JP4159802B2 - Thick-baked wafer sheet and manufacturing method thereof - Google Patents

Description

【００１９】
＜評価基準＞
食感
◎：サクサク感、口溶けとも良好で、適度な硬さがあって食べ応えがある。
〇：サクサク感、口溶けともかなり良好で、おおむね適度な硬さがあって食べ応えがある。
△：サクサク感がやや不足して、口溶けがやや悪い、又は逆にフワフワしてやや軽過ぎ、硬さがやや過ぎているか又はやや不足して食べ応えがやや不満足。
×：サクサク感が不足して、口溶けが悪い、又は逆にフワフワして軽過ぎ、硬さが過ぎているか又は不足して食べ応えが不満足。
【００２０】
◎：歪みが殆ど見られず、後工程で何ら問題を生じない。
〇：多少歪みが見られるが、裁断工程（スライサー）での適応性、裁断による一定形状の製品が得られる観点で殆ど問題を生じない。
△：部分的であってもかなり歪みが見られ、スライサーに適応したり、しなかったりする。
×：歪みがひどく、スライサーに適応しない。
【００２１】
【表１】

【００２２】
実施例２
実施例１において、澱粉として試料No.３のヒドロキシプロピル澱粉を用い、原料粉中のヒドロキシプロピル澱粉の比率（小麦粉とヒドロキシプロピル澱粉の総量に対する比率）を表２に示す割合に変えた他は実施例１と同様にして５ｍｍの厚さを有するウエハースシートを製造した。得られたウエハースシートを実施例１の評価基準に従って評価した。結果を表２に示す。なお、ヒドロキシプロピル澱粉の比率により水分の抜け時間が異なるので、焙焼後の水分が一定になるように表２に示す焙焼時間とした。
【００２３】
【表２】

【００２４】
実施例３
実施例１において、澱粉として試料No.３のヒドロキシプロピル澱粉を用い、ウエハースシートのプレート間隔を調整して厚さを変え、それぞれに焙焼時間を変えた他は同様にして厚さの異なるウエハースシートを製造した。得られたウエハースシートを実施例１の評価基準に従って評価した。結果を表３に示す。
【表３】

[0001]
[Industrial application fields]
The present invention relates to a thick-fired wafer sheet and a method for producing the same, and more particularly to a thick-fired wafer sheet having excellent texture and no distortion after release and a method for producing the same.
[0002]
[Prior art]
The wafer sheet uses wheat flour as the raw material powder, powdered milk, egg yolk, swelling agent, salt, spices, fats and oils, etc. as the auxiliary material, water is added and poured into two baking mold plates as a liquid type and roasted into a thin plate shape Manufactured by baking.
Conventional wafer sheets are rarely eaten as they are and can be added to the ice cream etc., and in most cases, the cream or chocolate is sanded into 1 to 3 layers or coated with chocolate. For that reason, the thickness was up to about 3 mm.
[0003]
The biggest reason why it is rare to eat a wafer sheet as it is is that it is fluffy and unresponsive to eating. The conventional product is thin, and there is a reason that it is too light and fluffy, including this point, if it can be made thicker and more responsive to eating The wafer sheet is crisp and can be accepted as a kind of confectionery with a good mouth melt texture.
However, if the thickness is simply increased by extension of the conventional method, a wafer sheet having a certain shape cannot be obtained particularly when the wafer sheet which has been released after roasting is severely distorted. is the current situation.
[0004]
In Japanese Patent Laid-Open No. 10-155410, the reason why it is rare to eat as it is is that there is no sweetness because sugar is not blended in the conventional general blending, and the taste and texture are not favorable (pasapasa to the teeth In order to improve such a problem, it is difficult to mix with sugar, which may cause scorching during roasting, decrease mold release from the mold plate, and cause distortion after mold release. A wafer sheet containing a low sugar alcohol and / or sugar has been proposed. However, there is no point at all about the thickness of the wafer sheet, and what is shown in the test example is 2.5 mm, which is the thickness of the category of the conventional product, and it is not satisfactory in terms of eating texture. There wasn't.
[0005]
Japanese Patent Laid-Open No. 2000-253832 discloses that a sheet of baked confectionery having a thickness of 2.0 to 10.0 mm is coated with an oily food (such as chocolate) having a thickness of 1 to 15 mm. A confectionery is disclosed in which the surface layer of food is roasted and does not become sticky even if it is held by hand, while maintaining the original softness of the oily food. The patent is a confectionery characterized by an oleaginous food, and as a sheet-like baked confectionery coated with an oleaginous food, a wafer sheet is mentioned together with a pie, cake, cracker, meringue and pretzel. However, only the raw materials to be used are described with respect to its production, and it is also “the ones that have been used conventionally can be freely used, and the usage ratio can be determined by appropriately selecting from the conventional ratio”. It is only described. That is, it is understood that the conventional method is used as a manufacturing method, and even if it is a thickness, it is understood that the thickness of the wafer sheet is a conventional category, and the thickness actually shown in the embodiment is 3 mm. The thickness of the category.
[0006]
Conventionally, wheat flour has been used as a raw material powder for wafer sheets, but there is also a proposal to replace part or all of this with other raw materials containing starch for a special purpose. Japanese Patent Application Laid-Open No. 11-46669 describes that, from the viewpoint of not containing wheat flour that causes allergies, starch and polysaccharides having a thickening action can be used as raw material flour, and various processed starches can be used as starch. However, it is merely intended that processed starch as well as natural starch can be used, and it is not intended to eat the wafer sheet as it is, nor does it suggest a thick-baked wafer sheet.
Japanese Patent Laid-Open No. 11-9176 discloses a baked confectionery using a soy protein-containing material, tapioca starch and trehalose, and wafers are shown as one of the baked confectionery. As tapioca starch, etherified tapioca starch is also mentioned, but tapioca starch is a problem that occurs when using soybean protein-containing material using 3 to 15 wt% in combination with trehalose in the dry solid content of baked goods There is no suggestion that tapioca modified starch exhibits any properties, especially in wafer sheets.
[0007]
[Problems to be solved by the invention]
An object of the present invention is to provide a thick-baked wafer sheet that has a moderate hardness when eaten and has a texture that is responsive to eating, and that is crispy and well meltable, and can be accepted as a kind of confectionery as it is. That is.
Another object of the present invention is to provide a method for producing the above thick wafer sheet, particularly a method for producing a thick wafer sheet that eliminates the problem of distortion after demolding that is observed during the production of the thick wafer sheet. .
[0008]
[Means for Solving the Problems]
In view of the present situation, the present inventors have intensively studied and found that the above problems can be solved by using hydroxypropyl starch having a specific substitution degree as a main raw material, and completed the present invention.
That is, this invention provides the thick baking wafer sheet manufactured using the raw material powder | flour in which the substitution degree 0.07-0.18 hydroxypropyl starch occupies 50 mass% or more.
The present invention also provides a method for producing a thick-baked wafer sheet, characterized by using a raw material powder in which hydroxypropyl starch having a substitution degree of 0.07 to 0.18 occupies 50% by mass or more.
The thickness of the thick-baked wafer sheet of the present invention is preferably 4 to 6 mm. As the raw material starch for hydroxypropyl starch, potato starch and tapioca starch are preferred.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, a wafer sheet has a desired shape such as a plate or shell made of a smooth or mesh pattern with a liquid surface (batter) poured into a heated plate and sandwiched and baked. The term “baked confectionery” refers to a crisp and crisp texture. Also, the wafer refers to a wafer sheet sandwiched with chocolate, caramel, cream or the like or a wafer sheet surface covered with these.
The thick-baked wafer sheet of the present invention is basically the above-described wafer sheet, the thickness of which exceeds about 3 mm, preferably 4 to 6 mm, has an appropriate texture, and remains as it is. It is a wafer sheet that can be eaten even if you eat it. In addition, moderate hardness is not light and fluffy like a conventional wafer sheet, and conversely, it is not too hard, and it feels good to eat when you eat it as it is. Hardness that can be felt.
[0010]
In the present invention, the raw material flour is a material that forms a body of a wafer sheet, and conventionally wheat flour has been mainly used, and corn flour, rice flour, starch and the like have been used in combination with some wheat flour. The present invention is characterized by using a raw material powder in which 50% by mass, preferably 60-90% by mass of the raw material powder is a hydroxypropyl starch having a predetermined substitution degree.
The hydroxypropyl starch used in the present invention is obtained by allowing propylene oxide to act on starch according to a conventional method, and among them, the degree of substitution (expressed in terms of moles of hydroxypropyl groups per glucose unit of starch) is 0.07-0. It is in the range of 18. If the degree of substitution is less than 0.07, it is difficult to obtain the intended effect, and if it exceeds 0.18, the texture tends to be slightly fluffy and unresponsive to eating.
As the raw material starch used for producing hydroxypropyl starch, any commercially available starch is effective, but tapioca starch and / or in terms of preventing distortion after mold release and obtaining a more preferable texture. Potato starch is more preferred.
[0011]
In the present invention, the thick-baked wafer sheet refers to a wafer sheet having a thickness not found in conventional ordinary products, that is, a thickness exceeding about 3 mm, preferably 4 to 6 mm. The thickness of the conventional wafer sheet is about 3mm, and this was sufficient in the case of wafers sanded with chocolate etc., but to eat as it is, it is fluffy and unresponsive, and it is eaten as it is It was rare. Further, when a thick-baked wafer sheet is produced by a conventional method, there is a problem that distortion after release is particularly large in addition to a texture problem.
[0012]
The present invention is suitable for eating a wafer sheet as a kind of novel confectionery as it is, and it has a crispy and well-melted texture unique to the wafer sheet and has a suitable hardness with a suitable hardness. It is provided as a product.
Such a wafer sheet uses a raw material powder in which the above-mentioned hydroxypropyl starch occupies 50% by mass or more, preferably a raw material powder consisting of 60 to 90% by mass and wheat flour 40 to 10% by mass, Can be obtained. If the proportion of the hydroxypropyl starch in the raw material powder is less than 50% by mass, not only a preferable texture can be obtained, but also the distortion after release becomes large, and a product having a certain shape cannot be obtained.
[0013]
Furthermore, it is more preferable that the object of the present invention can be more effectively realized by using a raw material powder composed of 60 to 90% by mass of the hydroxypropyl starch and 40 to 10% by mass of wheat flour. Of the raw material flour materials, wheat flour is preferred as a material other than hydroxypropyl starch, but corn flour, rice flour, soybean flour, etc. can be appropriately selected by substituting part of the wheat flour for the desired flavor and texture. Can be used.
[0014]
Auxiliary materials other than the raw material powder used in the present invention are fats and oils such as salad oil, butter, margarine, shortening, sugars such as sugar, trehalose, fructose, glucose, starch syrup, maltose, various reducing sugars, whole eggs, egg yolk, dried Egg products such as egg yolk, swelling agents such as sodium bicarbonate, ammonium carbonate, baking powder, dairy products such as skim milk powder, whole milk powder, condensed milk, cow milk, other acidulants such as lecithin, emulsifiers such as sucrose fatty acid ester, salt, Color cords, flavors, fruit juice, cocoa, high-intensity sweeteners, and the like can be appropriately selected and used. If desired, vitamins, minerals, various oligosaccharides, dietary fibers, polyphenols, and the like can be added for the purpose of enhancing nutrition.
[0015]
The main purpose of the present invention is to enable the wafer sheet to be eaten as a kind of confectionery. From this point of view, the desired amount of flavor and the amount of auxiliary materials required for seasoning are inevitably compared to conventional ones. To be more. For example, in the case of a milk-flavored product, the addition amount of saccharides or high-intensity sweeteners for adding a dairy product or a preferable sweetness is higher than usual.
The object of the present invention can be achieved by using the above-mentioned raw material powder and auxiliary raw material to form a thick-fired wafer sheet, and other production conditions can conform to conventional methods.
[0016]
An example of a preferred embodiment of the present invention is shown below.
In a mixer containing 0.8 to 2.0 times as much water as the raw material powder, the raw material powder, sugar, swelling agent, salt, dried whole egg, skim milk powder, etc. In the case of a solid fat, a batter (liquid type) is prepared by adding and mixing heated and melted fat and emulsifier. At this time, a part of the water can be replaced with milk, and when liquid materials such as liquid sugar, syrup, whole egg, fruit juice are used, it is likely to become uniform if added and mixed before the powder material is mixed. ,preferable.
The obtained batter is poured into the lower plate of the wafer oven, and the upper plate is pressed and roasted. At that time, the interval between the plates is adjusted so that the thickness of the obtained wafer sheet becomes 4 to 6 mm. It is also possible to make a rod-like or shell-like product using a plate or rod-like shell. The wafer sheet obtained by baking is cooled and cut into a desired shape to obtain a product.
Since the wafer sheet of the present invention has an appropriate hardness and is responsive to eating, it is suitable for eating as it is as a kind of confectionery, but it is sanded with chocolate, jelly, cream, caramel, etc. It can also be used as a wafer coated with.
[0017]
Hereinafter, the present invention will be described in more detail with reference to Examples and Reference Examples. In Examples and Reference Examples, “part” means “part by mass” and “%” means “mass%”.
[Reference Example 1]
5 parts of starch slurry were prepared by dissolving 20 parts of sodium sulfate in 120 parts of water and adding 100 parts of tapioca starch and 35 parts of 3% aqueous sodium hydroxide solution to these. 3 parts, 5.3 parts, 7 parts of propylene oxide were prepared. Parts, 11 parts and 13.5 parts were added and reacted at 38 to 40 ° C. for 24 hours, then neutralized with hydrochloric acid, washed with water, dehydrated and dried, and then sample No. The hydroxypropyl starch which used 1-5 tapioca starch as a raw material was obtained. The degree of substitution was 0.053, 0.085, 0.108, 0.165, and 0.198, respectively.
[Reference Example 2]
In Reference Example 1, potato starch (substitution degree 0) was changed except that tapioca starch was replaced with potato starch (sample No. 6) and corn starch (sample No. 7) and the addition amount of propylene oxide was 7 parts. .113) and corn starch (substitution degree 0.110).
[0018]
Example 1
A liquid type prepared with the following raw material composition was poured into a lower plate of a wafer oven adjusted to a plate interval that gave a predetermined thickness, and the upper plate was pressure-bonded and baked to produce a thick-baked wafer sheet. At that time, as the starch in the raw material, hydroxypropyl starch of sample Nos. 1 to 7 and raw (non-hydroxypropylated) tapioca starch (comparative example) were used, and roasting was performed at about 150 ° C. for 8 minutes. The texture of the obtained wafer sheet and the distortion after release were evaluated according to the following criteria. The results are shown in Table 1.

[0019]
<Evaluation criteria>
Texture ◎: Crispy texture, good melting in the mouth, moderate hardness and response to eating.
◯: Crispy feeling, melted in mouth is quite good, and generally has moderate hardness and is responsive to eating.
Δ: Slight crispy feeling, slightly melted in the mouth, or slightly fluffy, slightly lighter, slightly too hard, or slightly deficient in eating response.
×: Crispy feeling is insufficient, melting in the mouth is poor, or conversely, fluffy, too light, too hard, insufficient or insufficient, and unsatisfactory eating response.
[0020]
A: Almost no distortion is observed, and no problem occurs in the subsequent process.
A: Some distortion is observed, but hardly causes problems in terms of adaptability in the cutting process (slicer) and obtaining a product having a fixed shape by cutting.
(Triangle | delta): Even if it is partial, distortion is seen considerably, and it adapts to a slicer or does not.
X: Distortion is severe and does not adapt to the slicer.
[0021]
[Table 1]

[0022]
Example 2
In Example 1, except that the hydroxypropyl starch of sample No. 3 was used as the starch, and the ratio of hydroxypropyl starch in the raw material powder (ratio to the total amount of wheat flour and hydroxypropyl starch) was changed to the ratio shown in Table 2. A wafer sheet having a thickness of 5 mm was produced in the same manner as in Example 1. The obtained wafer sheet was evaluated according to the evaluation criteria of Example 1. The results are shown in Table 2. In addition, since the removal time of water | moisture content changes with the ratio of hydroxypropyl starch, it was set as the baking time shown in Table 2 so that the water | moisture content after baking might become constant.
[0023]
[Table 2]

[0024]
Example 3
In Example 1, wafers having different thicknesses were used in the same manner except that the hydroxypropyl starch of sample No. 3 was used as the starch, the thickness was changed by adjusting the plate interval of the wafer sheet, and the roasting time was changed for each. A sheet was produced. The obtained wafer sheet was evaluated according to the evaluation criteria of Example 1. The results are shown in Table 3.
[Table 3]

Claims (8)

A thick-baked wafer sheet manufactured using raw material powder in which hydroxypropyl starch having a substitution degree of 0.07 to 0.18 occupies 50% by mass or more. The thick-baked wafer sheet according to claim 1, wherein the raw material powder comprises 60 to 90% by mass of hydroxypropyl starch having a substitution degree of 0.07 to 0.18 and 40 to 10% by mass of wheat flour. The thick-baked wafer sheet according to claim 1 or 2, wherein the raw material starch of hydroxypropyl starch is tapioca starch and / or potato starch. The thick-fired wafer sheet according to any one of claims 1 to 3, wherein the thick-fired wafer sheet has a thickness of 4 to 6 mm. A method for producing a thick-baked wafer sheet, comprising using a raw material powder in which hydroxypropyl starch having a substitution degree of 0.07 to 0.18 occupies 50% by mass or more. 6. The method for producing a thick-baked wafer sheet according to claim 5, wherein the raw material powder comprises 60 to 90% by mass of hydroxypropyl starch having a substitution degree of 0.07 to 0.18 and 40 to 10% by mass of wheat flour. The method for producing a thick-baked wafer sheet according to claim 5 or 6, wherein the raw material starch of hydroxypropyl starch is tapioca starch and / or potato starch. The method for producing a thick wafer sheet according to any one of claims 5 to 7, wherein the thickness of the thick wafer sheet is 4 to 6 mm.