JP4130059B2 - Component mounting method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention provides a multi-chamfered Rimoto plate (motherboard), to a component mounting method and apparatus to optimize the mounting order in each section (refer to block or circuit pattern comprising a product).
[0002]
[Prior art]
An example of a conventional configuration in the component mounting apparatus will be described with reference to FIGS.
[0003]
As shown in FIG. 6, the mounting apparatus is provided with an orthogonal table 102 for holding a circuit board (multiple-sided board) and moving in the XY directions to position the circuit board. the parts, an input device 101 such as a keyboard for entering data, the state of the device, a display unit 100 composed of a display screen for displaying the contents of the data are provided. Further, on the right side, a component supply unit 103 having a mechanism for continuously supplying components and having a structure removable from the component mounting apparatus is arranged, and a component supply table for moving the component supply unit 103 to the component suction position 104 is provided. Furthermore, a mounting head 105 that holds a component is disposed at the front of the orthogonal table 102. The mounting head 105 is provided with a plurality of nozzles that can select an appropriate nozzle according to the component type and a mechanism for selecting the nozzle. ing. These mounting / mounting heads 105 are supported via a head moving unit 106, and the head moving unit 106 has a mechanism for moving the mounting head 105 along the circumference from the component suction position to the component mounting position. . By the head moving unit 106, the mounting component is sucked from the supply table 104 through the nozzle of the mounting head 105 and mounted on the mounting position on the circuit board held by the orthogonal table 102. In addition, a two-dimensional CCD camera 107 is disposed in the head moving unit 106, and a discrimination mark given in advance on the circuit board is recognized by the CCD camera 107. (Hereinafter referred to as a circuit pattern) ”and“ a circuit pattern not to be mounted ”.
[0004]
Note that the “circuit pattern not to be mounted” here is a multi-sided board in which a plurality of circuits with the same pattern are arranged, and a specific circuit pattern that has been judged defective in an upstream process inspection or a different product is randomly selected. In the form of production, it refers to a circuit pattern in which the same product is created as the same circuit pattern in the program and mounting is not required by the discrimination mark on the circuit board.
[0005]
FIG. 7 shows an NC program 110 that defines the order of mounting components and the supply position of the components to be mounted. In the NC program 110, a block 111 indicating the mounting order by number, a mounting coordinate 112 in which the mounting position for each block 111 is defined by two-dimensional XY coordinates, and a component supply position for each block 111 are shown in FIG. The Z number 113 defined by the number indicating the position of the supply table 104 and the mounting method of the multi-planar section are defined, and each circuit pattern position viewed from the first circuit pattern is defined in the mounting coordinates of the block 111. A chamfer circuit pattern definition unit 114, and a discrimination mark definition unit 115 that defines the type and position of a discrimination mark defined for each circuit pattern.
[0006]
FIG. 8 shows an arrangement program 120 that defines the supply position of the component to be mounted and the type of the mounted component to be supplied. This array program has a Z number 121 corresponding to the NC program and a component shape code 122 which is a character string for uniquely identifying the type of mounted component.
[0007]
FIG. 9 shows a component library 130 that defines the type, shape, and supply method according to the electrical characteristics of the mounted component for each type of mounted component. The component library 130 includes a component shape code 131 that uniquely identifies the type of the mounted component corresponding to the component shape code 122 in the array program, component attribute data 132 that defines the dimensions of the mounted component, and the mounting device. Operating condition data 133 that defines the speed of the mounting head 105 when picking up and mounting the mounted component, the speed of the orthogonal table 102, the type of nozzle to be used, and the like, and the supply condition that defines the type of the component supply means 103 of the mounting apparatus Data 134.
[0008]
FIG. 10 shows a mark library 140 that holds image data when a discrimination mark is recognized by the CCD camera 107 of the mounting apparatus for each type of discrimination mark. In the mark library 140, a mark shape code 141 for uniquely identifying the type of the discrimination mark, the luminance level at the time of recognition of the discrimination mark, and the like corresponding to the mark type defined in the discrimination mark definition unit 115 of the NC program 110 are stored. And recognition data 142 defined as image data (binary data). As the image data 142, the discrimination mark on the circuit board is actually recognized by the CCD camera 107 in advance, and data obtained at that time is stored.
[0009]
In the conventional component mounting apparatus constructed as described above, a "circuit pattern to mounting object" by the discrimination mark of the circuit board, the data creation method for performing determination of the "circuit pattern which does not implement subject" and, The actual mounting operation will be described with reference to FIG. 6, FIG. 11, and FIG.
[0010]
FIG. 11 is a data creation flowchart showing a data creation procedure for handling a specific defective board as a “circuit pattern not to be mounted” by a discrimination mark on the circuit board in a multi-sided board.
[0011]
First, the mounting order and mounting position for mounting one circuit pattern are defined in the NC program 110 (step S50). Then the mounting order for each circuit pattern on the basis of a multiple circuit pattern definition unit 11 4 shown in the NC program 110, defining each circuit pattern position as viewed from the first circuit pattern (step S51). Next, as shown in discrimination mark definition unit 11 5 NC program 110, it defines the type and the location of the discrimination mark corresponding to the respective circuit patterns (step S52). Further, according to the definition of the multi-planar circuit pattern, all mounting coordinates on the circuit board are calculated by (position of the first circuit pattern) + (position of each circuit pattern) + (mounting position), and the mounting order is determined. (Step S53).
[0012]
Note that the mounting order is defined as multi-circuit circuit pattern definition such as circuit pattern repeat for mounting the next circuit pattern after completing the mounting of one circuit pattern, or step repeat for mounting the same mounting coordinates between circuit patterns first. Determined by the type of
[0013]
FIG. 12 is a flow chart for a mounting specifying procedure showing a procedure for specifying a mounting location by recognizing a discrimination mark during production of a circuit board.
First, the circuit board is carried into the orthogonal table 102 from the upstream process (step S60). Next, the orthogonal table 102 is positioned so that the discrimination mark of the first circuit pattern on the circuit board appears in the center of the CCD camera 107 (step S61). Then, the discrimination mark is recognized by the CCD camera 107 at that position (step S62), and if it matches the image data of the mark library 141 registered in advance in the mark library 140, it is judged as a good circuit pattern. Judgment is made and a mounting target is set (step S63). If they do not coincide with each other, it is determined that the circuit pattern is a defective product, and is not a mounting target (step S64).
[0014]
This is repeated for the number of circuit patterns for the discrimination marks for each circuit pattern (step S65). Next, in the mounting order determined in step S53 of the data creation flowchart, the blocks belonging to the circuit pattern determined not to be mounted in step S64 are mounted in order while skipping (step S66). After the mounting of all circuit patterns to be mounted is completed, the circuit board is carried out to the downstream process (step S67).
[0015]
[Problems to be solved by the invention]
However, in the above mounting method, even when the “circuit pattern not to be mounted” varies from circuit board to circuit board, the mounting order is not changed by simply skipping the mounting of the circuit pattern, and the orthogonal table 102 is moved and the mounting head 107 is moved. The “circuit pattern that is not to be mounted” passes below. Therefore, depending on the arrangement of the “circuit pattern not to be mounted”, the orthogonal table performs a useless operation, and thus there is a problem that the production tact decreases.
[0016]
The present invention provides a component mounting method and apparatus that solves the above-mentioned conventional problems and eliminates wasteful operation of the orthogonal table to improve production tact.
[0017]
[Means for Solving the Problems]
In order to solve the above problem, the component mounting method according to claim 1 is a component mounting method for mounting a component on a multi-sided board in which a plurality of circuits of the same pattern are arranged on a circuit board, Recognizing the discrimination mark on the chamfered board, determining the circuit pattern to be mounted on the multi-chamfered board and the circuit pattern not to be mounted, and executing the optimization of the circuit pattern mounting order except to the circuit pattern that does not implement the subject was, among the circuit pattern and implementation subjects the determination, and performs rearrangement of the circuit pattern such production tact is shortened.
The component mounting method according to claim 2, there is provided a component mounting method according to claim 1, in performing the optimization of mounting order of the circuit pattern, a circuit pattern on which no mounting object described above determination The circuit pattern mounting order is rearranged so that the mounting head does not pass as much as possible.
[0018]
The component mounting apparatus according to claim 4 is a component mounting apparatus for mounting a component on a multi-sided board in which a plurality of circuits having the same pattern are arranged on the circuit board, and recognizing a discrimination mark on the multi-sided board. A determination mark recognition unit that determines a circuit pattern to be mounted and a circuit pattern that is not to be mounted on the multi-sided board, and the determination mark recognition unit when performing optimization of the mounting order of the circuit patterns The circuit pattern mounting order is rearranged so as to shorten the production tact among the circuit patterns to be mounted determined by the discrimination mark recognition unit , except for the circuit patterns not to be mounted determined by And a mounting order optimization unit.
The component mounting apparatus according to claim 5 is the component mounting apparatus according to claim 4, wherein the mounting order optimization unit recognizes the discrimination mark when the circuit pattern mounting order is optimized. The mounting order of the circuit patterns is rearranged so that the mounting head does not pass as much as possible on the circuit pattern which is determined not to be mounted by the unit.
[0019]
According to the first or fourth aspect of the present invention, for each circuit board, a discrimination mark attached to the circuit board is recognized , a circuit pattern ( partition ) not to be mounted is determined, and the circuit pattern is mounted. The order is optimized so that it can be carried out in a reasonable order that can be implemented continuously without waste, except for circuit patterns ( partitions ) that are not to be mounted. Can be implemented. Thereby, the production tact is improved and the advantageous effect of improving the line operation rate is obtained.
[0020]
Furthermore, the component mounting method according to claim 3 is the component mounting method according to claim 1, wherein in the upstream process of the mounting process, a circuit pattern to be mounted and a mounting target for each of the multiple chamfer substrates. The circuit pattern to be determined is determined, the determination result is obtained in the mounting step, and the mounting order of the circuit patterns is optimized based on the determination result before the multi-sided board is loaded.
[0022]
According to the third aspect of the invention, in addition to the effect of the first aspect , the information about the circuit pattern that is the information source of the optimization of the mounting order is acquired in the upstream process and optimized before the circuit board is carried in. By performing the above, it is possible to omit the recognition mark recognition time and to shorten the production tact.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a component mounting apparatus according to the present invention will be described below with reference to FIGS. In addition, the structural member in drawing and description which were shown in the prior art example including FIG. 10 attaches | subjects the same code | symbol, and abbreviate | omits description.
[0024]
FIG. 1 is a block diagram showing the structure of a data processing unit in a control device of a component mounting apparatus. A mounting data management unit 10 is provided for holding and setting the mounting order and mounting position for each mounted component. Includes an NC program 110 that defines the mounting order of components and the supply position of the components to be mounted, an array program 120 that defines the supply position of the components to be mounted and the types of mounted components to be mounted, and for each type of mounted component And a component library 130 that defines the type, shape, and supply method according to the electrical characteristics of the mounted component.
[0025]
The discrimination mark recognition unit 11 includes a CCD camera (detection means) 107, an image processing unit 21, and a mark library 140. Based on a plurality of discrimination marks on the circuit board (multi-sided board) , “circuit pattern (partition, block) to be mounted” and “circuit pattern (partition, block) not to be mounted” are determined, and the information Is provided to the mounting data management unit 10. Further, the mounting order optimization unit 12 rearranges the mounting order of the circuit patterns so that the production tact becomes the shortest for the “circuit pattern to be mounted” based on the recognition result of the discrimination mark recognition unit 11, and mount data management A function of re-registering with the unit 10; Further, the mounting operation unit 13 has a function of mounting components in the order based on the result of the mounting order optimization unit 12.
[0026]
FIG. 2 is a flowchart showing a data processing procedure according to the present invention. First, the circuit board is carried into the orthogonal table 102 from the upstream process (step S20). Next, the orthogonal table 102 is positioned so that the discrimination mark of the first circuit pattern on the circuit board appears in the center of the visual field (image) of the CCD camera 107 (step S21). At that position, the discrimination mark is recognized by the CCD camera 107 (step S22), and if it matches the image data registered in advance in the mark library 140, it is judged as a non-defective circuit pattern and “implementation”. "Circuit pattern to be processed" is determined (step S23). If they do not match, it is determined that the circuit pattern is a defective product, and is determined to be a “circuit pattern not to be mounted” (step S24). This is repeated for the number of circuit patterns for the discrimination marks for each circuit pattern (step S25). The next implementation order optimization unit 12 performs optimization of mounting order in the state in which disconnect the "circuit pattern which does not implement subject" (step S26). The optimization of the mounting order is to stop the mounting work by operating the orthogonal table 102 so that the mounting head 105 does not skip the “circuit pattern not to be mounted” as much as possible for each circuit board. The orthogonal table 102 is formed so as to be a shortest path in consideration of the entire circuit board so that the “circuit pattern to be mounted” does not remain away from the mounting head 105. The useless movement is reduced as much as possible. This operation signal is output to the mounting operation unit 13 and mounted in that order (step S27). After all the mounting is completed, the circuit board is carried out to the downstream process (step S28).
[0027]
FIG. 3 shows an embodiment when the mounting order is optimized. In this example, for simplicity, it is assumed that the mounting of the next circuit pattern is performed after the mounting of one circuit pattern is completed.
[0028]
3 (a) is Oite 9 chamfered circuit board, with mounting order when all the "circuit pattern and the mounting target" is similar to the conventional mounting order, from the circuit pattern a to the circuit pattern i The mounting work is performed sequentially according to the arrows.
[0029]
FIG. 3B shows a case where there is a circuit pattern e that is not to be mounted. Conventionally, as in FIG. 3A, the circuit pattern e is skipped and passed below the mounting head 105 without being mounted. The next circuit pattern f is mounted. After the circuit patterns a, b, c, and d are completed, the circuit pattern f is moved to the circuit pattern i adjacent to the circuit pattern d and the mounting is continuously performed. Next, by rearranging the mounting order in the order of the circuit patterns h, g, and f, the mounting operation of the orthogonal table 102 that is skipped is eliminated, and the operation stroke is reduced by one. Mounting tact can be improved.
[0030]
In the above embodiment, by recognizing the discrimination mark on the circuit board by the CCD camera 107, but it was determined to "circuit pattern which does not implement the subject" and "circuit pattern to mounting object", instead of the CCD camera 107 Thus, the discrimination mark can be detected and recognized using a dedicated sensor.
[0031]
In the above embodiment, by recognizing the discrimination mark on the circuit board by the CCD camera 107 that was included in the part article mounting device has been determined to "circuit pattern which does not implement the subject" and "circuit pattern to implement subject" As shown in FIG. 4, in the upstream process from the mounting process, information regarding the circuit pattern to be mounted in advance is acquired by the external pattern determination means 31 and input via the external interface 32 before the circuit board is loaded. It is conceivable that the mounting order optimization unit 12 optimizes the mounting order based on the information.
[0032]
Furthermore, in the above-described embodiment, the specification of “a circuit pattern not to be mounted” that has been determined to be defective in the upstream process inspection has been described for a multi-sided board in which a plurality of the same circuit patterns are arranged side by side. Even in multi-circuit boards that are produced randomly, the discrimination mark on the circuit board is recognized , and even if it is a different discrimination mark, the `` circuit pattern to be mounted '' is processed as the same circuit pattern on the program. It is also possible to specify a “circuit pattern not to be mounted”.
[0033]
Furthermore, in the above embodiment, the component mounting apparatus provided with the head moving unit (rotary head) 106 and the orthogonal table 102 of FIG. 6 has been described. The present invention can also be applied to a component mounting apparatus that includes the orthogonal table 102.
[0034]
【The invention's effect】
According to the invention of claim 1 or 4, wherein as described above, one by one circuit board, and recognizes the discrimination mark attached to the circuit board, determines the circuit pattern that does not implement the object (partition), the circuit The pattern mounting order is optimized so that it can be implemented in a reasonable order that allows continuous mounting without waste, except for circuit patterns ( partitions ) that are not to be mounted. Can be implemented in the order of implementation. Thereby, the production tact is improved and the advantageous effect of improving the line operation rate is obtained.
[0035]
According to the third aspect of the invention, in addition to the operation and effect of the first aspect , the information about the circuit pattern that is the information source of the optimization of the mounting order is acquired in the upstream process, and is optimized before the circuit board is carried in. By performing the process, it is possible to omit the recognition mark recognition time and shorten the production tact.
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing a data processing unit of a control device according to an embodiment of a component mounting apparatus according to the present invention.
FIG. 2 is a flowchart illustrating a mounting operation in the component mounting apparatus.
FIGS. 3A and 3B show examples of the mounting order, FIG. 3A is an explanatory diagram showing the mounting order of circuit boards having no circuit pattern to be mounted, and FIG. 3B is optimized. It is explanatory drawing which shows the mounting order of the printed circuit board.
FIG. 4 is a configuration diagram showing a data processing unit of a control device according to another embodiment of the component mounting apparatus according to the present invention.
FIG. 5 is a perspective view showing another embodiment of a component mounting apparatus according to the present invention.
FIG. 6 is a perspective view showing an embodiment of a conventional component mounting apparatus (common to the present invention).
FIG. 7 is an explanatory diagram showing a data structure of a conventional NC program (common to the present invention).
FIG. 8 is an explanatory diagram showing a data structure of a conventional (common to the present invention) array program.
FIG. 9 is an explanatory diagram showing a data structure of a conventional (common to the present invention) component library.
FIG. 10 is an explanatory diagram showing a data structure of a conventional mark library (common to the present invention).
FIG. 11 is a flowchart illustrating a conventional procedure for creating mounting data.
FIG. 12 is a flowchart showing a procedure for specifying a circuit pattern to be mounted in a conventional example.
[Explanation of symbols]
10 mounting data management unit 11 determines mark recognition unit 12 mounting order optimization unit 13 mounting operation portion 31 outer Bupa turn determination unit 41 orthogonal robot 42 mounting head 101 data input device 102 orthogonal table 103 component supply unit 104 supply table 105 mounted Head 106 Head moving unit 107 CCD camera 110 NC program 120 Array program 130 Parts library 140 Mark library

Claims (5)

A component mounting method for mounting a component on a multi-sided board in which a plurality of circuits having the same pattern are arranged on a circuit board,
Recognizing the discrimination mark on the multi-sided board to determine a circuit pattern to be mounted on the multi-sided board and a circuit pattern not to be mounted,
When performing the optimization of the mounting order of circuit patterns, the circuit pattern is determined so that the production tact is shortened among the determined circuit patterns to be mounted , except for the circuit patterns that are not determined to be mounted. A component mounting method characterized by rearranging the mounting order. When performing optimization of mounting order of the circuit pattern, wherein, characterized in that rearranges order of mounting the circuit pattern so that the circuit patterns on which no mounting object described above determination mounting head as little as possible pass Item mounting method according to Item 1. In the upstream process of the mounting process, a circuit pattern to be mounted and a circuit pattern that is not to be mounted are determined for each of the multiple chamfer substrates.
2. The component mounting according to claim 1, wherein the determination result is acquired in a mounting step, and a circuit pattern mounting order is optimized based on the determination result before the multi-planar board is carried in. 3. Method. A component mounting apparatus for mounting a component on a multi-sided board in which a plurality of circuits having the same pattern are arranged on a circuit board,
A discrimination mark recognition unit for recognizing a discrimination mark on the multi-sided substrate and determining a circuit pattern to be mounted on the multi-sided substrate and a circuit pattern not to be mounted;
When performing optimization of mounting order of the circuit pattern, except for the circuit pattern which does not implement the object which has been determined by the determining marks recognition unit of the circuit pattern to the determined mounting object by said discrimination mark recognition unit And a mounting order optimizing unit for rearranging the mounting order of the circuit patterns so that the production tact time is shortened . The mounting order optimization unit, when executing the optimization of mounting order of the circuit pattern, the discrimination mark recognition unit of the circuit pattern so that as little as possible pass through the mounting head was not the circuit pattern on the mounting object, which is determined by The component mounting apparatus according to claim 4, wherein the mounting order is rearranged .

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