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JP4133798B2 - Wavelength selective photodetector - Google Patents
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JP4133798B2 - Wavelength selective photodetector - Google Patents

Wavelength selective photodetector Download PDF

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JP4133798B2
JP4133798B2 JP2003433666A JP2003433666A JP4133798B2 JP 4133798 B2 JP4133798 B2 JP 4133798B2 JP 2003433666 A JP2003433666 A JP 2003433666A JP 2003433666 A JP2003433666 A JP 2003433666A JP 4133798 B2 JP4133798 B2 JP 4133798B2
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semiconductor layer
photodetector according
photodetector
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JP2004214675A (en
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俊 永 金
秉 龍 崔
銀 京 李
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Samsung Electronics Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/21Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
    • H10F30/22Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
    • H10F30/225Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier working in avalanche mode, e.g. avalanche photodiodes

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Description

本発明は光検出器に係り、さらに詳細には波長を選択でき、S/N比を増加させた光検出器に関する。   The present invention relates to a photodetector, and more particularly to a photodetector capable of selecting a wavelength and having an increased S / N ratio.

光検出器は、光信号を検出して、これを同じ情報を有する電気的な信号に変換させる素子であって入射した赤外線を電圧に変化させて光検出を可能にするパイロエレクトリック効果を利用した検出器、光吸収による半導体内のキャリア生成を利用した半導体検出器がある。半導体光検出器は、ダイオード型光検出素子と光伝導体型光検出器とがある。半導体光検出器は、主にシリコンとガリウム砒素とを利用して製造する。   The photodetector is an element that detects an optical signal and converts it into an electrical signal having the same information, and utilizes a pyroelectric effect that enables light detection by changing incident infrared rays into a voltage. There is a detector and a semiconductor detector using carrier generation in a semiconductor by light absorption. Semiconductor photodetectors include diode-type photodetectors and photoconductor-type photodetectors. The semiconductor photodetector is manufactured mainly using silicon and gallium arsenide.

図1は、半導体光検出器のうちアバランシェ光検出器を簡略に示す概念図である。   FIG. 1 is a conceptual diagram schematically showing an avalanche photodetector among semiconductor photodetectors.

図1を参照すれば、従来のアバランシェ光検出器は、P+型半導体電極11とN型半導体電極17間にi(π)型光吸収層13とP型増幅層15とが介在された構造を有する。P+型半導体電極11は、外部の負極と連結し、N型半導体電極17は外部の正極と連結し、光検出器の両端に強い逆バイアス電圧を印加して駆動する。 Referring to FIG. 1, the conventional avalanche photodetector has a structure in which an i (π) -type light absorption layer 13 and a P-type amplification layer 15 are interposed between a P + -type semiconductor electrode 11 and an N-type semiconductor electrode 17. Have The P + -type semiconductor electrode 11 is connected to an external negative electrode, the N-type semiconductor electrode 17 is connected to an external positive electrode, and is driven by applying a strong reverse bias voltage across the photodetector.

図2は、逆バイアス電圧を印加した場合、光検出器内の電場の強さの分布を示すグラフである。図面を参照すれば、P型半導体増幅層15に最も強い電場がかかるのを見られる。電場は、光吸収層13で生成される電子及び正孔の移動率に影響を与える。   FIG. 2 is a graph showing the electric field strength distribution in the photodetector when a reverse bias voltage is applied. Referring to the drawing, the strongest electric field is applied to the P-type semiconductor amplification layer 15. The electric field affects the mobility of electrons and holes generated in the light absorption layer 13.

図3は、図1のアバランシェ光検出器内の電子及び正孔の移動を示す概念図である。図面を参照すれば、逆バイアス電圧によって注入された光キャリアがi(π)型光吸収層13で光エネルギーを吸収して電子及び正孔対が形成され、形成された電子及び正孔対は逆バイアスによって加速される。負極に加速される正孔は、P+型半導体電極11に吸収されるが、正極に加速される電子は強い電場がかかったP型半導体増幅層15の原子に順次に衝突して2次の電子キャリアを生成させて電流を増幅させる。これをアバランシェ現象という。 FIG. 3 is a conceptual diagram showing the movement of electrons and holes in the avalanche photodetector of FIG. Referring to the drawing, photocarriers injected by a reverse bias voltage absorb light energy in the i (π) -type light absorption layer 13 to form electron-hole pairs, and the formed electron-hole pairs are Accelerated by reverse bias. Holes accelerated to the negative electrode are absorbed by the P + -type semiconductor electrode 11, but electrons accelerated to the positive electrode sequentially collide with atoms of the P-type semiconductor amplification layer 15 to which a strong electric field is applied, and are secondary. Electrons are generated to amplify the current. This is called an avalanche phenomenon.

図4は、図1に示された従来のアバランシェ光検出器の等価回路を簡略に示す回路図である。図示されたように、従来のアバランシェ光検出器は、ノイズ電流Inoise成分が信号電流Isigと共に回路を流れている。 FIG. 4 is a circuit diagram schematically showing an equivalent circuit of the conventional avalanche photodetector shown in FIG. As shown in the figure, in the conventional avalanche photodetector, the noise current I noise component flows through the circuit together with the signal current I sig .

アバランシェ光検出器は、アバランシェ現象によって非常に微弱な光信号も検出でき、構造上接合容量が少なく、応答特性に優れる長所を有する。しかし、従来のアバランシェ光検出器は、温度の増加による熱雑音、すなわちジョンソン−ナイキスト雑音と広い帯域幅とを有する大きい光電流が流れるにつれて散弾雑音現象が発生して信号対雑音(S/N)比が劣化される短所を有する。散弾雑音を減らすためには、受信周波数の帯域幅Δfと光検出器の暗電流とを減らすことが重要である。また、強い逆バイアス電圧によるノイズ電流が光検出器に作用する短所を補完する解決策が必要である。   The avalanche photodetector can detect a very weak optical signal due to the avalanche phenomenon, and has an advantage that the structure has a small junction capacitance and excellent response characteristics. However, the conventional avalanche photodetector has a thermal noise due to an increase in temperature, that is, a shot noise phenomenon occurs as a large photocurrent having a Johnson-Nyquist noise and a wide bandwidth flows, and a signal-to-noise (S / N) phenomenon occurs. It has the disadvantage that the ratio is degraded. In order to reduce shot noise, it is important to reduce the bandwidth Δf of the reception frequency and the dark current of the photodetector. There is also a need for a solution that compensates for the shortcomings of noise currents due to strong reverse bias voltages acting on the photodetector.

本発明が解決しようとする技術的課題は、前述した従来技術の問題点を改善するためのものとして、S/N比を向上させうる構造の光検出器を提供することである。   The technical problem to be solved by the present invention is to provide a photodetector having a structure capable of improving the S / N ratio, in order to improve the above-described problems of the prior art.

前記課題を達成するために、本発明は、キャパシタを含む透明な上部電極と、前記上部電極の下部に位置する第1半導体層と、前記第1半導体層の下部に位置し、光を吸収して電子及び正孔対を生成する光吸収層と、前記光吸収層の下部に位置し、2次電子を生成する増幅層と、前記増幅層の下部に形成される第2半導体層と、前記第2半導体層の下部に位置し、外部抵抗と並列連結されるインダクタンスを含む下部電極と、を備えることを特徴とする光検出器を提供する。   In order to achieve the above object, the present invention provides a transparent upper electrode including a capacitor, a first semiconductor layer located under the upper electrode, and a lower part of the first semiconductor layer, which absorbs light. A light absorbing layer that generates electron and hole pairs, an amplification layer that is located under the light absorption layer and generates secondary electrons, a second semiconductor layer formed under the amplification layer, There is provided a photodetector comprising: a lower electrode including an inductance located under the second semiconductor layer and connected in parallel with an external resistor.

前記キャパシタは、二つの伝導性薄膜間に誘電薄膜が多重に積層されて特定波長帯域の光を透過させる光学フィルターとして機能する。   The capacitor functions as an optical filter in which a plurality of dielectric thin films are stacked between two conductive thin films to transmit light in a specific wavelength band.

前記伝導性薄膜は、ITOまたはZnOで形成できる。   The conductive thin film can be formed of ITO or ZnO.

前記誘電薄膜は、SiO2またはSiNxで形成できる。 The dielectric thin film can be formed of SiO 2 or SiN x .

前記上部電極は、前記外部抵抗及び外部電源とオーム接触するボンディングパッドが表面に付着されうる。   The upper electrode may have a bonding pad attached to the surface in ohmic contact with the external resistor and the external power source.

前記上部電極は、前記外部電源とオーム接触するボンディングパッドが位置する中心部の第1円形電極と、前記第1円形電極と所定間隔離隔され、前記外部抵抗とオーム接触するボンディングパッドが付着される第2円形電極と、前記第1及び第2円形電極間に位置する円形絶縁膜と、を備える。   The upper electrode is spaced apart from the first circular electrode by a predetermined distance from a central first circular electrode where a bonding pad in ohmic contact with the external power source is located, and a bonding pad in ohmic contact with the external resistor is attached. A second circular electrode; and a circular insulating film positioned between the first and second circular electrodes.

前記下部電極は、絶縁膜にコイルが螺旋形に形成されたインダクターとして機能する。   The lower electrode functions as an inductor in which a coil is spirally formed on an insulating film.

前記下部電極は、外部素子とオーム接触するようにホールが形成される。   The lower electrode has a hole formed in ohmic contact with an external element.

前記第1半導体層はP+型半導体に、前記増幅層をP型半導体に、前記第2半導体層はN型半導体層に形成できる。 The first semiconductor layer may be a P + type semiconductor, the amplification layer may be a P type semiconductor, and the second semiconductor layer may be an N type semiconductor layer.

本発明はキャパシタとインダクターとを上部電極及び下部電極に含めてLC共振回路を形成することによって高周波ノイズ成分を除去できる。また、導電性薄膜と誘電薄膜とを多層に形成してキャパシタを構成することによって特定波長帯域の光だけをフィルタリングできる光学フィルターとしての機能を付加できる。   In the present invention, a high frequency noise component can be removed by forming an LC resonance circuit by including a capacitor and an inductor in the upper electrode and the lower electrode. Further, by forming a capacitor by forming a conductive thin film and a dielectric thin film in multiple layers, it is possible to add a function as an optical filter capable of filtering only light in a specific wavelength band.

本発明による光検出器は、上部電極にキャパシタと下部電極とにインダクターを含む共振回路(LC)を形成し、外部抵抗からのノイズ成分を遮断することによってS/N比を増加させうる。   The photodetector according to the present invention can increase the S / N ratio by forming a resonant circuit (LC) including an inductor in the upper electrode and an inductor in the upper electrode, and cutting off noise components from the external resistance.

また、本発明による光検出器は、伝導性薄膜と誘電薄膜とを多層に形成して光学フィルターとして機能するキャパシタを備えて特定波長帯域の光をフィルタリングできる。   In addition, the photodetector according to the present invention includes a capacitor that functions as an optical filter by forming a conductive thin film and a dielectric thin film in multiple layers, and can filter light in a specific wavelength band.

以下、本発明の実施例による光検出器を図面を参照して詳細に説明する。   Hereinafter, a photodetector according to an embodiment of the present invention will be described in detail with reference to the drawings.

図5は、本発明の実施例による光検出器を簡略に示す概念図である。   FIG. 5 is a conceptual diagram schematically showing a photodetector according to an embodiment of the present invention.

図5を参照すれば、光検出器30は、上側から順に上部電極31、第1半導体層33、光吸収層35、増幅層37、第2半導体層39及び下部電極41を備える。   Referring to FIG. 5, the photodetector 30 includes an upper electrode 31, a first semiconductor layer 33, a light absorption layer 35, an amplification layer 37, a second semiconductor layer 39, and a lower electrode 41 in order from the upper side.

上部電極31は、透明な第1伝導性薄膜31a、誘電薄膜31b及び第2伝導性薄膜31cが積層されてなるキャパシタCを含む。第1伝導性薄膜31aの上部には光が透過する第1円形電極が中心部に設けられ、第1円形電極の外部を覆い包むように円形絶縁膜が形成され、円形絶縁膜の外部にはまた第2円形電極が形成される。第1円形電極には外部電源と連結されるボンディングパッドが付着され、第2円形電極には外部抵抗と連結されるボンディングパッドが付着されうる。   The upper electrode 31 includes a capacitor C formed by laminating a transparent first conductive thin film 31a, a dielectric thin film 31b, and a second conductive thin film 31c. A first circular electrode through which light is transmitted is provided at the center of the upper portion of the first conductive thin film 31a, and a circular insulating film is formed so as to cover the outside of the first circular electrode. A second circular electrode is formed. A bonding pad connected to an external power source may be attached to the first circular electrode, and a bonding pad connected to an external resistor may be attached to the second circular electrode.

キャパシタCは、伝導性薄膜31a,31cと誘電薄膜31bとを複数に蒸着して多層に形成できる。伝導性薄膜31aは、ITO、ZnOのような物質で形成でき、誘電薄膜31bはSiO2、SiNxのような物質で形成できる。第1及び第2伝導性薄膜31a,31cを誘電性物質で形成すれば、キャパシタCが特定波長帯域の光を選択し、その他の波長帯域の光に対しては最小の反応を示す光学フィルターとして機能させうる。 The capacitor C can be formed in multiple layers by depositing a plurality of conductive thin films 31a and 31c and a dielectric thin film 31b. The conductive thin film 31a can be formed of a material such as ITO or ZnO, and the dielectric thin film 31b can be formed of a material such as SiO 2 or SiN x . If the first and second conductive thin films 31a and 31c are formed of a dielectric material, the capacitor C selects light in a specific wavelength band and serves as an optical filter that exhibits minimum response to light in other wavelength bands. Can function.

第1半導体層33がP型半導体であれば、第2半導体層39はN型半導体で、第1及び第2半導体層33,39間に介在される増幅層37はP型半導体で、光吸収層33はN型半導体で形成する。第1半導体層33をN型イオンでドーピングすれば、第2半導体層39はP型イオンで、増幅層37はN型イオンで、光吸収層33はP型イオンでドーピングする。   If the first semiconductor layer 33 is a P-type semiconductor, the second semiconductor layer 39 is an N-type semiconductor, the amplification layer 37 interposed between the first and second semiconductor layers 33 and 39 is a P-type semiconductor, and absorbs light. The layer 33 is formed of an N-type semiconductor. If the first semiconductor layer 33 is doped with N-type ions, the second semiconductor layer 39 is doped with P-type ions, the amplification layer 37 is doped with N-type ions, and the light absorption layer 33 is doped with P-type ions.

下部電極41は、絶縁膜41aの内部にコイル41bを図5に示されたように螺旋形に形成してインダクターとして機能させる。下部電極41の中心部には、外部素子とオーム接触できるようにホール41cを形成する。   The lower electrode 41 functions as an inductor by forming a coil 41b in a spiral shape in the insulating film 41a as shown in FIG. A hole 41c is formed at the center of the lower electrode 41 so as to be in ohmic contact with an external element.

上部電極31はキャパシタとして、下部電極41はインダクターとして作用して、本発明の実施例による光検出器は、上部電極31と下部電極41とを含む全体としてLC共振回路を形成する。   The upper electrode 31 functions as a capacitor and the lower electrode 41 functions as an inductor, and the photodetector according to the embodiment of the present invention forms an LC resonance circuit as a whole including the upper electrode 31 and the lower electrode 41.

上部電極31に強い逆バイアスを加えれば、上部電極31を通じて入射する光は、キャパシタCによって高周波ノイズ成分が除去された後、第1半導体層33を経由して光吸収層35に吸収される。光吸収層35に吸収された光は、電子と正孔との対を生成し、電子はN型の第2半導体層39に向けて移動し、正孔はP型の第1半導体層33に向けて移動する。第2半導体層39に向けて移動する電子は、P型の増幅層37の原子と衝突して2次電子を生成し、これにより受光量に比例して増幅された電流が光検出器を流れる。下部電極41を通じて電気的な信号として引出して光信号の情報を検出する。   If a strong reverse bias is applied to the upper electrode 31, the light incident through the upper electrode 31 is absorbed by the light absorption layer 35 via the first semiconductor layer 33 after the high frequency noise component is removed by the capacitor C. The light absorbed by the light absorption layer 35 generates a pair of electrons and holes, the electrons move toward the N-type second semiconductor layer 39, and the holes move to the P-type first semiconductor layer 33. Move towards. The electrons moving toward the second semiconductor layer 39 collide with the atoms of the P-type amplification layer 37 to generate secondary electrons, and thereby the current amplified in proportion to the amount of received light flows through the photodetector. . It extracts as an electrical signal through the lower electrode 41 and detects information of the optical signal.

図6は、図5に示された本発明の実施例による光検出器に関する簡略な回路図である。   FIG. 6 is a simplified circuit diagram of the photodetector shown in FIG. 5 according to the embodiment of the present invention.

図6を参照すれば、キャパシタC、光検出器構造体PD及びインダクターLが直列に連結され、光検出器構造体PD及びインダクターLと外部抵抗Rとが並列に連結されている。ここで、光検出器の構造体PDは、図5で上部電極31と下部電極41とを除いて第1半導体層33、光吸収層35、増幅層37及び第2半導体層39を備える半導体素子を示す。   Referring to FIG. 6, the capacitor C, the photodetector structure PD, and the inductor L are connected in series, and the photodetector structure PD, the inductor L, and the external resistor R are connected in parallel. Here, the structure PD of the photodetector includes a first semiconductor layer 33, a light absorption layer 35, an amplification layer 37, and a second semiconductor layer 39 except for the upper electrode 31 and the lower electrode 41 in FIG. Indicates.

電源Vの負極はキャパシタCに、正極はインダクターLに連結され、ノイズ電流Inは電源Vを通過して流れ、外部抵抗には信号電流Isだけが流れる。本発明の電源の電圧V、インダクターLの電圧をVL、インダクターLの誘導性リアクタンスXL及び、キャパシタCの容量性リアクタンスXcは数式1のような関係を有する。

Figure 0004133798
The negative electrode of the power supply V to the capacitor C, the positive electrode is connected to the inductor L, the noise current I n flows through the power supply V, only the signal current I s flows through the external resistor. The voltage V of the power source of the present invention, the voltage of the inductor L is V L , the inductive reactance X L of the inductor L, and the capacitive reactance X c of the capacitor C have a relationship as shown in Equation 1.
Figure 0004133798

キャパシタCが大きくなれば、VLはVに近接するが、電源のノイズは一般的に高周波成分として受光素子とグラウンドとの連結部位に挿入されたリアクタンスXLによってフィルタリングされる。これは、高周波成分で回路インピーダンスはリアクタンスが増加するほど高まるためである。したがって、本発明の実施例による光検出器で、光による純粋な信号電流Isだけが外部抵抗Rを流れるので、外部抵抗Rの値を小さく設計できる。また、インダクターLとキャパシタCとがバンドパスフィルターの役割をするので、検出器のS/N比を数式2のように示せる。

Figure 0004133798
If the capacitor C increases, V L approaches V, but the noise of the power supply is generally filtered by a reactance X L inserted as a high-frequency component at a connection portion between the light receiving element and the ground. This is because the circuit impedance increases as the reactance increases due to high frequency components. Accordingly, a photodetector according to an embodiment of the present invention, since only a pure signal current I s by light flows through the external resistor R, can be designed smaller the value of the external resistor R. In addition, since the inductor L and the capacitor C serve as a band-pass filter, the S / N ratio of the detector can be expressed as Equation 2.
Figure 0004133798

ここで、Mは利得、はショットノイズパワー、はサーマルノイズパワー、は信号パワーである。本発明の実施例による光検出器を特定周波数帯域の信号を検出する回路構造を有するように設計することによって周波数の選択度を増加させうる。このような回路構造では、Δfが減少し、XLが減少して全体光検出器のS/N比が増加する。 Here, M is a gain, is a shot noise power, is a thermal noise power, and is a signal power. By designing the photodetector according to the embodiment of the present invention to have a circuit structure for detecting a signal in a specific frequency band, the frequency selectivity can be increased. In such a circuit structure, Δf decreases, X L decreases, and the S / N ratio of the entire photodetector increases.

前記説明で多くの事項が具体的に記載されているが、それらは発明の範囲を限定するものではなく、望ましい実施例の例示として解釈されなければならない。   Although many items are specifically described in the above description, they do not limit the scope of the invention and should be construed as examples of preferred embodiments.

例えば、当業者ならば、本発明の技術的思想によってキャパシタとインダクターの性能を増加させうる多様な構造と配列とを採択できる。したがって、本発明の範囲は説明された実施例によって決定されるものではなく、特許請求の範囲に記載された技術的思想によって決定されなければならない。   For example, those skilled in the art can adopt various structures and arrangements that can increase the performance of capacitors and inductors according to the technical idea of the present invention. Accordingly, the scope of the invention should not be determined by the embodiments described, but by the technical spirit described in the claims.

本発明は高周波ノイズ成分を除去でき、特定波長帯域の光だけをフィルタリングできる光学フィルターとして機能する波長選択性光検出器に適用されうる。   The present invention can be applied to a wavelength selective photodetector that functions as an optical filter that can remove high-frequency noise components and filter only light in a specific wavelength band.

従来のアバランシェ光検出器を簡略に示す断面図である。It is sectional drawing which shows the conventional avalanche photodetector simply. 図1のアバランシェ光検出器の各薄膜層で電場の強さを示すグラフである。It is a graph which shows the intensity | strength of an electric field in each thin film layer of the avalanche photodetector of FIG. 図1のアバランシェ光検出器で電子と正孔との移動を示す概念図である。It is a conceptual diagram which shows a movement of an electron and a hole with the avalanche photodetector of FIG. 図1のアバランシェ光検出器の回路図である。It is a circuit diagram of the avalanche photodetector of FIG. 本発明の実施例による光検出器の概念図である。It is a conceptual diagram of the photodetector by the Example of this invention. 図5の光検出器の回路図である。FIG. 6 is a circuit diagram of the photodetector in FIG. 5.

符号の説明Explanation of symbols

30 光検出器
31 上部電極
31a 第1伝導性薄膜
31b 誘電薄膜
31c 第2伝導性薄膜
33 第1半導体層
35 光吸収層
37 増幅層
39 第2半導体層
41 下部電極
41a 絶縁膜
41b コイル
41c ホール
30 Photodetector 31 Upper electrode 31a First conductive thin film 31b Dielectric thin film 31c Second conductive thin film 33 First semiconductor layer 35 Light absorbing layer 37 Amplifying layer 39 Second semiconductor layer 41 Lower electrode 41a Insulating film 41b Coil 41c Hole

Claims (11)

キャパシタを含む透明な上部電極と、
前記上部電極の下部に位置する第1半導体層と、
前記第1半導体層の下部に位置し、光を吸収して電子及び正孔対を生成する光吸収層と、
前記光吸収層の下部に位置し、二次電子を生成する増幅層と、
前記増幅層の下部に形成される第2半導体層と、
前記第2半導体層の下部に位置し、外部抵抗と並列連結されるインダクタンスを含む下部電極と、を備えることを特徴とする光検出器。
A transparent upper electrode including a capacitor;
A first semiconductor layer located below the upper electrode;
A light absorption layer located under the first semiconductor layer and absorbing light to generate electron and hole pairs;
An amplifying layer located under the light absorbing layer and generating secondary electrons;
A second semiconductor layer formed under the amplification layer;
A photodetector, comprising: a lower electrode including an inductance located under the second semiconductor layer and connected in parallel with an external resistor.
前記キャパシタは、二つの伝導性薄膜間に誘電薄膜が多重に積層されて特定波長帯域の光を透過させる光学フィルターであることを特徴とする請求項1に記載の光検出器。   The photodetector according to claim 1, wherein the capacitor is an optical filter in which a plurality of dielectric thin films are stacked between two conductive thin films to transmit light in a specific wavelength band. 前記伝導性薄膜は、ITOまたはZnOであることを特徴とする請求項2に記載の光検出器。   The photodetector according to claim 2, wherein the conductive thin film is ITO or ZnO. 前記誘電薄膜は、SiO2またはSiNxであることを特徴とする請求項2に記載の光検出器。 The photodetector according to claim 2, wherein the dielectric thin film is made of SiO 2 or SiN x . 前記上部電極は、前記外部抵抗及び外部電源とオーム接触するボンディングパッドが表面に付着されることを特徴とする請求項2に記載の光検出器。   The photodetector according to claim 2, wherein the upper electrode has a bonding pad attached in ohmic contact with the external resistor and an external power source. 前記上部電極は、
前記外部電源とオーム接触するボンディングパッドが位置する中心部の第1円形電極と、
前記第1円形電極と所定間隔離隔され、前記外部抵抗とオーム接触するボンディングパッドが付着される第2円形電極と、
前記第1及び第2円形電極間に位置する円形絶縁膜と、を備えることを特徴とする請求項5に記載の光検出器。
The upper electrode is
A first circular electrode in the center where a bonding pad in ohmic contact with the external power source is located;
A second circular electrode spaced apart from the first circular electrode by a predetermined distance and having a bonding pad attached in ohmic contact with the external resistor;
The photodetector according to claim 5, further comprising a circular insulating film positioned between the first and second circular electrodes.
前記下部電極は、絶縁膜にコイルが螺旋形に形成されたインダクターであることを特徴とする請求項1に記載の光検出器。   The photodetector according to claim 1, wherein the lower electrode is an inductor in which a coil is spirally formed in an insulating film. 前記下部電極は、外部素子とオーム接触するようにホールが形成されたことを特徴とする請求項7に記載の光検出器。   The photodetector according to claim 7, wherein the lower electrode has a hole formed in ohmic contact with an external element. 前記第1半導体層はP+型半導体層に形成されることを特徴とする請求項1に記載の光検出器。 The photodetector according to claim 1, wherein the first semiconductor layer is a P + type semiconductor layer. 前記増幅層は、P型半導体層に形成されることを特徴とする請求項1に記載の光検出器。   The photodetector according to claim 1, wherein the amplification layer is formed in a P-type semiconductor layer. 前記第2半導体層は、N型半導体層に形成されることを特徴とする請求項1に記載の光検出器。   The photodetector according to claim 1, wherein the second semiconductor layer is formed on an N-type semiconductor layer.
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