JP4077280B2 - Semiconductor device manufacturing method and manufacturing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a manufacturing method and a manufacturing apparatus for a semiconductor device in which a semiconductor element is mounted on an elongated strip-shaped substrate.
[0002]
[Prior art]
As a semiconductor device, for example, an IC module mounted on a contact IC card is known. As a method for manufacturing an IC module, a method is known in which a plurality of IC chips (semiconductor elements) are attached to a long strip-shaped substrate (hoop substrate) to manufacture a plurality of IC chips.
[0003]
When mounting a plurality of IC chips on the hoop substrate in this way, the belt-shaped hoop substrate is run, and an adhesive of a type that is cured by heating is applied to a predetermined position on the substrate, and the IC chip is placed thereon. Then, the substrate is cured by heating the adhesive to a high temperature, and a plurality of IC chips are bonded onto the hoop substrate.
[0004]
Then, the hoop substrate is wound up once, put into another processing apparatus and run again, and the IC chip bonded and fixed on the substrate and the pad on the substrate are electrically bonded by a gold wire.
[0005]
Further, the hoop substrate is wound up again and put into another processing apparatus, and the bonded IC chip is molded on the substrate with epoxy resin.
[0006]
[Problems to be solved by the invention]
However, in a manufacturing apparatus of the type described above, when an IC chip is placed on a hoop substrate via an adhesive and then heated to cure the adhesive, it adheres to moisture contained in the substrate or the substrate surface. There was a problem that the moisture in the atmosphere was heated rapidly and boiled, and the water vapor caused bubbles in the adhesive, causing the IC chip to move and solidify.
[0007]
This problem becomes more prominent as the hoop substrate is run at a high speed and the substrate is heated rapidly in order to increase the manufacturing efficiency of the IC module.
[0008]
In addition, it is necessary to take up the hoop substrate several times before molding the IC chip and put it into another processing apparatus, and the processing efficiency is poor and the operation is complicated.
[0009]
The present invention has been made in view of the above points, and an object of the present invention is to provide a semiconductor device manufacturing method and a manufacturing apparatus that can increase the yield of the semiconductor device and increase the manufacturing efficiency.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, a method of manufacturing a semiconductor device according to the present invention includes a feeding step of feeding a strip-shaped substrate in the longitudinal direction thereof, and a pretreatment step of drying the substrate sent in the feeding step in a pretreatment section. , An application process for applying heat-curable adhesive to a predetermined position on the substrate dried in the pretreatment process, and an attachment process for attaching the semiconductor element to the substrate via the adhesive applied in the application process And an adhesive process in which the adhesive applied in the application process is cured by heating, and the semiconductor element is bonded to the substrate, and a measurement process for measuring the time during which the substrate that has passed through the pretreatment unit is stopped And in this measurement process, when measuring that the substrate that has passed through the pretreatment unit has stopped for a time exceeding the time to absorb moisture , return the substrate in the reverse direction, and pass the pretreatment unit. The substrate again It has a re-drying step for 燥, the.
[0012]
Further, the semiconductor device manufacturing apparatus of the present invention has a feed mechanism for feeding an elongated strip-shaped substrate in the longitudinal direction thereof, a pretreatment unit for drying the substrate sent by the feed mechanism, and the pretreatment unit for drying. A coating device that applies a heat-curable adhesive to a predetermined position on the substrate, a mounting portion for attaching a semiconductor element to the substrate via the adhesive applied by the coating device, and a coating device that is applied by the coating device A heating and curing unit that heats and cures the adhesive to bond the semiconductor element to the substrate, a timer that measures the time during which the substrate that has passed through the pretreatment unit is stopped, and the pretreatment using the timer When measuring that the substrate that has passed through the part has stopped beyond the time to absorb moisture, the control unit for returning the substrate in the reverse direction, passing the pretreatment unit and drying the substrate again, Have
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0015]
FIG. 1 schematically shows an IC module (semiconductor device) production line 1 (manufacturing device) according to a first embodiment of the present invention. FIG. 2 shows a cross-sectional view of the IC module 100 manufactured in the manufacturing line 1. The IC module 100 is mounted on a contact IC card such as a credit card or an ID card, for example.
[0016]
As shown in FIG. 1, the production line 1 has a feeding device 11 (feeding mechanism) that feeds an elongated belt-like substrate, that is, a hoop substrate 2 (see FIGS. 5 and 6) in the longitudinal direction (the direction of arrow T in the drawing). . The hoop substrate 2 is formed of, for example, a glass epoxy resin. The feed device 11 has a feed shaft 12 around which the hoop substrate 2 is wound, and feeds the hoop substrate 2 in the direction of arrow T by rotating the feed shaft 12 counterclockwise.
[0017]
A plurality of IC chips 4 (semiconductor elements) (see FIG. 2) are bonded and fixed to the downstream side of the feeding device 11 along the arrow T direction via adhesives 3 at predetermined positions on the hoop substrate 2, respectively. The chip mounting device 14 is adjacently disposed. The chip mounting device 14 will be described in detail later.
[0018]
A wire bonding device 15 (bonding unit), a molding device 16 (molding unit), and an inspection device 17 (inspection unit) are sequentially provided on the downstream side of the chip mounting device 14.
[0019]
On the further downstream side of the inspection device 17, a winding device 18 (winding mechanism) for winding the hoop substrate 2 sent out by the feeding device 11 and passed through the devices 14, 15, 16, 17 is provided. Yes. The winding device 18 has a winding shaft 19 for winding the hoop substrate 2, and the IC chip 4 is attached by rotating the winding shaft 19 counterclockwise (the state shown in FIG. 2). The hoop substrate 2) is wound up.
[0020]
A wire bonding device 15 provided adjacent to the chip attachment device 14 electrically connects the IC chip 4 attached to the hoop substrate 2 and the substrate 2 by the chip attachment device 14. More specifically, as shown in FIG. 2, the wire bonding apparatus 15 uses a connection terminal 4 a provided in advance on the IC chip 4 and a pad 2 a provided in advance at a predetermined position on the upper surface of the hoop substrate 2 as gold. Bonding connection is made by the wire 21.
[0021]
The molding device 16 molds the IC chip 4 electrically connected to the hoop substrate 2 by wire bonding. More specifically, as shown in FIG. 2, it is molded with an epoxy resin 22 using a mold (not shown) so as to cover the IC chip 4 in a wire-bonded state.
[0022]
The inspection device 17 inspects the IC module 100 molded in the state shown in FIG. More specifically, the inspection device 17 inspects the IC chip 4, the hoop substrate 2, and the connection state between them, such as the mounting position and bonding state of each IC chip 4.
[0023]
Moreover, the manufacturing line 1 mentioned above may have the storage apparatus which stores by slackening the hoop board | substrate 2 sent out by the feeder 11 and wound up by the winding device 18 on the way. A production line having a storage device will be described later as a second embodiment.
[0024]
As shown in an enlarged view in FIG. 3, the chip attachment device 14 includes a baking furnace 32 (pretreatment portion, heating portion), a die bonding device 34 (attachment portion), and a cure along the feed direction T of the hoop substrate 2. It has a furnace 36 (heat curing part).
[0025]
The bake furnace 32 heats the hoop substrate 2 by passing through a tunnel-like room. The baking furnace 32 heats the hoop substrate 2 to evaporate the moisture contained in the hoop substrate 2 and the moisture in the atmosphere attached to the surface of the hoop substrate 2, and the hoop substrate 2 is preliminarily kept at a predetermined temperature. Functions to heat up. In other words, the baking furnace 32 has a length that allows the passing hoop substrate 2 to be dried to a desired state and heated to a desired temperature. Note that the length of the baking furnace 32 is changed depending on the feed speed of the hoop substrate 2.
[0026]
The die bonding device 34 includes a coating device 42 that applies the insulating adhesive 3 to a predetermined position on the hoop substrate 2, a heater 44 that preheats the adhesive 3 applied by the coating device 42 to a predetermined temperature, And a chip mount device 48 having a robot arm for taking out the IC chip 4 from the IC chip supply unit 46 and placing it on the adhesive 3 applied by the application device 42.
[0027]
The adhesive 3 applied to the hoop substrate 2 by the coating device 42 has a property of being cured by heating to a predetermined temperature. Held at temperature.
[0028]
The curing furnace 36 heats the hoop substrate 2 by passing through a tunnel-like room. Here, by heating the hoop substrate 2, the adhesive 3 applied on the substrate 2 by the coating device 42 is heated and cured, and the IC chip 4 is bonded and fixed on the hoop substrate 2. The length along the feeding direction T of the curing furnace 36 is also changed by the feeding speed of the hoop substrate 2.
[0029]
Hereinafter, an operation of manufacturing the IC module 100 shown in FIG. 2 by the manufacturing line 1 described above will be described with reference to FIGS. FIG. 4 shows a side view of the assembly in a state where the IC chip 4 is bonded and fixed on the hoop substrate 2. FIG. 5 is a plan view of the hoop substrate 2 for explaining an attachment process for attaching the IC chip 4 by applying an adhesive on the hoop substrate 2. FIG. 6 shows a bottom view of the hoop substrate 2. As shown in FIG. 6, a contact surface 6 as an external connection terminal of the IC module is formed in advance on the lower surface side of the hoop substrate 2 according to the number and type of the IC chips 4.
[0030]
Prior to the operation, first, the reel-shaped hoop substrate 2 wound around the feed shaft 12 is set on the feed device 11. Then, the feed shaft 12 is rotated and the transport roller 13 is rotated, so that the hoop substrate 2 is sent out from the feed device 11 in the arrow T direction.
[0031]
As shown in FIGS. 5 and 6, a plurality of sprocket holes 2 b are continuously provided at equal intervals at both ends along the feed direction T of the hoop substrate 2. A plurality of projections (not shown) that mesh with the sprocket holes 2 b are provided on the outer peripheral surface of the transport roller 13. For this reason, the hoop board | substrate 2 is sent out by rotating the conveyance roller 13. FIG. Each of the devices 14, 15, 16, 17, 18 also has a transport mechanism that acts on the sprocket hole 2 b in the same manner as the transport roller 13.
[0032]
The hoop substrate 2 sent out from the feeding device 11 passes through the baking furnace 32 of the chip mounting device 14 and is heated and dried to a desired state. Desired dry state means that moisture adsorbed undesirably on the hoop substrate 2 or undesirably adheres to the hoop substrate 2 when the adhesive 3 is heated and cured in the curing furnace 36 in the subsequent bonding step. It means a dry state in which the water is not evaporated and bubbles are not generated in the adhesive 3.
[0033]
Thereafter, the hoop substrate 2 is passed through the die bonding apparatus 34 immediately after drying (before moisture in the atmosphere does not adhere). In the die bonding device 34, the adhesive 3 is applied to a predetermined position 2 c (see FIG. 5) on the hoop substrate 2 through the coating device 42, and the IC chip 4 taken out from the IC chip supply unit 46 by the chip mounting device 48 is used. Place on the adhesive 3. At this time, the robot arm of the chip mounting device 48 accurately positions the IC chip 4 with respect to the predetermined position 2c on the hoop substrate 2 and sets it at an accurate angle. The adhesive 3 is preheated by the heater 44 before being applied to the predetermined position 2c on the hoop substrate 2.
[0034]
Then, the hoop substrate 2 that has passed through the die bonding apparatus 34 is passed through the curing furnace 36, the adhesive 3 is heated and cured, and the IC chip 4 is bonded and fixed onto the hoop substrate 2. This state is shown in FIG. At this time, since the hoop substrate 2 has been previously passed through the baking furnace 32 and dried, bubbles are not generated in the adhesive 3 and the IC chip 4 is not displaced and bonded. Further, since the hoop substrate 2 is passed through the baking furnace 32 and preheated, and the adhesive 3 is preheated by the heater 44, the processing time of the curing furnace 36 can be greatly shortened.
[0035]
Further, the hoop substrate 2 that has passed through the curing furnace 36 is passed through the wire bonding apparatus 15, and all the IC chips 4 that are bonded and fixed on the substrate 2 are wire-bonded and electrically connected. Subsequently, the hoop substrate 2 is passed through the molding device 16, the IC chip 4 is molded, passed through the inspection device 17 and inspected.
[0036]
Finally, the hoop substrate 2 having a plurality of inspected IC modules 100 is taken up by the take-up shaft 19 of the take-up device 18. Thereafter, the wound hoop substrate 2 is taken out from the production line 1 and set in another device (not shown) as necessary, and the IC module 100 is cut out from the hoop substrate 2.
[0037]
As described above, according to the present embodiment, as a pretreatment before applying the adhesive 3 to the hoop substrate 2 and attaching the IC chip 4, the hoop substrate 2 is dried by passing through the baking furnace 32. Yes. For this reason, in the bonding process after the IC chip 4 is placed on the hoop substrate 2, when the adhesive 3 is heated and cured in the curing furnace 36, the moisture is undesirably absorbed inside the hoop substrate 2. It is possible to prevent moisture or moisture adhering to the surface of the hoop substrate 2 from evaporating and generating bubbles in the adhesive 3. As a result, the mounting position and angle of the IC chip 4 can be prevented from shifting, and the yield of the IC module 100 can be increased.
[0038]
Further, according to the present embodiment, since the hoop substrate 2 is preheated in the bake furnace 32 before passing through the cure furnace 36, the heat treatment time in the cure furnace 36 can be shortened. That is, the length of the curing furnace 36 can be shortened and the length of the production line 1 can be shortened, and at the same time, the feed speed of the hoop substrate 2 can be increased, and the production efficiency of the IC module can be increased.
[0039]
Next, a manufacturing line 50 according to a second embodiment of the present invention will be described with reference to FIGS.
[0040]
As shown in FIG. 7, in the production line 50 according to the second embodiment, the feeding device 11 and the winding device 18 have storage devices 51 and 55 built in, respectively, and between the devices 14, 15, 16, and 17. Are provided with storage devices 52, 53 and 54, respectively. Since other structures are the same as those in the first embodiment described above, the same reference numerals are given to components that function in the same manner, and detailed description thereof is omitted.
[0041]
Each storage device 51-55 (storage part) functions when the process speed of each device 11, 14, 15, 16, 17, 18 of the production line 50 is not constant or when each device is stopped for some reason. The hoop substrate 2 is temporarily stored.
[0042]
Thus, even if it is a case where each apparatus 11, 14, 15, 16, 17, 18 is temporarily stopped by providing the several storage apparatuses 51-55 in the production line 50, the production line 50 The processing can be continued without stopping. As a result, the wire bonding and molding of the IC chip 4 bonded onto the substrate 2 can be processed on one line.
[0043]
Hereinafter, the storage devices 51 to 55 will be described. In this embodiment, the two storage devices 51, 55 have a symmetrical structure, and the three storage devices 52, 53, 54 have basically the same structure. 52 will be described as a representative.
[0044]
As shown in FIG. 8, the storage device 51 of the feeding device 11 stores the hoop substrate 2 in a state of hanging downward between the feeding shaft 12 and the conveying roller 13. The storage device 51 includes two sensors 56 and 57 that detect the hoop substrate 2 that has hung down due to storage. Each of the sensors 56 and 57 has an optical axis that is spaced apart vertically and is blocked by the hoop substrate 2.
[0045]
For example, in the illustrated state in which the lower end of the hoop substrate 2 is between the upper sensor 56 and the lower sensor 57, that is, in the dark state of the sensor 56 and the bright state of the sensor 57, the tip mounting device 14 determines the feed speed by the feed shaft 12. When the process speed increases, the lower end of the hoop substrate 2 rises and the sensor 56 becomes bright. In this case, the transport mechanism 61 of the chip mounting device 14 is stopped together with the transport roller 13 using the sensor 56 light as a trigger. Then, the operation of the transport roller 13 and the transport mechanism 61 is restarted with the sensor 56 dark as a trigger.
[0046]
On the other hand, for example, when the chip mounting device 14 stops for some reason in the illustrated state of the sensor 56 dark and the sensor 57 bright, the lower end of the stored hoop substrate 2 is lowered and the sensor 57 becomes dark. In this case, the feed shaft 12 is stopped with the sensor dark as a trigger. Then, the feed operation by the feed shaft 12 is restarted with the sensor 57 light as a trigger.
[0047]
That is, the storage amount of the hoop substrate 2 in the storage device 51 is determined by the height position of the two sensors 56 and 57, the position of the upper sensor 56 determines the minimum storage amount, and the position of the lower sensor 57 is Determine the maximum storage volume. Needless to say, the storage device 55 of the winding device 18 also includes two sensors 56 and 57 and functions in the same manner as the storage device 51.
[0048]
The storage device 52 provided between the chip attachment device 14 and the wire bonding device 15 includes an inlet guide 62 that guides the hoop substrate 2 introduced from the chip attachment device 14 so as to hang downward, and a wire. It has an outlet guide 63 for guiding the hoop substrate 2 led out to the bonding apparatus 15. In addition, the storage device 52 includes two sensors 58 and 59 in the same manner as the storage device 51 described above.
[0049]
For example, when the storage amount of the hoop substrate 2 decreases from the illustrated state and the sensor 58 becomes bright, the transport mechanism 64 of the downstream wire bonding apparatus 15 is stopped, and the storage amount increases and the sensor 59 becomes dark. The transport mechanism 61 of the upstream chip mounting device 14 is stopped. That is, the storage amount is adjusted so that the lower end of the stored hoop substrate 2 is always located between the sensor 58 and the sensor 59.
[0050]
The other two storage devices 53 and 54 have the same structure as the storage device 52 and function in the same manner. By appropriately stopping the upstream and downstream devices, the hoop substrate 2 is kept within a certain range. Store with the amount of storage.
[0051]
In FIG. 9, the block diagram of the control system of the manufacturing line 50 which has the storage apparatuses 51-55 mentioned above is shown.
[0052]
The control unit 70 of the production line 50 includes a motor 71 that rotates the feed shaft 12 in both forward and reverse directions, a motor 72 that rotates the transport roller 13 in both forward and reverse directions, and a transport mechanism 61 of the chip mounting device 14 that is driven in both forward and reverse directions. , A motor 74 for driving the transport mechanism 64 of the wire bonding apparatus 15, a motor 75 for driving the transport mechanism 65 of the molding apparatus 16, a motor 76 for driving the transport mechanism 66 of the inspection apparatus 17, and a transport roller 67. A motor 77 and a motor 78 that rotates the winding shaft 19 are connected.
[0053]
The control unit 70 is connected to sensors 56, 57, 58, 59 of the storage devices 51 to 55, a counter 81 that counts the sprocket holes 2 b of the hoop substrate 2 that passes through the tip mounting device 14, and a timer 82. ing.
[0054]
By the way, when the manufacturing line 50 mentioned above stops for a comparatively long time for some reason, the hoop board | substrate 2 which passed the bake furnace 32 of the chip | tip attachment apparatus 14 will be cooled, and will absorb moisture again. For this reason, in this embodiment, when the production line 50 is stopped for a time that the hoop substrate 2 absorbs moisture, the hoop substrate 2 is returned and dried again.
[0055]
That is, when the chip mounting device 14 stops for some reason, the timer 82 is set and counting of the stop time is started. And the hoop board | substrate 2 is returned by the predetermined distance by the conveyance mechanism 61 on condition that the conveyance mechanism 61 of the chip | tip attachment apparatus 14 stopped for the predetermined time (10 minutes in this Embodiment). At this time, the distance at which the hoop substrate 2 is returned, that is, the operation time of the transport mechanism 61 is controlled by counting the sprocket holes 2b of the hoop substrate 2 by the counter 81, and at least the hoop substrate 2 that has passed through the die bonding apparatus 34. The part is set so as to return to the front of the baking furnace 32. The returned hoop substrate 2 is stored in the storage device 51 of the feeding device 11 or is wound up by rotating the feeding shaft 12 in the reverse direction.
[0056]
Assuming that the chip mounting device 14 is stopped for 10 minutes, the other devices 11, 15, 16, 17, 18 are stopped for a long time due to some trouble, and the sensor 59 of the storage device 52 on the downstream side of the curing furnace 36 is stopped for 10 minutes. The case where it is dark and the case where the chip mounting device 14 itself has stopped for 10 minutes due to some trouble are considered. In the latter case, the storage device 52 is stopped using the sensor 58 light as a trigger, and the storage amount of the hoop substrate 2 is minimized.
[0057]
Therefore, in order not to operate the transport mechanism of the other devices 15 to 18 when the hoop substrate 2 is returned, the height position of the sensor 58 above the storage device 52 on the downstream side of the chip mounting device 14 is set. It is necessary to set as follows. That is, when returning the hoop substrate 2 through the chip attachment device 14, at least at a height position at which the hoop substrate 2 corresponding to the return distance is stored at a minimum so that only the hoop substrate 2 stored in the storage device 52 is returned. The sensor 58 needs to be arranged.
[0058]
The other storage devices 51, 53, 54, and 55 are not particularly limited by the sensor positions described above, and are appropriately selected depending on the operation conditions such as the process speed and the transport method of each device.
[0059]
As described above, according to the present embodiment, since the plurality of storage devices 51 to 55 are provided in the middle of the production line 50, the devices 11, 14, 15, 16, 17, and 18 are stopped for a short time. In such a case, the processing can be continued without stopping the production line 50, and the processing efficiency can be improved.
[0060]
Further, according to the present embodiment, when the production line 50 is stopped for a relatively long time, the hoop substrate 2 can be returned to the reverse direction and dried again, and bubbles are generated when the adhesive is heated and cured. This can be prevented, and the IC chip 4 can be prevented from being displaced and adhered, and the yield can be increased.
[0061]
In addition, this invention is not limited to embodiment mentioned above, A various deformation | transformation is possible within the scope of this invention.
[0062]
For example, in the first and second embodiments described above, the production line 1 including the bake furnace 32 as the pretreatment unit has been described. However, the present invention is not limited thereto, and the dry air chamber 32 (drying unit) is used instead of the bake furnace 32. ) May be provided. In this case, when the hoop substrate 2 passes through the dry air chamber 32, dry air or hot air is blown onto the surface of the hoop substrate 2 to dry the hoop substrate 2.
[0063]
Further, for example, as shown in FIG. 10, a baking furnace 32a and a dry air chamber 32b may be provided adjacent to each other as a pretreatment unit. In this case, the hoop substrate 2 is first passed through the baking furnace 32a and heated, and then passed through the dry air chamber 32b to be dried. Alternatively, a bake furnace 32a may be provided behind the dry air chamber 32b. As described above, the bake furnace 32a and the air drying chamber 32b are arranged in parallel as the pretreatment unit, so that the hoop substrate 2 can be dried more reliably and the processing time required for the drying can be reduced. You can shorten it.
[0064]
Moreover, in 2nd Embodiment mentioned above, it was made to stop the apparatus of the downstream or the upstream side using the sensor signal of each storage apparatus 51-55 as a trigger, However, Not only this but all the storage apparatuses 51 are used. The amount of storage of the hoop substrate 2 in .about.55 may be monitored by the control unit 70 to stop the devices 11, 14, 15, 16, 17, and 18 as a whole production line.
[0065]
Furthermore, in the second embodiment described above, the upstream or downstream device is stopped using the sensor signal of each storage device 51 to 55 as a trigger, but the corresponding device is not completely stopped. Alternatively, the conveyance speed of the hoop substrate 2 by the conveyance mechanism may be reduced.
[0066]
【The invention's effect】
As described above, since the semiconductor device manufacturing apparatus of the present invention has the above-described configuration and operation, the yield of the semiconductor device can be increased and the manufacturing efficiency can be increased.
[Brief description of the drawings]
FIG. 1 is a schematic view showing an IC module production line according to a first embodiment of the invention.
2 is a cross-sectional view showing an IC module manufactured by the manufacturing line of FIG. 1. FIG.
3 is an enlarged schematic view showing a main part of the production line in FIG. 1. FIG.
4 is a side view showing an assembly manufactured by the configuration of FIG. 3;
FIG. 5 is a plan view of the hoop substrate as seen from the IC chip side for explaining the manufacturing process of the assembly of FIG. 4;
6 is a bottom view of the hoop substrate of FIG. 5. FIG.
FIG. 7 is a schematic view showing a production line according to a second embodiment of the present invention.
8 is an enlarged schematic view showing a main part of the production line in FIG. 7;
9 is a block diagram of a control system that controls the operation of the production line of FIG. 7;
FIG. 10 is a main part schematic diagram showing a modification of the production line.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1,50 ... Production line, 2 ... Hoop substrate, 2b ... Sprocket hole, 3 ... Adhesive, 11 ... Feeding device, 12 ... Feeding shaft, 13 ... Conveying roller, 14 ... Chip mounting device, 15 ... Wire bonding device, 16 DESCRIPTION OF SYMBOLS ... Molding device, 17 ... Inspection device, 18 ... Winding device, 19 ... Winding shaft, 32 ... Bake furnace, 34 ... Die bonding device, 36 ... Cure furnace, 42 ... Coating device, 44 ... Heater, 46 ... IC chip Supply unit, 48 ... chip mount device, 51-55 ... storage device, 56, 57, 58, 59 ... sensor, 61, 64, 65, 66 ... conveying mechanism, 67 ... conveying roller, 71-78 ... motor, 81 ... Counter, 82 ... timer, 100 ... IC module.

Claims (12)

A feeding step of sending an elongated belt-like substrate in the longitudinal direction;
A pretreatment step of drying the substrate sent in this feeding step in a pretreatment unit;
An application step of applying an adhesive curable by heat to a predetermined position on the substrate dried in the pretreatment step;
An attaching step of attaching the semiconductor element to the substrate via the adhesive applied in the applying step;
An adhesive step of heating and curing the adhesive applied in the application step, and bonding the semiconductor element to the substrate;
A measurement process for measuring the time during which the substrate that has passed through the pretreatment unit is stopped;
In this measurement step, when it is measured that the substrate that has passed through the pretreatment unit has stopped for a time exceeding the time to absorb moisture, the substrate is returned in the reverse direction, and the substrate is passed through the pretreatment unit. A re-drying step of drying again,
A method for manufacturing a semiconductor device, comprising:   The method of manufacturing a semiconductor device according to claim 1, wherein the pretreatment step further includes a heating step of heating the substrate.   The method of manufacturing a semiconductor device according to claim 1, wherein the applying step further includes a step of heating the adhesive in advance. A connection step of electrically connecting the semiconductor element bonded in the bonding step to the substrate;
A molding step of molding the semiconductor element connected to the substrate in this connection step;
A winding step of winding the substrate on which the semiconductor element is molded in this molding step;
The method of manufacturing a semiconductor device according to claim 1, further comprising:   5. The method of manufacturing a semiconductor device according to claim 4, further comprising an inspection step of inspecting the semiconductor element and the substrate molded in the molding step before winding in the winding step.   The method for manufacturing a semiconductor device according to claim 1, further comprising a storing step of storing a substrate to which the semiconductor element is bonded. A feed mechanism for feeding a strip-shaped substrate in the longitudinal direction;
A pretreatment unit for drying the substrate sent by the feed mechanism;
A coating apparatus that applies a heat-curable adhesive to a predetermined position on the substrate dried in the pretreatment unit;
A mounting portion for attaching the semiconductor element to the substrate via the adhesive applied by the coating device;
A heating and curing unit that heats and cures the adhesive applied by the coating apparatus, and bonds the semiconductor element to the substrate;
A timer for measuring the time during which the substrate that has passed through the pretreatment unit is stopped;
When it is measured by this timer that the substrate that has passed through the pretreatment unit has stopped for a time longer than moisture absorption, the substrate is returned to the reverse direction, and the substrate is passed through the pretreatment unit. A control section for drying again;
An apparatus for manufacturing a semiconductor device, comprising:   The semiconductor device manufacturing apparatus according to claim 7, wherein the pretreatment unit further includes a heating unit that heats the substrate.   The semiconductor device manufacturing apparatus according to claim 7, wherein the coating apparatus further includes a heater that preheats the adhesive. A bonding portion for electrically connecting the semiconductor element bonded by the heat curing portion to the substrate;
A mold part for molding the semiconductor element connected to the substrate at the bonding part;
A winding mechanism for winding the substrate on which the semiconductor element is molded in the mold part;
The apparatus for manufacturing a semiconductor device according to claim 7, further comprising:   The semiconductor device manufacturing apparatus according to claim 10, further comprising an inspection unit that inspects the semiconductor element molded by the mold unit and the substrate before winding the substrate by the winding mechanism.   The apparatus for manufacturing a semiconductor device according to claim 7, further comprising a storage unit that stores a substrate to which the semiconductor element is bonded.

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