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JP4159751B2 - Sphere processing method and jig used in the method - Google Patents
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JP4159751B2 - Sphere processing method and jig used in the method - Google Patents

Sphere processing method and jig used in the method Download PDF

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JP4159751B2
JP4159751B2 JP2001001545A JP2001001545A JP4159751B2 JP 4159751 B2 JP4159751 B2 JP 4159751B2 JP 2001001545 A JP2001001545 A JP 2001001545A JP 2001001545 A JP2001001545 A JP 2001001545A JP 4159751 B2 JP4159751 B2 JP 4159751B2
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Prior art keywords
polishing
guide ring
machine
spherical
disk
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JP2002205252A (en
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昌男 藤野
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Advantest Corp
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Advantest Corp
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Description

【0001】
【発明の属する技術分野】
この発明は球状被加工物の球面研磨加工を行う方法及びその方法に用いる治具に関する。
【0002】
【従来の技術】
例えば磁性体共振器において使用されるYIG(イットリウム鉄ガーネット)球などのフェリ磁性体の単結晶球の研磨加工においては、材料が硬くてもろく、また加工歪が残留しないようにする必要があることから、研磨盤を使用して球面研磨加工を行うといった方法が採用されている。
図3はこのような球状被加工物の研磨加工の従来例として、平面研磨機を使用する構成を示したものである。
【0003】
研磨盤(下研磨盤)11の周上に搭載されたガイドリング12は円筒状をなし、その外周面が支持アーム13によって支持されている。支持アーム13は図示しない筐体から延長されたアーム部13aと、その先端に取り付けられた円弧状をなす支持部13bと、その支持部13bの両端に取り付けられたベアリング13cとよりなり、両ベアリング13cがガイドリング12の外周面と接触する構造となっている。
ガイドリング12はこのような支持アーム13によって支持されることにより、研磨盤11上で回転自在(自転自在)とされ、また研磨盤11の回転に伴い、その回転方向に動かないように研磨盤11の周方向の動きが規制されている。
【0004】
ガイドリング12内には円板状をなすキャリア14と上研磨盤(荷重盤)15とが収容されている。キャリア14の周上には例えば6つの収容孔14aが等角間隔で形成されており、これら収容孔14aに研磨すべき被加工物16がそれぞれ可動自在に配置される。上研磨盤15はこれら被加工物16上に積載されており、この上研磨盤15によって各被加工物16に所要の荷重が付加される。
上記のような構成を有する平面研磨機においては、研磨盤11を回転させると、作用する周速差によってガイドリング12及び被加工物16を保持したキャリア14が研磨盤11上で回転(自転)し、被加工物16が研磨盤11と上研磨盤15とに挟まれた状態でころがりながら動くため、その表面が研磨されるものとなる。なお、この際、支持アーム13は矢印17で示したように、適宜往復運動される。図中、18は研磨盤11を回転させる回転シャフトを示す。
【0005】
【発明が解決しようとする課題】
ところで、上述したような平面研磨機を使用した研磨加工においては、球状被加工物16が研磨盤11と上研磨盤15とによって2点支持された構造となっているため、研磨加工の進行に伴い、被加工物16がいわゆる三角おむすびのような形状になる傾向があり、真球度の良好な球が得られないといった問題がある。一方、研磨加工において、真球度の良い球を得る方法として、図4に示したような構成を有するV研磨機を使用する方法がある。
【0006】
このV研磨機は上研磨盤21と、いわゆるV研磨盤と称される下研磨盤22とが対向配置されたもので、下研磨盤22にはその対向面の円周上にV溝23が形成されている。
上研磨盤21と下研磨盤22とはそれぞれ回転シャフト24,25に取り付け支持されており、また上研磨盤21とその回転シャフト24とは例えば上下方向に移動可能とされ、かつ所要の荷重を付加できる構造となっている。
このV研磨機においては、被加工物16をV溝23に必要数配置し、それら被加工物16に上研磨盤21を接触させ、荷重を付加した状態で、上研磨盤21と下研磨盤22とを例えば逆方向に回転させることによって、被加工物16がV溝23上をころがりながら動き、これによって被加工物16が研磨されるものとなっており、この際、被加工物16は3点支持された構造となっているため、真球度の良好な球が得られるものとなっている。
【0007】
このようにV研磨機を使用すれば、真球度の良好な球を得ることができるものの、そのためには新たにV研磨機を導入しなければならず、導入コストがかかり負担の大きいものとなっていた。
この発明の目的はこの問題に鑑み、新たにV研磨機を導入することなく、汎用の平面研磨機を使用して真球度の良好な球を得られるようにした球加工方法を提供することにあり、さらにその方法に用いる治具を提供することにある。
【0008】
【課題を解決するための手段】
請求項1の発明によれば、円周上にV溝が形成されたV研磨盤のV溝に複数の球状被加工物を配置し、それら被加工物上に上研磨盤を積載して、その上研磨盤に対してV研磨盤を相対的に回転させることにより、被加工物の球面研磨を行う加工方法において、V研磨盤を円筒状ガイドリングの底面に取り付けて固定し、そのガイドリングを平面研磨機の研磨盤の周上に、その周方向の動きを規制して搭載し、上記研磨盤を回転させることにより、V研磨盤に作用する周速差によって、上記球面研磨を行うためのV研磨盤の上記回転を得るものとする。
【0009】
請求項2の発明によれば、平面研磨機の回転する研磨盤の周上に、支持アームによってその周方向の動きが規制され、かつ回転自在に支持されて搭載され、研磨盤の回転により作用する周速差によって研磨盤上で回転する構造とされた治具は、円筒状ガイドリングと、そのガイドリングの底面に取り付け固定されたV研磨盤とよりなり、V研磨盤はその内面側に、円周上に形成されたV溝を具備しているものとされる。
【0010】
【発明の実施の形態】
この発明の実施の形態を図面を参照して実施例により説明する。
図1はこの発明による球加工用治具の一実施例の構成を断面図で示したものである。この例では治具31は円筒状をなすガイドリング32と、そのガイドリング32に取り付け固定されたV研磨盤33とよりなるものとされる。
V研磨盤33は円周上に形成されたV溝34を具備しており、このV溝34形成面が内面側とされてガイドリング32の底面に、その開口を蓋するように取り付けられている。
【0011】
上記のような構成とされた治具31は図3におけるガイドリング12と同様に、平面研磨機の研磨盤の周上に、支持アームによってその周方向の動きが規制され、かつ回転自在(自転自在)に支持されて搭載されるものとされる。
図2Aはこの治具31が平面研磨機の研磨盤の周上に搭載された状態を示したものであり、図3と対応する部分には同一符号を付してある。
研磨盤11を回転させると、支持アーム13によって支持されている治具31はV研磨盤33に作用する周速差によって研磨盤11上で回転する。従って、V溝34に研磨すべき球状被加工物16を所要数図2Bに示したように配置し、それら被加工物16上に上研磨盤15を積載して所要の荷重を付加することによって、被加工物16の球面研磨加工が行われるものとなる。
【0012】
被加工物16はV溝34と上研磨盤15とによって3点支持されているため、真球度の良好な球を得ることができ、即ちこのような加工方法を採用することにより、平面研磨機で真球度良く、球状被加工物16の球面研磨加工を行えるものとなる。
図2A中、35は支持アーム13に固定されている研磨液供給管を示し、この研磨液供給管35を介して研磨液が治具31内に供給されるものとなっている。なお、上研磨盤15に対してV研磨盤33が相対的に良好に回転して被加工物16がV溝34上を良好にころがるように、つまり上研磨盤15がV研磨盤33の回転に連動して回転しないように、上研磨盤15は固定しておくのが好ましい。固定は図には示していないが支持アーム13を利用して行うことができる。
【0013】
【発明の効果】
以上説明したように、この発明による球加工方法によれば、新たにV研磨機を導入することなく、汎用の平面研磨機を使用して真球度良く、球状被加工物の球面研磨加工を行うことができる。
また、この発明による球加工用治具によれば、上記のような平面研磨機を使用した球面研磨加工を簡易に行えるものとなる。
【図面の簡単な説明】
【図1】この発明による球加工用治具の実施例を示す断面図。
【図2】この発明による球加工方法を説明するための図。
【図3】平面研磨機を使用した従来の球加工方法を説明するための図。
【図4】V研磨機を使用した従来の球加工方法を説明するための図。
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for performing spherical polishing of a spherical workpiece and a jig used in the method.
[0002]
[Prior art]
For example, in polishing of ferrimagnetic single crystal spheres such as YIG (yttrium iron garnet) spheres used in magnetic resonators, the material must be hard and brittle and processing strain must not remain. Therefore, a method of performing spherical polishing using a polishing disk is employed.
FIG. 3 shows a configuration in which a flat polishing machine is used as a conventional example of polishing of such a spherical workpiece.
[0003]
A guide ring 12 mounted on the periphery of a polishing disk (lower polishing disk) 11 has a cylindrical shape, and an outer peripheral surface thereof is supported by a support arm 13. The support arm 13 includes an arm portion 13a extended from a housing (not shown), an arc-shaped support portion 13b attached to the tip thereof, and bearings 13c attached to both ends of the support portion 13b. 13 c is in contact with the outer peripheral surface of the guide ring 12.
The guide ring 12 is supported by such a support arm 13 so as to be freely rotatable (rotatable) on the polishing disk 11, and the polishing disk so as not to move in the rotating direction as the polishing disk 11 rotates. 11 movement in the circumferential direction is restricted.
[0004]
A disc-shaped carrier 14 and an upper polishing disc (load disc) 15 are accommodated in the guide ring 12. For example, six accommodation holes 14a are formed at equiangular intervals on the circumference of the carrier 14, and workpieces 16 to be polished are movably disposed in the accommodation holes 14a. The upper polishing disk 15 is loaded on these workpieces 16, and a necessary load is applied to each workpiece 16 by the upper polishing disk 15.
In the planar polishing machine having the above-described configuration, when the polishing plate 11 is rotated, the carrier 14 holding the guide ring 12 and the workpiece 16 is rotated (rotated) on the polishing plate 11 by the acting peripheral speed difference. Since the workpiece 16 moves while rolling in a state sandwiched between the polishing disc 11 and the upper polishing disc 15, the surface thereof is polished. At this time, the support arm 13 is appropriately reciprocated as indicated by an arrow 17. In the figure, reference numeral 18 denotes a rotating shaft for rotating the polishing board 11.
[0005]
[Problems to be solved by the invention]
By the way, in the polishing process using the planar polishing machine as described above, since the spherical workpiece 16 is supported at two points by the polishing disk 11 and the upper polishing disk 15, the polishing process proceeds. Accordingly, there is a problem that the workpiece 16 tends to have a shape like a so-called triangular rice ball, and a sphere with good sphericity cannot be obtained. On the other hand, in the polishing process, there is a method of using a V polishing machine having a configuration as shown in FIG.
[0006]
In this V polishing machine, an upper polishing disk 21 and a lower polishing disk 22 called a so-called V polishing disk are arranged so as to face each other. The lower polishing disk 22 has V grooves 23 on the circumference of the opposing surface. Is formed.
The upper polishing disk 21 and the lower polishing disk 22 are attached to and supported by rotating shafts 24 and 25, respectively, and the upper polishing disk 21 and the rotating shaft 24 are movable in the vertical direction, for example, and a required load is applied. It has a structure that can be added.
In this V polishing machine, the required number of workpieces 16 are arranged in the V-groove 23, the upper polishing disc 21 is brought into contact with the workpiece 16, and a load is applied to the upper polishing disc 21 and the lower polishing disc. 22 is rotated in the opposite direction, for example, and the workpiece 16 moves while rolling on the V-groove 23, whereby the workpiece 16 is polished. At this time, the workpiece 16 is Since the structure is supported at three points, a sphere with good sphericity can be obtained.
[0007]
In this way, if a V grinder is used, a sphere with good sphericity can be obtained, but for that purpose, a new V grinder must be introduced, which introduces a large burden due to the introduction cost. It was.
In view of this problem, an object of the present invention is to provide a sphere processing method in which a sphere having a good sphericity can be obtained by using a general-purpose plane polishing machine without newly introducing a V polishing machine. And providing a jig used in the method.
[0008]
[Means for Solving the Problems]
According to the invention of claim 1, a plurality of spherical workpieces are arranged in the V groove of the V polishing disk in which V grooves are formed on the circumference, and the upper polishing disk is loaded on the workpieces. In addition, in a processing method of performing spherical polishing of a workpiece by rotating the V polishing disk relative to the polishing disk, the V polishing disk is attached and fixed to the bottom surface of the cylindrical guide ring, and the guide ring Is mounted on the periphery of a polishing disk of a surface polishing machine by regulating the circumferential movement thereof, and rotating the polishing disk to perform the spherical polishing by the peripheral speed difference acting on the V polishing disk. The above-mentioned rotation of the V polishing machine is obtained.
[0009]
According to the second aspect of the present invention, the circumferential movement of the surface polishing machine is restricted by the support arm, and is rotatably supported and mounted on the circumference of the rotating polishing machine of the flat surface polishing machine, and acts by the rotation of the polishing machine. The jig that is structured to rotate on the polishing disk due to the difference in peripheral speed consists of a cylindrical guide ring and a V polishing disk that is fixedly attached to the bottom surface of the guide ring. And V-grooves formed on the circumference.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a sectional view showing the structure of an embodiment of a ball processing jig according to the present invention. In this example, the jig 31 includes a cylindrical guide ring 32 and a V polishing disk 33 attached and fixed to the guide ring 32.
The V-polishing disc 33 has a V-groove 34 formed on the circumference, and the surface on which the V-groove 34 is formed is the inner surface side, and is attached to the bottom surface of the guide ring 32 so as to cover the opening. Yes.
[0011]
As in the case of the guide ring 12 in FIG. 3, the jig 31 configured as described above has its circumferential movement restricted by the support arm on the periphery of the polishing machine of the surface polishing machine, and is rotatable (autorotated). It is supposed to be supported and mounted.
FIG. 2A shows a state in which the jig 31 is mounted on the periphery of a polishing machine of a plane polishing machine, and parts corresponding to those in FIG.
When the polishing plate 11 is rotated, the jig 31 supported by the support arm 13 rotates on the polishing plate 11 due to the peripheral speed difference acting on the V polishing plate 33. Accordingly, by arranging the required number of spherical workpieces 16 to be polished in the V-groove 34 as shown in FIG. 2B, and loading the upper polishing board 15 on these workpieces 16 and applying the required load. Then, spherical polishing of the workpiece 16 is performed.
[0012]
Since the workpiece 16 is supported at three points by the V-groove 34 and the upper polishing board 15, a sphere having a good sphericity can be obtained, that is, by adopting such a processing method, surface polishing is performed. This makes it possible to perform spherical polishing of the spherical workpiece 16 with good sphericity.
In FIG. 2A, reference numeral 35 denotes a polishing liquid supply pipe fixed to the support arm 13, and the polishing liquid is supplied into the jig 31 through the polishing liquid supply pipe 35. The V polishing disk 33 rotates relatively well with respect to the upper polishing disk 15 so that the workpiece 16 rolls well on the V groove 34, that is, the upper polishing disk 15 rotates the V polishing disk 33. The upper polishing board 15 is preferably fixed so as not to rotate in conjunction with the rotation. Although not shown in the figure, the fixing can be performed using the support arm 13.
[0013]
【The invention's effect】
As described above, according to the sphere processing method according to the present invention, spherical polishing of a spherical workpiece can be performed with good sphericity by using a general-purpose surface polishing machine without newly introducing a V polishing machine. It can be carried out.
Further, according to the sphere processing jig according to the present invention, the spherical polishing using the above-described flat polishing machine can be easily performed.
[Brief description of the drawings]
FIG. 1 is a sectional view showing an embodiment of a ball processing jig according to the present invention.
FIG. 2 is a view for explaining a ball processing method according to the present invention.
FIG. 3 is a view for explaining a conventional sphere processing method using a plane polishing machine.
FIG. 4 is a view for explaining a conventional sphere processing method using a V polishing machine.

Claims (2)

円周上にV溝が形成されたV研磨盤のV溝に複数の球状被加工物を配置し、それら被加工物上に上研磨盤を積載して、その上研磨盤に対してV研磨盤を相対的に回転させることにより、被加工物の球面研磨を行う加工方法であって、
上記V研磨盤を円筒状ガイドリングの底面に取り付けて固定し、
そのガイドリングを平面研磨機の研磨盤の周上に、その周方向の動きを規制して搭載し、
上記研磨盤を回転させることにより、上記V研磨盤に作用する周速差によって、上記球面研磨を行うためのV研磨盤の上記回転を得ることを特徴とする球加工方法。
A plurality of spherical workpieces are arranged in the V-groove of a V-polishing machine in which V-grooves are formed on the circumference, and an upper polishing machine is loaded on these workpieces, and V-polishing is performed on the upper grinding machine. A processing method for performing spherical polishing of a workpiece by relatively rotating a board,
Attach and fix the above V grinding machine to the bottom of the cylindrical guide ring,
The guide ring is mounted on the circumference of the polishing machine of the surface polishing machine, with its circumferential movement restricted.
A sphere processing method characterized in that the rotation of the V polishing disk for performing the spherical polishing is obtained by rotating the polishing disk by a peripheral speed difference acting on the V polishing disk.
平面研磨機の回転する研磨盤の周上に、支持アームによってその周方向の動きが規制され、かつ回転自在に支持されて搭載され、研磨盤の回転により作用する周速差によって研磨盤上で回転する構造とされた治具であって、
円筒状ガイドリングと、
そのガイドリングの底面に取り付け固定されたV研磨盤とよりなり、
上記V研磨盤はその内面側に、円周上に形成されたV溝を具備していることを特徴とする球加工用治具。
The circumferential movement of the surface grinder is controlled by the support arm and supported by the support arm so that it can rotate freely. A jig having a rotating structure,
A cylindrical guide ring;
It consists of a V grinding machine attached and fixed to the bottom of the guide ring,
The V-grinding machine has a V-groove formed on the circumference on the inner surface side thereof.
JP2001001545A 2001-01-09 2001-01-09 Sphere processing method and jig used in the method Expired - Fee Related JP4159751B2 (en)

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CN101841312B (en) * 2010-05-07 2013-10-30 中国电子科技集团公司第九研究所 YIG harmonic oscillator, YIG oscillator and manufacturing methods thereof
CN108608274A (en) * 2018-06-12 2018-10-02 常州市润昌光电科技有限公司 A kind of ultra-precision continuous polishing machine
CN108907971A (en) * 2018-07-28 2018-11-30 杭州智谷精工有限公司 A kind of method for fine finishing of small size sphere
CN110340742B (en) * 2019-07-18 2021-08-27 浙江科惠医疗器械股份有限公司 Biological ceramic sphere double-polishing-head polishing device

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