JP4093911B2 - Rotating developer - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a rotary developing device that uniformly diffuses a developing solution on the surface of an object to be processed by rotation.
[0002]
[Prior art]
Recently, attempts have been made to form a thick film on the substrate surface. For example, in order to form a protruding electrode called a bump having a height of about 10 to 20 μm on the IC pattern surface by applying an integrated circuit forming technique, a resist film having a thickness of about 10 to 20 μm is formed. There is a need.
Conventionally, wire bonding is performed to mount an IC chip on a substrate. However, in wire bonding, gold wires must be connected one by one, which is troublesome and takes time. Therefore, instead of wire bonding, a plurality of metal columns are provided on the chip itself, and the IC chip is mounted on the substrate via the metal columns. The height of the metal pillar is several tens of micrometers, and it is necessary to form a resist film with a thickness of several tens of micrometers in order to form the metal pillar by applying the integrated circuit forming technique.
[0003]
As described above, when the thickness of the resist film to be developed becomes thick, development cannot be performed in a normal development time, and the development is performed for a long time, resulting in a reduction in processing efficiency. Therefore, in order to increase the chemical reaction rate of development, the temperature of the developer is increased.
However, even if only the temperature of the developing solution is increased, the temperature of the developing solution is rapidly decreased unless the temperature of other elements such as the developing cup is increased. As measured by the present inventor, the developer temperature immediately after supply was 39.78 ° C., but after 200 seconds had elapsed, it decreased to 36.14 ° C.
[0004]
On the other hand, a developing device is known that adsorbs an object to be processed by a chuck, slowly rotates the object to be processed in this state, and uniformly diffuses the developer placed on the resist film on the surface of the object to be processed. Yes. In order to suppress the temperature fluctuation of the chuck, it has been proposed to provide a temperature adjusting member around the chuck and to fill the magnetic fluid in the chuck so as to increase the heat transfer from the chuck. (Patent Document 1).
[0005]
[Patent Literature]
(Patent Document 1) JP 2002-343696 A
[Problems to be solved by the invention]
In the method disclosed in Patent Document 1, only the chuck can adjust the temperature, and the temperature of the portion other than the portion in contact with the chuck cannot be adjusted. For this reason, uneven development tends to occur.
[0007]
[Means for Solving the Problems]
In order to solve the above problems, in the rotary developing device according to the present invention, a chuck for adsorbing and rotating the back surface of the object to be processed is arranged in the cup, and the bottom of the cup is large enough to cover the entire object to be processed. A jacket in which temperature-controlled water circulates is provided. A chuck shaft is disposed at the center of the jacket, and fins for enhancing the heat transfer effect are provided at the chuck shaft.
By setting it as such a structure, the heat-transfer effect to a chuck | zipper is also high and the whole to-be-processed object can be temperature-controlled.
[0008]
The jacket material is preferably made of aluminum. The thermal conductivity of aluminum is 133 to 165 (kcal / m · hr · ° C.), whereas the thermal conductivity of PVC (polyvinyl chloride), which is a normal cup material, is 0.14 to 0.17 (kcal / m · hr · ° C.), the temperature control effect is enhanced.
However, since aluminum is easily corroded, it is preferable to apply a Teflon (registered trademark) coating on at least the upper surface portion in contact with the developer.
[0009]
If the thickness of the Teflon (registered trademark) coating is thin, the heat transfer effect is enhanced but the corrosion resistance is inferior. Therefore, the thickness is preferably 50 to 100 μm.
[0010]
Moreover, it is good also as a structure which attached the rinse liquid ejection nozzle to the upper surface of the said jacket. In this case, the temperature of the rinsing liquid can also be controlled by penetrating the pipe for supplying the rinsing liquid to the rinsing liquid jet nozzle through the temperature adjusting water flow path of the jacket.
[0011]
The lower end position of the chuck that can be moved up and down is preferably determined so that the distance between the upper surface of the jacket and the rear surface of the object to be processed is 2 mm or less. When the distance between the upper surface of the jacket and the back surface of the object to be processed exceeds 2 mm, the temperature control effect is lowered.
[0012]
Further, the jacket may be configured such that the vertical position can be finely adjusted partially by the adjusting member.
When the object to be processed is enlarged, a slight distortion occurs between the central portion held by the chuck and the outer portion not held. Therefore, with the above-described configuration, slight distortion is also adjusted, and consequently, the in-plane parallelism between the workpiece and the jacket is adjusted, so that the temperature distribution of the workpiece can be made constant.
[0013]
Further, as a specific structure of the jacket, a structure in which a spiral temperature adjusting liquid flow path is formed on a vertical wall is conceivable. By setting it as such a structure, temperature control water circulates smoothly.
[0014]
Furthermore, the outer peripheral portion of the developing device may be provided with a trap portion that once exhausts downward and then upwards. With such a configuration, the drainage liquid (excess developer) can be reliably discharged from the drain pipe, and can be reliably separated from the exhaust gas.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 is a longitudinal sectional view of a rotary developing apparatus according to the present invention, FIG. 2 is a plan sectional view taken along the line A-A in FIG. 1, FIG. 3 is an enlarged sectional view of a main part of the temperature control jacket, and FIG. It is an expanded sectional view explaining the height adjustment mechanism of the upper surface.
[0016]
The rotary developing device includes a cup 1 that accommodates and rotates a workpiece W such as a glass substrate or a semiconductor wafer. The cup 1 includes a lower half 2 and an upper half 3, and the lower half 2 has a cylindrical inner plate 21 with a lower portion extending from the upper portion, and a bottom plate 22 that extends substantially horizontally outward from the lower end of the inner plate 21. The outer plate 23 rises outward from the outer peripheral end of the bottom plate 22, and a drain pipe 24 is connected to the bottom plate 22.
[0017]
The upper half 3 of the cup 1 has a cylindrical plate 31 that forms an opening through which the workpiece W is inserted and removed, an inclined plate 32 that extends obliquely downward from the lower end of the cylindrical plate 31, and the inclined plate 32. The vertical plate 33 extends downward from the outer end.
[0018]
The vertical plate 33 enters a space surrounded by the lower half 2 to form a U-shaped exhaust passage 34 in a sectional view. Since the exhaust passage 34 has a U-shape, it has a trap function, and the drainage efficiently collects at the drain pipe 24. A large number of exhaust ports 35 are formed in the outer rising passage of the exhaust passage 34.
[0019]
On the other hand, a temperature adjustment jacket 4 is attached to the upper end opening of the cylindrical inner plate 21. The jacket 4 is composed of an upper plate portion 41, a lower plate portion 42, and a partition wall 43 provided therebetween, all of which are made of aluminum (aluminum alloy) having excellent thermal conductivity. The area of the upper surface of the upper plate portion 41 is set equal to or larger than the area of the back surface (lower surface) of the workpiece W to cover the entire workpiece.
[0020]
The upper plate portion 41, the lower plate portion 42, and the partition wall 43 may be manufactured separately and joined later, but the partition wall 43 and the upper plate portion 41 or the lower plate portion 42 may be integrally cast.
[0021]
Further, the partition wall 43 has a spiral shape, and the temperature adjustment water flow path 44 defined by the partition wall 43 also has a spiral shape. A temperature adjustment water inlet 45 is formed at the innermost portion of the temperature adjustment water flow channel 44, and a temperature adjustment water outlet 46 is formed at the outermost portion, and the temperature adjustment water flowing from the temperature adjustment water inlet 45 is adjusted in temperature. After performing, the circulation path | route which flows out from the temperature control water outlet 46, is heated again with a heating apparatus, and flows in from the temperature control water inlet 45 again is formed.
[0022]
Further, as shown in FIG. 3, a part of the upper plate portion 41 defining the temperature adjusting water flow path 44 is formed as an inclined surface 47 facing outward, and a rinse liquid nozzle 48 is attached to the inclined surface 47, and this rinse is further performed. A pipe 49 for supplying a rinsing liquid to the liquid nozzle 48 is passed through the temperature adjusting water flow path 44. Thus, by arrange | positioning the piping 49 in the temperature control water flow path 44, the rinse liquid spouted toward the back surface of the to-be-processed object W is also temperature-controlled (23-80 degreeC).
[0023]
Further, a Teflon (registered trademark) coating 50 is formed on the surface of the upper plate portion 41 and the partition wall 43 constituting the jacket 4 which may come into contact with the developer so as to prevent corrosion. The thickness of the Teflon (registered trademark) coating 50 is suitably 50 to 100 μm. When it exceeds 100 μm, the thermal conductivity to the object to be processed is deteriorated.
In the illustrated example, the Teflon (registered trademark) coating 50 is also formed on the outer peripheral surface of the partition wall 43. However, since there is little opportunity for the developer to come into contact with this portion, the Teflon (registered trademark) coating 50 is not formed. May be.
[0024]
As shown in FIG. 4, the upper plate portion 41 constituting the jacket 4 is attached to the upper end portion of the cylindrical inner plate 21 of the cup 1 via the fine adjustment mechanism 6. The fine adjustment mechanism 6 includes a screw 61 that is rotatably attached to the upper plate portion 41 without rotating, and a screw hole 62 formed in the inner plate 21 into which the screw 61 is screwed. By loosening, the distance from the back surface of the workpiece W becomes narrow as shown in FIG. 4A, and by tightening the screw 61, the distance from the back surface of the workpiece W as shown in FIG. Become wider.
[0025]
A plurality of the fine adjustment mechanisms 6 are provided on the outer periphery of the upper plate portion 41 so that the height position of the upper plate portion 41 can be finely adjusted partially. When the workpiece W has a large size, distortion may occur partially in the outer peripheral portion, but the distortion of the substrate is corrected by partially adjusting the height position of the upper plate portion 41, and the substrate and Since the jacket spacing is uniform, the temperature distribution is uniform.
[0026]
On the other hand, a chuck 7 is disposed in an opening formed in the central portion of the jacket 4. There are electrostatic chucks and vacuum chucks for chucking workpieces. In this embodiment, a vacuum chuck is used. A passage 71 connected to the vacuum pump is formed in the shaft portion of the chuck 7, and fins 72 for enhancing the heat transfer effect are provided on the outer peripheral portion of the shaft portion.
[0027]
Further, the chuck 7 is rotatable and can be moved up and down, and is moved up to a position higher than the upper end portion of the cylindrical plate 31 at the rising end to deliver the workpiece W. The position of the descending end is set so that the distance between the back surface of the workpiece W adsorbed and the top surface of the jacket 4 is 2 mm or less. Note that 2 mm or less does not include contact between the workpiece W and the jacket 4. When contacted, the back surface of the workpiece W may become dirty.
[0028]
In the above, the processing object W adsorbed by the chuck 7 is slowly rotated together with the chuck while circulating the temperature control water of 23 to 80 ° C. in the temperature control water flow path 44 of the jacket 4, and the development is arranged on the surface of the object W to be processed. The solution is developed by diffusing the solution with centrifugal force.
[0029]
At this time, the temperature of the developer on the surface of the workpiece W immediately after the supply of the developer was 39.46 ° C., but the temperature of the developer after 200 seconds was 39.36 ° C. and hardly changed. It was.
[0030]
【The invention's effect】
As described above, according to the rotary developing device of the present invention, in order to transmit heat from the jacket for circulating the temperature-controlled water and the jacket, the fin is formed on the chuck shaft portion. Thus, the temperature of the entire object to be processed can be uniformly controlled. Therefore, the developing time can be shortened without lowering the temperature of the developer placed on the surface of the object to be processed.
Further, since the temperature of the entire object to be processed is uniformly controlled, development unevenness does not occur.
In addition, since the jacket is made of aluminum and necessary portions are provided with Teflon (registered trademark) coating, the heat transfer effect can be enhanced while preventing corrosion.
[0031]
Further, by adjusting the temperature of the rinsing liquid as well, it is possible to suppress the temperature of the object to be changed and to prevent development unevenness.
In addition, by making it possible to finely adjust the vertical position of the outer peripheral part of the upper surface of the jacket, it is possible to eliminate distortion caused by the increase in the size of the object to be processed, and to make the distance between the jacket and the object to be processed uniform. Temperature distribution can be made uniform.
Moreover, the temperature-controlled water circulates smoothly by forming a spiral temperature-controlled water flow path in the jacket.
Further, by providing a trap portion that once turns the exhaust gas downward and then upwards on the outer peripheral portion of the developing device, separation of the exhaust gas and the drainage is performed reliably, and the drainage is removed and discharged from the drain pipe.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a rotary developing apparatus according to the present invention. FIG. 2 is a plan sectional view taken along line AA in FIG. 1. FIG. ) And (b) are enlarged sectional views explaining the height adjustment mechanism of the upper surface of the temperature control jacket.
DESCRIPTION OF SYMBOLS 1 ... Cup, 2 ... Lower half of cup, 21 ... Cylindrical inner plate, 22 ... Bottom plate, 23 ... Outer plate, 24 ... Drain pipe, 3 ... Upper half of cup, 31 ... Cylindrical plate, 32 ... Inclined Plate, 33 ... Vertical plate, 34 ... Exhaust passage, 35 ... Exhaust port, 4 ... Temperature control jacket, 41 ... Upper plate part, 42 ... Lower plate part, 43 ... Bulkhead, 44 ... Temperature control water channel, 45 ... Temperature control Water inlet, 46 ... Temperature control water outlet, 47 ... Inclined surface, 48 ... Rinsing liquid nozzle, 49 ... Piping, 50 ... Teflon (registered trademark) coating, 6 ... Fine adjustment mechanism, 61 ... Screw, 62 ... Screw hole, 7 ... Chuck, 71 ... Passage connected to vacuum pump, 72 ... Fin, W ... Workpiece.

Claims (4)

In a rotary developing device for adsorbing a back surface of an object to be processed on which an exposed film has been formed on the surface with a chuck and rotating it in a cup to uniformly diffuse the developer supplied to the surface of the object, the bottom of the cup Is provided with a jacket in which temperature-controlled water of a size covering the entire object to be circulated is provided, and the shaft portion of the chuck is disposed at the center of the jacket, and the shaft portion of the chuck has a heat transfer effect. A rotary developing device, characterized in that fins for raising are provided and a spiral temperature-regulating water flow path is formed in the jacket on a vertical wall . In a rotary developing device for adsorbing a back surface of an object to be processed on which an exposed film has been formed on the surface with a chuck and rotating it in a cup to uniformly diffuse the developer supplied to the surface of the object, the bottom of the cup Is provided with a jacket in which temperature-controlled water of a size covering the entire object to be circulated is provided, and the shaft portion of the chuck is disposed at the center of the jacket, and the shaft portion of the chuck has a heat transfer effect. A fin for raising is provided, a rinse liquid jet nozzle is attached to the upper surface of the jacket, and a pipe for supplying the rinse liquid to the rinse liquid jet nozzle passes through the temperature control water flow path of the jacket. Rotating developing device. In a rotary developing device for adsorbing a back surface of an object to be processed on which an exposed film has been formed on the surface with a chuck and rotating it in a cup to uniformly diffuse the developer supplied to the surface of the object, the bottom of the cup Is provided with a jacket in which temperature-controlled water of a size covering the entire object to be circulated is provided, and the shaft portion of the chuck is disposed at the center of the jacket, and the shaft portion of the chuck has a heat transfer effect. 2. A rotary developing device according to claim 1, wherein fins are provided for enhancing the outer periphery of the jacket, and the upper and lower positions of the jacket are partially adjustable by an adjusting member . In a rotary developing device for adsorbing a back surface of an object to be processed on which an exposed film has been formed on the surface with a chuck and rotating it in a cup to uniformly diffuse the developer supplied to the surface of the object, the bottom of the cup Is provided with a jacket in which temperature-controlled water of a size covering the entire object to be circulated is provided, and the shaft portion of the chuck is disposed at the center of the jacket, and the shaft portion of the chuck has a heat transfer effect. A fin for raising is provided, and an exhaust passage having a trap function that forms a U shape in a cross-sectional view in which the exhaust is once turned downward and then upward is provided on the outer peripheral portion of the rotary developing device. Rotating developing device.

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