JP4149735B2 - Rotating tool mounting method and machining apparatus with rotating tool - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of attaching a rotary tool such as a cutting blade for cutting a workpiece such as a semiconductor wafer to a mounter mounted on a rotary spindle, and a processing apparatus provided with the rotary tool.
[0002]
[Prior art]
In the manufacturing process of a semiconductor device, circuits such as ICs and LSIs are formed in a large number of regions arranged in a lattice pattern on the surface of a semiconductor wafer having a substantially disk shape, and each region where the circuits are formed is designated as a predetermined region. Individual semiconductor chips are manufactured by cutting along cutting lines called streets. A cutting apparatus that cuts a semiconductor wafer along a cutting line moves a semiconductor wafer as required by rotating a circular cutting blade mounted on a rotary spindle at about 30000 to 60000 rpm while relatively moving along the cutting line. To cut. The cutting blade is composed of a base having a mounting hole at the center of rotation and a cutting blade attached to the outer periphery of the base, and is attached to a mounter attached to the rotary spindle. The mounter includes a tool support portion and a flange portion formed in a radial direction at the rear end of the tool support portion. After fitting the mounting hole of the rotary tool to the tool support portion of the mounter, the rotary tool is flanged. Attach the rotating tool to the mounter by fixing it to the part. In this way, the cutting blade attached to the mounter mounted on the rotating spindle is adjusted in advance so that the rotating balance does not break even if the cutting blade is attached to the mounter and rotates at a high speed of 30000 to 60000 rpm. .
[0003]
[Problems to be solved by the invention]
Therefore, the rotary tool needs to be easily attached to and detached from the mounter mounted on the rotary spindle. For this reason, the inner diameter of the mounting hole provided in the base of the rotary tool is larger than the outer diameter of the tool support portion of the mounter. It is formed large by about 5 to 10 μm. Accordingly, when a mounting hole provided in the base of the rotary tool is fitted into the tool support portion of the mounter, a deviation of about 5 to 10 μm occurs between the rotation center of the mounter, that is, the rotary spindle and the rotation center of the rotary tool. As a result, since the rotary tool is fixed to the mounter in a state where the rotation center of the rotary spindle and the rotation center of the rotary tool are misaligned, the rotational balance of the rotary tool assembly is lost, and the cutting accuracy of the workpiece is reduced. Cause. In addition, when a semiconductor wafer is cut as a work piece in a state where the rotational balance of the rotary tool is lost, there is a problem that many chips are generated on both sides of the cutting groove, and the quality of the semiconductor chip is significantly reduced.
[0004]
The present invention has been made in view of the above-mentioned fact, and the main technical problem thereof is that a rotary tool having a base having a mounting hole that fits into a tool support portion of a mounter mounted on a rotary spindle is mutually connected. An object of the present invention is to provide a mounting method of a rotary tool and a processing apparatus provided with the rotary tool, which can be mounted with their rotation centers coincident.
[0005]
[Means for Solving the Problems]
In order to solve the above-mentioned main technical problem, according to the present invention, a mounter having a tool support portion mounted on a rotary spindle and a flange portion formed to protrude radially from the rear end of the tool support portion is provided with a base A method of attaching a rotary tool having a mounting hole at the center of rotation of
The mounting hole provided in the base of the rotary tool is fitted into the tool support of the mounter, and the tool support of the mounter is heated to expand or the base of the rotary tool is By cooling and shrinking, the outer peripheral surface of the tool support portion of the mounter and the inner peripheral surface of the mounting hole provided in the base of the rotary tool are brought into close contact with each other, and the base of the rotary tool in the close contact state Is fixed to the flange portion of the mounter,
There is provided a method of mounting a rotary tool characterized by the above.
[0006]
According to the present invention, there is provided a rotating spindle, a mounter mounted on the rotating spindle, a tool support portion, and a flange portion that is formed to project radially from the rear end of the tool support portion, and the mounter A rotary tool having a base with a mounting hole that fits into the tool support, and after fitting the mounting hole provided in the base of the rotary tool to the tool support of the mounter In a processing apparatus provided with a rotary tool configured to fix the base of the rotary tool to the flange portion of the mounter,
Heating means including a heater having a fitting portion that is detachably fitted to the tool support portion of the mounter, and cooling having a fitting portion that is detachably fitted to a part of the base of the rotary tool Having both or one of the cooling means with a vessel,
The processing apparatus provided with the rotating tool characterized by the above is provided.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a preferred embodiment of a method for attaching a rotary tool and a processing apparatus provided with a rotary tool according to the present invention will be described in detail with reference to the accompanying drawings.
[0008]
FIG. 1 is a perspective view of a cutting device as a processing device configured according to the present invention.
The cutting device in the illustrated embodiment includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 for holding a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction. The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 mounted on the suction chuck support 31, and is a workpiece on a mounting surface that is a surface of the suction chuck 32. For example, a disk-shaped semiconductor wafer is held by suction means (not shown). The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown).
[0009]
The cutting apparatus in the illustrated embodiment includes a spindle unit 4 as cutting means. The spindle unit 4 is mounted on a moving base (not shown) and is adjusted to move in a direction indicated by an arrow Y that is an indexing direction and a direction indicated by an arrow Z that is a cutting direction. A rotary spindle 42 that is supported and rotated by a rotary drive mechanism (not shown), and a cutting blade 43 that is a rotary tool mounted on the rotary spindle 42 are provided. The details of the cutting blade 43 and the mounting structure for mounting the cutting blade 43 on the rotary spindle 42 will be described later.
[0010]
The cutting apparatus in the illustrated embodiment images the surface of the workpiece held on the surface of the suction chuck 32 constituting the chuck table 3, detects the region to be cut by the cutting blade 43, and cuts the groove. An image pickup mechanism 6 for confirming the state of is provided. The imaging mechanism 6 is composed of optical means such as a microscope and a CCD camera. In addition, the cutting apparatus includes a display unit 11 that displays an image captured by the imaging mechanism 10.
[0011]
The cutting apparatus in the illustrated embodiment includes a cassette 12 for stocking a semiconductor wafer 13 as a workpiece. The semiconductor wafer 13 is supported by a tape 15 on an annular support frame 14 formed of a metal material such as stainless steel, and is accommodated in the cassette 12 while being supported by the support frame 14. The cassette 12 is placed on a cassette table 121 arranged so as to be movable up and down by lifting means (not shown).
[0012]
The cutting apparatus in the illustrated embodiment is a workpiece that carries a semiconductor wafer 13 (a state supported by a tape 15 on a support frame 14) as a workpiece housed in a cassette 12 to a workpiece placement region 16. The unloading means 17, the workpiece conveying means 18 for conveying the semiconductor wafer 13 unloaded by the workpiece unloading means 17 onto the chuck table 3, and the semiconductor wafer 9 cut by the chuck table 3 are cleaned. A cleaning means 19 and a cleaning / conveying means 20 for conveying the semiconductor wafer 13 cut by the chuck table 3 to the cleaning means 19 are provided.
[0013]
Next, the processing operation of the above-described cutting apparatus will be briefly described.
A semiconductor wafer 13 supported by a support frame 14 accommodated in a predetermined position of the cassette 12 via a tape 15 (hereinafter, the semiconductor wafer 13 supported by the support frame 14 with the tape 15 is simply referred to as a semiconductor wafer 13). ) Is positioned at the carry-out position when the cassette table 121 is moved up and down by a lifting means (not shown). Next, the workpiece unloading means 17 moves forward and backward to unload the semiconductor wafer 13 positioned at the unloading position to the workpiece placement region 16. The semiconductor wafer 13 carried out to the workpiece mounting area 16 is transported to the mounting surface of the chucking chuck 32 constituting the chuck table 3 by the turning motion of the workpiece transporting means 18 and sucked by a suction means (not shown). The suction chuck 32 is held by suction by the action. The chuck table 3 that sucks and holds the semiconductor wafer 13 in this way is moved to a position immediately below the imaging mechanism 10. When the chuck table 3 is positioned immediately below the image pickup mechanism 10, a cutting line formed on the semiconductor wafer 13 is detected by the image pickup mechanism 10, and is moved and adjusted in the arrow Y direction that is the indexing direction of the spindle unit 4 to be precisely positioned. Matching work is performed.
[0014]
Thereafter, while the cutting blade 43 is cut and fed in a predetermined amount by the method indicated by the arrow Z and rotated in a predetermined direction, the chuck table 3 holding the semiconductor wafer 13 is sucked and held in the direction indicated by the arrow X (cutting blade 43). The semiconductor wafer 13 held on the chuck table 3 is cut along a predetermined cutting line (street) by the cutting blade 43 by moving at a predetermined cutting feed rate in a direction orthogonal to the rotation axis of the magnetic head. That is, the cutting blade 43 is mounted on the spindle unit 4 that is moved and adjusted in the direction indicated by the arrow Y that is the indexing direction and the direction indicated by the arrow Z that is the cutting direction, and is rotationally driven. Is moved in the cutting feed direction along the lower side of the cutting blade 43, the semiconductor wafer 13 held on the chuck table 3 is cut along the predetermined cutting line by the cutting blade 43. When cut along the cutting line, the semiconductor wafer 13 is divided into individual semiconductor chips. The divided semiconductor chips are not separated by the action of the tape 15, and the state of the semiconductor wafer 13 supported by the frame 14 is maintained. After the semiconductor wafer 13 has been cut in this way, the chuck table 3 holding the semiconductor wafer 13 is first returned to the position where the semiconductor wafer 13 is sucked and held. Here, the suction action of a suction means (not shown) is cut off. The suction holding of the semiconductor wafer 13 is released. Next, the semiconductor wafer 13 is transported to the cleaning means 19 by the cleaning transport means 20, where it is cleaned and dried. The semiconductor wafer 13 that has been cleaned and dried in this way is carried out to the workpiece placement region 16 by the workpiece conveyance means 18. Then, the semiconductor wafer 13 is stored in a predetermined position of the cassette 12 by the workpiece unloading means 17.
[0015]
Next, the cutting blade 43 and a mounting structure for mounting the cutting blade 43 to the rotary spindle 42 will be described with reference to FIGS.
The cutting blade 43 is a so-called hub blade composed of a disk-shaped base 431 and a cutting edge 432 disposed on the outer peripheral portion of one side surface of the base 431. The base 431 is made of aluminum, and a mounting hole 433 is provided at the center of rotation of the base 431. The mounting hole 433 is fitted into a tool support portion of a mounter described later. The cutting edge 432 is formed to have a thickness of about 15 μm by fixing diamond abrasive grains having a particle size of about 3 μm by electroforming, for example.
[0016]
The rotary spindle 42 to which the above-described cutting blade 43 is attached is disposed so that the tip portion protrudes from the tip of the spindle housing 41. A tapered mounter mounting portion 421 whose outer diameter gradually decreases toward the tip is provided at the tip of the rotating spindle 42, and a cylindrical nut screwing portion 422 is provided at the tip of the mounter mounting portion 421. A male screw 422a is formed on the outer peripheral surface of the nut screwing portion 422. The mounter 5 is mounted on a mounter mounting portion 421 provided at the tip of the rotary spindle 42. The mounter 5 is made of a metal material such as stainless steel, and is provided on the tip side of the tool support 51 and a tool support 51 that fits into a mounting hole 433 provided on the base 431 of the cutting blade 43. It consists of a nut screwing portion 52 and a flange portion 53 formed so as to protrude in the radial direction from the rear end of the tool support portion 51. The tool support 51 has a cylindrical outer peripheral surface, and its outer diameter is smaller than the inner diameter of the mounting hole 433 provided in the base 431 of the cutting blade 43 by about 5 to 10 μm at room temperature. The nut screwing portion 52 has an outer diameter substantially the same as the outer diameter of the tool support portion 51, and a male screw 52a is formed on the outer peripheral surface thereof. An annular support surface 53 a is formed on the front surface of the outer peripheral portion of the flange portion 53. At the center of the mounter 5, a mounting hole 54 is provided for fitting into a mounter mounting portion 421 provided at the tip of the rotary spindle 42. The mounting hole 54 is formed in a tapered shape corresponding to the taper of the mounter mounting portion 421. The mounter 5 configured as described above is configured by fitting the mounting hole 54 into the mounter mounting portion 421 of the rotary spindle 42 and then screwing the fixing nut 6 into the male screw 422a of the nut screwing portion 422 as shown in FIG. As shown in FIG.
[0017]
As described above, the cutting blade 43 is attached to the mounter 5 mounted on the rotary spindle 42. That is, the cutting blade 43 is configured by fitting a mounting hole 433 provided in the base 431 to the tool support portion 51 of the mounter 5 and then screwing the fixing nut 7 into the male screw 52a of the nut screwing portion 52. As shown in FIG. 4, it is clamped between the support surface 53a (see FIG. 3) of the flange portion 53 of the mounter 5. In this way, a slight deviation occurs between the rotation center of the cutting blade 43 attached to the mounter 5 and the rotation center of the mounter 5, that is, the rotation spindle 42. That is, the outer diameter of the tool support portion 51 of the mounter 5 is formed to be about 5 to 10 μm smaller than the inner diameter of the mounting hole 433 provided in the base 431 of the cutting blade 43. In a state of being fitted at room temperature, a deviation of about 5 to 10 μm occurs between the rotation center of the cutting blade 43 and the rotation center of the mounter 5, that is, the rotation spindle 42.
[0018]
The present invention relates to the rotation center of the cutting blade 43 and the rotation of the mounter 5, that is, the rotating spindle 42, which are generated when the mounting hole 433 provided in the base 431 of the cutting blade 43 is fitted to the tool support 51 of the mounter 5 at room temperature. After correcting the deviation from the center, the fixing nut 6 is screwed into the male screw 52 a of the nut screwing portion 52 to fix the cutting blade 43 to the mounter 5. That is, in a state where the mounting hole 433 provided in the base 431 of the cutting blade 43 is fitted to the tool support 51 of the mounter 5 at normal temperature, the tool support 51 of the mounter 5 is heated or the base of the cutting blade 43 is mounted. By cooling 431, the tool support 51 is expanded to increase its outer diameter or the base 431 is contracted to reduce the inner diameter of the mounting hole 433, thereby reducing the outer peripheral surface of the tool support 51 and the mounting hole 433. The inner peripheral surface of is closely attached. As described above, by bringing the outer peripheral surface of the tool support portion 51 into close contact with the inner peripheral surface of the mounting hole 433, the deviation between the rotation center of the cutting blade 43 and the rotation center of the mounter 5, that is, the rotation spindle 42 is corrected. In this state, the fixing nut 7 is screwed into the male screw 52 a of the nut screwing portion 52, and the cutting blade 43 is clamped and fixed between the flange portion 53 of the mounter 5. Therefore, the cutting blade 43 can be mounted with its rotation center aligned with the rotation center of the mounter 5, that is, the rotation spindle 42. In order to effectively execute the correction, it is desirable to heat the tool support 51 of the mounter 5 and cool the base 431 of the cutting blade 43.
[0019]
The cutting device in the illustrated embodiment heats the tool support portion 51 of the mounter 5 and cools the base 431 of the cutting blade 43 when attaching the cutting blade 43 to the mounter 5 as described above. As shown in FIG. 1, a heating means 8 and a cooling means 9 disposed on the front wall 21 of the apparatus housing 2 are provided.
The heating means 8 includes a heater 81 and a conductive wire cord 82 that connects the heater 81 to a power supply means (not shown). As shown in FIG. 5, the heater 81 includes a main body 811 having a fitting concave portion 811 a that fits the tool support portion 51 and the nut screwing portion 52 of the mounter 5, and an inner portion of the fitting concave portion 811 a of the main body 811. A thermo module 812 using a plurality of pairs of thermoelectric semiconductor elements disposed along the wall surface and having the Peltier effect is provided. The heater 81 is disposed on the front wall 21 of the apparatus housing 2 by engaging a fitting recess 811a formed in the main body 811 with a hook (not shown) mounted on the front wall 21 of the apparatus housing 2. The Here, a thermo module using a thermoelectric semiconductor element will be described. A thermo module using a thermoelectric semiconductor element includes P-type semiconductor elements (bismuth, tellurium, antimony crystals) and N-type semiconductor elements (bismuth, tellurium, selenium crystals) alternately arranged, and adjacent P-type semiconductor elements. And a lead wire connected to the P-type semiconductor element by connecting a positive (+) voltage of a DC power source to the lead wire connected to the N-type semiconductor element. By applying a minus (−) voltage to the Peltier effect, one of the semiconductor elements is cooled and the other is heated. The structure of such a thermo module itself is well known, and further description is omitted. The heat generating side of the above-described thermo module is disposed as the fitting recess 811a formed in the main body 811 of the heater 81, and a voltage is applied to the thermo module 812 from the power supply means (not shown) through the conductive wire cord 82. Thus, it can function as a heater.
[0020]
A usage example of the heating means 8 will be described.
As described above, when the cutting blade 43 is attached to the mounter 5, the mounting hole 433 provided in the base 431 of the cutting blade 43 is fitted to the tool support portion 51 of the mounter 5 attached to the tip end portion of the spindle 42. After that, as shown by a two-dot chain line in FIG. 5, the fitting concave portion 811 a formed in the main body 811 of the heater 81 constituting the heating means 8 is fitted into the tool support portion 51 and the nut screwing portion 52 of the mounter 5. To do. A voltage is applied to the thermo module 812 constituting the heater 81 from a power supply unit (not shown) through the conductive wire cord 82. As a result, the fitting recess 811a side of the thermo module 812 generates heat and the tool support portion 51 of the mounter 5 is heated. Then, by heating for an appropriate time, the tool support 51 of the mounter 5 expands and its outer peripheral surface comes into close contact with the inner peripheral surface of the mounting hole 433 of the base 431 of the cutting blade 43, so that the cutting blade 43 The deviation between the rotation center and the rotation center of the mounter 5, that is, the rotation spindle 42 is corrected. In this corrected state, the fixing nut 7 is screwed into the male screw 52 a of the nut screwing portion 52, and the cutting blade 43 is clamped and fixed between the mounter 5. Therefore, the cutting blade 43 can be mounted with its rotation center aligned with the rotation center of the mounter 5, that is, the rotation spindle 42. In the illustrated embodiment, the thermo module 812 using a thermoelectric semiconductor element is used as the heat generating means of the heating means 8, but a heat generating coil that generates heat when voltage is applied is used as the heat generating means. May be.
[0021]
Next, the cooling means 9 will be described with reference to FIGS.
The cooling means 9 includes a cooler 91 and a conductive wire cord 92 that connects the cooler 91 to a power supply means (not shown). As shown in FIG. 6, the cooler 91 includes a main body 911 having a fitting hole 911 a that fits into a boss portion 431 a of the base 431 of the cutting blade 43, and an inner wall surface of the fitting hole 911 a of the main body 911. A thermo module 912 using a plurality of pairs of thermoelectric semiconductor elements disposed along the Peltier effect is provided. In this thermo module 912, the cooling side is arranged as the fitting hole 911a side formed in the main body 911 of the cooler 91, and a voltage is applied to the thermo module 912 from the power supply means (not shown) through the conductive wire cord 92. It can function as a cooler. The cooler 91 is disposed on the front wall 21 of the apparatus housing 2 by engaging a fitting hole 911 a formed in the main body 911 with a hook 95 attached to the front wall 21 of the apparatus housing 2. .
[0022]
An example of use of the cooling means 9 described above will be described.
As described above, when the cutting blade 43 is attached to the mounter 5, the mounting hole 433 provided in the base 431 of the cutting blade 43 is fitted to the support portion 51 of the mounter 5 attached to the tip portion of the spindle 42. Thereafter, as shown by a two-dot chain line in FIG. 6, the fitting hole 911 a formed in the main body 911 of the cooler 91 constituting the cooling means 9 is fitted into the boss portion 431 a of the base 431 of the cutting blade 43. A voltage is applied to the thermo module 912 constituting the cooler 91 from a power supply unit (not shown) through the conductive wire cord 92. As a result, the fitting hole 911a side of the thermo module 912 is cooled, and the base 431 is cooled. Then, by cooling for an appropriate time, the base 431 contracts, and the inner peripheral surface of the mounting hole 433 comes into close contact with the outer peripheral surface of the tool support portion 51 of the mounter 5. 5, that is, the deviation from the rotation center of the rotary spindle 42 is corrected. In this corrected state, the fixing nut 7 is screwed into the male screw 52 a of the nut screwing portion 52, and the cutting blade 43 is clamped and fixed between the mounter 5. Therefore, the cutting blade 43 can be mounted with its rotation center aligned with the rotation center of the mounter 5, that is, the rotation spindle 42.
[0023]
In the illustrated embodiment, since the heating means 8 and the cooling means 9 are provided, the mounting holes of the base 431 can be obtained by using both means when attaching the cutting blade 43 to the mounter 5. Adhesion between the inner peripheral surface of 433 and the outer peripheral surface of the tool support 51 of the mounter 5 can be effectively achieved in a short time.
[0024]
【The invention's effect】
According to the mounting method of the rotary tool of the present invention, the mounting hole provided in the base of the rotary tool is fitted to the tool support of the mounter mounted on the rotary spindle, and the tool support of the mounter is heated to expand. Or the cooling tool base is cooled and contracted to bring the outer peripheral surface of the mounter tool support portion into close contact with the inner peripheral surface of the mounting hole provided in the base of the rotary tool, so that the base of the rotary tool is in close contact. Since the base is fixed to the flange portion of the mounter, the cutting blade can be mounted with its rotation center aligned with the rotation center of the mounter, that is, the rotation spindle.
[Brief description of the drawings]
FIG. 1 is a perspective view of a cutting apparatus as a processing apparatus according to the present invention.
FIG. 2 is an exploded perspective view showing a rotating spindle, a mounter, and a rotating tool that constitute the cutting apparatus shown in FIG. 1;
FIG. 3 is a perspective view showing a state where a mounter is mounted on the rotating spindle shown in FIG. 2;
4 is a perspective view showing a state where a rotary tool is attached to a mounter attached to the rotary spindle shown in FIG. 3;
FIG. 5 is an explanatory view showing a relationship between a heating means equipped in the cutting apparatus shown in FIG. 1 and a rotating spindle attached with a rotating tool.
6 is an explanatory view showing the relationship between the cooling means equipped in the cutting apparatus shown in FIG. 1 and the mounter attached to the rotating spindle. FIG.
[Explanation of symbols]
2: Device housing 3: Chuck table 31: Adsorption chuck support base 32: Adsorption chuck 4: Spindle unit 41: Spindle housing 42: Spindle spindle 43: Cutting blade 431: Cutting blade base 432: Cutting blade cutting edge 433: Cutting blade fitting hole 5: mounter 51: tool support 6: fixing nut 7: fixing nut 8: heating means 9: cooling means 10: imaging mechanism 11: display means 12: cassette 13: semiconductor wafer 17: work piece Unloading means 18: Workpiece conveying means 19: Cleaning means 20: Cleaning and conveying means

Claims (3)

A method of attaching a rotary tool having a mounting hole at a rotation center portion of a base to a mounter having a tool support portion mounted on a rotary spindle and a flange portion formed to project radially from the rear end of the tool support portion Because
The mounting hole provided in the base of the rotary tool is fitted into the tool support of the mounter, and the tool support of the mounter is heated to expand or the base of the rotary tool is By cooling and shrinking, the outer peripheral surface of the tool support portion of the mounter and the inner peripheral surface of the mounting hole provided in the base of the rotary tool are brought into close contact with each other, and the base of the rotary tool in the close contact state Is fixed to the flange portion of the mounter,
A method of mounting a rotary tool characterized by the above.   A nut screwing portion is provided on the tip end side of the tool support portion of the mounter, and a fixing nut is screwed into the nut screwing portion so that the rotary tool is interposed between the mounter and the flange portion. The mounting method of the rotary tool of Claim 1 which clamps and fixes this base. A rotary spindle; a mounter mounted on the rotary spindle; a mounter having a tool support portion; and a flange portion formed to project radially from the rear end of the tool support portion; and an attachment that fits the tool support portion of the mounter A rotary tool having a base with a hole, and after fitting a mounting hole provided in the base of the rotary tool to the tool support of the mounter, the base of the rotary tool is In a processing apparatus including a rotary tool that is fixed to the flange portion of the mounter,
Heating means including a heater having a fitting portion that is detachably fitted to the tool support portion of the mounter, and cooling having a fitting portion that is detachably fitted to a part of the base of the rotary tool Having both or one of the cooling means with a vessel,
The processing apparatus provided with the rotating tool characterized by the above-mentioned.

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