JP4144552B2 - Electronic component bonding apparatus and bonding tool - Google Patents

Description

  The present invention relates to an electronic component bonding apparatus and bonding tool for bonding an electronic component such as a bumped electronic component such as a flip chip to a surface to be bonded such as an electrode of a substrate.

  As a method for bonding an electronic component to a surface to be bonded such as an electrode of a substrate, a method using ultrasonic pressure welding is known. In this method, ultrasonic vibration is applied to the electronic component while pressing the electronic component against the surface to be joined, and the joining surface is brought into close contact by causing the joining surface to vibrate minutely to generate friction. The bonding tool used in this method has a horn that is an elongated rod body that transmits the vibration of an ultrasonic vibrator, which is a vibration generation source, to an electronic component. While applying a load and vibration to the component, the electronic component is bonded to the surface to be bonded by bonding. Because the load (load and vibration) during bonding acts on the crimper, its lower surface (the suction surface of the electronic component) is likely to wear due to repeated use. If this wear becomes excessive, normal bonding cannot be performed, and the crimper must be periodically replaced. Conventionally, the replacement of the crimper has been performed by replacing the entire horn or, if the crimper is a separate part that can be attached to and detached from the horn body, only this separate part is replaced.

  However, when the entire horn is replaced, the horn, which is an expensive part, is discarded as a consumable part, and the running cost increases. In addition, even when only attaching and detaching the crimper, with conventional bonding tools, it is difficult to reproduce the stable fixing state due to the method of fastening the crimper to the horn body, Therefore, there is a problem that vibration characteristics are likely to fluctuate and stable bonding cannot be performed.

  Accordingly, an object of the present invention is to provide an electronic component bonding apparatus and a bonding tool capable of performing stable bonding while performing stable vibration at low cost.

  The bonding apparatus according to claim 1 is a bonding apparatus for an electronic component that presses the electronic component against a surface to be bonded while applying a load and vibration to the electronic component, the bonding tool contacting the electronic component, and the bonding tool Pressing means for pressing the tool against the electronic component, the bonding tool includes a horizontally long horn, a vibrator for applying vibration to the horn, and a position corresponding to an antinode of standing wave vibration of the horn. A through hole provided perpendicular to the length direction of the horn, a crimping member that is detachably fastened to the horn by a fastening means that is inserted through the through hole, and a crimping member whose tip is in contact with the electronic component; A mounting portion that is symmetrically projected in plan view as a center, and a suction hole that vacuum-sucks electronic components is provided at the tip of the crimper. Atchakuko communicating with a vacuum suction hole provided in the horn at the connected state to the horn.

A bonding apparatus for an electronic component according to claim 2 is a bonding tool for pressing the electronic component against a surface to be bonded while applying a load and vibration to the electronic component, and applies a vibration to the horn and the horn. The horn is detachable from the horn by a vibrator, a through hole provided at a position corresponding to the antinode of the standing wave vibration of the horn and perpendicular to the length direction of the horn, and a fastening means inserted through the through hole. A crimping element that is fastened and abutted against the electronic component and presses the electronic component; and a mounting part that is symmetrically projected in plan view with the crimping element as a center, and the distal end of the crimping element The part is provided with a suction hole for vacuum-sucking the electronic component, and this suction hole communicates with a vacuum suction hole provided in the horn in a state where the crimping member is fastened to the horn.

  The present invention provides a through hole perpendicular to the length direction of the horn at a position corresponding to the antinode of standing wave vibration of the horn, and is detachably fastened to the horn by a fastening means inserted through the through hole. A crimper that abuts on the electronic component, a mounting portion that is symmetrically projected in plan view with the crimper as the center, and a suction hole that vacuum-sucks the electronic component at the tip of the crimper are provided. Since the suction hole communicates with the vacuum suction hole provided in the horn in a state where the crimper is connected to the horn, the electronic component can be bonded while maintaining a stable fixing state and vibration characteristics.

  Next, embodiments of the present invention will be described with reference to the drawings. 1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention, FIG. 2 is a vertically inverted perspective view of the bonding tool for the electronic component, FIG. 3 is a front view of the bonding tool for the electronic component, and FIG. (A), (b), FIG. 5 (a), (b), FIG. 6 (a), (b) is a fragmentary sectional view of the bonding tool of the electronic component.

  First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, and a first elevating plate 2 and a second elevating plate 3 are provided on the front surface thereof so as to be movable up and down. A cylinder 4 is mounted on the first lifting plate 2, and its rod 5 is coupled to the second lifting plate 3. A bonding head 10 is attached to the second lifting plate 3. A Z-axis motor 6 is provided on the upper surface of the support frame 1. The Z-axis motor 6 rotates a vertical feed screw 7. The feed screw 7 is screwed into a nut 8 provided on the back surface of the first lifting plate 2. Therefore, when the Z-axis motor 6 is driven and the feed screw 7 rotates, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3 also move up and down.

  In FIG. 1, a substrate 46 whose upper surface is a surface to be joined of an electronic component is placed on a substrate holder 47, and the substrate holder 47 is placed on a table 48. The table 48 is a movable table, and horizontally moves the substrate 46 in the X direction or the Y direction to position the substrate 46 at a predetermined position. The table 48 serves as positioning means for moving the substrate 46 relative to the electronic component 40.

  Reference numeral 42 denotes a camera, which is mounted on the uniaxial table 43. Reference numeral 44 denotes a lens barrel extending forward from the camera 42. An electronic component with a bump such as a flip chip, for example, as a bonded article that is moved forward along the uniaxial table 43 and the tip of the lens barrel 44 is adsorbed and held on the lower surface of the bonding tool 14 as indicated by a chain line The position of the electronic component 40 and the substrate 46 is observed by the camera 42 in this state.

  A recognition unit 53 recognizes images of the electronic component 40 and the board 46 captured by the camera 42 and detects their positions. Reference numeral 50 denotes a main control unit which controls the raising / lowering operation of the Z-axis motor 6, that is, the bonding head 10 through the motor driving unit 51, and positions the table 48, that is, the substrate 46 through the table control unit 52. Further, the main control unit 50 calculates a positional shift between the electronic component 40 and the substrate 46 detected by the recognition unit 53 in the horizontal plane, and drives the table 48 so as to correct the positional shift. Further, a load control unit 54 and a suction device 56 are connected to the main control unit 50.

  The cylinder 4 as the pressing means is connected to the main control unit 50 via the load control unit 54, and a pressing load that presses the bumped electronic component 40 against the substrate 46 by the bonding output 14 of the rod 5 of the cylinder 4. Be controlled. The suction device 56 performs suction / release of suction of the electronic component 40 by the bonding tool 14 according to a command from the main control unit 50. The vibrator 17 including an ultrasonic vibrator is connected to the main control unit 50 via the ultrasonic vibrator driving unit 55 and performs ultrasonic vibration in accordance with a command from the main control unit 50.

  A holder 12 is coupled to the lower end of the main body 11 of the bonding head 10. A block 13 is attached to the holder 12, and a bonding tool 14 is fixed to the block 13. The protrusion 13 a on the side of the block 13 is connected to the suction device 56. Hereinafter, the bonding tool 14 will be described with reference to FIGS. 2, 3, and 4.

  As shown in FIGS. 2, 3, and 4, the bonding tool 14 mainly includes a horizontally long horn 15. The horn 15 is an elongated rod-like body, and has a tapered surface 15a that becomes gradually narrower from both side portions toward the center in a plan view. At the center of the horn 15, an adsorbing portion 30 (crimper) is attached. The adsorbing portion 30 has a cross-sectional shape whose width is narrowed by a stepped portion 31, and an adsorbing hole 32 is provided at a tip portion protruding downward (in an upward direction in FIG. 2). The suction hole 32 communicates with a vacuum suction hole 30 c formed inside the suction part 30, and communicates with a vacuum suction hole 16 a provided inside the horn 15 when the suction part 30 is fastened to the horn 15. . The vacuum suction hole 16 a further communicates with a vacuum suction hole 16 c opened on the upper surface of the horn 15 via a vacuum suction hole 16 b inside the horn 15.

  In FIG. 1, a suction pad 19 is attached to a protrusion 13 a provided on the side surface of the block 13, and the suction pad 19 is in contact with a vacuum suction hole 16 c on the upper surface of the horn 15. Accordingly, by driving the suction device 56 (FIG. 1) connected to the suction pad 19 and sucking air, it opens at the tip of the suction portion 30 through the vacuum suction holes inside the horn 15 and the suction portion 30. Vacuum suction is performed through the suction holes 32 (FIG. 3), and the electronic component 40 with bumps can be vacuum-sucked and held on the lower surface of the suction portion 30 (see also FIG. 4B). The adsorbing unit 30 adsorbs and holds the electronic component 40, and at the time of bonding, the tip portion contacts the upper surface of the electronic component 40 and presses the electronic component 40 against the substrate 46.

  Ribs 15 b are provided integrally with the horn 15 at four locations that are equidistant from the suction portion 30. In order to improve the mounting balance to the block 13, the four ribs 15 b are projected symmetrically in plan view with the suction portion 30 at the center of the horn 15 as the center. The bonding tool 14 is detachably mounted on the lower surface of the block 13 by screwing a bolt into the through hole 20 formed in the rib 15b. That is, the rib 15 b is a mounting portion for mounting the horn 15 to the block 13.

  In FIG. 2, a vibrator 17 that is a vibration applying unit is attached to a side end of the horn 15. By driving the vibrator 17, longitudinal vibration (vibration in the longitudinal direction of the horn 15) is applied to the horn 15, and the suction unit 30 vibrates in the horizontal direction a (longitudinal direction of the horn 15). The shape of the horn 15 is such that the width is sequentially reduced from both end portions toward the central portion through the side tapered surface 15a. As a result, the amplitude of the ultrasonic vibration is amplified in the path transmitted from the vibrator 17 to the suction unit 30, and vibration larger than the amplitude oscillated by the vibrator 17 is transmitted to the suction unit 30. Is transmitted to.

Next, with reference to FIG. 4, the attachment of the suction part 30 to the horn 15 will be described. As shown in FIG. 4A, a through hole 15c is provided at the center of the horn 15 in the vertical direction. The through-hole 15c is provided at a position corresponding to the antinode of standing wave vibration induced by the vibrator 17 in the horn 15 so as to be orthogonal to the length direction of the horn 15, and is tapered below the through-hole 15c. Surface 1
A recess having 5d is formed. The vacuum suction hole 16a opens in the tapered surface 15d.

  Screw holes 30b are provided on the upper surface of the suction portion 30 corresponding to the positions of the through holes 15c, and contact surfaces 30a having shapes corresponding to the tapered surfaces 15d are formed on both sides of the screw holes 30b. The vacuum suction hole 30a opens in the contact surface 30a. As shown in FIG. 4B, in the mounted state of the suction portion 30, the bolt 33 is inserted into the through hole 15c with the contact surface 30a in contact with the tapered surface 15d, and the bolt 33 is inserted into the screw hole 30b. The suction part 30 is fastened to the horn 15 by screwing. By pulling out the bolt 33, the fastening of the suction part 30 is released. Accordingly, the bolt 33 serves as a fastening means for detachably fastening the suction portion 30 to the horn 15.

  By adopting the fastening method as described above, excellent effects as described below can be obtained. First, in the above fastening method, the abutting portion 30a is pressed against the tapered surface 15d by pulling up the suction portion 30 from the upper side of the horn 15 with the bolt 33 inserted through the through hole 15c. For this reason, it is not necessary to arrange components for fastening to the horn 15 around the suction portion 30, and a degree of freedom in securing the shape of the suction portion 30 and the arrangement of the vacuum suction holes is ensured. The suction part 30 adapted to the shape of the electronic component and the required vibration characteristics can be realized, and a stable fixing state can be realized by pressing the suction part 30 against the horn 15 with a sufficient surface pressure.

  Furthermore, by appropriately setting the shape and size of the portion of the bolt 33 that protrudes above the horn 15, it is possible to adjust the vertical mass distribution of the horn 15 to a desirable mass distribution for vibration transmission. That is, this protruding portion can be used as a mass balance portion, and thereby good vibration characteristics can be obtained.

  5 and 6 show examples of other mounting methods of the suction part. FIG. 5 is for fastening a suction portion 30 'similar to the suction portion 30 shown in FIG. 4 with a combination of bolts and nuts. In FIG. 5 (a), a bolt 34 is integrally formed on the suction portion 30 ', and when the suction portion 30' is mounted, the bolt 34 is lowered to the through hole 15c as shown in FIG. 5 (b). From the top of the horn 15. Then, the suction portion 30 is fastened to the horn 15 by screwing and tightening the nut 35 to the bolt 34. In this example, the same effect as described above can be obtained. In this case, the nut 35 can be used as a mass balance part.

  FIG. 6 shows an arrangement example of vacuum suction holes communicating with the suction holes 32. In FIG. 6A, the suction part 37 has a form in which the vacuum suction hole 30c is removed from the suction part 30 shown in FIG. 4, and the fastening screw hole 37 and the contact surface 37a are provided in the same manner as the suction part 30. Have. The suction portion 37 is fastened by a bolt 36 inserted through the through hole 15c, and cross-shaped suction holes 36b and 36c are provided inside the shaft portion 36a of the bolt 36. A ring groove 15e is provided in the middle of the through hole 15c, and the ring groove 15e communicates with the vacuum suction hole 16d inside the horn 15.

  When the contact surface 37a is brought into contact with the tapered surface 15d of the recess provided below the through hole 15c and the bolt 36 is screwed into the screw hole 37b as shown in FIG. 6B, the contact surface 37a. Is pressed against the tapered surface 15 d and the suction portion 37 is fastened to the horn 15. In this state, the suction hole 36b of the bolt 36 communicates with the ring groove 15e. Therefore, by sucking vacuum from the vacuum suction hole 16d, the suction part 37 holds the electronic component 40 in the suction hole 32 at the tip part by vacuum suction. Also in this example, the same effect as the above-described adsorption unit 30 can be obtained.

  As described above, the bonding tool of the present embodiment makes the suction part as a crimper that contacts the electronic component and transmits vibration and load detachable with respect to the horn body, and also the suction part to the horn. A fastening method that does not require a fastening mechanism or member on the mounting surface is adopted. Thereby, when the contact surface of the suction part with the electronic component is worn out, it is only necessary to replace this suction part, and the running cost can be reduced. In addition, according to the above fastening method, the degree of freedom in setting the shape and dimensions of the suction portion is ensured, so that a bonding tool having a stable fixed state and vibration characteristics can be realized.

  The present invention provides a through hole perpendicular to the length direction of the horn at a position corresponding to the antinode of standing wave vibration of the horn, and is detachably fastened to the horn by a fastening means inserted through the through hole. A crimper that abuts on the electronic component, a mounting portion that is symmetrically projected in plan view with the crimper as the center, and a suction hole that vacuum-sucks the electronic component at the tip of the crimper are provided. Since the suction hole communicates with the vacuum suction hole provided in the horn with the crimper connected to the horn, if the crimper is worn out by use, it is only necessary to replace the crimper. In addition, it is possible to perform bonding of electronic components while maintaining a stable fixing state and vibration characteristics, and it is useful as an electronic component bonding apparatus and bonding tool.

1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention. 1 is an upside-down inverted perspective view of a bonding tool for electronic components according to an embodiment of the present invention. 1 is a front view of an electronic component bonding tool according to an embodiment of the present invention. (A) Partial sectional view of a bonding tool for electronic components according to an embodiment of the present invention (b) Partial sectional view of a bonding tool for electronic components according to an embodiment of the present invention (A) Partial sectional view of a bonding tool for electronic components according to an embodiment of the present invention (b) Partial sectional view of a bonding tool for electronic components according to an embodiment of the present invention (A) Partial sectional view of a bonding tool for electronic components according to an embodiment of the present invention (b) Partial sectional view of a bonding tool for electronic components according to an embodiment of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 14 Bonding tool 15 Horn 15c Through-hole 16a, 16b, 16c Vacuum suction hole 17 Vibrator 30, 30 ', 37 Adsorption part 32 Adsorption hole 33, 36 Bolt 40 Electronic component 46 Substrate

Claims (2)

  An electronic component bonding apparatus that presses an electronic component against a surface to be bonded while applying a load and vibration to the electronic component, a bonding tool that contacts the electronic component, and a pressure that presses the bonding tool against the electronic component The bonding tool includes a horizontally long horn, a vibrator for applying vibration to the horn, and a position corresponding to the antinode of standing wave vibration of the horn, perpendicular to the length direction of the horn. A through-hole provided, a crimper that is detachably fastened to the horn by a fastening means that passes through the through-hole, and a tip that abuts against the electronic component; and a symmetrical projection in plan view about the crimper And a suction hole for vacuum-sucking electronic components at the tip of the crimper. The suction hole is connected to the horn in a state where the crimper is connected to a horn. Bonding apparatus of electronic components, characterized in that communicating with the vacuum suction holes provided in the emissions. A bonding tool for crimping an electronic component to a surface to be bonded while applying a load and vibration to the electronic component, a horizontally long horn, a vibrator for applying vibration to the horn, and a standing wave vibration of the horn A through hole provided perpendicular to the length direction of the horn at a position corresponding to the belly and a fastening means for inserting the through hole are detachably fastened to the horn so that a tip portion contacts the electronic component. A crimping member that presses the electronic component, and a mounting portion that protrudes symmetrically in plan view with the crimping member as the center, and a suction hole that vacuum-sucks the electronic component is provided at the tip of the crimping member The electronic component bonding tool is characterized in that the suction hole communicates with a vacuum suction hole provided in the horn in a state where the crimper is fastened to the horn.

Images