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JP4132990B2 - Electrical junction structure - Google Patents
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JP4132990B2 - Electrical junction structure - Google Patents

Electrical junction structure Download PDF

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Publication number
JP4132990B2
JP4132990B2 JP2002160977A JP2002160977A JP4132990B2 JP 4132990 B2 JP4132990 B2 JP 4132990B2 JP 2002160977 A JP2002160977 A JP 2002160977A JP 2002160977 A JP2002160977 A JP 2002160977A JP 4132990 B2 JP4132990 B2 JP 4132990B2
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Japan
Prior art keywords
electrical
main surface
electrical joint
joint
raised
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JP2002160977A
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Japanese (ja)
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JP2004006547A (en
Inventor
祐司 東
直樹 杉浦
裕基 藤村
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Koito Manufacturing Co Ltd
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Koito Manufacturing Co Ltd
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Description

【0001】
【発明の属する技術分野】
本発明は新規な電気的接合構造に関する。詳しくは、平板状の主面部を有する電気的接合部の接合に関し、主面部の厚さに制限されずに接合を可能にする技術に関する。
【0002】
【従来の技術】
図6に従来の電気的接合構造の一例を示す。
【0003】
図示した電気的接合構造は電気的接合部である端子a、aを有する電子部品bをもう一方の電気的接合部であるバスバーの接合端c、cに接合する構造である。端子a、a及び接合端c、c共に平板状をしており、接合端c、cの上に端子a、aをそれぞれ重ね合わせ、その状態で端子a、a上にレーザdを照射し、そして、レーザdにより端子a、aを熔解し、レーザdによる熔解が接合端c、cにまで達することによって、端子a、aと接合端c、cとが溶接により接合される。
【0004】
【発明が解決しようとする課題】
ところが、上記した従来のレーザdの照射により接合させる構造にあっては、端子の厚みが0.2mmを越えると、端子a、aの材質によっては(例えば、真鍮等)レーザdによって熔解された部分で小さな凹部eに端子a、aの熔解物が溜まった状態になり、熔解が接合端cに達する前に上記熔解物が気化してしまって爆飛するなどして(図7参照)溶接が困難であるという問題がある。
【0005】
また、電子部品bの端子a、aを上部からレーザ照射して溶接する場合、端子a、aの厚さに比例して照射エネルギーを多くする必要がある。そして、照射エネルギーが大きくなると、端子a、aに発生する熱が電子部品bに影響を与えて、電子部品bが破壊される惧れがある。
【0006】
そこで、本発明は、互いに接合される電気的接合部の厚みの如何に関わらず、確実な接合を可能にすることを課題とする。
【0007】
【課題を解決するための手段】
本発明電気的接合構造は、上記した課題を解決するために、平板状をした主面部を有する電気的接合部を互いに接合する電気的接合構造であって、一方の電気的接合部の主面部の端縁から2条のスリットを形成すると共に、該2条のスリットの間の部分を切り起こして板状の隆起部を設け、他方の電気的接合部の主面部に上記隆起部に当接する当接部を設け、上記2つの電気的接合部の主面部同士を重ね合わせて上記隆起部と上記当接部を係合させると共に、該隆起部を該当接部から突出させ、上記突出している部分を熔解してその熔解物を上記他方の電気的接合部に堆積させることにより該隆起部と該当接部とを結合させて上記2つの電気的接合部同士を接合するようにしたものである。
【0008】
従って、本発明電気的接合部の構造にあっては、隆起部の当接部から突出している部分を熔解してその熔解物を他方の電気的接合部に堆積させることにより隆起部と当接部とを結合させるものであるため、熔解物が狭い空間に溜まることがない。また、他方の電気的接続部が電子部品の端子である場合、該端子に生じる熱が電子部品に影響を与えて電子部品が破壊されることを防止することができる。
【0009】
【発明の実施の形態】
以下に、本発明電気的接合構造の詳細について本発明の実施の形態を示す添付図面を参照して説明する。
【0010】
本発明電気的接合構造は、平板状をした主面部を有する電気的接合部を互いに接合する電気的接合構造であって、一方の電気的接合部の主面部の端縁から2条のスリットを形成すると共に、該2条のスリットの間の部分を切り起こして板状の隆起部を設け、他方の電気的接合部の主面部に上記隆起部に当接する当接部を設け、上記2つの電気的接合部の主面部同士を重ね合わせて上記隆起部と上記当接部を係合させると共に、該隆起部を該当接部から突出させ、上記突出している部分を熔解してその熔解物を上記他方の電気的接合部に堆積させることにより該隆起部と該当接部とを結合させて上記2つの電気的接合部同士を接合するようにしたものである。
【0011】
本発明電気的接合構造は、従来技術のところで述べたごとく、電子部品、例えば、LED(light-emitting diode)等の電子部品を基板上の端子に接続する構造の他、コードの端部に取着した端子金具を基板上の端子等に接続する構造等、各種の電気的接続構造に適用することが出来る。
【0012】
本発明において電気的接合部とは、各種電子部品の端子、コードの端部等に取着される端子金具、インサート成形等樹脂成形技術、電解析出法、エッチング法等により基板上に形成された導体回路の接続端部等、互いに接合されて電気的導通を図る部分を意味する。
【0013】
上記した電気的接合部は平板状をした主面部を有し、互いに接合される一方の電気的接合部にはその一部を隆起させて形成された隆起部が形成され、他方の電気的接合部には上記隆起部に当接する当接部が形成される。
【0015】
また、上記当接部は、上記隆起部と係合し、且つ、隆起部の熔解物によって隆起部と接合されるものであれば良く、特に形状的に限定されるものではない。ただ、該当接部は隆起部に対して位置決め部を備えていることが好ましく、これによって、隆起部と係合されると同時に互いの位置決めも為される。このような位置決め部を有する当接部としては、隆起部が板状の突起の場合は、主面部の端縁に形成された半円形或いは矩形の切欠や主面部の一部を一方に筒状に打ち出して形成した軸方向長さの短い筒状部等が考えられる。
【0016】
さらに、電気的接合部の材質は特に限定されるものではないが、リン青銅が好ましく、短時間で強固な接合を得ることが出来る。
【0017】
さらにまた、、電気的接合部の平板状部分の厚みも、特に限定されるものではないが、10μm乃至20μmの範囲内が好ましい。平板状部分の厚みがこの範囲内であると、電気的接合部の強度が適当となり、且つ、接合も短時間に行われる。
【0018】
また、一方の電気的接合部の隆起部を熔解させる手段も特に限定されるものではないが、レーザ光、プラズマアーク等を使用することが出来る。
【0019】
以下に、本発明電気的接合構造の実施の形態について説明する。図1及び図2は本発明電気的接合構造の第1の実施の形態を示すものである。
【0020】
この第1の実施の形態は、基板(図示しない)に埋込状に一体化されたバスバー1、1の電気的接続部である接続端2、2に電子部品3の電気的接続部である端子4、4を接合するものである。
【0021】
バスバー1の接続端2は平板状をした主面部2aを有しており、該主面部2aには切り起こし状に板状をした突片5が立設されている。詳しくは、接続端2の端縁から内方に向かって平行に延びる2条のスリット6、6を形成し、該2条のスリット6と6との間の部分を切り起こして、突片5が形成される。そして、該突片5が隆起部となる。
【0022】
電子部品3の端子4は平板状をした主面部4aを有しており、該主面部4aの端縁には半円形の切欠7が形成され、該切欠7が当接部となる。
【0023】
なお、上記バスバー1の材質としては、真鍮、銅、銅系金属(オーリン等)、リン青銅等が考えられ、表面を錫でメッキしてある。そして、バスバー1の厚さは、例えば、0.3mm〜0.8mmである。また、上記端子4の材質としては、銅又は銅系金属(オーリン等)等が考えられ、その表面を金、パラジウム、ニッケル、錫等でメッキしてある。そして、端子4の厚さは0.1mm〜0.6mmである。
【0024】
そこで、図2に示すように、電子部品3の端子4、4をバスバー1、1の接続端2、2の上に載せると共に、上記端子4、4の当接部7、7に接続端2、2の突片5、5を係合させる(図2の左側の端子4と接続端2参照)。これによって、電子部品3の端子4、4はバスバー1の接続端2、2に対して位置決めされる。それから、突片5、5の上端にレーザ光8、8又はプラズマアーク9、9(双方とも一方のもののみを示す)を照射し、突片5、5を上端から熔解していく。そして、突片5、5をその基端部まで熔解すると、突片5、5の熔解物5′が端子4、4及び接続端2、2の上に堆積し(図2の右側の端子4と接続端2参照)、端子4、4と接続端2とは突片5、5の熔解物を介して電気的に及び機械的に接合される。
【0025】
この第1の実施の形態に係る電気的接合構造にあっては、隆起部である突片5が熔解されていって、その熔解物によって2つの電気的接合部2、4同士が接合されるので、熔解物が狭い凹部内に溜まることが無く、熔解物の爆飛が生じることがない。そのため、互いに接合される電気的接合部である端子4、4と接続端2、2、特に、端子4、4の厚さに拘わらず接合が可能になる。
【0026】
また、端子4、4が高温になることがなく、従って、端子4、4に生じる熱によって電子部品3が破壊される惧れがない。
【0027】
図3乃至図5は本発明電気的接合構造の第2の実施の形態を示すものである。この第2の実施の形態は、本発明を基板(図示しない)に埋込状に設けられたバスバー10の接続端11にコード12に取り付けられた端子金具13を接合する構造に適用したものである。
【0028】
バスバー10の接続端11は平板状をした主面部11aを有しており、該主面部11aには切り起こし状に板状をした突片14が隆起部として立設されている。詳しくは、接続端11の端縁から内方に向かって平行に延びる2条のスリット15、15を形成し、該2条のスリット15と15との間の部分を切り起こして、突片14が形成される(図3参照)。
【0029】
端子金具13は平板状をした主面部16を有しており、該主面部16の一端にカシメ部17が一体に形成されている。カシメ部17は互いに反対方向に突出した2つのカシメ片17a、17aを有する。また、上記主面部16には筒状に打ち出して形成した軸方向長さの短い筒状部18が当接部として形成されている(図3参照)。
【0030】
コード12の端部の芯線12aが剥き出され、該芯線12aが端子金具13の2つのカシメ片17aと17aとの間に位置され、その状態で、カシメ片17a、17aが芯線12aの上に折り重ねられ(図4参照)、これによって、コード12の端部に端子金具13が結合される。
【0031】
そこで、端子金具13がバスバー10の接続端11の上に載せされる。このとき、端子金具13の筒状部18内に接続端11の突片14が挿通され、該突片14は筒状部18の上端から上方へ突出した状態とされる。これによって、上記突片14と筒状部18とが係合されると共に、端子金具13が接続端11に対して位置決めされる(図4参照)。
【0032】
そして、レーザ光19(又はプラズマアーク20)を隆起部である突片14の上端に照射し、突片14のうち筒状部18から上方へ突出している部分を熔解する(図5参照)。突片14の筒状部から突出している部分が熔解されると、その熔解物14′が筒状部18の上端に積もった状態となり(図5参照)、該熔解物14′を介して突片14と筒状部18、すなわち、バスバー10の接続端11とコード12の端子金具13とが電気的に及び機械的に接合される。
【0033】
この第2の実施の形態に係る電気的接合構造にあっては、隆起部である突片14が熔解されていって、その熔解物によって2つの電気的接合部11、13同士が接合されるので、熔解物が狭い凹部内に溜まることが無く、よって、熔解物の爆飛が生じることがない。そのため、互いに接合される電気的接合部である端子金具13と接続端11、特に、端子金具13の厚さに拘わらず接合が可能になる。
【0034】
なお、上記した各実施の形態において示した各部の形状乃至構造は、何れも本発明を実施するに際して行う具体化のほんの一例を示したものにすぎず、これらによって本発明の技術的範囲が限定的に解釈されることがあってはならないものである。
【0035】
【発明の効果】
以上に記載したところから明らかなように、本発明電気的接合構造は、平板状をした主面部を有する電気的接合部を互いに接合する電気的接合構造であって、一方の電気的接合部の主面部の端縁から2条のスリットを形成すると共に、該2条のスリットの間の部分を切り起こして板状の隆起部を設け、他方の電気的接合部の主面部に上記隆起部に当接する当接部を設け、上記2つの電気的接合部の主面部同士を重ね合わせて上記隆起部と上記当接部を係合させると共に、該隆起部を該当接部から突出させ、上記突出している部分を熔解してその熔解物を上記他方の電気的接合部に堆積させることにより該隆起部と該当接部とを結合させて上記2つの電気的接合部同士を接合するようにしたことを特徴とする。
【0036】
従って、本発明電気的接合構造(請求項1乃至3に記載した発明)にあっては、隆起部の当接部から突出している部分を熔解してその熔解物を他方の電気的接合部に堆積させることにより隆起部と当接部とを結合させるものであるため、熔解物は狭い空間に溜まることがない。そのため、2つの電気的接合部が接合される前に熔解物が気化して爆飛が生じることが無く、電気的接合部の厚さの如何に関わらず接合が可能になる。
【0037】
また、他方の電気的接続部は高温なることがないので、該他方の電気的接続部が電子部品の端子である場合、該端子に生じる熱が電子部品に影響を与えて電子部品が破壊されてしまうことを防ぐことができる。
【0039】
請求項に記載した発明にあっては、上記主面部は厚さ0.3mm乃至0.8mmのリン青銅によって形成されているので、電気的接合部の強度が適当となり、且つ、接合も短時間に行われる。
【図面の簡単な説明】
【図1】図2と共に本発明電気的接合構造の第1の実施の形態を示すものであり、本図は接合前の状態を示す斜視図である。
【図2】接合作業中の状態を示す斜視図である。
【図3】図4及び図5と共に本発明電気的接合構造の第2の実施の形態を示すものであり、本図は接合前の状態を示す斜視図である。
【図4】2つの電気的接合部の主面部を重ね合わせた状態を示す斜視図である。
【図5】接合作業中の状態を示す斜視図である。
【図6】図7と共に従来の電気的接合構造を示すものであり、本図は接合作業中の状態を示す斜視図である。
【図7】問題点を示す要部の断面図である。
【符号の説明】
2…接続端(一方の電気的接合部)、2a…主面部、4…端子(他方の電気的接合部)、4a…主面部、5…突片(隆起部)、5′…熔解物、6…スリット、7…(切欠)当接部、11…接続端(一方の電気的接合部)、11a…主面部、13…端子金具(他方の電気的接合部)、14…突片(隆起部)、14′…熔解物、15…スリット、16…主面部、18…筒状部(当接部)
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a novel electrical junction structure. Specifically, the present invention relates to a technique for enabling bonding without being limited by the thickness of the main surface portion, with respect to the bonding of the electric bonding portion having a flat main surface portion.
[0002]
[Prior art]
FIG. 6 shows an example of a conventional electrical junction structure.
[0003]
The illustrated electrical joint structure is a structure in which an electronic component b having terminals a and a which are electrical joints is joined to joint ends c and c of a bus bar which is another electrical joint. The terminals a and a and the joining ends c and c are both flat, and the terminals a and a are superimposed on the joining ends c and c, respectively, and in this state, a laser d is irradiated on the terminals a and a, Then, the terminals a and a are melted by the laser d, and the melting by the laser d reaches the joint ends c and c, whereby the terminals a and a and the joint ends c and c are joined by welding.
[0004]
[Problems to be solved by the invention]
However, in the above-described structure that is joined by irradiation with the laser d, when the thickness of the terminal exceeds 0.2 mm, the material of the terminals a and a is melted by the laser d (for example, brass). The melted product of the terminals a and a is accumulated in the small recess e at the part, and the melted material is vaporized and blown off before the melt reaches the joint end c (see FIG. 7). There is a problem that is difficult.
[0005]
Further, when the terminals a and a of the electronic component b are welded by laser irradiation from above, it is necessary to increase the irradiation energy in proportion to the thickness of the terminals a and a. And if irradiation energy becomes large, the heat | fever which generate | occur | produces in the terminals a and a will affect the electronic component b, and there exists a possibility that the electronic component b may be destroyed.
[0006]
Accordingly, an object of the present invention is to enable reliable bonding regardless of the thickness of the electric bonding portions bonded to each other.
[0007]
[Means for Solving the Problems]
In order to solve the above-described problems, the electrical junction structure of the present invention is an electrical junction structure in which electrical junctions having a flat main surface portion are joined to each other, and the main surface portion of one electrical junction portion The two slits are formed from the edge of the two, and a plate-like ridge is provided by cutting and raising the portion between the two slits, and the main surface of the other electrical joint is in contact with the ridge A contact portion is provided, and the main surface portions of the two electrical joint portions are overlapped to engage the raised portion with the contact portion, and the raised portion protrudes from the corresponding contact portion and protrudes. By melting the portion and depositing the melted product on the other electrical joint portion, the raised portion and the corresponding contact portion are joined to join the two electrical joint portions. .
[0008]
Therefore, in the structure of the electrical joint of the present invention, the portion protruding from the contact portion of the raised portion is melted, and the melted material is deposited on the other electrical joint portion to contact the raised portion. Since it is what joins a part, a melt does not accumulate in a narrow space. Moreover, when the other electrical connection part is a terminal of an electronic component, it can prevent that the heat which generate | occur | produces in this terminal affects an electronic component, and an electronic component is destroyed.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
The details of the electrical junction structure of the present invention will be described below with reference to the accompanying drawings showing embodiments of the present invention.
[0010]
The electrical joint structure of the present invention is an electrical joint structure in which electrical joints having a flat main surface part are joined to each other, and two slits are formed from the edge of the main surface part of one electrical joint part. And forming a plate-like raised portion by cutting and raising the portion between the two slits, and providing a contact portion that contacts the raised portion on the main surface portion of the other electrical joint portion, The main surface portions of the electrical joint portion are overlapped to engage the raised portion and the contact portion, and the raised portion protrudes from the corresponding contact portion, and the protruding portion is melted to melt the melt. By depositing on the other electrical joint portion, the raised portion and the corresponding contact portion are joined to join the two electrical joint portions.
[0011]
As described in the section of the prior art, the electrical junction structure of the present invention has a structure for connecting an electronic component, for example, an electronic component such as an LED (light-emitting diode) to a terminal on the board, and is attached to the end of the cord. The present invention can be applied to various electrical connection structures such as a structure in which the attached terminal fitting is connected to a terminal on the substrate.
[0012]
In the present invention, the electrical joint is formed on the substrate by terminals of various electronic components, terminal fittings attached to the end of the cord, resin molding technology such as insert molding, electrolytic deposition, etching, etc. It means a portion that is joined to each other to achieve electrical conduction, such as a connection end of a conductor circuit.
[0013]
The electrical junction described above has a flat main surface portion, and one electrical junction that is joined to each other has a raised portion formed by raising a part of the electrical junction, and the other electrical junction. An abutting portion that abuts on the raised portion is formed on the portion.
[0015]
Moreover, the said contact part should just engage with the said protruding part, and should just be joined to a protruding part with the melt of a protruding part, and is not specifically limited in shape. However, the abutting portion is preferably provided with a positioning portion for the raised portion, thereby, also made simultaneously mutual positioning when engaged with the raised portion. As the contact portion having such a positioning portion, when the raised portion is a plate-like protrusion, a semicircular or rectangular notch formed on the edge of the main surface portion or a part of the main surface portion is formed into a cylindrical shape. A cylindrical portion having a short axial length formed by punching out into the shape is conceivable.
[0016]
Furthermore, the material of the electrical joint is not particularly limited, but phosphor bronze is preferable, and a strong joint can be obtained in a short time.
[0017]
Furthermore, the thickness of the flat portion of the electrical joint is not particularly limited, but is preferably in the range of 10 μm to 20 μm. When the thickness of the flat plate portion is within this range, the strength of the electrical joint becomes appropriate, and the joining is performed in a short time.
[0018]
Further, the means for melting the raised portion of one of the electrical joints is not particularly limited, but laser light, plasma arc, or the like can be used.
[0019]
Hereinafter, embodiments of the electrical junction structure of the present invention will be described. 1 and 2 show a first embodiment of the electrical junction structure of the present invention.
[0020]
In the first embodiment, an electrical connection portion of an electronic component 3 is connected to connection ends 2 and 2 which are electrical connection portions of a bus bar 1 and 1 which are integrally embedded in a substrate (not shown). The terminals 4 and 4 are joined.
[0021]
The connecting end 2 of the bus bar 1 has a main surface portion 2a having a flat plate shape, and a projecting piece 5 having a plate shape in a cut-and-raised shape is erected on the main surface portion 2a. Specifically, two slits 6, 6 extending inward from the end edge of the connection end 2 are formed in parallel, and a portion between the two slits 6, 6 is cut and raised to project the projecting piece 5. Is formed. And this protrusion 5 becomes a raised part.
[0022]
The terminal 4 of the electronic component 3 has a flat main surface portion 4a. A semicircular cutout 7 is formed at an edge of the main surface portion 4a, and the cutout 7 serves as a contact portion.
[0023]
The material of the bus bar 1 may be brass, copper, copper-based metal (such as aurin), phosphor bronze, etc., and the surface is plated with tin. And the thickness of the bus-bar 1 is 0.3 mm-0.8 mm, for example. The terminal 4 may be made of copper or copper-based metal (such as aurin), and the surface thereof is plated with gold, palladium, nickel, tin or the like. And the thickness of the terminal 4 is 0.1 mm-0.6 mm.
[0024]
Therefore, as shown in FIG. 2, the terminals 4 and 4 of the electronic component 3 are placed on the connection ends 2 and 2 of the bus bars 1 and 1, and the connection end 2 is connected to the contact portions 7 and 7 of the terminals 4 and 4. 2 are engaged with each other (see the terminal 4 on the left side and the connection end 2 in FIG. 2). Thereby, the terminals 4 and 4 of the electronic component 3 are positioned with respect to the connection ends 2 and 2 of the bus bar 1. Then, the upper ends of the projecting pieces 5 and 5 are irradiated with laser beams 8 and 8 or plasma arcs 9 and 9 (both only show one), and the projecting pieces 5 and 5 are melted from the upper end. Then, when the projecting pieces 5 and 5 are melted to the base end portion, a melt 5 ′ of the projecting pieces 5 and 5 is deposited on the terminals 4 and 4 and the connection ends 2 and 2 (the terminal 4 on the right side in FIG. 2). And the connection end 2), the terminals 4, 4 and the connection end 2 are electrically and mechanically joined via the melted pieces 5, 5.
[0025]
In the electrical joint structure according to the first embodiment, the protruding piece 5 that is a raised portion is melted, and the two electrical joints 2 and 4 are joined together by the melt. Therefore, the molten material does not accumulate in the narrow concave portion, and the molten material does not explode. Therefore, the terminals 4 and 4 and the connection ends 2 and 2, particularly the thicknesses of the terminals 4 and 4, which are electrical joints to be joined to each other, can be joined.
[0026]
Further, the terminals 4 and 4 do not become hot, and therefore there is no possibility that the electronic component 3 is destroyed by the heat generated in the terminals 4 and 4.
[0027]
3 to 5 show a second embodiment of the electrical junction structure of the present invention. In the second embodiment, the present invention is applied to a structure in which a terminal fitting 13 attached to a cord 12 is joined to a connection end 11 of a bus bar 10 embedded in a substrate (not shown). is there.
[0028]
The connection end 11 of the bus bar 10 has a main surface portion 11a having a flat plate shape, and a projecting piece 14 having a plate shape in a cut-and-raised shape is erected as a raised portion on the main surface portion 11a. Specifically, two slits 15, 15 extending in parallel from the end edge of the connection end 11 are formed, and a portion between the two slits 15, 15 is cut and raised to project the projecting piece 14. Is formed (see FIG. 3).
[0029]
The terminal fitting 13 has a main surface portion 16 having a flat plate shape, and a caulking portion 17 is integrally formed at one end of the main surface portion 16. The caulking portion 17 has two caulking pieces 17a and 17a protruding in opposite directions. Further, the main surface portion 16 is formed with a cylindrical portion 18 having a short axial length formed as a contact portion (see FIG. 3).
[0030]
The core wire 12a at the end of the cord 12 is stripped, the core wire 12a is positioned between the two crimping pieces 17a and 17a of the terminal fitting 13, and in this state, the crimping pieces 17a and 17a are placed on the core wire 12a. The terminal fitting 13 is joined to the end of the cord 12 by folding (see FIG. 4).
[0031]
Therefore, the terminal fitting 13 is placed on the connection end 11 of the bus bar 10. At this time, the protruding piece 14 of the connection end 11 is inserted into the cylindrical portion 18 of the terminal fitting 13, and the protruding piece 14 is projected upward from the upper end of the cylindrical portion 18. Thereby, the protruding piece 14 and the cylindrical portion 18 are engaged, and the terminal fitting 13 is positioned with respect to the connection end 11 (see FIG. 4).
[0032]
And the laser beam 19 (or plasma arc 20) is irradiated to the upper end of the protruding piece 14 which is a raised part, and the part which protrudes upwards from the cylindrical part 18 among the protruding pieces 14 is melted (refer FIG. 5). When the portion of the projecting piece 14 protruding from the cylindrical portion is melted, the melted material 14 ′ is piled up on the upper end of the tubular portion 18 (see FIG. 5). The piece 14 and the cylindrical portion 18, that is, the connection end 11 of the bus bar 10 and the terminal fitting 13 of the cord 12 are joined electrically and mechanically.
[0033]
In the electrical joint structure according to the second embodiment, the protruding piece 14 that is a raised portion is melted, and the two electrical joints 11 and 13 are joined together by the melt. Therefore, the melt does not accumulate in the narrow concave portion, and therefore, the melt does not explode. Therefore, it becomes possible to join regardless of the thickness of the terminal fitting 13 and the connection end 11, in particular, the terminal fitting 13, which are electrical joining portions joined together.
[0034]
It should be noted that the shape or structure of each part shown in each of the above-described embodiments is merely an example of implementation in carrying out the present invention, and the technical scope of the present invention is limited by these. It should not be interpreted in a general way.
[0035]
【The invention's effect】
As is apparent from the above description, the electrical junction structure of the present invention is an electrical junction structure in which electrical junctions having a flat main surface portion are joined to each other. Two slits are formed from the edge of the main surface portion , and a plate-like protruding portion is provided by cutting and raising a portion between the two slits, and the protruding portion is formed on the main surface portion of the other electrical joint portion. An abutting portion that abuts is provided, the main surface portions of the two electrical joint portions are overlapped to engage the raised portion and the abutting portion, and the raised portion protrudes from the corresponding contact portion, and the protruding portion The bulging part and the corresponding contact part are joined to each other by joining the two electrical joint parts by melting the part that is melted and depositing the melt on the other electrical joint part. It is characterized by.
[0036]
Therefore, in the electrical joint structure of the present invention (the invention described in claims 1 to 3) , the portion protruding from the contact portion of the raised portion is melted and the melted product is used as the other electrical joint portion. Since the raised portion and the abutting portion are coupled by depositing, the melt does not accumulate in a narrow space. Therefore, the melt does not vaporize before the two electrical joints are joined, and explosion does not occur, and joining is possible regardless of the thickness of the electrical joint.
[0037]
In addition, since the other electrical connection portion does not reach a high temperature , when the other electrical connection portion is a terminal of an electronic component, the heat generated in the terminal affects the electronic component and the electronic component is destroyed. Can be prevented.
[0039]
In the invention described in claim 4 , since the main surface portion is formed of phosphor bronze having a thickness of 0.3 mm to 0.8 mm, the strength of the electrical joint portion is appropriate, and the joint is short. Done on time.
[Brief description of the drawings]
FIG. 1 shows a first embodiment of the electrical joint structure of the present invention together with FIG. 2, and is a perspective view showing a state before joining.
FIG. 2 is a perspective view showing a state during a joining operation.
FIG. 3 shows a second embodiment of the electrical joint structure of the present invention together with FIGS. 4 and 5, and is a perspective view showing a state before joining.
FIG. 4 is a perspective view showing a state in which main surfaces of two electrical joints are overlapped.
FIG. 5 is a perspective view showing a state during a joining operation.
6 shows a conventional electrical joining structure together with FIG. 7, and this figure is a perspective view showing a state during a joining operation. FIG.
FIG. 7 is a cross-sectional view of a main part showing a problem.
[Explanation of symbols]
2 ... Connection end ( one electrical joint), 2a ... main surface, 4 ... terminal (the other electrical joint), 4a ... main surface, 5 ... protruding piece (bump), 5 '... melt, 6 ... slit, 7 ... (notch) contact part, 11 ... connection end ( one electrical joint part), 11a ... main surface part, 13 ... terminal metal fitting (the other electrical joint part), 14 ... projecting piece (bump) Part), 14 '... melt, 15 ... slit, 16 ... main surface part, 18 ... cylindrical part (contact part)

Claims (4)

平板状をした主面部を有する電気的接合部を互いに接合する電気的接合構造であって、
一方の電気的接合部の主面部の端縁から2条のスリットを形成すると共に、該2条のスリットの間の部分を切り起こして板状の隆起部を設け、
他方の電気的接合部の主面部に上記隆起部に当接する当接部を設け、
上記2つの電気的接合部の主面部同士を重ね合わせて上記隆起部と上記当接部を係合させると共に、該隆起部を該当接部から突出させ、
上記突出している部分を熔解してその熔解物を上記他方の電気的接合部に堆積させることにより該隆起部と該当接部とを結合させて上記2つの電気的接合部同士を接合する
ことを特徴とする電気的接合構造。
An electrical joint structure for joining together electrical joints having a flat plate-shaped main surface part,
While forming two slits from the edge of the main surface portion of one of the electrical joints , cut and raise the portion between the two slits to provide a plate-like raised portion,
Provide a contact portion that contacts the raised portion on the main surface portion of the other electrical joint,
The main surface portions of the two electrical joint portions are overlapped with each other to engage the raised portion and the contact portion, and the raised portion protrudes from the corresponding contact portion.
Melting the protruding portion and depositing the melted product on the other electrical joint, thereby joining the raised portion and the corresponding contact portion to join the two electrical joint portions together. Characteristic electrical junction structure.
上記当接部が上記他方の電気的接合部の主面部の端縁に形成された切欠になっていて、上記一方の電気的接合部の主面部と重ね合わせて上記隆起部と係合させた
ことを特徴とする請求項1に記載の電気的接合構造。
The contact portion is a notch formed at the edge of the main surface portion of the other electrical joint portion, and is overlapped with the main surface portion of the one electrical joint portion and engaged with the raised portion. The electrical junction structure according to claim 1.
上記当接部が上記他方の電気的接合部の主面部を筒状に打ち出して形成された筒状部になっていて、上記一方の電気的接合部の主面部と重ね合わせて上記隆起部と係合させた
ことを特徴とする請求項1に記載の電気的接合構造。
The contact portion is a cylindrical portion formed by projecting the main surface portion of the other electrical joint portion into a cylindrical shape, and overlaps with the main surface portion of the one electrical joint portion. The electrical connection structure according to claim 1, wherein the electrical connection structure is engaged .
上記主面部は厚さ0.3mm乃至0.8mmのリン青銅によって形成されている
ことを特徴とする請求項1、請求項2又は請求項3に記載の電気的接合構造。
The electrical junction structure according to claim 1, 2 or 3, wherein the main surface portion is formed of phosphor bronze having a thickness of 0.3 mm to 0.8 mm.
JP2002160977A 2002-06-03 2002-06-03 Electrical junction structure Expired - Fee Related JP4132990B2 (en)

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Publication number Priority date Publication date Assignee Title
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