JP4084543B2

JP4084543B2 - Coating film edge processing apparatus and photoreceptor manufacturing apparatus

Info

Publication number: JP4084543B2
Application number: JP2001075161A
Authority: JP
Inventors: 豪江川; 久義後藤; 照璽立嶋; 芳広山口; 政幸寺山
Original assignee: Ricoh Co Ltd
Current assignee: Ricoh Co Ltd
Priority date: 2001-03-16
Filing date: 2001-03-16
Publication date: 2008-04-30
Anticipated expiration: 2021-03-16
Also published as: JP2002278104A

Description

【０００１】
【発明の属する技術分野】
この発明は電子写真方式の複写機やプリンタに使用する感光体等円筒状基体の内外周面に塗布した塗膜の端部の余剰塗膜を除去する塗膜端部処理装置及び感光体の製造装置に関するものである。
【０００２】
【従来の技術】
電子写真感光体の製造方法として円筒状基体を基体保持装置により保持し、感光塗料に浸漬し、その後引き上げることにより塗膜を形成する浸漬塗工法が広く用いられている。その際、生じる基体の下端部に塗膜厚肉部と余剰塗膜が形成される。このように感光体の端部に塗膜厚肉部や余剰塗膜が形成されると、例えば塗膜厚肉部は膜厚が平坦部に比べ厚くなっているため、感光体を使用した画像形成工程で感光体の残留トナーをクリ−ニングブレ−ドで除去するときに、クリ−ニングブレ−ドの接触が悪くなりクリ−ニング不良が生じたり、クリ−ニングブレ−ドを破損するという問題がある。また、基体下端内面に余剰塗膜が形成されると、感光体の端部にフランジを装着して組み込むときに、感光体は変形してしまい、寸法精度や着強度などに問題が生じてしまう。また、画像品質向上のため、感光体端部面に各種突当部材を接触させ精度を持たせる場合があるが、その場合端部面に塗膜が存在することにより精度は著しく低下してしまう。
【０００３】
このように弊害となる感光体の端部余剰塗膜等を除去するため、特開平６−２０２３５２号公報等に示すように、塗膜を溶解する溶剤中に基体を特定の条件で浸漬して余剰塗膜を除去したり、実開昭６４−５６８７２号公報等に示すように、溶剤槽の基体下端に対向する位置に多孔質性柔軟性部材を上面が溶剤液面より露出するように設け、基体端部を液面上方から多孔質性柔軟部材に押し付けて溶剤内に浸漬し、一定時間浸積したのち基体を溶剤から引き上げるようにして余剰塗膜を除去している。
【０００４】
また、特開平４−７３７７８号公報に示すように、基体の端部の余剰塗膜にノズルから溶剤を吹き付けて余剰塗膜を除去したり、特開昭６１−２２３８４４号公報や特開平９−１５２７２４号公報に示すように、余剰塗膜の部分にブレードを接触させたり、ブラシにより除去したりしている。
【０００５】
【発明が解決しようとする課題】
しかしながら、溶剤浸漬法では余剰塗膜等を完全に除去することはできず、また、溶剤中に円筒状基体を浸積するため、液面のゆれにより塗膜にむらが生じたり余分な塗膜までも除去される恐れがある。また、基体端部を多孔質性柔軟部材に押し付けて溶剤中に浸漬する方法は、基体端部の余剰塗膜が多孔質性柔軟部材の上面に付着し、繰り返して処理を行うと除去精度が悪くなってしまう。
【０００６】
また、溶剤を吹き付ける溶剤洗浄法でも完全なる洗浄ができず、溶剤量も大量必要となる。さらに、ブレ−ドやブラシで除去する方法は、ブレード等の密着性により洗浄度が左右されるが、その再現性が乏しいため完全な除去ができないとともに正常な塗膜や基体を傷付けるおそれがある。
【０００７】
この発明は係る短所を改善し、円筒状基体の端部の塗膜厚肉部と余剰塗膜を精度よくかつ安定して除去することができる塗膜端部処理装置及び感光体の製造装置を提供することを目的とするものである。
【０００８】
【課題を解決するための手段】
この発明に係る塗膜端部処理装置は、円筒状の基体を保持して昇降させる基体保持装置と、液回収槽と液回収槽の中央部に回転自在に設けられ、柔軟性を有し平均セル径が 0.5 ｍｍ〜２ｍｍである連続気泡フォームからなる外面拭取り部材と内面拭取り部材を有する拭取り容器と、拭取り容器を回転する回転機構部とを有する拭取り装置と、溶剤タンクと溶剤供給ポンプを有し、拭取り容器に溶剤を供給する溶剤供給装置及び拭取り容器から液回収槽に排出された溶剤を回収する液回収タンクを有し、基体保持装置で基体の下端部を拭取り装置の外面拭取り部材と内面拭取り部材の位置まで下降させて基体の下端部の外周面と内周面を外面拭取り部材と内面拭取り部材に押し付けて、拭取り容器を回転しながら、基体の内外周端部に付着した塗膜厚肉部と余剰塗膜を外面拭取り部材と内面拭取り部材により吸い取りながら拭取ることを特徴とする。
【００１６】
また、基体の内外周端部に付着した塗膜厚肉部と余剰塗膜を外面拭取り部材と内面拭取り部材により吸い取りながら拭取るとき、基体と、外面拭取り部材と内面拭取り部材との間の回転速度差を１０ｒｐｍ〜６０ｒｐｍにすると良い。
【００１７】
この発明の感光体の製造装置は、上記塗膜端部処理装置を、導電性を有する円筒の基体に感光層を形成する塗工装置の後段に設けたことを特徴とする。
【００１８】
【発明の実施の形態】
この発明の塗膜端部処理装置は、基体保持装置と拭取り装置と溶剤供給装置及び液回収タンクを有する。基体保持装置は円筒状の基体を保持して昇降させる。拭取り装置は、液回収槽と液回収槽の中央部に回転自在に設けられ、柔軟性を有する多孔質材料からなる外面拭取り部材と内面拭取り部材を有する拭取り容器と、拭取り容器を回転する回転機構部とを有する。溶剤供給装置は溶剤タンクと溶剤供給ポンプを有し、拭取り容器に溶剤を供給する。液回収タンクは拭取り容器から液回収槽に排出された溶剤を回収する。
【００１９】
この塗膜端部処理装置で基体の内外周端部に付着した塗膜厚肉部と余剰塗膜を除去するとき、外面拭取り部材と内面拭取り部材に溶剤を供給しながら、基体と各拭取り部材の間に回転を与えて基体の内外周端部に付着した塗膜厚肉部と余剰塗膜を各拭取り部材により吸い取りながら拭取る。この基体の内外周端部に付着した塗膜厚肉部と余剰塗膜を拭取った後、外面拭取り部材と内面拭取り部材に溶剤を供給して外面拭取り部材と内面拭取り部材に付着した塗膜を除去する。
【００２０】
【実施例】
図１はこの発明の一実施例の感光体の製造装置に使用する塗膜端部処理装置の構成図である。図に示すように、塗膜端部処理装置は、基体保持装置１と拭取り装置２と溶剤供給装置３と液回収タンク４を有する。基体保持装置１は基台５に設けられた昇降ねじ６と、昇降ねじ６を回転する昇降モータ７と、昇降ねじ６の回転により昇降する昇降機８と、昇降機８に設けられたアーム９の先端下部に設けられ、感光体を形成する円筒状の基体１０を保持する基体保持部１１を有する。
【００２１】
拭取り装置２は液回収槽１２と、液回収槽１２の中央部に回転自在に設けられた拭取り桶１３と、拭取り桶１３を回転する回転モータ１４と、回転モータ１４の回転を拭取り桶１３に伝達するプーリやベルト等を有する回転伝達機構１５とを有する。液回収槽１２は側面に、前進後退用のシリンダ１６に連結された押付け機構１７が連結され、液回収槽１２の下端部は液回収タンク４に連結している。拭取り桶１３には、図２の断面図に示すように、内部中央部に円柱上に形成された拭取り部材保持部１８と、拭取り部材保持部１８の中間部で拭取り桶１３の底面より一定高さを有する位置に設けられた円盤状の拭取り部材保持板１９を有する。拭取り部材保持部１８の先端部には柔軟性を有し、多孔質の材料、例えばポリエチレンやポリプロピレン、テフロンあるいはポリウレタンや合成ゴム、シリコン等で形成された拭取り部材２０が設けられ、拭取り部材保持板１９の上面には、柔軟性を有し、多孔質の材料で形成された円盤状拭取り部材２１を有する。拭取り桶１３の拭取り部材保持部１８には下端部から拭取り部材２０の取付け部まで貫通した溶剤供給孔２２を有する。また、拭取り桶１３の底には液排出バルブ２３を取り付けた液排出口を有する。
【００２２】
溶剤供給装置３は溶剤タンク２４と溶剤供給ポンプ２５とシール部２６を有し、溶剤タンク２４は溶剤供給ポンプ２５とシール部２６を介して拭取り部材保持部１８の溶剤供給孔２２に連結している。
【００２３】
上記のように構成した塗膜端部処理装置で、外周面に塗膜を塗布した塗工後に基体１０の下端部に形成された塗膜厚肉部と余剰塗膜を除去するときの動作を図３の工程図を参照して説明する。
【００２４】
まず、拭取り桶１３の液排出バルブ２３を閉じた状態で溶剤供給装置３の溶剤供給ポンプ２５を駆動して溶剤タンク２４内の溶剤を拭取り装置２の拭取り部材保持部１８に設けた溶剤供給孔２２から拭取り部材２０を通して拭取り桶１３に供給し、円盤状拭取り部材２１に溶剤を含浸させる。円盤状拭取り部材２１に溶剤を含浸したのち溶剤供給ポンプ２５の駆動を停止して液排出バルブ２３を開にして拭取り桶１３内の溶剤を液回収タンク４に回収する。
【００２５】
この円盤状拭取り部材２１に溶剤を含浸した状態で、図３（ａ）に示すように、基体保持装置１により保持された塗工後の基体１０が拭取り桶１３の拭取り部材保持部１８と拭取り部材２０に接触しないように、シリンダ１６により液回収槽１２を移動して拭取り桶１３を基体１０に対して位置合わせする。この状態で基体保持装置１の昇降モータ７を駆動して基体１０を鉛直方向に下降し、基体１０の下端部を拭取り部材保持部１８に取り付けた拭取り部材２０の位置まで移動する。そして、図３（ｂ）に示すように、基体１０の下端部を、溶剤を含浸した円盤状拭取り部材２１に対して一定の深さで押し当てる。次に回転モータ１４を駆動して拭取り桶１３を一定回転速度で回転する。この拭取り桶１３の回転により円盤状拭取り部材２１が回転し、基体１０の下端部の外周端面と先端面に付着した塗膜肉厚部や余剰塗膜を拭取り除去する。拭取り桶１３を一定時間回転したのち回転モータ１４の駆動を停止し、拭取り桶１３の回転を停止する。
【００２６】
次に図３（ｃ）に示すように、基体保持装置１の昇降モータ７を駆動して基体１０を上昇させ、基体１０の下端部を円盤状拭取り部材２１から離し、基体１０の内周面の塗膜肉厚部や余剰塗膜が拭取り部材２０の位置にくるように位置決めして基体１０の上昇を停止する。この状態でシリンダ１６を駆動して液回収槽１２を一定距離だけ移動して拭取り部材２０を基体１０の内周面に一定圧力で押し付ける。そして拭取り桶１３の液排出バルブ２３を開にした状態で溶剤供給装置３の溶剤供給ポンプ２５を駆動して溶剤タンク２４内の溶剤を拭取り装置２の拭取り部材保持部１８に設けた溶剤供給孔２２から拭取り部材２０に供給しながら回転モータ１４を駆動して拭取り桶１３を一定の回転速度、例えば１０ｒｐｍから１００ｒｐｍの回転速度で回転する。この拭取り桶１３の回転により拭取り部材保持部１８に取り付けた拭取り部材２０は基体１３の内周端面に沿って回転し、基体１３の内周端面に付着した塗膜肉厚部や余剰塗膜を拭取り除去する。拭取り桶１３を一定時間回転した後、回転モータ１４の駆動を停止して拭取り桶１３の回転を停止し、溶剤供給ポンプ２５の駆動を停止して、図３（ｄ）に示すように、シリンダ１６を駆動して液回収槽１２を一定距離だけ移動して拭取り部材２０を基体１０の内周面から離す。そして昇降モータ７を駆動して基体１０を初期位置値まで上昇させる。
【００２７】
次に、図３（ｅ）に示すように、拭取り桶１３の液排出バルブ２３を閉にして溶剤供給装置３の溶剤供給ポンプ２５を駆動し、溶剤タンク２４内の溶剤を拭取り桶１３に供給し、拭取り桶１３内に溶剤を満たして一定時間保持する。この拭取り桶１３に満たされた溶剤により拭取り部材２０と円盤状拭取り部材２１の表面に付着した塗膜を溶解して、拭取り部材２０と円盤状拭取り部材２１の表面を拭取った塗膜のないきれいな状態にする。その後、図３（ｆ）に示すように、液排出バルブ２３を開にして拭取り桶１３内の塗膜を溶解した溶剤を液回収タンク４に排出し、次の基体１０の処理に備える。この拭取り桶１３内の塗膜を溶解した溶剤を排出するときに、円盤状拭取り部材２１を有する拭取り部材保持板１９を、拭取り桶１３の底面より一定高さを有する位置に設けてあるから、塗膜を溶解した溶剤を円滑に排出することができる。この拭取り桶１３内の塗膜を溶解した溶剤を液回収タンク４に排出した後、再度、拭取り桶１３に溶剤タンク２４から溶剤を流すと、拭取り部材２０と円盤状拭取り部材２１の表面をよりきれいにすることができるとともに拭取り部材２０と円盤状拭取り部材２１を溶剤で保湿することができる。
【００２８】
上記実施例は基体１０の内周面に拭取り部材２０を押し当てるためにシリンダ１６により液回収槽１２を移動する場合について説明したが、基体１０を保持するアーム９にシリンダ等の移動機構を設け、液回収槽１２を固定した状態で基体１０を水平方向と鉛直方法に移動するようにしても良い。
【００２９】
また、上記実施例は拭取り部材２０と円盤状拭取り部材２１をポリエチレン等の多孔性材料で１層に形成した場合について説明したが、多孔性材料を複数層積層して形成しても良い。また、多孔性材料の表面に網目状板材例えばメッシュを重ねたり、網目状板材をバネなどで固定して拭取り部材２０と円盤状拭取り部材２１を形成しても良い。
【００３０】
また、上記実施例は拭取り桶１３の拭取り部材保持部１８に溶剤を供給する溶剤供給孔２２を設けた場合について説明したが、溶剤供給管を拭取り部材１３の上部に設けても良い。
【００３１】
さらに、上記実施例は円盤状拭取り部材２１で基体１０の外周端面の余剰塗膜等を拭取り除去する場合について説明したが、図４の断面図に示すように、拭取り桶１３の壁面の一部に外面拭取り部材３０を設け、拭取り桶１３を回転することにより拭取り部材２０と外面拭取り部材３０で基体１０の内周端面と外周端面の余剰塗膜を同時に除去するようにしても良い。
【００３２】
また、図５の断面図に示すように、拭取り桶１３の代わりに、中央部に拭取り部材２０の保持部３１を有し、外周部に外面拭取り部材３０の保持部３２を有し、各保持部３１,３２に溶剤供給孔２２を有する回転部材３３を使用して、基体１０の内周端面と外周端面の余剰塗膜を同時に除去するようにしても良い。
【００３３】
さらに、拭取り桶１３や回転部材３３を回転モータ１４で回転する場合について説明したが、基体１０を保持するアーム９の先端部に回転機構を設け、基体１０を回転して、基体１０の先端部に付着した余剰塗膜を拭取るようにしても良い。
【００３４】
上記実施例は基体保持装置１に１本の基体を保持した場合について説明したが、図６に示すように基体保持装置１のアーム９に複数の基体保持部１１を設け、液回収槽１２に、基体保持部１１の数に応じた拭取り桶１３と遮蔽板２７を設けても良い。このようにして複数本の基体１０の端部の余剰塗膜等を一度に除去することができる。
【００３５】
次に、例えば電子写真方式の画像形成装置に使用する感光体の製造装置の塗工装置で導電性を有する基体１０に下引き層と電荷発生層及び電荷輸送層を形成し、形成した各塗膜の基体１０の端部の余剰塗膜等を、拭取り部材２０と円盤状拭取り部材２１として平均セル径０．８ｍｍの連続気泡ポリエチレンフォームを使用して除去した場合の具体例を説明する。
【００３６】
〔具体例１〕下記成分の下引き層塗工液に円筒状の基体１０を浸漬して塗膜を形成した後、塗膜除去用溶剤としてメチルエチルケトンを用い端部の余剰塗膜等を除去した。
下引き層塗工液成分
ＴｉＯ_２９０重量部
熱硬化樹脂１５０重量部
メチルエチルケトン６００重量部
下引き層膜厚５μｍ
このときの余剰塗膜等の除去度合いは良好で目視では内面及び外面に拭き残しは確認できず、拭き取るときに乱れることはなく、均一に塗膜を除去することができた。また、繰り返し精度に優れ、複数回の塗膜除去においても除去度合いは変わることなく無く良好であった。
【００３７】
〔具体例２〕上記成分の下引き層塗工液に円筒状の基体１０を浸漬して塗膜を形成した後、塗膜除去用溶剤として塩化メチレンを用い端部の余剰塗膜等を除去した。このときも除去度合いは良好で目視により内面及び外面に拭き残しは確認できず、拭き取り際は乱れることなく均一に塗膜を除去できた。
【００３８】
〔比較例１〕上記具体例１の下引き層の余剰塗膜等を従来の溶剤浸漬法にて除去した。溶剤はメチルエチルケトンを使用し浸漬時間を３０秒、浸漬回数を３回おこなった。塗膜を完全に除去することができず、相当量の塗膜が内面及び外面に付着していた。また、液面のゆれにより拭き取りの際は乱れていた。
【００３９】
〔比較例２〕具体例１の下引き層の余剰塗膜等をブラシによる掻き取法にて除去した。このとき溶剤は塩化メチレンを使用した。内面及び外面の塗膜はほとんど目視では確認できなかったが、拭き取り際にブラシにより乱されていた。また、繰り返し精度が乏しく洗浄度にばらつきがあった。
【００４０】
〔具体例３〕下記成分の電荷発生層塗工液に円筒状の基体１０を浸漬して塗膜を形成した後、塗膜除去用溶剤としてメチルエチルケトンを用い端部の余剰塗膜の除去をした。
電荷発生層塗工液成分
アゾ顔料（Ａ）４５重量部
ポリビニルブチラ−ル４.５重量部
メチルエチルケトン２４００重量部
除去度合いは良好で目視により内面及び外面に拭き残しは確認できず、拭き取りの際は乱れることなく均一に塗膜を除去できた。また、繰り返し精度に優れ複数回の塗膜除去においても除去度合いは変わることなく良好であった。
【００４１】
〔具体例４〕下記成分の電荷発生層塗工液に円筒状の基体１０を浸漬して塗膜を形成した後、塗膜除去用溶剤としてＴＨＦを用い端部の余剰塗膜等除去した。
電荷発生層塗工液成分
τ型無金属フタロシアニン３０重量部
ポリビニルブチラ−ル２０重量部
ＴＨＦ１２００重量部
塗膜除去度合いは良好で目視により内面及び外面に拭き残しは確認できず、拭き取り際は乱れること無く均一に塗膜を除去できた。また、繰り返し精度に優れ複数回の塗膜除去においても除去度合いは変わることなく良好であった。
【００４２】
〔比較例３〕具体例３の電荷発生層を従来の溶剤浸漬法にて除去した。溶剤はメチルエチルケトンを使用し、浸漬時間を３０秒、浸漬回数を３回おこなった。塗膜を完全に除去することができず、相当量の塗膜が内面及び外面に付着していた。
【００４３】
〔比較例４〕具体例４の電荷発生層をブラシによる掻き取法にて除去をおこなった。溶剤はＴＨＦを使用した。塗膜除去度合いは、具体例４に比べ劣りわずかに残査が残っていた。また、繰り返し精度に乏しく複数回の塗膜除去における除去度合いはばらついていた。
【００４４】
〔具体例５〕下記成分の電荷輸送層塗工液に円筒状の基体１０を浸漬して塗膜を形成した後、塗膜除去用溶剤としてＴＨＦを用い端部塗膜除去を実施した。
電荷発生層塗工液成分
電荷発生材料（Ｂ）１８０重量部
ポリカ−ボネ−ト樹脂２５０重量部
ＴＨＦ１５２０重量部
シリコンオイル０．０４重量部
電荷発生層膜厚３０μｍ
塗膜除去度合いは良好で目視により内面及び外面に拭き残しは確認できず、拭き取りの際は乱れることなく均一に塗膜を除去できた。また、繰り返し精度に優れ複数回の塗膜除去においても除去度合いは変わることなく良好であった。
【００４５】
〔具体例６〕具体例５の電荷輸送層塗工液に円筒状の基体１０を浸漬して塗膜を形成した後、塗膜除去用溶剤として塩化メチレンを用い端部の余剰塗膜等を除去した。塗膜除去度合いは良好で目視により内面及び外面に拭き残しは確認できず、拭き取りの際は乱れることなく均一に塗膜を除去ができた。また、繰り返し精度に優れ複数回の塗膜除去においても除去度合いは変わることなく良好であった。
【００４６】
〔比較例５〕具体例５の電荷発生層を従来の溶剤浸漬法にて除去をおこなった。溶剤はＴＨＦを使用し、浸漬時間を３０秒、浸漬回数を３回おこなった。塗膜を完全に除去できず、相当量の塗膜が内面及び外面に付着していた。
【００４７】
〔比較例６〕具体例５の電荷発生層をブラシによる掻き取法にて除去をおこなった。溶剤はＴＨＦを使用した。塗膜除去度合いは具体例５に比べ劣りわずかに残査が残っていた。
【００４８】
〔具体例７〕図６に示す複数本例えば１２本の基体１０を処理する塗膜端部処理装置を使用して具体例１の下引き層の余剰塗膜等を除去した。このときの塗膜除去度合いは良好であり、１２本すべて目視上内面及び外面に拭き残しは確認できず、拭き取りの際は乱れることなく均一に塗膜を除去できた。
【００４９】
〔具体例８〕具体例７と同様に１２本の基体１０を処理する塗膜端部処理装置を使用して具体例３の電荷発生層の余剰塗膜等を除去した。塗膜除去度合いは良好であり、１２本すべて目視上内面及び外面に拭き残しは確認できず、拭き取り際は乱れることなく均一に塗膜を除去できた。
【００５０】
〔具体例９〕同様に１２本の基体１０を処理する塗膜端部処理装置を使用して具体例５の電荷輸送層の余剰塗膜等を除去した。塗膜除去度合いは良好であり、１２本すべて目視上内面及び外面に拭き残しは確認できず、拭き取り際は乱れることなく均一に塗膜を除去できた。
【００５１】
〔具体例１０〕具体例３において、拭取り桶１３の回転速度を５ｒｐｍから１４０ｒｐｍの間で順次切り換えて電荷輸送層の余剰塗膜の除去を行った結果を下記表に示す。
【００５２】
【表１】

【００５３】
上記表に示すように、塗膜除去度合いは１０〜１００ｒｐｍの範囲で良好であるが、回転速度が速いほど処理にかかる時間が短く済むことが確認できた。また、１０ｒｐｍより遅いと拭き残しが生じ、１００ｒｐｍより早いと拭取り部材２０と円盤状拭取り部材２１にテンションがかかりすぎ、繰り返し処理を行うと切れ目がはいった。処理に要する時間と拭取り部材２０と円盤状拭取り部材２１の耐久性を考慮して２０ｒｐｍ〜６０ｒｐｍ程度がもっとも良好と確認できた。
【００５４】
〔比較例７〕具体例１の下引き層を従来の溶剤浸漬法にて塗布された基体１０をセル径０．５ｍｍの独立気泡フォームを使用し、塗膜除去用溶剤としてメチルエチルケトンを用い端部の余剰塗膜を除去施した。塗膜除去度合いは独立気泡フォーム内に塗膜を吸い取らないため、拭き取り効率が悪く、拭き残りを確認した。
【００５５】
〔具体例１１〕具体例１の下引き層を、セル径を約0.3，0.5，0.8，2.0，3.0ｍｍの拭取り部材２０と円盤状拭取り部材２１を使用し、塗膜除去用溶剤としてメチルエチルケトンを用い余剰塗膜等を除去した。この除去処理を連続１００本行い、除去度合いを確認した結果を下記表に示す。
【００５６】
【表２】

【００５７】
上記表に示すように拭取り部材２０と円盤状拭取り部材２１は0.5ｍｍ〜2ｍｍが最適であることが確認できた。
【００５８】
【発明の効果】
この発明は、以上説明したように、円筒状の基体に塗布した塗膜の基体の内外周端部に付着した塗膜厚肉部及び余剰塗膜を除去するときに、平均セル径が 0.5 ｍｍ〜２ｍｍである連続気泡フォームからなる拭取り部材により吸い取りながら拭取るようにしたから、基体の内外周端部に付着した塗膜厚肉部及び余剰塗膜を確実に除去することができるとともに連続除去を行ってもセルが目詰まりせず安定して除去処理を繰り返すことができる。
【００５９】
また、拭取り部材に溶剤を供給しながら、基体と拭取り部材の間に回転を与えて基体の内外周端部に付着した塗膜厚肉部及び余剰塗膜を拭取り部材により吸い取りながら拭取ることにより、基体の内外周端部に付着した塗膜厚肉部及び余剰塗膜を精度良く除去することができる。
【００６４】
また、基体の内外周端部に付着した塗膜厚肉部と余剰塗膜を外面拭取り部材と内面拭取り部材により吸い取りながら拭取るとき、基体と、外面拭取り部材と内面拭取り部材との間の回転速度差を１０ｒｐｍ〜６０ｒｐｍにすることにより、塗膜除去処理を精度良く行うことができる。
【００６５】
さらに、この塗膜端部処理装置を、導電性を有する円筒の基体に感光層を形成する塗工装置の後段に設けて感光体を製造することにより、良質な特性の感光体を安定して製造することができる。
【図面の簡単な説明】
【図１】この発明の実施例の塗膜端部処理装置の構成図である。
【図２】上記実施例の拭取り装置の構成を示す断面図である。
【図３】余剰塗膜等の拭取り動作を示す構成図である。
【図４】第２の拭取り装置の構成を示す断面図である。
【図５】第３の拭取り装置の構成を示す断面図である。
【図６】他の実施例の塗膜端部処理装置の構成図である。
【符号の説明】
１；基体保持装置、２；拭取り装置、３；溶剤供給装置、４；液回収タンク、
５；基台、６；昇降ねじ、７；昇降モータ、８；昇降機、９；アーム、
１０；基体、、１１；基体保持部、１２；液回収槽、１３；拭取り桶、
１４；回転モータ、１５；回転伝達機構、１６；シリンダ、
１７；押付け機構、１８；拭取り部材保持部、１９；拭取り部材保持板、
２０；拭取り部材、２１、円盤状拭取り部材、２２；溶剤供給孔、
２３；液排出バルブ、２４；溶剤タンク、２５；溶剤供給ポンプ。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a coating film edge processing apparatus for removing an excess coating film at the edge of a coating film applied to the inner and outer peripheral surfaces of a cylindrical substrate such as a photosensitive member used in an electrophotographic copying machine or printer, and manufacture of a photosensitive member. It relates to the device.
[0002]
[Prior art]
As a method for producing an electrophotographic photoreceptor, a dip coating method is widely used in which a cylindrical substrate is held by a substrate holding device, dipped in a photosensitive paint, and then pulled up to form a coating film. In that case, a thick-film part and an excess coating film are formed in the lower end part of the base | substrate produced | generated. Thus, when a thick film or surplus film is formed on the edge of the photoconductor, for example, the thick film is thicker than the flat part, so an image using the photoconductor When the residual toner on the photosensitive member is removed with a cleaning blade in the forming process, there is a problem in that the contact of the cleaning blade is deteriorated to cause a cleaning failure or damage to the cleaning blade. . In addition, if an excess coating film is formed on the inner surface of the lower end of the substrate, the photoconductor will be deformed when a flange is attached to the end of the photoconductor, and problems such as dimensional accuracy and wearing strength will occur. . In addition, in order to improve image quality, there are cases where various abutting members are brought into contact with the end surface of the photoreceptor to give accuracy, but in that case, the accuracy is significantly reduced due to the presence of the coating film on the end surface. .
[0003]
In order to remove the excessive film on the edge of the photosensitive member which is harmful in this way, as shown in JP-A-6-202352, the substrate is immersed in a solvent that dissolves the film under specific conditions. As shown in Japanese Utility Model Publication No. 64-56872, etc., a porous flexible member is provided at a position facing the lower end of the base of the solvent tank so that the upper surface is exposed from the solvent liquid level. Then, the end of the substrate is pressed against the porous flexible member from above the liquid surface and immersed in a solvent, and after dipping for a certain period of time, the substrate is lifted from the solvent to remove the excess coating film.
[0004]
Further, as shown in JP-A-4-73778, the excess coating film is removed by spraying a solvent from the nozzle onto the excess coating film at the end of the substrate, or JP-A-61-2223844 or JP-A-9- As shown in Japanese Patent No. 152724, a blade is brought into contact with a surplus coating film portion or removed with a brush.
[0005]
[Problems to be solved by the invention]
However, the solvent dipping method cannot completely remove the surplus coating film, etc., and the cylindrical substrate is immersed in the solvent. May be removed. In addition, the method in which the edge of the substrate is pressed against the porous flexible member and immersed in the solvent is such that the excess coating film on the edge of the substrate adheres to the upper surface of the porous flexible member, and the removal accuracy is improved by repeated processing. It gets worse.
[0006]
Further, even a solvent cleaning method in which a solvent is sprayed cannot be completely cleaned, and a large amount of solvent is required. Furthermore, the method of removing with a blade or brush depends on the adhesiveness of the blade or the like, but the reproducibility is poor, so complete removal cannot be achieved and there is a risk of damaging a normal coating film or substrate. .
[0007]
The present invention provides a coating film edge processing apparatus and a photoconductor manufacturing apparatus capable of improving the above disadvantages and accurately and stably removing a coating thick part and an excess coating film at an end of a cylindrical substrate. It is intended to provide.
[0008]
[Means for Solving the Problems]
The coating film edge processing apparatus according to the present invention includes a substrate holding device that holds and lifts a cylindrical substrate, and is rotatably provided at the center of the liquid recovery tank and the liquid recovery tank. A wiping device having an outer surface wiping member comprising an open cell foam having a cell diameter of 0.5 mm to 2 mm , an wiping container having an inner surface wiping member, a rotating mechanism for rotating the wiping container, a solvent tank, It has a solvent supply pump, a solvent supply device that supplies the solvent to the wiping container, and a liquid recovery tank that recovers the solvent discharged from the wiping container to the liquid recovery tank. Lower the wiper to the position of the outer wiper and inner wiper, press the outer and inner peripheral surfaces of the lower end of the base against the outer wiper and inner wiper, and rotate the wiper However, the coating adhered to the inner and outer peripheral edges of the substrate It is characterized in that the film thickness portion and the excess coating film are wiped off while being sucked by the outer surface wiping member and the inner surface wiping member.
[0016]
Further, when wiping the thick coating portion and the excess coating film adhering to the inner and outer peripheral edge portions of the base body with the outer surface wiping member and the inner surface wiping member, the base body, the outer surface wiping member and the inner surface wiping member, The rotational speed difference between the two is preferably 10 rpm to 60 rpm.
[0017]
The photoreceptor manufacturing apparatus according to the present invention is characterized in that the coating film edge processing apparatus is provided at a subsequent stage of a coating apparatus for forming a photosensitive layer on a conductive cylindrical substrate.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
The coating film edge processing apparatus of this invention has a substrate holding device, a wiping device, a solvent supply device, and a liquid recovery tank. The substrate holding device holds and lifts the cylindrical substrate. The wiping device is rotatably provided at a central portion of the liquid recovery tank and the liquid recovery tank, and includes a wiping container having an outer surface wiping member and an inner surface wiping member made of a flexible porous material, and a wiping container And a rotation mechanism unit that rotates the motor. The solvent supply device has a solvent tank and a solvent supply pump, and supplies the solvent to the wiping container. The liquid recovery tank recovers the solvent discharged from the wiping container to the liquid recovery tank.
[0019]
When removing the thick film portion and surplus coating film adhering to the inner and outer peripheral edges of the substrate with this coating film edge processing apparatus, supplying the solvent to the outer surface wiping member and the inner surface wiping member, Rotation is given between the wiping members, and the thick coating portions and the surplus coating portions adhering to the inner and outer peripheral edges of the substrate are wiped off by each wiping member. After wiping off the thick coating part and surplus coating film adhering to the inner and outer peripheral edges of the substrate, the outer surface wiping member and the inner surface wiping member are supplied with a solvent to the outer surface wiping member and the inner surface wiping member. Remove the adhered film.
[0020]
【Example】
FIG. 1 is a block diagram of a coating film edge processing apparatus used in a photoconductor manufacturing apparatus according to an embodiment of the present invention. As shown in the figure, the coating film edge processing apparatus includes a substrate holding device 1, a wiping device 2, a solvent supply device 3, and a liquid recovery tank 4. The substrate holding device 1 includes a lifting screw 6 provided on a base 5, a lifting motor 7 that rotates the lifting screw 6, a lifting device 8 that moves up and down by the rotation of the lifting screw 6, and a tip of an arm 9 provided in the lifting device 8. It has a substrate holding portion 11 provided at the lower portion and holding a cylindrical substrate 10 that forms a photoreceptor.
[0021]
The wiping device 2 wipes the rotation of the liquid recovery tank 12, a wiping rod 13 that is rotatably provided at the center of the liquid recovery tank 12, a rotation motor 14 that rotates the wiping rod 13, and the rotation motor 14. And a rotation transmission mechanism 15 having a pulley, a belt, and the like that transmit to the handle 13. The liquid recovery tank 12 is connected to the side thereof by a pressing mechanism 17 connected to the forward / backward cylinder 16, and the lower end of the liquid recovery tank 12 is connected to the liquid recovery tank 4. As shown in the cross-sectional view of FIG. 2, the wiping bar 13 includes a wiping member holding part 18 formed on a column at the center of the inside, and an intermediate part of the wiping member holding part 18. A disc-shaped wiping member holding plate 19 is provided at a position having a certain height from the bottom surface. A wiping member 20 made of a porous material, such as polyethylene, polypropylene, Teflon, polyurethane, synthetic rubber, silicon, or the like, is provided at the distal end of the wiping member holding portion 18 and is wiped. On the upper surface of the member holding plate 19, a disc-shaped wiping member 21 made of a porous material having flexibility is provided. The wiping member holding portion 18 of the wiping bar 13 has a solvent supply hole 22 penetrating from the lower end portion to the attachment portion of the wiping member 20. Further, the bottom of the wiping bar 13 has a liquid discharge port to which a liquid discharge valve 23 is attached.
[0022]
The solvent supply device 3 includes a solvent tank 24, a solvent supply pump 25, and a seal portion 26, and the solvent tank 24 is connected to the solvent supply hole 22 of the wiping member holding portion 18 via the solvent supply pump 25 and the seal portion 26. ing.
[0023]
In the coating film edge processing apparatus configured as described above, the operation when removing the thick coating part and the excess coating film formed on the lower end part of the substrate 10 after coating the coating film on the outer peripheral surface is performed. This will be described with reference to the process diagram of FIG.
[0024]
First, the solvent supply pump 25 of the solvent supply device 3 was driven with the liquid discharge valve 23 of the wiper 13 closed, and the solvent in the solvent tank 24 was provided in the wiping member holding portion 18 of the wiping device 2. The solvent is supplied from the solvent supply hole 22 to the wiping trough 13 through the wiping member 20, and the disc-like wiping member 21 is impregnated with the solvent. After the disc-like wiping member 21 is impregnated with the solvent, the drive of the solvent supply pump 25 is stopped, the liquid discharge valve 23 is opened, and the solvent in the wiping trough 13 is recovered in the liquid recovery tank 4.
[0025]
As shown in FIG. 3A, the coated substrate 10 held by the substrate holding device 1 in the state where the disk-like wiping member 21 is impregnated with the solvent is the wiping member holding portion of the wiping bar 13. The liquid recovery tank 12 is moved by the cylinder 16 so as not to contact the wiping member 20 and the wiping member 20, and the wiping bar 13 is aligned with the base body 10. In this state, the lifting motor 7 of the substrate holding device 1 is driven to lower the substrate 10 in the vertical direction, and the lower end portion of the substrate 10 is moved to the position of the wiping member 20 attached to the wiping member holding portion 18. And as shown in FIG.3 (b), the lower end part of the base | substrate 10 is pressed with the fixed depth with respect to the disk-shaped wiping member 21 impregnated with the solvent. Next, the rotary motor 14 is driven to rotate the wiping bar 13 at a constant rotational speed. The disk-like wiping member 21 is rotated by the rotation of the wiping bar 13 and wipes and removes the thick part of the coating film and the excessive coating film adhering to the outer peripheral end face and the front end face of the lower end part of the substrate 10. After rotating the wiping bar 13 for a certain time, the drive of the rotary motor 14 is stopped, and the rotation of the wiping bar 13 is stopped.
[0026]
Next, as shown in FIG. 3 (c), the lifting motor 7 of the substrate holding device 1 is driven to raise the substrate 10, and the lower end of the substrate 10 is separated from the disc-like wiping member 21. Positioning is performed so that the thick part of the coating film on the surface and the surplus coating film come to the position of the wiping member 20, and the rising of the substrate 10 is stopped. In this state, the cylinder 16 is driven to move the liquid recovery tank 12 by a certain distance and press the wiping member 20 against the inner peripheral surface of the base body 10 with a certain pressure. Then, the solvent supply pump 25 of the solvent supply device 3 was driven with the liquid discharge valve 23 of the wiping bar 13 opened, and the solvent in the solvent tank 24 was provided in the wiping member holding portion 18 of the wiping device 2. While supplying the wiping member 20 from the solvent supply hole 22, the rotary motor 14 is driven to rotate the wiping bar 13 at a constant rotational speed, for example, 10 rpm to 100 rpm. The wiping member 20 attached to the wiping member holding portion 18 by the rotation of the wiping bar 13 rotates along the inner peripheral end surface of the base 13, and the thick part of the coating film or surplus adhered to the inner peripheral end surface of the base 13. Wipe off the coating. After the wiping rod 13 is rotated for a certain period of time, the drive of the rotary motor 14 is stopped to stop the rotation of the wiping rod 13 and the drive of the solvent supply pump 25 is stopped, as shown in FIG. Then, the cylinder 16 is driven to move the liquid recovery tank 12 by a certain distance to separate the wiping member 20 from the inner peripheral surface of the base body 10. And the raising / lowering motor 7 is driven and the base | substrate 10 is raised to an initial position value.
[0027]
Next, as shown in FIG. 3 (e), the liquid discharge valve 23 of the wiping rod 13 is closed and the solvent supply pump 25 of the solvent supply device 3 is driven to remove the solvent in the solvent tank 24. The wiping trough 13 is filled with a solvent and held for a certain period of time. By dissolving the coating film adhered to the surface of the wiping member 20 by the solvent filled in the wipe tub 13 discotic wiping member 21, wiped the surface of the wiping member 20 and the disk-like wiper member 21 Make it clean with no paint film. Thereafter, as shown in FIG. 3 (f), the liquid discharge valve 23 is opened, and the solvent in which the coating film in the wiping trough 13 is dissolved is discharged to the liquid recovery tank 4 to prepare for the next processing of the substrate 10. When discharging the solvent in which the coating film in the wiping bar 13 is dissolved, the wiping member holding plate 19 having the disc-shaped wiping member 21 is provided at a position having a certain height from the bottom surface of the wiping bar 13. Therefore, the solvent in which the coating film is dissolved can be discharged smoothly. After the solvent in which the coating film in the wiping trough 13 is dissolved is discharged to the liquid recovery tank 4, when the solvent is again flowed from the solvent tank 24 to the wiping trough 13, the wiping member 20 and the disc-shaped wiping member 21. As a result, the wiping member 20 and the disc-shaped wiping member 21 can be moisturized with a solvent.
[0028]
Although the said Example demonstrated the case where the liquid collection tank 12 was moved by the cylinder 16 in order to press the wiping member 20 to the internal peripheral surface of the base | substrate 10, moving mechanisms, such as a cylinder, are provided in the arm 9 holding the base | substrate 10. FIG. The substrate 10 may be moved in the horizontal direction and the vertical method with the liquid recovery tank 12 fixed.
[0029]
Moreover, although the said Example demonstrated the case where the wiping member 20 and the disk-shaped wiping member 21 were formed in one layer with porous materials, such as polyethylene, you may form by laminating | stacking multiple layers of porous materials. . Further, the wiping member 20 and the disc-like wiping member 21 may be formed by overlapping a mesh plate material such as a mesh on the surface of the porous material, or fixing the mesh plate material with a spring or the like.
[0030]
Moreover, although the said Example demonstrated the case where the solvent supply hole 22 which supplies a solvent to the wiping member holding | maintenance part 18 of the wiping trough 13 was provided, you may provide a solvent supply pipe | tube in the upper part of the wiping member 13. FIG. .
[0031]
Furthermore, although the said Example demonstrated the case where the disk-shaped wiping member 21 wiped away the excess coating film etc. of the outer peripheral end surface of the base | substrate 10, as shown in sectional drawing of FIG. An outer surface wiping member 30 is provided on a part of the substrate 10, and the wiping rod 13 is rotated so that the wiping member 20 and the outer surface wiping member 30 simultaneously remove excess coating on the inner peripheral end surface and the outer peripheral end surface of the base 10. Anyway.
[0032]
Further, as shown in the sectional view of FIG. 5, instead of the wiping bar 13, the central portion has the holding portion 31 of the wiping member 20, and the outer peripheral portion has the holding portion 32 of the outer surface wiping member 30. Alternatively, the rotating member 33 having the solvent supply hole 22 may be used in each of the holding portions 31 and 32 to remove the excess coating film on the inner peripheral end surface and the outer peripheral end surface of the base 10 at the same time.
[0033]
Further, the case where the wiping bar 13 and the rotating member 33 are rotated by the rotary motor 14 has been described. However, a rotation mechanism is provided at the distal end portion of the arm 9 that holds the base body 10, the base body 10 is rotated, and the front end of the base body 10 is rotated. You may make it wipe off the excess coating film adhering to the part.
[0034]
In the above embodiment, the case where one substrate is held in the substrate holding device 1 has been described. However, as shown in FIG. 6, a plurality of substrate holding portions 11 are provided on the arm 9 of the substrate holding device 1, and the liquid recovery tank 12 is provided. Further, the wiping rods 13 and the shielding plates 27 corresponding to the number of the substrate holding portions 11 may be provided. In this way, the excess coating film and the like at the ends of the plurality of substrates 10 can be removed at a time.
[0035]
Next, for example, an undercoat layer, a charge generation layer, and a charge transport layer are formed on a conductive substrate 10 using a coating apparatus of a photoconductor manufacturing apparatus used in an electrophotographic image forming apparatus. A specific example will be described in the case where the excess coating film or the like at the end of the film substrate 10 is removed using an open-cell polyethylene foam having an average cell diameter of 0.8 mm as the wiping member 20 and the disc-like wiping member 21. .
[0036]
[Specific Example 1] After forming a coating film by immersing the cylindrical substrate 10 in an undercoat layer coating solution of the following components, the excess coating film and the like at the end were removed using methyl ethyl ketone as a solvent for removing the coating film. .
Undercoat layer coating liquid component TiO ₂ 90 parts by weight Thermosetting resin 150 parts by weight Methyl ethyl ketone 600 parts by weight Undercoat layer film thickness 5 μm
At this time, the degree of removal of the surplus coating film and the like was good, and no wiping residue was visually confirmed on the inner and outer surfaces, and there was no disturbance when wiping off, and the coating film could be removed uniformly. In addition, the repeatability was excellent, and the degree of removal remained unchanged even after multiple coating film removals.
[0037]
[Specific Example 2] After the cylindrical substrate 10 is immersed in the undercoat layer coating solution of the above components to form a coating film, the excess coating film at the end is removed using methylene chloride as a solvent for removing the coating film. did. Also at this time, the degree of removal was good, and no wiping residue could be confirmed on the inner and outer surfaces by visual observation, and the coating film could be uniformly removed without being disturbed during wiping.
[0038]
[Comparative Example 1] Excess coating film or the like of the undercoat layer of the specific example 1 was removed by a conventional solvent dipping method. The solvent used was methyl ethyl ketone, and the immersion time was 30 seconds and the number of immersions was 3 times. The coating film could not be completely removed, and a considerable amount of the coating film adhered to the inner surface and the outer surface. Moreover, the wiping off was disturbed by the fluctuation of the liquid level.
[0039]
[Comparative Example 2] Excess coating film or the like of the undercoat layer of Example 1 was removed by a scraping method using a brush. At this time, methylene chloride was used as a solvent. The coating on the inner and outer surfaces could hardly be confirmed visually, but was disturbed by the brush during wiping. In addition, the repeatability was poor and the cleanliness varied.
[0040]
[Example 3] After a cylindrical substrate 10 was immersed in a charge generation layer coating solution having the following components to form a coating film, the excess coating film at the end was removed using methyl ethyl ketone as a solvent for removing the coating film. .
Charge generation layer coating liquid component Azo pigment (A) 45 parts by weight Polyvinyl butyral 4.5 parts by weight Methyl ethyl ketone 2400 parts by weight The degree of removal was good and no wiping residue could be confirmed on the inner and outer surfaces by visual inspection. Was able to remove the coating uniformly without being disturbed. Moreover, it was excellent in repeatability, and the degree of removal was good without change even after multiple coating film removals.
[0041]
[Specific Example 4] After the cylindrical substrate 10 was immersed in a charge generation layer coating solution having the following components to form a coating film, the excess coating film at the end portion was removed using THF as a solvent for removing the coating film.
Charge generation layer coating liquid component τ-type metal-free phthalocyanine 30 parts by weight Polyvinyl butyral 20 parts by weight THF 1200 parts by weight The degree of removal of the coating film is good and no wiping residue can be confirmed on the inner and outer surfaces by visual inspection. The coating film could be removed uniformly without being disturbed. Moreover, it was excellent in repeatability, and the degree of removal was good without change even after multiple coating film removals.
[0042]
[Comparative Example 3] The charge generation layer of Specific Example 3 was removed by a conventional solvent immersion method. Methyl ethyl ketone was used as the solvent, and the immersion time was 30 seconds and the number of immersions was 3 times. The coating film could not be completely removed, and a considerable amount of the coating film adhered to the inner surface and the outer surface.
[0043]
[Comparative Example 4] The charge generation layer of Specific Example 4 was removed by a brush scraping method. The solvent was THF. The degree of removal of the coating film was inferior to that of Example 4, and a slight residue remained. Further, the degree of removal was not uniform and the degree of removal after multiple coating removals varied.
[0044]
[Example 5] After a cylindrical substrate 10 was immersed in a charge transport layer coating solution having the following components to form a coating film, end coating was removed using THF as a solvent for removing the coating film.
Charge generation layer coating liquid component Charge generation material (B) 180 parts by weight Polycarbonate resin 250 parts by weight THF 1520 parts by weight Silicon oil 0.04 parts by weight Charge generation layer film thickness 30 μm
The degree of coating film removal was good, and no wiping residue could be confirmed on the inner and outer surfaces by visual inspection, and the coating film could be removed uniformly without being disturbed during wiping. Moreover, it was excellent in repeatability, and the degree of removal was good without change even after multiple coating film removals.
[0045]
[Example 6] After the cylindrical substrate 10 is immersed in the charge transport layer coating solution of Example 5 to form a coating film, an excess coating film at the end is formed using methylene chloride as a solvent for removing the coating film. Removed. The degree of coating film removal was good, and no wiping residue was visually confirmed on the inner and outer surfaces, and the coating film could be removed uniformly without being disturbed during wiping. Moreover, it was excellent in repeatability, and the degree of removal was good without change even after multiple coating film removals.
[0046]
[Comparative Example 5] The charge generation layer of Specific Example 5 was removed by a conventional solvent immersion method. The solvent used was THF, the immersion time was 30 seconds, and the immersion frequency was 3 times. The coating film could not be completely removed, and a considerable amount of the coating film adhered to the inner surface and the outer surface.
[0047]
[Comparative Example 6] The charge generation layer of Specific Example 5 was removed by a brush scraping method. The solvent was THF. The degree of coating film removal was inferior to that of Example 5, and a slight residue remained.
[0048]
[Specific Example 7] An excess coating film or the like of the undercoat layer of Specific Example 1 was removed using a coating film edge processing apparatus for processing a plurality of, for example, 12 substrates 10 shown in FIG. At this time, the degree of removal of the coating film was good, and it was confirmed that no wiping residue was visually observed on the inner and outer surfaces of all twelve, and the coating film could be removed uniformly without being disturbed during wiping.
[0049]
[Specific Example 8] Using the coating film end treatment apparatus for processing 12 substrates 10 in the same manner as in Specific Example 7, the surplus coating film and the like of the charge generation layer in Specific Example 3 were removed. The degree of removal of the coating film was good, and no wiping residue was visually confirmed on the inner and outer surfaces of all twelve, and the coating film could be removed uniformly without being disturbed during wiping.
[0050]
[Specific Example 9] The coating film edge treatment apparatus for treating 12 substrates 10 in the same manner was used to remove the excess coating film of the charge transport layer of Specific Example 5 and the like. The degree of removal of the coating film was good, and no wiping residue was visually confirmed on the inner and outer surfaces of all twelve, and the coating film could be removed uniformly without being disturbed during wiping.
[0051]
[Specific Example 10] The results of removing the excess coating film on the charge transport layer by sequentially switching the rotation speed of the wiping bar 13 between 5 rpm and 140 rpm in Specific Example 3 are shown in the following table.
[0052]
[Table 1]

[0053]
As shown in the above table, the degree of removal of the coating film was good in the range of 10 to 100 rpm, but it was confirmed that the faster the rotation speed, the shorter the time required for the treatment. Further, if it is slower than 10 rpm, wiping remains are generated, and if it is faster than 100 rpm, too much tension is applied to the wiping member 20 and the disc-like wiping member 21, and a break occurs when repeated processing is performed. In consideration of the time required for the treatment and the durability of the wiping member 20 and the disc-like wiping member 21, it was confirmed that about 20 rpm to 60 rpm was the best.
[0054]
[Comparative Example 7] A base 10 coated with a subbing layer of a specific example 1 by a conventional solvent dipping method was used using a closed cell foam having a cell diameter of 0.5 mm, and methyl ethyl ketone was used as a solvent for removing a coating film. The excess coating film was removed. Since the coating film removal degree did not absorb the coating film in the closed cell foam, the wiping efficiency was poor, and wiping residue was confirmed.
[0055]
[Specific Example 11] The undercoat layer of Specific Example 1 was used as a solvent for removing a coating film by using a wiping member 20 and a disk-shaped wiping member 21 having a cell diameter of about 0.3, 0.5, 0.8, 2.0, and 3.0 mm. Excess coating film and the like were removed using methyl ethyl ketone. The following table shows the results of performing 100 removal processes and confirming the degree of removal.
[0056]
[Table 2]

[0057]
As shown in the above table, it was confirmed that 0.5 mm to 2 mm was optimal for the wiping member 20 and the disk-shaped wiping member 21.
[0058]
【The invention's effect】
As described above, the present invention has an average cell diameter of 0.5 mm when removing the thick film portion and the surplus coating film adhering to the inner and outer peripheral edges of the coating film applied to the cylindrical substrate. Since wiping is performed while wiping with a wiping member made of an open-cell foam of ˜2 mm, the thick-walled part and the surplus coating film adhering to the inner and outer peripheral edges of the substrate can be removed reliably and continuously. Even if the removal is performed, the cell is not clogged and the removal process can be stably repeated.
[0059]
In addition, while supplying the solvent to the wiping member, rotation is applied between the base and the wiping member, and the thick coating part and the excess coating attached to the inner and outer peripheral edges of the base are wiped off by the wiping member. By taking the film, it is possible to accurately remove the thick film portion and the surplus coating film adhering to the inner and outer peripheral edges of the substrate.
[0064]
Further, when wiping the thick coating portion and the excess coating film adhering to the inner and outer peripheral edge portions of the base body with the outer surface wiping member and the inner surface wiping member, the base body, the outer surface wiping member and the inner surface wiping member, The coating film removal process can be performed with high accuracy by setting the difference in rotational speed between 10 and 60 rpm.
[0065]
Furthermore, by providing this coating film edge processing apparatus after the coating apparatus for forming a photosensitive layer on a conductive cylindrical substrate, a photosensitive member having a good quality can be stably produced. Can be manufactured.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a coating film edge processing apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a configuration of the wiping device of the embodiment.
FIG. 3 is a configuration diagram showing a wiping operation of an excess coating film or the like.
FIG. 4 is a cross-sectional view showing a configuration of a second wiping device.
FIG. 5 is a cross-sectional view showing a configuration of a third wiping device.
FIG. 6 is a configuration diagram of a coating film edge processing apparatus according to another embodiment.
[Explanation of symbols]
1; substrate holding device, 2; wiping device, 3; solvent supply device, 4; liquid recovery tank,
5; Base, 6; Lifting screw, 7; Lift motor, 8; Lift, 9; Arm,
10; Substrate, 11; Substrate holding part, 12; Liquid recovery tank, 13;
14: Rotation motor, 15: Rotation transmission mechanism, 16: Cylinder,
17; pressing mechanism, 18; wiping member holding part, 19; wiping member holding plate,
20; Wiping member, 21, disk-shaped wiping member, 22; solvent supply hole,
23; liquid discharge valve, 24; solvent tank, 25; solvent supply pump.

Claims

A substrate holding device that holds and lifts a cylindrical substrate, and a liquid recovery tank and a central part of the liquid recovery tank are rotatably provided, and the average cell diameter is 0.5 A wiping device having an outer surface wiping member and an inner surface wiping member made of open-cell foam of mm to 2 mm, a rotating mechanism that rotates the wiping container, a solvent tank, and a solvent supply pump. Having a solvent supply device for supplying the solvent to the wiping container and a liquid recovery tank for recovering the solvent discharged from the wiping container to the liquid recovery tank,
With the substrate holding device, the lower end of the substrate is lowered to the position of the outer surface wiping member and the inner surface wiping member of the wiping device, and the outer peripheral surface and inner peripheral surface of the lower end of the substrate are changed to the outer surface wiping member and the inner surface wiping member. Rotating the wiping container while pressing, and wiping off the thick coating part and surplus coating film adhering to the inner and outer peripheral edges of the substrate while sucking with the outer surface wiping member and the inner surface wiping member Membrane edge processing equipment.

When wiping while removing the thick coating portion and the excess coating film adhering to the inner and outer peripheral edge portions of the substrate by the outer surface wiping member and the inner surface wiping member, the substrate, the outer surface wiping member and the inner surface wiping member The coating film edge processing apparatus of Claim 1 which makes a rotational speed difference between 10 rpm-60 rpm.

An apparatus for manufacturing a photoreceptor, wherein the coating film edge processing apparatus according to claim 1 or 2 is provided in a subsequent stage of a coating apparatus for forming a photosensitive layer on a conductive cylindrical substrate.