JP4158482B2 - Coating method, coating apparatus, and method for manufacturing plasma display member - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is used, for example, in the field of manufacturing plasma displays, color filters for color liquid crystal displays, optical filters, printed circuit boards, integrated circuits, semiconductors, and the like. And a coating apparatus for forming a coating film while discharging a coating solution.
[0002]
[Prior art]
In recent years, displays have gradually become diversified in their systems, and one of the current attention is a plasma display that is larger than a conventional cathode ray tube and can be reduced in thickness and weight. This is because a partition having grooves extending in one direction in a striped pattern at a constant pitch is formed on a glass substrate, and further, phosphors of R, G, and B are filled in the grooves of the partition, and an arbitrary portion is emitted by ultraviolet rays. And a predetermined color pattern is projected. Usually, the side with the partition walls is called the back plate, and the side with the part that generates ultraviolet rays is called the front plate.
[0003]
Here, as an important method of forming a partition pattern on the back plate, a partition paste is uniformly applied, dried and molded to a uniform film thickness, and then stripe-shaped grooves having a predetermined pitch are formed by a sandblasting method or the like. The mainstream is engraving and baking by post-processing such as photolithography. The coating film of the partition walls is as thick as 100 to 200 μm even after firing, and many die coating methods are introduced as means for uniformly coating the partition wall paste with this film thickness.
[0004]
In order to improve productivity in this die coating method, a coating film is formed by applying to a plurality of regions on a substrate so that a plurality of products can be obtained from a single glass substrate (multiple drawing). Yes. This multi-chamfering is an effective technique from the viewpoint of improving the productivity of the entire manufacturing process.
[0005]
As a die coater corresponding to this type of multiple chamfering, a plurality of coated members such as a glass substrate can be formed by a die having a plurality of discharge ports (for example, Patent Documents 1 and 2) or a plurality of dies (for example, Patent Document 3). Application to the application area is shown. There is also means (intermittent application) for applying a plurality of surfaces by repeatedly discharging and stopping the application liquid with one die (for example, Patent Document 2).
[0006]
[Patent Document 1]
JP-A-10-113595 (third column, ninth line to third column, 27th line, fourth column, 47th line to sixth column, first line, FIG. 2)
[0007]
[Patent Document 2]
Japanese Patent Laid-Open No. 10-43659 (third column, line 8 to fourth column, line 12; FIG. 1; first column, line 42 to second column, line 15; FIG. 3)
[0008]
[Patent Document 3]
JP 10-216599 A (column 7, line 32 to column 8, line 28, FIG. 2)
[0009]
[Problems to be solved by the invention]
When a product is manufactured with multiple chamfers, it is difficult to manufacture a good product without defects on all 100% surfaces. It is not known in which process the defect occurs, and processing may be performed on a surface already known to be defective, which may increase the manufacturing cost.
[0010]
For example, even if a defect occurs on the surface (region) where the electrode or dielectric is formed in the manufacturing process of the back plate of the plasma display, the partition is formed by a die coater in the partition forming process regardless of the defect. For this purpose, a predetermined thickness of glass paste may be applied. Since the glass paste is expensive, applying it to a waste surface (region) that does not become a product increases the cost significantly.
[0011]
The object of the present invention is to solve the above-mentioned problems in multi-chamfering, do not apply to the surface (area) that already has a defect as a product, save paste, energy loss, etc., and create a system that can reduce costs. Another object of the present invention is to provide a coating method and a coating apparatus using the same, and a method for manufacturing a member for a plasma display.
[0012]
[Means for Solving the Problems]
The object of the present invention is achieved by the means described below.
[0013]
The coating method of the present invention comprises: A die having a discharge port which is an outlet of a plurality of independently formed slits arranged in the longitudinal direction While relatively moving the coated member and The number corresponding to the number of discharge ports Apply the coating liquid from the coating liquid supply means. Die And supplying the coating liquid Die Discharge more than a plurality of non-overlapping parts Corresponding to the outlet In the coating method of forming a coating film in the coating area, Good or defective products for each application area Based on information Good product Application area Then Coating film On the other hand, do not form a coating film in the defective coating area Select Independently controlling the coating liquid supply means Application is performed.
[0015]
Further, the coating apparatus of the present invention discharges the coating liquid supply means for supplying the coating liquid and the coating liquid supplied from the coating liquid supply means onto the member to be coated. It is the exit of a plurality of independently formed slits arranged in the longitudinal direction Has discharge port Die And the coated member and Die An applicator comprising a moving means for relatively moving, The coating liquid supply means has a number corresponding to the number of discharge ports of the die, Furthermore, a transmitter that transmits information from the previous process by electrical communication, and a plurality of non-overlapping parts on the coated member Corresponding to the outlet Based on the transmitted information, the coating film formed by actually applying the coating film formed in the coating region each The apparatus further includes a determination device that selects each application region.
[0017]
Furthermore, the manufacturing method of the member for plasma display which becomes this invention, Above A member for a plasma display is manufactured using the coating method.
[0018]
If the coating method and the coating apparatus according to the present invention are used, a coating film to be formed for each of a plurality of coating regions on the coated member is selected based on information from the previous process, and coating is performed on the coated member. Therefore, it can be applied only to the non-defective part until the previous process, and it can be avoided to apply it to the defective part. Therefore, the cost can be reduced.
[0019]
According to the method for producing a member for plasma display according to the present invention, since the member for plasma display is produced using the above-described excellent coating method, it is possible to produce a member for plasma display with high quality at a low cost. It becomes possible.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. .
[0021]
1 is an overall perspective view of a die coater 1 which is a coating apparatus according to the present invention, FIG. 2 is a schematic configuration diagram showing the die coater 1 of FIG. 1 including a coating liquid supply system, and FIG. FIG. 4 is a schematic configuration diagram showing the die coater 200 of FIG. 3 including a coating solution supply system.
[0022]
Referring to FIG. 1, there is shown a die coater 1 applied to manufacturing a partition for a plasma display according to the present invention. The die coater 1 performs coating by discharging a coating solution from the dies 40A and B for each of the coating regions R1 and R2 of the substrate A (member to be coated) to form coating films C1 and C2 (FIG. 2). The die coater 1 includes a base 2 on which a pair of guide groove rails 4 are provided. The guide groove rails 4 are provided with a mounting table 6 that reciprocates freely in the horizontal direction on the guide groove rails 4 via a pair of slide legs 8. The upper surface of the mounting table 6 is a suction surface 90 having suction holes (not shown), and the substrate A can be suction fixed by vacuum suction. Sensors 92 A and 92 B for detecting the position of the lower end surface of the die 40 are attached to the top of the mounting table 6. The guide groove rail 4 is covered with a cover 10.
[0023]
Between the pair of guide groove rails 4, a casing 12 incorporating feed screw mechanisms 14, 16, and 18 shown in FIG. 2 is disposed. The casing 12 extends in the horizontal direction along the guide groove rail 4. As shown in FIG. 2, the feed screw mechanisms 14, 16, and 18 have a feed screw 14 that is a ball screw. The feed screw 14 is screwed into a nut-like connector 16 fixed to the lower surface of the mounting table 6, and extends through the connector 16. Both ends of the feed screw 14 are rotatably supported by a bearing (not shown), and an AC servo motor 18 is connected to one end thereof.
[0024]
As shown in FIG. 1, two die columns 24A and 24B are arranged at substantially the center of the upper surface of the base 2, and each of these die columns 24A and 24B has an inverted L shape. . The tips of the die columns 24A, B are installed above the reciprocating path of the mounting table 6, and lift mechanisms 26A, 26B are respectively attached thereto. The elevating mechanisms 26A, B are provided with elevating brackets (not shown) that can elevate, and the elevating brackets are guided by a pair of guide rods in the casings 28A, B so as to be movable up and down. In addition, a feed screw (not shown) made of a ball screw located between the guide rods is also rotatably disposed in the casings 28A and 28B, and a nut-type connector is connected to the feed screw. A lifting bracket is connected. With this configuration, the lifting bracket can be moved up and down. Further, AC servomotors 30A and 30B are connected to the upper end of the feed screw. The AC servomotors 30A and B are attached to the upper surfaces of the casings 28A and B.
[0025]
Die holders 32A and 32B are attached to each lifting bracket via a support shaft (not shown). The die holders 32 </ b> A and B have a U-shape and extend horizontally above the pair of guide groove rails 4 in the substrate width direction (a direction perpendicular to the reciprocating direction of the mounting table 6). The support shafts of the die holders 32A and 32B are rotatably supported in the lifting bracket, so that the die holders 32A and 32B can rotate in the vertical plane together with the support shaft.
[0026]
Further, horizontal bars 36A, B are also fixed to the lifting bracket, and the horizontal bars 36A, B are located above the die holders 32A, B and extend along the die holders 32A, B. Electromagnetically operated linear actuators 38A, 38B having telescopic rods protruding from the lower surfaces thereof are attached to both ends of the horizontal bars 36A, B, respectively. These telescopic rods are arranged such that their lower ends are in contact with both ends of the die holders 32A and 32B.
[0027]
The die holders 32A and B hold dies 40A and B which are applicators. As apparent from FIG. 1, the slit dies 40A and B extend horizontally in the direction perpendicular to the reciprocating direction of the mounting table 6, that is, the longitudinal direction of the die holders 32A and B, and both ends thereof are supported by the die holders 32A and B. Has been. With the above structure, the dies 40A and 40B can be moved up and down independently.
[0028]
In addition, a sensor column 20 is disposed on the upper surface of the base 2 on the front side of the die columns 24A and 24B. The sensor column 20 is also in an inverted L shape. A thickness sensor 22 is attached to the tip of the sensor column 20 via a bracket 21 so as to be above the reciprocating path of the mounting table 6.
[0029]
As shown schematically in FIG. 2, the dies 40 </ b> A and 40 </ b> B each have a long block-shaped rear lip 60 </ b> A and B and a front lip 66 </ b> A and B that are not illustrated in the reciprocating direction of the mounting table 6. The connecting bolts are integrally connected to each other. The lowermost surfaces of the rear lips 60A, B and the front lips 66A, B are discharge port surfaces 74A, B that hold the coating films C1, C2 formed in the coating regions R1, R2, respectively. The clearance from the discharge port surface 74A, B to the clearance of the substrate A is set to an optimum value from the applicability.
[0030]
Inside the dies 40A and B, slits 64A and B serving as a flow path for the coating liquid for forming the coating films C1 and C2 are formed between the rear lips 60A and B and the front lips 66A and B. The slits 64A, B serve as discharge ports 72A, B which are outlets of the coating liquid on the lower surfaces of the dies 40A, B. The gap between the slits 64A, B is secured by a shim (not shown) sandwiched between the parallel portions of the rear lips 60A, B and the front lips 66A, B, and can be set to any size. The discharge amount distribution in the longitudinal direction of the dies 40A and B (direction perpendicular to the paper surface of FIG. 2) is determined by the lip gap distribution in the longitudinal direction of the die 40. That is, when the lip gap is wide, the discharge amount increases, and when the lip gap is narrow, the discharge amount decreases. Further, on the upstream side of the slits 64A and B, manifolds 62A and B are formed which communicate with the slits 64A and B and extend horizontally in the longitudinal direction (substrate width direction) of the dies 40A and B. The manifolds 62A, B are connected to the discharge pipes 42A, B via the internal passages of the dies 40A, B.
[0031]
Upstream of the dies 40A and B are discharge pipes 42A and B, discharge valves 84A and B, syringe pumps 44A and B, suction pipes 82A and B, suction valves 86A and B, tanks 50A and B, and in tanks 50A and B The coating liquids 76A and 76B can be supplied to the dies 40A and 40B. These constitute the coating liquid supply means.
[0032]
The syringe pumps 44A and B are composed of syringes 80A and B, pistons 52A and B, and branch pipes 46A and B. When the suction valves 86A and B are opened and the discharge valves 84A and B are closed, when the pistons 52A and B are lowered by a driving device (not shown), the coating liquid fills the syringes 80A and B via the branch pipes 46A and B. To do. Next, when the suction valves 86A and B are closed and the discharge valves 84A and B are opened, and the pistons 52A and B are raised, the coating liquid filled in the syringes 80A and B passes through the branch pipes 46A and B and the die 40A. , B.
[0033]
The operating conditions such as the switching timing of the suction valves 86A and 86B, the discharge valves 84A and 84, the operation timing of the syringe pumps 44A and 44B, the discharge amount of the coating liquid, and the discharge speed are the computers to which the respective devices are electrically connected. 54 controls each device independently. Furthermore, in order to control the operation of the syringe pumps 44A and 44B in conjunction with the mounting table 6 and the like, in addition to the thickness sensor 22, a sequencer 56 is also electrically connected to the computer 54. The sequencer 56 controls the operation of the AC servomotor 18 of the feed screw 14 on the mounting table 6 side, the AC servomotors 30A and B of the elevating mechanisms 26A and B, and the linear actuators 38A and B. For control purposes, the sequencer 56 detects signals indicating the operating states of the AC servomotors 18, 30A, B, signals from the position sensor 58 that detects the movement position of the mounting table 6, and operating states of the dies 40A, B. A signal from a sensor (not shown) is input. On the other hand, the sequencer 56 outputs a signal indicating a sequence operation to the computer 54. With the above configuration, it is possible to arbitrarily perform the discharge of the coating liquids 76A and B from the dies 40A and B and the raising and lowering operations of the dies 40A and B. Instead of using the position sensor 58, it is also possible to incorporate an encoder in the AC servomotor 18 and detect the movement position of the mounting table 6 by the sequencer 56 based on the pulse signal output from the encoder. It is also possible to incorporate control by the computer 54 into the sequencer 56 itself.
[0034]
The computer 54 is further electrically connected to the host computer 100. The host computer 100 is also electrically connected to the main control unit of each device constituting the manufacturing process other than the die coater 1, and information indicating the status of each process and device, and the status (defects and others) for each substrate. ) Is stored. From the computer 100, the computer 54 is notified of the substrate number of the substrate A to be coated, the defect information generated in the previous process, and the non-defective / defective product information. On the other hand, the computer 54 is notified to the host computer 100 of the coating conditions such as the coating conditions in the die coater 1 and the substrate number that has been coated. Further, the computer 54 analyzes and determines the defect information and the non-defective / defective product information transmitted from the host computer 100, and applies to each of the application regions R1 and R2 for those having specific defects or defective products. It also has a function to prevent the operation from being performed. In particular, in multi-chamfering that applies to two or more application areas on a substrate, information is transmitted to each application area, and based on that information, the application area that is considered to be defective is not applied, but is regarded as a good product. It is selectively controlled by the computer 54 so as to apply only the application area.
[0035]
Next, a method for coating the two coating regions R1 and R2 of the substrate A shown in FIG. 1 using the die coater 1 will be described.
[0036]
First, when the origin of each operation unit in the coating apparatus is returned, the mounting table 6 and the dies 40A and 40B move to the standby position. By this time, the coating liquid has been supplied to the tanks 50A and 50B, and the discharge (removal of air) in the coating liquid supply line from the tanks 50A and B to the die 40A and B has already been completed. The supply line is filled with the coating liquid.
[0037]
Next, using the sensors 92A and 92B at the tips of the mounting table 6, the height distribution in the substrate width direction of the discharge port surfaces 74A and B of the dies 40A and B with reference to the suction surface 90 of the mounting table 6 is measured. Then, the expansion / contraction amount of each linear actuator 38A, B is adjusted so that the discharge port surfaces 74A, B are parallel to the suction surface 90 of the mounting table 6. At this time, the discharge port surfaces 74A, B with the suction surface 90 of the mounting table 6 as a reference point are associated with the vertical coordinate axes (Z-axis) values of the elevating mechanisms 26A, B, so-called each of the discharge port surfaces 74A, B. Origin search is also executed and completed at the same time. If the elevation position of the die 40 is controlled based on this vertical coordinate axis value, the discharge port surfaces 74A and 74B can be moved from the suction surface 90 to an arbitrary height position. When these operations are completed, the mounting table 6 and the dies 40A and B are returned to the origin.
[0038]
After this preparation operation is completed, lift pins (not shown) are raised on the surface of the mounting table 6, and when the substrate A is placed on the upper portion of the loader from the loader (not shown), the lift pins are lowered to place the substrate A on the upper surface of the placement table. Place and adsorb.
[0039]
Next, the mounting table 6 is moved at a predetermined speed, and is stopped when the central portion of the substrate A comes under the thickness sensor 22. In this stop state, the thickness sensor 22 measures the substrate thickness of the substrate A, calculates the values to be lowered for the dies 40A and B from the thickness and the clearance previously given as a condition, and sets the die at that position. 40A and B are lowered.
[0040]
On the other hand, the syringe pumps 44A and 44B are in a standby state while sucking a predetermined amount of coating liquid from the tanks 50A and 50B during this time.
[0041]
Next, upon request from the computer 54, the substrate number of the substrate A transferred to the mounting table 6 and the non-defective / defective product information for each of the coating areas R 1 and R 2 on the substrate A are transmitted from the host computer 100 to the computer 54. Is done. The computer 54 analyzes the transmitted information for each of the application areas R1 and R2, and controls the application information so as not to be applied if it is a defective product. Specifically, the mounting table 6 is moved and the dies 40A and 40B are moved up and down, but the parameters are set inside the computer 54 so as not to operate the syringe pumps 44A and B that handle the area designated as defective. Do. As a result, application / non-application (R1, R2: application, R1: application & R2: non-application, R1: non-application & R2: application, R1) in four combinations according to the non-defective / defective product information for each of the application areas R1, R2. , R2: non-coating).
[0042]
Next, in order to apply the application region R2 with the die 40A and the application region R1 with the die 40B, first, the mounting table 6 is started to move at a predetermined application speed. When the application start points S2 and S1 of each application region are directly below the discharge port 72A of the die 40A and the discharge port 72B of the die 40B, when applying, the syringe pumps 44A and 44B are activated independently, The coating liquids 76A and 76B are fed into the dies 40A and 40B, and coating is started. When the application end points E2 and E1 of the application regions R2 and R1 on the substrate A are respectively located immediately below the discharge port 72A of the die 40A and the discharge port 72B of the die 40B, a signal is output from the computer 54 and the syringe pump 44A and 44B are stopped and the dies 40A and 44B are raised independently to completely reach the coating liquids 76A and 76B from the substrate A to finish the coating.
[0043]
When application is not performed, the syringe pumps 44A and 44B corresponding to the regions R2 and R1 are not driven.
[0044]
On the other hand, the mounting table 6 continues to move, stops when the substrate A reaches the end point position where the substrate A is transferred by the unloader, releases the suction of the substrate A, raises the lift pins, and lifts the substrate A.
[0045]
At this time, the lower surface of the substrate A is held by an unloader (not shown), and the substrate A is transported to the next step. When the delivery to the unloader is completed, the mounting table 6 lowers the lift pins and returns to the origin position.
[0046]
During this time, the syringe pumps 44A, B perform a suction operation to newly fill the coating liquids 76A, B from the tanks 50A, B. Needless to say, the syringe pumps 44A and 44B corresponding to the regions R2 and R1 where the application is not performed do not perform this suction operation. Then, waiting for the next substrate A to come, the same operation is repeated.
[0047]
Next, a die coater 200 which is another embodiment of the present invention will be described with reference to FIG.
[0048]
The die coater 200 discharges and applies the coating liquid to the regions R3 and R4 aligned in the substrate width direction with a single die 210 to form the coating films C3 and C4. The die coater 200 has the same basic equipment configuration as the die coater 1, but has a single die 210 and a longer substrate width direction (a direction perpendicular to the reciprocating direction of the mounting table 206). There are some differences from the die coater 1 of FIG. The different parts are as follows. First, since there is one die holder 224 that holds the die 210, the elevator mechanism 26 that raises and lowers the die holder, the casing 28 that constitutes the elevator mechanism 26, and the AC servo motor 30 are one unit. Further, one horizontal bar 226 necessary for rotating the die in the vertical plane is one, and one on each of the left and right sides of the linear actuator 38. These are only the number of units, and are structurally the same as those shown by the die coater 1.
[0049]
Further, since the width direction of the substrate A has become longer, the mounting table 206 that holds the substrate A also becomes longer in the width direction, and accordingly, the die support 204 that supports the lifting mechanism 26 has a longer protrusion from the base 202. . Further, the bracket 230 for holding the thickness sensor 22 is also increased correspondingly as the distance between the sensor support 20 and the thickness sensor 22 for holding the thickness sensor 22 is increased. The casing 228 is also long in the width direction.
[0050]
In FIG. 3, the guide rail groove 4, the slide leg 8, and the cover 10 have the same sensors 92 </ b> A and B as those indicated by the die coater 1.
[0051]
On the other hand, in the die 210, as shown in FIG. 4, a long block-shaped rear lip 212 and front lip 214 are integrally coupled to each other by a plurality of connecting bolts (not shown) in the reciprocating direction of the mounting table 206. Configured. The lowermost surfaces of the rear lip 212 and the front lip 214 are discharge port surfaces 222 that hold coating films C3 and C4 (FIG. 4) formed in the coating regions R3 and R4, respectively.
[0052]
Inside the die 210, slits 216A, B serving as a flow path for the coating liquid for forming the coating films C3, C4 are formed between the rear lip 212 and the front lip 214. The slits 216 </ b> A and B serve as discharge ports 220 </ b> A and B that are outlets of the coating liquid on the discharge port surface 222. The discharge ports 220A and B are disposed corresponding to the application regions R3 and R4. The gap between the slits 216 </ b> A, B is secured by a shim (not shown) sandwiched between the rear lip 212 and the parallel portion of the front lip 214.
[0053]
Further, on the upstream side of the slits 216A, B, manifolds 218A, 218B are formed independently so as to communicate therewith and extend horizontally in the longitudinal direction (substrate width direction) of the die 210. The manifolds 218A, B are connected to the discharge pipes 42A, B via the internal passage of the die 210. The upstream of the discharge pipes 42A and B is connected to the discharge valves 84A and B, the syringe pumps 44A and B, the suction pipes 82A and B, the suction valves 86A and B, and the tanks 50A and B, similarly to the die coater 1. Thereby, the coating liquids 76A and B in the tanks 50A and 50B are discharged from the two discharge ports 220A and B of the die 210, so that the coating films C3 and C4 can be formed on the coating regions R3 and R4 of the substrate A. The discharge valves 84A and B, the syringe pumps 44A and B, the suction pipes 82A and B, the suction valves 86A and B, and the tanks 50A and B are exactly the same as those of the die coater 1 shown in FIG. The operation conditions such as valve switching timing, syringe pump operation timing, coating liquid discharge amount, discharge speed and the like are independently controlled by the sequencer 234. The sequencer 234 also sequentially controls the operations of the AC servomotor 18 of the feed screw 14 on the mounting table 206 side, the AC servomotor 30 of the lifting mechanism 26, and the linear actuator 38. For this purpose, the sequencer 234 includes a signal indicating the operating state of the AC servomotors 18 and 30, a signal from the position sensor 58 that detects the movement position of the mounting table 206, a sensor (not shown) that detects the operating state of the die 210, A signal from the thickness sensor 22 is input. With the above configuration, the discharge of the coating liquids 76 </ b> A and B from the die 210 and the raising / lowering operation of the die 210 can be arbitrarily performed in accordance with the movement of the mounting table 206.
[0054]
Furthermore, the sequencer 234 is further electrically connected to the sequencer 236 of the apparatus in the previous process and the sequencer 238 of the apparatus in the subsequent process, along with the delivery of the substrate processed in the previous process, as well as the substrate number, product defects, and non-defective products. In addition to receiving substrate information such as defective products, after the application at the die 210 is completed, information from the previous process and additional information at the die coater 200 are transmitted to the subsequent process together with the substrate.
[0055]
Then, the sequencer 234 analyzes and determines the information received from the previous process. As a result, for example, the application area that is determined to be defective is not applied, and only the application area that is determined to be non-defective is applied. It also has functions. ,
The application method of the application regions R3 and R4 arranged in parallel in the width direction by the die coater 200 is as follows.
[0056]
First, the mounting table 6 and the die 210 of the die coater 200 are moved to the standby position. By this time, the coating liquid is supplied to the tanks 50A and 50B, and the coating liquid supply lines from the tanks 50A and B to the die 210 are filled with the coating liquid.
[0057]
Further, the parallel adjustment and origin search of the die 210 with the mounting table 206 using the sensors 92A and 92B are performed in the same manner as the die coater 1 and completed.
[0058]
First, the substrate A is placed on the top surface of the mounting table 206 and sucked from a loader (not shown). At the same time that the substrate is transferred from the loader, the loader sequencer transmits the substrate number and the non-defective / defective product information for each of the coating areas R3 and R4 on the substrate A to the sequencer 234 of the die coater 200.
[0059]
Next, the mounting table 206 is moved at a coating speed, and when the substrate A comes directly below the thickness sensor 22, the substrate thickness of the substrate A is measured, and the die 210 is moved to a predetermined position from the thickness and the clearance previously given as a condition. Lower.
[0060]
When the application start points S3, S4 of the application regions R3, R4 of the substrate are directly below the discharge ports 220A, B of the die 210, the syringe pumps 44A, B are driven to send the application liquids 76A, 76B to the die 210, Start application.
[0061]
At this time, the sequencer 234 drives the syringe pumps 44A and B corresponding to the application areas R3 and R4 from the sequencer 234 to the application area which is a defective product based on the transmitted non-defective product / defective product information of the application areas R3 and R4. Since no command is issued and the operation is not performed, the application area which is a defective product is not applied. On the other hand, since the drive commands are issued to the corresponding syringe pumps 44A and 44B for the coating regions R3 and R4 which are good products, the coating liquid is discharged from the die 210 and coating is performed.
[0062]
When the application end points E3 and E4 of the application regions R3 and R4 on the substrate A come to a position immediately below the discharge ports 220A and B of the die 210, a signal is output from the sequencer 234 to stop the syringe pumps 44A and 44B. Then, the die 210 is raised independently, and the coating liquids 76A and 76B are completely covered with the substrate A, and the coating is finished.
[0063]
When application is not performed, the syringe pumps 44A and 44B corresponding to the application regions R3 and R4 are not driven, so there is no stop operation of the syringe pump, and the die 210 only rises.
[0064]
On the other hand, the mounting table 206 continues to move, stops when the substrate A reaches the end point position where the substrate A is transferred by the unloader, and releases the suction of the substrate A. Then, the substrate A is transported to the next process by an unloader (not shown), and the mounting table 206 is returned to the origin. As the substrate A is transported to the next process, the substrate number, non-defective / defective product information, and information obtained during coating are transmitted from the sequencer 234 to the sequencer of the next process apparatus.
[0065]
During this time, the syringe pumps 44A, B perform a suction operation to newly fill the coating liquids 76A, B from the tanks 50A, B. Needless to say, the syringe pumps 44A and 44B corresponding to the regions R3 and R4 where the application is not performed do not perform this suction operation. Then, waiting for the next substrate A to come, the same operation is repeated.
[0066]
The coating liquid to which the present invention can be applied has a viscosity of 1 cps to 100000 cps, preferably 10 cps to 50000 cps, and can be applied to both Newtonian and thixotropic coating liquids. As the substrate A, in addition to glass, a metal plate such as aluminum, a ceramic plate, a resin plate, a silicon wafer, or the like may be used. Further, as application conditions to be used, the clearance between the substrate A and the discharge port surface of the die is 40 to 500 μm, more preferably 80 to 300 μm, and the application speed is 0.1 m / min to 10 m / min, more preferably 0.5 m. / Min to 6 m / min, the die discharge gap is 50 to 1000 μm, more preferably 100 to 600 μm, and the coating thickness is 5 to 400 μm, more preferably 20 to 250 μm.
[0067]
The present invention is not limited to the above-described embodiment, and can be applied to any case as long as a region to be applied and a region not to be applied are selected from a plurality of application regions based on information from the previous process. .
[0068]
For example, in the die coater 1 of FIG. 1, there is nothing related to the die 40B such as the die 40B, the die holder 32B, the lifting mechanism 26B, the AC servo motor 30B, the die support 24B, etc., and the coating regions R1 and R2 are intermittently performed only by the die 40A. The present invention can also be applied to the application. In this case, when applying the application regions R1 and R2, the syringe pump 44A is operated while the application regions R1 and R2 pass under the discharge port 72A of the die 40A.
In addition, when there is an application region that is not applied from the defective product information in the previous process among the application regions R1 and R2, the syringe pump 44A is not operated when the application region passes through the discharge port 72A of the die 40A. The computer 54 controls the operation.
[0069]
【Example】
Photosensitive silver paste is screen-printed on the entire surface of a soda glass substrate of 440 mm width × 750 mm length × 2.8 mm thickness to a thickness of 5 μm, and then a photomask is formed so that it can be separated into two regions of 340 mm length × 440 mm width. The striped 1920 silver electrodes having a pitch of 220 μm and a length of 330 mm were formed in two places through each of the steps of development and baking. A glass paste made of glass and a binder was screen-printed on the electrode and then baked to form a dielectric layer at two locations in the region. Next, two dies having a discharge width of 430 mm and a lip gap (shim thickness) of 500 μm are mounted on the die coater shown in FIG. The glass paste was filled. Each die was lowered so that the clearance between the die 40 and the dielectric layer was 350 μm, and then the photosensitive glass paste was applied at a coating thickness of 300 μm and a coating speed of 1 m / min. The portion corresponding to the region R1 in FIG. 2 is coated with a die corresponding to the die 40A, and the portion corresponding to the region R2 is coated with a die corresponding to the die 40B, and photosensitive at two regions of 340 mm length × 440 mm width. A coating film of glass paste was formed separately. The substrate was taken out with a transfer machine, put into a drying furnace using a radiant heater, and dried at 100 ° C. for 30 minutes. When the coating thickness distribution after drying was measured over the entire surface of the substrate, it was within the range of 140 μm ± 3 μm. Next, exposure was performed using a photomask designed to form a partition between adjacent electrodes, and development and baking were performed to form the partition. The shape of the partition wall was a pitch of 220 μm, a line width of 30 μm, and a height of 130 μm, and the number of partition walls in each region was 1921. Thereafter, phosphor pastes of R, G, and B were sequentially applied by screen printing, dried at 80 ° C. for 15 minutes, and finally baked at 460 ° C. for 15 minutes to produce a back plate of the plasma display. The surface quality of the obtained plasma display back plate was satisfactory. Next, the plasma display back plate and the front plate were put together, sealed, sealed with a mixed gas of Xe 5% and Ne 95%, and a driving circuit was connected to obtain a plasma display.
[0070]
In the above-described photosensitive glass paste application process, 1000 substrates were loaded, but information on defective products generated in the pre-application process from the host computer 100 for each substrate is applied to the application regions R1 and R2 of each substrate. And transmitted to the computer 54. And it controlled so that application | coating area | region R1, R2 on the board | substrate reported to be inferior goods might not apply | coat. As a result, out of the 1000 substrates, the coating region R1 was applied to 990 (non-application 10), and the application region R2 was applied to 985 (non-application 15). Furthermore, the number of the coating regions R1 and R2 that were not applied on one substrate was three.
[0071]
【The invention's effect】
If the coating method and the coating apparatus according to the present invention are used, a coating film to be formed for each of a plurality of coating regions is selected on the basis of information from the previous process, and coating is performed on a member to be coated. It is possible to apply only to the non-defective part, and it is possible to prevent the cost reduction due to the application to the defective part.
[0072]
According to the method for producing a member for plasma display according to the present invention, since the member for plasma display is produced using the above-described excellent coating method, it is possible to produce a member for plasma display with high quality at a low cost. It becomes possible.
[Brief description of the drawings]
FIG. 1 is a perspective view schematically showing a die coater according to an embodiment of the present invention.
2 is a schematic configuration diagram showing the die coater of FIG. 1 including a coating liquid supply system. FIG.
FIG. 3 is a perspective view schematically showing a die coater according to another embodiment of the present invention.
4 is a schematic configuration diagram showing the die coater of FIG. 3 including a coating liquid supply system. FIG.
[Explanation of symbols]
1: Die coater
2: Base
4: Guide groove rail
6: Mounting table
8: Slide leg
10: Cover
12: Casing
14: Feed screw
16: Connector
18: AC servo motor
20: Sensor support
21: Bracket
22: Thickness sensor
24: Die support
26, 26A, 26B: lifting mechanism
28, 28A, 28B: casing
30, 30A, 30B: AC servo motor
32, 32A, 32B: Die holder
36, 36A, 36B: Horizontal bar
38, 38A, 38B: Linear actuator
40A, 40B: Die (applicator)
42A, 42B: Discharge piping
44A, 44B: Syringe pump
46A, 46B: Branch pipe
50A, 50B: Tank
52A, 52B: Piston
54: Computer
56: Sequencer
58: Position sensor
60A, 60B: Rear lip
62A, 62B: Manifold
64A, B: Slit
66A, 64B: Front lip
72A, 72B: Discharge port
74A, 74B: Discharge port surface
76A, 76B: Coating liquid
80A, 80B: Syringe
84A, 84B: Discharge valve
86A, 86B: Suction valve
90: Adsorption surface
92A, 92B: Sensor
100: Host computer
200: Die coater
202: Base
204: Die support
206: Mounting table
210: Die (applicator)
212: Rear lip
214: Front lip
216A, 216B: Slit
218A, 218B: Manifold
220A, 220B: Discharge port
222: Discharge port surface
228: casing
230: Bracket
234: Sequencer
236: Sequencer for previous process equipment
238: Sequencer 238 for post-process device
A: Substrate
C1, C2, C3, C4: coating film
R1, R2, R3, R4: Application area

Claims (3)

While a plurality of independently formed and the die and the coated member having a discharge port is an outlet of a slit arranged in the longitudinal direction is relatively moved, die coating liquid than the number of coating liquid supply means corresponding to the number of discharge ports In the coating method in which the coating liquid is discharged from the die and a coating film is formed in a coating region corresponding to the plurality of discharge ports that do not overlap with each other on the member to be coated. based on the non-defective or defective information for each region, while forming a a a coating region in the coating film good, independent control of the coating liquid supply means is selected so as not to form a coating film in the coating area is defective a coating method and, and performs coating. A coating liquid supply means for supplying the coating liquid , and a discharge port which is an outlet of a plurality of independently formed slits that discharge the coating liquid supplied from the coating liquid supply means onto the member to be coated. a die having a Applicator apparatus provided with a moving means, for relatively moving the application member and the die, the coating liquid supplying means comprises a number corresponding to the number of ejection ports of the die, yet from the previous step Based on the transmitted information from the transmitter for transmitting information by electrical communication and the coating film formed in the coating region corresponding to the plurality of discharge ports not overlapping on the member to be coated, An applicator, further comprising: a determination unit that selects, for each of the application regions, an application film that is actually formed by application . A method for producing a member for a plasma display, comprising producing a member for a plasma display using the coating method according to claim 1 .

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