、坩堝内の原料融液にドープ剤としてアンチモンまたは砒素を添加するために熱遮蔽部材の内側に配設され、且つ熱遮蔽部材の中段位置より下方で前記ドープ剤が熱遮蔽部材の外側へ導出されて坩堝内の原料融液に投入されるように、少なくとも下端部を熱遮蔽部材の外側に臨ませて配設されたドープ供給管とを具備することを構成上の特徴点としている。
【0016】
【発明の実施の形態】
以下に本発明の実施形態を図面に基づいて説明する。図1は本発明の実施形態に係る単結晶育成装置の縦断面図である。
【0017】
本単結晶育成装置は、CZ法によって単結晶を引き上げる育成装置本体10と、引き上げ速度を上げるために育成装置本体10の内部に設けられた熱遮蔽部材20と、ドープ剤を添加するために育成装置本体10の内部に設けられたドープ供給管30とを備えている。
【0018】
育成装置本体10は、円筒形状のメインチャンバー11を備えている。メインチャンバー11は、円筒部11a、円筒部11aを載置する底板部11b(図5参照)、及び円筒部11a上に載置される天板部11cを組み合わせた構造になっている。天板部11cの上には、図示されないプルチャンバーが載置される。プルチャンバーは引き上げ軸やその回転昇降機構等を有している。
【0019】
メインチャンバー11内には、その中心部に位置して坩堝12が配置されている。坩堝12は内側の石英坩堝12aと外側の黒鉛坩堝12bを組み合わせた二重構造になっている。この坩堝12は、メインチャンバー11の底板部11bを貫通するペディスタル13の上に支持されている。ペディスタル13は、坩堝12の回転及び昇降を行うために周方向及び軸方向に駆動される。
【0020】
坩堝12の外側にはヒータ14が配置されており、そのヒータ14の外側には断熱材15がメインチャンバー11の円筒部11a内面に沿って配置されている。また、メインチャンバー11の底板部11b上にも同様の断熱材16が配置されている。
【0021】
熱遮蔽部材20は坩堝12の上方に同心状に配置された、コーンと呼ばれる円筒体である。この円筒体は下方に向かって徐々に縮径した逆台錐形で、メインチャンバー11の天板部11cに取り付けられている。
【0022】
ドープ供給管30は、熱遮蔽部材20の内面にその傾斜に沿って取り付けられた漏斗管である。その下端部は、熱遮蔽部材20の下部を貫通して熱遮蔽部材20の外側に臨んでいる。また、ドープ供給管30の上端部は、メインチャンバー11の外側に設けられたドープ剤添加用の治具31と接続されている。この治具31としては、例えば特開平9−227275号公報に記載されているドープ剤添加装置を使用することかできる。
【0023】
次に、本単結晶育成装置を使用して、アンチモンがドープされたシリコン単結晶を製造する場合の手順について説明する。
【0024】
坩堝12内に塊状の多結晶シリコンを充填する。メインチャンバー11内を所定の真空度に排気する。ヒータ13により坩堝12内の多結晶シリコンを溶解し、坩堝12内にシリコン融液40を形成する。
【0025】
坩堝12内にシリコン融液40が形成されると、メインチャンバー11の外側に設けられたドープ剤添加装置により、所定量のアンチモンをドープ供給管30に投入する。ここで、ドープ供給管30は基本的に熱遮蔽部材20の内側に配設されており、その下端部のみが熱遮蔽部材20の下部を貫通して熱遮蔽部材20の外側に臨んでいる。このため、ドープ供給管30に導入されたアンチモンは、熱遮蔽部材20の下部レベルに達するまでは熱遮蔽部材20の内側を通り、その後は熱遮蔽部材20の外側に導出されて、その外側で坩堝12内のシリコン融液40に投入される。
【0026】
熱遮蔽部材20の内側は外側より低温であるので、ドープ供給管30内を通過するアンチモンの蒸発が抑制される。最終的には、熱遮蔽部材20の外側でシリコン融液40へのアンチモン投入が行われるので、その投入に伴うハネは熱遮蔽部材20の外面に付着する。しかし、そのハネは、熱遮蔽部材20の外面で薄く広がりベッタリと付着した状態で凝固するので、落下し難く、有転位化の原因にはならない。
【0027】
このようにしてアンチモンの投入が行われることにより、坩堝12内には、アンチモンが所定濃度にドープされたシリコン融液40が形成される。
【0028】
シリコン融液40の形成が終わると、引き上げ軸の下端に装着された種結晶をシリコン融液40に漬け、この状態から引き上げ軸を回転させながら引き上げる。これにより、種結晶の下方に、アンチモンがドープされたシリコン単結晶が育成される。育成結晶は熱遮蔽部材20の内側を通り、プルチャンバー内に引き込まれる。このとき、坩堝12は逆方向に回転する。また、単結晶の引き上げに伴う坩堝12内の液面低下を相殺するべく上昇する。
【0029】
アンチモン投入後の単結晶育成では、熱遮蔽部材20からのハネの落下がなく、有転位化が防止される。
【0030】
【実施例】
次に、本発明の実施例を示し、比較例と対比することにより、本発明の効果を明らかにする。
【0031】
本発明の実施例として、図1に示された単結晶育成装置を使用して、アンチモンがドープされたシリコン単結晶を育成した。坩堝の内径は石英坩堝の内径で16インチとした。多結晶シリコンの充填量は35kg、アンチモンの投入量は300gとした。育成結晶の直径は5インチ、結晶方位は<100>である。
【0032】
比較例1として、図4に示された単結晶育成装置を使用し、坩堝内のシリコン融液にアンチモンを投入する際に、その投入を熱遮蔽部材の外側で行った。それ以外は実施例と同じである。
【0033】
比較例2として、図5に示された単結晶育成装置を使用し、坩堝内のシリコン融液にアンチモンを投入する際に、その投入を熱遮蔽部材の内側で行った。それ以外は実施例と同じである。
【0034】
それぞれの場合につき引き上げを40回実施した。引き上げ歩留りを、実施例及び比較例2の場合について調査した。その結果を図2に示す。また、全長引き上げが可能であった単結晶の比抵抗を、実施例及び比較例1の場合について調査した。その結果を図3に示す。
【0035】
図2及び図3から分かるように、本発明の実施例では、全長引き上げが可能な操業回数は全操業回数の50%を超え、全長引き上げに近い操業を加えると70%近くに達する。育成結晶の比抵抗は300gのアンチモン使用で約0.014Ω・cmを得た。
【0036】
これに対し、坩堝内のシリコン融液にアンチモンを投入する際に、その投入を熱遮蔽部材の外側で行った比較例1では、引き上げ歩留りは本発明の実施例と同程度であったが、育成結晶の比抵抗は、300gのアンチモン使用では約0.0155Ω・cmまでしか低下しなかった。これは、使用されたアンチモンの多くが融液に投入されるまでの間に蒸発し、融液のドープ剤濃度上昇に有効に寄与しなかったことを意味する。
【0037】
ちなみに、本発明の実施例と同じ0.014Ω・cmレベルまで比抵抗を下げるためには約360gのアンチモンが必要となり、その使用量は本発明の実施例の1.2倍になる。
【0038】
一方、アンチモン投入を熱遮蔽部材の内側で行った比較例2では、比抵抗、即ちアンチモンの必要量は本発明の実施例と同じであった。しかし、引き上げ初期に有転位化が多発し、全長引き上げが可能な操業は全操業回数の20%に過ぎなかった。これは、アンチモンの投入に伴うハネが有転位化の原因につながったためである。
【0039】
このように、本発明の実施例では、使用したドープ剤が有効に活用され、且つドープ剤の添加に伴う有転位化が防止される。
【0040】
なお、上述の例ではドープ剤としてアンチモンを使用したが、アンチモン以外の蒸発が顕著なドープ剤、例えば砒素(As)等の添加にも本発明は有効である。
【0041】
本発明でのドープ剤の投下経路、即ちドープ供給管の配設経路は、上述の例では熱遮蔽部材の下部でドープ剤を熱遮蔽部材の内側から外側へ導出するものとなっているが、ドープ剤の種類や雰囲気温度等によっては熱遮蔽部材の中段部でこの導出を行ってもよく、更には熱遮蔽部材の下方を迂回して投入を行うことも可能である。
【0042】
【発明の効果】
以上の説明から明らかなように、本発明の単結晶育成装置は、坩堝内に形成された原料融液にドープ剤を投入する際に、途中まで熱遮蔽部材の内側を通すように構成されているので、投入途中におけるドープ剤の蒸発を抑え、その使用量を低減することができる。また、最終的には熱遮蔽部材の外側で原料融液への投入を行うように構成されているので、その投入に伴う有転位化を防止することができ、ドープ剤の節減と合わせて、単結晶の育成コストを大幅に低減することができる。
【図面の簡単な説明】
【図1】本発明の実施形態に係る単結晶育成装置の縦断面図である。
【図2】本発明の効果を引き上げ歩留りにより示すグラフである。
【図3】本発明の効果を単結晶の比抵抗により示すグラフである。
【図4】従来の単結晶育成装置の縦断面図である。
【図5】比較例として挙げた単結晶育成装置の縦断面図である。
【符号の説明】
10 育成装置本体
11 メインチャンバー
12 坩堝
13 ペディスタル
14 ヒータ
15,16 断熱材
20 熱遮蔽部材
30 ドープ供給管
40 シリコン融液(原料融液)
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a single crystal growing apparatus used for manufacturing a silicon wafer or the like used for a semiconductor device, and more particularly to a single crystal growing apparatus by crystal pulling using a CZ method.
[0002]
[Prior art]
In the growth of a silicon single crystal by the CZ method, as shown in FIG. 4, a crucible 12 is arranged in the center of the chamber 11, and massive polycrystalline silicon loaded in the crucible 12 is arranged around the crucible 12. The raw material melt 40 is formed in the crucible 12 by melting under reduced pressure by the heater 14. Then, the seed crystal attached to the lower end of the pulling shaft is immersed in the raw material melt 40, and the single crystal is grown under the seed crystal by pulling it up while rotating.
[0003]
In the growth of a silicon single crystal by such a CZ method, in order to increase the pulling rate of the single crystal, it is a recent trend that an inverted conical cylindrical heat shielding member 20 called a cone is disposed above the crucible 12. is there. The heat shielding member 20 surrounds the single crystal pulled up from the raw material melt 40 in the crucible 12 and shields the radiant heat from the raw material melt 40 and the radiant heat from the heater 14 to promote cooling of the single crystal. It is possible to increase the pulling rate of the single crystal.
[0004]
In the growth of a silicon single crystal, various dopants (dopants) are used to adjust the specific resistance of the single crystal. Typical dopants are phosphorus, boron, antimony and the like. Among these dopants, phosphorus and boron are introduced into the crucible together with the bulk polycrystalline silicon before the raw material melt is formed in the crucible, that is, before the raw material is melted by the heater, and the polycrystalline silicon is heated by the heater. Dissolved together. Thereby, a raw material melt containing a predetermined amount of the dopant is formed in the crucible.
[0005]
On the other hand, antimony has a lower melting point than phosphorus and boron, and the evaporation rate becomes very high under reduced pressure. Therefore, when simultaneous dissolution with polycrystalline silicon is performed in the same manner as phosphorus and boron, a large amount of antimony is evaporated. For this reason, the procedure of adding a dopant to the melt after melting polycrystalline silicon in the crucible is followed. In the single crystal growth apparatus provided with the heat shielding member 20, the antimony is melted in the crucible 12 through the outside of the heat shielding member 20 by the dope supply pipe 30 provided outside the heat shielding member 20. The introduction into the liquid 40 is described in, for example, JP-A-4-21585.
[0006]
[Problems to be solved by the invention]
However, when antimony is added to the raw material melt 40 in the crucible 12 through the outside of the heat shielding member 20, the raw material melt 40 is formed in the crucible 12 in advance. There is a problem that antimony is heated to a high temperature during charging due to radiant heat and further radiant heat from the silicon raw material melt 40 formed in the crucible 12, and much of the antimony evaporates before reaching the raw material melt 40. Because of this problem, the concentration of antimony in the melt is lower than the amount charged, and it is necessary to add a large amount of antimony in an attempt to secure a predetermined concentration.
[0007]
Therefore, the inventors conducted an experiment in which antimony was added to the raw material melt 40 in the crucible 12 through the inside of the heat shielding member 20, as shown in FIG. As a result, it has been found that the antimony being charged is effectively shielded from the surrounding radiant heat by the heat shielding member 20, and its evaporation is suppressed. On the other hand, from the raw material melt 40 after the addition of antimony It has been clarified that the single crystal pulling frequently causes dislocations in the single crystal.
[0008]
The reason why dislocations frequently occur when antimony is introduced through the inside of the heat shielding member 20 will be described in detail later. The splash of the raw material melt 40 accompanying the introduction is granular on the inner surface of the heat shielding member 20. It adheres and this falls into the raw material melt 40 later and is taken in by the single crystal.
[0009]
The object of the present invention is to effectively suppress evaporation of the dopant when adding a highly evaporated dopant such as antimony to the raw material melt, and to reduce dislocation caused by the addition of the dopant. An object of the present invention is to provide an apparatus for growing a single crystal that can be prevented.
[0010]
[Means for Solving the Problems]
In order to achieve the above-mentioned object, the present inventors have detailed the merit in the case of adding antimony to the raw material melt in the crucible through the inside of the single crystal growing apparatus provided with the heat shielding member. We conducted a survey. As a result, the following was found and confirmed.
[0011]
In the case where a dopant such as antimony that is highly evaporated is added to the raw material melt in the crucible, the evaporation becomes remarkable when it passes through the outside of the heat shielding member. In order to suppress this evaporation, it is effective and indispensable to pass the inside of the heat shielding member. However, when passing through the inside of the heat shielding member, dislocation occurs frequently. As shown in FIG. 5, the cause is that the honey 41 of the raw material melt 40 resulting from the introduction of the dopant adheres to the inner surface of the heat shielding member 20 and solidifies in the form of particles, and the grains grow thereafter as a single crystal. It falls into the liquid surface of the raw material melt and is taken into the single crystal.
[0012]
Naturally, this splash also occurs when the dopant is introduced through the outside of the heat shielding member. However, in this case, the honey adheres to the outer surface of the heat shielding member. Since the ambient temperature on the outer surface side is higher than that on the inner surface side, the honey adhering to the outer surface spreads thinly on the outer surface and solidifies in a state where it adheres firmly. The honey solidified in such a state is difficult to peel off from the outer surface. For this reason, no fall occurs during subsequent single crystal growth, and even if dropped, it does not cause dislocation because it is liquid.
[0013]
On the other hand, since the adhering to the inner surface of the heat shielding member has a low atmospheric temperature on the inner surface side, it solidifies in a granular form after adhering. For this reason, it becomes easy to peel from the inner surface of the heat shielding member, and the material that has peeled and dropped onto the surface of the raw material melt is taken into the single crystal as a solid and causes dislocation. This is a cause of frequent occurrence of dislocation when the dopant is added through the inside of the heat shielding member. In fact, the dislocations caused by honey tend to occur frequently at the initial stage of pulling up shortly after the addition of the dopant.
[0014]
Based on these examination results, the present inventors dropped the dope agent halfway through the inside of the heat shielding member, led the dope agent to the outside of the heat shield member from the middle, and put it into the raw material melt Tried to do. As a result, it was found that even with antimony, evaporation is effectively suppressed, and dislocations caused by honey are prevented.
[0015]
The single crystal growing apparatus of the present invention has been developed based on such knowledge. A raw material melt is formed in the crucible by a heater arranged outside the crucible, and the single crystal is formed from the raw material melt by the CZ method. A heating apparatus body for pulling up, a cylindrical heat shield member disposed so as to surround the single crystal above the crucible to shield the radiant heat from the heater and the raw material melt, and the raw material melt in the crucible disposed inside the heat shielding member to the addition of antimony or arsenic as a dopant, and the raw material melt in the crucible the dopant in below the middle position is derived to the outside of the heat shield member of the heat shield member And a dope supply pipe disposed with at least the lower end facing the outside of the heat shielding member.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view of a single crystal growing apparatus according to an embodiment of the present invention.
[0017]
This single crystal growth apparatus is a growth apparatus main body 10 for pulling up a single crystal by the CZ method, a heat shielding member 20 provided in the growth apparatus main body 10 for increasing the pulling speed, and a growth for adding a dopant. And a dope supply pipe 30 provided inside the apparatus main body 10.
[0018]
The growth apparatus main body 10 includes a cylindrical main chamber 11. The main chamber 11 has a structure in which a cylindrical portion 11a, a bottom plate portion 11b (see FIG. 5) on which the cylindrical portion 11a is placed, and a top plate portion 11c placed on the cylindrical portion 11a are combined. A pull chamber (not shown) is placed on the top plate portion 11c. The pull chamber has a pulling shaft, a rotating lift mechanism and the like.
[0019]
In the main chamber 11, a crucible 12 is disposed at the center thereof. The crucible 12 has a double structure in which an inner quartz crucible 12a and an outer graphite crucible 12b are combined. The crucible 12 is supported on a pedestal 13 that penetrates the bottom plate portion 11 b of the main chamber 11. The pedestal 13 is driven in the circumferential direction and the axial direction in order to rotate and lift the crucible 12.
[0020]
A heater 14 is disposed outside the crucible 12, and a heat insulating material 15 is disposed outside the heater 14 along the inner surface of the cylindrical portion 11 a of the main chamber 11. A similar heat insulating material 16 is also disposed on the bottom plate portion 11 b of the main chamber 11.
[0021]
The heat shielding member 20 is a cylindrical body called a cone disposed concentrically above the crucible 12. The cylindrical body has an inverted trapezoidal shape with a diameter gradually reduced downward, and is attached to the top plate portion 11 c of the main chamber 11.
[0022]
The dope supply pipe 30 is a funnel pipe attached to the inner surface of the heat shielding member 20 along its inclination. The lower end portion passes through the lower part of the heat shielding member 20 and faces the outside of the heat shielding member 20. The upper end portion of the dope supply pipe 30 is connected to a dope additive addition jig 31 provided outside the main chamber 11. As the jig 31, for example, a dopant adding device described in JP-A-9-227275 can be used.
[0023]
Next, a procedure for manufacturing a silicon single crystal doped with antimony using the present single crystal growing apparatus will be described.
[0024]
The crucible 12 is filled with massive polycrystalline silicon. The main chamber 11 is evacuated to a predetermined degree of vacuum. Polycrystalline silicon in the crucible 12 is melted by the heater 13 to form a silicon melt 40 in the crucible 12.
[0025]
When the silicon melt 40 is formed in the crucible 12, a predetermined amount of antimony is introduced into the dope supply pipe 30 by a dopant addition device provided outside the main chamber 11. Here, the dope supply pipe 30 is basically disposed inside the heat shielding member 20, and only the lower end thereof penetrates the lower part of the heat shielding member 20 and faces the outside of the heat shielding member 20. For this reason, the antimony introduced into the dope supply pipe 30 passes through the inside of the heat shielding member 20 until reaching the lower level of the heat shielding member 20, and thereafter, is led out to the outside of the heat shielding member 20 and on the outside thereof. The silicon melt 40 in the crucible 12 is charged.
[0026]
Since the inner side of the heat shielding member 20 is cooler than the outer side, evaporation of antimony passing through the dope supply pipe 30 is suppressed. Eventually, since antimony is charged into the silicon melt 40 outside the heat shielding member 20, the splash accompanying the charging adheres to the outer surface of the heat shielding member 20. However, since the flakes are thinly spread on the outer surface of the heat shielding member 20 and solidify in a tightly attached state, they do not fall easily and do not cause dislocation.
[0027]
By introducing antimony in this way, a silicon melt 40 doped with antimony at a predetermined concentration is formed in the crucible 12.
[0028]
When the formation of the silicon melt 40 is completed, the seed crystal attached to the lower end of the pulling shaft is immersed in the silicon melt 40, and the pulling shaft is pulled up from this state while rotating the pulling shaft. Thereby, a silicon single crystal doped with antimony is grown below the seed crystal. The grown crystal passes through the inside of the heat shielding member 20 and is drawn into the pull chamber. At this time, the crucible 12 rotates in the reverse direction. Moreover, it rises to offset the liquid level drop in the crucible 12 accompanying the pulling of the single crystal.
[0029]
In the growth of the single crystal after the addition of antimony, there is no drop of honey from the heat shielding member 20, and dislocation formation is prevented.
[0030]
【Example】
Next, examples of the present invention will be shown, and the effects of the present invention will be clarified by comparing with comparative examples.
[0031]
As an example of the present invention, a silicon single crystal doped with antimony was grown using the single crystal growth apparatus shown in FIG. The inner diameter of the crucible was 16 inches with the inner diameter of the quartz crucible. The filling amount of polycrystalline silicon was 35 kg, and the input amount of antimony was 300 g. The diameter of the grown crystal is 5 inches and the crystal orientation is <100>.
[0032]
As Comparative Example 1, when the single crystal growing apparatus shown in FIG. 4 was used and antimony was charged into the silicon melt in the crucible, the charging was performed outside the heat shielding member. The rest is the same as the embodiment.
[0033]
As Comparative Example 2, the single crystal growing apparatus shown in FIG. 5 was used, and when antimony was charged into the silicon melt in the crucible, the charging was performed inside the heat shielding member. The rest is the same as the embodiment.
[0034]
For each case, 40 pulls were performed. The pulling yield was investigated in the case of Example and Comparative Example 2. The result is shown in FIG. In addition, the specific resistance of the single crystal that could be pulled up was investigated in the case of Example and Comparative Example 1. The result is shown in FIG.
[0035]
As can be seen from FIGS. 2 and 3, in the embodiment of the present invention, the number of operations capable of raising the total length exceeds 50% of the total number of operations, and reaches nearly 70% when an operation close to full length is added. The specific resistance of the grown crystal was about 0.014 Ω · cm when 300 g of antimony was used.
[0036]
On the other hand, when introducing antimony into the silicon melt in the crucible, in Comparative Example 1 in which the introduction was performed outside the heat shielding member, the pulling yield was similar to that of the example of the present invention, The specific resistance of the grown crystal decreased only to about 0.0155 Ω · cm when 300 g of antimony was used. This means that most of the antimony used was evaporated before being introduced into the melt, and did not contribute effectively to the increase in the concentration of the dopant in the melt.
[0037]
Incidentally, in order to reduce the specific resistance to the same 0.014 Ω · cm level as in the embodiment of the present invention, about 360 g of antimony is required, and the amount used is 1.2 times that of the embodiment of the present invention.
[0038]
On the other hand, in Comparative Example 2 in which antimony was introduced inside the heat shielding member, the specific resistance, that is, the required amount of antimony, was the same as that of the example of the present invention. However, dislocations frequently occurred at the initial stage of pulling up, and operations that allowed the full length to be raised were only 20% of the total number of operations. This is because honey accompanying the introduction of antimony has led to the cause of dislocation.
[0039]
Thus, in the Example of this invention, the used dopant is utilized effectively and the dislocation | rearrangement accompanying the addition of a dopant is prevented.
[0040]
In the above example, antimony is used as a dopant, but the present invention is also effective for the addition of a dopant other than antimony, such as arsenic (As).
[0041]
In the above example, the dope agent dropping path in the present invention, that is, the dope supply pipe disposition path is led out from the inside to the outside of the heat shielding member at the lower part of the heat shielding member. Depending on the kind of the dopant, the ambient temperature, and the like, this derivation may be performed at the middle stage of the heat shielding member, and it is also possible to bypass the lower portion of the heat shielding member.
[0042]
【The invention's effect】
As is clear from the above description, the single crystal growing apparatus of the present invention is configured to pass the inside of the heat shielding member halfway when the dope is introduced into the raw material melt formed in the crucible. Therefore, evaporation of the dopant during the charging can be suppressed and the amount of use can be reduced. In addition, since it is configured to be charged into the raw material melt outside the heat shielding member in the end, it is possible to prevent dislocation due to the charging, and together with the saving of the dopant, The cost for growing a single crystal can be greatly reduced.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a single crystal growing apparatus according to an embodiment of the present invention.
FIG. 2 is a graph showing the effect of the present invention by raising yield.
FIG. 3 is a graph showing the effect of the present invention by the specific resistance of a single crystal.
FIG. 4 is a longitudinal sectional view of a conventional single crystal growth apparatus.
FIG. 5 is a vertical cross-sectional view of a single crystal growing apparatus cited as a comparative example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Growing apparatus main body 11 Main chamber 12 Crucible 13 Pedestal 14 Heater 15, 16 Heat insulating material 20 Heat shielding member 30 Dope supply pipe 40 Silicon melt (raw material melt)

Claims (1)

坩堝の外側に配置されたヒータによって坩堝内に原料融液を形成し、その原料融液からCZ法によって単結晶を引き上げる育成装置本体と、ヒータ及び原料融液からの輻射熱を遮蔽するために坩堝の上方に単結晶を包囲するように配設された筒状の熱遮蔽部材と、坩堝内の原料融液にドープ剤としてアンチモンまたは砒素を添加するために熱遮蔽部材の内側に配設され、且つ熱遮蔽部材の中段位置より下方で前記ドープ剤が熱遮蔽部材の外側へ導出されて坩堝内の原料融液に投入されるように、少なくとも下端部を熱遮蔽部材の外側に臨ませて配設されたドープ供給管とを具備することを特徴とする単結晶育成装置。A growth apparatus body for forming a raw material melt in the crucible by a heater arranged outside the crucible, and pulling the single crystal from the raw material melt by the CZ method, and a crucible to shield the radiation heat from the heater and the raw material melt A cylindrical heat shielding member disposed so as to surround the single crystal above, and disposed inside the heat shielding member for adding antimony or arsenic as a dopant to the raw material melt in the crucible, and as the dopant in below the middle position of the heat shield member is inserted in the raw material melt in the outer to be derived crucible of the heat shield member, distribution and at least the lower end portion to face the outside of the heat shield member A single crystal growth apparatus comprising a dope supply pipe provided.
JP15165998A 1998-06-01 1998-06-01 Single crystal growth equipment Expired - Lifetime JP4075136B2 (en)

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CN105369346A (en) * 2015-12-09 2016-03-02 天津市环欧半导体材料技术有限公司 Device used for czochralski method of highly arsenic-doped low-resistance silicon single crystals
TWI806139B (en) 2020-10-28 2023-06-21 日商Sumco股份有限公司 Single crystal manufacturing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8972959B2 (en) 2009-04-28 2015-03-03 International Business Machines Corporation Method of converting program code of program running in multi-thread to program code causing less lock collisions, computer program and computer system for the same

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