JP4077557B2 - Imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an apparatus for imaging a reading object such as an electronic component.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, an electronic component mounting apparatus that mounts an electronic component on a board is provided with an imaging device that images the electronic component in order to recognize the electronic component.
[0003]
As this imaging apparatus, for example, an apparatus described in JP-A-10-19795 is known.
[0004]
This imaging device is arranged in the middle of transporting an electronic component sucked by a suction nozzle onto a printed circuit board, illuminates the sucked electronic component and receives its reflected light, so that the electronic component becomes a suction nozzle. It recognizes misalignment or the like that occurs when it is attracted. Specifically, an electronic component that has been picked up by the suction nozzle and has reached the imaging position is placed at a predetermined irradiation elevation angle around the reflected optical axis of the electronic component (the optical axis of the projection light with respect to the electronic component is orthogonal to the reflected optical axis). Illumination is performed obliquely from below by a plurality of illumination light sources arranged in parallel at an angle formed with a flat surface, and the reflected light is imaged by an imaging unit (CCD) disposed on the reflected light axis.
[0005]
This imaging apparatus has a configuration for imaging electronic parts of various sizes at the imaging position, but the suction nozzle is moved so that the position of the bottom surface of the electronic component at the imaging position is always constant. The path is generally controlled. That is, there is always a constant work distance W between the electronic component and the imaging device at the imaging position.
[0006]
[Problems to be solved by the invention]
By the way, in such an imaging apparatus, when an electronic component having a spherical solder joint surface such as BGA (Ball Grid Array) or PGA (Pin Grid Array) is imaged, the illumination elevation angle of the illumination light source is set to approximately 0 ° to about 0 °. The present inventor has found that illuminating electronic parts such as BGA and PGA at 20 ° is optimal for imaging.
[0007]
However, as described above, since there is always a constant work distance W between the electronic component and the imaging apparatus at the imaging position, an illumination elevation angle of approximately 0 ° to 20 ° of the illumination light source is ensured. That is, in order to secure an angle of approximately 0 ° to 20 ° formed by the optical axis of the projection light of the illumination light source and the bottom surface of the electronic component, the illumination light source is in a direction (horizontal direction) perpendicular to the reflection optical axis. There is a problem in that the apparatus must be arranged far away from the reflection optical axis, and the apparatus becomes larger in the same direction.
[0008]
The present invention has been made to solve such a problem, and an object of the present invention is to provide an imaging apparatus that can optimally illuminate a reading object while realizing downsizing of the apparatus in the horizontal direction.
[0009]
[Means for Solving the Problems]
An imaging apparatus according to the present invention includes a plurality of illumination light sources that illuminate a reading object located at an imaging position from below, and receives reflected light from the illuminated reading object to image the reading object. In the imaging device including the unit, the illumination light source is arranged in parallel along each side of an n-gon (n is an integer of 4 or more) whose center coincides with the reflection optical axis of the reading object located at the imaging position. On the other hand, the plane is arranged corresponding to the upper side of the illumination light source, reflects the projection light from the illumination light source, and is a plane orthogonal to the optical axis of the reflected light and the reflection optical axis of the reading object. And a reflection mirror for irradiating the reading object with an irradiation elevation angle of approximately 0 ° to approximately 20 °.
[0010]
According to such an imaging apparatus according to the present invention, even if the illumination light source is not moved away in the direction (horizontal direction) perpendicular to the reflection optical axis of the object to be read, the illumination light source is disposed above the illumination light source. Since the projection light from the illumination light source is reflected by the reflecting mirror and the reading elevation is irradiated with an irradiation elevation angle of approximately 0 ° to approximately 20 ° being secured, the apparatus can be downsized in the horizontal direction. For example, a reading object such as BGA or PGA is optimally illuminated.
[0011]
Here, various projection elevation angles of the illumination light source formed by the optical axis of the projection light with respect to the reflection mirror and the plane, and inclination angles of the reflection mirror formed by the plane can be considered. For example, the illumination light source The projection elevation angle is approximately 80 ° and the tilt angle of the reflection mirror is approximately 45 °, and the reading object is irradiated with the illumination elevation angle formed by the optical axis of the reflected light by the reflection mirror and the plane being approximately 10 °. Adopting the configuration is particularly preferable in terms of design and manufacturing, and is more preferable.
[0012]
The reading object is sucked by the suction nozzle and can be moved in a horizontal direction parallel to the plane and in a vertical direction parallel to the reflection optical axis. The suction nozzle moves up and down so that the reading object does not interfere with the reflection mirror. Move the reading object to the upper position of the imaging position by moving horizontally at the position. At the time of imaging, the reading object is lowered to the imaging position, and when the imaging is completed, the reading object is raised to the upper position and moved horizontally. It is preferable to do this.
[0013]
The imaging apparatus configured as described above is particularly suitable when the reading object may interfere with the reflection mirror when the reading object is horizontally moved to / from the imaging position by the suction nozzle. In the horizontal movement of the object to be read by the suction nozzle, while the object to be read is horizontally moved by the suction nozzle at an upper and lower position where it does not interfere with the reflection mirror, interference with the reflection mirror is avoided. During / after imaging of the reading object, the reading object is lowered / raised by the suction nozzle and moved to the imaging position / horizontal movement position, so that there is no possibility of interference with the reflection mirror and the reliability of the apparatus is improved. More improved.
[0014]
Further, the reading object is sucked by the suction nozzle and moved in the horizontal direction parallel to the plane so as to be able to pass through the imaging position, and the portion of the reflecting mirror that corresponds to the horizontal movement locus of the reading object is read. It is preferable to include reflection mirror moving means for retracting the object to a position where it does not interfere with the reading object during horizontal movement and returning to the original position during imaging.
[0015]
The imaging apparatus configured as described above is particularly suitable when the reading object may interfere with the reflection mirror when the reading object is horizontally moved to / from the imaging position by the suction nozzle. The position where the portion of the reflection mirror that corresponds to the horizontal movement locus of the reading object does not interfere with the reading object when the reading object is horizontally moved by the suction nozzle by the reflecting mirror moving means. On the other hand, when the reading object is imaged at the imaging position, the original position is restored, so that there is no possibility of interference with the reflection mirror and the reliability of the apparatus is further improved.
[0016]
Further, the reading object is sucked by the suction nozzle and moved in the horizontal direction parallel to the plane so as to pass through the imaging position, and the reflection mirror lacks a portion corresponding to the horizontal movement locus of the reading object. Is preferred.
[0017]
The imaging apparatus configured as described above is particularly suitable when the reading object may interfere with the reflection mirror when the reading object is horizontally moved to / from the imaging position by the suction nozzle. Since the portion of the reflecting mirror that corresponds to the horizontal movement locus of the object to be read is missing, there is no possibility of interference with the reflecting mirror, and the reliability of the apparatus is further improved. At this time, regarding the recognition of the object to be read, complete recognition cannot be performed in this state due to the lack of the reflection mirror, but interpolation can be performed by using so-called recognition software, for example.
[0018]
Further, the illumination elevation angle formed by the optical axis of the projection light with respect to the reading object and the plane is set to approximately 35 ° to approximately 55 °, and the reading object is directly illuminated, and the illumination light source is alternately arranged along each side. It is preferable to provide the 2nd light source for illumination provided.
[0019]
When such a configuration is adopted, for example, a 10 mm square of QFP (Quad Flat Package) or the like is directly illuminated by the second illumination light source with an irradiation elevation angle of about 35 ° to about 55 °. Since a large reading object of about 40 mm square is optimally illuminated, the range of the imaging target is widened, and the second illumination light source is arranged in parallel with the illumination light source along each side. Even if this is provided, the apparatus can be downsized in the vertical direction.
[0020]
Further, the second reflection mirror that bends the optical path between the reading object located at the imaging position and the imaging unit by approximately 90 °, and the second reflection mirror and the imaging unit, the second reflection mirror is disposed. The illumination elevation angle formed by the optical axis of the projection light with respect to the mirror and the plane perpendicular to the reflection optical axis which is the reflection optical axis of the reading object and is 90 ° bent by the second reflection mirror is approximately 70 ° to approximately 90 °. It is preferable to indirectly illuminate the object to be read and to include a third illumination light source arranged in parallel corresponding to each of the sides.
[0021]
When such a configuration is adopted, the optical path between the reading object located at the imaging position and the imaging unit is bent by approximately 90 ° by the second reflecting mirror, and the second reflecting mirror, the imaging unit, Since the third illumination light source is arranged between the two, the size of the apparatus can be further reduced in the vertical direction, and the illumination elevation angle is set to approximately 70 ° to approximately 90 ° by the third illumination light source. By indirect illumination of the reading object, for example, a small reading object of, for example, a 10 mm square or less such as a condenser is optimally illuminated, so that the range of the imaging object is further expanded.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of an imaging position according to the invention will be described with reference to the accompanying drawings. Note that, in each drawing, the same elements are denoted by the same reference numerals, and redundant description is omitted.
[0023]
FIG. 1 is a perspective view illustrating the imaging apparatus 1 according to the first embodiment, FIG. 2 is a cross-sectional view of the imaging apparatus 1 in FIG. 1, and FIG. 3 is an enlarged view of the illumination system 5 and the electronic component 2 in FIG. FIG. 4 is a perspective view in which the reflecting mirror 20 and the protective glass plate 14 of the imaging device 1 of FIG.
[0024]
The imaging apparatus 1 shown in these drawings enables imaging of the electronic component (reading object) 2 shown in FIGS. 2 and 3 and is incorporated and used as a part of an electronic component mounting apparatus not shown. . Various electronic components 2 are applied. In this embodiment, for example, a capacitor, QFP (Quad Flat Package), BGA, PGA, or the like is applied.
[0025]
As shown in FIGS. 1 and 2, the imaging apparatus 1 has a casing 3 that constitutes a dark box, and is transported to the imaging position S by the suction nozzle 4 in the casing 3 as shown in FIG. The illumination system 5 for illuminating the bottom surface 2a of the electronic component 2 and the lead 2b (see FIG. 3), and the light reflected by the electronic component 2 are received as image information and displayed as an image of the electronic component 2. An imaging system 6; and a lens system 7 that is disposed between the illumination system 5 and the imaging system 6 and forms an image of reflected light on the imaging system 6. Further, the observation window 13 for the electronic component 2 of the casing 3 is provided. The reflection mirror 20 is disposed so as to cover the upper end of the light source and reflects the projection light of the first illumination light source group 16 constituting the illumination system 5 and irradiates the electronic component 2 with the reflected light.
[0026]
The imaging device 1 has a configuration for imaging the electronic component 2 of various sizes at the imaging position S. At the imaging position S, the position of the bottom surface 2a of the electronic component 2 is always constant. The moving path of the suction nozzle 4 is controlled. That is, the various electronic components 2 sucked by the suction nozzle 4 are moved in the horizontal direction by the suction nozzle so as to pass through the imaging position S, and the bottom surface 2a of the electronic component 2 is always a constant workpiece at the imaging position S. The distance W is maintained (see FIG. 3).
[0027]
Further, as shown in FIG. 2, the imaging system 6 and the lens system 7 of the imaging apparatus 1 have a small field of view for imaging a small electronic component 2 of 10 mm square or less, such as a capacitor, and a 30 mm square, for example. It is divided so as to correspond to two modes, such as a large visual field mode for imaging a large electronic component 2 of about 10 mm square to 40 mm square such as QFP.
[0028]
Specifically, the half mirror 8 is disposed on the reflection optical axis L of the electronic component 2 in the horizontal body 3a of the casing 3, and is reflected by the bottom surface 2a and the lead 2b of the electronic component 2 by the half mirror 8. The light is distributed in two directions, one of the reflected light is bent by 90 ° by the half mirror 8 and is incident on the vertical cylinder 3b for small field, and the other reflected light passes through the half mirror 8. The optical path is made to enter the vertical cylinder 3c for large field of view through a reflecting plate 21 for changing the optical path by 90 degrees. Further, in the vertical field cylinder 3b for small field of view, one end of the imaging system 6 is formed at the end thereof, and the small field CCD 10 for imaging the reflected light incident on the vertical field cylinder 3b for small field of view is disposed. At the same time, between the small-field CCD 10 and the half mirror 8, one of the lens systems 7 is configured, and a small-field lens unit 9 that forms an image of reflected light on the small-field CCD 10 is disposed. In the large-field vertical cylinder 3c, the other end of the imaging system 6 is arranged at the end thereof, and the large-field CCD 12 for imaging the reflected light incident in the large-field vertical cylinder 3c is disposed. Between the large-field CCD 12 and the reflection plate 21, there is disposed a large-field lens unit 11 that forms the other of the lens system 7 and forms an image of reflected light on the large-field CCD 12.
[0029]
The illumination system 5 is also divided so as to correspond to two modes of a large field mode and a small field mode, similarly to the imaging system 6 and the lens system 7 described above.
[0030]
Specifically, as shown in FIG. 3, the electronic component between the electronic component 2 and the half mirror 8, which is an inner wall surface of the boundary between the horizontal cylinder 3 a and the vertical cylinder 3 d having the observation window 13 on the upper side. The second reflection mirror 15 for bending the optical path by 90 degrees is fixed on the reflection optical axis L of 2 and between the second reflection mirror 15 and the half mirror 8 in the horizontal barrel 3a. A small-field illumination light source group 18 that constitutes one side of the illumination system 5 and projects light toward the second reflection mirror 15 is provided, while the observation window 13 and the second window 2 in the vertical body 3a are provided. A large-field illumination light source group 17 that constitutes the other side of the illumination system 5 and projects light directly toward the electronic component 2 is provided between the reflection mirror 15 and the vicinity of the observation window 13. .
[0031]
Here, the second reflection mirror 15 is arranged at an inclination angle of 45 ° with respect to the bottom surface of the casing 3. Further, the vertical cylinder 3d and the horizontal cylinder 3a of the casing 3 in which the illumination light source groups 17 and 18 are arranged have a rectangular cross section orthogonal to the axis (see FIG. 4).
[0032]
As shown in FIG. 3, the small-field illumination light source group 18 includes a plurality of LEDs (third illumination light sources) 18a for optimally illuminating the small electronic component 2 of 10 mm square or less such as a capacitor as described above. Each LED 18a includes an optical axis L3 of the projection light with respect to the second reflection mirror 15 along the circumference of the reflection optical axis L, that is, along the inner wall surface of the rectangular lateral cylinder 3a, and the reflection optical axis L Are arranged side by side so that the projection elevation angle γ formed by a plane orthogonal to is approximately 70 ° to approximately 90 °. Accordingly, the irradiation elevation angle (angle formed between the bottom surface 2a of the electronic component 2 and the irradiation light through the second reflecting mirror 15) γ by the small-field illumination light source group 18 is also approximately 70 ° to approximately 90 °. Become. The illumination elevation angle γ of the small-field illumination light source group 18 is most preferably about 80 ° because it can be optimally illuminated. However, it is acceptable if it is within a range of about 70 ° to about 90 °. The inventor has confirmed through experiments.
[0033]
As shown in FIGS. 2 to 4, the large-field illumination light source group 17 is for optimally illuminating a large electronic component 2 having a size of about 10 mm square to 40 mm square such as a 30 mm square QFP. The LED 17a is composed of a plurality of LEDs (second illumination light sources) 17a, and each LED 17a has an irradiation elevation angle (with respect to the electronic component 2) along the circumference of the reflection optical axis L, that is, along the inner wall surface of the vertical cylinder 3d. The angle (β) formed between the optical axis L2 of the projection light and the bottom surface 2a of the electronic component 2 is approximately 35 ° to approximately 55 ° (see FIG. 3). The illumination elevation angle β of the large-field illumination light source group 17 is most preferably about 45 ° because it can be optimally illuminated, but it is acceptable if it is within a range of about 35 ° to about 55 °. The inventor has confirmed through experiments.
[0034]
Further, particularly in the present embodiment, as shown in FIGS. 2 to 4, the LEDs constituting the first illumination light source group 16 are alternately arranged with the LEDs 17 a constituting the large-field illumination light source group 17. Light source) 16a is disposed. That is, the LEDs 17a and the LEDs 16a are alternately arranged along the inner wall surface of the vertical cylinder 3d that forms the rectangle.
[0035]
This LED 16a is for optimally illuminating the electronic component 2 having a spherical solder joint surface such as the aforementioned BGA or PGA. As shown in FIG. 3, the optical axis L1 ′ of the projection light and the reflected light are used. The projection elevation angle α1 formed with the plane orthogonal to the axis L (the bottom surface 2a of the electronic component 2) is arranged in parallel so as to be approximately 80 °.
[0036]
The projection light from the first illumination light source group 16, the direct projection light from the second illumination light source group 17 and the indirect projection light from the third illumination light source group 18 via the second reflection mirror 15 are as follows. All are emitted to the outside through a glass plate 14 for protecting the inside of the casing 3 fitted in the observation window 13.
[0037]
Here, the imaging device 1 of the present embodiment further includes a reflection mirror 20 fixed so as to cover the upper side of the end portion of the observation window 13 of the casing 3 from four directions as shown in FIGS. 1 to 3. The four reflecting mirrors 20 have a shape that protrudes upward from the edge of the rectangular vertical cylinder 3d and inclines toward the reflected light axis L from the middle, and the second illumination light source group. The direct projection light by 17 and the indirect projection light by the third illumination light source group 18 are not blocked, and only the projection light by the first illumination light source group 16 is reflected and directed to the electronic component 2 located at the imaging position S. It has been made into a configuration.
[0038]
Specifically, as shown in FIG. 3, the reflection mirror 20 is arranged such that an inclination angle θ formed with a plane orthogonal to the reflection optical axis L is approximately 45 °. Here, as described above, since the first illumination light source group 16 is arranged in parallel so that the projection elevation angle α1 is approximately 80 °, the light reflected by the reflection mirror 20 is reflected by this reflected light. The electronic component 2 is irradiated by setting the irradiation elevation angle α formed by the optical axis L1 and a plane orthogonal to the reflected optical axis L (the bottom surface 2a of the electronic component 2) to about 10 °. That is, the electronic component 2 such as BGA or PGA is optimally illuminated by the first illumination light source group 16.
[0039]
In this embodiment, the design and manufacture are particularly simple, and more preferable, the projection elevation angle α1 of the first illumination light source group 16 for securing the irradiation elevation angle α is approximately 80 °, and the reflection mirror 20 is used. However, the present invention is not limited to these angles. For example, the projection elevation angle α1 of the first illumination light source group 16 is set to about 90 °, and the inclination angle θ of the reflection mirror 20 is set. Is approximately 50 ° (approximately 50 ° by rotating approximately 5 ° without changing the light reflection position with respect to the case of approximately 45 °), the irradiation elevation angle α = approximately 10 ° can be secured.
[0040]
Further, the illumination elevation angle α of the first illumination light source group 16 through the reflection mirror 20 is most preferably about 10 ° because it can be optimally illuminated, but is within a range of about 0 ° to about 20 °. The present inventors have confirmed by experiment that it is acceptable.
[0041]
These illumination light source groups 16, 17, and 18 are configured to be able to switch lighting between each other, and either one of the illumination light source groups is lit, or a plurality of groups of illumination light sources. Whether the group is turned on at the same time depends on the shape and properties of the target electronic component 2.
[0042]
Thus, in the present embodiment, for example, when imaging the electronic component 2 such as BGA or PGA, the first illumination light source group 16 is placed in a direction (horizontal direction) orthogonal to the reflection optical axis L of the electronic component 2. Even if it is not moved away, the reflection mirror 20 arranged corresponding to the upper side of the first illumination light source group 16 reflects the projection light from the first illumination light source group 16 to irradiate the elevation angle α = approximately 0 ° to approximately 0 °. Since it is possible to irradiate the electronic component 2 with an angle of approximately 20 °, the electronic component 2 such as BGA or PGA can be optimally illuminated while realizing a reduction in size of the imaging position 1 in the horizontal direction.
[0043]
Further, direct illumination of the electronic component 2 by the LED 17a with the irradiation elevation angle β of approximately 35 ° to approximately 55 ° can optimally illuminate a large electronic component 2 of, for example, 10 mm square to 40 mm square such as QFP. The range of the object to be imaged can be expanded with only the imaging device 1 and the LED 16a is alternately arranged along each side. Therefore, even if the LED 17a is provided, the imaging device 1 is small in the vertical direction. Can be made.
[0044]
Further, the optical path L between the electronic component 2 located at the imaging position S and the imaging system 6 is bent by approximately 90 ° by the second reflecting mirror 15, so that the second reflecting mirror 15 is located between the second reflecting mirror 15 and the imaging system 6. Since the third illumination light source group 18 is disposed in the third position, the imaging position 1 can be further downsized in the vertical direction, and the irradiation elevation angle γ is set to approximately 70 ° to approximately 90 °. The indirect illumination of the electronic component 2 by the illumination light source group 18 can optimally illuminate, for example, a small electronic component 2 of, for example, a 10 mm square or less such as a capacitor. It can be expanded.
[0045]
In the first embodiment, the electronic component 2 can be passed through the imaging position S while maintaining the work distance W by being sucked by the suction nozzle 4 and rotated in the horizontal direction with one axis as a fulcrum. However, when the electronic component 2 is horizontally moved to / from the imaging position S by the suction nozzle 4, the electronic component 2 is part of the reflecting mirror 20 (for example, as shown in FIG. When there is a possibility of interference with the reflection mirrors 20a, 20a) opposed to the position corresponding to the horizontal movement locus of the electronic component 2 shown in FIG. While the electronic component 2 is horizontally moved by the nozzle 4 at a vertical position that does not interfere with the reflection mirrors 20a and 20a, interference with the reflection mirrors 20a and 20a is avoided. After image capture / scan is required for the electronic components 2 lowered / raised to move the imaging position S / horizontal movement position by the suction nozzle 4. If comprised in this way, since there is no possibility of interference of the electronic component 2 with respect to the reflective mirrors 20a and 20a, the reliability with respect to the imaging position 1 can be further improved.
[0046]
FIG. 5 is a perspective view showing the imaging apparatus 1 according to the second embodiment, and FIG. 6 is a bottom view of the reflecting mirror 20 in FIG. 5, and is a bottom view showing how the movable reflecting mirror 20a moves.
[0047]
The difference between the imaging device 1 of the second embodiment and that of the first embodiment is that the electronic component 2 that is sucked by the suction nozzle 4 and moved in the horizontal direction while maintaining the work distance W is interfered with the reflection mirror 20. This is the point of providing the reflecting mirror moving means 30 that actively avoids fear.
[0048]
The reflecting mirror moving means 30 uses the reflecting mirrors 20a and 20a facing the position corresponding to the horizontal movement locus of the electronic component 2 (see the phantom line in FIG. 6) as a movable reflecting mirror. For example, an air cylinder 30a as an actuator for moving forward / backward in one direction substantially orthogonal to the horizontal movement locus, and slide guides 30b, 30b for guiding the forward / backward movement of the movable reflecting mirrors 20a, 20a in this one direction are provided. When the electronic component 2 is moved horizontally by driving the air cylinder 30a, the movable reflecting mirrors 20a and 20a are retracted to the retracted position indicated by the solid line in FIG. 6, that is, the retracted position that does not interfere with the electronic component 2. When the component 2 reaches the imaging device S, it is configured to return to the original position indicated by the dotted line in FIG. It has been.
[0049]
As described above, in the second embodiment, the reflection mirror moving unit 30 does not cause any interference with the reflection mirror 20 even when the electronic component 2 is moved horizontally without moving up and down. It can be improved further.
[0050]
FIG. 7 is a perspective view showing the imaging apparatus 1 according to the third embodiment, and FIG. 8 is a perspective view showing the imaging apparatus 1 according to the fourth embodiment.
[0051]
In the reflection mirror moving means 40 of the third embodiment, a mechanism for moving the movable reflection mirrors 20a, 20a forward / backward in one direction substantially perpendicular to the horizontal movement locus is fixed to the motor 40a and the output shaft of the motor 40a. A pinion 40b, a rack 40c that engages with the pinion 40b and has the movable reflecting mirrors 20a and 20a fixed to the ends thereof, and guides the forward / backward movement of the rack 40c (movable reflecting mirrors 20a and 20a) in one direction. And slide guides 40d and 40e.
[0052]
In the reflection mirror moving means 50 of the fourth embodiment, a mechanism for moving the movable reflection mirrors 20a, 20a forward / backward in one direction substantially perpendicular to the horizontal movement locus is provided on the motor 50a and the output shaft of the motor 50a. A fixed rotating plate 50b and a link member whose one end is pivotally mounted at a position eccentric to the rotation center of the rotating plate 50b and the other end is pivotally mounted on a lever member 50d to which the movable reflecting mirrors 20a and 20a are fixed. The rotational movement is changed to a linear movement through the rotating plate 50b and the link member 50c by the driving of the motor 50a, and the movable reflecting mirrors 20a and 20a move forward in one direction described above. / Retreat is achieved.
[0053]
Needless to say, the same effects as those of the second embodiment can be obtained even when the third and fourth embodiments are configured.
[0054]
FIG. 9 is a bottom view of the reflection mirror 20 of the imaging apparatus 1 according to the fifth embodiment, and is a bottom view showing the movement of the movable reflection mirror 20a. The imaging apparatus 1 of the fifth embodiment is different from that of the second embodiment in that the movable reflecting mirrors 20a and 20a are divided into two parts, and the movable reflecting mirror 20a1 on one side is placed in the same direction as the second embodiment. The movable reflecting mirror 20a2 on the other side can be moved forward / backward, and can be moved forward / backward in the opposite direction to the second embodiment.
[0055]
That is, when the electronic component 2 is moved horizontally, the divided movable reflecting mirrors 20a1 and 20a1 are retracted to the retracted position on the left side of the drawing and do not interfere with the electronic component 2 shown by the solid line in FIG. When the movable reflecting mirrors 20a2 and 20a2 on the other side are retracted to the retracted position on the right side of the drawing and do not interfere with the electronic component 2 shown by the solid line in FIG. 20a1 and 20a2 are returned to their original positions indicated by dotted lines in FIG.
[0056]
Even if comprised in this way, the effect similar to 2nd Embodiment can be acquired. The configuration of the fifth embodiment can be similarly applied to the third and fourth embodiments.
[0057]
FIG. 10 is a bottom view of the reflection mirror 20 of the imaging apparatus 1 according to the sixth embodiment. The difference between the imaging device 1 of the sixth embodiment and that of the second to fifth embodiments is that the portion of the reflecting mirror 20 that corresponds to the horizontal movement locus of the electronic component 2 (see the virtual line in FIG. 10) (described above). The movable reflecting mirrors 20a and 20a) are eliminated.
[0058]
With this configuration, as a matter of course, there is no possibility of interference of the electronic component 2 with the reflection mirror 20, but in imaging of an electronic component having a spherical solder joint surface such as BGA, as shown in FIG. Two parts of the donut shape are cut off due to the missing part of the mirror, and complete recognition is impossible.
[0059]
However, when configured as in the sixth embodiment, for example, image recognition can be interpolated by using so-called recognition software or the like, so that the same effect as in the previous embodiment can be obtained. Become.
[0060]
Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say, for example, in the above-described embodiment, the LEDs 16a and the LEDs 17a are alternately arranged one by one. However, it is also possible to arrange a plurality of LEDs 16a and 17a for each side. You may make it arrange in parallel (LED16a or LED17a is arranged in parallel by the whole 1 side).
[0061]
Moreover, in the said embodiment, although the light source group for illumination is arranged in parallel along the inner wall face of the casing 3 which comprises a rectangle, ie, 4 sides, it is not limited to 4 sides and is not in the imaging position S. It suffices if they are arranged in parallel along each side of an n-gon (n is an integer of 4 or more) whose center coincides with the reflected optical axis L of the electronic component 2 positioned. Incidentally, in the case where they are arranged in a ring, they cannot be adopted because they are focused and cannot be well illuminated.
[0062]
Moreover, in the said embodiment, although the reading target object is the electronic component 2, for example, it is not limited to this, For example, it can also be set as a thing with unevenness | corrugations, such as money.
[0063]
【The invention's effect】
The image pickup apparatus according to the present invention includes a light source for illumination by a reflection mirror disposed above the light source for illumination even if the light source for illumination is not moved away in a direction (horizontal direction) perpendicular to the reflection optical axis of the object to be read. Since the projection light from the light beam is reflected to irradiate the reading object with an irradiation elevation angle of approximately 0 ° to approximately 20 °, the apparatus can be reduced in size in the horizontal direction, such as BGA or PGA. The reading object can be optimally illuminated. As a result, optimal and desired imaging can be performed while saving space.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an imaging apparatus according to a first embodiment.
2 is a cross-sectional view of the imaging apparatus of FIG.
FIG. 3 is a detailed cross-sectional view showing the illumination system and electronic components in FIG. 2 in an enlarged manner.
4 is a perspective view showing the image pickup apparatus of FIG. 1 with a reflection mirror and a protective glass plate removed and a part broken away.
FIG. 5 is a perspective view showing an imaging apparatus according to a second embodiment.
6 is a bottom view of the reflecting mirror in FIG. 5, and is a bottom view showing a state of movement of the movable reflecting mirror. FIG.
FIG. 7 is a perspective view showing an imaging apparatus according to a third embodiment.
FIG. 8 is a perspective view showing an imaging apparatus according to a fourth embodiment.
FIG. 9 is a bottom view of a reflection mirror of an imaging apparatus according to a fifth embodiment, and is a bottom view showing how the movable reflection mirror moves.
FIG. 10 is a bottom view of a reflection mirror of an imaging apparatus according to a sixth embodiment.
11 is an explanatory diagram showing a state of a reflected light beam of a reading object in the imaging apparatus of FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Imaging device, 2 ... Electronic component (read object), 2a ... Bottom of electronic component (plane orthogonal to reflection optical axis), 4 ... Suction nozzle, 5 ... Illumination system, 6 ... Imaging system (imaging part), DESCRIPTION OF SYMBOLS 15 ... 2nd reflection mirror, 16a ... 1st light source for illumination (illumination light source), 17a ... 2nd light source for illumination, 18a ... 3rd light source for illumination, 20 ... Reflection mirror, 20a, 20a1, 20a2 ... Part of the reflecting mirror corresponding to the horizontal movement locus of the electronic component, 30, 40, 50... Reflecting mirror moving means, L... Reflection optical axis of the electronic component, L1. 1 is an optical axis of the projection light from the illumination light source, L2 is an optical axis of the projection light from the second illumination light source, L3 is an optical axis of the projection light from the third illumination light source, and S is an imaging position.

Claims (7)

An imaging device including a plurality of illumination light sources that illuminate a reading object positioned at an imaging position from below, and an imaging unit that receives reflected light from the illuminated reading object and images the reading object In the device
While the illumination light source is arranged in parallel along each side of an n-gon (n is an integer of 4 or more) whose center coincides with the reflection optical axis of the reading object located at the imaging position,
The illumination light source is arranged corresponding to the upper side of the illumination light source, reflects the projection light from the illumination light source, and an optical axis of the reflected light and a plane orthogonal to the reflection optical axis of the reading object An imaging apparatus comprising: a reflection mirror that irradiates the reading object with an illumination elevation angle of approximately 0 ° to approximately 20 °. The illumination light source is disposed with a projection elevation angle formed by the optical axis of the projection light with respect to the reflection mirror and the plane being approximately 80 °,
The reflection mirror is arranged with an inclination angle of about 45 ° with the plane to reflect the projection light of the illumination light source, and an illumination elevation angle between the optical axis of the reflection light and the plane is about 10 °. The imaging apparatus according to claim 1, wherein the reading object is irradiated as follows. The reading object is sucked by a suction nozzle and is movable in a horizontal direction parallel to the plane and a vertical direction parallel to the reflected optical axis,
The suction nozzle horizontally moves the reading object at an upper and lower position where the reading object does not interfere with the reflection mirror, and causes the reading object to reach an upper position of the imaging position. At the time of imaging, the reading object is moved to the imaging position. The imaging apparatus according to claim 1, wherein when the imaging is finished, the reading object is raised to the upper position and moved horizontally. The reading object is sucked by a suction nozzle and moved in a horizontal direction parallel to the plane to be able to pass through the imaging position;
A portion of the reflecting mirror that corresponds to the horizontal movement trajectory of the reading object is retracted to a position that does not interfere with the reading object when the reading object is moved horizontally, and returned to the original position during imaging. The imaging apparatus according to claim 1, further comprising means. The reading object is sucked by a suction nozzle and moved in a horizontal direction parallel to the plane to be able to pass through the imaging position;
The imaging apparatus according to claim 1, wherein the reflection mirror lacks a portion corresponding to a horizontal movement locus of the object to be read. The illumination elevation angle formed by the optical axis of the projection light with respect to the reading object and the plane is set to approximately 35 ° to approximately 55 ° to directly illuminate the reading object, and alternately with the illumination light source along each side. The imaging apparatus according to claim 1, further comprising a second illumination light source arranged in parallel. A second reflecting mirror that bends an optical path between the reading object located at the imaging position and the imaging unit by approximately 90 °;
An optical axis of the projection light with respect to the second reflection mirror and the reflection optical axis of the reading object, which is disposed between the second reflection mirror and the imaging unit, and is 90 ° by the second reflection mirror. An illumination elevation angle formed with a plane orthogonal to the bent reflected optical axis is set to approximately 70 ° to approximately 90 ° to indirectly illuminate the reading object, and a third line arranged in parallel corresponding to each side. The imaging apparatus according to claim 6, further comprising an illumination light source.

Images