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JP4128262B2 - Sample stage and particle size measuring apparatus using the same - Google Patents
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JP4128262B2 - Sample stage and particle size measuring apparatus using the same - Google Patents

Sample stage and particle size measuring apparatus using the same Download PDF

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Publication number
JP4128262B2
JP4128262B2 JP10335498A JP10335498A JP4128262B2 JP 4128262 B2 JP4128262 B2 JP 4128262B2 JP 10335498 A JP10335498 A JP 10335498A JP 10335498 A JP10335498 A JP 10335498A JP 4128262 B2 JP4128262 B2 JP 4128262B2
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angle
measured
sample
moving
holding plate
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JPH11281543A (en
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勇蔵 森
伸一郎 渡辺
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Jasco Corp
Japan Science and Technology Agency
National Institute of Japan Science and Technology Agency
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Jasco Corp
Japan Science and Technology Agency
National Institute of Japan Science and Technology Agency
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Sampling And Sample Adjustment (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は試料ステージ及びそれを用いた粒径計測装置、特に試料ステージの上下位置の制御機構の改良に関する。
【0002】
【従来の技術】
従来、例えばパターン未形成シリコンウエハ上のナノメータオーダの粒子直径を計測するため、各種の粒径計測装置が用いられている。
【0003】
図1に示すように、かかる粒径計測装置10は、レーザ光L1を出射する光源12と、レーザ光L1を収束する凸レンズ14と、シリコンウエハ等の試料16が装填される試料ステージ18と、レーザ光L1の微粒子19よりのレーリ散乱光L2を検出器20に集光する集光器22と、検出器20で得た散乱光の強度変化より粒径を計測する検出回路24を備える。
このようにして粒径計測装置10を構成することにより、シリコンウエハ等の試料16に付着した微粒子19の直径を計測することができる。
【0004】
ところで、シリコンウエハ上の異物である微粒子19を検出する際、収束レーザ光L1を被測定面上の任意方向、XY方向に走査する必要がある。
このために、試料ステージ18は、試料16が装填される試料保持板28と、X軸モータ30と、Y軸モータ32と、駆動回路34,36と、制御回路38を備える。
そして、制御回路38は、駆動回路34,36に指示を与え、X軸モータ30、Y軸モータ32の動作を制御することにより、試料保持板28上の試料16をXY方向に移動させる。これにより、レーザ光L1をXY方向に走査するのである。
なお、正反射光L3は、集光器22の外へ出す構造となっている。
【0005】
【発明が解決しようとする課題】
ところで、微粒子19よりのレーリ散乱光L2を検出するためには、被測定面に焦点を合わせなければならない。このため、一般に、測定前、被測定面の特定部位の焦点合わせを行っていた。
【0006】
しかしながら、前記焦点合わせ後、従来の試料ステージ18を用いた粒径計測装置10では、一般に試料ステージ18をXY方向へのみ移動させながら検出を行っていたため、試料16の状態が悪く測定面にうねりがあったり、試料ステージ18の精度が悪いと、走査中に被測定面の上下位置が最適焦点位置よりZ方向にずれてしまう。このため、焦点が被測定面に合っていない状態で測定をしたり、又は測定を中断して焦点を合わせるための微妙な再調整を手動的にしなければならず、面倒であった。
【0007】
本発明は、前記従来技術の課題に鑑みなされたものであり、その目的は、被測定面の上下位置が所定の位置よりずれた場合であっても、それを正確に再調整することが容易にできる試料ステージ及びそれを用いた粒径計測装置を提供することにある。
【0008】
【課題を解決するための手段】
前記目的を達成するために、本発明に係る試料ステージは、試料を保持する試料保持板を、試料の被測定面に対し平行方向へ移動可能な平行移動手段を備えた試料ステージにおいて、直角移動手段と、位置検出手段と、角度検出手段、位置決定手段と、ステージ制御手段と、を備えたことを特徴とする。
【0009】
前記直角移動手段は、前記試料保持板を被測定面に対し直角方向へ移動可能なものである。
前記位置検出手段は、前記被測定面よりの反射光を受光し、該反射光の受光位置より、被測定面の仮の位置情報を得るためのものである。
前記角度検出手段は、前記反射光を受光し、該反射光の受光位置より被測定面の角度情報を得るためのものである。
【0010】
前記位置決定手段は、前記角度検出手段で得た角度情報と所定の角度情報とを比較し、誤差なしと判断したときは、前記位置検出手段で得た位置情報をそのまま真の位置情報とし、また誤差ありと判断したときは、該誤差に基づいて前記位置検出手段で得た位置情報を校正して真の位置情報とする。
ここでいう「所定の角度情報」とは、例えば最適焦点位置の設定時における被測定面の角度をいう。
【0011】
前記ステージ制御手段は、前記位置決定手段で得た位置情報が所定の位置となるように、前記直角移動手段により試料保持板を移動させる。
また、前記目的を達成するために、本発明に係る試料ステージは、試料を保持する試料保持板を、試料の被測定面に対し平行へ移動可能な平行移動手段を備えた試料ステージにおいて、直角移動手段と、角度変更手段と、角度検出手段と、位置検出手段と、ステージ制御手段と、を備えたことを特徴とする。
【0012】
前記直角移動手段は、前記試料保持板を被測定面に対し直角方向へ移動可能なものである。
前記角度変更手段は、前記試料保持板の角度を変更可能なものである。
前記角度検出手段は、前記被測定面よりの反射光を受光し、該反射光の受光位置より被測定面の角度情報を得るためのものである。
【0013】
前記位置検出手段は、前記反射光を受光し、該反射光の受光位置より、被測定面の位置情報を得るためのものである。
前記ステージ制御手段は、前記角度検出手段で得た角度情報が所定の角度となるように、前記角度変更手段により試料保持板を傾斜させた後、前記位置検出手段で得た位置情報が所定の位置となるように、前記直角移動手段により該試料保持板を移動させる。
【0014】
なお、前記試料ステージにおいて、前記被測定面よりの反射光を2分割し、その一方の光を前記位置検出手段に入射させ、その他方の光を前記角度検出手段に入射させるビームスプリッタを備えることが好適である。
また、前記目的を達成するために、本発明に係る粒径計測装置は、前記本発明に係る試料ステージにおいて、粒径計測手段を備えたことを特徴とする。
前記粒径計測手段は、収束レーザ光を被測定面に照射して走査しながら粒子からのレーリ散乱光を検出し、該粒子からの散乱光強度よりその粒径を計測する。
【0015】
【発明の実施形態】
以下、図面に基づき本発明の好適な実施形態を説明する。
第1実施形態
図2には本発明の第1実施形態に係る粒径計測装置の概略構成の図が示されいる。なお、前記図1と対応する部分には符号100を加えて示し説明を省略する。
同図に示す粒径計測装置110は、光源112と、凸レンズ114と、検出器120と、集光器122と、検出回路124と、水平移動手段であるX軸モータ130、Y軸モータ132及び駆動回路134,136を備える。
【0016】
前記凸レンズ114は、光源112よりのレーザ光L1を収束して試料116の被測定面に照射する(例えば入射角は、被測定面に対し45度)。
前記集光器122は、例えば楕円面鏡よりなり、収束レーザ光L1の被測定面よりのレーリ散乱光L2を1点に集光して検出器120に集める。
【0017】
前記検出器120は、例えば光電子増倍管(PMT)よりなり、集光器124よりのレーリ散乱光L2を検出し、該散乱光強度に比例した電気信号に変換する。
前記X軸モータ130及びY軸モータ132は、例えばステッピングモータよりなり、試料保持板128をXY方向に一定範囲で移動可能なものである。
【0018】
このようにして粒径測定装置110を構成することにより、シリコンウエハ等の試料126に付着した微粒子119の直径を計測することができる。
本発明において特徴的なことは、被測定面の上下位置が最適焦点位置よりずれた場合であっても、それを正確に再調整することが容易にできることであり、このために本実施形態においては、まず垂直移動手段140を備える。
【0019】
前記垂直移動手段140は、例えばステッピングモータよりなるZ軸モータ148と、その駆動回路150を含み、制御回路138よりの指示により、試料保持板128をZ方向へ一定範囲で移動可能なものである。
さらに本実施形態においては、図3に示すようにビームスプリッタ141と、位置検出手段142と、角度検出手段144と、決定手段146と、電圧データ格納手段147と、ステージ制御手段である制御回路138を備える。
【0020】
同図に示すように、前記ビームスプリッタ141は、レーザ光L1の被測定面よりの反射光L3を2分割して、一方の光L4を位置検出手段142に、他方の光L5を角度検出手段144に、それぞれ入射させる。
前記位置検出手段142は、例えば位置敏感検出器(以下、PSD142という)よりなり、反射光L4を受光し、該反射光L4の受光位置に対応した電圧Aを出力する。
【0021】
前記角度検出手段144は、例えば前記位置検出手段144と同様のPSD(以下、PSD144という)よりなり、反射光L5を受光し、該反射光L5の受光位置に対応した電圧Bを出力する。
位置決定手段146は、例えばCPU(以下、CPU146という)よりなり、PSD142の出力電圧Aを、電圧データ格納手段147に格納された、標準試料による電圧A−位置特性と照合することにより、被測定面の仮の位置情報を得る。
【0022】
このCPU146は、PSD142の出力電圧Aと、PSD144の出力電圧Bとの差(A−B=C)を、電圧データ格納手段147に格納された、標準試料による電圧差C−角度特性と照合することにより、被測定面の角度情報を得る。また、このCPU146は、得られた被測定面の角度情報より、被測定面の位置を決定する。
すなわち、CPU146は、得られた角度情報と、最適焦点位置の設定時の角度とを比較し、誤差なしと判断したときは、前記仮の位置情報をそのまま真の位置情報とする。
【0023】
これに対し、得られた角度情報が、前記設定時の角度よりずれていると判断したときは、この角度情報とPSD142の出力電圧Aとより、正反射したときの被測定面の位置を推定し、これを真の位置とする。なお、この場合、前記仮の位置情報を無効とする。
そして、前記制御回路138は、CPU146で決定された位置情報が、最適焦点位置となるように、前記Z軸モータ148及びその駆動回路150等の直角移動手段により試料保持板128をZ方向へ移動させる。
【0024】
なお、図4に示すように前記2のPSD142,144は、試料保持板(図示省略)に載置された試料116をZ方向に移動しても、入射面の角度が同じであれば、これらのPSD142、144による受光位置は、P1〜P3へと同様に移動するように配置されている。これにより、試料116をZ方向に移動しても、入射面の角度が同じであれば、これらの出力電圧A,Bは同じように変化するため、電圧差Cも一定となるが、入射面の角度が変われば、電圧差Cも変化するようになっている。
【0025】
本発明の第1実施形態に係る粒径計測装置110は概略以上のように構成され、以下にその作用を図5を参照しつつ説明する。
まず、標準試料を用いて、一方のPSD142の出力電圧Aと位置との関係、電圧差Cと角度との関係等の比較用データを得る(ステップ100)。
すなわち、被測定面上の角度が均一に水平の標準試料をZ方向に所定距離、例えば2μmづつ移動させるごとに、PSD142の出力電圧Aを測定し、これを標準試料による電圧A−位置特性としてデータ格納手段147に格納する。
【0026】
また、被測定面の角度が既知の標準試料を所定角度、例えば2°づつ変更させるごとに、PSD142の出力電圧AとPSD144の出力電圧Bより、電圧差Cを測定し、これを標準試料による電圧差C−角度特性としてデータ格納手段147に格納する。
つぎに、被測定試料を用いて最適焦点位置を合わせたときの被測定面の位置情報と角度情報を設定する(ステップ102)。
設定後、粒径計測のためのレーリ散乱光測定を測定を開始する(ステップ104)。
【0027】
ところで、例えば1の位置検出手段、例えばPSD142のみを設けた場合では、試料の状態が悪く被測定面にうねりがあったり、ステージの精度が悪く、ステージ移動中に被測定面の角度が設定時の角度よりθずれることがある。すると、図6に示すように反射光L3の進行方向が変化するため、PSD142による反射光L4の受光位置がP4からP5へと変わってしまう。すると、出力電圧Aも変化するため、理論上の位置と実際の位置との間に誤差が生じてしまう場合があった。
【0028】
そこで、本実施形態においては、前述のように被測定面の角度が、最適焦点位置の設定時よりずれた場合であっても、位置情報を正確に得るため、2のPSD142,144を配置し、これらの出力電圧差Cより得られた被測定面の角度情報を考慮して位置を決定することとした。
【0029】
すなわち、前記図5に示すようにCPU146は、PSD142の出力電圧Aを、電圧データ格納手段147に格納された、標準試料による電圧A−位置特性と照合することにより、被測定面の仮の位置情報を得る(ステップ106)。
また、このCPU146は、PSD142の出力電圧Aと、PSD144の出力電圧Bとの差、電圧差Cを、電圧データ格納手段147に格納された、標準試料による電圧差C−角度特性と照合することにより、被測定面の角度情報を得る。
【0030】
また、このCPU146は、得られた被測定面の角度情報より、被測定面の位置を決定する。
すなわち、CPU146は、得られた角度情報と、最適焦点位置の設定時の角度とを比較し(ステップ108)、得られた角度情報が所定の角度よりずれていると判断したときは、この角度情報とPSD142の出力電圧Aとより、正反射したときの被測定面の位置を推定し、これを被測定面の真の位置とする(ステップ110)。
【0031】
これに対し、誤差なしと判断したときは、前記仮の位置情報をそのまま真の位置情報とする(ステップ112)。
そして、CPU146は、得られた位置情報と、最適焦点位置の設定時の位置情報とを比較し(ステップ114)、誤差ありと判断したときは、制御回路138は、CPU146で決定された位置情報が、最適焦点位置となるように、直角移動手段により試料保持板128をZ方向へ移動させる(ステップ116)。
【0032】
その後、つぎの被測定面の仮の位置情報及び角度情報測定を開始する(前記ステップ106)。
これに対し、誤差なしと判断したときは、すぐに、つぎの被測定面の仮の位置情報及び角度情報測定を開始する(前記ステップ106)。
そして、これらの処理を測定中、繰り返す。
また、本実施形態において、ステージ制御は、前記XY方向へのステージ移動に限られるものでなく、Z軸モータ等の直角移動手段によりZ方向へステージ移動を行い、被測定面の傾きが変わった場合であっても、前記ステップ206〜ステップ216の処理を行うことにより、前述のようにして被測定面の位置を、再度正確に設定時の最適焦点位置に調整することが容易にできる。
【0033】
以上のように、本発明の第1実施形態に係る粒径計測装置110によれば、水平移動手段によるステージ移動中や、直角移動手段によるステージ移動中に、被被測定面の位置が最適焦点位置よりずれた場合、被測定面の角度が一定の時は勿論、変わったときであっても、正確な位置情報を得ることができるので、容易に被測定面の位置を再度正確に最適焦点位置に調整することができる。これにより、被測定面の状態や試料ステージの精度に拘わらず、常に最適焦点位置を保ちながら粒径計測のためのレーリ散乱光検出を行うことができるため、測定精度の結果向上を図ることができる。
【0034】
第2実施形態
図7には本発明の第2実施形態に係る試料ステージの概略構成の図が、図8には本発明の第2実施形態に係る試料ステージの概略構成の図が、それぞれ示されている。なお、前記図2,3と対応する部分には符号100を加えて示し説明を省略する。
本実施形態においては、図7に示すように角度変更手段を備えている。
【0035】
前記角度変更手段は、例えばステッピングモータ252と、その駆動回路254よりなり、シリコンウエハ等の試料216が載置される試料保持板228の角度を一定角度範囲で角度変更可能なものである。
そして、制御回路238は、まず、2のPSD242,244(図8参照)の電圧差Cより得られた角度情報に基づいて、該角度情報が所定の角度、例えば最適焦点位置の設定時の被測定面の角度となるように、前記ステッピングモータ252、その駆動回路254等の角度変更手段により、試料保持板218を傾斜させる。
【0036】
角度調整後、この制御回路238は、PSD242で得た位置情報が最適焦点位置の設定時の位置となるように、前記直角移動手段等によりに試料保持板218をZ方向に移動させる。
本発明の第2実施形態に係る粒径計測装置210は概略以上のように構成され、以下にその作用を図9を参照しつつ説明する。
まず、標準試料を用いて、一方のPSD242の出力電圧Aと位置との関係、電圧差Cと角度との関係等の比較用データを得る(ステップ200)。
【0037】
すなわち、測定面上の角度が均一に水平の標準試料をZ方向に所定距離、例えば2μmづつ移動させるごとに、PSD242の出力電圧Aを測定し、これを標準試料による電圧A−位置特性としてデータ格納手段247に格納する。
また、被測定面の角度が既知の標準試料を所定角度、例えば2°づつ変更させるごとに電圧差Cを測定し、これを標準試料による電圧差C−角度特性としてデータ格納手段247に格納する。
つぎに、被測定試料を用いて最適焦点位置を合わせたときの被測定面の位置情報と角度情報を設定する(ステップ202)。
設定後、粒径計測のためのレーリ散乱光測定を行う(ステップ204)。
【0038】
ここで、CPU246は、PSD242の出力電圧AとPSD244の出力電圧Bとの差Cを、電圧データ格納手段247に格納された、標準試料による電圧差C−角度特性と照合することにより、被測定面の角度情報を得る(ステップ206)。
そして、CPU246は、得られた角度情報と、最適焦点位置の設定時の被測定面の角度とを比較し(ステップ208)、得られた角度情報が設定時の角度よりずれていると判断したときは、制御回路238は、得られた角度情報が設定時の角度となるように前記角度変更手段により試料保持板218を傾斜させる(ステップ210)。
【0039】
角度調整後、CPU246は、PSD242の出力電圧Aを、電圧データ格納手段247に格納された、標準試料による電圧A−位置特性と照合することにより、被測定面の位置情報を得ている(ステップ212)。
つぎに、CPU246は、得られた位置情報と、設定時の位置情報とを比較し(ステップ214)、誤差なしと判断したときは、すぐに、つぎの被測定面の角度情報の測定を行う(前記ステップ206)。
【0040】
これに対し、誤差ありと判断したときは、角度調整後に得られたPSD242よりの位置情報が設定時の位置情報となるように、前記直角移動手段により試料保持板218をZ方向へ移動させる。その後、つぎの被測定面の角度情報の測定を行う(前記ステップ206)。
そして、これらの処理を測定中、繰り返す。
【0041】
このように、ステージ移動中に被測定面の角度が、設定時よりずれた場合であっても、被測定面の角度を、設定時と同様の角度に調整した後、PSD142よりの位置情報を得ることとしたので、被測定面の位置情報を正確に得ることができる。
【0042】
以上のように、本発明の第2実施形態に係る粒径計測装置210によれば、被測定面の角度を、設定時と同様の角度に調整した後、PSD142よりの位置情報を得ることとしたので、前記本発明の第1実施形態に係る粒径計測装置110と同様、被測定面の位置情報を正確に得ることができるため、被測定面の上下位置が最適焦点位置よりZ方向にずれた場合であっても、被測定面の位置を再度正確に最適焦点位置に調整することが容易にできる。これにより、被測定面の状態や試料ステージの精度に拘わらず、常に最適焦点位置を保ちながら粒径計測のためのレーリ散乱光測定を行うことができるため、測定精度の向上を図ることができる。
【0043】
なお、前記各構成では、本実施形態に係る試料ステージを粒径計測装置の試料ステージに用いた例について説明したが、これに限られるものでなく、例えば走査型電子顕微鏡(SEM)等の任意の機器の試料ステージに用いてもよい。
また、本実施形態においては、試料としてシリコンウエハを用いた例について説明したが、これに限られるものでなく、その他のものを用いてもよい。
また、本実施形態においては、位置情報をPSD142の出力電圧Aより得た例について説明したが、これに限られるものでなく、PSD144の出力電圧Bより得てもよい。すなわち、被測定面の仮の位置情報は、2のPSD142,144のうち、どちらか一方のPSDの出力電圧より得ることができるからである。
【0044】
【発明の効果】
以上説明したように、本発明に係る試料ステージによれば、上記角度検出手段及び位置決定手段等により被測定面の角度を考慮して位置情報を得ることとしたので、ステージ移動中に被測定面の角度が変わった場合であっても、被測定面の位置情報を正確に得ることが容易にできる。これにより、ステージ移動中に被測定面の位置が最適焦点位置よりずれた場合であっても、被測定面の位置を再度正確に最適焦点位置に調整することが容易にできる。
また、本発明に係る粒径計測装置によれば、試料ステージとして前記本発明に係る試料ステージを用いることとしたので、被測定面の状態や試料ステージの精度に拘わらず、常に最適焦点位置を保ちながら粒径計測のためのレーリ散乱光測定を行うことができるため、測定精度の向上を図ることができる。
【図面の簡単な説明】
【図1】従来の粒径計測装置の概略構成の説明図である。
【図2】本発明の第1実施形態に係る粒径計測装置の概略構成の説明図である。
【図3】本発明の第1実施形態に係る試料ステージの概略構成の説明図である。
【図4】図3に示したPSDの配置の説明図である。
【図5】図3に示した試料ステージによる位置調整の処理手順を示すフローチャートである。
【図6】図3に示したPSDの作用の説明図である。
【図7】本発明の第2実施形態に係る粒径計測装置の概略構成の説明図である。
【図8】本発明の第2実施形態に係る試料ステージの概略構成の説明図である。
【図9】図8に示した試料ステージによる位置調整の処理手順を示すフローチャートである。
【符号の説明】
110 粒径計測装置
116 シリコンウエハ(試料)
118 試料ステージ
128 試料保持板
130 X軸モータ(水平移動手段)
132 Y軸モータ(水平移動手段)
134,136 駆動回路(水平移動手段)
138 制御回路(ステージ制御手段)
142 PSD(位置検出手段)
144 PSD(角度検出手段)
146 CPU(位置決定手段)
148 Z軸モータ(直角移動手段)
150 駆動回路(直角移動手段)
L1 収束レーザ光
L3 正反射光(反射光)
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a sample stage and a particle size measuring apparatus using the sample stage, and more particularly to improvement of a control mechanism for the vertical position of the sample stage.
[0002]
[Prior art]
Conventionally, various particle size measuring devices have been used to measure a nanometer order particle diameter on, for example, an unpatterned silicon wafer.
[0003]
As shown in FIG. 1, the particle size measuring apparatus 10 includes a light source 12 that emits laser light L1, a convex lens 14 that converges the laser light L1, a sample stage 18 on which a sample 16 such as a silicon wafer is loaded, A condenser 22 that condenses the Rayleigh scattered light L2 from the fine particles 19 of the laser light L1 on the detector 20 and a detection circuit 24 that measures the particle diameter from the intensity change of the scattered light obtained by the detector 20 are provided.
By configuring the particle size measuring apparatus 10 in this manner, the diameter of the fine particles 19 attached to the sample 16 such as a silicon wafer can be measured.
[0004]
By the way, when detecting the fine particles 19 which are foreign matters on the silicon wafer, it is necessary to scan the convergent laser light L1 in an arbitrary direction and an XY direction on the surface to be measured.
For this purpose, the sample stage 18 includes a sample holding plate 28 on which the sample 16 is loaded, an X-axis motor 30, a Y-axis motor 32, drive circuits 34 and 36, and a control circuit 38.
Then, the control circuit 38 gives instructions to the drive circuits 34 and 36 and controls the operations of the X-axis motor 30 and the Y-axis motor 32 to move the sample 16 on the sample holding plate 28 in the XY directions. Thereby, the laser beam L1 is scanned in the XY directions.
Note that the regular reflection light L3 is structured to go out of the condenser 22.
[0005]
[Problems to be solved by the invention]
By the way, in order to detect the Rayleigh scattered light L2 from the fine particles 19, the surface to be measured must be focused. For this reason, in general, a specific part of the surface to be measured is focused before measurement.
[0006]
However, in the particle size measuring apparatus 10 using the conventional sample stage 18 after the focusing, since the detection is generally performed while moving the sample stage 18 only in the XY direction, the state of the sample 16 is poor and the measurement surface is swollen. If the sample stage 18 is inaccurate or the accuracy of the sample stage 18 is low, the vertical position of the surface to be measured is shifted in the Z direction from the optimum focus position during scanning. For this reason, it is troublesome to perform measurement in a state where the focal point does not match the surface to be measured, or to manually perform delicate readjustment for interrupting the measurement and adjusting the focal point.
[0007]
The present invention has been made in view of the problems of the prior art, and its purpose is to easily readjust the accurate measurement even when the vertical position of the surface to be measured is deviated from a predetermined position. It is an object of the present invention to provide a sample stage and a particle size measurement apparatus using the sample stage.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the sample stage according to the present invention is a sample stage having a parallel moving means capable of moving a sample holding plate for holding a sample in a direction parallel to the surface to be measured. Means, position detection means, angle detection means, position determination means, and stage control means.
[0009]
The right-angle moving means is capable of moving the sample holding plate in a direction perpendicular to the surface to be measured.
The position detecting means receives reflected light from the surface to be measured and obtains temporary position information of the surface to be measured from the light receiving position of the reflected light.
The angle detection means receives the reflected light and obtains angle information of the surface to be measured from the light receiving position of the reflected light.
[0010]
The position determination means compares the angle information obtained by the angle detection means with predetermined angle information, and when it is determined that there is no error, the position information obtained by the position detection means is used as true position information as it is, If it is determined that there is an error, the position information obtained by the position detection means is calibrated based on the error to obtain true position information.
Here, the “predetermined angle information” refers to, for example, the angle of the surface to be measured when the optimum focus position is set.
[0011]
The stage control means moves the sample holding plate by the right-angle movement means so that the position information obtained by the position determination means becomes a predetermined position.
In order to achieve the above object, a sample stage according to the present invention is a sample stage provided with a parallel moving means capable of moving a sample holding plate for holding a sample in parallel to the surface to be measured. A moving means, an angle changing means, an angle detecting means, a position detecting means, and a stage control means are provided.
[0012]
The right-angle moving means is capable of moving the sample holding plate in a direction perpendicular to the surface to be measured.
The angle changing means can change the angle of the sample holding plate.
The angle detection means receives reflected light from the surface to be measured and obtains angle information of the surface to be measured from a light receiving position of the reflected light.
[0013]
The position detecting means receives the reflected light and obtains position information of the surface to be measured from the light receiving position of the reflected light.
The stage control means tilts the sample holding plate by the angle changing means so that the angle information obtained by the angle detection means becomes a predetermined angle, and then the position information obtained by the position detection means The sample holding plate is moved by the right-angle moving means so as to be positioned.
[0014]
The sample stage includes a beam splitter that divides the reflected light from the surface to be measured into two, makes one of the light incident on the position detecting means, and makes the other light incident on the angle detecting means. Is preferred.
In order to achieve the above object, a particle size measuring apparatus according to the present invention is characterized in that the sample stage according to the present invention includes a particle size measuring means.
The particle size measuring means detects the Rayleigh scattered light from the particles while irradiating and scanning the surface to be measured with the convergent laser light, and measures the particle size from the scattered light intensity from the particles.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Preferred embodiments of the present invention will be described below with reference to the drawings.
First embodiment Fig. 2 shows a schematic configuration of a particle size measuring apparatus according to a first embodiment of the present invention. Note that portions corresponding to those in FIG. 1 are denoted by reference numeral 100 and description thereof is omitted.
The particle size measuring apparatus 110 shown in the figure includes a light source 112, a convex lens 114, a detector 120, a condenser 122, a detection circuit 124, an X-axis motor 130, a Y-axis motor 132, which are horizontal moving means, Drive circuits 134 and 136 are provided.
[0016]
The convex lens 114 converges the laser beam L1 from the light source 112 and irradiates the surface to be measured of the sample 116 (for example, the incident angle is 45 degrees with respect to the surface to be measured).
The concentrator 122 is composed of, for example, an ellipsoidal mirror, and condenses the Rayleigh scattered light L2 from the surface to be measured of the converged laser light L1 at one point and collects it on the detector 120.
[0017]
The detector 120 is composed of, for example, a photomultiplier tube (PMT), detects the Rayleigh scattered light L2 from the condenser 124, and converts it into an electrical signal proportional to the scattered light intensity.
The X-axis motor 130 and the Y-axis motor 132 are stepping motors, for example, and are capable of moving the sample holding plate 128 in a certain range in the XY directions.
[0018]
By configuring the particle size measuring apparatus 110 in this manner, the diameter of the fine particles 119 attached to the sample 126 such as a silicon wafer can be measured.
What is characteristic in the present invention is that even when the vertical position of the surface to be measured is deviated from the optimum focal position, it can be easily readjusted accurately. First, vertical movement means 140 is provided.
[0019]
The vertical moving means 140 includes, for example, a Z-axis motor 148 formed of a stepping motor and a driving circuit 150 for the Z-axis motor 148, and is capable of moving the sample holding plate 128 in a certain range in the Z direction according to an instruction from the control circuit 138. .
Further, in the present embodiment, as shown in FIG. 3, a beam splitter 141, a position detection means 142, an angle detection means 144, a determination means 146, a voltage data storage means 147, and a control circuit 138 which is a stage control means. Is provided.
[0020]
As shown in the figure, the beam splitter 141 divides the reflected light L3 from the surface to be measured of the laser light L1 into two parts, one light L4 as the position detecting means 142 and the other light L5 as the angle detecting means. 144, respectively.
The position detection unit 142 includes, for example, a position sensitive detector (hereinafter referred to as PSD 142), receives the reflected light L4, and outputs a voltage A corresponding to the light receiving position of the reflected light L4.
[0021]
The angle detection unit 144 includes, for example, a PSD similar to the position detection unit 144 (hereinafter referred to as PSD 144), receives the reflected light L5, and outputs a voltage B corresponding to the light receiving position of the reflected light L5.
The position determining means 146 is composed of, for example, a CPU (hereinafter referred to as CPU 146), and compares the output voltage A of the PSD 142 with the voltage A-position characteristic of the standard sample stored in the voltage data storage means 147, thereby measuring the measurement target. Get temporary position information of the surface.
[0022]
The CPU 146 collates the difference (A−B = C) between the output voltage A of the PSD 142 and the output voltage B of the PSD 144 with the voltage difference C−angle characteristic of the standard sample stored in the voltage data storage unit 147. As a result, the angle information of the surface to be measured is obtained. Further, the CPU 146 determines the position of the measured surface from the obtained angle information of the measured surface.
That is, the CPU 146 compares the obtained angle information with the angle at the time of setting the optimum focus position, and when it is determined that there is no error, the temporary position information is used as it is as the true position information.
[0023]
On the other hand, when it is determined that the obtained angle information is deviated from the angle at the time of setting, the position of the surface to be measured when specularly reflected is estimated from this angle information and the output voltage A of the PSD 142. This is the true position. In this case, the temporary position information is invalidated.
Then, the control circuit 138 moves the sample holding plate 128 in the Z direction by the right-angle moving means such as the Z-axis motor 148 and its drive circuit 150 so that the position information determined by the CPU 146 becomes the optimum focus position. Let
[0024]
As shown in FIG. 4, the PSDs 142 and 144 of the above 2 can be used as long as the angle of the incident surface is the same even if the sample 116 placed on the sample holding plate (not shown) is moved in the Z direction. The light receiving positions of the PSDs 142 and 144 are arranged so as to move in the same manner from P1 to P3. As a result, even if the sample 116 is moved in the Z direction, if the angle of the incident surface is the same, these output voltages A and B change in the same way, so the voltage difference C is also constant. When the angle changes, the voltage difference C also changes.
[0025]
The particle size measuring apparatus 110 according to the first embodiment of the present invention is configured as described above, and the operation thereof will be described below with reference to FIG.
First, using a standard sample, comparison data such as the relationship between the output voltage A and the position of one PSD 142 and the relationship between the voltage difference C and the angle is obtained (step 100).
That is, every time a standard sample with a uniform angle on the surface to be measured is moved in the Z direction by a predetermined distance, for example, 2 μm, the output voltage A of the PSD 142 is measured, and this is used as the voltage A-position characteristic of the standard sample. The data is stored in the data storage unit 147.
[0026]
Further, every time a standard sample whose angle of the surface to be measured is known is changed by a predetermined angle, for example, 2 °, a voltage difference C is measured from the output voltage A of the PSD 142 and the output voltage B of the PSD 144, and this is determined by the standard sample. The voltage difference C-angle characteristic is stored in the data storage means 147.
Next, position information and angle information of the surface to be measured when the optimum focus position is adjusted using the sample to be measured are set (step 102).
After setting, measurement of Rayleigh scattered light measurement for particle size measurement is started (step 104).
[0027]
By the way, when only one position detection means, for example, PSD 142 is provided, the state of the sample is bad and the surface to be measured is wavy, the accuracy of the stage is poor, and the angle of the surface to be measured is set while the stage is moving. Θ may deviate from this angle. Then, since the traveling direction of the reflected light L3 changes as shown in FIG. 6, the light receiving position of the reflected light L4 by the PSD 142 changes from P4 to P5. Then, since the output voltage A also changes, an error may occur between the theoretical position and the actual position.
[0028]
Therefore, in the present embodiment, as described above, even if the angle of the surface to be measured is deviated from that at the time of setting the optimum focus position, the two PSDs 142 and 144 are arranged in order to obtain the position information accurately. The position is determined in consideration of the angle information of the surface to be measured obtained from the output voltage difference C.
[0029]
That is, as shown in FIG. 5, the CPU 146 compares the output voltage A of the PSD 142 with the voltage A-position characteristic of the standard sample stored in the voltage data storage unit 147, so that the temporary position of the measured surface is obtained. Information is obtained (step 106).
In addition, the CPU 146 checks the difference between the output voltage A of the PSD 142 and the output voltage B of the PSD 144 and the voltage difference C with the voltage difference C-angle characteristic of the standard sample stored in the voltage data storage unit 147. Thus, angle information of the surface to be measured is obtained.
[0030]
Further, the CPU 146 determines the position of the measured surface from the obtained angle information of the measured surface.
That is, the CPU 146 compares the obtained angle information with the angle at the time of setting the optimum focus position (step 108), and determines that the obtained angle information is deviated from a predetermined angle. Based on the information and the output voltage A of the PSD 142, the position of the measured surface when specularly reflected is estimated, and this is set as the true position of the measured surface (step 110).
[0031]
On the other hand, when it is determined that there is no error, the temporary position information is used as it is as the true position information (step 112).
Then, the CPU 146 compares the obtained position information with the position information at the time of setting the optimum focus position (step 114), and when determining that there is an error, the control circuit 138 determines the position information determined by the CPU 146. However, the sample holding plate 128 is moved in the Z direction by the right-angle moving means so that the optimum focal position is obtained (step 116).
[0032]
Thereafter, measurement of temporary position information and angle information of the next surface to be measured is started (step 106).
On the other hand, when it is determined that there is no error, measurement of temporary position information and angle information of the next surface to be measured is started immediately (step 106).
These processes are repeated during measurement.
In the present embodiment, the stage control is not limited to the stage movement in the XY direction, but the stage movement is performed in the Z direction by a right-angle moving means such as a Z-axis motor, and the inclination of the surface to be measured is changed. Even in such a case, by performing the processing from step 206 to step 216, the position of the surface to be measured can be easily adjusted to the optimum focal position at the time of setting again as described above.
[0033]
As described above, according to the particle size measuring device 110 according to the first embodiment of the present invention, the position of the surface to be measured is optimally focused during the stage movement by the horizontal movement means or the stage movement by the right-angle movement means. If the angle of the surface to be measured is deviated from the position, it is possible to obtain accurate position information even when the angle of the surface to be measured is constant as well as when the angle is changed. Can be adjusted to the position. As a result, regardless of the state of the surface to be measured and the accuracy of the sample stage, it is possible to detect Rayleigh scattered light for particle size measurement while always maintaining the optimum focus position, so that the measurement accuracy can be improved. it can.
[0034]
Second embodiment Fig. 7 shows a schematic configuration of a sample stage according to the second embodiment of the present invention, and Fig. 8 shows a schematic configuration of a sample stage according to the second embodiment of the present invention. Are shown respectively. The parts corresponding to those in FIGS. 2 and 3 are denoted by reference numeral 100 and the description thereof is omitted.
In the present embodiment, an angle changing means is provided as shown in FIG.
[0035]
The angle changing means includes, for example, a stepping motor 252 and its drive circuit 254, and can change the angle of the sample holding plate 228 on which the sample 216 such as a silicon wafer is placed within a certain angle range.
Then, based on the angle information obtained from the voltage difference C between the two PSDs 242 and 244 (see FIG. 8), the control circuit 238 first determines that the angle information is a predetermined angle, for example, the target when the optimum focus position is set. The sample holding plate 218 is tilted by angle changing means such as the stepping motor 252 and its drive circuit 254 so that the angle of the measurement surface is obtained.
[0036]
After the angle adjustment, the control circuit 238 moves the sample holding plate 218 in the Z direction by the right-angle moving means or the like so that the position information obtained by the PSD 242 becomes the position when the optimum focus position is set.
The particle size measuring apparatus 210 according to the second embodiment of the present invention is configured as described above, and the operation thereof will be described below with reference to FIG.
First, using a standard sample, comparison data such as the relationship between the output voltage A and the position of one PSD 242 and the relationship between the voltage difference C and the angle is obtained (step 200).
[0037]
That is, every time a standard sample with a uniform horizontal angle on the measurement surface is moved in the Z direction by a predetermined distance, for example, 2 μm, the output voltage A of the PSD 242 is measured, and this is used as voltage A-position characteristics of the standard sample. Store in the storage means 247.
Further, the voltage difference C is measured every time a standard sample whose angle of the surface to be measured is known is changed by a predetermined angle, for example, 2 °, and this is stored in the data storage means 247 as the voltage difference C-angle characteristic of the standard sample. .
Next, position information and angle information of the surface to be measured when the optimum focus position is adjusted using the sample to be measured are set (step 202).
After the setting, Rayleigh scattered light measurement for particle size measurement is performed (step 204).
[0038]
Here, the CPU 246 compares the difference C between the output voltage A of the PSD 242 and the output voltage B of the PSD 244 with the voltage difference C-angle characteristic of the standard sample stored in the voltage data storage unit 247, thereby measuring the measurement target. Surface angle information is obtained (step 206).
Then, the CPU 246 compares the obtained angle information with the angle of the surface to be measured at the time of setting the optimum focus position (step 208), and determines that the obtained angle information is deviated from the angle at the time of setting. If so, the control circuit 238 tilts the sample holding plate 218 by the angle changing means so that the obtained angle information becomes the angle at the time of setting (step 210).
[0039]
After the angle adjustment, the CPU 246 obtains the position information of the surface to be measured by comparing the output voltage A of the PSD 242 with the voltage A-position characteristic of the standard sample stored in the voltage data storage unit 247 (step). 212).
Next, the CPU 246 compares the obtained position information with the position information at the time of setting (step 214). When it is determined that there is no error, the CPU 246 immediately measures the angle information of the next surface to be measured. (Step 206).
[0040]
On the other hand, when it is determined that there is an error, the sample holding plate 218 is moved in the Z direction by the right-angle moving means so that the position information from the PSD 242 obtained after the angle adjustment becomes the position information at the time of setting. Thereafter, the angle information of the next surface to be measured is measured (step 206).
These processes are repeated during measurement.
[0041]
As described above, even when the angle of the measured surface is shifted from the setting time during the stage movement, the position information from the PSD 142 is obtained after adjusting the angle of the measured surface to the same angle as the setting time. Therefore, the position information of the surface to be measured can be obtained accurately.
[0042]
As described above, according to the particle size measuring apparatus 210 according to the second embodiment of the present invention, after adjusting the angle of the surface to be measured to the same angle as that at the time of setting, obtaining position information from the PSD 142 Therefore, as with the particle size measuring apparatus 110 according to the first embodiment of the present invention, since the position information of the surface to be measured can be obtained accurately, the vertical position of the surface to be measured is in the Z direction from the optimum focus position. Even in the case of deviation, the position of the surface to be measured can be easily adjusted to the optimum focal position again accurately. As a result, regardless of the state of the surface to be measured and the accuracy of the sample stage, it is possible to perform Rayleigh scattered light measurement for particle size measurement while always maintaining the optimum focal position, so that the measurement accuracy can be improved. .
[0043]
In each of the above-described configurations, the example in which the sample stage according to the present embodiment is used as the sample stage of the particle size measuring apparatus has been described. You may use for the sample stage of the apparatus of.
In the present embodiment, an example in which a silicon wafer is used as a sample has been described. However, the present invention is not limited to this, and other samples may be used.
In this embodiment, the example in which the position information is obtained from the output voltage A of the PSD 142 has been described. However, the present invention is not limited to this, and the position information may be obtained from the output voltage B of the PSD 144. That is, the temporary position information of the surface to be measured can be obtained from the output voltage of one of the two PSDs 142 and 144.
[0044]
【The invention's effect】
As described above, according to the sample stage according to the present invention, since the position information is obtained in consideration of the angle of the surface to be measured by the angle detection unit and the position determination unit, the measurement target is measured while the stage is moving. Even when the angle of the surface changes, it is possible to easily obtain the position information of the surface to be measured accurately. Thereby, even when the position of the surface to be measured is shifted from the optimum focus position during the stage movement, the position of the surface to be measured can be easily adjusted to the optimum focus position again accurately.
Moreover, according to the particle size measuring apparatus according to the present invention, since the sample stage according to the present invention is used as the sample stage, the optimum focal position is always set regardless of the state of the surface to be measured and the accuracy of the sample stage. Since the Rayleigh scattered light measurement for the particle size measurement can be performed while maintaining, the measurement accuracy can be improved.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of a schematic configuration of a conventional particle size measuring apparatus.
FIG. 2 is an explanatory diagram of a schematic configuration of a particle size measuring apparatus according to the first embodiment of the present invention.
FIG. 3 is an explanatory diagram of a schematic configuration of a sample stage according to the first embodiment of the present invention.
4 is an explanatory diagram of the arrangement of the PSD shown in FIG. 3. FIG.
FIG. 5 is a flowchart showing a processing procedure for position adjustment by the sample stage shown in FIG. 3;
6 is an explanatory diagram of the action of the PSD shown in FIG. 3. FIG.
FIG. 7 is an explanatory diagram of a schematic configuration of a particle size measuring apparatus according to a second embodiment of the present invention.
FIG. 8 is an explanatory diagram of a schematic configuration of a sample stage according to a second embodiment of the present invention.
9 is a flowchart showing a processing procedure for position adjustment by the sample stage shown in FIG. 8. FIG.
[Explanation of symbols]
110 Particle size measuring device 116 Silicon wafer (sample)
118 Sample stage 128 Sample holding plate 130 X-axis motor (horizontal movement means)
132 Y-axis motor (horizontal movement means)
134,136 Drive circuit (horizontal movement means)
138 Control circuit (stage control means)
142 PSD (position detection means)
144 PSD (angle detection means)
146 CPU (position determining means)
148 Z-axis motor (right-angle moving means)
150 Drive circuit (right-angle moving means)
L1 convergent laser light L3 specularly reflected light (reflected light)

Claims (4)

試料を保持する試料保持板を、試料の被測定面に対し平行方向へ移動可能な平行移動手段を備えた試料ステージにおいて、
前記試料保持板を被測定面に対し直角方向へ移動可能な直角移動手段と、
前記被測定面よりの反射光を受光し、該反射光の受光位置より被測定面の仮の位置情報を得るための位置検出手段と、
前記反射光を受光し、該反射光の受光位置より被測定面の角度情報を得るための角度検出手段と、
前記角度検出手段で得た角度情報と所定の角度情報とを比較し、誤差なしと判断したときは、前記位置検出手段で得た位置情報をそのまま真の位置情報とし、また誤差ありと判断したときは、該誤差に基づいて前記位置検出手段で得た位置情報を校正して真の位置情報とする位置決定手段と、
前記位置決定手段で得た位置情報が所定の位置となるように、前記直角移動手段により試料保持板を移動させるステージ制御手段と、
を備えたことを特徴とする試料ステージ。
In a sample stage equipped with a parallel moving means capable of moving a sample holding plate for holding a sample in a direction parallel to the surface to be measured of the sample,
A right angle moving means capable of moving the sample holding plate in a direction perpendicular to the surface to be measured;
Position detecting means for receiving reflected light from the surface to be measured, and obtaining temporary position information of the surface to be measured from a light receiving position of the reflected light;
Angle detection means for receiving the reflected light and obtaining angle information of the surface to be measured from the light receiving position of the reflected light;
When the angle information obtained by the angle detection means is compared with predetermined angle information and it is determined that there is no error, the position information obtained by the position detection means is used as it is as true position information, and it is determined that there is an error. When the position determination means calibrates the position information obtained by the position detection means based on the error to obtain true position information,
Stage control means for moving the sample holding plate by the right-angle moving means so that the position information obtained by the position determining means is a predetermined position;
A sample stage characterized by comprising:
試料を保持する試料保持板を、試料の被測定面に対し平行に移動可能な平行移動手段を備えた試料ステージにおいて、
前記試料保持板を被測定面に対し直角方向へ移動可能な直角移動手段と、
前記試料保持板の角度を変更可能な角度変更手段と、
前記被測定面よりの反射光を受光し、該反射光の受光位置より被測定面の角度情報を得るための角度検出手段と、
前記反射光を受光し、該反射光の受光位置より、被測定面の位置情報を得るための位置検出手段と、
前記角度検出手段で得た角度情報が所定の角度となるように、前記角度変更手段により試料保持板を傾斜させた後、前記位置検出手段で得た位置情報が所定の位置となるように、前記直角移動手段により該試料保持板を移動させるステージ制御手段と、
を備えたことを特徴とする試料ステージ。
In a sample stage equipped with a parallel moving means capable of moving a sample holding plate for holding a sample in parallel to the surface to be measured of the sample,
A right angle moving means capable of moving the sample holding plate in a direction perpendicular to the surface to be measured;
Angle changing means capable of changing the angle of the sample holding plate;
Angle detection means for receiving reflected light from the surface to be measured and obtaining angle information of the surface to be measured from a light receiving position of the reflected light;
Position detecting means for receiving the reflected light and obtaining position information of the surface to be measured from the light receiving position of the reflected light;
After the sample holding plate is tilted by the angle changing means so that the angle information obtained by the angle detecting means becomes a predetermined angle, the position information obtained by the position detecting means becomes a predetermined position. Stage control means for moving the sample holding plate by the right-angle moving means;
A sample stage characterized by comprising:
請求項1又は2記載の試料ステージにおいて、前記被測定面よりの反射光を2分割し、その一方の光を前記位置検出手段に入射させ、その他方の光を前記角度検出手段に入射させるビームスプリッタを備えたことを特徴とする試料ステージ。3. The sample stage according to claim 1, wherein the reflected light from the surface to be measured is divided into two, one light is incident on the position detecting means, and the other light is incident on the angle detecting means. A sample stage comprising a splitter. 請求項1乃至3の何れかに記載の試料ステージにおいて、収束レーザ光を被測定面に照射して走査しながら粒子よりのレーリ散乱光を検出し、該散乱光強度より粒子の粒径を計測する粒径計測手段を備えたことを特徴とする粒径計測装置。4. The sample stage according to claim 1, wherein the Rayleigh scattered light from the particles is detected while scanning by irradiating the surface to be measured with a focused laser beam, and the particle size of the particles is measured from the scattered light intensity. A particle size measuring apparatus comprising particle size measuring means for performing the operation.
JP10335498A 1998-03-30 1998-03-30 Sample stage and particle size measuring apparatus using the same Expired - Fee Related JP4128262B2 (en)

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