JP4130101B2 - Prober device and inspection device with prober device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an inspection apparatus for inspecting electrical characteristics of an object to be inspected, such as a semiconductor wafer, and more particularly, to adjust the position of an object to be inspected for contacting a probe needle and an object to be inspected in a prober apparatus. About.
[0002]
[Prior art]
Inspection of electrical characteristics of an object to be inspected such as a semiconductor wafer is performed by an inspection apparatus as shown in FIG. The inspection apparatus main body 101 includes a prober apparatus 110 and a tester apparatus main body 130. The inspected object 111 is placed and fixed on the upper surface of the placing table 112 in the prober device 110. For example, a wafer chuck is preferably used as the mounting table 112. The mounting table 112 is supported by support means 113, and the support means 113 is provided on a stage 114 having tables 114b and 114c movable in the X and Y directions as shown in FIG. Furthermore, the support means 113 can move the mounting table 112 up and down (Z direction) and rotate (θ). Further, as shown in FIG. 2B, the support means 113 can tilt (φ) the upper surface of the mounting table 112 with respect to the X and Y planes. The stage 114 and the support means 113 are driven by a command from the prober control unit 120.
[0003]
On the other hand, a test head connecting portion including a head plate 115 and a pogo pin ring 116 is provided on the prober device 110. Further, a probe card 118 is mounted on the head plate 115 via a card holder 117. The probe card 118 is provided with a probe needle that contacts the electrode pad of the device under test 111. The tester device main body 130 is provided with a test head 131 and a tester (not shown), and the test head 131 is supported by a test head support portion 132. A performance board 133 provided with a contact group connected to a tester for inspecting the electrical characteristics of the object to be inspected is provided below the test head. When the test head 131 is connected to the prober device 110, a contact provided on the performance board 133 is pressed against one end of a terminal called a pogo pin provided on the pogo pin ring 116. The other end of the pogo pin is pressed against a terminal on the probe card drawn from the probe needle. Thereby, electrical conduction between the device under test and the tester can be obtained.
[0004]
The tester apparatus main body 130 includes a tester control unit 134 that controls the operation of the tester and a test head driving unit 135 that moves the test head.
[0005]
In order to bring the electrode pad of the device under test 111 into contact with the probe needle, it is necessary to adjust the position of the mounting table 112 (hereinafter referred to as “needle alignment operation”). The needle alignment operation is performed according to the following procedure. First, the probe card 118 is mounted on the head plate 115 in a state where the test head 131 is not connected to the prober device 110. Thereafter, the test head 131 is connected to the prober device 110. Then, by moving the table 114b and the table 114c in the X and Y directions, the needle alignment camera 119 having a fixed relative position with the mounting table 112 is moved to move under the probe needle, and the position and height of the needle tip are increased. Read the length sequentially. Then, the relative distance from the mounting table 112 is subtracted from the read value, and the position (X, Y), height (Z) and angle (θ) of the mounting table 112 where the electrode pad of the device under test 111 and the probe needle come into contact with each other. , Φ) is derived, the position, height, and angle are stored in a storage means (not shown) in the prober control unit 120, and the needle alignment operation is completed. Needle alignment work is naturally performed not only when the probe card 118 is replaced, but also after other work such as directly changing the tip position of the probe needle, for example, adjusting the position of the probe card 118.
[0006]
In the inspection operation, the inspection object 111 placed on the mounting table 112 is moved to the stored position (X, Y), height (Z), and angle (θ) by the stage 114 and the support means 113. set. Thereby, the electrode pad of the to-be-inspected object 111 and a probe needle can be made to contact. Since the positions of the probe card 118 and the probe needle do not fluctuate during the inspection operation, it is not necessary to perform the needle alignment operation in principle.
[0007]
However, in the actual inspection work, there is a case where work accompanied with an operation of moving the test head 131 away from the prober device 110 occurs (hereinafter referred to as test head operation). For example, the maintenance of the test head itself, such as calibration, or the maintenance of the test head connecting portion that cannot be maintained when the test head 131 is connected. The test head operation itself is not intended to change the tip position of the probe needle as described above, but affects the tip position of the probe needle. This is because the test head 131 normally has a weight of about 200 kg to 700 kg, and the pressure is applied to the test head connecting portion. This is because the pressure also affects the probe card and the probe needle. Therefore, it is necessary to perform needle alignment even after the test head is operated and the test head 131 is reconnected to the prober device 110.
[0008]
[Problems to be solved by the invention]
However, in the conventional inspection apparatus described above, the needle alignment operation of the probe needle necessary after the test head operation is performed based on the memory of the operator. Therefore, an operator who has forgotten the needle alignment operation sometimes restarts the inspection in a state where the probe needle and the electrode pad of the object to be inspected are not sufficiently in contact. As a result, there is an inconvenience such as an error in the inspection result and a reduction in work efficiency.
[0009]
An object of the present invention is to detect the test head operation by the inspection device, thereby performing the needle alignment of the probe needle without depending on the memory of the operator, and maintaining the proper accuracy. An object of the present invention is to provide an inspection apparatus capable of inspecting electrical characteristics.
[0010]
[Means for Solving the Problems]
Therefore, the inspection apparatus of the present invention includes a tester device used for inspecting the electrical characteristics of the object to be inspected and a prober device used for alignment of the object to be inspected,
The tester device includes a tester for measuring electrical characteristics and a test head electrically connected to the tester;
The prober device includes a probe card having a probe needle that comes into contact with an electrode of the object to be inspected, a test head connecting part for electrically connecting the test head and the probe card, and a mounting table on which the object to be inspected is mounted. And an inspection apparatus for electrically connecting the test head connecting portion and the test head, and thereby electrically connecting the electrode of the object to be inspected and the tester,
The inspection apparatus automatically adjusts the position of the mounting table so that the tip of the probe needle and the electrode of the object to be inspected come into contact with each other based on the result of detecting the movement of the test head. It was decided to be equipped with the means to perform automatically.
[0011]
The inspection apparatus of the present invention further includes a tester device used for inspecting the electrical characteristics of the object to be inspected and a prober device used for alignment of the object to be inspected.
The tester device includes a tester for measuring electrical characteristics and a test head electrically connected to the tester;
The prober device includes a probe card having a probe needle that comes into contact with an electrode of the object to be inspected, a test head connecting part for electrically connecting the test head and the probe card, and a mounting table on which the object to be inspected is mounted. And an inspection apparatus for electrically connecting the test head connecting portion and the test head, and thereby electrically connecting the electrode of the object to be inspected and the tester,
The inspection apparatus includes a means for sensing that the test head has moved, and a means for signaling that the test head has moved based on the sensed result.
[0012]
The inspection apparatus of the present invention further includes a tester device used for inspecting the electrical characteristics of the object to be inspected and a prober device used for alignment of the object to be inspected.
The tester device includes a tester for measuring electrical characteristics and a test head electrically connected to the tester;
The prober device includes a probe card having a probe needle that comes into contact with an electrode of the object to be inspected, a test head connecting part for electrically connecting the test head and the probe card, and a mounting table on which the object to be inspected is mounted. And an inspection apparatus for electrically connecting the test head connecting portion and the test head, and thereby electrically connecting the electrode of the object to be inspected and the tester,
Based on the means for detecting that the test head has moved, and the detection result, the inspection apparatus adjusts the position of the mounting table so that the tip of the probe needle and the electrode of the object to be inspected contact each other. The apparatus is configured to be provided with means for prohibiting the inspection of the electrical characteristics of the object to be inspected until it is performed.
[0013]
The inspection apparatus according to the present invention further includes detection means for detecting movement of the test head as the detection means.
[0014]
In the inspection apparatus of the present invention, as the sensing means, a test head driving unit included in the tester apparatus includes a means for receiving a signal generated when the test head is moved.
[0015]
Furthermore, the prober apparatus of the present invention is a prober apparatus used for an inspection apparatus for inspecting electrical characteristics of an object to be inspected, and used for alignment of the object to be inspected,
The prober device includes a probe card having a probe needle that contacts an electrode of the object to be inspected, a test head and a test head connecting part for electrically connecting the probe card, and a mounting table on which the object to be inspected is mounted. In the prober device,
The prober device automatically detects the movement of the test head and, based on the detected result, automatically adjusts the position of the mounting table so that the tip of the probe needle contacts the electrode of the object to be inspected. It was decided to be equipped with the means to perform automatically.
[0016]
The prober apparatus of the present invention is a prober apparatus used for an inspection apparatus for inspecting electrical characteristics of an object to be inspected, and used for alignment of the object to be inspected,
The prober device includes a probe card having a probe needle that contacts an electrode of the object to be inspected, a test head and a test head connecting part for electrically connecting the probe card, and a mounting table on which the object to be inspected is mounted. In the prober device,
The prober apparatus is configured to include means for sensing that the test head has moved, and means for signaling that the test head has moved based on the sensed result.
[0017]
The prober apparatus of the present invention is a prober apparatus used for an inspection apparatus for inspecting electrical characteristics of an object to be inspected, and used for alignment of the object to be inspected,
The prober device includes a probe card having a probe needle that contacts an electrode of the object to be inspected, a test head and a test head connecting part for electrically connecting the probe card, and a mounting table on which the object to be inspected is mounted. In the prober device,
The prober device adjusts the position of the mounting table according to the means for detecting the movement of the test head and the probe tip and the electrode of the object to be inspected based on the detected result. It is configured to include means for prohibiting the inspection of the electrical characteristics of the object to be inspected until it is touched.
[0018]
Further, the prober apparatus of the present invention includes a detecting means for detecting the movement of the test head as the detecting means.
[0019]
In the prober apparatus of the present invention, as the sensing means, a test head driving unit included in the tester apparatus includes a means for receiving a signal generated when the test head is moved.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings. Throughout the drawings, similar components are denoted by the same reference numerals.
FIG. 3 is a diagram showing a first embodiment of the inspection apparatus according to the present invention. Here, in the first embodiment, the inspection apparatus main body 301 further detects the movement of the test head 131, and the input / output port 312 that inputs and outputs signals between the prober control unit 120 and the tester control unit 134. It is characterized by providing. The detection unit 311 can be realized by various sensors such as a mechanical sensor such as a microswitch, an optical sensor, and an ultrasonic sensor. Although it is provided on the prober device 110 in FIG. 1, it may be provided on the test head 131 or the test head support portion 132. The detection unit 311 is connected by a wired or wireless communication unit (not shown).
[0021]
The operation of the first embodiment of the present invention will be described with reference to the flowchart of FIG. When the inspection work is stopped, the tester control unit 134 outputs a signal indicating that the inspection work is stopped to the prober control unit 120 (step 401). The prober control unit 120 initializes a variable indicating that the test head 131 has moved (step 402), and waits for an instruction from the operator to resume the inspection (step 405). When a signal indicating that the test head 131 has moved is received from the detection means 311 during the loop for waiting for the instruction (step 403), the prober control unit 120 stores that in the variable (step 404). Thereafter, when there is an instruction to restart the inspection (step 405), the prober control unit 120 refers to the variable (step 406), and if the test head is moved while the inspection operation is stopped, the needle alignment operation is automatically performed. (Step 407). After the needle alignment operation is completed, the prober control unit 120 outputs a signal for restarting the inspection operation to the tester control unit 134 (step 408).
[0022]
FIG. 5 is a diagram showing a second embodiment of the inspection apparatus according to the present invention. Here, in the second embodiment, the inspection apparatus main body 501 includes an input / output port 511 for inputting / outputting signals between the test head drive unit 135 and the prober control unit 120 provided in the tester apparatus main body 130, and The prober control unit 120 uses a signal generated by the test head driving unit 135 when moving the test head 131 instead of the detection signal by the detection unit 311 in the embodiment.
[0023]
FIG. 6 is a diagram showing a third embodiment of the inspection apparatus according to the present invention. Here, the third embodiment is characterized in that the inspection apparatus main body 601 includes the detection unit 311 and the input / output port 312 as in the first embodiment, and the prober apparatus 110 includes the console 611. The console 611 includes an input device such as a keypad or / and a display device.
[0024]
The operation of the third embodiment will be described with reference to the flowchart of FIG. When the inspection operation is stopped (step 701), when the prober control unit 120 receives a signal indicating that the test head 131 has moved from the detection means 311 (step 702), the tester control is performed through the input / output port 312. A signal prohibiting the resumption of the inspection is output to the unit 134 (step 703), and an alarm is displayed on the console 611 that the needle alignment operation needs to be performed because the test head 131 has moved (step 704). After the needle alignment operation is completed (step 705), the prober control unit 120 transmits a signal for canceling the prohibition of the inspection operation to the tester control unit 134 (step 706), whereby the inspection operation is resumed. (Step 707).
[0025]
In particular, in a prober device that does not have an automatic needle alignment function, the detection means 311 and the input / output port 312 are directly connected to the console 611, and it is determined that the needle alignment operation is completed by an input to the console 611 by the operator. (Step 705) By mounting the function of the prober control unit 120 in this embodiment on the console 611, the prober control unit 120 can be omitted.
[0026]
【The invention's effect】
According to the first embodiment of the present invention, when the test head operation is performed while the inspection operation is temporarily stopped, the inspection apparatus automatically performs the needle alignment operation before resuming the inspection without depending on the memory of the operator. Do it. For this reason, it is possible to prevent a measurement error caused by forgetting the needle alignment operation after operating the test head as described above, and to improve the work efficiency.
[0027]
Further, according to the second embodiment of the present invention, as a means for detecting whether or not the test head has been moved, a signal generated by the test head driving unit for moving the test head is directly received and detected. As a result, the cost of newly providing the detection means can be omitted, and problems due to failure of the detection means can be avoided, so that the object of the present invention can be achieved more inexpensively and reliably.
[0028]
Further, according to the third embodiment of the present invention, even in an inspection apparatus that does not have an automatic needle alignment function, it is possible to effectively prevent the inspection operation from being restarted without performing the needle alignment operation after operating the test head. it can. As a result, measurement errors can be prevented and work efficiency can be improved.
[Brief description of the drawings]
FIG. 1 is a view showing an inspection apparatus having a conventional prober apparatus.
FIGS. 2A and 2B are diagrams for explaining a position adjustment mechanism for an object to be inspected in a conventional prober apparatus, wherein FIG. 2A is a perspective view of the position adjustment mechanism, and FIG. 2B is a side view thereof;
FIG. 3 is a view showing an inspection apparatus according to a first embodiment of the present invention.
4 is a flowchart for explaining the operation of the inspection apparatus shown in FIG. 3;
FIG. 5 is a view showing an inspection apparatus according to a second embodiment of the present invention.
FIG. 6 is a view showing an inspection apparatus according to a third embodiment of the present invention.
7 is a flowchart for explaining the operation of the inspection apparatus shown in FIG. 6;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 301 ... Inspection apparatus main body 110 ... Prober apparatus main body 111 ... Inspected object 112 ... Mounting stand 113 ... Support means 114 ... Stage 118 ... Probe card 120 ... Prober control part 130 ... Tester apparatus main body 131 ... Test head 134 ... Tester control part 311 ... Detection means 312 ... Input / output port

Claims (10)

An inspection apparatus comprising a tester device used for inspection of electrical characteristics of an object to be inspected and a prober device used for alignment of the object to be inspected,
The tester device includes a tester for measuring electrical characteristics and a test head electrically connected to the tester;
The prober device includes a probe card having a probe needle that comes into contact with an electrode of the object to be inspected, a test head connecting part for electrically connecting the test head and the probe card, and a mounting table on which the object to be inspected is mounted. And an inspection apparatus for electrically connecting the test head connecting portion and the test head, and thereby electrically connecting the electrode of the object to be inspected and the tester,
The inspection apparatus has means for detecting that the test head has moved, means for storing the detection result, and the probe when there is a history of movement of the test head when an inspection restart instruction is issued by an operator. An inspection apparatus comprising: means for automatically adjusting the position of the mounting table so that the needle tip of the needle and the electrode of the object to be inspected are in contact with each other. An inspection apparatus including a tester device used for inspection of electrical characteristics of an object to be inspected and a prober device used for alignment of the object to be inspected,
The tester device includes a tester for measuring electrical characteristics and a test head electrically connected to the tester;
The prober device includes a probe card having a probe needle that comes into contact with an electrode of the object to be inspected, a test head connecting part for electrically connecting the test head and the probe card, and a mounting table on which the object to be inspected is mounted. And an inspection apparatus for electrically connecting the test head connecting portion and the test head, and thereby electrically connecting the electrode of the object to be inspected and the tester,
The inspection apparatus has means for detecting that the test head has moved, means for storing the detection result, and the probe when there is a history of movement of the test head when an inspection restart instruction is given by an operator. An inspection apparatus comprising: means for prohibiting inspection of electrical characteristics of the object to be inspected until the position of the mounting table is adjusted so that a needle tip of the needle and an electrode of the object to be inspected are in contact with each other. 3. The inspection apparatus according to claim 2, further comprising means for signaling that the test head has moved based on the sensed result. The inspection apparatus according to claim 1, wherein the sensing unit is a detection unit that detects movement of the test head. 4. The inspection apparatus according to claim 1, wherein the sensing unit is a unit that receives a signal generated when the test head driving unit included in the tester device moves the test head. 5. A prober device used for an inspection device for inspecting electrical characteristics of an inspection object, and used for alignment of the inspection object,
The prober device includes a probe card having a probe needle that contacts an electrode of the object to be inspected, a test head and a test head connecting part for electrically connecting the probe card, and a mounting table on which the object to be inspected is mounted. In the prober device,
The prober device has a means for sensing that the test head has moved, a means for storing the sensing result, and the probe when there is a history of movement of the test head when an instruction to restart the test is given by an operator. A prober device comprising means for automatically adjusting the position of the mounting table so that the needle tip of the needle and the electrode of the object to be inspected contact each other. A prober device used for an inspection apparatus for inspecting electrical characteristics of an object to be inspected, and used for alignment of the object to be inspected,
The prober device includes a probe card having a probe needle that contacts an electrode of the object to be inspected, a test head and a test head connection part for electrically connecting the probe card, and a mounting table on which the object to be inspected is mounted. In the prober device,
The prober device has means for sensing that the test head has moved, means for storing the sensing result, and when there is a history that the test head has been moved once when an instruction to restart the test is given by an operator. A prober device comprising means for prohibiting the inspection of the electrical characteristics of the object to be inspected until the position of the mounting table is adjusted so that the tip of the probe needle and the electrode of the object to be inspected are in contact with each other . 8. The prober device according to claim 7, further comprising means for signaling that the test head has moved based on the sensed result. The prober apparatus according to claim 6, wherein the sensing unit is a sensing unit that detects movement of the test head. 9. The prober device according to claim 6, wherein the sensing unit is a unit that receives a signal indicating that the test head has moved.

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