JP4091882B2 - Array head of fine conductive ball mounting device - Google Patents

Description

【００４８】
なお、実施例は一例のみだが、他に６０μｍφ、８０μｍφ、１５０μｍφのボールサイズや、ＰＢフリー材（Ｓｎ-Ａｇ-Ｃｕ系、Ｓｎ-Ａｇ系）においても同様の試験を実施し、本発明の配列ヘッドが従来の配列ヘッドでは達し得ない、前記と同等の良好な結果を得ている。但し、ボールサイズが６０μｍφの場合は配列板の板厚が７０μｍ、吸引孔径が４０μｍφ、吸引孔ピッチが１００μｍで実施した。
【００４９】
（本発明の他の実施の形態）
本発明は複数の機器から構成されるシステムに適用しても１つの機器からなる装置に適用しても良い。
【００５０】
また、前述した実施の形態の機能を実現するように各種のデバイスを動作させるように、前記各種デバイスと接続された装置あるいはシステム内のコンピュータに対し、記憶媒体から、またはインターネット等の伝送媒体を介して前記実施の形態の機能を実現するためのソフトウェアのプログラムコードを供給し、そのシステムあるいは装置のコンピュータ（ＣＰＵあるいはＭＰＵ）に格納されたプログラムに従って前記各種デバイスを動作させることによって実施したものも、本発明の範疇に含まれる。
【００５１】
また、この場合、前記ソフトウェアのプログラムコード自体が前述した実施の形態の機能を実現することになり、そのプログラムコード自体、およびそのプログラムコードをコンピュータに供給するための手段、例えばかかるプログラムコードを格納した記憶媒体は本発明を構成する。かかるプログラムコードを記憶する記憶媒体としては、例えばフレキシブルディスク、ハードディスク、光ディスク、光磁気ディスク、ＣＤ−ＲＯＭ、磁気テープ、不揮発性のメモリカード、ＲＯＭ等を用いることができる。
【００５２】
また、コンピュータが供給されたプログラムコードを実行することにより、前述の実施の形態で説明した機能が実現されるだけでなく、そのプログラムコードがコンピュータにおいて稼働しているＯＳ（オペレーティングシステム）あるいは他のアプリケーションソフト等と共同して前述の実施の形態で示した機能が実現される場合にもかかるプログラムコードは本発明の実施の形態に含まれることは言うまでもない。
【００５３】
さらに、供給されたプログラムコードがコンピュータの機能拡張ボードやコンピュータに接続された機能拡張ユニットに備わるメモリに格納された後、そのプログラムコードの指示に基づいてその機能拡張ボードや機能拡張ユニットに備わるＣＰＵ等が実際の処理の一部または全部を行い、その処理によって前述した実施の形態の機能が実現される場合にも本発明に含まれる。
【００５４】
【発明の効果】
以上説明してきたように、本発明によれば、大面積の搭載エリアであっても確実にボール吸引配列を行なうことができ、ボール搭載歩留を向上させてバンプ形成対象の電極上に高精度で微小導電性バンプを形成するようにすることができる。
【図面の簡単な説明】
【図１】本発明の微細導電性ボール搭載装置の配列ヘッドの背景技術を示し、ボール吸着時の様子を示す図である。
【図２】配列板押え治具の構成を説明する図である。
【図３】微細導電性ボール搭載装置の配列ヘッドの構成を説明する図である。
【図４】配列板と配列板押え治具との間を収縮性樹脂で接合する例を示す図である。
【図５】本実施の形態を示し、微細導電性ボール搭載装置の配列ヘッドの概略構成を示す図である。
【図６】微細ボールが搭載されるウエハの一例を示す図である。
【符号の説明】
１ 配列ヘッド
２ 減圧空間
３ 配列ヘッドの貫通穴
４ 配列板支持部
５ 配列板
６ 吸引孔
７ 導電性ボール
９ ボール収容容器
１０ 配列板押え治具
１１ 収縮性樹脂[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an arrangement head of a fine conductive ball mounting device, and more particularly to a conductive ball suction arrangement jig and an arrangement mounting device, and more particularly to a plurality of fine arrangements on a ball arrangement plate on which a plurality of ball suction holes are formed. It is suitable for holding balls in a lump and mounting them on electrodes of electronic parts such as wafers, printed boards and semiconductor chips.
[0002]
[Prior art]
Recently, ball bumps using fine conductive balls have been used for electrical connection of semiconductor chips. By using the ball bumps, it is possible to obtain a number of merits such as downsizing the package and increasing the number of pins. A bump forming technique using such a fine conductive ball is described in Patent Document 1, for example.
[0003]
In the bump forming method described in Patent Document 1, a metal ball group corresponding to at least one semiconductor chip is sucked and held. In order to suck and hold a plurality of metal ball groups, a ball array plate in which suction holes are formed at all positions corresponding to bump formation positions on the semiconductor chip is used. After the fine metal spheres are adsorbed and held on the ball array plate, the ball array plate is transported to the joining stage and joined to the joined portion.
[0004]
According to this method, since the uniformly formed fine conductive balls can be bonded together at the bump forming position, it is possible to easily and efficiently form a ball bump with high reliability. Recently, semiconductor devices have been increasingly miniaturized, and the wiring pitch of electrodes has become extremely small.
[0005]
For this reason, the fine conductive balls used for forming ball bumps on the electrodes have become extremely fine as the wiring pitch of the electrodes becomes finer. On the other hand, the number of electrodes is increasing for higher performance of the chip, and the number of balls that are attracted and arranged at a time for bump formation is also increasing.
[0006]
In such a situation, the arrangement for one semiconductor chip has a complicated process and is disadvantageous in terms of cost and time. For this reason, before the wafer is cut into individual chips, that is, before the dicing process is performed, ball bumps are arranged on all the electrodes corresponding to a plurality of chips on the wafer.
[0007]
[Patent Document 1]
JP-A-7-153765 [0008]
[Problems to be solved by the invention]
However, when trying to place ball bumps collectively on all the electrodes on the wafer on which a plurality of semiconductor chips are formed, a suction failure that prevents the ball from being attracted to the outer periphery of the suction area occurs in the ball suction process, There has been a problem that it takes a long time for the adsorption arrangement to the arrangement plate.
[0009]
There are several factors that may cause this problem.
First, as compared with the case where the conductive ball for one semiconductor chip is adsorbed, the suction area becomes large and the number of suction holes increases, so that the suction air volume may become extremely large.
[0010]
Further, since the air volume is increased and the space between the ball container and the array plate is as narrow as about 1 to 15 centimeters, the speed of the cross wind flowing between the array head and the container is greatly increased.
[0011]
Secondly, the increase in air volume makes it easier for gas turbulence (vortex) to occur between the arrangement head and the ball container. Due to this eddy current, the ball group on the ball container is coarse and dense, and the ball is not adsorbed easily in the rough portion because the existence rate of the ball is low.
[0012]
The inventors of the present application have analyzed the gas flow at the time of sucking the ball and found that, due to these factors, it was difficult to perform good suction on the outer periphery of the suction area, and time was required for the suction arrangement. .
[0013]
The present invention has been made to solve such a problem, and while reducing the time required for adsorption over the entire adsorption area of a large area, a large amount of wafers can be stably and collectively processed. It is an object of the present invention to provide an array head of a fine conductive ball mounting apparatus in which conductive balls can be arranged.
[0014]
[Means for Solving the Problems]
The arrangement head of the fine conductive ball mounting device according to the present invention has a conductive ball in a circular ball container placed on a ball arrangement plate mounted on a square arrangement head having a size larger than the circular size of the ball container. An array head of a fine conductive ball mounting apparatus that mounts the conductive balls on all the electrodes on the wafer on which a plurality of semiconductor chips are formed after the suction array, wherein the ball array plate includes: The ball array plate is supported by an array plate pressing jig which is a fixed frame at its peripheral edge, and is installed at the lower part of the ball array head so as to be detachable by the array plate pressing jig. A step between the surface and the arrangement plate pressing jig is set to 2 mm or less, and the entire ball adsorbing surface is made flat. Further, the arrangement head is a square arrangement head.
Another feature of the present invention is that the conductive balls in the circular ball container are sucked into a ball array plate mounted on a square array head having a size larger than the circular size of the ball container. An array head of a fine conductive ball mounting apparatus for mounting the conductive balls collectively on all the electrodes on the wafer on which a plurality of semiconductor chips are formed, wherein the ball array plate includes: It is integrated with the array plate fixing frame at the periphery, and the integrated array plate and the array plate fixing frame can be attached to and detached from the ball array head, and the ball array plate is inclined to the outer periphery without suction holes. In the space between the extended surface of the ball adsorption surface of the ball array plate and the extended surface of the peripheral edge of the ball container, there is no obstacle affecting the gas flow generated in the adsorption process, and the SEQ head installed an array plate, the container of the conductive ball is brought closer in the step of adsorbing the conductive ball is characterized in that so as to suppress the turbulence of the gas flow. Further, the ball array plate is integrated by joining the array plate fixing frame and the shrinkable resin at a peripheral portion thereof, and the integrated array plate and the array plate fixing frame are attached to and detached from the ball array head. It is characterized by being possible. In the above two inventions, the ball array plate is made of a magnetic material, and a magnet is disposed on at least a part of the array head.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Next, an embodiment of the array head of the fine conductive ball mounting apparatus of the present invention will be described with reference to the accompanying drawings. Note that this embodiment is merely an example and does not limit the scope thereof.
[0016]
First, an example of a general fine ball adsorption process is shown in FIG. With the conductive balls 7 jumped by the vibration of the ball container 9, the arrangement head 1 is brought close to the ball container 9. A vacuum generation source (not shown) is connected to the array head 1 to decompress the decompression space 2.
[0017]
The array plate support portion 4 has a conduction hole 3 of the array head, and connects the suction hole 6 of the array plate 5 installed in the array plate support portion 4 to the decompression space 2. A porous body or a mesh may be inserted between the array plate 5 and the array plate support portion 4 to ensure air permeability. As a result, the jumping conductive balls 7 are attracted to the suction holes 6 of the array plate 5.
[0018]
There are various shapes for the array plate pressing jig 10 for fixing the ball array plate 5, but generally the shape shown in FIGS. 1 and 2 and the thickness of the array plate pressing jig 10 itself is about 5 to 10 mm. Met.
[0019]
Further, as shown in FIG. 2, the outer shape of the array plate pressing jig 10 is generally a square shape for ease of processing. However, the inventors have discovered that this shape is a cause of difficulty in adsorbing to the outer periphery of the ball suction area. When the outer shape of the array plate pressing jig 10 is square, the spatial distance connecting the ball container 9 and the array plate pressing jig 10 is not uniform as shown in FIG. 2 (second location B> First location A).
[0020]
Further, when the thickness of the array plate pressing jig 10 is thick, the space of the first portion A becomes extremely narrow. For this reason, the velocity of the gas flow generated when sucking the ball 7 is slower in the portion of the distance A than in other portions, particularly the second location B, and therefore the gas flow is disturbed and a group of balls jumping under the influence. Roughness occurs. In particular, it has been found that there is a tendency that the ball cannot be adsorbed at the outer peripheral portion where the flow rate of the gas flow is high, which causes a problem such as a longer time for adsorbing the ball.
[0021]
As shown in FIG. 3, in the arrangement head of the fine conductive ball mounting apparatus according to the present embodiment, the step between the suction surface of the ball arrangement plate and the arrangement plate holding jig 10 is 2 mm or less, preferably 1 mm or less. Thereby, even if the ball container 9 is circular and the outer shape of the array head is square, the gas flow turbulence generated by the ball suction can be suppressed by eliminating the step as much as possible.
[0022]
Preferably, the outer shapes of the ball container 9, the array head, and the array plate pressing jig 10 are unified to have the same shape, and the distance between the peripheral edge of the container and the peripheral edge of the ball array head is uniform over the entire circumference. . The arrangement plate holding jig 10 can be easily removed from the arrangement head 1, and it is desirable that the arrangement plate holding jig 10 does not have a displacement of the attachment position every time it is attached.
[0023]
By using the arrangement head of the fine conductive ball mounting device of the present embodiment, the gas flow non-uniformity is eliminated, the adverse effects such as the density of the jumping ball are eliminated, the adsorption time is shortened, and the yield is improved. I let you. The most suitable is the step between the adsorption surface of the ball array plate and the array plate holding jig is 0 mm, but in reality there is a slight step and it is difficult to process 0 mm. Demonstrated as shown.
[0024]
FIG. 5 shows a schematic configuration of the array head of the fine conductive ball mounting apparatus according to the present embodiment. In this embodiment, the semiconductor substrate or wafer W moves while being fixed on the wafer stage 20 along a wafer transfer path perpendicular to the paper surface, and waits at a predetermined position.
[0025]
Here, in the embodiment of the present invention, for example, a wafer having a size of 4 inches or more is targeted. According to this wafer W, a plurality of semiconductor chips C (individual square portions) to be formed can be obtained as shown in FIG. 6, and the ball array plate of the present invention is provided on the electrode portion of each semiconductor chip C. A plurality of conductive balls are used.
[0026]
In FIG. 6, although the conductive balls are shown in a simplified manner, the number of conductive balls used in the entire semiconductor chip C is several hundred thousand. The array head of the fine conductive ball mounting apparatus according to the present embodiment relates to a ball array plate used in the process of mounting an extremely large amount of conductive balls on the wafer W at once.
[0027]
Further, as shown in FIG. 5, a guide or guide rail 21 is installed along a direction (X direction) orthogonal to the wafer transfer path, and the ball array head 1 movable in the XZ direction on the guide rail 21. Is supported. As shown in FIG. 3, the ball array head 1 includes a decompression space 2, a conduction hole 3 that connects the suction hole 6 of the ball array plate 5 and the decompression space 2, and the bottom surface on which the conduction hole 3 is installed. The ball array plate 5 is fixed, and the conductive balls 7 are sucked and arranged on the ball array plate.
[0028]
When the ball array plate 5 and the array plate holding jig 10 are installed in the array head 1, the step on the ball adsorption surface of the ball array plate 5 and its extended surface must be 2 mm or less. The array plate 5 may be supported by adhering to the array plate pressing jig 10 with a tape or resin adhesive, or by welding or brazing.
[0029]
Alternatively, the arrangement plate pressing jig is shaped so as not to hang over the arrangement area where the suction holes 6 exist, and the portion covering the outer peripheral portion of the arrangement plate is made of a plate spring-like tension member having a thickness of 2 mm or less. Thus, the arrangement plate 5 may be pressed against the arrangement plate support portion 4 with its tension.
[0030]
Alternatively, by joining the array plate 5 and the array plate pressing jig 10 with the shrinkable resin 11, the array plate itself can be given a tension in the surface direction. When it is desired to apply tension by the array plate 5, as shown in FIG. 4, an inclination can be provided on the outer peripheral portion of the ball array plate without the suction hole 6, so that the array plate has tension in the out-of-plane direction.
[0031]
When the decompression space 2 is switched to a positive pressure at the time of ball mounting by giving tension to the array plate, it is possible to prevent the ball mounting position from being displaced or an overload from being applied due to deflection of the array plate itself. effective. Alternatively, the array plate may be made of a magnetic material, a magnet may be disposed at least at a part thereof, and the array plate may be adhered to the array plate support portion by a magnetic force.
[0032]
Further, the portion other than the area for adsorbing the balls on the ball array plate where the suction holes 6 exist may be fixed by vacuum suction independent of the vacuum system for attracting the balls. If the array plate holding jig is removed after the array plate is temporarily fixed to the array head by vacuum suction on the array head, it is possible to prevent displacement at each attachment / detachment. Then, the conductive balls 7 are collectively mounted on the electrode portions of the semiconductor chip C formed on the wafer W.
[0033]
The ball supply device 13 is disposed on one end side of the guide rail 21 so as to be positioned below the ball arrangement head 1. The ball supply device 13 includes a ball storage container 9 that stores a considerable amount of the conductive balls 7, and a vibrator 15 that vibrates the ball storage container 9 and jumps the conductive balls 7 in the ball storage container 9. It is out.
[0034]
The ball array head 1 is provided with a vibration generation source (not shown) such as an ultrasonic vibrator, and attaches to the periphery of the suction hole 6 or a portion other than the suction hole by applying vibration during the adsorption of the ball or at the end of the adsorption. Generation of excessive balls can be suppressed. In this case, the vibration frequency is preferably about several Hz to 1 GHz. It is desirable that the vibration application time, amplitude, frequency, and application timing can be set arbitrarily.
[0035]
The location of the vibration source is not particularly limited as long as vibration is transmitted to the ball array plate, but a position closer to the ball array plate is preferable, even if it is installed on the wall surface of the array head or the array plate holding jig 10. They can be installed directly on the ball array plate.
[0036]
Between the ball supply device 13 and the ball mounting stage 20, an arrangement defect ball removing mechanism 16 and an arrangement inspection camera 17 are arranged. The ball removing mechanism 16 removes the misaligned balls in the ball arranging head 1 by suction or gas blowing. At the time of removal, if the array head 1 is vibrated by the above-described vibration generation source, it can be removed more effectively. Further, the array inspection camera 17 inspects a ball array defect in the ball array head 1.
[0037]
The ball array head 1 reciprocates between the ball supply device 13 and the ball mounting stage 20, but the decompression space 2 is connected to a suction mechanism (not shown) connected to a negative pressure or a vacuum source. In FIG. 5, a large number of conductive balls 7 are arranged by suction.
[0038]
Further, by providing a valve between the decompression space 2 and the suction mechanism and switching the valve during the ball mounting process and switching the suction mechanism to the pressurization pump, the decompression space can be made positive. The ball array plate 5 has suction holes 6 corresponding to the electrode portions of the plurality of semiconductor chips C on the wafer W. Then, by the suction mechanism, the conductive balls 7 jumping in the ball container 9 can be adsorbed one by one in each suction hole 6.
[0039]
In the above configuration, the arrangement operation from when the ball arrangement head 1 starts sucking the ball until the conductive ball 7 is mounted on the mounting object will be described.
In the ball supply device 13, the conductive ball 7 in the ball container 9 is jumped by the shaker 15. As shown by the dotted line in FIG. 5, the ball array head 1 is lowered to a predetermined height on the ball container 9, and the jumping conductive balls 7 are adsorbed.
[0040]
Next, after attracting the conductive balls 7, the ball array head 1 moves up and moves to the ball mounting stage 20 along the guide rail 21. During this movement, the defective ball is removed. Thereafter, the array inspection camera 17 moves in a direction perpendicular to the paper surface to inspect the ball adsorption state over the entire array surface of the ball array plate 19.
[0041]
If the inspection result is good, the robot moves to the ball mounting stage 20. Further, if an alignment defect is found during this inspection, it is possible to return to the position of the ball removal mechanism 16 and remove the defect.
[0042]
Next, the ball arrangement head 1 is aligned with the wafer W waiting on the ball mounting stage 20. Then, by lowering the ball array head 1, the conductive balls 7 attracted to the ball array plate 5 are mounted on the electrode portion of the wafer W to which the flux has been applied.
[0043]
The ball array head 1 is configured such that the mounting load when contacting the wafer W can be controlled in accordance with the type of conductive balls. Thereby, the conductive ball 7 can be brought into contact with the wafer W with an optimum load, and the conductive ball 7 can always be mounted appropriately and smoothly.
[0044]
Further, as described above, the ball arraying head 1 is provided with a vibration generating source (not shown), and the conductive ball sucked into the suction hole 6 is easily released from the suction hole by applying vibration during the ball mounting process. To be able to. In this case, the vibration frequency is preferably about several Hz to 1 GHz. It is desirable that the vibration application time, amplitude, frequency, and application timing can be set arbitrarily.
[0045]
In consideration of the presence of balls remaining on the ball array plate 5 after the balls are mounted on the wafer W, the suction removal operation can be performed by the ball removal mechanism 16.
[0046]
【Example】
Examples are shown below.
Implementation conditions:
Ball size used: 100 μmφ, ball material: Sn63PB eutectic array plate: 8 inch (200 mm) wafer compatible, number of suction holes: 385000 / wafer (625 / chip), number of chips: 616 / wafer array plate thickness: 100 μm, suction hole diameter: 70 μmφ, suction hole pitch: 200 μm
Suction time: 90 seconds or less, the number of suction holes that have not been attracted to the ball generated by one suction operation.
[0047]
[Table 1]

[0048]
The example is only an example, but the same test was conducted on ball sizes of 60 μmφ, 80 μmφ, 150 μmφ, and PB-free materials (Sn—Ag—Cu type, Sn—Ag type). The head has a good result equivalent to the above, which cannot be achieved by a conventional array head. However, when the ball size was 60 μmφ, the thickness of the array plate was 70 μm, the suction hole diameter was 40 μmφ, and the suction hole pitch was 100 μm.
[0049]
(Another embodiment of the present invention)
The present invention may be applied to a system composed of a plurality of devices or an apparatus composed of a single device.
[0050]
Further, in order to operate various devices so as to realize the functions of the above-described embodiments, a transmission medium such as the Internet is transmitted from a storage medium to an apparatus connected to the various devices or a computer in the system. The program implemented by operating the various devices according to the program stored in the computer (CPU or MPU) of the system or apparatus is supplied via the program code of software for realizing the functions of the embodiment Are included in the scope of the present invention.
[0051]
In this case, the program code of the software itself realizes the functions of the above-described embodiments, and the program code itself and means for supplying the program code to the computer, for example, the program code are stored. This storage medium constitutes the present invention. As a storage medium for storing the program code, for example, a flexible disk, a hard disk, an optical disk, a magneto-optical disk, a CD-ROM, a magnetic tape, a nonvolatile memory card, a ROM, or the like can be used.
[0052]
Further, by executing the program code supplied by the computer, not only the functions described in the above embodiments are realized, but also the OS (operating system) or other operating system in which the program code is running on the computer. It goes without saying that such program code is also included in the embodiment of the present invention even when the functions described in the above-described embodiment are realized in cooperation with application software or the like.
[0053]
Further, after the supplied program code is stored in the memory provided in the function expansion board of the computer or the function expansion unit connected to the computer, the CPU provided in the function expansion board or function expansion unit based on the instruction of the program code The present invention also includes the case where the functions of the above-described embodiment are realized by performing part or all of the actual processing.
[0054]
【The invention's effect】
As described above, according to the present invention, it is possible to reliably perform the ball suction arrangement even in a large mounting area, and to improve the ball mounting yield and provide high precision on the electrodes on which bumps are to be formed. Thus, a minute conductive bump can be formed.
[Brief description of the drawings]
FIG. 1 is a view showing a background art of an array head of a fine conductive ball mounting apparatus according to the present invention and a state at the time of ball adsorption.
FIG. 2 is a diagram illustrating the configuration of an array plate pressing jig.
FIG. 3 is a diagram illustrating a configuration of an array head of a fine conductive ball mounting apparatus.
FIG. 4 is a diagram illustrating an example in which an array plate and an array plate holding jig are joined with a shrinkable resin.
FIG. 5 is a diagram showing a schematic configuration of an arrangement head of a fine conductive ball mounting apparatus according to the present embodiment.
FIG. 6 is a diagram showing an example of a wafer on which fine balls are mounted.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Arrangement head 2 Decompression space 3 Through hole 4 of arrangement head Arrangement board support part 5 Arrangement board 6 Suction hole 7 Conductive ball 9 Ball container 10 Arrangement board holding jig 11 Contractile resin

Claims (4)

After the conductive balls in the circular ball container are sucked and arranged on a ball arrangement plate mounted on a square arrangement head having a size larger than the circular size of the ball container, the conductive balls are arranged on a plurality of semiconductor chips. An array head of a fine conductive ball mounting device that collectively mounts on all the electrodes on the wafer on which is formed ,
The ball array plate is supported by an array plate presser jig that is a fixed frame at the periphery of the ball array plate, and is installed at the lower part of the ball array head so as to be detachable with the array plate presser jig ,
An array head of a finely conductive ball mounting apparatus, wherein a step between the ball suction surface of the ball array plate and the array plate pressing jig is 2 mm or less, and the entire ball suction surface is flattened. After the conductive balls in the circular ball container are sucked and arranged on a ball arrangement plate mounted on a square arrangement head having a size larger than the circular size of the ball container, the conductive balls are arranged on a plurality of semiconductor chips. An array head of a fine conductive ball mounting device that collectively mounts on all the electrodes on the wafer on which is formed ,
The ball array plate is integrated with an array plate fixing frame at a peripheral portion thereof, and is installed so that the integrated array plate and the array plate fixing frame can be attached to and detached from the ball array head.
An inclination is provided on the outer peripheral portion of the ball array plate without a suction hole,
The space between the extended surface of the ball adsorbing surface of the ball array plate and the extended surface of the peripheral edge of the ball container is free of obstacles affecting the gas flow generated in the adsorbing process, and the ball array plate is The arrangement head of the fine conductive ball mounting apparatus, wherein the arranged arrangement head suppresses the turbulence of the gas flow in the step of adsorbing the conductive ball by bringing the container for containing the conductive ball close to the container. . The ball array plate is integrated by joining the array plate fixing frame and the shrinkable resin at a peripheral edge thereof , and the integrated array plate and the array plate fixing frame can be attached to and detached from the ball array head. The arrangement head of the fine conductive ball mounting apparatus according to claim 2, wherein 3. The arrangement head of the fine conductive ball mounting apparatus according to claim 1, wherein the ball arrangement plate is made of a magnetic material, and a magnet is arranged on at least a part of the arrangement head.

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