JP4136849B2 - Electron source substrate manufacturing method and droplet application method - Google Patents

Description

The present invention includes an electron-emitting device having a pair of device electrodes and a conductive thin film connecting the device electrodes on an insulating substrate, and an electron-emitting portion is formed in a part of the conductive thin film. and a process for producing and droplet applying method of the electron source substrate configured by arranging a plurality, such an electron source substrate is used as an image display device.

  In recent years, FPDs and PDPs are becoming more and more popular as display elements for large displays such as airport waiting rooms and large TVs and large TVs. An electron source substrate as a kind of display element of FPD does not leak to the example, and it is becoming increasingly necessary to increase the size.

  An electron source substrate is an electron-emitting device having a pair of device electrodes and a conductive thin film connecting the device electrodes on an insulating substrate, and an electron-emitting portion is formed in a part of the conductive thin film Is a display substrate configured by arranging a plurality of electrodes, and particularly, a substrate in which a surface conduction electron-emitting device is formed as an electron source.

  Conventionally, two types of electron-emitting devices using a thermionic electron-emitting device and a cold cathode electron-emitting device are known. Cold cathode electron-emitting devices include field emission type (hereinafter referred to as “FE type”), metal / insulating layer / metal type (hereinafter referred to as “MIM type”), surface conduction type electron emitting device, and the like.

  As examples of the FE type, those disclosed in Non-Patent Document 1 or Non-Patent Document 2 below are known.

  On the other hand, as an example of the MIM type, one disclosed in Non-Patent Document 3 below is known.

Examples of the surface conduction electron-emitting device type include those disclosed in Non-Patent Document 4 below. The surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current flows through a small-area thin film formed on a substrate in parallel to the film surface. As this surface conduction electron-emitting device, a device using a SnO ₂ thin film by Elinson et al., A device using an Au thin film (the following non-patent document 5), a device using an In ₂ O ₃ / SnO ₂ thin film (the following non-patent document 6). ), A carbon thin film (the following non-patent document 7), and the like have been reported.

  FIG. 10 is a diagram schematically showing the aforementioned M. Hartwell device configuration as a typical example of these surface conduction electron-emitting devices.

  In the figure, 11 is a glass substrate, and 12 and 13 are a pair of element electrodes formed on the glass substrate 11 so as to face each other. 14 is a conductive thin film made of a metal oxide thin film or the like formed by sputtering or the like in an H-shaped pattern, and the electron emission portion 15 is formed by an energization process called energization forming. In the figure, the element electrode interval L is set to 0.5 to 1 mm, and W is set to 0.1 mm. Note that the position and shape of the electron emission portion 15 are schematically shown because they are uncertain.

  The present invention provides an electron-emitting device having a plurality of pairs of device electrodes on a substrate and a conductive thin film formed by applying droplets of a solution containing a conductive thin film material between the electrodes of each device electrode pair The present invention relates to a manufacturing method and a manufacturing apparatus for an electron source substrate having a plurality of substrates.

In the conventional manufacturing method, in the manufacturing method for manufacturing the electron source substrate by discharging and applying droplets to the substrate while relatively moving the substrate and the inkjet head that discharges the droplets, the droplets are discharged. The inkjet head for applying was positioned and fixed by abutting against the reference pin. If the ink jet head is fixed to the reference pin, it can be fixed within several tens of μm. Therefore, more accurate positioning of the substrate to a desired position is performed by moving the stage on the substrate side.
JP-A-8-292319 JP-A-9-300664 JP-A-9-69334 JP 2000-251665 A WP Dyke & WW Dolan, "Field emission", Advance in Electron Physics, 8, 89 (1956) CA Spindt, "PHYSICAL Properties of thin-film field emission cathodes with molybdenium cones," J. Appl. Phys., 47, 5248 (1976) CA Mead, "Operation of Tunnel-Emission Devices", J. Appl. Phys., 32, 646 (1961) MI Elinson, Radio Eng. Electron Phys., 10, 1290 (1965) G. Dittmer, "Thin Solid Films", 9, 317 (1972) M. Hartwell and CG Fonstad, "IEEE Trans. ED Conf.", 519 (1975) H. Araki et al., Vacuum, Vol. 26, No. 1, p. 22 (1983)

  However, since the number of ejection nozzles of the inkjet head is small, in order to eject liquid droplets onto all the arrayed element electrodes on the substrate, it is necessary to scan many times and a long time is required. Met.

  If the number of nozzles to be discharged is increased, the discharge time to the entire surface of the substrate is naturally short. Furthermore, if a plurality of inkjet heads having a large number of nozzles are used, the discharge time onto the entire surface of the substrate can be further shortened. For this purpose, it is necessary to accurately position each nozzle of the inkjet head and the substrate. Particularly in an apparatus using a plurality of inkjet heads, positioning of the inkjet head within several tens of μm allows more accurate positioning. It is not possible to do this by moving the stage. In order to accurately position all of the ejection nozzles of the plurality of inkjet heads so as to be ejected to a desired position on the substrate, it is necessary to accurately position the inkjet head itself with respect to the substrate.

  As a patent gazette, a color filter manufacturing method (above Patent Document 1) for the purpose of realizing high precision landing accuracy using an ink jet head having a plurality of discharge nozzles, when forming a color filter by an ink jet method. A color filter manufacturing method (the above-mentioned Patent Document 2) for the purpose of manufacturing a color filter with high efficiency and high throughput is disclosed.

  In Patent Document 1, as a method of positioning an inkjet head, for example, a mechanism that adjusts the posture in the X, Y, Z, and θ directions by combining a moving mechanism such as a linear motion stage and a rotary stage is provided. As the moving mechanism is described in the specification, if the linear motion stage has three axes and the rotary stage has one axis, a high-precision four-axis stage is combined. To be expected.

  In Patent Document 2, as a method for positioning an inkjet head, there are a mechanism for adjusting the angle by simultaneously rotating a plurality of inkjet heads, and a mechanism for finely adjusting each inkjet head in the nozzle arrangement direction. If the total nozzle interval from the nozzle at one end of each inkjet head to the nozzle at the other end is the same for a plurality of inkjet heads, the inkjet head can be positioned by this method.

  However, the inkjet head used in the present invention is desired to be manufactured at a low cost. If the total nozzle interval is within a tolerance of several tens of μm, we would like to consider using it as a non-defective product. By doing so, the company intends to increase the manufacturing yield of inkjet heads and reduce manufacturing costs.

  Accordingly, there has been a demand for an apparatus and a method that can match a plurality of inkjet heads having a total nozzle interval tolerance of several tens of μm with a desired discharge interval of a substrate. In addition, even when the total nozzle spacing of each inkjet head is the same for multiple inkjet heads, it is not possible to cope with the case where the droplet application pattern on the substrate is partially displaced within the substrate. An apparatus and a method that can be used have been desired.

The present invention has been made in view of the above circumstances, and a first object of the present invention is to eject and apply droplets from an inkjet head to a desired position on the substrate while relatively moving the substrate and the inkjet head. In the manufacturing method of the electron source substrate, there are provided a manufacturing method and a droplet applying method for manufacturing the electron source substrate in a very short time by using a plurality of ink jet heads having a large number of ejection nozzles.

The second object is to provide a manufacturing method and a droplet applying method that can easily match the desired pitch interval of the substrate even if the tolerance of the total nozzle interval of the inkjet head is several tens of μm.

A third object is to continue manufacturing an electron source substrate by discharging droplets using another nozzle without replacing the inkjet head when the discharge nozzle becomes abnormal for some reason. A production method and a droplet application method are provided.

In the method for manufacturing an electron source substrate according to the present invention, at least one of a substrate on which a plurality of a pair of element electrodes are arranged and a plurality of inkjet heads each having a plurality of nozzles is set in the main scanning direction relative to the other. A method of manufacturing an electron source substrate that scans and applies droplets containing a conductive thin film material from the plurality of ink jet heads between electrodes of the plurality of element electrodes, the substrate having a plurality of the pair of element electrodes A plurality of inkjet heads having a plurality of nozzles arranged opposite to each other, and an angle of the nozzle arrangement direction of the plurality of inkjet heads with respect to a sub-scanning direction orthogonal to the main scanning direction. an angle adjustment step of adjusting individually for each, the position of the substrate and the plurality of inkjet heads, the inkjet f A position adjustment step of adjusting by moving the de in the arrangement direction of the nozzle, moving the at least relatively the main scanning direction one against the other the substrate and the plurality of ink jet heads after each adjustment while and a droplet applying step of applying the droplets from a plurality of nozzles of the ink jet head of the respective between the plurality of element electrodes, further, by adjusting the position of the inkjet head in the array direction of the nozzle , Including a step of reselecting a combination of nozzles for applying droplets from a nozzle having an ejection failure to another nozzle .
The droplet applying method according to the present invention includes at least one of a substrate on which a plurality of paired element electrodes are arranged and a plurality of inkjet heads each having a plurality of nozzles in the main scanning direction relative to the other. A method of scanning and applying droplets containing a conductive thin film material from a plurality of ink jet heads between electrodes of the plurality of element electrodes, wherein the plurality of nozzles are formed on a substrate having a plurality of the pair of element electrodes. A plurality of inkjet heads having a plurality of inkjet heads arranged opposite to each other, and an angle of the arrangement direction of the nozzles of the plurality of inkjet heads to the sub-scanning direction orthogonal to the main scanning direction is individually adjusted for each of the plurality of inkjet heads The angle adjustment step, the positions of the substrate and the plurality of inkjet heads, and the inkjet heads of the nozzles. A position adjustment step of adjusting by moving the fine direction, wherein the plurality of elements while moving relatively the main scanning direction at least one relative to the other of the substrate and the plurality of ink jet heads after each adjustment A droplet applying step of applying the droplets from a plurality of nozzles of each of the inkjet heads between the electrodes, and further applying the droplets by adjusting the position of the inkjet head in the direction of alignment of the nozzles Including a step of reselecting a combination of nozzles to be changed from a nozzle having a discharge abnormality to another nozzle.

  According to the present invention, even if the tolerance of the total nozzle interval of the inkjet head is several tens of μm, it can be easily matched with the desired pitch interval of the substrate, so that the manufacturing yield of the inkjet head can be dramatically increased. The inkjet head can be manufactured at a very low cost.

  In addition, when the discharge nozzle becomes abnormal for some reason, it is possible to continue manufacturing the electron source substrate by discharging droplets using another nozzle without replacing the inkjet head. The consumption cost is drastically reduced and the operating rate of the manufacturing apparatus is increased.

  Further, by using a plurality of ink jet heads having a large number of discharge nozzles, a large electron source substrate can be accurately manufactured in a very short time.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings, but before that, a method for manufacturing an electron-emitting device will be described in order, including pre- and post-processes of the present invention.

  FIG. 8 is a schematic view showing an example of a method for manufacturing a surface conduction electron-emitting device in the method for manufacturing an electron source substrate of the present invention.

  FIG. 9 is a schematic view showing an example of a surface conduction electron-emitting device manufactured by the manufacturing method, where (a) is a plan view and (b) is a cross-sectional view.

  8 and 9, 11 is a substrate, 12 and 13 are element electrodes, 14 is a conductive thin film, 15 is an electron emission portion, 31 is a droplet discharge head, and 32 is a droplet.

  First, in the pre-process of the present invention, the device electrodes 12 and 13 are formed on the substrate 11 with a distance L (FIG. 8A). Next, with the apparatus of the present invention, a droplet 32 made of a solution containing a metal element is discharged from the droplet discharge head 31 (FIG. 8B), so that the conductive thin film 14 is in contact with the device electrodes 12 and 13. It forms (FIG.8 (c)). Next, a crack is generated in the conductive thin film by, for example, a forming process, and the electron emission portion 15 is formed.

  In addition, since the formation method of an element electrode and the formation method of the electron emission part by a forming process are demonstrated in the said patent document 3, the said patent document 4, etc., it abbreviate | omits.

  As the droplet discharge head, an ink jet type that can be controlled in the range of about 10 ng to several tens of ng and can easily form a minute amount of droplets of about 10 ng to several tens of ng is preferable. As an ink jet head, an ink jet ejecting head using a piezoelectric element or the like, a method in which bubbles are formed in a liquid by thermal energy, and the liquid is ejected as droplets (referred to as a “bubble jet (registered trademark) method”). And an ink jet jet head.

  The conductive thin film 14 is particularly preferably a fine particle film composed of fine particles in order to obtain good electron emission characteristics. The film thickness is determined by step coverage to the device electrodes 12 and 13, resistance value between the device electrodes 12 to 13, and Although it is set as appropriate depending on the energization forming conditions, etc., it is preferably several to several thousand, particularly preferably 10 to 500.

  The electron source substrate manufacturing method and manufacturing apparatus according to the present invention are characterized by a plurality of inkjet heads each having a plurality of droplet application nozzles, and a relative position of the electron source substrate and the inkjet head. A moving means for moving at least one; and an angle adjusting means for individually adjusting an inclination angle of a nozzle arrangement direction with respect to a moving direction of the plurality of inkjet heads by the moving means.

  Another feature of the method and apparatus for manufacturing an electron source substrate according to the present invention is that it includes position adjusting means for individually adjusting the positions of the plurality of inkjet heads.

  In the present invention, the object to be scanned may be either an inkjet head or a substrate, but when scanning the inkjet head, a measuring instrument for measuring the position of the substrate must also be scanned.

  FIG. 1 is a schematic view of an electron source substrate manufacturing apparatus according to an embodiment of the present invention.

  In FIG. 1, 101 is a main body surface plate for mounting the apparatus, 102 is a vibration isolator for supporting the surface plate 101 and blocking external vibrations, and 103 is a Y stage that is provided on the surface plate and performs a large stroke movement. Guide shaft, 104 Y-stage linear motor, 105 Y-stage Y-stage Y axis function, 106 X-stage linear motor, 107 X-axis function X stage, 108 substrate A plate to be mounted, 109 is a head unit composed of an inkjet head, 110 is an XY measurement optical system for measuring a pattern position (XY direction) on the substrate, and 111 is a Z measurement optical for measuring the position of the substrate in the Z direction. System, 112 is a Z moving unit that moves the XY measuring optical system 110 in the Z direction, and 113 is a head unit orthogonal to the substrate scanning direction (X direction). Head moving unit that moves in the direction (Y, Z direction), 114 is a column that supports the Z moving unit 112 and the head moving unit 113, 115 is a laser optical system length measuring device for measuring the stage position, and 116 is an inkjet head. A cleaning unit and a drive system that clean the discharge nozzle surface and stabilize the discharge amount and the discharge position.

  In this embodiment, the laser optical length measuring device 115 is used for the position measurement of the stage. However, a position measurement scale such as an optical scale may be used for each of the X and Y stages as a substitute for 115. Good.

  FIG. 2 is a schematic view of a head unit 109 for positioning the ink jet head. Two ink jet heads can be attached, and the head unit 109 is mounted and used in the manufacturing apparatus of FIG. In FIG. 2, 201 is a unit base plate, 202 is a guide holder, 203 is a guide rail for moving in the W direction, and 204 is a W direction slider. Here, the V and W axes in FIG. 2 and FIGS. 3, 4, and 5, which will be described later, are in different directions from the X and Y axes on the plane including the X and Y axes in FIG. The axis is the same direction as V and W in FIG. The entire head unit 109 is roughly adjusted in the W direction (nozzle arrangement direction), and a plurality of inkjet heads can be switched.

  205 is a high-precision positioning mechanism in the θz direction and the W direction, and the high-precision positioning in the W direction is for performing high-precision positioning in the Y direction. 206 is a base fixed to the W-direction slider 204 with the high-precision positioning mechanism 205 interposed therebetween, 207 is a guide rail fixed to the base 206, 208 is a slider that moves along the guide rail 207, and 209 is fixed to the slider 208. The drive piece 210 is movable in the Z direction with the guide shaft 212 as a guide, 210 and 211 are fixed to the support plate 201 to support the guide shaft 212, and 213 is fixed to the unit base plate 201 to support the micrometer head 214. It is a plate. The tip of the movable shaft of the micrometer head 214 is connected to the drive piece 209. Reference numerals 215 and 216 denote support plates that are fixed to the movable portion of the high-precision positioning mechanism 205 and support the inkjet head 217.

  The slider 204 is provided with a clamp mechanism (not shown in the drawing) that is fixed to the unit base plate 201 so as not to be displaced.

  Reference numerals 203 to 217 are configured symmetrically on both sides of the guide holder 202. In FIG. 2, 203 to 205 are shown on both sides, and 206 to 217 are shown only on one side and the other is omitted.

  FIG. 3 is a configuration diagram of the high-accuracy positioning mechanism 205. The position adjustment mechanism 205a for adjusting the minute position of the inkjet head 217 in the W direction and the angle position in the θz direction, that is, a minute amount centered on the predetermined angle θ. An angle adjustment mechanism 205b for adjusting the angle is used.

  FIG. 4 is a schematic diagram of the mechanism 205a, in which the rigid body portions 501 and 502 are integrally coupled by two parallel hinges, and both end portions 503 of the hinges have curves (such as a sudden thickness change) (Circle shape as shown). Rigid bodies 501 and 502 can be moved relative to each other in the W direction. Reference numeral 504 denotes a sealed diaphragm, to which a pipe 505 for sending compressed gas is connected. The other side of the pipe 505 is connected to a servo pressure gauge (not shown). In addition, monitoring the output of the servo pressure gauge and feeding it back to the servo pressure gauge is also effective in stabilizing the pressure.

  The diaphragm 504 may be a drive source by incorporating a piezo as a substitute and connecting to an external control unit to control the drive voltage of the piezo.

  FIG. 5 is a schematic view of the mechanism 205b, in which the rigid body portions 511 and 512 are integrally coupled to each other at a portion 513, and the portion 513 has a curve (for example, a circular shape as illustrated) that does not have a sudden thickness change. It consists of The rigid body portions 511 and 512 can be relatively rotated around a portion 513. Reference numeral 514 denotes a sealed diaphragm, and a pipe 515 for sending compressed gas into the inside is connected to one side. The other end of the pipe 515 is connected to a servo pressure gauge (not shown).

  The diaphragm 514 may be a drive source by incorporating a piezo as a substitute and connecting to an external control unit to control the drive voltage of the piezo.

  Next, the adjustment operation of the inkjet head 217, which is one of the features of the present invention, will be specifically described.

  In the following description, “head” refers to the inkjet head 217. In addition, the following (1) to (3) are explanations of the operation principle regarding the alignment and adjustment of the substrate serving as the electron source substrate and the head. Based on this principle, the actual creation of the electron source substrate will be described in detail later in steps S11 to S22.

(1) How to make the head nozzle interval coincide with the substrate element electrode interval will be described.

  FIG. 6 is a relationship diagram between the nozzle spacing of the head and the device electrode spacing of the substrate.

  In FIG. 6, Lh represents the nozzle interval of the head, and Lp represents the target position (here, element electrodes) interval of the substrate. If the dimension Lh is the same as Lp, the head does not need to be tilted. However, since the element electrode interval is a dimension determined by the display resolution of the electron source substrate, there are a plurality of types, and therefore they generally do not match.

Therefore, in order to match the Lp dimensions of a plurality of types of electron source substrates, the head may be set so that the nozzle arrangement direction is inclined with respect to the scanning direction. In FIG. 6, the inclination of the nozzle arrangement direction with respect to the direction (Y) perpendicular to the scanning direction (X) is θ, and the relationship between Lh, Lp, and θ is Lp = n × Lh × cos θ.
It is. However, n is a positive integer. By appropriately setting n and the angle θ, it is possible to apply droplets to an electron source substrate having any element electrode interval.

  In this embodiment, using a head with Lh = 317.5 μm, in order to apply a droplet to a substrate with Lp = 615 μm, n = 2 and θ = 14.418 degrees tilted from the above formula. did.

  The head unit 109 to which the head is fixed is tilted at an angle θ = 14.418 degrees with respect to the main scanning direction of the substrate stage, and the head unit 109 and the stage on which the substrate is mounted are ejected from a plurality of nozzles while scanning relatively ( X direction here). Next, the position of the droplets discharged onto the substrate is measured, and the interval between adjacent droplets in the sub-scanning direction (the direction perpendicular to the main scanning direction, here the Y direction) of all droplets is It is calculated whether the element electrode interval coincides with or does not coincide. If they do not match, the angle of the head is adjusted by the angle adjusting mechanism 205b, and the discharge confirmation is repeated again.

When two heads are incorporated into a manufacturing apparatus, the two nozzles do not necessarily have the same nozzle spacing. The total nozzle interval of the head having 100 nozzles is 99 × 317.5 μm = 31.4325 mm.
It becomes. For example, if the dimensional tolerance of 31.4325 mm is set within ± 0.001 mm, it is apparent that the head is very expensive.

  In order to reduce the manufacturing cost of the head, it is an effective means to increase the manufacturing yield by making the dimensional tolerance of the total nozzle interval as wide as possible. Therefore, an angle adjustment mechanism for each head has been devised so that it can be used even with a dimensional tolerance of ± 50 μm.

  That is, in the apparatus configuration and the manufacturing method of the present invention, a mechanism for individually adjusting the head angle and a method capable of being individually adjusted according to the nozzle interval of each head in a plurality of heads are provided. is there.

  In this example, it was possible to converge to an allowable value by repeating three times.

  It is an effective means to measure in advance the performance of the angle adjusting mechanism 205b in the θz direction of the head unit 109, that is, how many times it rotates with respect to the driving pressure and to make a database.

(2) How to make the ejection position of the head coincide with the target position of the substrate will be described.

  (1) Analyze the measurement data of the liquid droplets obtained in the operation for matching the nozzle spacing of the head with the device electrode spacing of the substrate.

  If it is shifted in the main scanning direction with respect to a desired position in the X and Y directions of the droplet measurement data, the ejection timing may be adjusted. On the other hand, if it is shifted in the sub scanning direction, the head unit 109 is adjusted. The position adjusting mechanism 205a is adjusted.

  Since the head is inclined at an angle θ with respect to the main scanning direction, if the position adjustment mechanism 205a is adjusted, the discharge timing is shifted by the adjustment amount × sin θ, and it is necessary to take this into consideration.

  In addition, it is an effective means to measure in advance the performance of the mechanism 205a, that is, how many mm it moves with respect to the driving pressure, and make it a database. In the case of this example, it was able to be within the allowable value by repeating three times.

(3) A method of dealing with the nozzle ejection abnormality will be described.

  In this embodiment, using a head with Lh = 317.5 μm, in order to apply a droplet to a substrate with Lp = 615 μm, n = 2 and θ = 14.418 degrees tilted from the above formula. I have already said that. Here, n = 2 indicates that every other nozzle is discharged out of all the nozzles of the head.

  Therefore, after discharging droplets onto a plurality of substrates, the micrometer head 214 of the head unit 109 is turned to move the W-direction slider 204 to which the head is attached by about 310 μm, and the position adjustment mechanism 205a is used to make the minute amount. By properly adjusting the position, it was possible to discharge the droplet to the desired position on the substrate again by shifting the discharge nozzle by one.

  From this, it was proved that it is possible to use the nozzle by reselecting the nozzle to be ejected without replacing the head when there is a nozzle ejection abnormality.

  Next, a flow of a specific manufacturing method of the electron source substrate by the manufacturing apparatus of the present invention will be described with reference to FIG.

"Process S11"
A test substrate for adjusting the position and angle of the head is mounted on the XY stage of the manufacturing apparatus and vacuum suction is performed.

“Process S12”
The test substrate is scanned relative to the head (hereinafter, this scanning direction is assumed to be the X direction), and droplets are ejected from the plurality of nozzles of the head onto the test substrate.

"Process S13"
Measure the position in the X and Y directions of a plurality of droplets discharged and applied on the test substrate, and calculate the position in the W direction and the angle θ (angle in the nozzle alignment direction with respect to the Y direction) from the appropriate position of each liquid To calculate the amount to be corrected.

"Process S14"
The head position and angle are moved and fixed by the correction amount of the position and angle in the W direction calculated in the previous step. Depending on the position of the droplet, there are many cases in which the ejection timing must be further adjusted.

"Process S15"
Cut the vacuum and eject the test board.

  Steps S11 to S15 are steps for adjusting the position and angle of the head (including the ejection timing in some cases). When the head is attached to the manufacturing apparatus, the distance between the element electrodes on the electron source substrate is set. It must be done whenever it changes.

“Process S16”
The electron source substrate is mounted on the XY stage of the manufacturing apparatus and vacuum suction is performed.

  Steps S16 to S22 are steps for discharging and applying droplets to the substrate on which the electron source is created.

  In the following description, the substrate on which the electron source is created is simply referred to as a substrate.

"Process S17"
While the Z measurement optical system and the XY measurement optical system and the substrate are relatively scanned (X and Y directions), the position of the upper surface of the substrate is measured by the Z measurement optical system, and the XY measurement optical system is based on the measurement result. Is moved in the Z direction to bring the upper surface of the substrate into the focal range, and the displacement of the target position of the substrate in the X, Y, and θ directions is measured. As a preferred method, the XY measuring optical system reads the alignment mark on the substrate with a sensor such as a CCD, and the image information obtained there is analyzed by an image processing unit to measure the amount of deviation.

  This measurement may be performed with a plurality of marks using a plurality of measurement optical systems, or may be performed by moving the stage with a plurality of marks using one measurement optical system. Further, a pattern such as a device electrode may be read instead of the alignment mark.

"Process S18"
Based on the measurement result of the process, the deviation of the θ component is corrected by the θ adjustment mechanism of the XY stage, and the deviation in the X and Y directions is corrected by matching the position of the XY stage.

"Process S19"
In order to stabilize the ejection position and ejection amount of the head, preliminary ejection is performed a predetermined number of times in advance in a place where droplets can be ejected. As a dischargeable place, a preset area on the substrate, a set area outside the substrate on the stage, or a tray for receiving droplets to be discharged may be moved directly below the head. It is also an effective method to clean the head ejection surface by observing the surface condition of the head ejection surface, the adhesion of extra droplets, etc., and using the recovery function described later. Note that this step may be omitted if the ejection position and ejection amount of the head are stable.

“Process S20”
The substrate is scanned in one direction (for example, the X direction) relative to the Z measurement optical system and the XY measurement optical system, and the position of the target pattern on the substrate (positions in the X, Y, and Z directions orthogonal to each other) ). The target pattern to be measured is preferably a pattern of a plurality of locations selected in advance from all the patterns of element electrodes in the area where liquid droplets are ejected from the head in step S22. It is statistically determined that the location (number of locations) to be selected is based on the measurement results of a plurality of selected locations, and the positions of all element electrodes in the area fall within the set tolerance. It is possible to calculate that it is certain, and it is desirable that the number is necessary and sufficient.

"Process S21"
The substrate is moved stepwise relative to the head in a direction (Y direction) perpendicular to the scanning direction of step S20. The distance of step movement is a width dimension in which droplets are discharged from all the discharge nozzles.

"Process S22"
Based on the measurement results in the X, Y, and Z directions of the plurality of patterns measured in the step S20, the liquid droplet ejection position onto the substrate while scanning the head and the substrate relatively in one direction (X direction). The droplets are discharged from the head to a desired position on the substrate while controlling the above.

  Next, similarly to step S21, the substrate is moved stepwise relative to the head in a direction (Y direction) perpendicular to the scanning direction.

Next, as in step S20, the target position (position in the X, Y, and Z directions) of the area where the next droplet is to be applied is measured while the substrate is scanned in one direction relative to the head.
Thereafter, by repeating steps S20 to S22, the droplets are accurately ejected and applied to all desired areas on the substrate.

  Note that the present invention can be applied to a modified or modified embodiment without departing from the spirit of the present invention.

  In addition, it is preferable to add recovery means for the ink jet head, preliminary auxiliary means, and the like provided as the configuration of the manufacturing apparatus of the present invention, since the effects of the present invention can be further stabilized. Specifically, capping means, cleaning means, pressurizing or suction means for the ink-jet head, preheating means using an electrothermal converter or a heating element different from this, or a combination of these, original ejection It is also effective to perform a preliminary discharge mode different from that in order to perform stable discharge.

It is the schematic of the manufacturing apparatus of the electron source board | substrate which concerns on one Embodiment of this invention. It is the schematic of the head unit 109 mounted and used for the manufacturing apparatus of FIG. 3 is a schematic view of a high-precision positioning mechanism 205. FIG. It is the schematic which shows the position adjustment mechanism of the nozzle alignment direction of an inkjet head. It is the schematic which shows the angle adjustment mechanism of an inkjet head. FIG. 4 is a relationship diagram between a nozzle interval of a head and an element electrode interval of a substrate. It is a flowchart for demonstrating the manufacturing method of the electron source board | substrate of this invention. It is a schematic diagram which shows an example of the manufacturing method of the surface conduction electron-emitting device in the manufacturing method of the electron source board | substrate of this invention. It is a schematic diagram which shows an example of the surface conduction electron-emitting device manufactured by the manufacturing method of this invention. It is the figure which showed typically the element structure of the surface conduction type electron-emitting element in a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Substrate 12 Element electrode 13 Element electrode 14 Conductive thin film 15 Electron emission part 31 Droplet discharge head 32 Droplet 101 Main body surface plate 105 Y stage 107 X stage 108 Plate 109 Head unit 110 XY measurement optical system 111 Z measurement optical system 112 Z moving unit 113 Head moving unit 204 W direction slider 205 High-precision positioning mechanism 205a Position adjusting mechanism 205b Angle adjusting mechanism 214 Micrometer head 217 Inkjet head

Claims (3)

At least one of a substrate on which a plurality of element electrodes are arranged and a plurality of inkjet heads each having a plurality of nozzles is scanned in the main scanning direction relative to the other, and between the electrodes of the plurality of element electrodes A method of manufacturing an electron source substrate for applying droplets containing a material for a conductive thin film from the plurality of inkjet heads,
Disposing a plurality of inkjet heads having the plurality of nozzles on a substrate having a plurality of the pair of element electrodes,
An angle adjustment step of individually adjusting the angle of the nozzles in the plurality of inkjet heads in the sub-scanning direction perpendicular to the main scanning direction for each of the plurality of inkjet heads;
A position adjustment step of adjusting the positions of the substrate and the plurality of inkjet heads by moving the inkjet heads in the direction in which the nozzles are arranged ;
After each adjustment, while moving at least one of the substrate and the plurality of inkjet heads in the main scanning direction relative to the other, the plurality of nozzles of each inkjet head between the plurality of element electrodes Including a droplet applying step for applying a droplet,
And a step of reselecting a combination of nozzles for applying droplets from nozzles having ejection abnormalities to other nozzles by adjusting the position of the inkjet head in the nozzle arrangement direction. A method for manufacturing an electron source substrate. A mechanism for moving the inkjet head in the array direction of the nozzle using a piezoelectric element, wherein the position adjustment step, adjusting the ink jet head in the array direction of the nozzles by controlling the drive voltage of the piezoelectric element The method of manufacturing an electron source substrate according to claim 1. At least one of a substrate on which a plurality of element electrodes are arranged and a plurality of inkjet heads each having a plurality of nozzles is scanned in the main scanning direction relative to the other, and between the electrodes of the plurality of element electrodes A method for applying droplets containing a material for a conductive thin film from the plurality of inkjet heads,
Disposing a plurality of inkjet heads having the plurality of nozzles on a substrate having a plurality of the pair of element electrodes,
An angle adjustment step of individually adjusting the angle of the nozzles in the plurality of inkjet heads in the sub-scanning direction perpendicular to the main scanning direction for each of the plurality of inkjet heads;
A position adjustment step of adjusting the positions of the substrate and the plurality of inkjet heads by moving the inkjet heads in the direction in which the nozzles are arranged ;
After each adjustment, while moving at least one of the substrate and the plurality of inkjet heads in the main scanning direction relative to the other, the plurality of nozzles of each inkjet head between the plurality of element electrodes Including a droplet applying step for applying a droplet,
Further, a step of reselecting a combination of nozzles for applying droplets from a nozzle having an ejection abnormality to another nozzle by adjusting the position of the inkjet head in the direction in which the nozzles are arranged.
A droplet applying method comprising the step of:

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