JP4161222B2 - Electronics - Google Patents

Description

  The present invention relates to a mounting structure between a panel constituting a casing and an electronic component mounting board, and an electronic apparatus having the structure.

  For example, in the case of an acoustic mixer, the electronic component mounting substrate is mounted in the casing of the electronic device. The casing is configured by covering the substrate on which a large number of electronic components such as a volume, a push button switch, and a fader are mounted with a button base. The board and the button base are fixed to the top panel using many screws.

  The button base is formed with a large number of holes through which operation electronic components such as the volume mounted on the substrate are inserted, and functions as a guide for these operation electronic components, and between the substrate and the top panel. It is a tray-shaped resin molded product that functions as a spacer.

  However, when the electronic component mounting board is attached to the panel as described above, there are the following problems.

  Generally, an electronic component mounting board is mounted on a printed wiring board formed of glass epoxy or the like, and soldered by solder dip using a flow soldering device or the like. Warpage is likely to occur. In a state where the substrate is warped, workability is poor when screwed to the top panel of the casing, and solder and parts may be adversely affected when the warp is corrected by screwing.

  In addition, in order to correct the warpage of the substrate, it is necessary to arrange a large number of cylindrical bosses as spacers on the back surface of the top panel and screw them through screw holes formed in the substrate. Furthermore, when there are multiple operation parts such as a volume as electronic parts mounted on the board, it is necessary to support a board by arranging a large number of cylindrical bosses so that the board will not be deformed by the pressing force during the operation. was there. Therefore, time for these screwing operations has been increased.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic apparatus having an electronic component mounting board mounting structure that can eliminate the above-mentioned conventional problems, prevent warping of the board, and shorten the mounting work time.

  The object of the present invention is an electronic device in which an electronic component mounting board is mounted in a casing, and has at least one stay extending on the electronic component mounting board in a direction toward both ends of the board. The stay is coupled to the substrate by a substrate coupling portion provided on the substrate abutting side of the stay, and is abutted on the back surface of the top panel of the casing by the top panel abutting portion of the stay and coupled to the casing. The stay has a positioning convex portion that fits into a positioning hole formed in the substrate, and is positioned on the substrate by fitting the positioning convex portion with the positioning hole. Achieved by electronic equipment.

  According to the present invention, the electronic component mounting board has at least one stay extending in a direction toward both ends of the board, and the stay is provided by the board coupling portion provided on the board contact side of the stay. Since the board is coupled to the stay by being coupled to the substrate, abutting the back surface of the top panel of the casing by the top panel abutting portion of the stay, and coupled to the casing, the solder dip It is possible to prevent the substrate from warping when performing. Further, even if a large number of spacer parts such as bosses are not used separately, the abutment portion functions as a spacer by contacting the top panel.

  In addition, the stay has a positioning convex portion that fits into a positioning hole formed in the substrate, and is positioned on the substrate by fitting the positioning convex portion with the positioning hole. Position accuracy increases.

  A preferred embodiment of the present invention will be described below with reference to FIGS. 1 to 6 as an example of an electronic apparatus according to the present invention that uses an acoustic mixer.

  As shown in FIGS. 1, 5, and 6, the acoustic mixer casing 1 includes a top panel 2, a bottom panel 3, and a side panel 4 (see FIG. 6), each of which is formed of sheet metal. ing.

  An electronic component 7 such as a fader 7a, a push button switch 7b with a light emitting function, a volume (variable resistor) 7c, and an IC 7d is inserted into a through-hole (not shown) of the terminal 8 (see FIG. 3) and soldered. The electronic component mounting substrate 5 is formed by mounting.

  As shown in FIG. 1, the top panel 2 of the casing 1 has an insertion hole 2a for inserting the operating element mounting shaft portions 7a2, 7b2, 7c2 into which the operating elements 7a1, 7b1, 7c1 of the electronic component 7 are mounted. Is formed.

  In addition to the electronic component 7, a total of three stays 9, 10, 11 extending in the direction toward both ends of the substrate 6 are coupled to the electronic component mounting substrate 5 at a substantially central portion and both side portions of the substrate 6. Yes.

  The stays 9 and 10 are long members substantially corresponding to the length of the substrate 6. In the illustrated example, the stays 9 and 10 are substantially cross-sections composed of a panel-facing plate 12 and a pair of opposed upright plates 13 connected at right angles thereto. Although it is formed in a U-shape or a substantially groove-shaped cross section, various shapes such as a substantially I-shaped cross section and a substantially H-shaped cross section can be adopted, and an angle portion (corner portion) is provided to increase bending rigidity. It is preferable to have. The stays 9, 10, and 11 are formed by sheet metal finishing by press working and bending after punching formation.

  As shown in FIG. 4, a through-hole 14 through which the operating element mounting shaft portion 7b2 of the volume 7c exposed on the top panel 2 can be inserted is formed in the panel facing plate 12 extending in the longitudinal direction of the stays 9 and 10. The electronic component mounting area on the substrate 6 is not limited.

  In the illustrated example, the through hole 14 is formed corresponding to the volume 7c. The main body of the volume 7c is accommodated in the space surrounded by the inside of the stays 9 and 10, that is, the panel facing plate 12, the standing plate 13 standing on the substrate, and the substrate 6, and the operator of the volume 7c is mounted. The shaft portion 7b2 is passed through the through hole 14, and the operation member (knob) 7b1 is retrofitted. The through-hole 14 may be formed by, for example, a long hole so as to be compatible with many models.

  In addition, bridge-like raised portions 15 are formed at three positions at equal intervals on the panel facing plate 12 of the stays 9 and 10, and the raised portion 15 has a flat top surface and forms a top panel contact portion 16. is doing. The top panel contact portion 16 is formed with a hole 16a through which a screw or a screw can pass. By bringing the stays 9 and 10 into contact with the top panel 2 through the raised portions 15, even if the top panel 2 is slightly twisted and the flatness is low, the stays 9 and 10. And the top panel 2 can be reliably brought into contact with each other, and both can be firmly coupled.

  Further, as shown in FIG. 4, a plurality of protrusions are formed at intervals on the substrate contact side ends of the pair of upright plates 13 extending in the longitudinal direction of the stays 9 and 10. Consists of a substantially L-shaped protrusion 17 and a flat-plate-shaped protrusion 18. The substantially L-shaped protrusion 17 constitutes a substrate coupling portion that couples the stays 9 and 10 to the substrate 6 by inserting into a hole 6a (see FIG. 3) formed corresponding to the substrate 6 and twisting the tip. .

  The flat plate-like protrusions 18 are fitted into positioning holes 6 b (see FIG. 3) formed corresponding to the substrate 6 and constitute positioning convex portions for positioning the stays 9 and 10 on the substrate 6.

  As shown in FIG. 4B, step portions 17 a and 18 a that can come into contact with the surface of the substrate 9 are formed at the base portions of the protrusions 17 and 18. Therefore, even when the substrate has surface twist or the like and the flatness is inferior, the stays 9 and 10 come into contact with the substrate 6 at the step portions 17a and 18a. The flatness of the substrate 6 can be improved.

  Further, the protrusion 17 sandwiches the substrate 6 between the stepped portion 17a and the L-shaped portion, but the sandwiching height H (see FIG. 4B) is almost equal to the thickness of the substrate 6. Thus, the stays 9 and 10 can be firmly coupled to the substrate 6.

  The protrusions 18 constituting the positioning convex part are preferably arranged between the protrusions 17 that constitute the substrate coupling part and are arranged at a predetermined interval. Thereby, the positional accuracy between the substrate 6 and the stay 11 is increased.

  The stay 11 is a long body having a substantially U-shaped cross section composed of the substrate contact side plate 11a, the standing plate 11b, and the panel facing plate 11c, and has a screw insertion hole formed in the substrate contact side plate 11a. The board | substrate coupling | bond part is comprised by couple | bonding with the board | substrate 6 with the screw | thread 19 (FIG. 3). The stay 11 constitutes a top panel contact portion where the panel facing plate 11 c contacts the top panel 2.

  Further, at both ends of the stays 9, 10, 11, end pieces 20 formed by bending both ends of the panel facing plates 12, 11 c are provided. A screw hole 21 is formed in 20.

  The horn jack 22 is accommodated in the stay 10 as shown in FIG. 3, and the horn jack 22 is fixed to the stay 10 by a nut 22a as shown in FIG. It is preferable to form a projecting projection 23 (see FIG. 4C) to provide a detent member when tightening the nut 22a. A similar convex portion 23 is also formed on the stay 9 (see FIG. 2), and this is used as a detent member for a rotary operation type electronic component such as a volume.

  The electronic component 7 is soldered by a known solder dipping method, but if the stays 9, 10 and 11 are coupled to the substrate by the substrate coupling portion, the warpage of the substrate due to thermal deformation during solder dipping can be prevented. can do. In particular, if both ends of the stays 9, 10, 11 are supported on a side conveyor or the like of a dip soldering apparatus (not shown), the warping of the board can be prevented more reliably.

Thus the electronic component 7 is an electronic component mounting substrate 5 is soldered, screwed with the screw hole 21 of the end piece 20 is polymerized with hole 24 of the side panel 4 shown in FIG.

  Next, as shown in FIGS. 1 and 6, the top panel 2 is covered and the top panel 2 is fixed to the side panel 4 with screws, and a plurality of top panel holders formed on the stays 9 and 10 are fixed. The top panel contact portion 16 selected from the contact portions 16 (in the illustrated example, of the three raised portions 15 formed on each of the stays 9 and 10, the raised portion 15 arranged at the center) is the top. Screw on panel 2. In the illustrated example, the hole 16a formed in the top panel contact portion 16 is formed by burring (rising) and is screwed with a tapping screw. Finally, the bottom panel 3 is screwed to the side panel 4 to complete.

  Further, in the illustrated example, the side panel 4 has a screw hole 4b screwed into a top panel mounting piece 4a formed by bending an edge thereof, and a through hole (not shown) formed in the top panel 2. A screw 25 (see FIG. 6) passed through is screwed into the screw hole 4b to be fixed to the top panel 2. In addition, although the top panel 2 is mounted and fixed on the upper surface of the top panel mounting piece 4a in the illustrated example, it can be fixed to the lower surface of the top panel mounting piece 4a. Although not shown, when the side panel 4 is thick, a screw hole can be screwed into the end face of the side panel, and the top panel 2 can be placed on the end face and screwed.

  If the electronic component mounting substrate is fixed to the casing 1 as described above, the stays 9, 10, and 11 coupled to the electronic component mounting substrate 6 prevent the substrate 5 from warping and function as a spacer. 2 and the substrate 5 may be coupled with a small amount of screws (two in the illustrated example), or the end pieces 20 of the stays 9, 10, 11 may be secured to the side panel 4 with the top panel 2. It is also possible to omit the screwing, and the mounting work efficiency is greatly improved.

  Further, since the stays 9, 10 and 11 also function as beam members for reinforcement, high flatness required when a substrate is large and a large number of operating elements are mounted like the acoustic mixer of this example. Can be satisfied. Furthermore, even when a large number of electronic components for operation such as faders are mounted and a pressing force is frequently applied, the operation pressing force is counteracted, and not only the substrate but also the top panel is reinforced and protected. be able to.

  Note that the casing is often made of metal in order to give a high-class feeling. Conventionally, the cylindrical boss described in the above prior art is made of metal like the casing and welded to the back surface of the top panel. However, the surface of the top panel at the welding site is oxidized by welding, and if the oxide film is polished and removed, the surface condition becomes inhomogeneous, so the casing is painted with a dark-colored paint with no noticeable coating spots. I had to. In the present invention, since there is no need to weld such a conventional cylindrical boss to the top panel 2, there is no fear of paint spots and there is an effect that there is no restriction on the paint color.

It is a vertical side view which shows roughly the state before fixing an electronic component mounting substrate to a casing. It is a perspective view which shows the board | substrate which mounted the electronic component and combined the stay which is a component of this invention. It is a perspective view which shows the back surface of the board | substrate of FIG. 2 shows one of the stays shown in FIG. 2, FIG. 2 (a) is a perspective view, FIG. 2 (b) is a partially enlarged side view, and FIG. 2 (c) is a cross-sectional view taken along line A in FIG. is there. It is a perspective view which shows the state which attached the board | substrate of FIG. 2 to the side panel of the casing. FIG. 3 is an external perspective view of an electronic apparatus to which the substrate of FIG. 2 is attached, in which electronic components are not shown, and the inside is indicated by a dotted line.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Casing 2 Top panel 3 Bottom panel 4 Side panel 5 Electronic component mounting substrate 6 Substrate 7 Electronic component 9, 10, 11 Stay 16 Top panel contact part

Claims (1)

An electronic device in which an electronic component mounting board is mounted in a casing,
Having at least one stay extending on the electronic component mounting substrate in a direction toward both ends of the substrate;
The stay is coupled to the substrate by a substrate coupling portion provided on the substrate abutting side of the stay, and is abutted against the back surface of the top panel of the casing by the top panel abutting portion of the stay and coupled to the casing. ,
The stay has a positioning convex portion that fits into a positioning hole formed in the substrate, and is positioned on the substrate by fitting the positioning convex portion with the positioning hole , and the positioning convex portion An electronic device characterized in that a step portion capable of coming into contact with the substrate surface is formed at a base portion of the substrate .

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