JP4086016B2 - Thermoelectric module mounting package - Google Patents

Description

  The present invention relates to a package on which a thermoelectric module utilizing a thermoelectric conversion function of a Peltier element is mounted, and more particularly to a thermoelectric module mounting package having a post electrode for connecting to an electrode of the package by wire bonding.

  In the thermoelectric module, a lower electrode and an upper electrode are formed on a lower substrate and an upper substrate, respectively, and the lower substrate and the upper substrate are arranged in parallel so that the lower electrode and the upper electrode face each other, and a plurality of thermoelectric modules are interposed therebetween. Elements are arranged. Two thermoelectric elements are joined to each lower electrode and upper electrode, and two adjacent thermoelectric elements provided on two adjacent lower electrodes are connected by one upper electrode at the upper end. Thus, a plurality of thermoelectric elements are connected in series by the lower electrode and the upper electrode.

  FIG. 12 (a) is a plan view showing a conventional general thermoelectric module, and FIG. 12 (b) is a side view thereof. The thermoelectric element 3 is arranged between the lower substrate 1 and the upper substrate 2 in the above-described manner. Are connected in series. The thermoelectric elements at both ends of the serially connected thermoelectric elements are respectively connected to electrode pads 4 formed on the lower substrate 1. Further, a lead wire 5 such as a Sn-plated Cu wire having a diameter of 0.3 mm is joined to the electrode pad 4 by soldering. Are connected to the electrode pads.

  However, the method of using the lead wire 4 to lead out the terminals of the thermoelectric module to the outside requires the lead wire 4 to be soldered manually, and this connection process is complicated.

  Therefore, recently, as shown in FIG. 13, a post electrode 6 is provided instead of the electrode pad 4 of the thermoelectric module, and as shown in FIG. 14, the post electrode 6 and the electrode pad 7 of the package are made of Au wire or the like. A method of wire bonding using a bonding wire 8 is proposed (see Patent Document 1). This connection by wire bonding does not require soldering work and is easy to automate.

Patent No. 3082170

  However, the thermoelectric module provided with the conventional post electrode has the following drawbacks. FIGS. 15A and 15B are plan views showing the case where the electrode pad 4 and the electrode pads 7a and 7b of the package are connected by the lead wire 5. FIG. As shown in FIG. 15A, when the electrode pads 4 of the thermoelectric module are connected to the electrode pads 7a and 7b arranged on both sides thereof, the equal-sized lead wire 5 becomes the central axis of the thermoelectric module. When the soldering is performed by extending symmetrically about the AA ′ axis, and as shown in FIG. 15B, the electrode pads 7c and 7d of the package are disposed on one side with respect to the thermoelectric module In this case, the lead wires 5c and 5d can be freely bent and the length can be freely set only by changing the lengths of the lead wires 5c and 5d connecting the electrode pad 4 and the electrode pads 7c and 7d. There is a high degree of freedom in attaching the wires.

  However, in the case of the post electrode, as shown in FIG. 16A, there is no problem when the post electrode 6 and the electrode pads 7 on both sides thereof are connected by the Au wire 8, but as shown in FIG. Thus, when the electrode pads 7c and 7d of the package are located on one side of the thermoelectric module, the Au wire 8c connected to the post electrode 6 farther from the electrode pads 7c and 7d out of the Au wires 8c and 8d. Becomes too long and bonding becomes difficult. For this reason, the positions of the electrode pads 7c and 7d on the package side are greatly restricted.

  Further, as shown in FIG. 16C, when the post electrode 6 of the thermoelectric module and the electrode pads 7c and 7d of the package are connected, if the wire 8c and the wire 8d intersect, an electrical short May occur. Since the lead wire is relatively thick and has rigidity, the short circuit can be avoided by forming the lead wires so that the two lead wires do not come into contact with each other even when the wirings intersect. However, it is difficult to form a bonding wire because it is thin and lacks rigidity, and when performing automation by wire bonding, it is difficult to perform the operation of forming the bonding wire in advance.

  The present invention has been made in view of such problems, and a thermoelectric module mounting package that can adjust the position of the post electrode in accordance with the position of the electrode pad on the package side and smoothly wire-bond both of them. The purpose is to provide.

A thermoelectric module mounting package according to the present invention is a thermoelectric module mounting package having a thermoelectric module and a pair of electrode pads connected to the thermoelectric module. The thermoelectric module includes an upper substrate, a lower substrate having an extending portion extending in the arrangement, single direction relative to the substrate so as to face a plurality of the lower electrode and the upper electrode formed on the opposing surfaces of the lower substrate and the upper substrate the thermoelectric element group consisting of series and / or parallel-connected plurality of thermoelectric elements by the lower and upper electrodes provided between the lower electrode and the upper electrode, the extended portion of the front Symbol lower substrate and wire respectively connected a pair of post electrode disposed in asymmetrical positions with respect to the central axis parallel to the extending direction of Oite the lower substrate, and the post electrodes and the electrode pads, the Anda lead layer pair formed asymmetrically with respect to the central axis in the extending portion of the front Symbol lower substrate co when connected to the thermoelectric elements at both ends of photoelectric element array, said pair The lead layer extends from two locations along the edge on the upper substrate side of the extension portion to the extension portion, and one lead layer faces the edge of the extension portion far from the upper substrate. And extending toward the other lead layer side edge of the extension portion, and the other lead layer is formed only along the other lead layer side edge of the extension portion. Each of the post electrodes is disposed at a position closest to the electrode pad on the lead layer and is connected to the lead layer .

In the present invention, since the post electrode is connected to the lower electrode at the end by the lead layer, the post electrode can be disposed at an arbitrary position on the lower substrate. For this reason, the position of the post electrode can be arbitrarily determined in accordance with the position of the electrode pad of the package on which the thermoelectric module is mounted. Can be connected to the post electrode .

According to the present invention, is provided with the lead layer of the non-symmetrically on the lower substrate, a post electrode, can be placed in any position in accordance with the electrode pads of the package thermoelectric modules are arranged, Therefore, Regardless of the position of the electrode pad of the package, the post electrode and the electrode pad can be easily connected by wire bonding. Therefore, the connection work can be automated, and the manufacturing cost can be reduced.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1A and 1B show a first embodiment of the present invention, in which FIG. 1A is a plan view, FIG. 1B is a side view, and FIG. A thermoelectric element 11 composed of a plurality of Peltier elements is disposed between an insulating lower substrate 10 such as Al ₂ O ₃ and the upper substrate 12, and the opposing surfaces of the lower substrate 10 and the upper substrate 12 are respectively disposed on the opposing surfaces. A plurality of lower electrodes and upper electrodes (both not shown) are formed. Then, two thermoelectric elements are joined on each lower electrode, and adjacent thermoelectric elements 11 on adjacent lower electrodes are connected by one upper electrode, whereby a plurality of thermoelectric elements 11 are connected to the lower electrodes. The electrodes and the upper electrode are connected in series.

  Lead layers 16a and 16b are connected to the lower electrodes of the two thermoelectric elements arranged at the ends of the series connection, and post electrodes 15a and 15b are joined to the ends of the lead layers 16a and 16b. Has been. The upper electrode on the upper substrate 12 and the lower electrode on the lower substrate 10 are formed by, for example, forming a Cu layer on the upper substrate 12 and the lower substrate 10 by plating and patterning the Cu layer. Alternatively, after forming a thin metallized layer on the substrate surface and patterning the metallized layer into a predetermined shape, a Cu layer having a predetermined pattern is formed thereon by electrolytic plating, and then a thin metallized layer between the patterns is formed. By removing, the Cu layer can be patterned.

  In patterning for forming the lower electrode, the lead layers 16a and 16b can be formed by patterning the Cu layer so as to extend from the lower electrode at the end of the series connection. The post electrodes 15a and 15b are formed by, for example, plating a Ni layer with a thickness of 3 μm on both front and back surfaces of a 2.5 mm thick Cu plate, and further forming an Au layer with a thickness of 1 μm by plating. Then, it is cut by dicing so that one side has a square length of 0.7 mm. The rectangular parallelepiped post electrodes 15a and 15b are disposed on the Cu lead layers 16a and 16b, and the Au layers of the post electrodes 15a and 15b and the Cu lead layers 16a and 16b are soldered to form the post electrodes 15a and 15b. Is fixed to the Cu lead layers 16a and 16b. In many cases, a Ni plating layer (for example, a thickness of 3 μm) is formed on the Cu surface of the lower electrode, the upper electrode, and the Cu lead layer, and Au plating is further provided on the Ni plating layer. A layer (for example, a thickness of 1 μm) may be formed.

  The post electrode may be made of Al instead of Cu. Only one side of a pure Al plate with a thickness of 2.5 mm is formed by plating a Ni layer with a thickness of 3 μm and an Au layer with a thickness of 0.5 μm by plating. Cut to a square with a length of 0.7 mm. The surface of the post electrode on which Ni and Au are plated and the Cu lead layer are joined by soldering. The upper surface of the post electrode may be a smooth Al surface.

  In the case of this Al post electrode, it is preferable to connect to the Al post electrode using an Al wire having the best bonding properties. The Al wire can be made thicker than the Au wire, and a wire having a diameter of 100 μm or 200 μm, or even 500 μm, which is difficult with the Au wire, can be used. For this reason, it is easy to flow a large current through the wire, and in this respect, the Al wire is more advantageous than the Au wire. However, when the height of the joint surface where the Al wire is connected is different, or when the connection distance is long, the connection reliability is lowered. For this reason, in this embodiment, it is necessary to install Al post electrodes so that the heights are as close as possible to the electrodes of the package even in the wide Cu lead layer. Conversely, the Al post electrode is effective when it has a wide Cu lead layer as in this embodiment. When using an Al wire, even if the post electrodes are not all formed of Al, good bonding properties can be maintained as long as at least the upper surface of the post electrode is formed of Al. The surface of the electrode to be bonded on the package side is preferably formed of Al. In the present invention, Cu or Al includes Cu alloy or Al alloy.

  A metallized layer 13 for soldering the thermoelectric module to a package or the like is formed on the outer surface (lower surface) of the lower substrate 10 of the thermoelectric module. A metallized layer 14 for soldering elements such as LD (semiconductor laser diode) and thermistor is formed on the outer surface (upper surface) of the upper substrate 12 of the thermoelectric module. These metallized layers 13 and 14 are plated layers having a three-layer structure in which, for example, a Cu layer, a Ni layer, and an Au layer are formed on the lower substrate 10 and the upper substrate 12 by plating. In this embodiment, for example, the height of the post electrode is 2.5 mm as described above, the length of the upper substrate 12 is 10 mm, the length of the lower substrate 10 is 12 mm, and the width of the upper substrate 12 and the lower substrate 10. Therefore, the lower substrate 10 extends 2 mm longer than the upper substrate 12. In this extended region (hereinafter referred to as a patterning region) having a width of 6 mm and a length of 2 mm, the lead layers 16 a and 16 b are Patterned. When viewed from the upper surface with respect to the upper substrate 12, the lead layer 16b extends slightly beyond the longitudinal direction, that is, the direction in which the lower substrate 10 is extended (hereinafter, this direction is referred to as the longitudinal direction of the thermoelectric module). 16a extends to the vicinity of the lead layer 16b so as to occupy the patterning region other than the lead layer 16b.

  Thus, in the thermoelectric module of the present embodiment, a pair of post electrodes 15a and 15b are arranged in the vicinity of one side edge of the thermoelectric module. Therefore, as shown in FIG. 1B, even when the electrode pad on the package side to be connected to the post electrodes 15a and 15b is arranged on one side with respect to the thermoelectric module, the post electrodes 15a and 15b. Is disposed in opposition to the electrode pad on the package side and in the vicinity thereof, the post electrodes 15a and 15b and the electrode pad on the package side can be easily connected by a bonding wire using a wire bonder.

  For this reason, in this embodiment, the bonding wire to be connected to the post electrode does not become too long to be bonded, and wire bonding can be performed reliably. In this way, the position of the post electrode of the thermoelectric module can be arbitrarily changed by the lead layers 16a and 16b, and can easily be adjusted to the position of the electrode pad of the package.

  The lead layer 16a can also be formed in a belt-shaped L-shaped pattern as indicated by a broken line in FIG.

  Further, as shown in FIG. 2, if a post electrode 18a is disposed in the base portion of the L-shaped strip-shaped lead layer 17a, that is, in the vicinity of the lower electrode, the post electrode 18a and the lead layer 17b are provided. The arranged post electrodes 18b are arranged on both sides of the thermoelectric module, and can correspond to the case where the electrode pads on the package side are located on both sides of the thermoelectric module.

  FIGS. 3A to 3C are plan views showing other embodiments of the present invention. In these embodiments, the lead layers 19a and 19b extend in an L shape, and once extend in the longitudinal direction of the thermoelectric module, they are bent vertically and extend in parallel to each other.

  In FIG. 3A, post electrodes 20a and 20b are arranged at the tips of the lead layers 19a and 19b, respectively. 3B, the post electrode 21a is disposed at the bent portion of the lead layer 19a, and the post electrode 21b is disposed at the tip of the lead layer 19a. In FIG. 22b is disposed at the bent portion of the lead layer 19b, and the post electrode 22a is disposed at the tip of the lead layer 19a.

  FIGS. 4A to 4C are diagrams showing still another embodiment of the present invention. 4A and 4B, not only one end portion of the lower substrate 20 in the longitudinal direction but also one side portion is secured as a patterning region in which the lower substrate 20 extends from the upper substrate 22. . The lead layer 23a extends once in the longitudinal direction of the thermoelectric module, then bends vertically and proceeds laterally along the edge of the lower substrate 20, and further bends vertically at the corner portion to form side edges of the lower substrate 20. Proceed along. The lead layer 23 b extends in an L shape along the edge of the upper substrate 22 and the side edge of the upper substrate 22.

  In FIG. 4A, the post electrodes 24a and 24b are arranged at portions extending along the side edges of the thermoelectric module in the lead layers 23a and 23b. In this case, the post electrodes 24a and 24b can be arranged at arbitrary positions in the longitudinal direction of the thermoelectric module, and the electrode pads of the package can be arranged at any position along the side edge of the thermoelectric module. Can respond.

  In FIG. 4B, the post electrode 25a is disposed at the tip of the portion extending along the side edge of the thermoelectric module in the lead layer 23a, and the post electrode 25b is along the edge of the upper substrate 22 in the lead layer 23b. It arrange | positions at the front-end | tip part of the part which extends. Thus, since the lead layers 23a and 23b have portions extending in the longitudinal direction of the thermoelectric module, the post electrodes can be arbitrarily arranged according to the electrode pads of the package.

  In FIG. 4C, a pair of lead layers 26 a and 26 b are formed on the lower substrate 10 in a patterning region extending from the upper substrate 22 at the peripheral edge thereof. The lead layer 26a extends along the four edges of the lower substrate 20, and the lead layer 26b extends along the four edges of the lower substrate 20 inside the lead layer 26a.

  As described above, in FIG. 4C, the lead layers 26a and 26b are formed along the four sides of the thermoelectric module, and the post electrodes 27a and 27b can be arranged at arbitrary positions. Therefore, regardless of the position of the electrode pad on the package side, the electrode pad and the post electrode can always be connected by the bonding wire at the shortest distance. As described above, the post electrodes 27a and 27b only need to be asymmetric in at least one direction with respect to a plurality of directions.

  FIGS. 5A and 5B are diagrams showing another embodiment of the present invention. The lead layers 31a and 31b are patterned by the Cu layer so as to intersect with each other. However, as shown in FIG. 5B, the lead layer 31b is interrupted at the portion intersecting with the lead layer 31a. In this disconnected portion, the lead layer 31b is connected by a bridge component 33 that straddles the lead layer 31a in a non-contact manner. The bridge part 33 can be formed of a Cu plate. It is desirable that the height of the bridge part 33 is lower than that of the post electrodes 32a and 32b so that the bridge part 33 does not come into contact during bonding.

  6 (a) and 6 (b) are diagrams showing another embodiment of the present invention. In FIG. 6A, post electrodes 40a, 40b, and 40c are provided in the thermoelectric module shown in FIG. The lead layer 17b is provided with one post electrode 40c, but the lead layer 17a is provided with two post electrodes 40a and 40b. Therefore, either the post electrode 40a or the post electrode 40b can be selected according to the position of the electrode pad of the package to be mounted.

  In FIG. 6B, each of the lead layers 19a and 19b is provided with two post electrodes 41a and 41b and post electrodes 41c and 41d. In this embodiment, either the post electrodes 41a and 41b or the post electrodes 41c and 41d can be selected according to the position of the electrode pad of the package to be mounted.

  FIGS. 7A and 7B are diagrams showing another embodiment of the present invention. In FIGS. 7A and 7B, the lead layers 50a and 50b are formed in a wide surface shape instead of a belt shape. Therefore, the post electrodes 51a and 51b and the post electrodes 52a and 52b can be joined to arbitrary positions of the vast lead layers 50a and 50b. Since the placement of the post electrodes 52a and 52b is two-dimensionally more flexible, the post electrodes 52a and 52b are arranged to be the shortest distance from each other regardless of the position of the electrode pad of the package, and the position is finely adjusted. can do. From the viewpoint of preventing wire crossing, it is preferable that the width of the lead is twice or more than the width of the post electrodes 52a and 52b.

  FIGS. 8A and 8B are diagrams showing another embodiment of the present invention. 8A and 8B, one lead layer 53a is formed to be larger than the other lead layer 53b, and this lead layer 53a is patterned on the lower substrate 10 that is not covered by the upper substrate 12. Occupies most of the area. In this case, the position of the post electrode 55b is restricted, but the post electrode 55a can be provided at an arbitrary position of the vast lead layer 53a. For example, of the pair of lead layers 53a and 53b, the width of one lead layer 53b is substantially the same as that of the post electrode 54b, while the other lead layer 53a can be wider. . However, the width of the other lead layer 53a can be formed to the full width of the lower substrate (patterning region). In this case, it is possible to freely arrange the other post electrode 54a while minimizing the distance to the one post electrode 54b regardless of the location of the electrode pad of the package.

  When the post electrode is disposed at an arbitrary position of the lead layer as in the above-described embodiments, it is preferable to provide a marking on the lead layer in order to facilitate positioning. These markings can be provided at the time of pattern formation in the form of slits, recesses, or notches around the pattern of the lead layer or inside the pattern. 9A and 9B to FIG. 11A and FIG. 11B are schematic views showing the lead layer on which the marking is formed. 9A and 9B show a case where square alignment markings 70, 71, 72 and 73 are provided on the lead layers 60, 61, 62 and 63, respectively.

  Further, as shown in FIGS. 10A and 10B, the markings 74, 75, 76, and 77 can be formed in, for example, a rectangular shape in order to prevent the positional deviation of the post electrodes. In particular, in the case of the planar lead layer 63, the arrangement of the marking 77 is preferably a grid. Thereby, the post electrode can be arranged at the designed position, and the positional deviation of the post electrode can be prevented.

  Further, as shown in FIGS. 11A and 11B, in order to improve the alignment accuracy, the alignment image recognition markings 78 and 79 are independent of the lead layers 60, 61, 62, and 63. , 80, 81 may be provided. In this case, the markings 78, 79, 80, 81 can be produced by simultaneously forming another pattern when forming the lead layer. The alignment image recognition markings 80 and 81 are formed in the margin of the substrate on which the lead layers 62 and 63 are formed.

1A is a plan view, FIG. 1B is a side view, and FIG. It is a top view which shows the modification of a present Example. (A) thru | or (c) is a top view which shows the other Example of this invention. (A) thru | or (c) is a figure which shows other Example of this invention. (A) And (b) is a figure which shows the other Example of this invention. (A) And (b) is a figure which shows the other Example of this invention. (A) And (b) is a figure which shows the other Example of this invention. (A) And (b) is a figure which shows the other Example of this invention. (A) And (b) is a schematic diagram which shows the lead layer in which the marking was formed. (A) And (b) is a schematic diagram which shows the lead layer in which the marking was formed. (A) And (b) is a schematic diagram which shows the lead layer in which the marking was formed. (A) is a top view which shows the conventional general thermoelectric module, FIG.12 (b) is the side view. (A) is a top view which shows the conventional thermoelectric module which has a post electrode, FIG.13 (b) is the side view. It is a top view which shows the conventional thermoelectric module which has a post electrode. (A) And (b) is a top view which shows the case where the electrode pad 4 and the electrode pads 7a and 7b of a package are connected by the lead wire 5. FIG. It is a figure explaining the fault of the conventional thermoelectric module which has a post electrode.

Explanation of symbols

  10; Lower substrate, 11; Thermoelectric element, 12; Upper substrate, 13, 14; Metallized layer, 15a, 15b, 18a, 18b, 20a, 20b; Post electrode, 16a, 16b, 17a, 17b, 19a, 19b; Lead layer

Claims (1)

A thermoelectric module mounting package having a thermoelectric module and a pair of electrode pads connected to the thermoelectric module, wherein the thermoelectric module is disposed to face the upper substrate and is disposed on the upper substrate. between a lower substrate, a plurality of the lower electrode and the upper electrode formed on the opposing surfaces of the lower substrate and the upper substrate, and the lower electrode and the upper electrode having an extending portion extending in the first direction for the lower electrode and the thermoelectric element group comprising a plurality of thermoelectric elements connected in series and / or parallel by the upper electrode, the extending direction of Oite the lower substrate in the extending portion of the front Symbol lower substrate provided A pair of post electrodes disposed at positions asymmetric with respect to the central axis parallel to the wire, wires connecting the electrode pads and the post electrodes, and thermoelectric elements at both ends of the thermoelectric element group. that door both In extending portion of the front Symbol lower substrate has a lead layer pair formed asymmetrically with respect to the central axis, the pair of lead layers are edge of the substrate side of the extending portion The one lead layer extends toward the end of the extension portion farther from the upper substrate and the side edge of the extension portion on the other lead layer side. extends toward said the other lead layer is formed only along the side edge of the other lead layer side of the extending portion, the electrode pad in the post electrodes are each the lead layer A thermoelectric module mounting package, wherein the package is disposed at the shortest distance and connected to the lead layer .

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