JP4124516B2 - Carrier tape - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a carrier tape used for supplying or transporting an electronic component to a mounting device, in particular, a carrier tape suitable for storing a leaded electronic component such as a QFP (Quad Flat Package) comprising a mold part (main body) and a lead. About.
[0002]
[Prior art]
As a conventional carrier tape, for example, one described in Japanese Patent Publication No. 4-42260 is known. In Japanese Patent Publication No. 4-42260, there are a large number of recesses capable of accommodating electronic components at intervals in the longitudinal direction, a protrusion (base) is formed on the bottom surface of the recess, and a plurality of recesses along the outer periphery are formed on the base. A carrier tape having a plurality of protrusions is described. In this carrier tape, the protrusion is positioned between the electronic component main body and the lead bent portion, the protrusion sandwiches the bottom side portion of the electronic component main body, prevents the lead from contacting the side surface of the concave portion, and protects the lead.
[0003]
[Problems to be solved by the invention]
As described above, such a carrier tape is provided for the purpose of restricting the movement of the electronic component main body as described above, and in order to improve the rigidity of the object, the protrusion is placed on the pedestal over the entire circumference, and It is desired that the height be as large as possible below the dimension from the bottom of the electronic component body to the lead root. However, the carrier tape is formed by pressure forming, vacuum forming, press forming or the like, and it is inevitable that the carrier tape is thin due to the elongation of the material film during forming. And this thinning becomes more conspicuous at the corners of the bottom surface of the recesses as the height of the projections is increased, and when a projection with a large height is formed on the entire circumference on the base, the thickness of the corners of the bottom surface of the recesses is increased. Becomes extremely thin.
The present invention has been made in view of the above circumstances, and provides a carrier tape capable of forming protrusions (ridges) at a considerable height over the entire circumference of the pedestal upper surface without extremely thinning the corners of the recess bottom. An object of the present invention is to further improve the rigidity and more reliably prevent the movement of the stored electronic components.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a carrier tape in which a plurality of storage recesses capable of storing electronic components with leads are formed at predetermined intervals in the longitudinal direction, and a rectangular base in plan view on the bottom surface of the storage recess The ridge is swelled so that the electronic component main body can be placed, and a ridge is continuously projected over the entire circumference of the upper periphery of the pedestal , and the ridge is positioned at the high portion and the corner of the upper surface of the pedestal. A low portion formed lower than the height of the high portion, wherein the high portion is 1/3 to 1/2 of the height from the bottom surface of the electronic component main body to the lead root, and the low portion is the electronic component The height from the bottom surface of the main body to the lead root is 1/10 to 1/5.
[0005]
And the carrier tape concerning this invention is the aspect (Claim 2) which forms a dent in the center part of the said base, Moreover, the length of the low part in the both ends of one piece of the said ridge is the electronic component main body. the aspect (claim 3) in the range of 1 / 15-1 / 4 with respect to the length of the side, also an auxiliary ridge extending toward the inner wall surface angle portion of the housing recess from the corner of the ridge In addition to this aspect (Claim 4), a cornering surface can be formed at a corner between the side wall surfaces of the storage recess (Claim 5) .
[0006]
[Action]
The carrier tape concerning this invention accommodates an electronic component in the state by which the main body was mounted on the base. A ridge is formed on the entire periphery of the upper surface of the pedestal, and the ridge has a high portion and a low portion located at a corner of the upper surface of the pedestal and lower than the height of the high portion, Is 1/3 to 1/2 of the height from the bottom surface of the electronic component body to the lead root, and the low portion is 1/10 to 1/5 of the height from the bottom surface of the electronic component body to the lead root. For this reason, the rigidity can be improved, and the movement of the stored electronic component body can be effectively prevented by the ridge, particularly the high ridge at the center of the side, and can be stably stored . Since the height is lowered, it is possible to prevent the corners of the storage recesses from becoming extremely thin during molding.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
1 to 4 show a carrier tape according to one embodiment of the present invention, in which FIG. 1 is a partial plan view, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. -B arrow sectional drawing and FIG. 4 is the elements on larger scale of FIG.
[0008]
Reference numeral 10 denotes an embossed carrier tape (hereinafter referred to as a carrier tape). The carrier tape 10 has a large number of storage recesses 12 opened on one surface (front surface) at regular intervals in the tape longitudinal direction. The electronic component 20 is accommodated. Although illustration and detailed description are omitted, a top tape T is bonded to the surface of the carrier tape 10 in a state where an electronic component is stored in the storage recess 12, and the opening of the storage recess 12 is closed.
In addition, 11 is a feed hole formed by penetrating at regular intervals on both sides in the width direction.
[0009]
As schematically shown in FIG. 2, the electronic component 20 has a plurality of leads 22 extending on four side surfaces of a rectangular main body 21 made of a resin mold or the like, and is typically represented by a semiconductor package such as QFP. Is done. As will be described later, the electronic component 20 is housed in the housing recess 12 with the main body 21 placed on the pedestal, and the leads 22 extend over the pedestal periphery across the ridge. The electronic component 20 has a dimension H from the bottom surface of the main body 21 to the root of the lead 22 (see FIG. 2).
[0010]
The storage recess 12 has a substantially rectangular parallelepiped shape that rises at a predetermined inclination angle at which the side wall surface expands on the opening side at each of the four sides of the rectangular bottom surface, and the pedestal 15 swells symmetrically with the bottom surface at the bottom surface. A lead receiving groove 14 is defined around the base 15. The pedestal 15 has a rectangular shape whose upper surface is similar to the bottom surface of the storage recess 12 and has a size corresponding to the main body 21 of the electronic component 20. In this pedestal 15, a ridge 17 is provided integrally and continuously on the periphery of the upper surface, and a recess 16 that is recessed toward the back surface is formed in the center of the upper surface. A detection hole 19 is formed in the center of the recess 16. It is formed through. The recess 16 has a rectangular shape similar to the top surface of the pedestal 15, is inclined so that four side surfaces expand on the opening side, and the opening is smaller than the electronic component main body 21.
[0011]
As shown in detail in FIG. 4, the ridge 17 has a high portion 17 a over a predetermined range at the center of each side of the upper surface of the pedestal 15, and a low portion 17 b continuous with the high portion 17 a at four corners of the upper surface of the pedestal 15. The high portion 17a is about 1/3 to 1/2 of the dimension H of the electronic component 20 described above, and the clearance δ formed between the main body 21 and the top tape T when the top tape T is bonded. Has a greater height ha. The low portion 17 b has a height hb of about 1/10 to 1/5 of the dimension H of the electronic component 20 and is continuous with the auxiliary ridge 18. The auxiliary ridge 18 has a height (hb) substantially equal to the low portion 17 b of the ridge 17, and continues from the low portion 17 b to the corner of the side wall surface of the storage recess 12.
[0012]
In the carrier tape 10 according to this embodiment, after the electronic component 20 is stored in the storage recess 12, the top tape is bonded to the surface to close the opening of the storage recess 12, and transportation or the like is performed in this state. Is called. The electronic component 20 is stored in a state in which the main body 21 is placed on the pedestal 15 and the lead 22 extends over the ridge 17 into the lead storing groove 14. Here, the pedestal 15 has a recess 16 formed on the surface and is excellent in flatness on the upper surface, and the electronic component 20 is formed by the ridge 17 so that the main body 21 moves continuously, that is, continuously around the entire circumference of the pedestal 15. A high portion 17a at the center of the side of the pedestal 15 is regulated by a ridge 17 having a height ha greater than the clearance with the top tape. For this reason, the electronic component 20 can be stably accommodated and rattling during transportation can be prevented. Further, the low portions 17b at both ends of one side of the ridge 17 are each in a range of 1/15 to 1/4 with respect to the length of the side of the electronic component main body 21 to prevent the electronic component 20 from falling off. This is preferable.
[0013]
Further, in this carrier tape, a ridge 17 is continuous with the entire periphery of the upper surface of the pedestal 15, and an auxiliary ridge 18 is continued from the lower corner portion 17 b of the ridge 17 to the side corner portion of the storage recess 12. For this reason, the rigidity can be improved, the electronic component 20 can be easily stored in the storage recess 12, taken out from the storage recess 12, etc., and high reliability can be obtained for storage. The carrier tape 10 is formed by pressure forming or the like. However, since the ridge 19 has a low portion 17b having a low height at the corner portion of the pedestal 15, the elongation at the time of forming can be reduced, and the bottom of the storage recess 12 can be reduced. It is possible to suppress the thinning of the corner portion of the mold and to improve the releasability from the mold.
[0014]
FIG. 5 shows a carrier tape according to another embodiment of the present invention and is a partial plan view thereof.
In this embodiment, the same parts as those in the above-described embodiment are denoted by the same reference numerals and description thereof is omitted.
[0015]
In this embodiment, a cornering surface 33 is formed over the entire depth of the storage recess 12 at the corner between the side wall surfaces of the storage recess 12. The corner surface 33 is formed so that the width dimension thereof does not interfere with the lead 22 of the electronic component 20 accommodated, intersects the adjacent side wall surface at an obtuse angle, and continues to the auxiliary ridge 18.
[0016]
Even in this embodiment, similarly to the above-described embodiment, the ridge 17 is continuously formed on the entire periphery of the upper surface of the pedestal 15 so that the electronic component 20 can be stably stored. In addition, since the auxiliary ridge 18 is formed, the rigidity is also improved. Further, since the ridge 17 has the low portion 17b having a low height at the corner portion, it is possible to suppress the thinning of the corner portion of the storage recess 12. In particular, in this embodiment, since the cornering surfaces 33 are formed at the corners between the side wall surfaces of the storage recess 12, the refraction angle of the side wall surfaces can be increased, and thinning during molding can be more effectively prevented.
[0017]
In the above-described embodiment, the auxiliary ridge 18 is formed at the same height hb as the lower portion 17b of the ridge 17. However, the height of the auxiliary ridge 18 can be arbitrarily set. It is also possible to mold so as to incline upward toward the opening or incline downward toward the bottom surface of the storage recess 12.
[0018]
【The invention's effect】
As described above, according to the present invention, the pedestal is formed so as to bulge toward the opening side on the bottom surface of the housing recess, and the ridge is formed on the entire periphery of the pedestal upper surface. A lower portion formed at a corner portion of the upper surface and lower than the height of the high portion, and the high portion is 1/3 to 1/2 of the height from the bottom surface of the electronic component body to the lead root. The lower part is 1/10 to 1/5 of the height from the bottom surface of the electronic component body to the lead root, so that not only can the electronic component be stably stored, but also the rigidity is improved, The corners of the storage recesses can be molded without extremely thinning, and the releasability from the mold can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view showing a part of a carrier tape according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along the line AA in FIG.
FIG. 3 is a cross-sectional view taken along the line BB in FIG. 1;
FIG. 4 is a partially enlarged view of FIG. 3;
FIG. 5 is a plan view showing a part of a carrier tape according to another embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Carrier tape 12 Storage recessed part 15 Base 16 Recessed part 17 Ridge 17a High part 17b Low part 18 Auxiliary ridge 20 Electronic component 21 Main body 22 Lead 33 Cornering surface

Claims (5)

In the carrier tape in which a large number of storage recesses capable of storing electronic components with leads are formed at predetermined intervals in the longitudinal direction,
A pedestal having a rectangular shape in plan view is formed on the bottom surface of the storage recess so that the electronic component main body can be placed thereon, and a ridge is continuously projected over the entire periphery of the upper periphery of the pedestal so that the ridge is a high portion. And a lower portion located at a corner of the upper surface of the pedestal and formed lower than the height of the high portion, the high portion being 1/3 of the height from the bottom surface of the electronic component body to the lead root. The carrier tape according to claim 1, wherein the lower portion is 1/10 to 1/5 of a height from a bottom surface of the electronic component main body to a lead root .   The carrier tape according to claim 1, wherein a dent is formed in a central portion of the pedestal. 2. The carrier tape according to claim 1, wherein a length of a low portion at both ends of one piece of the ridge is in a range of 1/15 to 1/4 with respect to a length of a side of the electronic component main body .   The carrier tape according to claim 1, wherein an auxiliary ridge extending from a corner of the ridge toward an inner wall corner of the storage recess is formed. The carrier tape according to any one of claims 1 to 4, wherein a cornering surface is formed at a corner between the side wall surfaces of the storage recess.

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