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JP4132333B2 - IC tag structure - Google Patents
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JP4132333B2 - IC tag structure - Google Patents

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JP4132333B2
JP4132333B2 JP37327298A JP37327298A JP4132333B2 JP 4132333 B2 JP4132333 B2 JP 4132333B2 JP 37327298 A JP37327298 A JP 37327298A JP 37327298 A JP37327298 A JP 37327298A JP 4132333 B2 JP4132333 B2 JP 4132333B2
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Japan
Prior art keywords
film
copper wire
substrate
tag
coiled copper
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JP2000194810A (en
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康夫 清水
正邦 白鳥
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シチズンミヨタ株式会社
サクサ株式会社
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G06K19/07381—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
    • G06K19/0739—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering the incapacitated circuit being part of an antenna

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、タグ情報を記憶したＩＣチップとアンテナを主な内部部品として持ち、物品等に付与され、非接触で外部装置との間で情報等の交信を行うＩＣタグ構造に関するものである。
【０００２】
【従来の技術】
物品等に付与されているタグ情報を自動的に読み取って識別するためのシステムとして、バーコード方式によるものがあるが、より大量の情報を扱え、遠隔読み出しが可能となるデータキャリアシステムと呼ばれるＩＣタグシステムの開発が進んでいる。
【０００３】
このＩＣタグシステムは物品等に取り付けられるＩＣタグと呼ばれる応答器と、質問器で構成され、これら応答器と質問器との間で、磁気、誘導電磁界、マイクロ波（電波）等の伝送媒体を介して非接触で交信を行うものである。
【０００４】
図１は従来のＩＣタグ構造を示す分解斜示図である。１はタグ情報を記憶したＩＣチップであり、２はアンテナとなるコイル状に巻かれた銅線である。コイル状銅線２の巻きはじめの接続端部２ａと巻き終わりの接続端部２ｂはＩＣチップに直接接続され、ＩＣタグを構成する。また、図示していないが、コイル状銅線２の接続端部２ａ、２ｂのＩＣチップ１への接続はＩＣチップを基板に搭載し、該基板のパターンを介して接続する構造もある。
【０００５】
前記コイル状銅線２の接続端部２ａ、２ｂを前記ＩＣチップ１に接続した後、フィルム３、フィルム４を用い、上下から挟んで接着してＩＣダグを完成する。前記フィルムはポリエチレン等の樹脂をシート状に形成したものを用い、熱溶着による方法で接着したり、粘着剤を有するフィルムにて接着されている。また、ＩＣタグを直接物品等に貼り付けて用いる場合、物品に貼り付ける面をあらかじめ粘着剤を有するフィルムで構成しておき、粘着剤を介して物品に貼り付けてタグ情報の自動認識システムに用いている。
【０００６】
図２は従来のＩＣタグを物品に貼り付けた状態を示す断面図である。フィルム３、フィルム４で挟まれ接着されたＩＣチップ１とコイル状銅線２はフィルム３の片面（ＩＣチップとコイル状銅線を接着する面とは反対側の面）の粘着剤を介して物品５に貼付されている。
【０００７】
【発明が解決しようとする課題】
ところで、物品に貼り付けられたＩＣタグは貼り付けた物品そのもののタグ情報を記憶しているものなので、一度貼り付けたＩＣタグが、他の物品に貼り替えられるようなことがあると、誤ったタグ情報が認識されてしまい物品の取扱に悪影響を与えてしまう。そこで、物品に一度貼ったＩＣタグは、再度利用できないようなＩＣタグ構造にする必要がある。
図３は、図２のＩＣタグを剥がした状態を示す断面図である。図３に示すように、フィルム３とフィルム４はそれぞれ分離して剥がれるが、ＩＣチップ１とコイル状銅線２はフィルム４に接着されたまま剥がれてしまう場合がある。この時ＩＣチップ１とコイル状銅線２がうまく分離して剥がれれば、ＩＣタグは壊れてしまうので使えなくなる。しかし、図３のような状態で剥がれると、ＩＣタグの機能上、ＩＣチップ１とコイル状銅線２は接続されたままなので、これを他の物品に付け替えて使用することができてしまう。
そこで、本発明は一度物品に貼付したＩＣタグを剥がそうとした場合に、剥がすことによってＩＣタグが破壊される構造を提供しようとするものである。
【０００８】
【課題を解決するための手段】
アンテナとなるコイル状銅線と、ＩＣチップを有し、該ＩＣチップが基板に搭載され、前記基板のパターン部に接続され、さらに前記基板のパターン部と前記コイル状銅線の接続端部とが接続されて成るＩＣタグを二枚のフィルムで挟んで接着するＩＣタグ構造において、前記基板を前記コイル状銅線の内径よりも大きくなるように形成し、前記基板のパターン部にＩＣチップを接続してＩＣモジュール部を構成し、前記基板のパターン部外周に前記コイル状銅線を前記基板とは非接着の状態で搭載し、前記基板のパターン部と前記コイル状銅線の接続端部を接続してＩＣタグを構成し、一方のフィルムは、前記コイル状銅線の前記基板に搭載された面と対向する側面の全面に接着され、他方のフィルムは前記基板の前記コイル状銅線の搭載されていない面側に接着され、前記コイル状銅線の前記基板へ搭載された側面の全面又は一部分とは接着されていないＩＣタグ構造とする。
【００１０】
前記ＩＣモジュール部と前記コイル状銅線が、片面のみ粘着剤を有するフィルムと、前記フィルムよりもその外形状が小さく、両面に粘着剤を有するフィルムの二種類のフィルムで挟んで接着されたＩＣタグ構造とする。
【００１１】
前記ＩＣモジュール部と前記コイル状銅線が、片面のみ粘着剤を有するフィルムと、前記フィルムよりもその外形状が小さく形成されたフィルム状粘着剤とで挟んで接着されたＩＣタグ構造とする。
【００１２】
【発明の実施の形態】
図４は本発明の一実施形態を示すＩＣタグ構造の分解斜示図である。６はＩＣチップ７を搭載するための基板である。８はコイル状に巻かれた銅線で、ＩＣチップ７内のタグ情報を伝送するためのアンテナとなるものである。前記基板６の外形状は前記コイル状銅線８の外形状に合わせて円盤状に形成されている。前記基板６は前記コイル状銅線８の内径よりも大きく形成すればよく、円盤状に限らず方形状でもよい。前記基板６にはその中央部付近にパターン部９、１０が設けられ、基板６の中央部にＩＣチップ７を搭載し、該ＩＣチップ７と前記パターン部９、１０がそれぞれワイヤーボンディング等により接続され、ＩＣモジュールを構成している。
【００１３】
前記ＩＣモジュールのパターン部９、１０の外周にコイル状銅線８を搭載し、前記コイル状銅線８の接続端部８ａをパターン部９に、接続端部８ｂをパターン部１０へそれぞれハンダ付け等により接続する。前記ＩＣモジュールとコイル状銅線８でＩＣタグを構成する。尚、前記コイル状銅線８は前記基板６上への固定（接着剤等による）はしないものとする。
【００１４】
前記ＩＣタグは、さらに粘着剤を有するフィルム１１、１２で挟み込むようにして接着して構成する。前記フィルム１１はその両面に粘着剤を有するものを用い、フィルム１２は片面（ＩＣタグを挟み込む側）のみに粘着剤を有するものを用いる。前記フィルム１１はその外形状を前記フィルム１２の外形状より小さく形成する。また、前記フィルム１１は粘着剤そのものをフィルム状に形成したものを用いてもよい。
前記フィルムを張り合わせて構成した後、フィルム１１の外側の面（ＩＣタグを挟んでいない面）の粘着剤を介して物品等に貼り付けて自動認識システムに用いる。尚、フィルム１１の物品等に貼り付ける側の粘着剤は他の粘着剤（フィルム１１、フィルム１２のＩＣタグを挟む面の粘着剤）よりも粘着力の強いもので構成すると良い。
【００１５】
図５は、本発明の一実施形態のＩＣタグを物品に貼り付けた状態を示す断面図で、図６は、図５のＩＣタグを剥がした状態を示す断面図である。
１３は物品であり、前記したＩＣタグがフィルム１１の粘着剤を介して物品１３に貼り付けられている。ＩＣタグのコイル状銅線８はフィルム１１側にのみ接着され、ＩＣチップ７の搭載された基板６はフィルム１２に接着された状態である。一度貼り付けられたＩＣタグを剥がそうとした場合、外形状の大きいフィルム１２の端部１２ａが摘まれて剥がされることとなる。図６に示す断面図のように、粘着力の強いフィルム１１は物品側に貼り付いたまま残り、フィルム１１よりも粘着力の弱いフィルム１２が剥がれだす。コイル状銅線８はフィルム１１の粘着剤によりフィルム１１側に残り、基板６はフィルム１２の粘着剤によりフィルム１２に貼り付いたまま剥がされることになる。コイル状銅線８と基板６は接着固定されていないので容易に分離可能である。また、基板６の径がコイル状銅線８の外径よりも小さく、コイル状銅線８の一部がフィルム１２に接着された状態であっても、基板６とコイル状銅線８の接触面積が、フィルム１２とコイル状銅線８の接着面積よりも大きければ容易に分離可能である。このような状態でフィルムを全て剥がそうとすると、図示してないが、基板６のパターン部９、１０に接続されたコイル状銅線８の接続端部８ａ、８ｂが切断され、ＩＣタグが破壊される。このような構成にすることで、一度物品等に貼付したＩＣタグを再度利用することができないようにしている。
【００１６】
【発明の効果】
コイル状銅線と基板（ＩＣモジュール部）をフィルムで挟んで構成する場合、一方のフィルムはコイル状銅線に接着させ、他方のフィルムはＩＣモジュールに接着するように構成したので、ＩＣタグを剥がそうとしたときには、コイル状銅線と基板（ＩＣモジュール）が分離し易くなり、ＩＣタグを確実に破壊できる。よって不正目的等による貼り替え行為の防止になる。
【００１７】
基板をコイル状銅線の内径よりも大きく形成することで、一方のフィルムはコイル状銅線に接着され、他方のフィルムは基板に接着するので、ＩＣタグを剥がそうとしたとき、コイル状銅線と基板が分離しやすくなる。
【００１８】
ＩＣモジュール部とコイル状銅線が、片面のみ粘着剤を有するフィルムと、前記フィルムよりもその外形状が小さく、両面に粘着剤を有するフィルムの二種類のフィルムで挟まれて接着されたＩＣタグを、前記両面に粘着剤を有するフィルム側を物品に貼り付けるので、これを剥がす場合、外形状の大きい外側のフィルムのみが剥がされるようになった。よってコイル状銅線と基板が分離し易くなる。
【図面の簡単な説明】
【図１】従来のＩＣタグ構造を示す分解斜示図。
【図２】従来のＩＣタグを物品に貼り付けた状態を示す断面図。
【図３】図２のＩＣタグを剥がした状態を示す断面図。
【図４】本発明の一実施形態を示すＩＣタグ構造の分解斜示図。
【図５】本発明の一実施形態のＩＣタグを物品に貼り付けた状態を示す断面図。
【図６】図５のＩＣタグを剥がした状態を示す断面図。
【符号の説明】
１ ＩＣチップ
２ コイル状銅線
３ フィルム
４ フィルム
５ 物品
６ 基板
７ ＩＣチップ
８ コイル状銅線
８ａ 接続端部
８ｂ 接続端部
９ パターン部
１０ パターン部
１１ フィルム
１２ フィルム
１２ａ 端部
１３ 物品[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC tag structure that has an IC chip and an antenna that store tag information as main internal parts, is attached to an article, etc., and communicates information and the like with an external device in a non-contact manner.
[0002]
[Prior art]
As a system for automatically reading and identifying tag information attached to articles, etc., there is a system using a bar code system, but an IC called a data carrier system that can handle a larger amount of information and can be read out remotely. Tag system development is progressing.
[0003]
This IC tag system is composed of a transponder called an IC tag attached to an article or the like and an interrogator. Between these transponders and the interrogator, a transmission medium such as magnetism, induction electromagnetic field, microwave (radio wave), etc. It communicates without contact via
[0004]
FIG. 1 is an exploded perspective view showing a conventional IC tag structure. Reference numeral 1 denotes an IC chip that stores tag information, and reference numeral 2 denotes a copper wire wound in a coil shape serving as an antenna. The connection end 2a at the beginning of winding and the connection end 2b at the end of winding of the coiled copper wire 2 are directly connected to the IC chip to constitute an IC tag. Although not shown, the connection ends 2a and 2b of the coiled copper wire 2 may be connected to the IC chip 1 by mounting the IC chip on a substrate and connecting it via a pattern on the substrate.
[0005]
After connecting the connection end portions 2a and 2b of the coiled copper wire 2 to the IC chip 1, the film 3 and the film 4 are used and bonded by being sandwiched from above and below to complete the IC doug. The film is made of a resin such as polyethylene formed into a sheet shape, and is adhered by a method by heat welding or by a film having an adhesive. In addition, when the IC tag is directly attached to an article or the like, the surface to be attached to the article is configured with a film having an adhesive in advance, and is attached to the article via the adhesive to be used as an automatic tag information recognition system. Used.
[0006]
FIG. 2 is a cross-sectional view showing a state where a conventional IC tag is attached to an article. The IC chip 1 and the coiled copper wire 2 sandwiched and bonded between the film 3 and the film 4 are bonded via an adhesive on one side of the film 3 (the surface opposite to the surface where the IC chip and the coiled copper wire are bonded). It is affixed to the article 5.
[0007]
[Problems to be solved by the invention]
By the way, since the IC tag attached to the article stores the tag information of the attached article itself, the IC tag once attached may be erroneously replaced with another article. The tag information is recognized and adversely affects the handling of the article. Therefore, the IC tag once attached to the article needs to have an IC tag structure that cannot be used again.
FIG. 3 is a cross-sectional view showing a state where the IC tag of FIG. 2 is peeled off. As shown in FIG. 3, the film 3 and the film 4 are separated and peeled off, but the IC chip 1 and the coiled copper wire 2 may be peeled off while being adhered to the film 4. At this time, if the IC chip 1 and the coiled copper wire 2 are well separated and peeled off, the IC tag is broken and cannot be used. However, if it is peeled off in the state as shown in FIG. 3, the IC chip 1 and the coiled copper wire 2 remain connected to each other because of the function of the IC tag.
Therefore, the present invention intends to provide a structure in which when an IC tag once attached to an article is to be peeled off, the IC tag is destroyed by peeling off.
[0008]
[Means for Solving the Problems]
A coil-shaped copper wire serving as an antenna, and an IC chip, the IC chip being mounted on the substrate and connected to the pattern portion of the substrate; and a connection portion of the pattern portion of the substrate and the coiled copper wire; In an IC tag structure in which an IC tag formed by bonding is sandwiched between two films and bonded, the substrate is formed to be larger than the inner diameter of the coiled copper wire, and an IC chip is mounted on the pattern portion of the substrate Connected to form an IC module part, and the coiled copper wire is mounted on the outer periphery of the pattern part of the substrate in a non-adhering state with the substrate, and the connection part between the pattern part of the substrate and the coiled copper wire Are connected to the entire surface of the coiled copper wire opposite to the surface mounted on the substrate, and the other film is bonded to the coiled copper wire of the substrate. Loading Is bonded have not to the surface side, and IC tag structure that is not bonded to the entire surface or a portion of the mounted side to the substrate of the coiled copper wire.
[0010]
IC in which the IC module portion and the coiled copper wire are sandwiched and bonded between two types of films: a film having an adhesive only on one side and a film having an outer shape smaller than the film and having an adhesive on both sides. Use tag structure.
[0011]
The IC module part and the coiled copper wire have an IC tag structure in which a film having an adhesive only on one surface and a film adhesive having an outer shape smaller than the film are bonded.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 4 is an exploded perspective view of an IC tag structure showing an embodiment of the present invention. Reference numeral 6 denotes a substrate on which the IC chip 7 is mounted. A copper wire 8 is coiled and serves as an antenna for transmitting tag information in the IC chip 7. The outer shape of the substrate 6 is formed in a disc shape in accordance with the outer shape of the coiled copper wire 8. The substrate 6 may be formed larger than the inner diameter of the coiled copper wire 8, and is not limited to a disk shape but may be a square shape. The substrate 6 is provided with pattern portions 9 and 10 in the vicinity of the central portion thereof, and an IC chip 7 is mounted on the central portion of the substrate 6, and the IC chip 7 and the pattern portions 9 and 10 are connected to each other by wire bonding or the like. And constitutes an IC module.
[0013]
The coiled copper wire 8 is mounted on the outer periphery of the pattern portions 9 and 10 of the IC module, and the connection end 8a of the coiled copper wire 8 is soldered to the pattern portion 9 and the connection end 8b is soldered to the pattern portion 10 respectively. Connect by etc. The IC module and the coiled copper wire 8 constitute an IC tag. The coiled copper wire 8 is not fixed on the substrate 6 (by an adhesive or the like).
[0014]
The IC tag is constructed by adhering so as to be further sandwiched between films 11 and 12 having an adhesive. The film 11 has a pressure-sensitive adhesive on both sides, and the film 12 has a pressure-sensitive adhesive only on one side (the side where the IC tag is sandwiched). The film 11 has an outer shape smaller than the outer shape of the film 12. The film 11 may be a film in which the pressure sensitive adhesive itself is formed.
After the film is laminated, the film 11 is attached to an article or the like via an adhesive on the outer surface of the film 11 (the surface not sandwiching the IC tag) and used for an automatic recognition system. The adhesive on the side of the film 11 to be attached to the article or the like is preferably composed of a material having a stronger adhesive force than other adhesives (adhesives on the surfaces of the film 11 and film 12 that sandwich the IC tag).
[0015]
FIG. 5 is a cross-sectional view showing a state where an IC tag according to an embodiment of the present invention is attached to an article, and FIG. 6 is a cross-sectional view showing a state where the IC tag of FIG. 5 is peeled off.
Reference numeral 13 denotes an article, and the above-described IC tag is attached to the article 13 via the adhesive of the film 11. The coiled copper wire 8 of the IC tag is bonded only to the film 11 side, and the substrate 6 on which the IC chip 7 is mounted is bonded to the film 12. When the IC tag once pasted is to be peeled off, the end 12a of the film 12 having a large outer shape is picked and peeled off. As shown in the cross-sectional view of FIG. 6, the film 11 having a high adhesive strength remains attached to the article side, and the film 12 having a lower adhesive strength than the film 11 is peeled off. The coiled copper wire 8 is left on the film 11 side by the adhesive of the film 11, and the substrate 6 is peeled off while being attached to the film 12 by the adhesive of the film 12. Since the coiled copper wire 8 and the substrate 6 are not bonded and fixed, they can be easily separated. Further, even when the diameter of the substrate 6 is smaller than the outer diameter of the coiled copper wire 8 and a part of the coiled copper wire 8 is adhered to the film 12, the contact between the substrate 6 and the coiled copper wire 8 is achieved. If the area is larger than the adhesion area between the film 12 and the coiled copper wire 8, it can be easily separated. If an attempt is made to peel all the film in such a state, although not shown, the connection ends 8a and 8b of the coiled copper wire 8 connected to the pattern portions 9 and 10 of the substrate 6 are cut, and the IC tag is Destroyed. With such a configuration, an IC tag once attached to an article or the like cannot be reused.
[0016]
【The invention's effect】
When the coiled copper wire and the substrate (IC module part) are sandwiched between films, one film is bonded to the coiled copper wire and the other film is bonded to the IC module. When peeling is attempted, the coiled copper wire and the substrate (IC module) are easily separated, and the IC tag can be reliably destroyed. Therefore, it is possible to prevent a re-seating action for an illegal purpose or the like.
[0017]
By forming the substrate larger than the inner diameter of the coiled copper wire, one film is adhered to the coiled copper wire and the other film is adhered to the substrate. The line and the substrate are easily separated.
[0018]
An IC tag in which an IC module part and a coiled copper wire are sandwiched and bonded between two types of films, a film having an adhesive only on one side and a film having an outer shape smaller than the film and having an adhesive on both sides. Since the film side having an adhesive on both sides is attached to an article, when the film side is peeled off, only the outer film having a large outer shape is peeled off. Therefore, it becomes easy to separate the coiled copper wire from the substrate.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a conventional IC tag structure.
FIG. 2 is a cross-sectional view showing a state in which a conventional IC tag is attached to an article.
3 is a cross-sectional view showing a state where the IC tag of FIG. 2 is peeled off.
FIG. 4 is an exploded perspective view of an IC tag structure showing an embodiment of the present invention.
FIG. 5 is a cross-sectional view showing a state where an IC tag according to an embodiment of the present invention is attached to an article.
6 is a cross-sectional view showing a state where the IC tag of FIG. 5 is peeled off.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 IC chip 2 Coiled copper wire 3 Film 4 Film 5 Article 6 Board | substrate 7 IC chip 8 Coiled copper wire 8a Connection end part 8b Connection end part 9 Pattern part 10 Pattern part 11 Film 12 Film 12a End part 13 Goods

Claims (3)

アンテナとなるコイル状銅線と、ＩＣチップを有し、該ＩＣチップが基板に搭載され、前記基板のパターン部に接続され、さらに前記基板のパターン部と前記コイル状銅線の接続端部とが接続されて成るＩＣタグを二枚のフィルムで挟んで接着するＩＣタグ構造において、A coiled copper wire serving as an antenna; and an IC chip, the IC chip being mounted on the substrate and connected to a pattern portion of the substrate; and a pattern portion of the substrate and a connection end of the coiled copper wire; In an IC tag structure in which an IC tag formed by bonding is bonded between two films,
前記基板を前記コイル状銅線の内径よりも大きくなるように形成し、前記基板のパターン部にＩＣチップを接続してＩＣモジュール部を構成し、前記基板のパターン部外周に前記コイル状銅線を前記基板とは非接着の状態で搭載し、前記基板のパターン部と前記コイル状銅線の接続端部を接続してＩＣタグを構成し、The substrate is formed to be larger than the inner diameter of the coiled copper wire, an IC chip is connected to the pattern portion of the substrate to constitute an IC module portion, and the coiled copper wire is formed on the outer periphery of the pattern portion of the substrate. Is mounted in an unbonded state with the substrate, and the IC tag is configured by connecting the pattern portion of the substrate and the connection end of the coiled copper wire,
一方のフィルムは、前記コイル状銅線の前記基板に搭載された面と対向する側面の全面に接着され、他方のフィルムは前記基板の前記コイル状銅線の搭載されていない面側に接着され、前記コイル状銅線の前記基板へ搭載された側面の全面又は一部分とは接着されていない構造であることを特徴とするＩＣタグ構造。One film is bonded to the entire surface of the coiled copper wire facing the surface mounted on the substrate, and the other film is bonded to the surface of the substrate not mounted with the coiled copper wire. An IC tag structure having a structure in which the coil-shaped copper wire is not bonded to the whole or a part of a side surface mounted on the substrate. 前記ＩＣモジュール部と前記コイル状銅線が、片面のみ粘着剤を有するフィルムと、前記フィルムよりもその外形状が小さく、両面に粘着剤を有するフィルムの二種類のフィルムで挟んで接着されたことを特徴とする請求項１記載のＩＣタグ構造。The IC module part and the coiled copper wire were bonded by being sandwiched between two types of films, a film having an adhesive only on one side and a film having an outer shape smaller than the film and having an adhesive on both sides. The IC tag structure according to claim 1 . 前記ＩＣモジュール部と前記コイル状銅線が、片面のみ粘着剤を有するフィルムと、前記フィルムよりもその外形状が小さく形成されたフィルム状粘着剤とで挟んで接着されたことを特徴とする請求項１記載のＩＣタグ構造。The IC module portion and the coiled copper wire are bonded by being sandwiched between a film having an adhesive only on one side and a film adhesive having an outer shape smaller than that of the film. Item 1. The IC tag structure according to Item 1 .
JP37327298A 1998-12-28 1998-12-28 IC tag structure Expired - Fee Related JP4132333B2 (en)

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Publication number Priority date Publication date Assignee Title
US7102522B2 (en) 2002-12-24 2006-09-05 3M Innovative Properties Company Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same
US6816125B2 (en) 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder
CN112992523B (en) * 2021-04-23 2023-03-24 昆山联滔电子有限公司 Coil assembling process

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