JP4165232B2

JP4165232B2 - Cooling member

Info

Publication number: JP4165232B2
Application number: JP2003006784A
Authority: JP
Inventors: 庸介杉浦; 哲史石川; 邦史松尾
Original assignee: Mitsubishi Electric Corp
Current assignee: Mitsubishi Electric Corp
Priority date: 2003-01-15
Filing date: 2003-01-15
Publication date: 2008-10-15
Anticipated expiration: 2023-01-15
Also published as: JP2004221315A

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品を内部に実装した電子機器を間接冷却する冷却部材に関する。
【０００２】
【従来の技術】
従来の電子機器冷却用の冷却板においては、冷却板は冷媒の流れる流路溝を加工した薄肉平板と均一厚さの極めて薄い平板を接合して構成される。したがって、上記冷却板内には薄肉平板で囲まれた矩形断面の流路が構成されこの内部を冷媒が流れる。流路に冷媒が流れだすと冷却板内の内圧が上昇し内圧上昇により平板が膨張してその表面がエレクトロニクスモジュールに密着しエレクトロニクスモジュールと冷却板間の空気層を減じ、接触熱抵抗を減じ、エレクトロニクスモジュール内の電子部品の発生した熱を放熱することができる。（例えば特許文献１参照）
【０００３】
【特許文献１】
特公平３−２２０７４号公報（第３頁、図３）
【０００４】
【発明が解決しようとする課題】
従来の電子機器冷却用の冷却板は、冷却板内面は平坦な矩形の断面を有するため、冷媒の流れは乱流に発達せず層流状態の流れとなり、冷媒の流れと冷却板内面は剥離した状態であり、冷却板内面と冷媒間の熱伝達率は大きくない状態であった。
そのため、従来の電子機器に搭載される電子部品からの発熱量を移送するためには十分な熱伝達率であるものの、電子部品の高出力化、高密度実装化、稼動率向上などに伴い増大した発熱量を移送するには不十分であり、冷却板内面と冷媒間に許容できない温度差が生じ、結果として電子部品の温度が許容できない温度に上昇するという問題があった。
【０００５】
この発明はこのような問題点を解決するためになされたものであり、冷却板内面と冷媒間の温度差をより小さく抑え、電子部品の温度を許容値内にとどめる電子部品の冷却部材を得ることを目的とする。
【０００６】
【課題を解決するための手段】
課題を解決するために、本発明の冷却部材は、発熱性の電子部品と熱的に間接的に接続され、冷媒の流れる内部流路を形成する内壁面を有し、その内壁面に流路縮小部が構成された冷却部材において、流路縮小部の形状を流路の中心に対して非対象に形成するものである。
【０００７】
【発明の実施の形態】
実施の形態１．
図１（ａ）はこの本発明の実施の形態１において、例えば電子走査アンテナ装置のようにモジュール１が規則正しく配列された電子装置の斜視図であり、図１（ｂ）は図１（ａ）のＡ−Ａにおける断面図、図１（ｃ）は図１（ａ）のＢ−Ｂにおける断面図である。高出力増幅器、低雑音増幅器等の電子部品２を内蔵したモジュール１は、シャーシ５の上にアレイ状に配置されている。
【０００８】
冷却板３は、長尺の平板２枚を対向させて並べ、平板の短手方向の２つの端面を他の長尺の平板で夫々接合して形成される。これによって、冷媒４の流れる長方形状断面の内部流路を形成する内壁面を有し、断面が長方形の枠型形状を成すと共に、側面が帯状に長い外壁面（の長手方向）は冷却面を形成している。
【０００９】
電子部品２を内蔵し電子部品２の保護や所定の性能を得るために冷却が必要なモジュール１は、冷却板３の冷却面に接触して配置される。冷却板３の内部を流れる冷媒４は、冷却板に沿って、冷却面の長手方向に流れる。冷媒４は冷却面の長手方向に流れ、同方向を図１（ｃ）に流れ方向４１ｂとして示す。冷却板の長手方向へ垂直に流入流出する冷媒４は図１（ｂ）に示す流れ方向４１ａに流れる。モジュール1の内部の電子部品２で発生した熱は冷却板３の壁面を通過し冷媒に伝達され、冷媒の流れ方向４１ａに冷媒４を介して移送される。この実施の形態による冷却板３は、その内壁面に流路縮小部を構成し、流路縮小部の形状を流路の中心に対して非対象に形成している。
【００１０】
一方、近年、実装される電子部品２の高出力化、モジュール１内に実装される電子部品２の高密度実装化に伴い、モジュール１の発熱量が増大する傾向にある。これに対応して冷却性能を向上させるために、冷却板３の内部に例えば図２の比較例に示すような冷却構造を設けることも検討されている。図２の冷却板３は、流路に所定の間隔で突起３１を設け、流路を急縮小させる流路縮小部３２ｂを形成する。これにより、冷媒４の流れを乱流化させ、冷却板３内面と冷媒４との間の熱伝達率を向上させる。
しかし、このように構成された電子機器の間接冷却構造では、乱流化した冷媒の流れは冷却板３の内面に向かわないため、冷媒の流れと冷却板内面は依然として剥離状態であって、冷却板３内面と冷媒４との間の熱伝達率を向上させる効果は不十分であった。
【００１１】
図３は実施の形態１による冷却板の断面構造を示す図であり、この図に示す冷却構造では上述の比較例で示したような問題点を解消している。
冷却板３の内面の流路と接する面には複数の突起（第１の突起７及び第２の突起８）が設けられ、第１の突起７及び第２の突起８は冷媒の流れ方向において断面が矩形形状を有している。冷却板を構成する平板それぞれからの第１の突起７及び第２の突起８により流路の幅が縮小される複数の流路縮小部３２が構成される。流路縮小部３２において、第１の突起７の冷媒流入側の面と、第２の突起８の冷媒流入側の面とが、互いに対向するように配置される。第１の突起７は第２の突起８よりも長さが長い。
【００１２】
ここで、第１の突起７の冷媒流入側の面の位置と、第２の突起８の冷媒流入側の面の位置とが、異なる位置になるように配置している。流路縮小部３２において冷媒は乱流化し、乱流化した冷媒の流れは、突起の冷媒流入側の面の位置の違いによって流路縮小部３２に侵入するときに、流れに偏りを生じさせる。
【００１３】
これにより、或る流路縮小部３２と冷媒の流れ方向４１ｂに配置された別の流路縮小部３２との間で冷媒４の流れに偏りが生じる。この偏った流れは、第２の突起８の側の冷却板３の内面に衝突することにより、冷媒４の冷却板３の内面への付着領域が更に増える。その結果、冷却板３の内面と冷媒４との間の熱伝達率を向上させる効果を得る。
【００１４】
このように、冷媒４の流れる内部流路を形成する内壁面を有し、その内壁面に流路縮小部３２が構成され、流路縮小部３２の形状を流路の中心に対して非対称に形成した冷却板３では、冷却板内面と冷媒間の熱伝達率を向上し、冷却板内面と冷媒間の温度差を小さくし、電子部品２の温度をより低減できる。
【００１５】
冷媒の流れる内部流路を形成する内壁面に複数の突起を設け、当該突起により流路の幅が縮小される複数の流路縮小部が構成され、流路縮小部の形状を流路の中心に対して非対称に形成した冷却板では、冷却板内面と冷媒間の熱伝達率を向上し、冷却板内面と冷媒間の温度差を小さくし、電子部品の温度をより低減できる。
【００１６】
少なくとも２つ以上の平板が対向配置されて内部流路の内壁面を構成するとともに、当該平板の流路と接する面に形成された複数の突起を有し、当該突起は冷媒流れ方向において矩形形状を有し、当該平板それぞれからの突起により流路の幅が縮小される複数の流路縮小部が構成され、当該流路縮小部において対向する少なくとも２つの突起の冷媒流入側の面の位置を異なる位置に配置した冷却板では、冷却板内面と冷媒間の熱伝達率を向上し、冷却板内面と冷媒間の温度差を小さくし、電子部品の温度を低減できる。
【００１７】
実施の形態２．
図４は、実施の形態２による冷却板の断面を示す図であり、冷却板３の内面の流路と接する面には複数の突起を有し、当該突起は冷媒流れ方向において矩形形状を有している。当該平板それぞれからの突起により流路の幅が縮小される複数の流路縮小部３２が構成され、流路縮小部３２において、第１の突起９の冷媒排出側の面の位置と対向して配置された第２の突起１０の冷媒排出側の面の位置を、異なる位置に配置している。流路縮小部３２において冷媒は乱流化し、乱流化した冷媒の流れは突起の冷媒排出側の面の位置の違いにより、流路縮小部３２から排出するときに流れに偏りが生じる。
【００１８】
これにより、或る流路縮小部と冷媒の流れ方向に配置された別の流路縮小部との間の冷媒の流れに偏りが生じ、冷却板内面に衝突することにより冷媒の冷却板３の内面への付着領域が増え、その結果、冷却板３内面と冷媒４との間の熱伝達率を向上させる効果を得る。
【００１９】
少なくとも２つ以上の平板が対向配置されて内部流路の内壁面を構成するとともに、当該平板の流路と接する面に形成された複数の突起を有し、当該突起は冷媒流れ方向において矩形形状を有し、当該平板それぞれからの突起により流路の幅が縮小される複数の流路縮小部が構成され、当該流路縮小部において対向する突起の冷媒排出側の面の位置を異なる位置に配置した冷却板では、冷却板内面と冷媒間の熱伝達率を向上し、冷却板内面と冷媒間の温度差を小さくし、電子部品の温度を低減できる。
【００２０】
実施の形態３．
図５は、実施の形態３による冷却板の断面を示す図であり、冷却板３の内面の流路と接する面には複数の突起を有し、当該突起は冷媒流れ方向において矩形形状を有している。当該平板それぞれからの突起により流路の幅が縮小される複数の流路縮小部３２が構成される。
【００２１】
流路縮小部３２において、第１の突起 11の冷媒の流れ方向の長さと、第１の突起 11と対向して配置された第２の突起12の冷媒の流れ方向の長さを異なるように設定している。流路縮小部３２において冷媒は乱流化し、乱流化した冷媒の流れは第１の突起 11と第２の突起12の冷媒の流れ方向の長さの違いにより、流路縮小部に侵入するとき及び流路縮小部から排出するときに流れに偏りが生じる。
【００２２】
これより、或る流路縮小部と冷媒の流れ方向に配置された別の流路縮小部の間の冷媒の流れに偏りが生じ、冷却板内面に衝突することにより冷媒の冷却板３の内面への付着領域が増え、その結果、冷却板３内面と冷媒４との間の熱伝達率を向上させる効果を得る。また、第１の突起 11と第２の突起12の冷媒の流れ方向の長さの違いにより、流路縮小部の冷媒の侵入する側の開口と排出する側の開口は両者とも冷媒の流れの方向に拡く開口していることになり、冷媒の流れの抵抗はより小さくなり、結果として圧力損失が小さくなる効果を得る。
【００２３】
少なくとも２つ以上の平板が対向配置されて内部流路の内壁面を構成するとともに、当該平板の流路と接する面に形成された複数の突起を有し、当該突起は冷媒流れ方向において矩形形状を有し、当該平板それぞれからの突起により流路の幅が縮小される複数の流路縮小部が構成される。流路縮小部において対向する突起の冷媒の流れ方向の長さを異なるように設定した冷却板では、冷却板内面と冷媒間の熱伝達率を向上し、冷却板内面と冷媒間の温度差を小さくし、電子部品の温度を低減できる。
【００２４】
実施の形態４．
図６は、実施の形態４による冷却板の断面を示す図であり、冷却板３の内面の流路と接する面には複数の突起を有し、当該突起は冷媒流れ方向において矩形形状を有している。当該平板それぞれからの突起により流路の幅が縮小される複数の流路縮小部が構成される。
【００２５】
第１の流路縮小部３３においては、第１の突起３の冷媒流入側の面はそれに対向して配置される第１の突起４の冷媒流入側の面の位置に対して冷媒の流れ方向に対して前に位置し、第２の流路縮小部３４においては、第３の突起１５の冷媒流入側の面はそれに対向して配置される第４の突起１６の冷媒流入側の面の位置に対して冷媒の流れ方向に対して前に位置するように、冷媒の流れ方向に対して対向する突起の位置を交互に変化させる。流路縮小部３３，３４において冷媒は乱流化し、乱流化した冷媒の流れは突起の冷媒流入面及び排出側の面の位置の違いにより、流路縮小部から排出するときに流れに偏りが生じる。
【００２６】
これより、或る流路縮小部と冷媒の流れ方向に配置された別の流路縮小部の間の冷媒の流れに偏りが生じ、冷却板内面に衝突することにより冷媒の冷却板３の内面への付着領域が増え、その結果、冷却板３内面と冷媒４との間の熱伝達率を向上させる効果を得る。さらに、冷媒の流れ方向に対して対向する突起の位置を交互に変化させることにより、冷媒の流れの偏り方向が交互に変化し、冷媒の衝突する冷却板内面が交互に規則的に変化することにより、冷却板３内面と冷媒４との間の熱伝達率は冷却板内面の両面に対して均等に向上し、冷却板３の両面に接触固定した電子部品の温度を同様に低減できる。
【００２７】
少なくとも２つ以上の平板が対向配置されて内部流路の内壁面を構成するとともに、当該平板の流路と接する面に形成された複数の突起を有し、当該突起は冷媒流れ方向において矩形形状を有し、当該平板それぞれからの突起により流路の幅が縮小される複数の流路縮小部が構成される。流路縮小部において対向する突起の形状もしくは位置関係を冷媒の流れ方向に沿って変化する冷却板では、冷却板の少なくとも２面において冷却板内面と冷媒間の熱伝達率を向上し、冷却板内面と冷媒間の温度差を小さくし、冷却板の２面に接触固定した電子部品の温度を低減できる。
【００２８】
少なくとも２つ以上の平板が対向配置されて内部流路の内壁面を構成するとともに、当該平板の流路と接する面に形成された複数の突起を有し、当該突起は冷媒流れ方向において矩形形状を有し、当該平板それぞれからの突起により流路の幅が縮小される複数の流路縮小部が構成される。流路縮小部において対向する突起の形状もしくは位置関係を冷媒の流れ方向に沿って交互に規則的に配置する冷却板では、冷却板の少なくとも２面において冷却板内面と冷媒間の熱伝達率を向上し、冷却板内面と冷媒間の温度差を小さくし、冷却板の２面に接触固定した電子部品の温度を低減できる。
【００２９】
実施の形態５．
図７は、実施の形態５による冷却板の断面を示す図であり、冷却板３の内面の流路と接する面には複数の突起を有する。当該平板それぞれからの突起により流路の幅が縮小される複数の流路縮小部３２が構成され、当該流路縮小部３２において、第１の突起１７は冷媒流れ方向において矩形断面形状を有し、対向して配置された第２の突起１８の冷媒流れ方向における断面形状は冷媒流入側に傾斜面を有する断面形状を有する。当該流路縮小部３２において冷媒は乱流化し、乱流化した冷媒の流れは突起の冷媒流れ方向における断面形状の違いにより、当該流路縮小部に侵入するときに流れに偏りが生じる。これより当該流路縮小部と冷媒の流れ方向に配置された別の流路縮小部の間の冷媒の流れに偏りが生じ、冷却板内面に衝突することにより冷媒の冷却板３の内面への付着領域が増え、その結果、冷却板３内面と冷媒４との間の熱伝達率を向上させる効果を得る。なお第２の突起１８の傾斜面が比較的大きい例を示したが、面取り程度の傾斜面を適用する場合もある。
【００３０】
少なくとも２つ以上の平板が対向配置されて内部流路の内壁面を構成するとともに、当該平板の流路と接する面に形成された複数の突起を有し、当該平板それぞれからの突起により流路の幅が縮小される複数の流路縮小部が構成され、当該流路縮小部において対向する突起の冷媒流れ方向における断面形状が異なる冷却板では、冷却板内面と冷媒間の熱伝達率を向上し、冷却板内面と冷媒間の温度差を小さくし、電子部品の温度を低減できる。
【００３１】
実施の形態６．
図８(a)は、実施の形態６による冷却板の断面を示す図であり、冷却板３の内面の流路と接する面には複数の突起を有し、当該突起は冷媒流れ方向において矩形形状を有している。当該平板それぞれからの突起により流路の幅が縮小される複数の流路縮小部３２が構成される。
【００３２】
図８(ｂ)は、図８(a)に示される冷却板をＡ方向から見た図であり、第１の突起１９には当該流路縮小部と交差する方向にスリット２１が、第２の突起２０にはスリット２２が設けられており、当該スリットにおいても、流路は縮小し冷媒は乱流化する。図８(ｃ)は、図８(a)に示される冷却板をＢ方向から見た図であり、突起には、第１の突起１９，第２の突起２０とは異なる位置関係の箇所にスリット２１、２２が設けられている。冷媒の流れは、流路縮小部３２及びスリットにより乱流化し、スリットの位置関係の違いにより、或る流路縮小部と冷媒の流れ方向に配置された別の流路縮小部との間の冷媒の流れに偏りが生じ、冷却板内面に衝突することにより冷媒の冷却板３の内面への付着領域が増え、その結果、冷却板３内面と冷媒４との間の熱伝達率を向上させる効果を得る。
【００３３】
少なくとも２つ以上の平板が対向配置されて内部流路の内壁面を構成するとともに、当該平板の流路と接する面に形成された複数の突起を有し、当該平板それぞれからの突起により流路の幅が縮小される複数の流路縮小部が構成されるとともに、当該突起に当該流路縮小部と交差する方向に少なくとも１つ以上のスリットを設けた冷却板では冷却板内面と冷媒間の熱伝達率を向上し、冷却板内面と冷媒間の温度差を小さくし、電子部品の温度を低減できる。
【００３４】
少なくとも２つ以上の平板が対向配置されて内部流路の内壁面を構成するとともに、当該平板の流路と接する面に形成された複数の突起を有し、当該平板それぞれからの突起により流路の幅が縮小される複数の流路縮小部が構成されるとともに、当該突起に当該流路縮小部と交差する方向に少なくとも１つ以上のスリットを設け、スリットの位置を冷媒流れ方向に沿ったそれぞれの突起ごとに変化させた冷却板では冷却板内面と冷媒間の熱伝達率を向上し、冷却板内面と冷媒間の温度差を小さくし、電子部品の温度を低減できる。
【００３５】
【発明の効果】
以上説明したように本発明によれば、発熱性の電子部品と熱的に間接的に接続され、冷媒の流れる内部流路を形成する内壁面を有し、その内壁面に流路縮小部が構成された冷却部材において、流路縮小部の形状を流路の中心に対して非対象に形成したことにより、冷却板内面と冷媒間の熱伝達率を向上し、冷却板内面と冷媒間の温度差を小さくできる。
【図面の簡単な説明】
【図１】この発明の実施の形態１を示す図である。
【図２】この発明の比較例として示す冷却板の断面図である。
【図３】この発明の実施の形態１における冷却板の断面図である。
【図４】この発明の実施の形態２における冷却板の断面図である。
【図５】この発明の実施の形態３における冷却板の断面図である。
【図６】この発明の実施の形態４における冷却板の断面図である。
【図７】この発明の実施の形態５における冷却板の断面図である。
【図８】この発明の実施の形態６における冷却板の断面図である。
【符号の説明】
１モジュール、２電子部品、３冷却板、４冷媒、５シャーシ、７第１の突起、８第２の突起、９第１の突起、１０第２の突起、１１第１の突起、１２第２の突起、１３第１の突起、１４第２の突起、１５第３の突起、１６第４の突起、１７第１の突起、１８第２の突起、１９第１の突起、２０第２の突起、２１スリット、２２スリット、３１突起、３２流路縮小部、３３流路縮小部、３４流路縮小部。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cooling member for indirectly cooling an electronic device having an electronic component mounted therein.
[0002]
[Prior art]
In a conventional cooling plate for cooling an electronic device, the cooling plate is formed by joining a thin flat plate processed with a flow path groove through which a coolant flows and an extremely thin flat plate having a uniform thickness. Therefore, a rectangular cross-section channel surrounded by a thin flat plate is formed in the cooling plate, and the refrigerant flows through this channel. When the refrigerant flows into the flow path, the internal pressure in the cooling plate rises, the flat plate expands due to the increase in internal pressure, the surface adheres to the electronics module, reduces the air layer between the electronics module and the cooling plate, reduces the contact thermal resistance, The heat generated by the electronic components in the electronics module can be dissipated. (For example, see Patent Document 1)
[0003]
[Patent Document 1]
Japanese Examined Patent Publication No. 3-22074 (page 3, Fig. 3)
[0004]
[Problems to be solved by the invention]
Conventional cooling plates for cooling electronic devices have a flat rectangular cross section on the inner surface of the cooling plate, so that the refrigerant flow does not develop into a turbulent flow and becomes a laminar flow state, and the refrigerant flow and the inner surface of the cooling plate are separated. The heat transfer coefficient between the cooling plate inner surface and the refrigerant was not large.
Therefore, although the heat transfer rate is sufficient to transfer the amount of heat generated from electronic components mounted on conventional electronic devices, it increases with higher output, higher density mounting, and higher operating rates of electronic components. However, there is a problem in that an unacceptable temperature difference occurs between the inner surface of the cooling plate and the refrigerant, and as a result, the temperature of the electronic component rises to an unacceptable temperature.
[0005]
The present invention has been made to solve such problems, and obtains a cooling member for an electronic component that keeps the temperature difference between the inner surface of the cooling plate and the refrigerant smaller and keeps the temperature of the electronic component within an allowable value. For the purpose.
[0006]
[Means for Solving the Problems]
In order to solve the problem, the cooling member of the present invention has an inner wall surface that is thermally indirectly connected to the heat-generating electronic component and forms an internal flow path through which the refrigerant flows, and the flow path is formed on the inner wall surface. In the cooling member in which the reduction part is configured, the shape of the flow path reduction part is formed non-targeted with respect to the center of the flow path.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
FIG. 1A is a perspective view of an electronic device in which modules 1 are regularly arranged, for example, like an electronic scanning antenna device, according to the first embodiment of the present invention. FIG. 1B is a perspective view of FIG. FIG. 1C is a cross-sectional view taken along the line BB of FIG. 1A. Modules 1 incorporating electronic components 2 such as high-power amplifiers and low-noise amplifiers are arranged in an array on a chassis 5.
[0008]
The cooling plate 3 is formed by arranging two long flat plates facing each other, and joining two end surfaces in the short direction of the flat plates with other long flat plates, respectively. This has an inner wall surface that forms an internal flow path with a rectangular cross section through which the refrigerant 4 flows, forms a frame shape with a rectangular cross section, and has an outer wall surface (longitudinal direction) that is long in the form of a strip as a cooling surface. Forming.
[0009]
The module 1 that contains the electronic component 2 and needs to be cooled in order to protect the electronic component 2 and obtain a predetermined performance is disposed in contact with the cooling surface of the cooling plate 3. The refrigerant 4 flowing inside the cooling plate 3 flows in the longitudinal direction of the cooling surface along the cooling plate. The refrigerant 4 flows in the longitudinal direction of the cooling surface, and the same direction is shown as a flow direction 41b in FIG. The refrigerant 4 flowing in and out vertically in the longitudinal direction of the cooling plate flows in the flow direction 41a shown in FIG. The heat generated in the electronic component 2 inside the module 1 passes through the wall surface of the cooling plate 3 and is transmitted to the refrigerant, and is transferred through the refrigerant 4 in the refrigerant flow direction 41a. The cooling plate 3 according to this embodiment forms a flow path reducing portion on the inner wall surface thereof, and the shape of the flow path reducing portion is formed in a non-target with respect to the center of the flow path.
[0010]
On the other hand, in recent years, the amount of heat generated by the module 1 tends to increase as the output of the electronic component 2 to be mounted increases and the density of the electronic component 2 mounted in the module 1 increases. In order to improve the cooling performance correspondingly, it is also considered to provide a cooling structure as shown in the comparative example of FIG. The cooling plate 3 in FIG. 2 is provided with protrusions 31 at predetermined intervals in the flow path to form a flow path reducing portion 32b that rapidly reduces the flow path. Thereby, the flow of the refrigerant 4 is turbulent, and the heat transfer coefficient between the inner surface of the cooling plate 3 and the refrigerant 4 is improved.
However, in the indirect cooling structure of the electronic device configured as described above, since the turbulent refrigerant flow does not go to the inner surface of the cooling plate 3, the refrigerant flow and the inner surface of the cooling plate are still separated, The effect of improving the heat transfer coefficient between the inner surface of the plate 3 and the refrigerant 4 was insufficient.
[0011]
FIG. 3 is a diagram showing a cross-sectional structure of the cooling plate according to the first embodiment, and the cooling structure shown in FIG. 3 solves the problems as shown in the comparative example described above.
A plurality of protrusions (first protrusions 7 and second protrusions 8) are provided on the surface of the inner surface of the cooling plate 3 that is in contact with the flow path, and the first protrusions 7 and the second protrusions 8 are in the refrigerant flow direction. The cross section has a rectangular shape. The first protrusion 7 and the second protrusion 8 from each of the flat plates constituting the cooling plate constitute a plurality of flow path reducing portions 32 in which the width of the flow path is reduced. In the flow path reduction part 32, the refrigerant | coolant inflow side surface of the 1st protrusion 7 and the refrigerant | coolant inflow side surface of the 2nd protrusion 8 are arrange | positioned so that it may mutually oppose. The first protrusion 7 is longer than the second protrusion 8.
[0012]
Here, the position of the surface of the first protrusion 7 on the refrigerant inflow side and the position of the surface of the second protrusion 8 on the refrigerant inflow side are different from each other. The refrigerant is turbulent in the flow path reducing section 32, and the flow of the turbulent refrigerant causes a bias in the flow when entering the flow path reducing section 32 due to the difference in the position of the surface of the protrusion on the refrigerant inflow side. .
[0013]
Thereby, the flow of the refrigerant 4 is biased between a certain flow path reducing part 32 and another flow path reducing part 32 arranged in the flow direction 41b of the refrigerant. This uneven flow collides with the inner surface of the cooling plate 3 on the second protrusion 8 side, so that the region where the refrigerant 4 adheres to the inner surface of the cooling plate 3 further increases. As a result, the effect of improving the heat transfer coefficient between the inner surface of the cooling plate 3 and the refrigerant 4 is obtained.
[0014]
As described above, the inner wall surface forming the internal flow path through which the refrigerant 4 flows is formed, the flow path reducing portion 32 is formed on the inner wall surface, and the shape of the flow path reducing portion 32 is asymmetric with respect to the center of the flow path. The formed cooling plate 3 can improve the heat transfer coefficient between the cooling plate inner surface and the refrigerant, reduce the temperature difference between the cooling plate inner surface and the refrigerant, and further reduce the temperature of the electronic component 2.
[0015]
A plurality of protrusions are provided on the inner wall surface forming the internal flow path through which the refrigerant flows, and a plurality of flow path reducing parts are formed by the protrusions to reduce the width of the flow path. With the cooling plate formed asymmetrically, the heat transfer coefficient between the cooling plate inner surface and the refrigerant can be improved, the temperature difference between the cooling plate inner surface and the refrigerant can be reduced, and the temperature of the electronic component can be further reduced.
[0016]
At least two or more flat plates are arranged to face each other to form an inner wall surface of the internal flow path, and have a plurality of protrusions formed on a surface of the flat plate in contact with the flow path, and the protrusions are rectangular in the refrigerant flow direction. And a plurality of flow path reducing portions in which the width of the flow path is reduced by protrusions from the respective flat plates, and the positions of the surfaces on the refrigerant inflow side of at least two protrusions facing each other in the flow path reducing portions are In the cooling plates arranged at different positions, the heat transfer coefficient between the cooling plate inner surface and the refrigerant can be improved, the temperature difference between the cooling plate inner surface and the refrigerant can be reduced, and the temperature of the electronic component can be reduced.
[0017]
Embodiment 2. FIG.
FIG. 4 is a view showing a cross section of the cooling plate according to the second embodiment. The cooling plate 3 has a plurality of protrusions on the surface in contact with the flow path, and the protrusions have a rectangular shape in the refrigerant flow direction. is doing. A plurality of flow path reducing portions 32 in which the width of the flow path is reduced by the protrusions from the respective flat plates are configured to face the position of the surface of the first protrusion 9 on the refrigerant discharge side. The position of the refrigerant discharge side surface of the arranged second protrusion 10 is arranged at a different position. The refrigerant becomes turbulent in the flow path reducing section 32, and the flow of the turbulent refrigerant is biased when discharged from the flow path reducing section 32 due to the difference in the position of the surface of the protrusion on the refrigerant discharge side.
[0018]
As a result, the flow of the refrigerant between a certain flow path reducing portion and another flow path reduced portion arranged in the flow direction of the refrigerant is biased and collides with the inner surface of the cooling plate, thereby The adhesion area to the inner surface is increased, and as a result, the effect of improving the heat transfer coefficient between the inner surface of the cooling plate 3 and the refrigerant 4 is obtained.
[0019]
At least two or more flat plates are arranged to face each other to form an inner wall surface of the internal flow path, and have a plurality of protrusions formed on a surface of the flat plate in contact with the flow path, and the protrusions are rectangular in the refrigerant flow direction. And a plurality of flow path reduction portions in which the width of the flow path is reduced by the protrusions from the respective flat plates, and the positions of the surfaces on the refrigerant discharge side of the protrusions facing each other in the flow path reduction portions are different positions. The arranged cooling plate can improve the heat transfer coefficient between the cooling plate inner surface and the refrigerant, reduce the temperature difference between the cooling plate inner surface and the refrigerant, and reduce the temperature of the electronic component.
[0020]
Embodiment 3 FIG.
FIG. 5 is a diagram showing a cross section of the cooling plate according to Embodiment 3, and has a plurality of protrusions on the inner surface of the cooling plate 3 in contact with the flow path, and the protrusions have a rectangular shape in the refrigerant flow direction. is doing. A plurality of flow path reducing portions 32 in which the width of the flow path is reduced are formed by protrusions from the respective flat plates.
[0021]
In the flow path reduction part 32, the length of the first protrusion 11 in the refrigerant flow direction is different from the length of the second protrusion 12 disposed opposite to the first protrusion 11 in the refrigerant flow direction. It is set. The refrigerant is turbulent in the flow path reduction section 32, and the turbulent refrigerant flow enters the flow path reduction section due to the difference in the length of the first protrusion 11 and the second protrusion 12 in the refrigerant flow direction. When and when discharging from the flow path reduction part, the flow is biased.
[0022]
As a result, the flow of the refrigerant between a certain flow path reducing portion and another flow path reduced portion arranged in the flow direction of the refrigerant is biased, and collides with the inner surface of the cooling plate, thereby causing the inner surface of the cooling plate 3 of the refrigerant. As a result, the heat transfer coefficient between the inner surface of the cooling plate 3 and the refrigerant 4 is improved. In addition, due to the difference in the length of the refrigerant flow direction between the first protrusion 11 and the second protrusion 12, both the refrigerant intrusion side opening and the discharge side opening of the flow path reducing portion are both flow of refrigerant. Since the opening is widened in the direction, the resistance of the refrigerant flow becomes smaller, and as a result, the effect of reducing the pressure loss is obtained.
[0023]
At least two or more flat plates are arranged to face each other to form an inner wall surface of the internal flow path, and have a plurality of protrusions formed on a surface of the flat plate in contact with the flow path, and the protrusions are rectangular in the refrigerant flow direction. And a plurality of flow path reducing portions in which the width of the flow path is reduced by protrusions from the respective flat plates. In the cooling plate in which the length of the protrusions facing each other in the flow path reduction part is set to be different, the heat transfer coefficient between the cooling plate inner surface and the refrigerant is improved, and the temperature difference between the cooling plate inner surface and the refrigerant is reduced. It is possible to reduce the temperature of the electronic component.
[0024]
Embodiment 4 FIG.
FIG. 6 is a diagram showing a cross section of the cooling plate according to the fourth embodiment. The cooling plate 3 has a plurality of protrusions on the surface in contact with the flow path, and the protrusions have a rectangular shape in the refrigerant flow direction. is doing. A plurality of flow path reducing portions in which the width of the flow path is reduced are formed by protrusions from the respective flat plates.
[0025]
In the first flow path reduction portion 33, the refrigerant inflow side surface of the first protrusion 3 is in the refrigerant flow direction with respect to the position of the refrigerant inflow side surface of the first protrusion 4 arranged to face the first protrusion 3. In the second flow path reduction section 34, the surface on the refrigerant inflow side of the third protrusion 15 is the surface of the refrigerant inflow side of the fourth protrusion 16 disposed opposite thereto. The positions of the protrusions facing the refrigerant flow direction are alternately changed so as to be positioned before the refrigerant flow direction. The refrigerant is turbulent in the flow path reduction portions 33 and 34, and the turbulent flow of the refrigerant is biased toward the flow when discharged from the flow path reduction portion due to the difference in the position of the refrigerant inflow surface and the discharge side surface of the protrusion. Occurs.
[0026]
As a result, the flow of the refrigerant between a certain flow path reducing portion and another flow path reduced portion arranged in the flow direction of the refrigerant is biased, and collides with the inner surface of the cooling plate, thereby causing the inner surface of the cooling plate 3 of the refrigerant. As a result, the heat transfer coefficient between the inner surface of the cooling plate 3 and the refrigerant 4 is improved. Furthermore, by alternately changing the positions of the protrusions facing the refrigerant flow direction, the direction of deviation of the refrigerant flow changes alternately, and the inner surface of the cooling plate on which the refrigerant collides alternately changes regularly. Thus, the heat transfer coefficient between the inner surface of the cooling plate 3 and the refrigerant 4 is improved evenly with respect to both surfaces of the inner surface of the cooling plate, and the temperature of the electronic components fixed in contact with both surfaces of the cooling plate 3 can be similarly reduced.
[0027]
At least two or more flat plates are arranged to face each other to form an inner wall surface of the internal flow path, and have a plurality of protrusions formed on a surface of the flat plate in contact with the flow path, and the protrusions are rectangular in the refrigerant flow direction. And a plurality of flow path reducing portions in which the width of the flow path is reduced by protrusions from the respective flat plates. In the cooling plate in which the shape or positional relationship of the protrusions facing each other in the flow path reducing portion is changed along the refrigerant flow direction, the heat transfer coefficient between the cooling plate inner surface and the refrigerant is improved on at least two surfaces of the cooling plate. The temperature difference between the inner surface and the refrigerant can be reduced, and the temperature of the electronic component fixed in contact with the two surfaces of the cooling plate can be reduced.
[0028]
At least two or more flat plates are arranged to face each other to form an inner wall surface of the internal flow path, and have a plurality of protrusions formed on a surface of the flat plate in contact with the flow path, and the protrusions are rectangular in the refrigerant flow direction. And a plurality of flow path reducing portions in which the width of the flow path is reduced by protrusions from the respective flat plates. In the cooling plate in which the shape or positional relationship of the protrusions facing each other in the flow path reduction portion is arranged regularly and alternately along the flow direction of the refrigerant, the heat transfer coefficient between the cooling plate inner surface and the refrigerant is set on at least two surfaces of the cooling plate. The temperature difference between the cooling plate inner surface and the refrigerant can be reduced, and the temperature of the electronic component fixed in contact with the two surfaces of the cooling plate can be reduced.
[0029]
Embodiment 5. FIG.
FIG. 7 is a diagram showing a cross section of the cooling plate according to the fifth embodiment, and has a plurality of protrusions on the surface of the inner surface of the cooling plate 3 that is in contact with the flow path. A plurality of flow path reducing portions 32 in which the width of the flow path is reduced are formed by protrusions from the respective flat plates, and in the flow path reduced portion 32, the first protrusions 17 have a rectangular cross-sectional shape in the refrigerant flow direction. The cross-sectional shape in the refrigerant flow direction of the second protrusions 18 arranged facing each other has a cross-sectional shape having an inclined surface on the refrigerant inflow side. The refrigerant is turbulent in the flow path reducing section 32, and the flow of the turbulent refrigerant is biased when entering the flow path reducing section due to the difference in cross-sectional shape in the refrigerant flow direction of the protrusions. As a result, the flow of the refrigerant between the flow path reducing portion and another flow path reduced portion arranged in the flow direction of the refrigerant is biased, and collides with the inner surface of the cooling plate, whereby the refrigerant flows into the inner surface of the cooling plate 3. The adhesion area increases, and as a result, the effect of improving the heat transfer coefficient between the inner surface of the cooling plate 3 and the refrigerant 4 is obtained. In addition, although the example in which the inclined surface of the second protrusion 18 is relatively large has been shown, an inclined surface having a chamfering degree may be applied.
[0030]
At least two or more flat plates are arranged to face each other to form an inner wall surface of the internal flow path, and have a plurality of protrusions formed on a surface of the flat plate in contact with the flow path. In the cooling plate in which a plurality of flow path reducing portions whose widths are reduced and the cross-sectional shapes in the refrigerant flow direction of the protrusions facing each other in the flow path reducing portion are different, the heat transfer coefficient between the cooling plate inner surface and the refrigerant is improved. In addition, the temperature difference between the inner surface of the cooling plate and the refrigerant can be reduced, and the temperature of the electronic component can be reduced.
[0031]
Embodiment 6 FIG.
FIG. 8 (a) is a diagram showing a cross section of the cooling plate according to the sixth embodiment. The cooling plate 3 has a plurality of protrusions on the surface in contact with the flow path, and the protrusions are rectangular in the refrigerant flow direction. It has a shape. A plurality of flow path reducing portions 32 in which the width of the flow path is reduced are formed by protrusions from the respective flat plates.
[0032]
FIG. 8B is a view of the cooling plate shown in FIG. 8A viewed from the direction A. The first protrusion 19 has a slit 21 in a direction intersecting the flow path reducing portion, and a second shape. The projection 20 is provided with a slit 22, and also in the slit, the flow path is reduced and the refrigerant is turbulent. FIG. 8 (c) is a view of the cooling plate shown in FIG. 8 (a) as viewed from the B direction. The protrusions have different positional relationships from the first protrusion 19 and the second protrusion 20. Slits 21 and 22 are provided. The flow of the refrigerant is turbulent by the flow path reducing portion 32 and the slit, and due to the difference in the positional relationship between the slits, the flow between the certain flow path reduced portion and another flow path reduced portion arranged in the flow direction of the refrigerant. When the flow of the refrigerant is biased and collides with the inner surface of the cooling plate, the region where the refrigerant adheres to the inner surface of the cooling plate 3 increases, and as a result, the heat transfer coefficient between the inner surface of the cooling plate 3 and the refrigerant 4 is improved. Get the effect.
[0033]
At least two or more flat plates are arranged to face each other to form an inner wall surface of the internal flow path, and have a plurality of protrusions formed on a surface of the flat plate in contact with the flow path. In the cooling plate in which a plurality of flow path reducing portions whose width is reduced and at least one slit is provided in the projection in a direction intersecting the flow path reducing portion, the cooling plate inner surface and the coolant The heat transfer rate can be improved, the temperature difference between the cooling plate inner surface and the refrigerant can be reduced, and the temperature of the electronic component can be reduced.
[0034]
At least two or more flat plates are arranged to face each other to form an inner wall surface of the internal flow path, and have a plurality of protrusions formed on a surface of the flat plate in contact with the flow path. A plurality of flow path reduction portions that are reduced in width, and at least one or more slits are provided in the projections in a direction intersecting the flow path reduction portions, and the positions of the slits are along the refrigerant flow direction. The cooling plate changed for each protrusion can improve the heat transfer coefficient between the cooling plate inner surface and the refrigerant, reduce the temperature difference between the cooling plate inner surface and the refrigerant, and reduce the temperature of the electronic component.
[0035]
【The invention's effect】
As described above, according to the present invention, there is an inner wall surface that is thermally indirectly connected to a heat-generating electronic component and forms an internal flow path through which a refrigerant flows, and the flow path reducing portion is formed on the inner wall surface. In the configured cooling member, by forming the shape of the flow path reduction portion as a non-target with respect to the center of the flow path, the heat transfer coefficient between the cooling plate inner surface and the refrigerant is improved, and The temperature difference can be reduced.
[Brief description of the drawings]
FIG. 1 is a diagram showing a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of a cooling plate shown as a comparative example of the present invention.
FIG. 3 is a cross-sectional view of a cooling plate according to Embodiment 1 of the present invention.
FIG. 4 is a sectional view of a cooling plate in Embodiment 2 of the present invention.
FIG. 5 is a sectional view of a cooling plate according to Embodiment 3 of the present invention.
FIG. 6 is a sectional view of a cooling plate according to Embodiment 4 of the present invention.
FIG. 7 is a sectional view of a cooling plate in a fifth embodiment of the present invention.
FIG. 8 is a sectional view of a cooling plate in a sixth embodiment of the present invention.
[Explanation of symbols]
1 module, 2 electronic components, 3 cooling plate, 4 refrigerant, 5 chassis, 7 1st protrusion, 8 2nd protrusion, 9 1st protrusion, 10 2nd protrusion, 11 1st protrusion, 12 2nd Projection, 13 first projection, 14 second projection, 15 third projection, 16 fourth projection, 17 first projection, 18 second projection, 19 first projection, 20 second projection , 21 slit, 22 slit, 31 protrusion, 32 flow path reduction part, 33 flow path reduction part, 34 flow path reduction part.

Claims

An inner wall surface that is thermally indirectly connected to the exothermic electronic component and forms an internal flow path through which a refrigerant flows by disposing at least two flat plates opposite to each other;
A plurality of protrusions forming a flow path reduction portion formed on the inner wall surface and reducing the width of the internal flow path;
With
The plurality of protrusions are formed asymmetrically with respect to the center of the internal flow path, and are formed so that at least two opposing protrusions have different lengths in the refrigerant flow direction.

An inner wall surface which is thermally indirectly connected to the heat-generating electronic component and forms an internal flow path through which refrigerant flows by disposing at least two flat plates opposite to each other;
A plurality of protrusions forming a flow path reduction portion formed on the inner wall surface and reducing the width of the internal flow path;
With
The plurality of protrusions are formed asymmetrically with respect to the center of the internal flow path, and are formed such that the shape or positional relationship of at least two opposing protrusions changes along the flow direction of the refrigerant. Cooling member.

An inner wall surface which is thermally indirectly connected to the heat-generating electronic component and forms an internal flow path through which refrigerant flows by disposing at least two flat plates opposite to each other;
A plurality of protrusions forming a flow path reduction portion formed on the inner wall surface and reducing the width of the internal flow path;
With
The plurality of protrusions are formed asymmetrically with respect to the center of the internal flow path, and at least two opposing protrusions have different cross-sectional shapes in the refrigerant flow direction.