JP4093519B2 - package - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a package, and more particularly, to a package suitable for a crystal resonator in which an insulating base and a metal cap are sealed.
[0002]
[Prior art]
Recently, electronic components have been downsized and surface-mounted, and there is a demand for downsizing and surface mounting of packages. For example, the surface-mount type crystal resonator has a structure as shown in FIG. FIG. 6A is a plan view in which a part is cut open so that the internal structure can be seen, FIG. 6B is a longitudinal sectional view along the center line in the longitudinal direction, and FIG. 6C is a bottom view.
The package D in the surface-mount type crystal resonator shown in FIG. 6 has an insulating base 60, that is, a bottom plate portion 61 and a frame body portion 62 made of alumina ceramic, and Ag on the surface of one end portion in the longitudinal direction of the bottom plate portion 61. / Pd electrodes 63 and 64 are formed, and the electrodes 63 and 64 pass between the bottom plate portion 61 and the frame portion 62, respectively, are led out to both ends in the longitudinal direction, and further pass through the end surface of the bottom plate portion 61. And connected to terminal portions 65 and 66 of Ag / Pd or the like formed on the back surface. Reference numeral 67 denotes a support portion called a “pillow” for horizontally supporting a crystal vibrating piece (68), which will be described later, and is formed of the same material and the same height as the electrodes 63 and 64 at the same time. Yes. A crystal vibrating piece 68 is connected and fixed to the electrodes 63 and 64 with a conductive adhesive, and a flat metal cap 70 is fixedly sealed to the upper surface of the frame body portion 62 with a low melting point glass 69.
[0003]
[Problems to be solved by the invention]
By the way, the package D in the surface-mount type crystal resonator has only the upper surface of the insulating base 60 and the lower surface of the metal cap 70 fixed and sealed in a plane, and is applied to the end surface of the metal cap 70 from the horizontal direction. There was a problem that the metal cap 70 was easily peeled off by an impact force. In particular, when the insulating base 60 is made of alumina ceramic, the internal stress resulting from the difference in thermal expansion coefficient from the metal cap 70 remains in the sealing portion, and the metal cap is not affected by a slight external impact force. There was a tendency for 70 to be easily peeled off.
[0004]
In the semiconductor device, the purpose is to prevent the spread of the solder flow, but the insulating base 80 in the insulating base 80 made of alumina ceramic or the like and having the bottom plate portion 81 and the frame portion 82 as in the package E shown in FIG. A step portion 83 is provided on the inner peripheral portion of the upper surface of the frame portion 82, and a gold plating layer 84 is formed on the step portion 83, and the central portion is outwardly disposed on the gold plating layer 84 via a solder 85. It is conceived that a convex metal cap 86 is sealed to prevent the end face of the metal cap 86 from being exposed to the outside (Japanese Patent Laid-Open No. 58-155743).
As described above, the package E having such a sealing structure is intended to prevent the solder 85 from spreading and is not intended to prevent the metal cap from being peeled off. It is difficult to apply an external force in the horizontal direction to the end of 86, and the impact resistance is improved. However, the problem of residual internal stress due to the difference in thermal expansion coefficient between the insulating base 80 and the metal cap 86 has not been solved, and the sealing interface distance between the insulating base 80 and the metal cap 86 is reduced. Therefore, there was a problem that it was difficult to ensure airtightness.
[0005]
Similarly, in the semiconductor device, the purpose is to prevent the spread of the solder as in the case described above. However, as in the package F shown in FIG. 8, the insulating material is made of alumina ceramic or the like and has the bottom plate portion 91 and the frame portion 92. An annular groove 93 is provided in the center of the upper surface of the frame body 92 in the base 90, and a falling portion 95 is provided from the vicinity of the peripheral edge of the metal cap 94, and the lower end of the falling portion 95 is fitted into the groove 93. A structure that is sealed with a gold-tin brazing material 96 is also considered (Japanese Patent Laid-Open No. 61-232641).
In the package F having such a sealing structure, the end portion of the metal cap 94 is exposed to the outside, but since the falling portion 95 is fitted and sealed in the concave groove 93, the external impact is the concave portion. Although the impact resistance is improved by being blocked by the groove 93, the problem of the residual internal stress has not been solved, and the concave groove 93 is formed in the center of the upper surface of the frame body portion 92 of the insulating base 90. Therefore, in the insulating base 90 having the same thickness as that of the prior art, the mechanical strength of the upper surface portion of the frame body portion 92 is reduced and the portion near the concave groove 93 is easily damaged. On the other hand, in order to prevent damage, if the insulating base 90 is made thick without changing the external dimensions, the internal volume of the package is reduced. If the external dimensions are increased in order to secure the same internal volume as in the conventional case, the package It becomes larger and it is against the lightness, thinness and miniaturization.
[0006]
SUMMARY OF THE INVENTION An object of the present invention is to provide a package with high impact resistance of a sealing portion, high mechanical strength, and high airtightness.
[0007]
[Means for Solving the Problems]
The invention of claim 1 of the present invention, in package sealing the metal cap by the interposition of a low-melting glass ceramic insulating base having a bottom plate portion and the frame portion, said metal cap and the top plate portion the periphery And is fixed to the frame body portion with low melting point glass interposed between the upper surface and the peripheral surface portion of the ceramic insulating base frame portion, and the metal cap It is a package characterized in that a tongue piece provided on the lower end side of the lowering portion is fitted and positioned in a recess formed in the peripheral surface of the frame portion of the ceramic insulating base . According to the above-mentioned package, since it is sealed by two surfaces, that is, the upper surface and peripheral surface of the insulating base, the lower surface of the top plate portion of the cup-shaped metal cap, and the inner surface of the falling portion, the external impact resistance is large. In addition, since the insulating base does not have a concave groove or the like formed on the upper surface thereof, the mechanical strength is high, and the thickness of the insulating base is not changed at all, so that the airtightness can be easily secured.
[0008]
In other words, the step has a step on the peripheral surface of the frame part of the ceramic insulating base, and the lower end of the falling part of the metal cap is positioned by this step, so that the metal cap can be positioned by the step and insulated. Appropriate space between the upper surface of the base and the top surface of the top portion of the metal cap, and therefore, an appropriate amount of low-melting glass can be secured, sufficient mechanical strength for the sealing portion, Airtightness can be obtained.
[0009]
Further, the present invention is characterized in that the ceramic insulating base has a concave portion on the peripheral surface of the frame body , and a tongue piece is provided on the lower end side of the falling portion of the metal cap and is fitted into the concave portion. Since the tongue of the metal cap is fitted into the recess of the insulating base, the external impact resistance can be further improved.
[0010]
According to a second aspect of the present invention, the tongue piece is a plurality of tongue pieces each having a bent portion provided on the lower end side of the opposite side portion of the falling portion, and the bent portion is the ceramic insulating property. It is a package characterized by being fitted into a recess of a base . According to the above package, not only the same effect as described above can be obtained, but also the bent portion of the tongue piece is fitted into the recessed portion of the insulating base, so that compared to the case of the straight tongue piece. The caulking process can be omitted.
[0011]
In addition, the bent part of the tongue of the metal cap is recessed in the central axis direction of the metal cap from the falling part in a state before sealing, and is fitted into the recess of the insulating base by its elastic force. By doing so, the bent portion of the tongue piece is fitted into the concave portion of the insulating base by its elastic force .
[0012]
According to a third aspect of the present invention , the grounding conductive layer and the conductive portion of the terminal are provided on the back side of the bottom plate portion of the ceramic insulating base from the concave portion formed on the peripheral surface of the frame portion of the ceramic insulating base. The package is characterized in that the tongue piece of the metal cap is in contact with the conductive layer for grounding. According to the above package, the metal cap can be grounded, and fluctuations in the characteristics of the electronic element due to external electromagnetic waves and stray capacitance can be prevented. In addition, since no expensive conductive low melting point glass is required, the cost can be reduced.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[Example 1]
FIG. 1 shows a case where the package A according to the first embodiment of the present invention is applied to a surface-mount type crystal unit. FIG. 1A is a plan view in which a part is opened so that the internal structure can be seen. b) is a longitudinal sectional view along the longitudinal center line, and FIG. 1C is a bottom view.
In FIG. 1, reference numeral 1 denotes an insulating base made of glass ceramic, which is formed by laminating a bottom plate portion 2 and a frame portion 3 and integrally sintering them. A step portion 4 is formed on the outer surface of the frame body portion 3. The formation position of the step part 4 from the upper end of the frame body part 3 is set according to the height dimension of the falling part of the metal cap described later, and the width dimension of the step part 4 is the thickness dimension of the metal cap. It is set according to. These bottom plate part 2 and frame part 3 are, for example, dispersed in a fine powder of forsterite having a particle size of about 0.3 to 3 μm in an alkaline glass fine powder of a particle size of about 0.3 to 3 μm. The insulating base 1 has a longitudinal dimension of 3.0 to 12.0 mm and a short dimension of 10 to 15 ppm / ° C. with a thermal expansion coefficient of 10 to 15 ppm / ° C. The size of the frame body portion 2 is about 2.0 to 10.0 mm and the thickness dimension is about 0.2 to 1.0 mm. The inner dimension in the lateral direction is 0 mm, 1.0 to 9.0 mm, and the thickness dimension is about 0.2 to 1.0 mm.
[0017]
The alkali glass of the first embodiment constituting the glass ceramic in the insulating base 1 has, for example, the following composition and contains an alkali component such as Na ₂ O, K ₂ O, LiO ₂ .
SiO _2: 50~70wt%
Al ₂ O ₃ : _{2 to} 15 wt%
RO: 5 to 30 wt% (R is one or more of Ca, Sr and Ba)
B ₂ O _3: 1~8wt%
ZnO: 2 to 15 wt%
R ₂ O: 5 to 30 wt% (R is one or more of Na, K and Li)
[0018]
Electrodes 5 and 6 having a thickness of about 40 to 50 μm are formed on the upper surface of the bottom plate portion 2 in the vicinity of one end in the longitudinal direction by applying and baking an Ag / Pd paste. One electrode 5 passes between the bottom plate portion 2 and the frame body portion 3 and is led out of one end in the longitudinal direction of the bottom plate portion 2, and the other electrode 6 is below the frame body portion 3. And is formed by applying and baking an Ag / Pd paste on the lower surfaces of both ends in the longitudinal direction of the bottom plate portion 2 through the end surface of the bottom plate portion 2. It is connected to terminal portions 7 and 8. These electrodes 5 and 6 and terminal portions 7 and 8 may be formed separately, but may be formed simultaneously.
Further, a support portion 9 called a “pillow” for supporting a crystal vibrating piece (10), which will be described later, in a horizontal state is formed on the upper surface of the bottom plate portion 2 opposite to the electrodes 5 and 6. Has been. The support 9 is formed of the same material as the electrodes 5 and 6 at the same time and with the same thickness.
[0019]
Although not shown, the electrodes 5 and 6 and the terminal portions 7 and 8 are formed with an electroless Ni plating layer and / or an electroless Au plating layer.
On the electrodes 5 and 6, a crystal vibrating piece 10 having electrodes (not shown) on both sides is connected and fixed by a conductive adhesive or the like. Note that the support portion 9 is for supporting the quartz crystal vibrating piece 10 in a horizontal state as described above, and does not require adhesion or the like.
And the top plate part 13 in the cup-shaped metal cap 12 about 0.05-0.2 mm in thickness which consists of stainless steel etc. through the low melting glass 11 on the upper surface and outer peripheral surface of the said frame part 3. As shown in FIG. Two surfaces, that is, the lower surface and the inner surface of the falling portion 14 from the peripheral edge thereof are fixed and sealed.
[0020]
Next, examples of the low melting point glass 11 will be described.
First, the low-melting glass used as the base of the low-melting glass is, for example, the following silver-phosphate low-melting glass Ag-PIO (Ag ₂ O, AgI, P ₂ O ₅ oxidation) It is mixed in the form of a product and melted and then pulverized, but the ratio as Ag, P, I is such that the softening point of Ag: 30-60%, P: 20-40%, I: 5-15%) is 200- In order to match or approximate the thermal expansion coefficient of glass ceramic to 30 to 70 wt% of 230 ° C. silver-phosphate glass, 70 to 30 wt% of a phosphoric acid compound or niobium pentoxide was added as a filler. Low melting point glass of about ~ 290 ° C.
This low melting point glass is 0.1% of any one or more selected from the group consisting of Al, Ni, Ag, BaTiO ₃ , NiCr, TiB, and TiO _{2 in} the low melting point glass as the base material. 10 vol% is added.
Here, when the amount of addition of one or more selected from the group of Al, Ni, Ag, BaTiO ₃ , NiCr, TiB, and TiO ₂ is less than 0.1 vol%, sealing is performed in a high-pressure and high-humidity test. The effect of improving the stopping strength is not recognized, and if it exceeds 10 vol%, the working temperature of the low-melting glass 10 rises and the glass becomes difficult to flow and low-temperature sealing becomes difficult. Therefore, the addition amount of one or more selected from the group of Al, Ni, Ag, BaTiO ₃ , NiCr, TiB, and TiO ₂ is limited to 0.1 to 10 vol%.
[0021]
According to the package A, the insulating base 1 is made of glass ceramic, and its thermal expansion coefficient is set to 10-15 ppm / ° C., which is much larger than that of alumina ceramic, 6.6 ppm / ° C. The quartz crystal vibrating piece 10 is approximated to a thermal expansion coefficient of 12 to 20 ppm / ° C., the metal cap 12 is made of stainless steel, and the thermal expansion coefficient is set to 10 to 13 ppm / ° C. Therefore, separation due to residual internal stress caused by the difference in thermal expansion coefficient between the insulating base 1 and the metal cap 12 does not occur. Further, the insulating base 1 and the metal cap 12 have a low melting point on the two surfaces of the upper surface and the peripheral surface of the frame body portion 3 and the lower surface of the peripheral portion of the top plate portion 13 and the inner surface of the falling portion 14 of the metal cap 12. Since the glass 11 is fixed and sealed, the sealing strength is remarkably high. In addition, the mechanical strength is remarkably large as compared with the insulating base 1 in which concave grooves are formed. Furthermore, as described above, since the sealing is performed on the two surfaces, the sealing interface distance is remarkably increased, and it has various excellent features that airtightness can be easily secured and high airtightness can be obtained.
Here, the step portion 4 of the insulating base 1 supports the lower end of the falling portion 14 of the metal cap 12, and is appropriate between the upper surface of the frame body portion 3 and the lower surface of the top plate portion 13 of the metal cap 12. Therefore, it is useful to secure a proper distance, and to secure an appropriate amount of the low melting point glass 11 to form a preferable sealing portion.
[0022]
[Example 2]
Next, a package B according to a second embodiment of the present invention will be described with reference to FIGS.
FIG. 2 is an exploded perspective view before sealing, and FIG. 3 is a longitudinal sectional view in the short direction after sealing. 2 and 3, reference numeral 20 denotes an insulating base made of glass ceramic, which has a bottom plate portion 21 and a frame body portion 22, and has a step portion 23 on the outer periphery of the frame body portion 22. The difference from the package A of the first embodiment shown in FIG. 1 is that the step portion 23 is not for positioning the metal cap but for securing the thickness of the low-melting glass described later. In addition, recesses 24 and 25 are formed in part of the opposing side surfaces of the insulating base 20, and the grounding conductive layers 26 and 27 and the inner surface of the bottom surface plate 21 of the insulating base 20 are formed from the inner surfaces of the recesses 24 and 25. That is, the terminal portions 28 and 29 are formed. Note that illustration of electrodes and support portions is omitted.
Further, a cup-shaped metal cap 31 is sealed on the insulating base 20 via a low melting point glass 30, and the metal cap 31 has a top plate portion 32 and a falling portion 33, and a falling portion 33. The tongue pieces 34 and 35 extending downward from the falling portion 33 are integrally provided at the lower ends of the two opposing surfaces. Although not shown in the drawing, a V-shaped groove or the like for assisting bending and caulking may be formed in the inner portions of the tongue pieces 34 and 35 as necessary.
Then, a glass tablet (not shown) preformed in a frame shape is placed on the step portion 23 of the insulating base 20, and a metal cap 31 is placed thereon to heat and melt the glass tablet. After sealing, the tips of the tongue pieces 34 and 35 are bent and crimped into the recesses 24 and 25, and are connected to the grounding conductive layers 26 and 27.
Alternatively, first, the tips of the tongue pieces 34 and 35 may be bent and crimped into the recesses 24 and 25, and then heated to melt and seal the glass tablet.
Therefore, according to the package B of the second embodiment, as in the package A of the first embodiment, the external impact resistance is improved, the mechanical strength of the sealing portion is high, and the airtightness is high. In addition to providing a package, the tongues 33 and 34 of the metal cap 31 are caulked by fitting into the recesses 23 and 24 of the insulating base 20, so that the external impact resistance can only be significantly improved. Since the tongue pieces 33 and 34 are connected to the conductive layers 25 and 26 for grounding and the terminal portions 27 and 28, the metal cap 31 is grounded by grounding the terminal portions 27 and 28. be able to. As described above, when the metal cap 31 is grounded, the characteristic variation of the electronic element such as the crystal vibrating piece housed in the package B due to the external electromagnetic wave or the stray capacitance can be prevented, and particularly expensive conductive property is obtained. The advantage that the metal cap 31 can be grounded without using low-melting glass is extremely large.
[0023]
[Example 3]
Next, a package C according to a third embodiment of the present invention will be described with reference to FIGS.
4 is an exploded perspective view before sealing, and FIG. 5 is a longitudinal cross-sectional view in the short direction after sealing. 4 and 5, reference numeral 40 denotes an insulating base made of glass ceramic, which includes a bottom plate portion 41 and a frame body portion 42, and has a stepped portion 43 on the peripheral surface of the frame body portion 42. Further, concave portions 44 and 45 are provided on two opposing side surfaces, and grounding conductive layers 46 and 47 and terminal portions 48 and 49 are provided from the respective concave portions 44 and 45 to the back surface of the bottom plate portion 41.
A cup-shaped metal cap 51 is sealed on the insulating base 40 via a low melting point glass 50. The metal cap 51 has a top plate portion 52 and a falling portion 53, and the upper surface and outer surface of the frame body portion 43 of the insulating base 40, the lower surface of the top plate portion 52 of the metal cap 51, and the inner surface of the falling portion 53. And are sealed on two surfaces. The metal cap 51 also has tongue pieces 54 and 55 projecting from the lower ends of the two opposite side falling portions 53. The tongue pieces 54 and 55 have a bent portion that is bent in advance toward the central axis of the metal cap 51, and the dimension between the bent portions is set to be slightly smaller than the outer dimension of the insulating base 40. ing.
Therefore, according to this package C, since the insulating base 40 and the metal cap 51 are sealed with the low melting point glass 50 on the two surfaces in the same manner as described above, high impact resistance, mechanical strength and high airtightness are achieved. In addition, since the bent portions of the tongue pieces 54 and 55 of the metal cap 51 are fitted into the recesses 44 and 45 of the insulating base 40 by the elastic force, the metal cap 51 is connected to the recesses of the insulating base 40. Since the metal cap 51 can be held and connected to the conductive layers 46 and 47 simply by being fitted into the pins 44 and 45, there is a feature that a holding jig for positioning the metal cap 51 or the like is not required at the time of sealing.
[0024]
Although each of the above embodiments has been described with respect to specific shapes, structures, and uses, the present invention is not limited to such embodiments, and various modifications can be made without departing from the spirit of the present invention. Is possible.
[0025]
For example, as the glass-ceramic alkali glass constituting the insulating bases 1, 20, and 40, in addition to those shown in the above examples, the same results are obtained for the compositions of the following second and third examples. was gotten.
[0026]
[Alkaline glass composition of the second embodiment]
SiO _2: 40~55wt%
A1 ₂ O ₃ : 20-30 wt%
P ₂ O _5: 1~20wt%
BaO: 0.2-5 wt%
R ₂ O: 5 to 10 wt% (R is Na, K)
[0027]
[Alkaline glass composition of the third embodiment]
SiO _2: 70~85wt%
P ₂ O _5: 1~5wt%
MgO: 1 to 5 wt%
R ₂ O: 8 to 25 wt% (R is Li, K)
[0028]
Further, 1.2 to 5 wt% of one or more fine powders (0.1 to 1 μm) of ZrO, SnO ₂ , P ₂ O ₅ and MoO ₃ are added to the alkali glass having the composition of the first embodiment. Similar results were obtained for the added glass ceramic.
[0029]
Furthermore, in the above-described embodiments, the insulating bases 1, 20, and 40 have been described as being made of glass ceramics, but may be made of ceramics such as alumina and forsterite. That is, in the present invention, the metal caps 12, 31, 51 are provided with the falling portions 14, 33, 53 so that not only the respective top plate portions 13, 32, 52 but also the falling portions 14, 33, 53 are provided. Since it is sealed with the low melting glass 11, 30, 50, all of external shock resistance, mechanical strength and airtightness are remarkably improved as compared with the conventional package, and the metal cap 12, The falling portions 14, 33, 53 of 31, 51 are expanded by heating at the time of sealing, and are contracted by cooling after the sealing, so that the thermal expansion coefficient of the insulating bases 1, 20, 40 is assumed to be a metal cap. Even if it is smaller than the thermal expansion coefficient of 12, 31, 51, the fastening force by the metal caps 12, 31, 51 acts on the outer surfaces of the insulating bases 1, 20, 40, so that they may be peeled off from each other. ,machine Strength may decrease, because becomes nil that such airtightness decreases.
[0030]
In the crystal resonator using the package A of the present invention, the support portion 9 that supports the crystal vibrating piece 10 is described as being formed of the same material as the electrodes 5 and 6. The same material may be used. In this way, the amount of expensive conductive material used can be saved and the cost can be reduced.
[0031]
Further, in the crystal resonator using the package A of the present invention, the electrodes 5 and 6 are formed only of a conductive material such as Ag / Pd. However, the desired material is almost the same height as the insulating base. A pedestal portion may be formed, and an electrode may be formed of a conductive material on the pedestal portion. In this way, the amount of expensive conductive material used can be saved and the cost can be reduced.
[0032]
Furthermore, the present invention can be similarly applied to a surface acoustic wave element other than a crystal resonator, a package for a semiconductor device, an electronic component, or the like.
[0033]
【The invention's effect】
The present invention provides a package having an insulating base and a metal cap sealed with the insulating base, wherein the metal cap is a cup-shaped member having a top plate portion and a falling portion from a peripheral portion thereof, The package is characterized by sealing the insulating base and the metal cap on the two surfaces of the upper surface and the peripheral surface of the insulating base and the top plate and the falling portion of the metal cap. There is a specific effect that a package having impact and mechanical strength and high airtightness can be provided.
[Brief description of the drawings]
1A and 1B show a surface-mounted crystal resonator using a package A according to a first embodiment of the present invention, where FIG. 1A is a plan view with a part cut away, and FIG. FIG. 2 is a bottom view of the package B according to the second embodiment of the present invention before sealing. FIG. 3 is a short side direction after sealing of the package B of the second embodiment of the present invention. FIG. 4 is an exploded perspective view of the package C of the third embodiment of the present invention before sealing. FIG. 5 is a longitudinal cross section of the package C of the third embodiment of the present invention after sealing. FIG. 6 shows a surface-mount type crystal resonator using a conventional package D, where (a) is a plan view with a part cut away, (b) a longitudinal sectional view along the center line in the longitudinal direction, (c) ) Bottom view [FIG. 7] Vertical sectional view of another conventional package E [FIG. 8] Vertical sectional view of still another conventional package F [Explanation of symbols]
A, B, C Package 1, 20, 40 Insulating base 2, 21, 41 Bottom plate part 3, 22, 42 Frame part 4, 23, 43 Step part 5, 6 Electrode 7, 8 Terminal part 9 Support part 10 Crystal Vibrating piece 11, 30, 50 Low melting point glass 12, 31, 51 Metal cap 13, 32, 52 Top plate part 14, 33, 53 Falling part 24, 25, 44, 45 Recess 26, 27, 46, 47 For grounding Conductive layers 28, 29, 48, 49 Terminal portion for grounding

Claims (3)

In a package in which a metal cap is sealed by a low melting point glass interposed in a ceramic insulating base having a bottom plate portion and a frame body portion , the metal cap has a top plate portion and a falling portion at the periphery thereof, and the ceramic The tongue piece provided on the lower end side of the falling portion of the metal cap is fixed to the frame body portion with low melting point glass interposed between the upper surface and the peripheral surface portion of the frame body portion of the insulating base. A package characterized by being fitted and positioned in a recess formed in a peripheral surface of a frame portion of a ceramic insulating base . The tongue piece includes a plurality of bent portions provided on the lower end side of the opposite side of the falling portion, and these bent portions are formed into a plurality of concave portions formed on the peripheral surface of the frame portion of the ceramic insulating base. The package according to claim 1, wherein the package is fitted. A grounding conductive portion is provided on the back surface of the bottom plate portion of the ceramic insulating base from a recess formed in the peripheral surface of the ceramic insulating base frame, and the tongue of the metal cap is brought into contact with the grounding conductive portion. The package according to claim 2.

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