JP4130971B2 - Coating film forming apparatus and coating film forming method - Google Patents

Description

  The present invention relates to a coating film forming apparatus capable of preventing a shortage of the processing liquid from being deposited at the nozzle tip and applying the processing liquid uniformly to the substrate to be processed when the processing liquid is applied to the substrate to be processed to form a film. And a coating film forming method.

  For example, in LCD manufacturing, a predetermined film is formed on an LCD substrate, which is a substrate to be processed, and then a photoresist film is applied to form a resist film, and the resist film is exposed in accordance with a circuit pattern. A circuit pattern is formed by a so-called photolithography technique of developing the film. In this photolithography technology, the LCD substrate, which is the substrate to be processed, undergoes a series of processes such as cleaning processing → dehydration baking → adhesion (hydrophobization) processing → resist coating → prebaking → exposure → development → post baking. A predetermined circuit pattern is formed on the resist layer.

  Conventionally, in such processing, processing units for performing each processing are arranged on both sides of the transport path in consideration of the process flow, and a substrate to be processed is carried into each processing unit by a central transport apparatus that can travel on the transport path. This is performed by a processing system in which one or a plurality of process blocks to be output are arranged. Since such a processing system is basically random access, the degree of freedom of processing is extremely high.

  In such a processing system, as a method of forming a resist film by applying a resist solution to the LCD substrate, a resist supply nozzle for applying the resist solution in a strip shape and the LCD substrate are arranged in a direction perpendicular to the longitudinal direction of the nozzle discharge port. There is a method in which the coating is carried out by moving it relatively. In this case, the resist supply nozzle is provided with a slit-like discharge port having a minute gap extending in the width direction of the substrate, and a resist solution discharged in a strip shape from the slit-like discharge port is supplied to the entire surface of the substrate. A resist film is formed.

According to this method, since the resist solution is discharged (supplied) from one side of the substrate to the other side in a strip shape, a resist film is formed on the entire surface of the square substrate on average without wasting the resist solution. be able to. A coating film forming apparatus employing such a coating film forming method is disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 10-156255).
JP-A-10-156255 (page 3, right column, line 5 to page 4, left column, line 6, FIG. 1)

  In the coating film forming method described above, the resist solution discharged from the nozzles adheres to the periphery of the discharge port during the coating process. Therefore, after the coating process, the resist solution is not uniform throughout the periphery of the discharge port. It is attached with. That is, when the next coating process is performed in that state, the discharge of the resist solution from the ejection port is disturbed, and the uniform coating process cannot be performed on the substrate surface.

  In order to avoid this problem, conventionally, as shown in FIG. 13, during standby, a predetermined amount of resist solution R is discharged onto the peripheral surface of the priming roller 202 in the vicinity of the priming roller 202 that rotates the nozzle 201. The resist solution R adhering to the nozzle tip was made uniform (hereinafter referred to as priming process). In the conventional example shown in FIG. 13, the lower part of the priming roller 202 is immersed in a thinner 204 as a solvent in order to easily remove the resist solution adhering to the peripheral surface of the priming roller 202. That is, the resist solution adhering to the peripheral surface of the priming roller 202 is dissolved in the thinner 204. Furthermore, in this configuration, the fixed wiper 203 is brought into sliding contact with the peripheral surface of the priming roller 202 to remove excess resist solution R adhering to the priming roller 202.

FIG. 14 is an enlarged cross-sectional view of the tip of the nozzle 201 shown in FIG. 13 as viewed from the short side. The tip of the nozzle 201 is tapered when viewed from its short side, and a lower end surface 201b and an inclined surface 201c are formed in front and rear of the discharge port 201a along the nozzle short direction.
As shown in the figure, in the priming process, the resist solution R is discharged from the discharge port 201a to the peripheral surface of the rotating priming roller 202. At that time, since the resist solution R flows along the rotation direction of the priming roller 202, a part of the lower end surface 201 b and the inclined surface 201 c on the roller rotation direction side is formed by the resist solution R at the nozzle tip as shown in the figure. A wet state (a state in which the resist solution R is attached) is obtained.

  In the conventional priming process, the timing for starting the rotation of the priming roller 202 and the timing for discharging the resist solution R from the nozzle 201 are substantially the same. In that case, the resist solution R discharged from the nozzle 201 is immediately wound up by the priming roller 202. At this time, as shown in the enlarged view of the longitudinal side of the nozzle in FIG. 15, due to the shortage of the resist solution on the nozzle tip, the portion wetted by the resist solution R and the lower portion of the inclined surface 201c are wet. The part that did not occur.

By the way, after this priming process, as shown in FIG. 16, when the resist solution R is applied to the substrate G, the resist solution R adhering to the inclined surface 201c is the resist solution R discharged from the discharge port 201a opposite to the nozzle traveling direction. In addition to pulling in the direction, it also pulls in the direction perpendicular to the nozzle traveling direction (nozzle longitudinal direction).
That is, when the resist solution R is applied to the substrate G in the state of the nozzle tip shown in FIG. 15, the resist solution R attached to the inclined surface 201c pulls the resist solution R discharged from the discharge port 201a. Only the thickness was thick. For this reason, there is a problem that the resist film thickness at the application start position becomes non-uniform, and wrinkles L and the like are generated as shown in FIG.

  The present invention has been made under the circumstances as described above, and when forming a film by applying a treatment liquid to a substrate to be treated, the liquid deposition of the treatment liquid at the nozzle tip is prevented from being insufficient. It is an object of the present invention to provide a coating film forming apparatus and a coating film forming method capable of uniformly applying a treatment liquid.

In order to solve the above-described problems, a coating film forming apparatus according to the present invention includes a processing liquid supply nozzle having a slit-like discharge port extending in the width direction of a substrate to be processed, and a processing liquid discharge from the processing liquid supply nozzle. Discharge control means for controlling the process, a roller installed at a standby position of the treatment liquid supply nozzle and formed to be rotatable, a roller rotation control means for controlling the rotation of the roller, and the process on the substrate to be processed. And a nozzle moving means for moving the liquid supply nozzle. The processing liquid is discharged from the discharge port onto the peripheral surface of the roller, and the processing liquid adhering to the discharge port is made uniform by rotating the roller. a coating film forming apparatus in the standby position, after the ejection control means has discharged a predetermined amount of the treatment liquid from the treatment liquid supply nozzle, said rollers rotating control means, Rotate the roller in one direction so that a large amount of processing liquid adhering to the discharge port of the processing liquid supply nozzle adheres to one side of the discharge port in the longitudinal direction, with a fixed time interval, and supplying the processing liquid In the nozzle use position, the nozzle moving means is characterized in that the processing liquid supply nozzle is moved from the longitudinal direction of the ejection port as a traveling direction on a side where the processing liquid is less attached .

According to this configuration, after starting the discharge of the processing liquid from the processing liquid supply nozzle, control is performed so that the roller starts rotating after a predetermined time. By doing so, the processing liquid stays in the vicinity of the discharge port, and a sufficient amount of the processing liquid can be attached around the discharge port.
After the priming process, when the coating process is performed on the substrate to be processed using the processing liquid supply nozzle, a sufficient amount of the processing liquid is uniformly attached around the discharge port. The thickness can be made uniform, and the generation of wrinkles and the like can be suppressed.
In addition, after the priming process, a sufficient amount of processing liquid can be uniformly attached to the periphery of the discharge port at least on the rotation direction side of the roller. And according to the above-described configuration, at the start of application to the substrate to be processed, the uniformly and sufficiently attached processing liquid uniformly pulls the processing liquid discharged from the discharge port in the direction opposite to the nozzle traveling direction, Pull evenly in the direction perpendicular to the nozzle travel direction (nozzle longitudinal direction). As a result, the film thickness can be made more uniform at the application start position, and the generation of wrinkles and the like can be suppressed.

Alternatively, in order to solve the above-described problem, the coating film forming apparatus according to the present invention includes a processing liquid supply nozzle having a slit-like discharge port extending in the width direction of the substrate to be processed, and a process from the processing liquid supply nozzle. Discharge control means for controlling liquid discharge, a roller installed at a standby position of the treatment liquid supply nozzle and formed to be rotatable, and roller rotation control means for controlling rotation of the roller, and processing from the discharge port A coating film forming apparatus that discharges the liquid onto the peripheral surface of the roller and uniformizes the processing liquid adhering to the discharge port by rotating the roller, wherein the discharge control means at the standby position After discharging a predetermined amount of the processing liquid from the processing liquid supply nozzle and ending the discharge of the processing liquid, the roller rotation control means moves forward after a predetermined time from the discharge of the predetermined amount of the processing liquid. Having said roller to be started rotating.

According to this configuration, after discharging a predetermined amount of the processing liquid from the processing liquid supply nozzle and finishing the discharge of the processing liquid, the roller is started to rotate after a predetermined time from the discharge of the predetermined amount of the processing liquid. Control is performed. By doing so, the processing liquid stays in the vicinity of the discharge port, and a sufficient amount of the processing liquid can be attached around the discharge port.
After the priming process, when the coating process is performed on the substrate to be processed using the processing liquid supply nozzle, a sufficient amount of the processing liquid is uniformly attached around the discharge port. The thickness can be made uniform, and the generation of wrinkles and the like can be suppressed.

In order to solve the above-described problem, the coating film forming method according to the present invention is capable of rotating a predetermined amount of processing liquid from a processing liquid supply nozzle having a slit-like discharge port extending in the width direction of the substrate to be processed. A coating film forming method for discharging the processing liquid adhering to the peripheral surface of the formed roller and uniforming the processing liquid adhering to the discharge port by rotating the roller, the standby position of the processing liquid supply nozzle A process of starting the rotation of the roller after a predetermined time has elapsed after starting the discharge of the processing liquid from the processing liquid supply nozzle, and moving the processing liquid supply nozzle from the standby position onto the substrate to be processed. and a step of forming the substrate to be processed by the processing liquid ejected from the supply nozzle, in the step of start of rotation of the roller, to rotate the roller in one direction In the step of depositing the substrate to be processed by depositing a large amount of processing liquid on one side of the ejection port in the longitudinal direction, the side on which the treatment liquid is less adhered on the boundary of the longitudinal direction of the ejection port is processed. It is characterized by the direction of travel of the liquid supply nozzle.

In this way, after starting the discharge of the processing liquid from the processing liquid supply nozzle, control is performed so that the roller starts rotating after a predetermined time. By doing so, the treatment liquid stays in the vicinity of the discharge port, and sufficient treatment liquid can be attached to the periphery of the discharge port.
After the priming process, when the coating process is performed on the substrate to be processed using the processing liquid supply nozzle, a sufficient amount of the processing liquid is uniformly attached around the discharge port. The thickness can be made uniform, and the generation of wrinkles and the like can be suppressed.
In addition, a sufficient amount of processing liquid can be uniformly attached around at least the rotation direction of the roller around the discharge port. At the start of application to the substrate to be processed, the uniformly and sufficiently attached processing liquid uniformly pulls the processing liquid discharged from the discharge port in the direction opposite to the nozzle moving direction and is orthogonal to the nozzle moving direction. Pull evenly in the direction. As a result, the film thickness can be made more uniform at the application start position, and the generation of wrinkles and the like can be suppressed.

Alternatively, in order to solve the above-described problem, the coating film forming method according to the present invention can freely rotate a predetermined amount of processing liquid from a processing liquid supply nozzle having a slit-like discharge port extending in the width direction of the substrate to be processed. A coating film forming method for discharging the processing liquid adhering to the peripheral surface of the formed roller and uniforming the processing liquid adhering to the discharge port by rotating the roller, the standby position of the processing liquid supply nozzle And a step of starting the rotation of the roller after completion of the discharge of the processing liquid after starting the discharge of the processing liquid from the processing liquid supply nozzle, and the substrate to be processed from the standby position. And a step of forming a film on the substrate to be processed by the processing liquid discharged from the processing liquid supply nozzle.

By doing so, the processing liquid stays in the vicinity of the discharge port, and a sufficient amount of the processing liquid can be attached around the discharge port.
After the priming process, when the coating process is performed on the substrate to be processed using the processing liquid supply nozzle, a sufficient amount of the processing liquid is uniformly attached around the discharge port. The thickness can be made uniform, and the generation of wrinkles and the like can be suppressed.

  According to the present invention, when a film is formed by applying a processing liquid to a substrate to be processed, the coating film can prevent the liquid from being insufficiently applied to the nozzle tip, and can uniformly apply the processing liquid to the substrate to be processed. A forming apparatus and a coating film forming method can be provided.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the overall configuration of a resist coating and developing apparatus provided with a coating film forming apparatus (resist coating apparatus) according to the present invention.
This resist coating and developing apparatus 100 is a cassette station 1 on which a plurality of cassettes C for accommodating a plurality of LCD substrates G (hereinafter referred to as substrates G), which are substrates to be processed, and a processing liquid on the substrates G. A processing station 2 including a plurality of processing units for performing a series of processes including application and development of a resist solution, and an interface station 3 for transferring the substrate G to and from the exposure apparatus 4 are provided. Yes.
The cassette station 1 and the interface station 3 are arranged at both ends of the processing station 2, respectively. In FIG. 1, the longitudinal direction of the resist coating and developing apparatus 100 is defined as the X direction, and the direction perpendicular to the X direction on the plane is defined as the Y direction.

  The cassette station 1 includes a transfer device 11 for carrying in and out the substrate G between the cassette C and the processing station 2. This transfer device 11 has a transfer arm 11a, and can move on a transfer path 10 provided along the Y direction which is the arrangement direction of the cassettes C. Between the cassette C and the processing station 2 by the transfer arm 11a. Then, the substrate G is carried in and out.

The processing station 2 has two parallel rows of transfer lines A and B for transferring the substrate G extending in the X direction, and scrub cleaning is performed from the cassette station 1 side to the interface station 3 along the transfer line A. A part of the processing unit (SCR) 21, the first heat treatment unit section 26, the resist processing unit 23, and the second heat treatment unit section 27 are arranged.
An excimer UV irradiation unit (e-UV) 22 is provided on a part of the scrub cleaning unit (SCR) 21.

  Further, a part of the second heat treatment unit section 27, the development processing unit (DEV) 24, and the i-line UV irradiation unit (i-UV) 25 from the interface station 3 side toward the cassette station 1 along the transfer line B. And the 3rd heat processing unit 28 is arranged.

  In the processing station 2, the processing units and the transfer devices are arranged so as to constitute the two rows of transfer lines A and B and basically in the order of processing. A space 40 is provided between them. And the shuttle 41 is provided so that this space part 40 can be reciprocated. The shuttle 41 is configured to hold the substrate G, and the substrate G can be transferred to and from the transfer lines A and B.

  In addition, the interface station 3 has a transfer device 42 for loading and unloading the substrate G between the processing station 2 and the exposure device 4, a buffer stage (BUF) 43 for arranging a buffer cassette, and a cooling function. An extension / cooling stage (EXT / COL) 44, which is a substrate transfer section, is provided, and an external apparatus block 45 in which a tiger (TITLER) and a peripheral exposure apparatus (EE) are vertically stacked is a transport apparatus 42. It is provided adjacent to. The transfer device 42 includes a transfer arm 42a, and the transfer arm 42a carries in and out the substrate G between the processing station 2 and the exposure device 4.

In the resist coating and developing apparatus 100 configured in this way, first, after the substrate G in the cassette C arranged in the cassette station 1 is carried into the processing station 2 by the transport apparatus 11, first, the excimer UV irradiation unit. A scrub pretreatment by (e-UV) 22 and a scrub cleaning treatment by a scrub cleaning unit (SCR) 21 are performed.
Next, the substrate G is loaded into heat treatment unit blocks (TB) 31 and 32 belonging to the first heat treatment unit section 26, and a series of heat treatments (dehydration baking treatment, hydrophobization treatment, etc.) are performed. The substrate is transferred in the first heat treatment unit section 26 by the transfer device 33.

Thereafter, the substrate G is carried into the resist coating processing unit 23 and subjected to a resist liquid film forming process. In the resist coating processing unit 23, first, a resist solution is applied to the substrate G in the resist coating apparatus (CT) 23a, and then a vacuum drying process is performed in the vacuum drying unit (VD) 23b.
The resist coating processing unit 23 includes a resist coating apparatus (CT) 23a as a coating film forming apparatus according to the present invention, and will be described in detail later.
After the resist film forming process in the resist coating unit 23, the substrate G is carried into the heat treatment unit blocks (TB) 34 and 35 belonging to the second heat treatment unit section 27, and a series of heat treatments (such as pre-bake treatment) are performed. Is called. The substrate is transferred in the second heat treatment unit section 27 by the transfer device 36.

  Next, the substrate G is transferred to the extension / cooling stage (EXT / COL) 44 of the interface station 3 by the transfer device 36, and is transferred to the peripheral exposure device (EE) of the external device block 45 by the transfer device 42. Therefore, the substrate G is exposed to remove the peripheral resist, and is then transported to the exposure device 4 by the transport device 42, and the resist film on the substrate G is exposed to form a predetermined pattern. In some cases, the substrate G is accommodated in a buffer cassette on the buffer stage (BUF) 43 and then transferred to the exposure apparatus 4.

  After the exposure is completed, the substrate G is transported to the upper TITER of the external device block 45 by the transport device 42 of the interface station 3, and predetermined information is written on the substrate G. Thereafter, the substrate G is placed on an extension / cooling stage (EXT / COL) 44, and then transferred to the processing station 2 again. For example, the substrate G is transported to the development processing unit (DEV) 24 by a roller transport mechanism, where development processing is performed.

After completion of the development processing, the substrate G is carried from the development processing unit (DEV) 24 to the i-ray UV irradiation unit (i-UV) 25, and the substrate G is subjected to decoloring processing. Thereafter, the substrate G is carried into the third heat treatment unit section 28 and subjected to a series of heat treatments (post-bake treatment or the like) in the heat treatment unit blocks (TB) 37 and 38. Note that the substrate transport in the third heat treatment unit section 28 is performed by the transport device 39.
The substrate G is cooled to a predetermined temperature in the third heat treatment unit section 28 and then accommodated in a predetermined cassette C by the transfer device 11 of the cassette station 1.

  Next, the resist coating unit 23 will be described with reference to FIG. FIG. 2 is a plan view of a resist coating apparatus (CT) 23a and a reduced pressure drying unit (VD) 23b constituting the resist coating processing unit 23. The resist coating device (CT) 23a and the reduced pressure drying unit (VD) 23b are arranged in a horizontal row on the support base 60 in the order of processing steps. A pair of guide rails 62 are laid on both sides of the support base 60, and the substrate G can be directly exchanged between the units by one or a plurality of pairs of transfer arms 64 moving in parallel along the guide rails 62. Yes.

  A vacuum drying unit (VD) 23b shown in FIG. 2 includes a tray or bottom shallow container type lower chamber 66 having an open top surface, and a lid configured to be tightly fitted or fitted to the top surface of the lower chamber 66. And an upper chamber (not shown). The lower chamber 66 has a substantially rectangular shape, a stage 70 for horizontally placing and supporting the substrate G is disposed at the center, and exhaust ports 72 are provided at the four corners of the bottom surface. Further, an exhaust pipe (not shown) connected to each exhaust port 72 communicates with a vacuum pump (not shown). Then, the processing space in both chambers can be depressurized to a predetermined degree of vacuum by the vacuum pump while the lower chamber 66 is covered with the upper chamber.

  In the vacuum drying unit (VD) 23b configured in this way, the substrate G coated with the resist solution in the resist coating apparatus (CT) 23a is subjected to vacuum drying that does not depend on heating. That is, in the drying under reduced pressure, the solvent in the resist is gradually released, and rapid drying as in the case of drying by heating does not occur. Therefore, this reduced pressure drying unit (VD) 23b has an adverse effect on the resist. The drying of the resist is promoted without giving.

  Further, the resist coating apparatus (CT) 23a will be described in detail with reference to FIGS. FIG. 3 is a perspective view showing the appearance of the resist coating apparatus (CT) 23a. As shown in the figure, the resist coating apparatus (CT) 23a includes a mounting table 50 that is a horizontally movable holding unit that holds the substrate G horizontally, and a resist supply nozzle (above the mounting table 50). A treatment liquid supply nozzle) 51 and nozzle moving means 86 for horizontally moving the resist supply nozzle 51 (hereinafter referred to as nozzle 51).

In this configuration, the nozzle 51 is horizontally moved by the nozzle moving means 86 so that the substrate G on the mounting table 50 and the nozzle 51 can be relatively horizontally moved.
Note that, at one end portion of the mounting table 50 in the moving direction of the nozzle 51, a rotatable priming roller (roller) 52 for uniformizing the resist solution adhering to the tip of the nozzle 51 during standby, and the priming roller 52 A standby section 55 having a container 53 for immersing the container in the thinner is provided.

  The nozzle 51 has a slit-like discharge port 51a extending in the width direction of the substrate G, and a resist solution storage chamber (not shown) communicating with the discharge port 51a, and is connected to the resist solution storage chamber. A resist solution supply source 95 is connected through a resist solution supply tube 57 to be used. The tip of the nozzle 51 is tapered when viewed from its short side, and a lower end surface 51b and an inclined surface 51c are formed in front and rear of the discharge port 51a along the nozzle short direction.

  Further, on both sides of the discharge port 51a in the longitudinal direction, film thickness control means 80 for reducing the discharge pressure of the resist solution R discharged from the discharge port 51a is provided. The film thickness control means 80 includes a suction pipe 82 connected to the communication passage 81 communicating with both sides in the longitudinal direction of the discharge port 51a, and a suction pump 83 such as a diaphragm pump provided in the suction pipe 82. The discharge pressure on both sides of the discharge port 51a is reduced by driving the suction pump 83. Note that an opening / closing valve 84 is interposed on the suction side of the suction pump 83 in the suction pipe 82, that is, on the nozzle 51 side.

  Next, an operation mode at the time of resist solution coating processing by the resist coating apparatus (CT) 23a having the above-described configuration will be described. First, the substrate G transported by the transport arm 64 is sucked and held on the mounting table 50 in a state where the nozzle 51 is brought close to the priming roller 52 of the standby unit 55. Next, the resist solution R is supplied from the resist solution supply source 95 to the resist solution storage chamber in the nozzle 51, and the nozzle 51 is moved from the standby unit 55 onto the substrate G by the nozzle moving means 86.

Next, the nozzle 51 moves on the substrate G while discharging the resist solution R from the discharge port 51a. In FIG. 3, the distance between the discharge port 51a and the substrate G is illustrated in an enlarged manner for explaining the configuration, but the distance between the discharge port 51a and the substrate G is about 40 to 150 μm. Installed, preferably set to 60 μm.
At this time, the suction pump 83 is driven to suck both sides of the discharge port 51a in the longitudinal direction, whereby the discharge pressure of the resist solution R on both sides of the discharge port 51a is reduced, and the central side of the discharge port 51a is reduced. The discharge pressure is discharged (supplied) onto the substrate G in a state where the discharge pressure is substantially equal to the discharge pressure on both sides, that is, in the state where the liquid thickness of the resist solution R is equal. Therefore, when the substrate G and the nozzle 51 move relatively horizontally, the resist solution R is supplied in a strip shape to the surface of the substrate G, and a resist film having a uniform film thickness is formed on the entire surface of the substrate G.

  After the resist film is formed on the surface of the substrate G in this way, the supply of the resist solution R is stopped, the nozzle 51 is moved to the standby position, and the discharge port 51a of the nozzle 51 is moved to the priming roller in the standby unit 55. Close to 52, prepare for the next coating process. Further, the substrate G on which the resist film is formed is transported from the mounting table 50 to the vacuum drying unit (VD) 23b by the transport arm 64.

  Next, the operation when the nozzle 51 is in the standby position in the resist coating apparatus (CT) 23a will be described with reference to FIGS. FIG. 4 is a block diagram showing a functional configuration of the resist coating apparatus (CT) 23a in a standby state, and FIG. 5 is a process diagram for explaining a uniform process (priming process) of the resist solution adhering to the tip of the nozzle 51. 6 is a process flow of FIG.

In FIG. 4, after the resist film is formed on the substrate G, the nozzle moving means 86 is controlled by the overall control unit 85, and the nozzle 51 that has finished the coating operation is moved from the use position b to the standby position a. Prepare for application. At this standby position a, a standby position detector 87 composed of an optical sensor is provided. When the nozzle 51 is at the standby position a, a standby position detection signal P1 to that effect is generated, and the overall control unit 85. Is input.
That is, while the standby position detection signal P1 is input, the overall control unit 85 determines that the nozzle 51 is at the standby position a, and appropriately controls the operation of the resist coating apparatus (CT) 23a in the standby state. Has been made.

When the nozzle 51 is in the standby position a, the nozzle tip is disposed close to the peripheral surface of the priming roller 52 (step S1 in FIG. 6). The distance between the discharge port 51a at the nozzle tip and the priming roller 52 is set to be the same as the distance between the discharge port 51a and the substrate G during the coating process. That is, the distance is set to about 40 to 150 μm, preferably 60 μm.
The discharge control means (for example, an air operation valve) 88 of the resist solution supply source 95 is opened by an instruction from the overall control unit 85, and a predetermined amount is discharged from the discharge port 51a of the nozzle 51 as shown in FIG. Resist solution R (for example, viscosity 4 cps) is discharged onto the peripheral surface of priming roller 52 (for example, 0.1 cc of resist solution R is discharged in 0.03 to 0.05 sec). At this time, the priming roller 52 is still in a rotation stopped state (step S2 in FIG. 6).

  Here, since the resist solution R discharged from the discharge port 51a stays on the peripheral surface of the priming roller 52, the tip of the nozzle 51 is temporarily immersed in the resist solution R, and below the inclined surface 51c. For example, the resist solution R is sufficiently adhered over the entire width of 10 to 20 μm.

  Next, after a predetermined time T has elapsed after the start of discharge of the resist solution from the nozzle 51 (step S3 in FIG. 6), the priming roller 52 is moved in one direction by the roller rotation control means 92 as shown in FIG. 5B. The rotation is started (for example, the roller diameter is 90 mm and the speed is 60 mm / sec), and the resist solution R adhering to the periphery of the discharge port 51a is uniformly prepared (step S4 in FIG. 6).

  Here, since the resist solution R discharged from the discharge port 51a of the nozzle 51 flows along the rotation direction of the priming roller 52, the resist solution R adhering to the tip of the nozzle 51 is also primed with respect to the longitudinal direction of the discharge port 51a. A large amount adheres to the rotation direction side of the roller 52. In particular, since the lower part of the inclined surface 51c at the tip of the nozzle 51 is wetted by the resist solution R throughout before the rotation of the priming roller 52, the resist solution R flowed by the rotation of the priming roller 52 is At the same time as being wound around the peripheral surface of the priming roller 52, it is easy to flow on the inclined surface 51c. As a result, a large amount of the resist solution R uniformly adheres to the rotational direction side of the priming roller 52 below the inclined surface 51c.

  If the discharge of the predetermined amount of resist solution has been completed as shown in FIG. 5C (step S5 in FIG. 6), the nozzle 51 is moved to the priming roller by the nozzle moving means 86 as shown in FIG. 52 (step S6 in FIG. 6). The flow shown in FIG. 6 does not limit the order of the end timing of the discharge of the resist solution R from the discharge port 51a and the timing of the start timing of the rotation of the priming roller 52. For example, either one may be first.

  According to the priming process described above, the resist solution R is uniformly attached as shown in FIG. 7 at least on the rotational direction side of the priming roller 52 below the inclined surface 51c. When performing the coating process on the substrate G using the nozzle 51 in this state, the nozzle side is disposed on the lower side of the inclined surface 51c in the rotation direction of the priming roller 52, that is, the side where the resist solution R is more uniformly attached. The nozzle 51 is moved on the opposite side (back side) of the traveling direction. At the start of the coating process, the resist solution R adhering to the lower portion of the inclined surface 51c pulls the resist solution R discharged from the discharge port 51a in the direction opposite to the nozzle moving direction, and is orthogonal to the nozzle moving direction ( Pull also in the nozzle longitudinal direction). However, since the resist solution R uniformly adheres to the lower portion of the inclined surface 51c, the film thickness at the coating processing start position on the substrate G becomes substantially uniform as shown in FIG. Is suppressed.

  As shown in FIG. 4, in this configuration, the lower part of the priming roller 52 is immersed in a thinner 89 that is a solvent in order to easily remove the resist solution R adhering to the peripheral surface of the priming roller 52. That is, the resist solution adhering to the peripheral surface of the priming roller 52 is dissolved in the thinner 89.

A wiper 91 is provided in the middle of the priming roller 52. The wiper 91 is made of a chemical-resistant resin, and the tip of the wiper 91 is in sliding contact with the peripheral surface of the priming roller 52 so that unnecessary previous wraparound resist solution and thinner 89 on the peripheral surface can be removed.
The tip shape of the wiper 91 may be any shape that can exhibit this resist solution removing function, and an arbitrary shape such as a rectangular cross section or a bifurcated cross section is adopted in addition to the wedge-shaped cross section used in this example. be able to.
Further, the wiper 91 is configured to be able to move up and down between a lower position in contact with the peripheral surface of the priming roller 52 by an air cylinder 90 and an upper position away from the peripheral surface of the priming roller 52. The position can be changed.

According to the above-described embodiment, in the priming process during standby, after the discharge of the resist solution R from the nozzle 51 is started, the priming roller 52 is controlled to start rotating after a predetermined time T. By doing so, the resist solution R stays at the tip of the nozzle 51, and the resist solution R is sufficiently adhered to the lower part of the inclined surface 51c at the tip of the nozzle 51 even after the priming process. be able to.
Then, when performing the coating process on the substrate G using the nozzle 51 after the priming process, the resist liquid R adhered to the lower portion of the inclined surface 51c at the start of coating is used as the resist liquid R discharged from the discharge port 51a. In addition to pulling in the direction opposite to the nozzle traveling direction, it is also pulled in the direction orthogonal to the nozzle traveling direction (the nozzle longitudinal direction). However, since the resist solution R uniformly adheres to the lower portion of the inclined surface 51c, the film thickness can be made uniform at the coating start position, and generation of wrinkles and the like can be suppressed. it can.

  Further, according to the present embodiment, the tip of the nozzle 51 is attached to the rotation direction side of the priming roller 52 with the longitudinal direction of the discharge port 51a as a boundary. Then, in the resist film forming process on the substrate G, control is performed so that the side on which the resist solution is less adhering to the longitudinal direction of the discharge port 51a is the traveling direction. That is, since the resist solution R uniformly adheres at least on the rotational direction side of the priming roller 52 at the lower part of the inclined surface 51c at the tip of the nozzle 51, the film thickness can be more uniformly made uniform at the application start position. And the occurrence of wrinkle streaks can be suppressed.

  In the above-described embodiment, the resist film is applied and formed on the LCD substrate. However, the present invention is not limited to this, and the present invention can be applied to any coating film forming apparatus that supplies the processing liquid onto the substrate to be processed. is there. In addition to the resist solution, the processing solution in the present invention may be a liquid such as an interlayer insulating material, a dielectric material, or a wiring material. Further, the substrate to be processed in the present invention is not limited to an LCD substrate, but may be a semiconductor wafer, a CD substrate, a glass substrate, a photomask, a printed substrate, or the like.

Next, the coating film forming apparatus according to the present invention will be further described based on examples.
[Comparative example]
In the process of homogenizing the resist solution adhering to the tip of the nozzle during standby (priming process), an experiment was performed in which the timing of starting the discharge of the resist solution from the nozzle and the timing of starting the rotation of the priming roller were simultaneous (referred to as conventional timing). . In this experiment, first, the resist solution adhering to the nozzle tip was homogenized at the conventional timing, and then the resist film was formed on the substrate surface. And while observing a film formation state, the film thickness in the application | coating start position was measured. The experimental conditions are shown in Table 1 below.

The results of film thickness measurement by this experiment are shown in the table of FIG. 9A and the graph of FIG. These results are shown in FIG. 9B. The substrate end (0 mm) along the nozzle traveling direction at each of the different positions (Back, 1 / 2Back, Center, 1 / 2Front, Front) shown in FIG. It is the result of having measured the film thickness in a period from 100 to 100 mm (application start position).
As shown in the graph of FIG. 10, when the measurement position is 30 mm or more, the film thickness is substantially uniform between the positions on the substrate, but when the measurement position is between 0 and 30 mm, the position on the substrate is stable. There was a variation in film thickness between the two. Further, as a result of observing the film formation state, wrinkled streaks and granular marks were observed at the application start position.

[Example]
Experiments were performed using the resist coating apparatus having the configuration shown in the above embodiment. In this experiment, first, a resist solution homogenization process at the nozzle tip was performed, followed by a resist film formation process on the substrate surface. And while observing a film formation state, the film thickness in the application | coating start position was measured. The experimental conditions are shown in Table 2 below.

The film thickness measurement results by this experiment are shown in the table of FIG. 11A and the graph of FIG. In addition, these results are shown in FIG. 11 (b) at different positions (Back, 1 / 2Back, Center, 1 / 2Front, Front) on the substrate along the nozzle traveling direction (0 mm). It is the result of having measured the film thickness in a period from 100 to 100 mm (application start position).
As shown in the graph of FIG. 12, in this experiment, it was confirmed that the film thickness between each position on the substrate was stabilized substantially uniformly at all measurement positions. Further, as a result of observing the film formation state, no wrinkle-like streaks or granular marks were observed at the application start position.

  From the results of the above examples, in the coating film forming apparatus and the coating film forming method according to the present invention, when the processing liquid is applied to the substrate and the film is formed, the liquid deposition of the processing liquid at the nozzle tip is insufficient. It was confirmed that the treatment liquid can be uniformly applied to the substrate.

  The present invention can be applied to a coating film forming apparatus for forming a processing liquid on an LCD substrate, a semiconductor wafer or the like, and can be suitably used in the semiconductor manufacturing industry, the electronic device manufacturing industry, and the like.

FIG. 1 is a plan view showing the overall configuration of a resist coating and developing apparatus provided with a coating film forming apparatus (resist coating apparatus) according to the present invention. FIG. 2 is a plan view of a resist coating unit provided in the resist coating and developing apparatus of FIG. FIG. 3 is a perspective view showing an appearance of a resist coating apparatus constituting the resist coating processing unit of FIG. FIG. 4 is a block diagram showing a functional configuration of the resist coating apparatus of FIG. 3 in a standby state. FIG. 5 is a process diagram for explaining a resist solution equalization process in the vicinity of a discharge port of a resist supply nozzle provided in the resist coating apparatus. FIG. 6 is a process flow of FIG. FIG. 7 is an enlarged view of the nozzle tip for explaining the state of the nozzle tip that has been homogenized by the process of FIG. FIG. 8 is a plan view for explaining the state of the substrate subjected to the coating process using the resist supply nozzle that has been subjected to the uniform process in the process of FIG. FIG. 9 is a table showing the result of measuring the film thickness at the start of coating by applying a resist solution using a conventional resist coating apparatus as a comparative example. FIG. 10 is a graph of FIG. FIG. 11 is a table showing the result of measuring the film thickness at the start of coating by applying a resist solution using the resist coating apparatus having the configuration shown in FIGS. 3 and 4. FIG. 12 is a graph of FIG. FIG. 13 is a diagram for explaining a resist solution equalizing process in the vicinity of a discharge port of a conventional resist supply nozzle. FIG. 14 is an enlarged cross-sectional view of the tip of the nozzle shown in FIG. FIG. 15 is an enlarged view of the nozzle tip for explaining the state of the nozzle tip by the conventional homogenization process. FIG. 16 is an enlarged cross-sectional view of the nozzle tip for explaining a state in which the coating process is performed on the substrate. FIG. 17 is a plan view showing wrinkle lines at the start of application of a resist solution that has occurred in a conventional resist coating apparatus.

Explanation of symbols

23 resist coating processing unit 23a resist coating apparatus (coating film forming apparatus)
51 Resist supply nozzle (Processing liquid supply nozzle)
51a Discharge port 51b Lower end surface 51c Inclined surface 52 Priming roller (roller)
86 Nozzle moving means 88 Discharge control means 92 Roller rotation control means 100 Resist coating and developing processing apparatus G LCD substrate (substrate to be processed)
R resist solution (treatment solution)

Claims (4)

A processing liquid supply nozzle having a slit-like discharge port extending in the width direction of the substrate to be processed, discharge control means for controlling discharge of the processing liquid from the processing liquid supply nozzle, and a standby position of the processing liquid supply nozzle A roller formed to be rotatable, roller rotation control means for controlling the rotation of the roller, and nozzle moving means for moving the processing liquid supply nozzle relative to the substrate to be processed,
A coating film forming apparatus that discharges a processing liquid from the discharge port onto the peripheral surface of the roller and uniformizes the processing liquid adhering to the discharge port by rotating the roller,
At the standby position, after the discharge control means discharges a predetermined amount of processing liquid from the processing liquid supply nozzle, the roller rotation control means attaches to the discharge port of the processing liquid supply nozzle after a predetermined time. Rotate the roller in one direction so that the treatment liquid adheres more on one side with respect to the longitudinal direction of the discharge port,
In the use position of the processing liquid supply nozzle, the nozzle moving means moves the processing liquid supply nozzle from the longitudinal direction of the discharge port as a traveling direction on the side where the processing liquid is less attached. Forming equipment. A processing liquid supply nozzle having a slit-like discharge port extending in the width direction of the substrate to be processed, discharge control means for controlling discharge of the processing liquid from the processing liquid supply nozzle, and a standby position of the processing liquid supply nozzle A roller formed rotatably, and a roller rotation control means for controlling the rotation of the roller,
A coating film forming apparatus that discharges a processing liquid from the discharge port onto the peripheral surface of the roller and uniformizes the processing liquid adhering to the discharge port by rotating the roller,
At the standby position, after the discharge control means discharges a predetermined amount of processing liquid from the processing liquid supply nozzle and finishes discharging the processing liquid, the roller rotates after a predetermined time from the discharge of the predetermined amount of processing liquid. A coating film forming apparatus, wherein the control means starts rotating the roller . A processing liquid that discharges a predetermined amount of processing liquid from a processing liquid supply nozzle having a slit-like discharge port extending in the width direction of the substrate to be processed to a circumferential surface of a roller formed to be rotatable, and adheres to the discharge port Is a coating film forming method for performing a homogenization process by rotating the roller,
Starting the rotation of the roller after a predetermined time after starting the discharge of the processing liquid from the processing liquid supply nozzle at the standby position of the processing liquid supply nozzle;
Moving the processing liquid supply nozzle from the standby position onto the substrate to be processed, and forming the substrate to be processed with the processing liquid discharged from the processing liquid supply nozzle,
In the step of starting the rotation of the roller, by rotating the roller in one direction, a large amount of processing liquid is adhered to one side with respect to the longitudinal direction of the discharge port,
In the step of forming a film on the substrate to be processed, a method of forming a coating film, wherein the side where the processing liquid is less adhered with respect to the longitudinal direction of the discharge port is the traveling direction of the processing liquid supply nozzle. A processing liquid that discharges a predetermined amount of processing liquid from a processing liquid supply nozzle having a slit-like discharge port extending in the width direction of the substrate to be processed to a circumferential surface of a roller formed to be rotatable, and adheres to the discharge port Is a coating film forming method for performing a homogenization process by rotating the roller,
At a standby position of the processing liquid supply nozzle, after a predetermined time has elapsed after starting the discharge of the processing liquid from the processing liquid supply nozzle, and after the discharge of the processing liquid has ended, starting the rotation of the roller;
Moving the processing liquid supply nozzle onto the substrate to be processed from a standby position, and forming the substrate to be processed with the processing liquid discharged from the processing liquid supply nozzle. .

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