JP4154728B2 - Mold production method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a mold capable of forming an optical surface of an optical element and the like, and more particularly to a method for manufacturing a mold capable of accurately joining when forming a mold from a plurality of members.
[0002]
[Prior art]
In recent years, in the field of optical pickup devices that are rapidly developing, optical elements such as objective lenses having extremely high-precision shapes are used. An optical element having a fine pattern such as a diffraction grating has also been developed. Here, when molding such an optical element using a metal mold such as plastic or glass, it is possible to quickly produce a product having a uniform shape, so that mold molding is suitable for mass production. It can be said.
[Patent Document 1]
Japanese Patent Laid-Open No. 2002-67113
[Problems to be solved by the invention]
By the way, the mold for molding an optical element is often manufactured by cutting one by one with, for example, a single crystal diamond tool. However, since the mold material is expensive, it is necessary to make the mold small in order to reduce the cost. For example, when machining is performed by attaching a mold to a cylindrical grinder or the like and rotating the mold, the mold is preferably as light and small as possible in order to suppress a machining error due to run-out. However, when assembling the mold in the molding apparatus, if the mold is small, it must be integrated with the backing member in order to properly transmit the molding press force, but a fine pattern is formed on the mold transfer surface. In such a case, it is necessary to accurately position the fine pattern and the backing member on the order of microns.
[0004]
Here, when joining a metal mold | die and a backing member, it is possible to use the fastening by a volt | bolt (refer patent document 1), adhesion | attachment by an adhesive agent, thermal spraying, and joining by a low melting-point alloy. However, when the mold is joined to the backing member by fastening the bolt, the rebolt may be loosened after a long period of use due to the temperature cycle and repetitive force caused by the molding. Further, when the mold is joined to the backing member using an adhesive, there is a possibility that sufficient adhesive strength cannot be maintained under a high temperature environment during molding. Furthermore, when the mold is joined to the backing member by thermal spraying, the mold or the backing member may be deformed at the temperature during thermal spraying. In addition, when the mold is joined to the backing member by melting and then solidifying the low melting point alloy, if the melting point is high, the mold or the backing member is deformed by exposure to a high temperature molten alloy. If the melting point is low, there is a possibility that sufficient adhesive strength of such an alloy cannot be secured under a high temperature environment such as molding. In particular, when the above-described fine pattern is formed on the mold, a great problem arises with these joining methods. In particular, when an optical element is finally formed, the optical performance due to the fine pattern is greatly affected.
[0005]
This invention is made | formed in view of such a problem, and provides the molding method of the metal mold | die which can join such a some member accurately and can obtain a reliable mold. Objective.
[0006]
[Means for Solving the Problems]
Here, “matching joint surfaces” includes not only direct contact but also facing each other with a gap.
[0007]
Note that one of the members to be joined using the electroforming may be a mold having a mold transfer surface, and a metal, an amorphous material, or the like can be considered as a material of the mold. Further, one of the members may be a backing member joined to the mold. Metal molds can be formed by turning with a diamond tool to form a mold transfer surface corresponding to the optical surface or fine pattern, but there is a master mold corresponding to the shape of the optical element. For example, by growing electroforming therefrom, a transfer surface including, for example, a fine pattern can be transferred and formed with high accuracy. Even if one of the members to be joined is not a conductive member, electroforming can be performed by forming a conductive coating on the surface thereof by electroless plating or vapor deposition. Furthermore, a mold in which a fine pattern is accurately transferred can be formed by pressing the molten amorphous material against the matrix and solidifying the material as it is. Although it is conceivable to form an entire mold having a length that does not require a backing member from electroforming or amorphous material, it takes time to grow electroforming, so for example, it includes a cylindrical drive part. It takes a long time to produce a long mold. In addition, since the amorphous material itself is expensive, there is a problem in that it becomes a very expensive mold. Therefore, even if a mold having a mold transfer surface is formed by electroforming or amorphous material, it is necessary to join the backing member in consideration of manufacturing cost and time, and the effect of the present invention is exhibited. . In addition, as the material of the mold, silicon wafers, ceramics, and the like are conceivable, but these have low toughness and may not be able to withstand the repeated force of molding.
[0008]
The mold manufacturing method of the present invention is a method for manufacturing a mold for molding an optical element, wherein at least one positioning step temporarily fixes the joint surfaces of a plurality of members having a mold transfer surface in alignment with each other. If, have a, a bonding step of electroforming joining both members by said plurality of members forming the electroforming around the joint surface in a state of being positioned in a direction toward each other with respect to the joint faces The temporary fixing is performed by applying a force using a mechanical means, and the mechanical means is sandwiched between the plane and a pair of planes arranged opposite to each other in the force transmission path. Because it includes a ball that can freely roll, by performing electroforming bonding in an environment close to room temperature, it is possible to perform highly accurate bonding without causing deformation due to thermal expansion of the member, and high temperature Adequate bonding even in environments Highly reliable mold compared to bolt fastening, adhesive bonding, thermal spraying, low melting point alloy bonding, etc. Can be provided.
[0009]
Also, an electroforming step is performed on the mother die having the mold transfer surface to form a mold material to which the mold transfer surface is transferred, and a shaping step for shaping the mold material. The positioning step is performed by temporarily fixing a backing member to the mold material shaped by the shaping step, and the electroforming joining step is performed between the electroformed member and the backing member. When it is performed by forming electroforming around the joint surface, when the same electroforming is formed from above the electroformed member, the bonding state thereof is ensured and the joint strength and durability are excellent.
[0010]
Furthermore, it is preferable that in the electroforming joining step, electroforming is formed around the joint surface between the electroformed member and the backing member by energizing the backing member.
[0011]
The backing member is preferably made of a conductive member.
[0012]
Furthermore, it is preferable that the periphery of the part having the joint surface is formed to be narrower than the outer diameter of the backing member or the mold material in a part other than the part having the joint surface.
[0013]
In the positioning step, the temporary fixing is performed by adhering the joint surfaces with an adhesive, and at least one of the plurality of members is formed with a peripheral groove that allows the adhesive to escape. It is preferable because it can perform proper adhesion.
[0014]
Further, if a fine pattern is formed on the mold transfer surface before joining the members, positioning of the fine pattern and a member to be joined to the member having the mold transfer surface is required with high accuracy. Therefore, the effect of the present invention can be exhibited more.
[0015]
The mold for molding an optical element is preferably an injection mold.
[0016]
Furthermore, if the joint surfaces of the members to be joined are temporarily fixed in a state where they are aligned and then electroformed is formed around the joint surfaces, heat and stress that cause deterioration in positioning are joined to the members. Since it does not sometimes occur, it can be temporarily fixed after positioning and can be joined while maintaining that state. In addition, when contacting the said joint surfaces, there exists an advantage that the structure of temporary fixation is simplified. Further, particularly in this case, since the outer periphery of each member is mainly grown by electroforming, a mold member having a short time until joining and a length necessary for injection molding can be easily formed.
[0017]
In addition, positioning can be performed with high accuracy by forming a recess on one of the joint surfaces to be mated, forming a projection on the other, and fitting the projection into the recess.
[0018]
Further, the concave portions are formed on both of the joint surfaces to be combined, and the joint surfaces are aligned via an inclusion (for example, a rod-like member fitted to the concave portion) that engages both the concave portions. Performing accurate positioning can be performed.
[0019]
Further, it is preferable to perform the temporary fixing by bonding the joint surfaces because a configuration for holding the member is unnecessary.
[0020]
Further, if at least one of the plurality of members is made of a conductive member and the joint surfaces are in contact with each other without interposing an adhesive layer, wiring necessary for electroforming can be simplified.
[0021]
The conductive member preferably contains a metal.
[0022]
Furthermore, it is preferable to perform the temporary fixing by applying a force in a direction toward each other with respect to the joint surfaces.
[0023]
Moreover, it is preferable to apply the force using a mechanical means because the adhesion degree between the joint surfaces is increased.
[0024]
Further, the mechanical means includes a pair of planes arranged opposite to each other in the force transmission path and a rollable ball sandwiched between the planes. Even if a force including a direction component other than the direction in which the force is to be applied is generated, the force of the direction component is not transmitted, and the force can be transmitted only in the direction to be originally applied. Therefore, it is preferable that the pair of planes extend substantially perpendicular to the force applied to the planes.
[0025]
Further, when the mechanical means includes a tapered surface disposed in the transmission path from the force and a sphere that engages with the tapered surface, the mechanical means touches lightly until just before contact or after contact. If so, the position of the sphere is not restricted with respect to the plane side (assuming that the sphere can slide between the plane and the plane). By applying a magnetic force or a mechanical force, the bonded surfaces are kept in a combined state, and by increasing the force applied in that state, the bonded surfaces can be maintained and brought into close contact with each other. .
[0026]
Further, it is preferable that the plurality of members are made of a ferromagnetic material, and the force is applied using a magnetic force generated by applying a magnetic field to the ferromagnetic material. Here, the magnetic force may be a magnetic force generated by a permanent magnet or a magnetic force generated by an electromagnet.
[0027]
Further, if the temporary fixing is performed by applying an adhesive in the direction toward each other after applying an adhesive to the joint surfaces, the temporary fixing can be performed more strongly.
[0028]
It is preferable to position the joint surfaces before the temporary fixing. In addition, when the reference surfaces of both members, for example, the rear end surface on the opposite side of the joint surfaces of both members are used as the reference surfaces and they are held parallel to each other, the distance and the position are adjusted to match the joint surfaces. Since the area of the surface is small, it is effective when it is difficult to improve the processing accuracy or the accuracy of positioning by abutment. When the area of the joint surface is small, the abutment tends to be affected by foreign matter being caught, but there is an advantage that the rear end surface and the outer periphery have a larger area than the joint surface, and the processing accuracy and positioning accuracy are easily obtained. Although the outer peripheral surface rather than the rear end surface may be used as a reference, in this case, holding the rear end surface as a reference surface has an advantage of facilitating the electroforming operation.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the manufacturing method of the metal mold | die concerning embodiment of this invention is demonstrated with reference to drawings. FIG. 1 is a diagram showing a process of manufacturing a mold by electroforming. First, a silicon matrix 1 having a fine pattern is formed by mechanical processing, chemical processing, or physical processing, and attached to the end face of the jig 2 using bolts 3 as shown in FIG. . At this time, the end surface 2a of the jig 2 is assumed to be perpendicular to the axis X with high accuracy. Thereafter, a nickel phosphorous film for protecting the fine pattern, for conducting, and for improving the surface hardness as a mold is formed on the surface of the mother die 1 by sputtering.
[0030]
Further, in FIG. 1B, as shown by a two-dot chain line, pure nickel electroforming is grown to form a mold material 4 (electroforming step). If an electroforming prevention process is performed on the outer peripheral surface of the jig 2 by applying an insulating agent in advance, unnecessary adhesion of electroforming can be suppressed. After the formation, as shown by the solid line in the figure, the mold material 4 is shaped (shaping step).
[0031]
Thereafter, in FIG. 1C, the backing member 5 formed of a conductive member is temporarily fixed to the mold material 4. The temporary fixing method will be described more specifically. In FIG. 2 showing the enlarged arrow II portion, the bonding surface 4c of the mold 4 has a protrusion 4e formed at the center and a circumferential groove 4d formed around the protrusion 4e. On the other hand, the bonding surface 5d of the backing member 5 has an opening 5f at the center. The outer circumferences of the joint surfaces 4c and 5d are reduced in diameter in preparation for electroforming. That is, the periphery of the joining portion (the portion having the joining surface) is formed thinner than the outer diameter of the backing member 5 and the mold material 4 other than the joining portion as shown in FIG. As a result, the connecting member 6 can be formed sufficiently thick by the subsequent electroforming process, and even if the outer periphery of the joint is finished as shown in FIG. Can be fixed to. After the adhesive is applied to the bonding surface 4c or the bonding surface 5d, the bonding surfaces 4c and 5d are positioned by inserting and fitting the protrusions 4e into the openings 5f (positioning step). When the adhesive is solidified in such a state, the temporary fixing of the mold material 4 and the backing member 5 is completed. At the time of positioning, the adhesive escapes into the circumferential groove 4d, so that the surrounding joint surface 4c comes into direct contact with the joint surface 5d, and the mold material 4 and the backing member 5 are inclined or the entire length varies. Can be suppressed. In addition, since electrical contact is achieved between the mold material 4 and the backing member 5, current flows through the mold material 4 by energizing the backing member 5 during electroforming, which will be described later. Simplification of wiring and the like can be achieved. The energization is not limited to the energization from the backing member 5 but can be energized from the mold material 4. It is preferable to remove the adhesive that protrudes outside the joint surface. In the present embodiment, the temporary fixing is performed using an adhesive, and therefore there is no need for an auxiliary tool or the like necessary for temporary fixing.
[0032]
Thereafter, electroforming is grown on the outer periphery of the joining surface to form the connecting member 6 (electroforming joining step). The connecting member 6 is cross-linked so as to surround the outer periphery of the mold material 4 and the backing member 5, so that both are joined. In the present invention, at least one member to be joined, in particular, a member having a mold transfer surface is formed by previously growing electroforming, so that it is very strongly joined to the connecting member formed by electroforming. In addition, durability when used as a mold can be increased, and high-precision bonding corresponding to a fine pattern formed on the mold transfer surface is possible. As described above, an electroforming prevention treatment may be performed on an area where electroforming is not desired. After the electroforming, sufficient cleaning is performed, and the end surface 5a of the backing member 5 is processed using a surface grinder or the like using the end surface 2a of the jig 2 as a reference surface to obtain a predetermined parallelism. Therefore, the end face 5a is also orthogonal to the axis X with high accuracy. Further, the mold material 4 is cut at the position indicated by A in the figure while rotating the jig 2 to separate (demold) from the jig 2 to obtain the configuration shown in FIG. At this time, a fine pattern is transferred and formed on the surface 4 a of the mold material 4 facing the mother die 1. Note that the outer peripheral surface of the backing member 5 may be finished before the mold release, and the end surface may be finished with reference to the outer peripheral surface.
[0033]
Further, roughing is performed by cutting the mold material 4 at a position B in FIG. 1 (d) using a wire cut or a milling machine while rotating the backing member 5. Finally, the outer peripheral surfaces of the large-diameter portion 5b and the small-diameter portion 5c of the backing member are finished using a cylindrical grinder (or a precision lathe) with the end surface 5a of the backing member 5 as a reference. Further, the outer peripheral surface 4b of the mold material 4 and the outer peripheral surface of the connecting member 6 are finished with the end surface 5a as a reference. At this time, it is preferable that the outer peripheral surface 4 b of the mold material 4 and the outer peripheral surface of the connecting member 6 are formed to be equal to or slightly smaller than the outer diameter of the small diameter portion 5 c of the backing member 5. This is because the connecting member 6 formed by pure nickel electroforming has a lower hardness than the backing member 5 formed of steel or the like, and thus there is a risk of early wear or heat generation due to repeated molding. The mold thus formed is preferably used for injection molding or the like.
[0034]
FIG. 3 is a view showing an apparatus for temporarily fixing a mold material to a backing member. Such an apparatus constitutes a mechanical means for applying a force in order to temporarily fix the mold material to the backing member. Since the mother mold 1, the jig 2, the mold material 4, and the backing member 5 shown in FIG. 3 basically have the configuration shown in FIGS.
[0035]
In FIG. 3, the jig 2 is fixed to the frame 10 by using bolts 11 in a state where the molded die material 4 is attached (see FIG. 1B). On the other hand, the holder 13 is fixed to the end surface of the backing member 5 using the bolts 12, and the taper member 14 is fitted to the holder 13. In this state, the mold material 4 and the backing member 5 are positioned by inserting and fitting the projection 4e (FIG. 2) into the opening 5f (FIG. 2) which is a recess while the bonding surfaces 4c and 5d are opposed to each other. Is done. Thereafter, the sphere 15 is engaged with the tapered surface 14 a of the taper member 14, and the plane of the pad 16 a is brought into contact with the sphere 15. The pad 16a is attached to the frame 10 by a support member 16 so as to be displaceable, and is pressed by a tip of a bolt 17 screwed into the frame 10 from the back side.
[0036]
When the bolt 17 is screwed, the pad 16a is pushed through the support member 16, and moves to the left in FIG. When the pad 16a is pressed, the ball 15 presses the taper surface 14a of the taper member 14 and presses the backing member 5 through the holder 13, so that the bonding surfaces 4c and 5d are mechanically pressed. Abut with each other. By performing electroforming in this state, the mold material 4 and the backing member 5 can be connected using the connecting member 6 formed from electroforming, as shown in FIG. According to the present embodiment, since the pressing force transmission path includes the tapered surface 14a and the ball 15 in contact with the tapered surface 14a, even if the joint surfaces 4c and 5d are non-parallel before temporary fixing, If they are brought into contact with each other while applying a pressing force, the joint surface 5d can be inclined, so that the joint surfaces 4c and 5d come into close contact with each other, and the axes of the mold material 4 and the backing member 5 are made to coincide. be able to.
[0037]
FIG. 4 is a view showing another apparatus for temporarily fixing the mold material to the backing member. Such an apparatus also constitutes a mechanical means for applying force in order to temporarily fix the mold material to the backing member, but only the configuration different from the apparatus of FIG. 3 will be described.
[0038]
In FIG. 4, a parallel member 14 ′ is fitted to the holder 13, and a sphere 15 is disposed between the flat surface 14 a ′ and the surface of the pad 16 so as to roll freely. When the bolt 17 is screwed, the pad 16a is pushed through the support member 16, and moves to the left in FIG. When the pad 16a is pressed, the sphere 15 presses the flat surface 14a 'of the parallel member 14' and presses the backing member 5 through the holder 13, so that the bonding surfaces 4c and 5d are mechanically pressed. Contact with each other.
[0039]
Strictly speaking, even if the bolt 17 is screwed, the pad 16a performs an arc motion, and therefore the force applied from the pad 16a to the ball 15 includes a direction component other than the axial direction to which the pressing force is to be applied. May occur. However, according to the present embodiment, the ball 15 rolls between the plane 14 a ′ of the parallel member 14 ′ and the surface of the pad 16, thereby preventing transmission of force other than the axial direction. Therefore, both the joint surfaces 4c and 5d come into close contact with each other, and the axes of the mold material 4 and the backing member 5 can be matched.
[0040]
FIG. 5 is a view showing another apparatus for temporarily fixing the mold material to the backing member. Such an apparatus also constitutes a mechanical means for applying force in order to temporarily fix the mold material to the backing member, but only the configuration different from the apparatus of FIG. 3 will be described.
[0041]
In FIG. 5, the jig 2 in a state (see FIG. 1B) in which the mold material 4 that has been shaped is attached is fixed to the substrate 20 on which a plurality of support columns 21 are implanted using the bolts 11. On the other hand, the panel 23 is fixed to the end surface of the backing member 5 using bolts 12. In this state, the mold material 4 and the backing member 5 are positioned by inserting and fitting the protrusions 4e (FIG. 2) into the openings 5f (FIG. 2) while facing the joint surfaces 4c and 5d. At this time, a thin shim 24 is inserted between the upper ends of the plurality of columns 21 and the panel 23 so that the parallelism between the substrate 21 and the panel 23 is maintained. Since the subsequent steps are the same as those in the above-described embodiment, the description thereof is omitted.
[0042]
The mold described above constitutes the movable side core, but the mold constituting the fixed side cavity can also be manufactured by applying this embodiment. However, some molds are formed in a thin plate shape. In this case, it becomes a problem how to install in the molding apparatus.
[0043]
6 (a) is a front view of a mold constituting the fixed cavity, and FIG. 6 (b) is a diagram of the configuration of FIG. 6 (a) cut along the VIB-VIB line and viewed in the direction of the arrow. It is. The thin plate-shaped mold material 4 ′ is temporarily fixed to the end surface of the cylindrical backing member 5 ′, and then both are fixed by a connecting member 6 ′ obtained by growing electroforming from the back side.
[0044]
The mold constituting the fixed cavity does not require a sliding surface, but needs a certain thickness so that it can withstand the pressure during molding. However, when a fine pattern (for example, a ring-shaped groove) 4a ′ is formed on a semiconductor wafer as the mold material 4 ′, it is often a thin plate having a thickness of 1 mm or less in terms of process and cost. In such a case, according to the present embodiment, the mold material 4 ′ and the backing member 5 ′ can be connected by electroforming, so that it can be used as a mold constituting the solid side cavity.
[0045]
As described above, the present invention has been described in detail with reference to the embodiments. However, the present invention should not be construed as being limited to the above-described embodiments, and can be appropriately changed and improved without departing from the spirit thereof. Of course there is. For example, when aligning the bonding surfaces, as a positioning, the protrusion formed on one bonding surface was fitted into the recess (opening) formed on the other surface, but the protrusions were formed on both bonding surfaces, Positioning may be performed by fitting a rod-like member (such as a pin) into both concave portions. Further, by forming the backing member from a ferromagnetic material, it is possible to apply a force for bringing the bonding surfaces into close contact with each other by attracting a pure nickel mold material by a magnetic force. Bonding surfaces may be used in combination with adhesion and application of pressing force.
[0046]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the shaping | molding method of the metal mold | die which can join a some member accurately and can obtain a reliable metal mold | die can be provided.
[Brief description of the drawings]
FIG. 1 is a diagram showing a process of manufacturing a mold by electroforming.
FIG. 2 is an enlarged view showing a part of a mold material and a backing member.
FIG. 3 is a view showing an apparatus for temporarily fixing a mold material to a backing member.
FIG. 4 is a view showing another apparatus for temporarily fixing a mold material to a backing member.
FIG. 5 is a view showing still another apparatus for temporarily fixing a mold material to a backing member.
6 (a) is a front view of a mold constituting a fixed cavity, and FIG. 6 (b) is a cross-sectional view taken along line VIB-VIB in FIG. 6 (a). FIG. Thin plate [Explanation of symbols]
1 Master 2 Jig 3 Nickel Phosphorus Layer 4, 4 ′ Electroformed 5, 5 ′ Backing Member 6, 6 ′ Connecting Member

Claims (17)

In the manufacturing method of the mold for optical element molding,
A positioning step in which at least one of the plurality of members having a mold transfer surface is temporarily fixed in a aligned state;
Have a, a bonding step of electroforming joining both members by said plurality of members forming the electroforming around the bonding surface while being positioned,
The temporary fixing is performed by applying a force using a mechanical means in a direction toward each other with respect to the joint surfaces,
The method for producing a mold, wherein the mechanical means includes a pair of planes arranged opposite to each other in the force transmission path, and a rollable ball sandwiched between the planes . Performing an electroforming process on a mother die having the mold transfer surface, and forming a mold material on which the mold transfer surface is transferred; and
A shaping step of shaping the mold material,
The positioning step is performed by temporarily fixing a backing member to the mold material shaped by the shaping step,
The electroforming bonding step, mold making method according to claim 1, characterized in that it is carried out by forming a electroforming around the junction surface between the backing member and the electroformed member. 3. The mold according to claim 2 , wherein in the electroforming joining step, electroforming is formed around a joint surface between the electroformed member and the backing member by energizing the backing member. Production method. The backing member fabrication method of a mold according to claim 2 or 3, characterized in that it is formed of a conductive member. Around the site where there is the joint surface, either of claims 2 to 4, characterized in that it is narrower than the outer diameter of said backing member or said die material at sites other than the site where there is the joint surface How to make a mold as described in Crab. In the positioning step, the temporary fixing is performed by adhering the bonding surfaces with an adhesive, and at least one of the plurality of members is formed with a circumferential groove for allowing the adhesive to escape. A method for manufacturing a mold according to any one of claims 1 to 5 . The said mold transfer surface, method of manufacturing the mold according to any one of claims 1 to 6, characterized in that to form a fine pattern before joining the member. The optical element a mold for molding, mold making method according to any of claims 1 to 7, characterized in that a mold for injection molding. The mold according to any one of claims 1 to 8, wherein the mold is temporarily fixed in a state where the joint surfaces of the members to be joined are aligned and positioned, and thereafter, electroforming is formed around the joint surface. How to make. A recess in one of the joining surfaces to be mated, the other to form a protrusion, of claims 1 to 9, characterized in that for positioning of the joining surface by fitting the projection into the recess The manufacturing method of the metal mold | die in any one. A recess in both of the joining surfaces to be combined, that through the inclusions which engages with both of the recesses aligning the bonding surface, according to claim 1 to 9, characterized in that the positioning The manufacturing method of the metal mold | die in any one. Mold making method according to any one of claims 1 to 5, 7 to 11, characterized in that the temporary fixing by bonding the bonding surface. At least one of the plurality of members is made of a conductive member, said joint surface, without interposing an adhesive layer, according to any one of claims 6 to 12, characterized in that part are in contact with each other How to make the mold. The method of claim 13 , wherein the conductive member includes a metal. The mold according to any one of claims 1 to 14, wherein the plurality of members are made of a ferromagnetic material, and the force is applied using a magnetic force generated by applying a magnetic field to the ferromagnetic material. How to make. The method for producing a mold according to any one of claims 6 to 15 , wherein the temporary fixing is performed by applying a force in a direction toward each other after applying an adhesive to the joint surfaces. . Wherein before temporary fixing, a manufacturing method of a mold according to any one of claims 1 to 16, characterized in that for positioning between the bonding surfaces.

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