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JP4128948B2 - building - Google Patents
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JP4128948B2 - building - Google Patents

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JP4128948B2
JP4128948B2 JP2003430724A JP2003430724A JP4128948B2 JP 4128948 B2 JP4128948 B2 JP 4128948B2 JP 2003430724 A JP2003430724 A JP 2003430724A JP 2003430724 A JP2003430724 A JP 2003430724A JP 4128948 B2 JP4128948 B2 JP 4128948B2
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radiator
underfloor
underfloor space
space
heat pump
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JP2005188823A (en
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大介 朝桐
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Sekisui Chemical Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00Energy efficient heating, ventilation or air conditioning [HVAC]

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Description

この発明は、床下暖房装置、及びこの床下暖房装置を備えた建物に関する。   The present invention relates to an underfloor heating device and a building including the underfloor heating device.

ヒートポンプ等の熱源からの熱を床下空間へ供給し、快適な居住性を実現する技術がある(特許文献1参照)。   There is a technology for realizing comfortable living by supplying heat from a heat source such as a heat pump to an underfloor space (see Patent Document 1).

特開2001−323562号公報JP 2001-323562 A

しかし、上記特許文献1記載のような従来の床下暖房装置は、居室の床暖房を対象としているが、温水の戻り水温の低下が小さい。そのため、ヒートポンプは、エネルギー消費効率の悪い運転となっていた。   However, although the conventional underfloor heating apparatus as described in Patent Document 1 is intended for floor heating in a living room, a decrease in the return temperature of warm water is small. For this reason, the heat pump has been operated with low energy consumption efficiency.

この発明の課題は、機器側の制御は代えないで、ヒートポンプのエネルギー消費効率が向上した床下暖房装置、及びその床下暖房装置を備えた建物を提供することにある。   The subject of this invention is providing the building provided with the underfloor heating apparatus which the energy consumption efficiency of the heat pump improved, and the underfloor heating apparatus, without changing control by the side of an apparatus.

本発明は、ヒートポンプにより加熱された熱媒が、建物の床下空間に設置された複数の放熱器を直列的に通ってヒートポンプに戻る循環路を備えたことを特徴とする。

The present invention is characterized in that a heat medium heated by a heat pump is provided with a circulation path that returns in series to a heat pump through a plurality of radiators installed in an under-floor space of a building.

ここで、前記複数の放熱器のうち、ヒートポンプにより加熱された熱媒は、先ず居室の床下空間に設置されている放熱器に送られ、その後、廊下等の非居室の床下空間に設置されている他の放熱器に送られようにされていることを特徴とする。

Here, among the plurality of radiators, the heating medium heated by the heat pump is first sent to the radiator installed in the underfloor space of the living room, and then installed in the underfloor space of the non-residential room such as a hallway. It is intended to be sent to other radiators.

そして、本発明の建物は、複数の放熱器は、それぞれ別室の床下空間に設置され、それぞれの床下空間は仕切り壁によって仕切られていて別空間とされていることを特徴とする。

Then, the onset bright building, multiple radiator are respectively installed under the floor space of another room, each of underfloor space, characterized in that there is a separate space has been partitioned by a partition wall.

この発明によると、ヒートポンプにより加熱された熱媒が、建物の床下空間に設置された複数の放熱器を直列的に通ってヒートポンプに戻る循環路を備えているので、熱媒は、最初の放熱器に流入して熱媒温度が低下して、次の放熱器に流入して熱媒温度が更に低下するなど、順次熱媒温度が低下した後、ヒートポンプに戻るので、ヒートポンプへ戻った時点で、熱媒の戻り温度の低下幅が大きくなり、ヒートポンプのCOP(エネルギー消費効率)が向上する。
この際、COP向上のため、従来技術のように、インバータ制御機器を設けなくてもよいので、ヒートポンプ機器側の制御を複雑にしないで済む。

According to the present invention, the heat medium heated by the heat pump has a circulation path that passes through a plurality of radiators installed in the underfloor space of the building in series and returns to the heat pump. When the temperature of the heat medium decreases, such as when the temperature of the heat medium decreases and the temperature of the heat medium further decreases, such as when the temperature of the heat medium further decreases, the temperature returns to the heat pump. Thus, the reduction range of the return temperature of the heat medium is increased, and the COP (energy consumption efficiency) of the heat pump is improved.
At this time, in order to improve COP, it is not necessary to provide an inverter control device as in the prior art, so that the control on the heat pump device side does not have to be complicated.

らに、複数の放熱器のうち、ヒートポンプにより加熱された熱媒は、先ず居室の床下空間に設置されている放熱器に送られ、その後、廊下等の非居室の床下空間に設置されている他の放熱器に送られようにされているので、居室暖房の余熱を使って、非居室である廊下等の比較的暖房熱源が少なくて済む空間をほのかに温めることができる。
このため、居室と廊下等の非居室の温度差は小さくなり、居室から廊下等の非居室に出るときのヒートショックを防止できる。

Et al is, among the plurality of radiators, heating medium heated by the heat pump is first sent to a radiator that is located under the floor space of the room, then, it is installed under the floor space of the non room such as hallways Because it is sent to other radiators, it is possible to slightly warm a space that requires a relatively small heating heat source, such as a corridor that is a non-residential room, by using the residual heat of the room heating.
For this reason, the temperature difference between the living room and the non-living room such as the hallway becomes small, and a heat shock when going out from the living room to the non-living room such as the hallway can be prevented.

また、複数の放熱器は、それぞれ別室の床下空間に設置され、それぞれの床下空間は仕切り壁によって仕切られていて別空間とされているので、それぞれの部屋は、その床下空間に設置された放熱器によって暖房される。 In addition , a plurality of radiators are installed in the underfloor space of each separate room, and each underfloor space is separated by a partition wall to be a separate space, so each room has a heat dissipation installed in the underfloor space. It is heated by a vessel.

この発明を実施するための最良の形態を図面を参照して説明する。   The best mode for carrying out the present invention will be described with reference to the drawings.

(実施の形態1)
図1は、この発明の実施の形態であり、床下暖房装置を模式的に示す建物の床下空間部の平面視断面図である。図2は、図1のイ−イ線の断面図である。
(Embodiment 1)
FIG. 1 is an embodiment of the present invention and is a plan view sectional view of an underfloor space portion of a building schematically showing an underfloor heating device. 2 is a cross-sectional view taken along the line II in FIG.

本実施の形態の建物は、例えば、工場生産された複数の建物ユニットが施工現場に搬送され、布基礎1の上に据えつけられて構築されている。
この建物は、内部の一方側に居室である居間2があり、建物内の他方側にキッチン3と非居室である廊下(図示省略)がある。居間2の床下空間2aには放熱器2bが設置され、キッチンの3の床下空間3aには放熱器3bが設置され、廊下の床下空間4aには放熱器4bが設置されている。
The building of the present embodiment is constructed by, for example, a plurality of factory-produced building units being transported to a construction site and installed on the fabric foundation 1.
This building has a living room 2 which is a living room on one side of the interior, and a kitchen 3 and a hallway (not shown) which is a non-living room on the other side of the building. A radiator 2b is installed in the underfloor space 2a of the living room 2, a radiator 3b is installed in the underfloor space 3a of the kitchen 3, and a radiator 4b is installed in the underfloor space 4a of the hallway.

なお、居間2の床下空間2aとキッチン3の床下空間3aとは仕切り壁11によって仕切られ、キッチン3の床下空間3aと廊下の床下空間4aも別の仕切り壁11によって仕切られている。   The underfloor space 2a of the living room 2 and the underfloor space 3a of the kitchen 3 are partitioned by a partition wall 11, and the underfloor space 3a of the kitchen 3 and the underfloor space 4a of the corridor are also partitioned by another partition wall 11.

そして、それぞれの床下空間2a、3a、4aは、床下地盤に敷設した、防湿と断熱を兼ねた土間コンクリート12と、布基礎1の内周面、仕切り壁11の側面に貼着された発泡ポリスチレンシートなどの断熱材13によって外気と遮蔽され、温められた床下空間の空気が外気に逃げないようにされている。   Each of the underfloor spaces 2a, 3a, 4a is a concrete floor 12 that is laid on the floor baseboard and serves as moisture proof and heat insulation, and an expanded polystyrene affixed to the inner peripheral surface of the fabric foundation 1 and the side surface of the partition wall 11. The outside air is shielded from the outside air by a heat insulating material 13 such as a sheet so that the heated air in the underfloor space does not escape to the outside air.

ヒートポンプ5は屋外に設置され、このヒートポンプ5により加熱された温水が、循環路6によって、先ず居間2の床下空間2aに設置された放熱器2bに送られ、熱媒温度が所定の設定温度より低下した段階で、続いてキッチン3の床下空間3aに設置された放熱器3bと廊下の床下空間4aに敷設された放熱器4bとに送られてヒートポンプ5に戻って循環するようにされている。   The heat pump 5 is installed outdoors, and hot water heated by the heat pump 5 is first sent by the circulation path 6 to the radiator 2b installed in the underfloor space 2a of the living room 2 so that the heat medium temperature is higher than a predetermined set temperature. At the lowered stage, the heat is then sent to the radiator 3b installed in the underfloor space 3a of the kitchen 3 and the radiator 4b laid in the underfloor space 4a of the corridor and returned to the heat pump 5 for circulation. .

具体的には、先ず、ヒートポンプ5により60℃に加熱された温水は、循環路6を経て居間2の床下空間2aに設置された放熱器2bに送られ、放熱器2bから放熱され、居間2の床下空間2bを温めることによって居室2が暖房される。   Specifically, first, the hot water heated to 60 ° C. by the heat pump 5 is sent to the radiator 2b installed in the under-floor space 2a of the living room 2 through the circulation path 6, radiated from the radiator 2b, and the living room 2 The living room 2 is heated by heating the underfloor space 2b.

その後、温水温度が、所定の設定温度である50℃より低下した段階で、温水は、循環路6を経てキッチン3の床下空間3aに設置された放熱器3bに送られ、放熱器3bから放熱され、キッチン3の床下空間3bを温めることによってキッチン3がほのかに暖房される。続いて、廊下の床下空間4aに設置した放熱器4bに送られ、廊下の床下空間4aを温めることによって廊下がほのかに暖房される。
そして、温水温度が20℃以下に低下すると、温水は放熱器4bから戻り循環路6を通ってヒートポンプ5に戻るように制御されている。
Thereafter, when the temperature of the hot water drops below a predetermined set temperature of 50 ° C., the hot water is sent to the radiator 3b installed in the underfloor space 3a of the kitchen 3 via the circulation path 6, and radiated from the radiator 3b. Then, the kitchen 3 is slightly heated by heating the underfloor space 3b of the kitchen 3. Then, it is sent to the heat radiator 4b installed in the underfloor space 4a of the hallway, and the hallway is slightly heated by heating the underfloor space 4a of the hallway.
And when warm water temperature falls below 20 degreeC, warm water is controlled to return to the heat pump 5 through the return circuit 6 from the radiator 4b.

(実施の形態の作用)
本実施の形態の床下暖房装置と、これを設けた建物によると、居間2の床下空間2aに設置された放熱器2bでの温水温度が所定の設定温度50℃より低下した段階で、温水はキッチン3の床下空間3aに設置された放熱器3bと、廊下の床下空間4aに設置した放熱器4bに流入して循環し、温水温度が20℃以下に低下した後、ヒートポンプ5に戻るようになされているので、ヒートポンプ5へ戻った時点で、温水の戻り温度の低下幅は、60℃−20℃=40℃と大きくなり、ヒートポンプのCOP(エネルギー消費効率)が向上する。
この際、COP向上のため、インバータ制御機器を設けなくてもよいので、ヒートポンプ機器側の制御を複雑にしないですむ。
(Operation of the embodiment)
According to the underfloor heating device of the present embodiment and the building provided with this, at the stage where the hot water temperature in the radiator 2b installed in the underfloor space 2a of the living room 2 has dropped below a predetermined set temperature of 50 ° C, After flowing into and circulating in the radiator 3b installed in the underfloor space 3a of the kitchen 3 and the radiator 4b installed in the underfloor space 4a of the corridor, the temperature of the hot water drops below 20 ° C. and then returns to the heat pump 5. Therefore, when returning to the heat pump 5, the decrease width of the return temperature of the hot water becomes as large as 60 ° C.−20 ° C. = 40 ° C., and the COP (energy consumption efficiency) of the heat pump is improved.
At this time, in order to improve COP, it is not necessary to provide an inverter control device, so that the control on the heat pump device side does not have to be complicated.

さらに、放熱器2bは、居間2の床下空間2aに敷設され、放熱器3bは、キッチン3の床下3aに敷設され、放熱器4bは、非居室である廊下の床下空間4aに設置されているから、居間2の床下暖房の余熱を使ってキッチン3と廊下をほのかに温めることができる。
このため、居室2とキッチン3と廊下の温度差は小さくなり、居間2からキッチン3や非居室である廊下に出るときのヒートショックを防止できる。
Furthermore, the radiator 2b is laid in the underfloor space 2a of the living room 2, the radiator 3b is laid in the underfloor 3a of the kitchen 3, and the radiator 4b is installed in the underfloor space 4a of the hallway that is a non-residential room. The kitchen 3 and the hallway can be warmed slightly using the residual heat of the underfloor heating in the living room 2.
For this reason, the temperature difference between the living room 2, the kitchen 3, and the hallway becomes small, and heat shock when the living room 2 goes out to the kitchen 3 or the hallway that is a non-living room can be prevented.

以上、この発明の一実施の形態を図面により詳述したが、この発明の具体的な構成はこの実施の形態に限られるものではなく、この発明の要旨を逸脱しない範囲の設計の変更等があってもこの発明に含まれる。
例えば、複数の居室の床下空間にそれぞれ放熱器を設置し、これらの放熱器にヒートポンプからの熱媒を送り、続いて非居室の床下空間に設置した放熱器に送るようにしてもよい。
また、この床下暖房装置には、他の空調手段の併用をしてもよいのは勿論である。
Although one embodiment of the present invention has been described in detail with reference to the drawings, the specific configuration of the present invention is not limited to this embodiment, and design changes and the like within a scope not departing from the gist of the present invention are possible. Even if it exists, it is included in this invention.
For example, a radiator may be installed in each of the underfloor spaces of a plurality of living rooms, a heat medium from a heat pump may be sent to these radiators, and then sent to a radiator installed in the underfloor space of the non-residential room.
Of course, this underfloor heating device may be used in combination with other air conditioning means.

この発明によれば、機器側の制御は換えないで、ヒートポンプのエネルギー消費効率が向上した床下暖房装置を提供することができ、建物内を効率的に暖房できる。   According to the present invention, an underfloor heating apparatus with improved energy consumption efficiency of a heat pump can be provided without changing the control on the equipment side, and the inside of a building can be efficiently heated.

この発明の一実施の形態であり、床下暖房装置を模式的に示す建物の床下空間部の横断面図である。It is one Embodiment of this invention, and is a cross-sectional view of the underfloor space part of the building which shows an underfloor heating apparatus typically. 図1のイ−イの断面図である。It is sectional drawing of II of FIG.

符号の説明Explanation of symbols

1 布基礎
2 居間(居室)
2a 居間の床下空間
2b 放熱器
3 キッチン
3a キッチンの床下空間
3b 放熱器
4a 廊下(非居室)の床下空間
4b 放熱器
5 ヒートポンプ
6 循環路
11 仕切り壁
12 土間コンクリート
13 断熱材
1 Fabric foundation 2 Living room (living room)
2a Living room floor space 2b Radiator 3 Kitchen 3a Kitchen floor space 3b Radiator 4a Corridor (non-living room) floor space 4b Radiator 5 Heat pump 6 Circulation path 11 Partition wall 12 Soil concrete 13 Heat insulation material

Claims (4)

ヒートポンプにより加熱された熱媒が、建物の床下空間に設置された複数の放熱器を直列的に通ってヒートポンプに戻る循環路を備えた床下暖房装置が設けられている建物であって、
前記複数の放熱器は、それぞれ別室の床下空間に設置され、それぞれの床下空間は仕切り壁によって仕切られていて別空間とされるとともに、
前記複数の放熱器のうち、ヒートポンプにより加熱された熱媒は、先ず居室の床下空間に設置されている放熱器に送られ、その後、廊下等の非居室の床下空間に設置されている他の放熱器に送られるようにされていることを特徴とする建物。
Heating medium heated by the heat pump, a building floor under heating apparatus a plurality of radiator installed under the floor space with the circulation path to return to the heat pump through a series of buildings are provided,
The plurality of radiators are respectively installed in underfloor spaces of separate rooms, and each underfloor space is partitioned by a partition wall to be a separate space,
Among the plurality of radiators, the heat medium heated by the heat pump is first sent to the radiator installed in the underfloor space of the living room, and then other installed in the underfloor space of the non-residential room such as a corridor. A building characterized by being sent to a radiator.
前記仕切り壁によって仕切られた床下空間は断熱構造となっていることを特徴とする請求項1に記載の建物。The building according to claim 1, wherein the underfloor space partitioned by the partition wall has a heat insulating structure. 前記居室の床下空間に設置されている放熱器に送られた熱媒は、所定の温度より低下した段階で、廊下等の非居室の床下空間に設置されている他の放熱器に送られるように制御されることを特徴とする請求項1又は2に記載の建物。The heat medium sent to the radiator installed in the underfloor space of the living room is sent to another radiator installed in the underfloor space of the non-residential room such as a corridor when the temperature is lower than a predetermined temperature. The building according to claim 1, wherein the building is controlled by the following. 前記熱媒は、20℃以下に低下すると前記ヒートポンプに戻るように制御されることを特徴とする請求項1乃至3のいずれか一項に記載の建物。The building according to any one of claims 1 to 3, wherein the heat medium is controlled to return to the heat pump when the temperature is lowered to 20 ° C or lower.
JP2003430724A 2003-12-25 2003-12-25 building Expired - Fee Related JP4128948B2 (en)

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Publication number Priority date Publication date Assignee Title
JP4581897B2 (en) * 2005-08-04 2010-11-17 株式会社富士通ゼネラル Heat pump type hot air heater
JP2007078324A (en) * 2005-09-16 2007-03-29 Sekisui House Ltd Building air conditioning system
JP5281303B2 (en) * 2008-03-14 2013-09-04 大阪瓦斯株式会社 Heating system
JP5481942B2 (en) * 2008-05-30 2014-04-23 ダイキン工業株式会社 Heating system
CN104879832A (en) * 2015-05-21 2015-09-02 广东美的暖通设备有限公司 Heat pump directly-heated type floor heating system with heating heat dissipater

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JP2002061854A (en) * 2000-08-21 2002-02-28 Sunpot Co Ltd Underfloor heating system
JP4517556B2 (en) * 2001-09-17 2010-08-04 株式会社デンソー Heat pump heating system

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