JP4152020B2 - Component mounting method and surface mounter - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting method and a surface mounter in which an electronic component such as an IC is taken out from a component supply unit by a head unit and mounted at a predetermined position on a substrate such as a printed board or a ceramic substrate.
[0002]
[Prior art]
Conventionally, an electronic component such as an IC is sucked from a component supply unit by a movable head unit having a suction head, is carried to a predetermined work position by a conveyor, and transferred to a set printed circuit board for printing. A surface mounter (hereinafter, abbreviated as a mounter) that is mounted at a predetermined position on a board is generally known. Recently, a plurality of suction heads are mounted on a head unit to improve mounting efficiency. There has also been proposed a mounting machine that can pick up at once.
[0003]
In the mounting machine as described above, components are usually mounted while setting the printed circuit boards one by one at the working position. For example, a relatively small circuit board in which the printed circuit board on which the components are mounted is incorporated into a small device. In this case, since the efficiency is low if this is processed one by one, components are mounted on a collective board (so-called multi-sided board). This collective substrate is a single large substrate formed by integrally forming a large number of small substrates of the same shape in a predetermined arrangement, and this collective substrate is conveyed by a conveyor or the like in an undivided state, and a unit substrate Components are mounted on the entire collective substrate so that a plurality of components are mounted per unit, and then divided into unit substrates.
[0004]
[Problems to be solved by the invention]
When mounting components on a collective board, the method includes a pattern repeat in which all the components are sequentially mounted on each unit board, and a step of sequentially mounting the components for each type of component on the entire collective board. Repeat is known and both are actually adopted.
[0005]
By the way, in the mounting machine as described above, it is possible to replace the suction nozzle for sucking the component provided in the suction head according to the type of the component, and such a replacement of the suction nozzle is a mounting operation on the printed circuit board. Done in. However, since replacement of the suction nozzle is a time loss, it is advantageous to reduce the number of nozzle replacements as much as possible in order to shorten the tact time. For example, when there is only one suction head, the nozzle is compared with pattern repeat. Step repeats that require fewer exchanges are advantageous.
[0006]
Therefore, it is conceivable to mount parts by step repeat even in a mounting machine that picks up and mounts a plurality of parts at once with a plurality of suction nozzles, but it is more desirable if the parts can be mounted with fewer nozzle replacements than this method. .
[0007]
The present invention has been made to solve the above problems, and in a method of mounting a plurality of components on a collective substrate while adsorbing them at a time, the components can be replaced with fewer adsorption nozzles than pattern repeats or step repeats. It is an object of the present invention to provide a component mounting method and a surface mounter capable of mounting a component.
[0008]
[Means for Solving the Problems]
In order to solve the above problems, the present invention takes out components from a component supply unit by a head unit including a plurality of suction heads having replaceable suction nozzles, and integrally forms a plurality of unit substrates in a predetermined arrangement. In the method of mounting on a collective board, the parts to be mounted on the unit board are grouped with a plurality of different types of parts in the same group , and each group includes a plurality of types of parts sucked by different types of suction nozzles. In this way, the parts belonging to the same group are mounted on the entire collective substrate with different types of suction nozzles attached to the suction heads of the head unit, and the suction nozzles are changed when the group is changed. And the components are mounted on the collective board one by one in order (claim 1).
[0009]
In this way, it is possible to reduce the number of times of replacement of the suction nozzle as compared with step repeat and pattern repeat.
[0010]
In order to solve the above problems, the present invention takes out a component from a component supply unit by a head unit including a plurality of suction heads having replaceable suction nozzles, and integrates a plurality of unit substrates in a predetermined arrangement. In the surface mounter to be mounted on the formed collective board, the input means for inputting information on the collective board, and the parts to be mounted on the unit board based on the information input by the input means are the same for different types of parts. Arranging means to divide into multiple groups so that each group includes a plurality of types of parts that are attracted by different types of suction nozzles, and different types of suction nozzles for the plurality of suction heads of the head unit in a state fitted with the parts belonging to the same group equipped for the whole aggregate substrate, exchange the suction nozzle when the group change To, in which are provided one by a group, and control means for controlling driving of the head unit so as to mount the component to the assembly substrate (claim 2).
[0011]
According to this apparatus, it is possible to automatically mount components on the collective substrate based on the method according to the first aspect. Incidentally, in this apparatus, the calculating means, for each group of the component in consideration of the mounting position location components prioritize so efficiently mounting components, the control means, the priority which is set It is preferable to control so that components are mounted on the collective board in order of group according to the order (claim 3).
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 schematically shows the entire surface mounter of the present invention. As shown in this figure, on the base 1 of the mounting machine main body, a printed circuit board conveying conveyor 2 is arranged, so that the printed circuit board 3 is conveyed on the conveyor 2 and stopped at a predetermined work position. It has become. The printed board 3 is a so-called collective board in which a large number of unit boards having the same shape, in the present embodiment, four unit boards K1 to K4 are integrally formed in a predetermined arrangement, and each unit board K1 to K4 ( (See FIG. 2).
[0013]
A component supply unit 4 is disposed on the side of the conveyor 2. The component supply unit 4 includes a feeder for supplying electronic components, for example, a multi-row tape feeder 4a. In addition to the tape feeder 4a as described above, the component supply unit 4 may be provided with a tray feeder or the like that supplies relatively large components such as PLCC and QFP placed on the tray. It has become.
[0014]
Above the base 1, a head unit 5 for mounting components is provided. The head unit 5 is movable over the component supply unit 4 and the work position where the printed circuit board 3 is located. In this embodiment, the head unit 5 is in the X-axis direction (the direction of the conveyor 2) and the Y-axis direction (the X-axis on the horizontal plane). It is possible to move in an orthogonal direction.
[0015]
That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servomotor 9 are disposed on the base 1, and a head unit support member 11 is disposed on the fixed rail 7. And a nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 5 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 5 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 5 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. ing.
[0016]
Although not shown, the head unit 5 is provided with two suction heads arranged in a line in the X-axis direction. These suction heads can be moved up and down and rotated with respect to the frame of the head unit 5. In addition, a suction nozzle is provided at the lower end of each suction head, and at the time of component suction, negative pressure is supplied from the negative pressure supply means (not shown) to the tip of the suction nozzle, so that the suction force due to the negative pressure causes the component to Are to be adsorbed.
[0017]
Further, the base 1 is provided with a component recognition camera 17 for recognizing the suction state of the electronic component sucked by the head unit 5, and the head unit 5 moves above the component recognition camera 17 after the electronic component suction. By doing so, the component recognition camera 17 images the suction component. Further, on the base 1, there is provided a nozzle replacement station 18 that holds a plurality of suction nozzles in a replaceable manner. If necessary, the head unit 5 is moved to this station to replace the suction nozzles. It has become.
[0018]
The mounting machine is provided with a controller 20 for controlling a component mounting operation. The controller 20 is provided with main control means 21 that controls operation control during mounting, and the servo motors 9 and 15, the component recognition camera 17, and the like are connected to the main control means 21 .
[0019]
Further, the controller 20 has a storage means 22 for storing various information for the mounting operation, and a mounting order calculation means 23 (calculation means) for grouping components mounted on the printed circuit board 3 and calculating the mounting order. The storage means 22 and the mounting order calculation means 23 are connected to the main control means 21, respectively. Further, the mounting machine is provided with input means 24 such as a keyboard equipped with a monitor, and this input means 24 is connected to the main control means 21 of the controller 20.
[0020]
At the time of mounting, components should be mounted on the printed circuit board 3 based on the mounting order data obtained in advance by the mounting order calculation means 23 based on the information about the printed circuit board 3 and the mounted components input via the input unit 24. The main controller 21 controls the operation of the head unit 5 and the like.
[0021]
Here, processing of component mounting order calculation by the mounting order calculation means 23 will be described. In the following description, an example will be described in which components are mounted on the printed circuit board 3 configured as shown in FIG.
[0022]
The printed circuit board 3 shown in this figure is composed of four unit boards K1 to K4 having the same configuration, and each of the four types of parts A to D is mounted in a predetermined arrangement on each of the unit boards K1 to K4. It is like that. Note that the numbers attached to A to D correspond to the numbers of the unit substrates K1 to K4 and are given for convenience.
[0023]
In the mounting order calculation process, the parts to be mounted on the unit board are grouped with different types of parts in the same group , and each group includes multiple types of parts that are picked up by different types of suction nozzles. Divided into a plurality of groups, for example, divided into groups composed of different types of components that are the same as the number of components that are simultaneously attracted by the head unit 5, that is, the number of suction heads.
[0024]
More specifically, since the mounting unit has two suction heads mounted on the head unit 5, as shown in the figure, the mounted components are, for example, (A, B), (C, D). Divide into two groups Ga and Gb. The grouping is performed in consideration of the component mounting position and the positional relationship of the tape feeder 4a so that the component can be sucked and mounted as efficiently as possible. Therefore, it can be divided into (A, C), (B, D) or (A, D), (B, C) according to these conditions.
[0025]
After the grouping is performed, next, priorities at the time of mounting these groups Ga and Gb are set. Again, considering the mounting position of the component to determine the priority to allow efficient mounting components.
[0026]
In this way, for example, data relating to the mounting order of the mounted components in which the group Ga including the components A and B is mounted in preference to the group Gb including the components C and D is obtained and stored in the storage unit 22. .
[0027]
Next, a component mounting operation in the mounting machine will be described with reference to the flowchart of FIG.
[0028]
In the component mounting operation shown in this flow, first, an initial value “1” is set to the variable n that determines the priority order of the group at the time of mounting, whereby the suction nozzle of each suction head of the head unit 5 is prioritized. The parts (that is, parts A and B) belonging to the first (n = 1) rank group (that is, group Ga) are replaced with suction nozzles for suction (steps S1 and S2).
[0029]
When the nozzle replacement is completed, the head unit 5 is moved to the component supply unit 4, and the components A and B belonging to the first priority group are picked up from the component supply unit 4 by each suction nozzle (step S3). Then, after moving the head unit 5 onto the component recognition camera 17 and examining the suction state of the component, the head unit 5 is moved onto the printed circuit board 3 to mount the component on the printed circuit board 3 (steps S4 and S5). ).
[0030]
Then, it is determined whether or not the parts belonging to the first group in the priority order are mounted on all of the unit boards K1 to K4 in the printed circuit board 3. If it is determined that the processing is not completed, the process proceeds to step S3. Transition is made (step S6). Thus, by repeating steps S3 to S6, for example, the components A and B belonging to the first group in the priority order are mounted on the unit substrates K1 to K4 in the order of the unit substrates K1, K2, K3, and K4.
[0031]
On the other hand, when the mounting of all the parts belonging to the first priority group is finished, it is determined whether or not all the parts (all kinds of parts) are mounted on the printed circuit board 3 and are not mounted. Is determined, the variable n is incremented and the process proceeds to step S2 (step S7). Thus, according to the priority order, the components are sequentially mounted on the printed circuit board 3 while exchanging the suction nozzle when the group is changed.
[0032]
If it is finally determined that all the components are mounted on the printed circuit board 3 (YES in step S7), this flowchart is terminated.
[0033]
When components are mounted as described above, the number of suction nozzle replacements is less than conventional pattern repeats and step repeats, which are known as assembly board mounting methods, and components are more efficient than pattern repeats and step repeats. Can be installed.
[0034]
The printed board 3 shown in FIG. 2 will be described as an example. Four types of parts are mounted on the board 3 in total, and the parts are mounted by the two suction heads of the head unit 5, so that the parts are absorbed. The mounting operation is performed a total of 16 times.
[0035]
Here, according to the above mounting machine, as shown in FIG. 4, after mounting two types of components A and B on the entire printed circuit board 3, two types of components C and D are mounted. Nozzle replacement is performed when A and B parts are mounted for the first time (when the first part is mounted) and when mounting of two types of parts C and D is started (when the ninth part is mounted). (In the figure, the reference numerals of the components are enclosed in a frame). In this case, for example, if the parts A to D are all sucked using different suction nozzles, the suction nozzles are replaced four times in total in 16 suction mounting operations.
[0036]
On the other hand, in the pattern repeat method in which components are sequentially mounted on each of the unit boards K1 to K4, for example, as shown in FIG. If two parts C and D are mounted next, the suction nozzles are replaced four times per unit substrate, so the total number of replacements of the suction nozzles in the entire printed circuit board 3 is increased. It will be performed 16 times.
[0037]
Further, in the step repeat method in which components are sequentially mounted on the entire printed circuit board 3 for each component type, for example, as shown in FIG. Therefore, the suction nozzles are exchanged a total of eight times over the entire substrate.
[0038]
Thus, according to the mounting machine described above, the number of times of replacement of the suction nozzle can be reduced as compared with an apparatus for mounting components by a conventional mounting method such as pattern repeat or step repeat. Therefore, the time loss is reduced by that much, and the tact time can be shortened effectively.
[0039]
In the above description, the case where components are mounted on the printed circuit board 3 by a head unit including two suction heads has been described. Of course, the above embodiment is basically applied to a case where there are more suction heads. The component mounting order may be set in accordance with the mounting order calculation process described above, and the components may be mounted in accordance with the flowchart shown in FIG.
[0040]
In addition, as a method of dividing the components mounted on the unit substrate into a plurality of groups in which different types of components are made into the same group, when there are three or more suction heads, the number of types of components to be set in the same group and the suction head The number is not necessarily the same. For example, when there are four or more suction heads, two types of parts may be sucked by each suction head.
[0041]
【The invention's effect】
As described above, according to the present invention, in a method of taking out components from a component supply unit by using a plurality of suction heads mounted on a head unit and mounting them on a collective substrate, components mounted on a unit substrate are replaced with different types of components. The same group and each group is divided into a plurality of groups so as to include a plurality of types of parts that are sucked by different types of suction nozzles, and different types of suction nozzles are provided to the plurality of suction heads of the head unit. In the mounted state, the parts belonging to the same group are mounted on the entire collective board, the suction nozzle is replaced when the group is changed, and the parts are mounted on the collective board one by one in order. Compared to the conventional mounting method called pattern repeat, the suction nozzle needs to be replaced less frequently. Minute, can reduce the time loss at the time of implementation, it is possible to shorten the tact time effectively.
[Brief description of the drawings]
FIG. 1 is a schematic plan view showing a surface mounter according to the present invention.
FIG. 2 is a schematic diagram illustrating a configuration of an aggregate substrate.
FIG. 3 is a flowchart illustrating an example of a mounting operation.
FIG. 4 is a diagram for explaining a mounting order of components in the mounting method according to the present invention.
FIG. 5 is a diagram for explaining a mounting order of components in a conventional mounting method.
[Explanation of symbols]
2 Conveyor 3 Printed circuit board 4 Component supply unit 5 Head unit 17 Board recognition camera 18 Nozzle exchange station 20 Controller 21 Main control means 22 Storage means 23 Mounting order calculation means 24 Input means

Claims (3)

In a method of taking out components from a component supply unit by a head unit having a plurality of suction heads having replaceable suction nozzles and mounting the unit substrates on a collective substrate integrally formed in a predetermined arrangement,
The components mounted on the unit board are divided into a plurality of different types of components in the same group , and each group is divided into a plurality of groups so as to include a plurality of types of components sucked by different types of suction nozzles ,
With different types of suction nozzles attached to the multiple suction heads of the above head unit, the parts belonging to the same group are mounted on the entire assembly board, and the suction nozzles are replaced when the group is changed. A component mounting method comprising sequentially mounting components on a collective substrate . In a surface mounter that takes out components from a component supply unit by a head unit including a plurality of suction heads having replaceable suction nozzles and mounts the unit substrates on a collective substrate integrally formed in a predetermined arrangement.
Input means for inputting information on the collective substrate;
Based on the information input by this input means, the parts to be mounted on the unit board are divided into a plurality of different types of parts in the same group , and each group has a plurality of types of parts that are picked up by different types of suction nozzles. Computing means to divide into multiple groups to include
With different types of suction nozzles attached to the multiple suction heads of the above head unit, the parts belonging to the same group are mounted on the entire assembly board, and the suction nozzles are replaced when the group is changed. A surface mounter comprising: control means for controlling the drive of the head unit so that components are mounted on a collective substrate in order . In the surface mounting apparatus according to claim 2, wherein said calculating means, taking into account the mounting position location components within each group of the component sets the priority to allow efficient mounting components, said control means, A surface mounter that controls to mount components on a collective board in order of group according to a set priority.

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