JP4100497B2 - Plate laminate, hollow laminate using plate laminate and plate heat pipe - Google Patents

Description

[0001]
[Technical field to which the invention belongs]
In the present invention, a plurality of plate materials are laminated and joined, and at least one pair of opposing plate materials are formed with a joining suppression portion in a predetermined pattern, and one or more of the joining restraining portions are to be opened. The present invention relates to a plate laminate material, a hollow laminate material using the plate laminate material, and a plate heat pipe using the hollow laminate material.
[0002]
[Prior art]
In computer equipment such as personal computers, high performance is being promoted rapidly, and in order to realize this high performance, radiators and heat exchangers that efficiently dissipate heat generated from MPUs and the like. Cooling device parts such as are needed.
[0003]
As one of such cooling device components, for example, a plate-type heat pipe as disclosed in Japanese Patent Laid-Open No. 10-185465 has been proposed. In this plate type heat pipe, a plurality of aluminum alloy materials are laminated and pressure-bonded, a narrow tunnel meandering at the boundary of the lamination is formed by a roll bond method, and chlorofluorocarbon 134a or the like is enclosed as a heat pipe working fluid in the tunnel. ing. As shown in FIGS. 1 and 2, this plate-type heat pipe 1 is formed by laminating two metal thin plates 3 and 4 and joining them by hot rolling, and then applying a pressure-bonding inhibitor in a predetermined pattern in advance. The meandering pattern portion of the boundary surface is expanded to form the meandering small diameter tunnel 2, and the heat dissipation performance is improved by dramatically increasing the number of meandering turns per unit width.
[0004]
[Problems to be solved by the invention]
However, in the cooling device parts formed by the conventional roll bond method as described above, the deformation of the base metal is large because the metal thin plates are joined by hot rolling, and the shape of the tunnel cannot be formed with high accuracy. There are also problems such as a decrease in bonding strength due to alloying between different metals in the steel.
[0005]
In view of the technical background as described above, the present invention provides a plate laminated material that can be reduced in weight and thickness, a hollow laminated material using the plate laminated material, and a plate heat pipe using the hollow laminated material. The issue is to provide.
[0006]
[Means for Solving the Problems]
As a first solution to the above problem, the plate laminate material of the present invention is a plate laminate material obtained by laminating and joining a plurality of plate materials having a thickness of 5 to 1000 μm , and at least between a pair of opposing plate materials. After forming the joint restraining portion in a predetermined pattern and activating the joint surface of the plate material in advance, the activated surfaces are brought into contact with each other so as to face each other, and the rolling rate is 0.1 to 30%. One or a plurality of locations of the joint restraining portion that have been cold-welded have a planned opening portion . Preferably, the activation process is configured to perform a glow discharge in an inert gas atmosphere and perform a sputter etching process on each of the surfaces to be bonded of the plate material.
[0007]
As a second means for solving the above problems, the hollow laminated material of the present invention has a configuration in which a hollow portion having a predetermined shape is formed by expanding the planned opening portion using the plate laminated material .
[0008]
As a third solution to the above problem, the plate-type heat pipe of the present invention has a configuration in which a heat pipe working body is enclosed in the hollow portion .
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described. FIG. 3 is a schematic plan view showing one embodiment of the hollow laminated material of the present invention, and shows an example in which one elongated tunnel-shaped hollow portion 11 meanders. In the figure, 11a is an opening. FIG. 4 is a schematic cross-sectional view showing an embodiment of the hollow laminated material of the present invention. At least one of two plate materials 12 and 13, for example, a hollow portion is formed by providing a recess 16 in the plate material 12. An example is shown. FIG. 5 is a schematic cross-sectional view showing another embodiment of the hollow laminated material of the present invention. At least one of the two plate materials 12 and 13, for example, the plate material 12 is thinned to form the recess 16. The example which provided and formed the hollow part is shown. FIG. 6 is a schematic cross-sectional view showing still another embodiment of the hollow laminated material of the present invention, in which a penetrating portion 17 is provided in the plate material 12 located in the middle of the three plate materials 12, 13, 14. The example which formed the hollow part by is shown. FIG. 7 is a schematic cross-sectional view showing still another embodiment of the hollow laminate material of the present invention, in which one side of the plate material forming the hollow portion is a two-layer laminate material comprising the plate materials 12 and 14. An example composed of FIG. 8 is a schematic cross-sectional view showing still another embodiment of the hollow laminated material of the present invention, in which both sides of the plate material forming the hollow portion are composed of the plate materials 12 and 14 and the plate materials 13 and 15, respectively. The example comprised by the laminated material of 2 layers is shown. FIG. 9 is a schematic cross-sectional view showing still another embodiment of the hollow laminated material of the present invention, and shows a form having a double-structured hollow portion.
[0010]
The material of the plate material 12 is not particularly limited as long as it is a material capable of producing a hollow laminated material, and can be appropriately selected and used depending on the use of the hollow laminated material. For example, metals that are solid at room temperature (for example, Al, Fe, Ni, Cu, Zn, Pd, Ag, Sn, Pt, Au, etc.) and alloys containing at least one of these metals (for example, specified in JIS) Or a laminated body (for example, a clad material, a plating material, a vapor deposition film material, etc.) having at least one layer of these metals and alloys can be applied. Furthermore, the above metal or alloy may be an amorphous body. In addition, a polymer material or a laminate in which the above metal or alloy is laminated on the polymer material can also be used. If the use of the hollow laminated material is a heat exchanger or the like, Cu, Al, Ni, etc., which are metals having excellent thermal conductivity, alloys containing at least one of these metals, or at least one of these metals and alloys are used. A stacked body including layers can be used.
[0011]
As an alloy prescribed in JIS, for example, for steel materials, alloy iron, structural steel, pressure vessel steel, thin steel plate, stainless steel, heat-resistant steel, superalloy, magnetic materials, etc., for Cu-based alloys, for example, JIS H 3100 Oxygen-free copper, tough pitch copper, phosphorous deoxidized copper, red brass, brass, free-cutting brass, tin-filled brass, admiralty brass, naval brass, aluminum bronze, phosphor bronze, bronze, etc. In the Ni series alloys such as 1000 series, 2000 series, 3000 series, 5000 series, 6000 series, 7000 series described in JIS H4000 or 4160, for example, ordinary carbon nickel, low carbon nickel, nickel-copper alloy described in JIS H4551 , Nickel-copper-aluminum-titanium alloy, nickel-molybdenum alloy, nickel-molybdenum-chromium alloy, nickel - chromium - Iron - molybdenum - copper alloy, a nickel - chromium - molybdenum - iron alloy, a nickel - iron alloy, a nickel - chromium - can be applied such as iron alloys.
[0012]
Further, the thickness of the plate material 12 can be appropriately selected depending on the use of the hollow laminated material. For example, it is 5-1000 micrometers. When the thickness is less than 5 μm, it is difficult to produce a plate material, and when it exceeds 1000 μm, it is difficult to produce a hollow laminated material. Preferably, it is 10-500 micrometers. The plate material 12 may be a substantially flat plate and may have some unevenness and curvature.
[0013]
There are no particular limitations on the dimensions and shape such as the material and thickness of the plate materials 13, 14 and 15 as long as they can be applied to the plate material 12, and the plate materials can be appropriately selected and used depending on the use of the hollow laminate material. 12 may be the same or different, and may be the same or different.
[0014]
For example, as shown in FIG. 4, the hollow laminated material of the present invention is activated by applying a bonding inhibitor or the like so as to form a bonding suppression portion having a predetermined pattern on the opposing surfaces of the two plate materials 12 and 13. After the plate forming process is performed, the plate laminated material 20 is manufactured by laminating and bonding, and if necessary, the plate laminated material 20 is cut into a predetermined size, and the bonding inhibition portion of the plate laminated material 20 is inflated with a mold expansion tube using air or the like to be hollow. It can be manufactured by forming the part 11.
[0015]
The manufacturing method of the hollow laminated material of this invention is demonstrated below. First, a method for manufacturing a two-layer laminate material used in FIGS. 7 and 8, that is, a laminate material composed of the plate materials 12 and 14 and the plate materials 13 and 15 will be described. In the laminated material manufacturing apparatus 50 shown in FIG. 10, the plate material 12 rewound from the rewind reel 62 is activated by the activation processing device 70. Similarly, the plate material 14 rewound from the rewound reel 64 is activated by the activation processing device 80. The plate members 12 and 14 are cold-welded by the pressure-welding unit 60 and laminated and bonded so that the surfaces subjected to the activation treatment are in contact with each other to produce the plate-laminated material 20 and wound by the take-up roll 66. Moreover, you may provide the cutting-out process cut out to a predetermined | prescribed magnitude | size instead of a winding roll part as needed. In this way, a two-layer laminate can be produced.
[0016]
The activation process is performed as follows. That is, the plate material 12 put into the activation processing apparatus 70 is brought into contact with one electrode A (electrode roll 72) grounded and sputter-etched with the other electrode B (electrode 74) supported and insulated. Perform the activation process. Similarly, the plate material 14 put into the activation processing apparatus 80 is brought into contact with one electrode A (electrode roll 82) grounded and sputter-etched with the other electrode B (electrode 84) supported by insulation. The activation process by is performed. In the activation treatment, glow discharge is performed by applying an alternating current of 1 to 50 MHz between electrodes A and B in an extremely low pressure inert gas atmosphere of 10 to 1 × 10 ⁻³ Pa, preferably argon gas. Sputter etching is performed so that the area of the electrode A exposed in the plasma generated by the above is effectively 1/3 or less of the area of the electrode B. If the inert gas pressure is less than 1 × 10 ⁻³ Pa, stable glow discharge is difficult to perform and high-speed etching is difficult, and if it exceeds 10 Pa, the activation treatment efficiency decreases. If the alternating current applied is less than 1 MHz, it is difficult to maintain a stable glow discharge, and continuous etching is difficult, and if it exceeds 50 MHz, oscillation tends to occur and the power supply system becomes complicated, which is not preferable. Further, in order to etch efficiently, the area of the electrode A needs to be smaller than the area of the electrode B. By effectively setting it to 1/3 or less, the etching can be performed with sufficient efficiency.
[0017]
Lamination bonding is performed as follows. That is, the laminated bonding can be achieved by cold-welding with the pressure-welding unit 60 by bringing the plates 12 and 14 into contact with each other so that the surfaces subjected to the activation treatment are opposed to each other. Lamination joining at this time is possible at low temperature and low rolling rate, and mitigates adverse effects such as structural changes, alloying, fracture, etc. on the plate material and laminating joint as in hot welding or high rolling rate welding. Or it can be eliminated. At this time, the temperature T (° C.) of the plate material is preferably 0 ° C. <T ≦ 300 ° C. If it is 0 ° C. or less, a large cooling device is required, and if it exceeds 300 ° C., the joint is alloyed and the joint strength is lowered, which is not preferable. The rolling rate R (%) is preferably 0.1% ≦ R ≦ 30%. If it is less than 0.1%, sufficient bonding strength cannot be obtained, and if it exceeds 30%, deformation becomes large, which is not preferable in terms of processing accuracy.
[0018]
Next, the method for manufacturing the hollow laminate shown in FIG. 3 will be described by taking as an example the case of using a bonding inhibitor. In the hollow laminated material 10 shown in FIG. 3, 11 is a hollow part. The hollow portion 11 can be formed as follows. As shown in FIG. 4, first, at least one of the plate materials 12 and 13 is bonded to at least one plate material with a bonding inhibitor or the like so as to form a predetermined pattern of the bonding suppression portion corresponding to the hollow portion shape. Apply. For example, in the laminated material manufacturing apparatus 50 shown in FIG. 10, the plate material 13 is used instead of the plate material 14, and at least one of the activation processing devices 70 and 80 is used as the plate laminated material instead of the plate laminated material 20. Applying the bonding inhibitor in a predetermined pattern to the rewound plate material by providing a process or device for printing a predetermined pattern of the bonding inhibitor before, that is, between the rewinding reel and the activation processing device. Is possible. The bonding inhibitor can be applied by pattern printing or the like. As the bonding inhibitor, for example, an ink mainly composed of colloidal graphite can be used. The application thickness of the bonding inhibitor can be set to a thickness that does not disappear due to the activation treatment performed thereafter, or to a level at which the bonding inhibitor is not bonded during the lamination bonding.
[0019]
Thereafter, activation processing is performed on the opposing surfaces of the plate materials 12 and 13 by the activation processing devices 70 and 80, and the surfaces of the plate materials 12 and 13 that are subjected to the activation processing are opposed to each other so that they are in contact with each other. The plate laminate 20 can be manufactured by performing cold pressure welding with the pressure welding unit 60 and laminating and joining them. By laminating and bonding in this manner, only the portion where the bonding inhibitor has not adhered is pressed and a bonding suppression portion is formed in the portion where the bonding inhibitor has adhered. Thereafter, if necessary, the plate laminate 20 can be manufactured by cutting it into a predetermined size and having the joint inhibiting portion of the present invention. Moreover, you may provide the through-hole which penetrates front and back in the junction part of the plate laminated material 20. As shown in FIG. Note that the printing process and apparatus for the bonding inhibitor may be installed after the activation processing apparatus, that is, between the activation processing apparatus and the pressure contact unit.
[0020]
The hollow laminated material of the present invention is obtained by cutting out the plate laminated material produced as described above, sending compressed air or the like from the opening portion 11a to the joint inhibiting portion of the plate laminated material, and if necessary, a mold or the like. It is used by expanding at least one surface of the plate material. In this way, the hollow portion 11 is formed. Further, if necessary, the inside of the hollow portion may be washed to remove excess bonding inhibitor. The hollow laminated material 10 which has the hollow part 11 of this invention as mentioned above can be manufactured. Note that the plurality of openings may be formed after the expansion tube, or may have a planned opening in the state of a plate laminate before the expansion tube.
[0021]
Laminate bonding can also be achieved by replacing the pressure welding unit with a press working apparatus or the like. Further, after printing the bonding inhibitor or after the sputter etching process, a plate material or the like may be cut out to a predetermined size and then laminated and pressed. It is also possible to first cut a plate material or the like into a predetermined size, and then perform sputter etching processing / bonding inhibitor printing to perform lamination and press processing. In the case where the sputter etching process is performed after cutting out, the plate material may be one electrode A that is insulated and supported, and the activation process may be performed between the other electrode B that is grounded.
[0022]
The hollow laminated material shown in FIG. 4 is laminated in the laminated material manufacturing apparatus 50 shown in FIG. 10 by providing a non-pressure contact portion such as a depression corresponding to a predetermined pattern of the bonding suppression portion on the pressure contact roll surface of the pressure contact unit 60. It can also be manufactured by manufacturing the material 20 and expanding the plate laminated material 20. A bonding inhibitor or the like may be used in combination.
[0023]
The hollow laminated material as shown in FIG. 5 forms a concave portion by subjecting at least one of the plate materials to a thin pattern processing of a predetermined pattern, thereby forming a bonding suppression portion. That is, a plate material in which a thin portion has been formed in advance is loaded into the laminated material manufacturing apparatus shown in FIG. 10 and laminated or joined, or a thin-wall processing step or apparatus is provided between the rewinding reel and the activation processing apparatus. Thus, a hollow laminated material can be manufactured by subjecting the unwound plate material to thin-wall processing and then laminating and joining. Furthermore, you may process an expansion tube etc. to the hollow laminated material manufactured in this way as needed.
[0024]
The hollow laminated material as shown in FIG. 6 forms a hollow portion by closing a through hole of a plate material having a predetermined pattern of through holes with another plate material. Become. Furthermore, you may process an expansion tube etc. to the hollow laminated material manufactured in this way as needed.
[0025]
7 and 8 can be manufactured by using the two-layer plate laminate 20 instead of the plate members 12 and 13 in the laminate production apparatus 50 shown in FIG. For example, in the hollow laminated material as shown in FIG. 8, a two-layer laminated material in which aluminum plates 14 and 15 are laminated and joined to the copper plates 12 and 13 may be used as the laminated material used on both sides of the hollow portion. As a result, when liquid or gas such as water is present in the hollow part, the copper plate is used on the inside to increase the corrosion resistance, or the copper-aluminum laminate is used to reduce the weight or to increase the specific strength. Can be increased. Moreover, it is preferable that the thickness of a copper plate shall be 0.01-0.1 mm. If it is less than 0.01 mm, sufficient corrosion resistance cannot be obtained, and if it is thicker than 0.1 mm, it becomes too heavy and there is no need to reinforce by laminating and joining from the strength aspect. Moreover, it is preferable that the thickness of an aluminum plate shall be 0.05-1.0 mm. If it is less than 0.05 mm, sufficient strength cannot be obtained, and if it is thicker than 1.0 mm, it becomes too heavy, which is not preferable.
[0026]
In the hollow laminated material of the present invention, as shown in FIG. 9, a part of the hollow portion may have a multiple structure. Such a hollow portion may be a multistage expansion tube that expands the inner hollow portion and then expands the outer hollow portion, or may expand the tube at the same time. At this time, this can be achieved by making the expansion tube pressure of the inner hollow portion higher than that of the outer side. The hollow portions may be the same shape or different shapes, and the inner and outer openings may be provided at the same location or at different locations.
[0027]
Furthermore, the component of the present invention uses a hollow laminated material having one or a plurality of openings. In a part having a plurality of openings, a form that is partially communicated inside the hollow part or a form that is not communicated is possible. For example, what has two opening parts and is connected inside a hollow part can be utilized as integral piping. By using such an integrated pipe, it is possible to suppress vibration applied to the portion forming the hollow portion, compared to a normal pipe. What has a hollow part of a multiple structure can be used also for heat exchanger components. Moreover, even if it has two opening parts, what is not connected inside a hollow part can be used for a two-plate type heat pipe. A component having one opening can be used for a single plate heat pipe or the like.
[0028]
In the plate type heat pipe, after creating a hollow laminated material, a predetermined amount of a heat pipe working body is sealed through the opening 11a of the hollow laminated material, and the inside is filled with a predetermined pressure, for example, a vacuum state, a reduced pressure state or an atmospheric pressure level. Thus, the opening can be sealed by a method such as welding. As the heat pipe actuating body, water, pure water or ultrapure water can be used from the viewpoint of easy handling, particularly from the viewpoint of defluorination. Moreover, in the heat pipe manufactured in this way, since the drawing portion of the heat pipe working body by capillary force can be formed on both sides in the width direction in the hollow portion 11, the heat dissipation performance is not affected by the holding posture. It becomes possible to demonstrate.
[0029]
【Example】
Embodiments will be described below with reference to the drawings. An oxygen-free copper plate having a thickness of 100 μm was used as the plate materials 12 and 13. The ink was applied to the oxygen-free copper plate in a predetermined pattern, set together with the oxygen-free copper plate in the laminated material manufacturing apparatus 50, and activated by the sputter etching method in the activation processing units 70 and 80 in the vacuum chamber 52. Next, using the press contact unit 60, these activated oxygen-free copper plates were stacked with the activation surfaces overlapped and pressed to form a laminated laminate 20. Next, the plate laminated material 20 was cut into a predetermined size to form two planned openings, and an air expansion tube was used to produce a hollow laminated material 10 in which the two openings communicated. Further, a through-hole was partially provided in the joint 18 of the hollow laminated material 10 to manufacture an integrated pipe.
[0030]
【The invention's effect】
As described above, the plate laminated material of the present invention is a plate laminated material obtained by laminating and bonding a plurality of plate materials, and at least one pair of opposing plate materials is provided with a bonding suppression portion in a predetermined pattern. It is formed, and one or a plurality of locations of the joint restraining portion is a planned opening portion. Moreover, the hollow laminated body of this invention becomes a joining suppression part as a hollow part. Furthermore, the component of the present invention uses a hollow laminated material having one or a plurality of openings. For this reason, it is possible to join a thin metal plate at a low rolling rate without adversely affecting the joining portion, so that it is possible to achieve high precision in shape and light weight, and it can be suitably used for various parts. .
[Brief description of the drawings]
FIG. 1 is an example of a schematic plan view of a conventional plate heat pipe.
FIG. 2 is an example of a schematic cross section of a conventional plate heat pipe.
FIG. 3 is an embodiment of a schematic plan view of the hollow laminate of the present invention.
FIG. 4 is an embodiment of a schematic cross-sectional view of the hollow laminate of the present invention.
FIG. 5 is another embodiment of the schematic cross-sectional view of the hollow laminate of the present invention.
FIG. 6 is still another embodiment of the schematic cross-sectional view of the hollow laminate of the present invention.
FIG. 7 is still another embodiment of the schematic cross-sectional view of the hollow laminate of the present invention.
FIG. 8 is still another embodiment of the schematic cross-sectional view of the hollow laminate of the present invention.
FIG. 9 is still another embodiment of the schematic cross-sectional view of the hollow laminate of the present invention.
FIG. 10 is an embodiment of a schematic cross-sectional view of a plate laminate manufacturing apparatus used in the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Hollow body 2 Tunnel 3 Metal thin plate 4 Metal thin plate 5 Joint part 6 Expansion pipe part 10 Hollow laminated material 11 Hollow part (tunnel)
11a Opening portion 12 Plate material 13 Plate material 14 Plate material 15 Plate material 16 Recessed portion 17 Through hole 18 Joint portion 19 Joint portion 20 Plate laminated material 21 Hollow portion (tunnel)
DESCRIPTION OF SYMBOLS 50 Laminate manufacturing apparatus 52 Vacuum tank 60 Pressure-contact unit 62 Rewinding reel 64 Rewinding reel 66 Winding roll 70 Activation processing apparatus 72 Electrode roll 74 Electrode 80 Activation processing apparatus 82 Electrode roll 84 Electrode A Electrode A
B Electrode B

Claims (4)

A plate laminated material formed by laminating and bonding a plurality of plate materials having a thickness of 5 to 1000 μm, and forming a bonding suppression portion in a predetermined pattern between at least one pair of opposing plate materials, and joining surfaces of the plate materials After the activation treatment, the activation treatment surfaces are brought into contact with each other so as to face each other, and are cold-welded at a rolling rate of 0.1 to 30%, so that one or a plurality of locations of the joint suppressing portion are opened. A plate laminate having a predetermined portion. 2. The plate laminate according to claim 1 , wherein in the activation treatment, glow discharge is performed in an inert gas atmosphere to perform sputter etching treatment on each of the surfaces to be bonded of the plate material. The hollow laminated material which forms the hollow part of a predetermined shape by expanding the said opening scheduled part using the plate laminated material of Claim 1 or 2 . A plate-type heat pipe formed by enclosing a heat pipe working body in the hollow portion using the hollow laminated material according to claim 3.

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